Chip lamp bead and lamp

Abstract

Embodiments of the present disclosure provide a chip lamp bead and a lamp, relating to the technical field of lamp beads, comprising: a packaging body, and a lamp bead body packaged within the packaging body. The lamp bead body comprises a substrate, and a first light-emitting body, a second light-emitting body, and a control chip disposed on the substrate. In the embodiments of the present disclosure, a white light-emitting body and a light-emitting body of a preset color system are integrated within one lamp bead, so that different lamp beads and different colors of the lamp beads can be uniformly controlled through the control chip, thereby improving the functionality and flexibility of a lighting and decorative lighting system. On the basis of white LEDs, by further adjusting the proportions of white LEDs having different color temperatures (such as warm white and cool white), color temperature adjustment of the preset color system from warm tones to cool tones can be achieved. Moreover, under single-color blue light, the color is purer blue light; under single-color white light or warm white light, the color is more consistent; and the yield can be increased to above 99%.

Description

Chip LEDs and Lighting Fixtures

[0001] Cross-references to related applications

[0002] This disclosure claims priority to Chinese Patent Application No. 202411629631.X, filed on November 14, 2024, entitled "Chip-based LED Beads and Lamp Fixtures", the entire contents of which are incorporated herein by reference. Technical Field

[0003] This disclosure relates to the field of LED technology, and in particular to a chip LED and a lighting fixture. Background Technology

[0004] Existing chip-type LED lights are mostly monochromatic lights such as red, green, blue, warm white, and white light, or multi-color lights such as dual-color and tri-color lights with R, G, and B combinations. They are formed by molding monochromatic LED chips into LED beads using transparent or fluorescent adhesive. During production, each color of LED chip needs to be individually packaged and then assembled, requiring precise control of the position and connection of each chip. This makes the entire production process very complex, inefficient, and increases production costs. Achieving simultaneous illumination of full-color R, G, B, white, and warm white light in the same area also suffers from drawbacks such as slow production, high costs, and complex manufacturing processes.

[0005] Moreover, existing technologies make it difficult to integrate multiple colors (R, G, B) and white light of different color temperatures (cool white, warm white) into the same LED bead, and cannot achieve the full-color R, G, B and white light and warm white light of the LED string in the same LED (RGBW / RGBCW) color-changing function.

[0006] Public content

[0007] In view of this, the purpose of this disclosure is to provide a chip lamp bead and lamp fixture that can realize a single lamp light source that can be controlled and emit light in both full-color and multi-color systems simultaneously.

[0008] In a first aspect, embodiments of this disclosure provide a chip-type LED, comprising: a package, and an LED body packaged within the package; wherein the LED body includes a substrate, and a first light-emitting element, a second light-emitting element, and a control chip disposed on the substrate; the first light-emitting element and the second light-emitting element are respectively connected to control terminals corresponding to the control chip; wherein the first light-emitting element is a light-emitting element of a preset color system, and the second light-emitting element is a light-emitting element of a white light system; the control chip is configured to respond to a control signal and control the first light-emitting element and / or the second light-emitting element to light up based on the control signal.

[0009] In an optional embodiment, the substrate includes a first substrate and a second substrate. The control chip is mounted on the first substrate by a preset die bonding process, and the first light emitter and the second light emitter are mounted on the second substrate by a preset die bonding process.

[0010] In an optional implementation, the control terminal of the control chip is positioned facing the second substrate.

[0011] In an optional embodiment, the second substrate includes an extension that is away from the first substrate; the first light emitter and the second light emitter are disposed on the side close to the first substrate.

[0012] In an optional embodiment, the first substrate includes a signal access terminal, and the control chip includes signal pins connected to the signal access terminal.

[0013] In an optional embodiment, the chip lamp bead further includes a light-emitting body fixing structure; a substrate is mounted on one end face of the light-emitting body fixing structure; the other end face of the light-emitting body fixing structure is provided with a first connection structure corresponding to the control chip, and a second connection structure corresponding to the first light-emitting body and the second light-emitting body.

[0014] In an optional implementation, the first light emitter includes at least one sub-light emitter, and the number of sub-light emitters corresponds to the number of monochrome colors in the preset color system.

[0015] In an optional implementation, the second light emitter is a surface-mount LED.

[0016] In an optional implementation, the control chip, the first light emitter, and / or the second light emitter are mounted on the second substrate either upright or flip-flop.

[0017] Secondly, this disclosure provides a lamp that is equipped with chip lamp beads according to any of the above embodiments.

