Electronic device, electronic apparatus, and transportation means

Abstract

The present application provides an electronic device, an electronic apparatus, and a transportation means. The electronic device comprises a housing, a chip, and a connecting member. The housing comprises a mounting surface. The housing is provided with an accommodating recess. The accommodating recess is recessed from the mounting surface. The chip comprises a packaging substrate and a functional portion. The functional portion and the packaging substrate are both located in the accommodating recess. The connecting member comprises edge parts and a middle part. The edge parts are connected to the periphery of the middle part, the edge parts are connected to the mounting surface, and the middle part is connected to the packaging substrate. The difference between the thermal expansion coefficient of the housing and the thermal expansion coefficient of the packaging substrate is greater than or equal to a preset threshold, and the thermal expansion coefficient of the connecting member is between the thermal expansion coefficient of the housing and the thermal expansion coefficient of the packaging substrate. According to embodiments of the present application, by adjusting the structure of an electronic device, the electronic device can be stably connected to chips having a plurality of different packaging modes.

Description

Electronic components, electronic equipment and vehicles

[0001] This application claims priority to Chinese Patent Application No. 202422758275.3, filed on November 13, 2024, with the Chinese National Intellectual Property Administration, entitled "Electronic Devices, Electronic Equipment and Vehicles", the entire contents of which are incorporated herein by reference. Technical Field

[0002] This application relates to the field of chip mounting, specifically to an electronic device, electronic equipment, and vehicle. Background Technology

[0003] Currently, chips in devices that require optical engines are generally packaged in plastic, metal, or ceramic. Plastic or metal packages offer a more stable connection to the mounting housing, reducing the likelihood of loosening. However, ceramic packages have a weaker connection, making the chip prone to loosening during use and hindering stable operation. Therefore, adjusting the structure of electronic devices to ensure high connection strength with chips of various package types, thereby guaranteeing stable chip operation, is a pressing issue that needs to be addressed. Summary of the Invention

[0004] Embodiments of this application provide an electronic device, an electronic device, and a vehicle, which can be stably connected to chips with various packaging methods by adjusting the structure of the electronic device.

[0005] In a first aspect, this application provides an electronic device, including a housing, a chip, and a connector. The housing includes a mounting surface and a receiving groove recessed from the mounting surface. The chip includes a packaging substrate and a functional portion, both located within the receiving groove. The connector includes an edge portion and a middle portion, the edge portion being connected to the periphery of the middle portion and connected to the mounting surface, and the middle portion being connected to the packaging substrate. The difference in the coefficients of thermal expansion between the housing and the packaging substrate is greater than or equal to a preset threshold, and the coefficient of thermal expansion of the connector is between the coefficients of thermal expansion of the housing and the packaging substrate.

[0006] Currently, when there is a significant difference between the thermal expansion coefficients of the chip's packaging substrate and the casing, the packaging substrate and casing will experience relative displacement due to different degrees of expansion or contraction during temperature changes. This relative displacement can cause stress concentration at the connection points between the packaging substrate and the casing, potentially leading to deformation of the chip's packaging substrate and damage to the chip's structure, rendering it unable to function properly.

[0007] In this embodiment, the housing can be connected to the chip via a connector, and the housing and the chip's packaging substrate do not need to be in direct contact. Therefore, during temperature changes, the deformation of the housing and the chip's packaging substrate will not affect each other's structural stability.

[0008] Because the thermal expansion coefficient of the connector lies between that of the housing and the packaging substrate, the connector can act as a buffer between them. The difference between the connector's and the housing's thermal expansion coefficients is relatively small (compared to the difference between the housing's and the packaging substrate's thermal expansion coefficients). During temperature changes, the deformation of the connector and the housing is relatively similar. Therefore, the stress at the connection point is relatively low, and the deformation of the connector and the housing is close. This ensures a certain level of connection strength, preventing the connector from detaching from the housing.

[0009] Furthermore, because the difference between the thermal expansion coefficients of the connector and the chip's packaging substrate is relatively small (compared to the difference between the thermal expansion coefficients of the housing and the packaging substrate), the deformation degrees of the connector and the packaging substrate are quite similar during temperature changes. Therefore, the stress at the connection between the connector and the chip is relatively low, and the connection between the connector and the chip's packaging substrate is more stable. The chip will not suffer structural damage due to deformation during temperature changes, thus maintaining structural integrity and contributing to stable chip operation.

[0010] In one possible implementation, the preset threshold is greater than or equal to 30*10. -6 / ℃.

[0011] In this embodiment, when the thermal expansion coefficient of the housing differs significantly from that of the packaging substrate (exceeding 30*10), -6 When the temperature changes during daily use, the direct connection between the housing and the packaging substrate of electronic devices is relatively unstable. By indirectly connecting the housing and the packaging substrate through connectors, the relative position of the housing and the chip can be kept basically unchanged, so that the chip can be stably installed in the housing.

