Connecting assembly and waveguide antenna using connecting assembly

WO2026103086A1PCT designated stage Publication Date: 2026-05-21KUNSHAN INNOWAVE COMMUNICATION TECHNOLOGY CO LTD
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Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
KUNSHAN INNOWAVE COMMUNICATION TECHNOLOGY CO LTD
Filing Date
2025-05-26
Publication Date
2026-05-21

AI Technical Summary

Technical Problem

Existing waveguide antennas suffer from poor performance due to welding quality issues caused by connection gaps and filling seals during the manufacturing process, resulting in reduced production yield and increased costs.

Method used

A connecting component is designed, including a first connecting surface, a second connecting surface, and a connecting seal. The welding structure is optimized by providing a protrusion on the first connecting surface to form a gap, and filling the gap with the seal to connect the two surfaces.

Benefits of technology

It effectively solved the problem of connection gaps and seals affecting welding quality, improved production yield, reduced production costs, and increased production efficiency.

✦ Generated by Eureka AI based on patent content.

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Abstract

Provided in the present invention are a connecting assembly and a waveguide antenna using the connecting assembly. The connecting assembly comprises a first connecting face, a second connecting face and connecting sealing members, wherein the first connecting face and the second connecting face are arranged opposite each other and are connected and fixed by means of the connecting sealing members; the first connecting face is provided with a protruding portion, which abuts against the second connecting face to form a gap; and the connecting sealing members fill the gap to connect the first connecting face to the second connecting face. The connecting assembly of the present invention can effectively solve the problem in the current production whereby a connecting gap and the filling sealing members may affect connection or welding quality, leading to poor performance, thereby effectively improving production yield, reducing production costs, and improving production efficiency.
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Description

A connection component and a waveguide antenna using the connection component. Technical Field

[0001] This invention relates to the field of communication technology, and in particular to a connection component and a waveguide antenna using the connection component. Background Technology

[0002] A waveguide antenna is an antenna that guides radio frequency (RF) energy from the air medium into a waveguide. The RF energy is conducted through waveguide interconnects or picked up by a coaxial interface and then transmitted through a coaxial assembly. A waveguide antenna is a symmetrical system that can both receive and transmit RF energy.

[0003] An air waveguide antenna is an antenna that guides radio frequency (RF) energy from the air medium into a waveguide and vice versa. Once the RF energy is captured, it is conducted through waveguide interconnects or picked up by a coaxial interface and then transmitted through a coaxial assembly. Air waveguide antennas are a type of millimeter-wave radar antenna developed in recent years, and their outstanding advantages have led to widespread optimism regarding their application prospects in automotive radar.

[0004] Given the advantages of air waveguide antennas, their application prospects are widely regarded as promising. Significant resources have been invested in researching their design and manufacturing processes, especially in manufacturing. Air waveguide antennas require a cavity to allow microwave signals to propagate through the air, and this cavity cannot be formed in one piece; it needs to be assembled from several components. Currently, the most common and effective method for connecting these components is reflow soldering. However, reflow soldering has some problems. For example, due to the planar design of the connection points and the deformation of the plastic parts during production, gaps may appear on the welded surfaces. Poor soldering can lead to crosstalk between signals from different wall surfaces, thus affecting the antenna's performance.

[0005] In view of this, it is indeed necessary for the present invention to provide a connection junction assembly and a waveguide antenna using the connection assembly. Summary of the Invention

[0006] The purpose of this invention is to provide a connecting component that can effectively solve the problem that connection gaps and filling seals in current production can affect the connection or welding quality, resulting in poor performance. This can effectively improve production yield, reduce production costs, and increase production efficiency.

[0007] To solve the above-mentioned technical problems, the present invention provides a connecting component, the connecting component including a first connecting surface, a second connecting surface and a connecting seal, the first connecting surface and the second connecting surface being disposed opposite to each other and connected and fixed by the connecting seal; the first connecting surface is provided with a protrusion, the protrusion abutting against the second connecting surface to form a gap, and the connecting seal filling the gap to connect the first connecting surface and the second connecting surface.

[0008] As a further improvement of the present invention, the gap includes a first gap and a second gap, and the protrusion abuts against the second connecting surface to form the first gap and the second gap.