[0018] This disclosure provides a chip-based LED and a lighting fixture that integrates a white light emitter and a preset color-coded light emitter within a single LED chip. This allows for unified control of different LEDs via a control chip, enhancing the functionality and flexibility of the lighting system. It not only achieves rich color effects and dynamic lighting effects but also improves energy efficiency. Based on white LEDs, the color temperature of the preset color system can be adjusted from warm to cool tones by varying the proportion of white LEDs with different color temperatures (such as warm white and cool white), enhancing the user experience and providing various intelligent functions. Furthermore, the blue light under monochromatic blue light is purer, and the color of monochromatic white light or warm white light is more consistent, with a yield rate exceeding 99%.

[0019] Other features and advantages of this disclosure will be set forth in the following description and will be apparent in part from the description or may be learned by practicing the disclosure. The objects and other advantages of this disclosure are realized and obtained through the structures particularly pointed out in the description, claims and drawings.

[0020] To make the above-mentioned objects, features and advantages of this disclosure more apparent and understandable, preferred embodiments are described below in detail with reference to the accompanying drawings. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the specific embodiments of this disclosure or the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0022] Figure 1 is a schematic diagram of the structure of a chip lamp bead provided in an embodiment of this disclosure;

[0023] Figure 2 is a schematic diagram of the structure of a chip lamp bead provided in an embodiment of this disclosure;

[0024] Figure 3 is a structural diagram of a chip lamp bead provided in an embodiment of this disclosure;

[0025] Figure 4 is a schematic diagram of the back of the chip lamp corresponding to Figure 3.

[0026] Icons: 10-Package; 20-Substrate; 11-Control chip; 12-First light emitter; 13-Second light emitter; 21-First substrate; 211-Signal input terminal; 22-Second substrate; 221-Extension; 31-First connection structure; 32-Second connection structure. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of this disclosure will be clearly and completely described below in conjunction with the embodiments. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. Based on the embodiments of this disclosure, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this disclosure.

[0028] To solve the above-mentioned technical problems, this disclosure provides a chip lamp bead and a lamp fixture that can realize a single lamp light source that can be controlled and emit light in a single color system and multiple color systems at the same time.

[0029] To facilitate understanding of this embodiment, a detailed description of a chip LED bead disclosed in this disclosure is provided first. Figure 1 shows a schematic diagram of the structure of a chip LED bead provided in this disclosure embodiment. As shown in Figure 1, the chip LED bead includes: a package 10, and an LED bead body packaged within the package 10. The LED bead body includes a substrate 20, and a first light-emitting element 12, a second light-emitting element 13, and a control chip 11 disposed on the substrate 20. The package 10 is the outer shell of the entire LED bead, typically made of transparent or semi-transparent materials, such as epoxy resin or silicone, or other transparent encapsulation materials. The package 10 not only protects the internal light-emitting element and control chip 11 but also provides optical properties such as light transmittance and scattering characteristics. In specific implementations, according to design requirements, the encapsulation material can be injected onto the substrate 20 using a mold to form the desired package shape. The first light-emitting element 12 is a light-emitting element of a preset color system, such as red, green, or blue. This type of LED chip emits light of a specific wavelength when powered on. The second light-emitting element 13 is a white light-emitting element, such as white light or warm white light. The first light emitter 12 and the second light emitter 13 are respectively connected to the corresponding control terminals of the control chip 11. The control chip 11 is configured to respond to control signals and control the first light emitter 12 and / or the second light emitter 13 to light up based on the control signals.

[0030] The substrate 20 serves as the base for all components and is typically made of ceramic or aluminum, offering good thermal conductivity and electrical insulation. Pads are provided on the substrate 20 to fix and connect the various components. This embodiment features a preset color-coded light emitter (first light emitter 12) and a white-coded light emitter (second light emitter 13), which are independently controlled by a control chip 11. The control chip 11 receives external control signals and controls the operating state of the first light emitter 12 and the second light emitter 13 based on these signals. For example, if the control signal requires red and white LEDs to be lit, the control chip 11 will activate the corresponding output ports, causing the red and white LEDs to light up simultaneously. It should be noted that the functions that the control chip 11 can perform include, but are not limited to: independent control: controlling the lighting and extinguishing of the first light emitter 12 and the second light emitter 13 separately; brightness adjustment: adjusting the brightness of each light emitter using PWM (Pulse Width Modulation) technology; and color mixing: achieving the mixing of multiple colors by controlling the brightness ratio of different light emitters, thereby generating different color effects.