[0012] In one possible implementation, the difference between the coefficient of thermal expansion of the connector and the coefficient of thermal expansion of the housing is 12*10. -6 / ℃-18*10 -6 Between / ℃.

[0013] In this embodiment, the difference between the connector and the housing is maintained at 12*10. -6 / ℃-18*10 -6Within a temperature range of / ℃. When the temperature changes, the deformation of the housing and the connector is relatively similar, making it less prone to disconnection at the connection point. Furthermore, the coefficient of thermal expansion of the connector is also relatively close to that of the chip's packaging substrate, resulting in a more stable connection between the connector and the chip's packaging substrate, thus preventing damage to the connection between the connector and the housing and / or the chip.

[0014] In one possible implementation, the electronic device further includes a first colloid and a second colloid, the first colloid being connected between the middle portion and the encapsulation substrate, and the second colloid being connected between the edge portion and the mounting surface, with the first colloid and the second colloid being spaced apart.

[0015] In this embodiment, the first colloid can fix the middle portion of the connector to the packaging substrate. The second colloid can fix the edge portion of the connector to the housing, thereby ensuring that the housing and the chip are in a stable relative position, preventing the chip from shaking relative to the housing and affecting the normal operation of the chip.

[0016] In one possible implementation, the connector includes a first connecting surface facing the encapsulation substrate, a connecting groove recessed in the middle portion of the first connecting surface, and a first adhesive connecting the connecting groove and the encapsulation substrate.

[0017] In this embodiment, the connecting groove can accommodate the first adhesive and prevent the first adhesive from overflowing from the middle part of the connector and the ceramic substrate before curing.

[0018] In one possible implementation, the connector is provided with a buffer groove, the orthogonal projection of the buffer groove onto the encapsulation substrate being located between the first colloid and the second colloid.

[0019] In this embodiment, the buffer groove can be spaced between the middle portion and the edge portion of the connector. The edge portion of the connector is subjected to stress from the thermal expansion and contraction of the housing, while the middle portion is subjected to stress from the thermal expansion and contraction of the chip's packaging substrate. The buffer groove can prevent the force on the edge portion of the connector from being transmitted to the middle portion, and at the same time prevent the force on the middle portion of the connector from being transmitted to the edge. This prevents the chip and housing from directly generating stress differences due to a mismatch in their coefficients of thermal expansion, allowing the connector to better absorb the stress and deformation caused by the thermal expansion and contraction of the housing and the chip's packaging substrate, making the relative position of the chip and housing more stable.

[0020] In one possible implementation, the electronic device further includes a third colloid and a fourth colloid, the third colloid being connected between the intermediate portion and the encapsulation substrate, the third colloid being spaced apart from the first colloid, and the fourth colloid being connected between the edge portion and the mounting surface, the fourth colloid being spaced apart from the second colloid.

[0021] The materials of the third and fourth colloids are photocurable materials.

[0022] In this embodiment, the third colloid can be pre-positioned between the edge of the connector and the housing. The fourth colloid can be pre-positioned between the middle of the connector and the chip. The third and fourth colloids can fix the relative positions of the connector, housing, and chip before the first and second colloids have cured, so that the first and second colloids can stably connect the three components according to the predetermined positions under high-temperature baking.

[0023] In one possible implementation, the electronic device further includes a heating element, and the connector further includes a second connecting surface. In the thickness direction of the connector, the second connecting surface is opposite to the first connecting surface. The heating element is connected to the second connecting surface and is used to heat the working environment temperature of the chip when the ambient temperature of the electronic device is lower than or equal to a preset temperature threshold.

[0024] In this embodiment, the heating element can heat the chip's ambient temperature when the ambient temperature is low, so that the chip can work at a suitable ambient temperature and ensure that the chip can operate normally and stably.

[0025] In one possible implementation, the heating element includes a main body and an electrical connection wire. The main body is connected to a second connection surface. One end of the electrical connection wire is electrically connected to the main body, and the other end is used to electrically connect to a controller. When the ambient temperature is lower than or equal to a preset temperature threshold, the controller is used to control the main body to heat up through the electrical connection wire.

[0026] In one possible implementation, the connector is provided with a limiting body, which includes a first segment and a second segment. One end of the first segment is bent and connected to the second segment, and the other end is connected to a second connecting surface. There is a gap between the second segment and the second connecting surface, and a portion of the electrical connection wire is located between the second segment and the second connecting surface.

[0027] In this embodiment, the limiting body can provide support and limit the electrical connection wire, preventing the electrical connection wire from moving to other positions and affecting the operation of other components.