[0009] As a further improvement of the present invention, the protrusion includes a first protruding surface and a second protruding surface, the first gap is located between the first protruding surface and the second connecting surface, and the second gap is located between the second protruding surface and the second connecting surface.

[0010] As a further improvement of the present invention, the protrusion is tapered, the top of the protrusion abuts against the second connecting surface, and the two tapered surfaces on the top of the protrusion form dihedral angles with the second connecting surface.

[0011] As a further improvement of the present invention, the angle range of the dihedral angle is (0°, 90°).

[0012] As a further improvement of the present invention, the second connecting surface is recessed to form a groove, the protrusion is correspondingly connected to the groove, and the top of the protrusion abuts against the bottom of the groove.

[0013] As a further improvement of the present invention, the groove is conical, and the width of the conical opening of the groove is greater than the width of the protrusion in the horizontal direction.

[0014] As a further improvement of the present invention, the height of the groove in the vertical direction is greater than or equal to the height of the protrusion in the vertical direction.

[0015] As a further improvement of the present invention, the groove sidewall forms the first gap and the second gap with the first protruding surface and the second protruding surface, respectively, and the sealing element is configured as solder paste, which fills the first gap and the second gap.

[0016] As a further improvement of the present invention, the height of the protrusion in the vertical direction is equal to the height of the groove in the vertical direction, and the width of the protrusion in the horizontal direction is less than the width of the groove in the horizontal direction.

[0017] As a further improvement of the present invention, the bottom end of the protrusion extends to both sides to form a bottom extension, the bottom extension abuts against the opening of the groove, and the sidewall of the groove forms a gap with the protrusion. The first connecting surface and the second connecting surface are assembled to form a relatively closed tin-containing space on both sides of the protrusion.

[0018] The purpose of this invention is to provide a waveguide antenna for better application of the above-mentioned connection components.

[0019] To solve the above-mentioned technical problems, the present invention provides a waveguide antenna, which includes the connection components described above.

[0020] This invention provides a connection component and a waveguide antenna using the connection component. The connection component includes a first connection surface, a second connection surface, and a connection seal. The first and second connection surfaces are disposed opposite to each other and connected and fixed by the connection seal. A protrusion is provided on the first connection surface, which abuts against the second connection surface to form a gap. The connection seal fills the gap to connect the first and second connection surfaces. The connection component of this invention effectively solves the problem in current production where connection gaps and the filling seal affect connection or welding quality, leading to poor performance. This effectively improves production yield, reduces production costs, and increases production efficiency. Attached Figure Description

[0021] Figure 1 is a schematic diagram of the connection between the components of a cavity in a traditional waveguide antenna.

[0022] Figure 2 is a schematic diagram of the structure of the first embodiment of the connecting component in the waveguide antenna of the present invention.

[0023] Figure 3 is a schematic diagram of the second embodiment of the connecting component in the waveguide antenna of the present invention.

[0024] Figure 4 is a structural schematic diagram of the third embodiment of the connecting component in the waveguide antenna of the present invention.

[0025] Figure 5 is a structural schematic diagram of the fourth embodiment of the connecting component in the waveguide antenna of the present invention.

[0026] The reference numerals in the attached drawings are explained as follows: First connecting surface 10, First raised surface 11, Second raised surface 12, Raised portion 13, Bottom extension portion 14, Second connecting surface 20, Seal / Solder paste 30, First gap 40, Second gap 41, Groove 50, Solder space 60. Detailed Implementation

[0027] The following detailed description, in conjunction with the accompanying drawings and specific embodiments, provides a further detailed account of the connecting component proposed in this invention and the waveguide antenna using this connecting component. It should be noted that the drawings are all in a very simplified form and use non-precise scales, intended only to facilitate and clarify the illustration of the embodiments of the present invention. Furthermore, the structures shown in the drawings are often part of the actual structure. In particular, different figures may emphasize different aspects and sometimes use different scales.

