Sensor module
The sensor module employs solder dams around signal terminals to provide a three-dimensional waterproof structure, addressing the challenge of miniaturization by simplifying the waterproofing process and enhancing productivity and competitiveness.
WO2026095323A1PCT designated stage Publication Date: 2026-05-07PARTRON
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Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- PARTRON
- Filing Date
- 2025-09-09
- Publication Date
- 2026-05-07
Smart Images
Figure KR2025013961_07052026_PF_FP_ABST
Abstract
The present invention relates to a sensor module and, more particularly, to a sensor module comprising: a circuit board having a coupling region and an extension region extending from the coupling region to one side; a sensor package coupled to one surface of the coupling region and comprising a package substrate, a sensor chip mounted on the package substrate, and a molding part for molding the sensor chip; and a coupling part that connects the circuit board with the sensor package, wherein the circuit board comprises: a plurality of first signal terminals formed on the top surface of the coupling region; a first dummy terminal surrounding the plurality of first signal terminals; and a transmission line that transmits an electrical signal between the first signal terminals and a signal processing unit of a main device, the package substrate comprises: a plurality of second signal terminals electrically connected to the first signal terminals; and a second dummy terminal surrounding the plurality of second signal terminals, and the coupling part comprises: a first coupling part respectively electrically connecting the plurality of first signal terminals with the second signal terminals; and a second coupling unit connecting the first dummy terminal with the second dummy terminal to form a waterproof portion.
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Citation Information
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