[0028] In one possible implementation, the electronic device further includes a heat conductor connected between the intermediate portion of the packaging substrate and the connector, with the heat conductor and the first colloid spaced apart.

[0029] In this embodiment, the heat conductor can transfer the heat of the chip to the connector in a timely manner, and then transfer the heat from the connector to the environment to complete the heat dissipation of the chip, thereby avoiding the accumulation of heat in the chip and causing the chip to overheat and fail to work properly.

[0030] In one possible implementation, the electronic device further includes a light source, and the housing has a light-transmitting channel that communicates with a receiving groove. The functional unit includes a light-transmitting plate and a liquid crystal layer. The light-transmitting plate is stacked with a packaging substrate to form a receiving space, and the liquid crystal layer is located within the receiving space. The light-transmitting plate is connected to the bottom wall of the receiving groove. The light source emits light, which, after entering the housing, passes through the light-transmitting channel and the light-transmitting plate and is reflected on the surface of the liquid crystal layer.

[0031] In this embodiment, the electronic device can be part of the optomechanical system of the head-up display system, and the chip can be a reflective liquid crystal chip. This embodiment uses a connector to stably connect the chip to the housing, which fixes the chip's position relative to the housing, preventing the chip from shaking when reflecting light. This makes the optical path of the light emitted by the optomechanical system more stable, facilitating stable image formation in the head-up display system.

[0032] In one possible implementation, the connector and the housing form the outer casing structure of the electronic device.

[0033] Secondly, this application provides an electronic device, including a controller, a sensor, and the electronic device as described above. The controller is electrically connected to the electronic device, and the controller is able to identify the temperature signal from the sensor and issue an operating command to the heating element of the electronic device.

[0034] Thirdly, this application also provides a means of transportation, including a body and an electronic device as described above, the electronic device being mounted on the body. Attached Figure Description

[0035] To more clearly illustrate the technical solution of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0036] Figure 1 is a schematic diagram of the structure of the vehicle provided in an embodiment of this application;

[0037] Figure 2 is a schematic diagram of the electronic device shown in Figure 1;

[0038] Figure 3 is an exploded view of the electronic device shown in Figure 2;

[0039] Figure 4 is an enlarged schematic diagram of part A of the electronic device shown in Figure 3;

[0040] Figure 5 is a schematic diagram of the shell shown in Figure 3;

[0041] Figure 6 is a schematic diagram of the structure of the chip described in Figure 3;

[0042] Figure 7 is a structural schematic diagram of the connector shown in Figure 3;

[0043] Figure 8 is a schematic diagram of the connector shown in Figure 7, which has an adhesive component.

[0044] Reference numerals: 100-Vehicle; 10-Body; 20-Electronic device; 21-Controller; 22-Sensor; 23-Electronic component; 231-Housing; 232-Chip; 233-Connector; 234-Heating element; 2311-Light transmission channel; 2312-Mounting surface; 2313-Cable outlet surface; 2314-Receiving slot; 2315-Communication slot; 2316-Connecting slot; 2317-First adhesive slot; 2318-Second adhesive slot; 2321-Encapsulation substrate; 2322-Functional part; 2323-Light transmission plate; 2331-First 2332 - Second connecting surface; 2333 - Edge portion; 2334 - Middle portion; 2335 - First connecting groove; 2336 - Second connecting groove; 2337 - Third connecting groove; 2338 - First ring platform; 2339 - Second ring platform; 2330 - Buffer groove; 235 - Limiting body; 2351 - First segment; 2352 - Second segment; 236 - First colloid; 237 - Second colloid; 238 - Third colloid; 239 - Fourth colloid; 240 - Heat conductor; 2341 - Main body; 2342 - Electrical connection wire. Detailed Implementation

[0045] The specific embodiments of this application will now be described in more detail with reference to the accompanying drawings. Although exemplary embodiments of this application are shown in the drawings, it should be understood that this application may be implemented in other ways different from those described herein, and therefore, this application is not limited to these embodiments.

[0046] For ease of understanding, the terminology used in the embodiments of this application will be explained first.

[0047] Multiple: refers to two or more.

[0048] Connection: should be interpreted broadly. For example, the connection between A and B can be a direct connection between A and B, or an indirect connection between A and B through an intermediary.

[0049] The specific embodiments of this application will now be clearly described in conjunction with the accompanying drawings.

[0050] Please refer to Figure 1, which is a schematic diagram of the structure of a vehicle 100 provided in an embodiment of this application. The vehicle 100 can be any type of tool that requires the use of a head-up display device or an image projection device. The following description and accompanying drawings use a vehicle as an example of the vehicle 100, but it should be understood that the vehicle 100 is not limited to a vehicle.