[0031] In summary, the chip-based LED provided in this disclosure integrates white light and preset color-system light within a single LED chip. This allows for unified control of LEDs with different color systems via a control chip, enhancing the functionality and flexibility of the lighting system. It not only achieves rich color effects and dynamic lighting effects but also improves energy efficiency. Furthermore, based on white LEDs, the color temperature of the preset color system can be adjusted from warm to cool tones by varying the proportion of white LEDs with different color temperatures (such as warm white and cool white), enhancing the user experience and providing various intelligent functions.

[0032] Optionally, based on the above embodiments, this disclosure also provides another type of chip LED, wherein FIG2 shows a schematic diagram of the structure of another type of chip LED provided in this disclosure. As shown in FIG2, the substrate includes a first substrate 21 and a second substrate 22. The control chip is mounted on the first substrate 21 by a preset die bonding process, and the first light emitter and the second light emitter are mounted on the second substrate 22 by a preset die bonding process. This disclosure features a separate substrate design, a modular design for the chip LED, and separates the control chip and the light emitter by mounting them on different substrates, which facilitates production and maintenance. Moreover, the position and size of the first substrate 21 and the second substrate 22 can be adjusted according to actual needs, improving design flexibility.

[0033] In practical implementation, depending on the function of the chip-type iridescent or point-control substrate, the first light-emitting element (the desired color LED) and the second light-emitting element (white or warm white light) can be soldered to their corresponding positions on the substrate using silver paste or solder paste. Suitable substrate materials, such as aluminum or ceramic substrates, can be selected. The pad positions are pre-set on the substrate according to the LED LED design requirements. Optionally, the first and second light-emitting elements are soldered using silver paste or solder paste. Silver paste: Conductive silver paste is used to fix the white and colored LEDs to their corresponding positions on the substrate. Silver paste not only has good conductivity but also provides some heat dissipation. Solder paste: Lead-free solder paste is used to fix the LEDs to the substrate via reflow soldering. This method is suitable for mass production, with lower cost and higher reliability. The control chip (such as a point-control IC) can be fixed to a designated position on the substrate using conductive silver paste or solder paste.

[0034] Optionally, the control chip, the first light-emitting element, and / or the second light-emitting element are mounted on the second substrate 22 using either a front-mounted or flip-chip method. Front-mounted process: The LED chip (including white and colored LEDs) is placed face up on the substrate. Gold or copper wire is used to connect the electrodes of the LED chip to the pads on the substrate using a wire bonder. The point control IC is placed face up on the substrate, and its pins are connected to the pads on the substrate using gold or copper wire. Flip-chip process: The LED chip is placed back up on the substrate, and its electrodes are directly connected to the pads on the substrate using bump soldering technology. The point control IC is placed back up on the substrate, and its pins are connected to the pads on the substrate using bump soldering technology. The flip-chip process can reduce wire length, improve heat dissipation, and increase reliability. Optionally, the packaged LEDs are placed in an oven for curing to ensure that the packaging material is completely hardened and firmly encapsulates the LED chip and the control chip. The control chip in this embodiment can be a color-coded IC or a point-control IC. The color-coded IC is configured to generate and control various colors and dynamic effects (such as gradients, flashing, etc.). The point-control IC is configured to precisely control the brightness and color of each LED, and is commonly used for pixel-level control.

[0035] In this embodiment, the control terminal of the control chip is positioned facing the second substrate 22, which reduces the length of the signal transmission path, simplifies circuit wiring, and reduces signal delay and interference. The control chip is closer to the light-emitting element, allowing for efficient integration within a smaller space, resulting in a more compact LED structure, facilitating overall packaging and installation, and enabling miniaturization design.

[0036] Optionally, the second substrate 22 includes an extension 221, which is located away from the first substrate 21; the first light emitter and the second light emitter are disposed on the side closer to the first substrate 21. The design of the extension 221 allows the first and second light emitters to be positioned at the center of the LED, resulting in a more uniform light distribution and improved illumination. The centrally located light emitter reduces shading caused by the structure, providing more uniform illumination. Furthermore, the extension 221 can serve as an additional heat dissipation area, helping to disperse heat and improve overall heat dissipation.

[0037] Optionally, the control chip includes signal pins configured to output control signals. The control chip requires only one signal input terminal to implement complex color-changing effects, simplifying the design of external connections. This reduces the number of interfaces that need to be connected, lowering system complexity. Furthermore, the first substrate 21 includes a signal access terminal 211, and the signal pins of the control chip are directly connected to the signal access terminal 211 of the first substrate 21, simplifying circuit design and improving signal transmission quality and system integration. Moreover, the control chip in this embodiment, as an independent module, can be easily integrated into different systems. New functions can be added by updating the firmware or software of the control chip without changing the hardware design.