[0028] Waveguide antennas are a type of millimeter-wave radar antenna developed in recent years. Air waveguide antennas, in particular, are highly regarded for their outstanding advantages, making their application prospects in automotive radar very promising. These advantages include: lower antenna loss, as electromagnetic waves propagate more efficiently in air than in a vacuum; traditional microstrip antennas are planar, resulting in limited flexibility, while waveguide antennas allow for three-dimensional layouts, leading to shorter transmission lines and further reduced loss; and the use of metallized plastic, which reduces loss by approximately 93% compared to traditional PCBs. Given these advantages, the application prospects of air waveguide antennas are widely recognized, and significant resources have been invested in research on their design and manufacturing processes, especially manufacturing, as air waveguide antennas require the formation of cavities to achieve [the desired effect]. Microwave signals propagate through the air, but the cavity cannot be formed in one piece; it requires the assembly and connection of several components to form the cavity. Currently, the most common and effective method for connecting these components is reflow soldering. However, reflow soldering has several problems: the connection surfaces of the components are planar, and because plastic parts can deform during production, a fixture is needed to flatten the two components during reflow soldering to ensure the soldering effect. If the pressure is too high, the solder paste on the soldering surface will be squeezed into the cavity, affecting performance. In other words, after the two connecting components are pressed and fully contacted, the contact surface has zero gap, causing the seals printed on the soldering surface, such as solder paste, to be squeezed out of the soldering surface and into the cavity. The cavity is a functional space, and the solder paste that is squeezed into the cavity is metal, which will affect the antenna's frequency, gain, and radiation pattern. If the pressure is too low, the deformation of the plastic parts cannot be effectively corrected, leading to gaps at the solder joints. Poor soldering causes signal interference between different cavities, thus affecting performance. In other words, the inability to effectively correct the deformation of the plastic parts results in excessive gaps between the upper and lower components at the solder joints, preventing the solder from contacting one of the connection surfaces. After reflow soldering, gaps appear at the solder joints, allowing signals from different cavities to interfere with each other through these gaps, causing significant changes in the antenna's frequency, gain, and radiation pattern. These problems severely impact the production efficiency and yield of waveguide antennas. To address these manufacturing process issues and improve production efficiency and yield while reducing production costs, this invention improves the design of the solder joints or connection structure. The design of the connection components in this invention fundamentally solves the problems of existing solutions.

[0029] Figure 1 shows a schematic diagram of the connection between components in a conventional waveguide antenna cavity. Components 1, 2, and 3 form the microwave signal transmission cavity 4, and the soldering surface 5 is a planar weld or connection. During reflow soldering, a fixture is needed to flatten the two soldering components. If the pressure is too high, the solder paste 30 on the soldering surface will be squeezed into the cavity, affecting performance. If the pressure is too low, the deformation of the plastic parts cannot be effectively corrected, resulting in gaps between the soldering surfaces. Poor soldering can lead to crosstalk between signals from different cavities, thus affecting performance.

[0030] Therefore, the present invention provides a connection assembly for use in a waveguide antenna having a cavity. Specifically, the connection assembly includes a first connection surface 10, a second connection surface 20, and a connection seal 30. The first connection surface 10 and the second connection surface 20 are disposed opposite to each other and are connected and fixed by the connection seal 30. The first connection surface 10 is provided with a protrusion 13, which abuts against the second connection surface 20 to form a gap. The connection seal 30 fills the gap to connect the first connection surface 10 and the second connection surface 20.

[0031] An air waveguide antenna requires several components to connect and form a cavity. These components are connected by connecting surfaces. Specifically, the first connecting surface 10 and the second connecting surface 20 in the connection assembly of this invention are located on the vertically positioned components. The vertically positioned components and the horizontally positioned components can form a cavity. With this configuration, the connection assembly of this invention can effectively solve the problem in current production where connection gaps and the filling seal 30 affect the connection or welding quality, leading to poor performance. This effectively improves production yield, reduces production costs, and increases production efficiency.

[0032] In other words, a gap or void is formed between the first and second connecting surfaces during connection. This avoids the problem of zero gap when the first and / or second connecting surfaces are pressed, allowing sufficient space for the seals or solder paste to fill. It also prevents the seals or solder paste from being squeezed out of the soldering or connecting surfaces and thus into the cavity when the first or second connecting surfaces are pressed. Furthermore, it avoids the problem of plastic parts deforming and not being effectively corrected when the pressure is too low. This ensures that both the first and second connecting surfaces make full and effective contact during connection or soldering, preventing gaps after assembly from causing signals between cavities to interfere with each other through the gaps in the connecting or soldering surfaces.