[0051] The vehicle 100 includes a body 10 and electronic equipment 20. The body 10 can be the vehicle body. The electronic equipment 20 can be a head-up display (HUD) or image projection device required by the vehicle.

[0052] Among them, the HUD can project key driving information, such as vehicle speed and navigation instructions, onto the vehicle's windshield or a specially designed holographic semi-mirror. This allows the driver to easily access this information without looking down while driving, significantly enhancing driving safety.

[0053] Image projection devices can project entertainment content such as movies, TV shows, and sporting events onto large screens inside vehicles, such as the windshield, roof, or specially designed projection screens. This allows drivers and passengers to enjoy a private cinema-like viewing experience inside the car, without being limited by screen size and functionality, making long journeys or daily commutes more enjoyable and comfortable.

[0054] Please refer to Figure 1. The electronic device 20 includes a controller 21, a sensor 22, and an electronic component 23. The controller 21, sensor 22, and electronic component 23 can all be mounted on the body 10 of the vehicle 100. The controller 21 is electrically connected to the heating element in the electronic component 23. The controller 21 can recognize the temperature signal from the sensor 22. When the controller 21 detects that the temperature signal is below a preset temperature threshold, the controller 21 can control the heating element to rise, thereby increasing the ambient temperature of the electronic component 23 and preventing the electronic component 23 from failing to start and operate normally under low-temperature conditions.

[0055] In this context, controller 21 generally refers to a series of electronic devices used to manage and control various systems and components of the vehicle. These controllers 21 receive signals from sensors 22 and other input devices, and then process and analyze these signals according to predetermined programs and algorithms, thereby achieving precise control of various vehicle functions.

[0056] Sensor 22 can be a temperature sensor. A temperature sensor can sense the temperature information of its environment and convert the sensed temperature information into an electrical signal or other required form of information output according to a certain rule, so as to meet the requirements of information transmission, processing, storage, display, recording and control.

[0057] Electronic device 23 can be any device that requires the chip to be mounted in its housing structure. The following description uses an example where electronic device 23 can be a projection optical engine for a vehicle. This projection optical engine is capable of projecting the desired image into a projected image.

[0058] Currently, chips in electronic devices generally employ plastic, metal, or ceramic encapsulation. Among these, the connection between the plastic or metal encapsulation structure and the mounting housing is relatively stable and less prone to loosening. However, the connection strength between the ceramic encapsulation structure and the mounting housing is weaker, making the chip susceptible to loosening during use and thus unable to function stably. Therefore, how to adjust the casing structure of electronic devices to ensure high connection strength with chips of various encapsulation structures, thereby guaranteeing stable chip operation, is a pressing problem that needs to be solved.

[0059] Based on this, please refer to Figures 2 and 3. Figure 2 is a structural schematic diagram of the electronic device 23 shown in Figure 1. Figure 3 is an exploded schematic diagram of the electronic device 23 shown in Figure 2. In this embodiment, by adjusting the structure of the electronic device 23, the outer casing structure (not shown) of the electronic device 23 can be stably connected to the packaging substrates of various different chips, allowing the chips to be stably mounted on the casing structure. The relative position of the chip and the casing structure is stable, thereby enabling the chip to stably process light and preventing the projected image from flickering.

[0060] Electronic device 23 includes a housing 231, a chip 232, a connector 233, and a heating element 234. Both chip 232 and connector 233 are mounted on the housing 231. Electronic device 23 may also include a light source (not shown), which emits light that travels to chip 232 to generate an image.

[0061] It should be noted that Figure 2 is only intended to schematically illustrate the connection relationship between the housing 231, chip 232, connector 233, and heating element 234, and is not intended to specifically limit the connection positions, specific structures, or quantities of each device. Furthermore, the structures illustrated in the embodiments of this application do not constitute a specific limitation on the electronic device 23. In other embodiments of this application, the electronic device 23 may include more or fewer components than illustrated, or combine certain components, or split certain components, or have different component arrangements. The illustrated components may be implemented in hardware, software, or a combination of both.

[0062] In this embodiment, the electronic device 23 can be the optomechanical system of a vehicle's head-up display system, and the chip 232 can be a reflective liquid crystal chip. In this embodiment, the chip 232 is stably connected to the housing 231 via the connector 233, which fixes the relative positions of the chip 232 and the housing 231, preventing the chip 232 from shaking when reflecting light. This makes the optical path of the light emitted by the optomechanical system more stable, facilitating stable image formation in the head-up display system.