[0038] Optionally, the first light-emitting body in this embodiment includes at least one sub-light-emitting body, and the number of sub-light-emitting bodies corresponds to the number of monochrome elements in a preset color system. The preset color system includes three color systems: RGB (red, green, and blue). There can be three sub-light-emitting bodies, such as one for each color system, or other color systems and numbers of LEDs can be selected according to requirements, such as yellow (red + green), cyan (green + blue), and purple (red + blue). This allows for the generation of various colors and hues through different combinations of sub-light-emitting bodies, achieving richer color expression. Each sub-light-emitting body corresponds to a specific color, and high-precision color adjustment can be achieved by precisely controlling the brightness of each sub-light-emitting body. In this embodiment, the sub-light-emitting bodies of the first light-emitting body are R, G, and B chips, which are independent light-emitting areas corresponding to red, green, and blue, respectively. Correspondingly, Figure 3 shows a structural diagram of a chip LED provided in this embodiment. In Figure 3, the first light-emitting body has three sub-light-emitting bodies, arranged side-by-side. In one embodiment, from top to bottom, they can be R, G, and B chips. The second light emitter is located on the side of the first light emitter, making the entire LED chip structure compact. Figure 3 shows a schematic diagram of the flip-chip LED chip structure. The first light emitter in Figure 3 is the mounting position for a sub-light emitter of a preset color (such as the aforementioned chip), with solder resist in the center. The area where the first light emitter is located is the position of the second substrate, which is connected to the extension. In Figure 3, the extension connects to the positive electrode of the LED chip, the first substrate connects to the negative electrode, and the signal input terminal is the input terminal of the LED chip. Furthermore, in Figure 3, a marking is provided on the lower side of the first substrate to identify the negative electrode.

[0039] Optionally, referring to Figure 3, the second light-emitting element in this embodiment of the present disclosure is a surface-mount LED, i.e., an SMD LED (Surface-Mounted Device LED). This LED is a small-sized chip-type lamp bead, small in size, suitable for high-density installation, and particularly suitable for applications with limited space. In specific implementations, it can be of types such as 0201 (size 0.6mm x 0.3mm) and 0402 (size 1.0mm x 0.5mm). White light-emitting elements include near-white light: referring to a color close to natural light, with a color temperature of approximately 4000K to 6500K; and warm white light: with a lower color temperature, typically between 2700K and 3500K. In Figure 3, the second light-emitting element is a Warm White LED bead.

[0040] Existing technologies typically use blue LED chips to excite yellow phosphors, converting some blue light into yellow light. The blue and yellow light then mix to form white light. However, due to the conversion efficiency and color uniformity issues of the phosphors, the generated white light may not be pure enough, potentially resulting in color temperature deviations or color inhomogeneity. In this embodiment, white or warm white LEDs are packaged into small-sized chip-type LED beads to achieve white or warm white light. This embodiment directly uses a control chip to drive the white light-emitting element (such as a white LED chip), instead of relying on phosphor conversion. The resulting white light is purer, has a more stable color temperature, and achieves a yield rate exceeding 99%. This avoids the color inhomogeneity issues that may occur during phosphor conversion and also reduces energy loss during the phosphor conversion process, improving overall luminous efficiency. Optionally, since each light-emitting element is individually controlled by a control chip, not only is the color of monochromatic white light or warm white light more consistent, but the color of monochromatic blue light is also purer. The same applies to other color systems, enabling string lights and decorative products to achieve full-color (RGB, G, B) single-lamp four-channel or five-channel (RGBW / RGBCW) color-changing functions for both white and warm white light. Dynamic effects such as flashing, gradation, and breathing lights can also be achieved through programmable control chips. This makes it suitable for various application scenarios, such as stage lighting, smart homes, and decorative lighting.

[0041] Optionally, the chip LED also includes a light-emitting element fixing structure; a substrate is mounted on one end face of the light-emitting element fixing structure; the other end face of the light-emitting element fixing structure is provided with a first connection structure 31 corresponding to the control chip, and a second connection structure 32 corresponding to the first and second light-emitting elements. Figure 4 shows a schematic diagram of the back of the chip LED. Taking Figure 4 as an example, the light-emitting element fixing structure is a surface mount structure, and the connection structure on its other end face includes an input terminal, a negative electrode, and a positive electrode. The first substrate 21 corresponds to the input terminal and the negative electrode, and the second substrate 22 corresponds to the positive electrode. A green strip, made of copper foil or other conductive material, is provided between each connection structure and coated with a green solder mask to prevent short circuits and corrosion. These conductive paths ensure that current can be smoothly transmitted from the input terminal to the negative and positive electrodes, thereby driving the light-emitting element (such as an LED) to work.