[0033] Further, the gaps include a first gap 40 and a second gap 41, with the protrusion 13 abutting against the second connecting surface 20 to form the first gap 40 and the second gap 41. The protrusion 13 includes a first protruding surface 11 and a second protruding surface 12. The first gap 40 is located between the first protruding surface 11 and the second connecting surface 20, and the second gap 41 is located between the second protruding surface 12 and the second connecting surface 20. The protrusion 13 is tapered, with its top abutting against the second connecting surface 20, and the two tapered surfaces on the top of the protrusion 13 forming a dihedral angle with the second connecting surface 20. The angle range of the dihedral angle is (0°, 90°). That is, the design of the protrusion 13 on the first connecting surface 10 ensures that the top of the protrusion 13 on the first connecting surface 10 is in complete contact with the second connecting surface 20 after being pressed. At this time, the sealing filler fills the first gap 40 and the second gap 41 on both sides of the protrusion 13. In other words, the two inclined surfaces of the protrusion 13 form a first gap 40 and a second gap 41 with the side wall of the groove 50 of the second connecting surface 20. This structural design can press the second connecting surface 20 with greater force. Since the actual contact area between the first connecting surface 10 and the second connecting surface 20 is small, and the connection pressure between the first connecting surface 10 and the second connecting surface 20 can be further deepened under the pressure of the seals 30 on both sides. Preferably, the seals 30 are preferably connectors filled with solder paste 30. At this time, it is not necessary to control the amount of solder paste 30 very precisely, which can completely eliminate the gap between the upper and lower parts, and there is no problem of solder paste 30 or seals 30 flowing into the cavity after being pressed.

[0034] In this invention, the two tapered surfaces on the top of the protrusion 13 form a dihedral angle with the second connecting surface 20. The dihedral angle is an acute angle. This allows the seal 30 to not only deepen the connection pressure between the first connecting surface 10 and the second connecting surface 20 under the action of gravity and extrusion when filling, but also to reduce the amount of seal 30, such as solder paste 30, entering the cavity.

[0035] In this invention, the connection between the first connecting surface 10 and the second connecting surface 20 is achieved through reflow soldering technology. Reflow soldering is a process that uses solder paste, typically a mixture of solder and flux, to connect one or more electronic components to contact pads. By controlling the flow, the solder is melted to achieve a permanent bond. This process is commonly used in the electronics manufacturing industry. The reflow soldering process includes single-sided and double-sided mounting. The main equipment is a reflow soldering machine, also known as a reflow oven or reflow furnace. It provides a heating environment to melt the solder paste 30, thereby reliably bonding the surface-mount components and PCB pads together through the solder paste 30 alloy. In this invention, the first connecting surface 10 and the second connecting surface 20 are connected via reflow soldering.

[0036] In another embodiment of the present invention, the second connecting surface 20 is recessed to form a groove 50, and the protrusion 13 is correspondingly connected to the groove 50, with the top end of the protrusion 13 abutting against the bottom of the groove 50. The groove 50 is conical, and the width of the conical opening of the groove 50 is greater than the width of the protrusion 13 in the horizontal direction. The height of the groove 50 in the vertical direction is greater than or equal to the height of the protrusion 13 in the vertical direction. The sidewall of the groove 50 forms the first gap 40 and the second gap 41 with the first protrusion surface 11 and the second protrusion surface 12, respectively. The sealing element 30 is configured as solder paste 30, which fills the first gap 40 and the second gap 41. With this configuration, the second connecting surface 20 is recessed to form a groove 50, which further optimizes the reduction of the contact area between the first connecting surface 10 and the second connecting surface 20 when filling the sealing element 30. This not only reduces the use of the sealing element 30 but also reduces its production cost.