[0063] Please refer to Figure 5, which is a structural schematic diagram of the housing 231 shown in Figure 3. The housing 231 has a light-transmitting channel 2311. The light-transmitting channel 2311 penetrates the housing 231. The wall of the light-transmitting channel 2311 can be the inner surface of the housing 231. The cavity shape of the light-transmitting channel 2311 can be a straight through hole or a curved through hole. The light-transmitting channel 2311 can be arranged in a serpentine pattern inside the housing 231. This application does not limit the specific shape of the light-transmitting channel 2311.

[0064] The housing 231 may include a mounting surface 2312 and a wiring surface 2313. The mounting surface 2312 may be a part of the outer surface of the housing 231. The mounting surface 2312 may be a curved surface, a stepped surface, or a flat surface, etc. This application does not limit the specific shape of the mounting surface 2312. The wiring surface 2313 is bent and connected to the edge of the mounting surface 2312. The wiring surface 2313 is the surface from which the electrical connection lines of the chip 232 extend from the receiving slot.

[0065] The housing 231 is provided with a receiving groove 2314, a communicating groove 2315, and a connecting groove 2316. The receiving groove 2314 is recessed by the mounting surface 2312. The receiving groove 2314 also extends through the exit surface 2313. The communicating groove 2315 extends through the middle portion of the bottom wall of the receiving groove 2314 and the wall of the light-transmitting channel 2311. The communicating groove 2315 connects the receiving groove 2314 and the light-transmitting channel 2311. The connecting groove 2316 is recessed by the bottom wall of the receiving groove 2314. The connecting groove 2316 is arranged around the communicating groove 2315 and is spaced apart from the communicating groove 2315.

[0066] The housing 231 may also be provided with a first adhesive groove 2317 and a second adhesive groove 2318. Both the first adhesive groove 2317 and the second adhesive groove 2318 are recessed by the mounting surface 2312 and are located on opposite sides of the receiving groove 2314. Both the first adhesive groove 2317 and the second adhesive groove 2318 can communicate with the receiving groove 2314.

[0067] A light source (not shown) can be connected to the housing 231 via a back panel (not shown). The light source can emit light into the light transmission channel 2311. For example, the light source may include a laser light source, an LED light source, a fluorescent light source, etc.

[0068] Chip 232 can be a spatial light modulator. Spatial light modulators can be digital micromirror devices (DMDs), liquid crystal displays (LCDs), liquid crystal on silicon (LCOS), etc. They are used to modulate light from a light source to generate image light. The following explanation uses chip 232 as an example of an LCOS chip.

[0069] Please refer to Figure 6, which is a schematic diagram of the structure of the chip 232 described in Figure 3. The chip 232 includes a packaging substrate 2321 and a functional unit 2322. The packaging substrate 2321 can be a metal substrate, a plastic substrate, or a ceramic substrate, etc.

[0070] The housing 231 of the optical engine used for projection is generally made of molded plastic due to its relatively complex structure. Different plastic housing materials have different coefficients of thermal expansion. For example, the coefficient of thermal expansion of polyvinyl chloride (PVC) is approximately 37*10. -6 / ℃. The coefficient of thermal expansion of polypropylene (PP) is approximately 30.6*10. -6 / ℃. The coefficient of thermal expansion of ceramic materials is generally less than 10*10. -6 / ℃.

[0071] Both the functional unit 2322 and the packaging substrate 2321 are located in the receiving groove 2314.

[0072] Currently, due to the significant difference in the coefficients of thermal expansion between the ceramic substrate and the shell, if the ceramic substrate is directly connected to the plastic shell, the different degrees of deformation of the ceramic substrate and the plastic shell when the temperature changes can easily lead to stress at the connection between the ceramic substrate and the plastic shell, affecting the connection stability between the ceramic substrate and the plastic shell.

[0073] Therefore, this application indirectly connects the packaging substrate 2321 and the housing 231 through the connector 233, avoiding direct contact between the packaging substrate 2321 and the housing 231. This prevents large stress from being generated at the connection point when the packaging substrate 2321 and the housing 231 undergo different degrees of deformation, thus preventing instability at the connection point between the packaging substrate 2321 and the housing 231.

[0074] The electronic device 23 provided in this application embodiment can use a ceramic packaging substrate 2321. Since the packaging cost of the ceramic packaged chip 232 is lower than that of the chip 232 packaged with materials such as metal, the electronic device 23 provided in this application embodiment can also use a chip 232 with a lower packaging cost, thereby reducing the overall production cost of the electronic device 23.

[0075] Specifically, the packaging substrate 2321 of the chip 232 is provided with a receiving groove (not shown in the figure). The receiving groove is recessed along one surface of the packaging substrate 2321 in the thickness direction and penetrates one peripheral side surface of the packaging substrate 2321.