[0042] Optionally, based on the above embodiments, this disclosure also provides a lamp fixture configured with chip LEDs from any of the above embodiments. These chip LEDs can be widely used in various lamp fixtures, from household lighting to professional equipment. In one embodiment, they can be used in high-end lighting equipment, such as indoor lighting (e.g., chandeliers, wall lamps, table lamps), commercial lighting (e.g., lighting systems for shopping malls, hotels, offices), industrial lighting (e.g., lighting for factories, warehouses, etc., requiring high brightness and stability), and display devices (e.g., LCD / LED displays for televisions, computer monitors, mobile phone screens), and OLED displays (e.g., high-end display devices such as professional-grade monitors and smartwatches). Alternatively, they can be used in medical equipment (e.g., surgical lights, therapeutic lights) and scientific research instruments (e.g., fluorescence microscopes, spectrometers). It should be noted that the lamp fixture provided in this disclosure has the same implementation principle and technical effects as the aforementioned chip LED embodiments. For the sake of brevity, any parts not mentioned in the lamp fixture embodiments can be referred to the corresponding content in the aforementioned chip LED embodiments.

[0043] Finally, it should be noted that the above-described embodiments are merely specific implementations of this disclosure, used to illustrate the technical solutions of this disclosure, and not to limit it. The protection scope of this disclosure is not limited thereto. Although this disclosure has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that any person skilled in the art can still modify or easily conceive of changes to the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features, within the scope of the technology disclosed in this disclosure. Such modifications, changes, or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this disclosure, and should all be covered within the protection scope of this disclosure. Therefore, the protection scope of this disclosure should be determined by the protection scope of the claims. Industrial applicability

[0044] In summary, the embodiments of this disclosure provide a chip-based LED and a lighting fixture, integrating a white light emitter and a preset color-system light emitter within a single LED. This allows for unified control of different LEDs via a control chip, enhancing the functionality and flexibility of the lighting system. It not only achieves rich color effects and dynamic lighting effects but also improves energy efficiency. Based on white LEDs, the color temperature of the preset color system can be adjusted from warm to cool tones by varying the proportion of white LEDs with different color temperatures (such as warm white and cool white), enhancing the user experience and providing various intelligent functions. Furthermore, the blue light under monochromatic blue light is purer, and the color of monochromatic white light or warm white light is more consistent, with a yield rate exceeding 99%.

Claims

1. A chip lamp bead, characterized in that, include: The package body, and the lamp bead body packaged within the package body; The lamp bead body includes a substrate, and a first light-emitting element, a second light-emitting element, and a control chip disposed on the substrate; The first light-emitting element and the second light-emitting element are respectively connected to the control terminal corresponding to the control chip; wherein, the first light-emitting element is a light-emitting element of a preset color system, and the second light-emitting element is a light-emitting element of a white light system; The control chip is configured to respond to a control signal and control the first light-emitting element and / or the second light-emitting element to light up based on the control signal.

2. The chip lamp bead according to claim 1, characterized in that, The substrate includes a first substrate and a second substrate. The control chip is mounted on the first substrate by a preset die bonding process, and the first light emitter and the second light emitter are mounted on the second substrate by a preset die bonding process.

3. The chip lamp bead according to claim 2, characterized in that, The control terminal of the control chip is positioned facing the second substrate.

4. The chip lamp bead according to claim 2 or 3, characterized in that, The second substrate includes an extension that is located away from the first substrate; The first light emitter and the second light emitter are disposed on the side close to the first substrate.

5. The chip lamp bead according to any one of claims 2-4, characterized in that, The first substrate includes a signal access terminal, and the control chip includes signal pins, which are connected to the signal access terminal.

6. The chip lamp bead according to any one of claims 1-5, characterized in that, The chip lamp bead also includes a light-emitting element fixing structure; the substrate is mounted on one end face of the light-emitting element fixing structure; The other end face of the light-emitting body fixing structure is provided with a first connection structure corresponding to the control chip, and a second connection structure corresponding to the first light-emitting body and the second light-emitting body.

7. The chip lamp bead according to any one of claims 1-6, characterized in that, The first light emitter includes at least one sub-light emitter, and the number of the sub-light emitters corresponds to the number of monochrome colors in the preset color system.

8. The chip lamp bead according to any one of claims 1-7, characterized in that, The second light-emitting element is a surface-mount LED.

9. The chip lamp bead according to any one of claims 2-8, characterized in that, The control chip, the first light emitter, and / or the second light emitter are mounted on the second substrate either upright or flip-flop.

10. A luminaire characterized by, The lamp is equipped with a chip lamp bead as described in any one of claims 1 to 9.

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