[0037] In another embodiment of the invention, the second connecting surface 20 is recessed to form a groove 50. As shown in Figures 4 and 5, the groove may be conical, rectangular, or other shapes. The protrusion 13 is correspondingly connected to the groove 50, and the top end of the protrusion 13 abuts against the bottom of the groove 50. The vertical height of the protrusion 13 is equal to the vertical height of the groove 50, and the horizontal width of the protrusion 13 is less than the horizontal width of the groove 50. The bottom end of the protrusion extends to both sides to form a bottom extension. The bottom extension 14 of the protrusion 13 abuts against the opening of the groove 50, and the sidewall of the groove 50 forms a gap with the protrusion 13. After the first connecting surface 10 and the second connecting surface 20 are assembled and attached, a relatively closed tin-containing space 60 is formed on both sides of the protrusion 13. After the tin melts, it is placed in the tin-containing space 60. After welding, a relatively closed welding layer is formed. At the same time, the tin-containing space 60 can effectively prevent tin from splashing and falling during welding. If tin splashes or falls into the waveguide antenna cavity, it will also cause changes in the antenna performance.

[0038] In summary, this invention provides a connecting component and a waveguide antenna using the connecting component. The connecting component includes a first connecting surface 10, a second connecting surface 20, and a connecting seal 30. The first connecting surface 10 and the second connecting surface 20 are disposed opposite to each other and connected and fixed by the connecting seal 30. The first connecting surface 10 has a protrusion 13, which abuts against the second connecting surface 20 to form a gap. The connecting seal 30 fills the gap to connect the first connecting surface 10 and the second connecting surface 20. The connecting component of this invention can effectively solve the problems existing in current production where connection gaps and the filling seal 30 affect the connection or welding quality, leading to poor performance. This effectively improves production yield, reduces production costs, and increases production efficiency.

[0039] It should be noted that the various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. Similar or identical parts between embodiments can be referred to mutually. In addition, different parts between embodiments can also be combined with each other, and this invention does not limit this.

[0040] The above description is merely a description of preferred embodiments of the present invention and is not intended to limit the scope of the present invention in any way. Any changes or modifications made by those skilled in the art based on the above disclosure shall fall within the protection scope of the claims.

Claims

1. A connection assembly, characterized by: The connecting assembly includes a first connecting surface, a second connecting surface, and a connecting seal. The first connecting surface and the second connecting surface are arranged opposite to each other and are connected and fixed by the connecting seal. A protrusion is provided on the first connecting surface, and the protrusion abuts against the second connecting surface to form a gap. The connecting seal fills the gap to connect the first connecting surface and the second connecting surface.

2. The connection assembly of claim 1, wherein: The gap includes a first gap and a second gap, and the protrusion abuts against the second connecting surface to form the first gap and the second gap.

3. The connection assembly of claim 2, wherein: The protrusion includes a first protruding surface and a second protruding surface, the first gap is located between the first protruding surface and the second connecting surface, and the second gap is located between the second protruding surface and the second connecting surface.

4. The connection assembly of claim 3, wherein: The protrusion is tapered, with its top abutting against the second connecting surface, and the two tapered surfaces at the top of the protrusion forming dihedral angles with the second connecting surface.

5. The connection assembly of claim 4, wherein: The dihedral angle range is (0°, 90°).

6. The connection assembly of claim 5, wherein: The second connecting surface is recessed to form a groove, and the protrusion is connected to the groove accordingly, with the top of the protrusion abutting against the bottom of the groove.

7. The connection assembly of claim 6, wherein: The groove is conical, and the width of the conical opening of the groove is greater than the width of the protrusion in the horizontal direction.

8. The connection assembly of claim 7, wherein: The height of the groove in the vertical direction is greater than or equal to the height of the protrusion in the vertical direction.

9. The connection assembly of claim 8, wherein: The groove sidewall forms the first gap and the second gap with the first protruding surface and the second protruding surface, respectively. The sealing element is configured as solder paste, which fills the first gap and the second gap.

10. The connection assembly of claim 6, wherein: The vertical height of the protrusion is equal to the vertical height of the groove, and the horizontal width of the protrusion is less than the horizontal width of the groove.

11. The connection assembly of claim 10, wherein: The bottom end of the protrusion extends to both sides to form a bottom extension. The bottom extension abuts against the opening of the groove, and the sidewall of the groove forms a gap with the protrusion. The first connecting surface and the second connecting surface are assembled to form a relatively closed tin-containing space on both sides of the protrusion.

12. A waveguide antenna, characterized by: The waveguide antenna includes the connection component as described in any one of claims 1-10.