[0076] Functional unit 2322 includes a light-transmitting plate 2323 and a liquid crystal layer (not shown). The light-transmitting plate 2323 is stacked with the encapsulation substrate 2321 to form a receiving space, and the liquid crystal layer is located within the receiving space.

[0077] The light-transmitting plate 2323 can be a glass panel. The light-transmitting plate 2323 allows light to pass through, thus enabling the light to shine onto the liquid crystal layer.

[0078] An opening is provided between the light-transmitting plate 2323 and one side edge of the encapsulation substrate 2321, and the opening communicates with the receiving groove of the encapsulation substrate 2321. The opening is used for the circuit traces of the liquid crystal layer to pass through. The side of the light-transmitting plate 2323 facing away from the liquid crystal layer is connected to the connecting groove 2316 through a connecting adhesive.

[0079] The surface of the packaging substrate 2321 of chip 232 facing away from the liquid crystal layer can be set on the same side as the mounting surface 2312 of housing 231.

[0080] In this embodiment, there is a difference between the coefficient of thermal expansion of the packaging substrate 2321 of the chip 232 and the coefficient of thermal expansion of the housing 231, and this difference is not zero. The difference between the coefficient of thermal expansion of the packaging substrate 2321 and the housing 231 is defined as a preset threshold value. For example, when the material of the housing 231 is a plastic material and the material of the packaging substrate 2321 is a ceramic material, the preset threshold value is greater than or equal to 30 * 10. -6 / ℃.

[0081] In this embodiment, when the thermal expansion coefficient of the housing 231 differs significantly from that of the packaging substrate 2321 (exceeding 30*10), -6 When the temperature changes during daily use, the direct connection between the housing 231 and the packaging substrate 2321 is less stable. By indirectly connecting the housing 231 and the packaging substrate 2321 through the connector 233, the relative position of the housing 231 and the chip 232 can remain basically unchanged, so that the chip 232 can be stably installed on the housing 231.

[0082] In some other embodiments, the material of the housing 231 can be a plastic material, and the material of the packaging substrate 2321 of the chip 232 can be a metal material. The preset threshold can be in the range of 0-30 (including the endpoint value 30).

[0083] In this embodiment, the electronic device 23 can use a chip 232 packaged on a ceramic substrate. In other application scenarios, the electronic device 23 can also use a chip 232 packaged in plastic or metal. As the electronic device 20 is continuously updated and iterated, the types of chips 232 are also constantly changing. The electronic device 23 provided in this application embodiment can stably install chips 232 with any common packaging method.

[0084] The light source emits light, which enters the housing 231 and passes through the light-transmitting channel 2311 and the light-transmitting plate 2323, and is reflected on the surface of the liquid crystal layer. Under the influence of an electrical signal, the liquid crystal layer undergoes a change in the arrangement of its liquid crystal molecules, thereby altering the polarization state of the light and reflecting it. The reflected light can be magnified and projected onto a screen to form an image.

[0085] Please refer to Figure 7, which is a structural schematic diagram of the connector 233 shown in Figure 3. The connector 233 includes a first connecting surface 2331 and a second connecting surface 2332. The first connecting surface 2331 and the second connecting surface 2332 are disposed opposite to each other along the thickness direction of the connector 233. The first connecting surface 2331 faces the packaging substrate 2321 of the chip 232. The second connecting surface 2332 faces away from the packaging substrate 2321 of the chip 232.

[0086] The first connecting surface 2331 of the connector 233 includes an edge portion 2333 and a middle portion 2334, with the edge portion 2333 connected to the periphery of the middle portion 2334. The edge portion 2333 is connected to the mounting surface 2312, and the middle portion 2334 is connected to the packaging substrate 2321. The connector 233 and the housing 231 form the housing structure of the electronic device 23, which can mount the chip 232 therein. The coefficient of thermal expansion of the connector 233 is between that of the housing 231 and the packaging substrate 2321.

[0087] Currently, when there is a significant difference between the coefficient of thermal expansion of the packaging substrate 2321 of chip 232 and the coefficient of thermal expansion of the housing 231, the packaging substrate 2321 and the housing 231 will experience relative displacement due to different degrees of expansion or contraction during temperature changes. This relative displacement will cause stress concentration at the connection between the packaging substrate 2321 and the housing 231, which may lead to deformation of the packaging substrate 2321 of chip 232, resulting in damage to the structure of chip 232 and rendering it unable to function properly.

[0088] In this embodiment, the housing 231 can be connected to the chip 232 via the connector 233, and the housing 231 and the packaging substrate 2321 of the chip 232 do not need to be in direct contact. Therefore, during temperature changes, the deformation of the housing 231 and the deformation of the packaging substrate 2321 of the chip 232 will not affect each other's structural stability.

[0089] Since the coefficient of thermal expansion of connector 233 is between that of housing 231 and packaging substrate 2321, connector 233 can provide buffering between housing 231 and packaging substrate 2321.

[0090] The difference between the thermal expansion coefficient of connector 233 and that of housing 231 is relatively small (compared to the difference between the thermal expansion coefficient of housing 231 and that of packaging substrate 2321). During temperature changes, the deformation of connector 233 and housing 231 is relatively similar. Therefore, the stress at the connection between connector 233 and housing 231 is relatively small, and the deformation of connector 233 and housing 231 is relatively similar. Thus, connector 233 and housing 231 can maintain a certain degree of connection strength so that connector 233 will not fall off housing 231.

[0091] Furthermore, since the difference between the thermal expansion coefficients of the connector 233 and the packaging substrate 2321 of the chip 232 is relatively small (compared to the difference between the thermal expansion coefficients of the housing 231 and the packaging substrate 2321), the deformation degrees of the connector 233 and the packaging substrate 2321 are relatively similar during temperature changes. Therefore, the stress at the connection between the connector 233 and the chip 232 is relatively small, and the connection between the connector 233 and the packaging substrate 2321 of the chip 232 is relatively stable. The chip 232 will not suffer structural damage due to deformation during temperature changes, thus maintaining structural integrity and contributing to the stable operation of the chip 232.

[0092] In one possible implementation, the difference between the coefficient of thermal expansion of the connector 233 and the coefficient of thermal expansion of the housing 231 is within 12*10. -6 / °C-18*10 -6 Between / ℃ (including the endpoint value 12*10) -6 / ℃ and 18*10 -6 / ℃).

[0093] In this embodiment, the difference between the connector 233 and the housing 231 is maintained at 12*10. -6 / ℃-18*10 -6 The temperature range is between ℃. When the temperature changes, the deformation of the housing 231 and the connector 233 is relatively similar, making it less prone to disconnection at the connection point. Furthermore, the coefficient of thermal expansion of the connector 233 is also relatively close to that of the packaging substrate 2321 of the chip 232, resulting in a more stable connection between the connector 233 and the packaging substrate 2321 of the chip 232, thus preventing damage to the connection between the connector 233 and the housing 231 and / or the chip 232.

[0094] Specifically, there are two edge portions 2333. The two edge portions 2333 are respectively connected to both sides of the width direction of the middle portion 2334.

[0095] The connector 233 is also provided with multiple connecting grooves (not shown in the figure). These multiple connecting grooves are recessed in the middle portion 2334 of the first connecting surface 2331, and are designated as a first connecting groove 2335, a second connecting groove 2336, and a third connecting groove 2337. Along the length of the middle portion 2334, the first connecting groove 2335, the second connecting groove 2336, and the third connecting groove 2337 are arranged sequentially and spaced apart.

[0096] The connector 233 also includes a first annular platform 2338 and a second annular platform 2339. Both the first annular platform 2338 and the second annular platform 2339 protrude from the middle portion 2334 of the first connector 233. The first annular platform 2338 surrounds the periphery of the first connecting groove 2335. The second annular platform 2339 surrounds the periphery of the third connecting groove 2337. The first annular platform 2338 and the second annular platform 2339 can abut against the packaging substrate 2321 of the chip 232 to form a sealed cavity.

[0097] The connector 233 also has two buffer grooves 2330. The buffer grooves 2330 extend through the connector 233 along its thickness direction. The two buffer grooves 2330 are positioned opposite each other along the width direction of the intermediate portion 2334. The two buffer grooves 2330 extend along the length direction of the intermediate portion 2334. The two buffer grooves 2330 are located on opposite sides of the second connecting groove 2336 and the third connecting groove 2337, respectively.

[0098] In this embodiment, the buffer groove 2330 can be spaced between the connection point of the middle portion 2334 of the connector 233 and the chip 232 and the connection point of the edge portion 2333 and the housing 231. The edge portion 2333 of the connector 233 will be subjected to stress caused by the thermal expansion and contraction of the housing 231, and the middle portion 2334 of the connector 233 will be subjected to stress caused by the thermal expansion and contraction of the packaging substrate 2321 of the chip 232.

[0099] The buffer groove 2330 prevents the force on the edge portion 2333 of the connector 233 from being transmitted to the middle portion 2334, and at the same time prevents the force on the middle portion 2334 of the connector 233 from being transmitted to the edge. This prevents the chip 232 and the housing 231 from directly generating stress differences due to the mismatch of their coefficients of thermal expansion, allowing the connector 233 to better absorb the stress and deformation caused by the thermal expansion and contraction of the housing 231 and the packaging substrate 2321 of the chip 232, making the relative position of the chip 232 and the housing 231 more stable.

[0100] In some possible embodiments, please refer to Figures 3 and 4, where Figure 4 is an enlarged schematic diagram of part A of the electronic device 23 shown in Figure 3. The connector 233 also includes a limiting body 235. The limiting body 235 can be L-shaped. The limiting body 235 includes a first segment 2351 and a second segment 2352. One end of the first segment 2351 is bent and connected to the second segment 2352, and the other end is connected to the second connecting surface 2332. There is a gap between the second segment 2352 and the second connecting surface 2332, and part of the electrical connection wire of the heating element 234 is located between the second segment 2352 and the second connecting surface 2332.

[0101] In this embodiment, the limiting body 235 can provide support and limit the electrical connection line of the heating body 234, preventing the electrical connection line of the heating body 234 from moving to other positions and affecting the operation of other components.

[0102] This application also conducted simulation tests on the deformation of connector 233 at extreme low temperatures. Under an ambient temperature of -40°C, when the material of connector 233 includes aluminum alloy, the structural strain of the middle portion 2334 of connector 233 is 2%. The decoupling strain of the edge portion 2333 of connector 233 is 1.1%. In the mechanical property tests of connector 233, it was found that the structure of connector 233 will not fracture when the strain is less than 2.8%. Exemplarily, connector 233, made of aluminum alloy, can be die-cast using a die-casting machine.

[0103] When the material of connector 233 is a copper alloy at an ambient temperature of -40°C, the structural strain of the middle portion 2334 of connector 233 is 1.7%. The decoupling strain of the edge portion 2333 of connector 233 is also 1.7%. Mechanical property testing of connector 233 revealed that the structure of connector 233 will not fracture when the strain is less than 2.8%. For example, connector 233 made of copper alloy can be manufactured by forging or sheet metal stamping. The manufacturing cost of connector 233 made of copper alloy is higher than that of connector 233 made of aluminum alloy.

[0104] Please refer to Figures 5, 7, and 8. Figure 8 is a schematic diagram of the connector 233 shown in Figure 7, which includes an adhesive. The electronic device 23 also includes a first adhesive 236 and a second adhesive 237. There is one first adhesive 236, which connects the second connecting groove 2336 of the intermediate portion 2334 to the packaging substrate 2321.

[0105] There are two second adhesives 237. One second adhesive 237 is connected between the middle portion 2334 of the first adhesive groove 2317 at one edge portion 2333 and the mounting surface 2312. The other second adhesive 237 is connected to the middle portion 2334 of the second adhesive groove 2318 at the other edge portion 2333. The first adhesive 236 and the second adhesive 237 are spaced apart. The orthogonal projection of the buffer groove 2330 onto the encapsulation substrate 2321 is located between the first adhesive 236 and the second adhesive 237.

[0106] The elastic modulus of both the first colloid 236 and the second colloid 237 can be in the range of 2 GPa to 3 GPa. The materials of the first colloid 236 and the second colloid 237 can be the same. Both the first colloid 236 and the second colloid 237 can be colloidal materials that cure under high-temperature baking.

[0107] In this embodiment, the first colloid 236 can fix the middle portion 2334 of the connector 233 to the packaging substrate 2321. The second colloid 237 can fix the edge portion 2333 of the connector 233 to the housing 231, thereby ensuring that the housing 231 and the chip 232 are in a stable relative position, preventing the chip 232 from shaking relative to the housing 231 and affecting the normal operation of the chip 232.

[0108] In addition, the connecting groove 2316 (second connecting groove 2336) can accommodate the first adhesive 236 and prevent the first adhesive 236 from overflowing from the middle portion 2334 of the connector 233 and the encapsulation substrate 2321 before curing.

[0109] In some other possible embodiments, the electronic device 23 further includes a third colloid 238 and a fourth colloid 239. The materials of the third colloid 238 and the fourth colloid 239 are photocurable materials. For example, the third colloid 238 and the fourth colloid 239 can be cured under ultraviolet light.

[0110] The third colloid 238 connects the intermediate portion 2334 and the encapsulation substrate 2321. For example, there may be two third colloids 238. The two third colloids 238 are respectively connected to opposite sides of the second connecting groove 2336. Part of the third colloid 238 may be located within the buffer groove 2330. The third colloid 238 is spaced apart from the first colloid 236.

[0111] A fourth adhesive 239 is connected between the adhesive groove of the edge portion 2333 and the mounting surface 2312. For example, there can be four fourth adhesives 239. Two of the four fourth adhesives 239 are connected to both ends of the first adhesive groove 2317 of one edge portion 2333, and the other two fourth adhesives 239 are connected to both ends of the second adhesive groove 2318 of another edge portion 2333. The two fourth adhesives 239 can be located on opposite sides of the length of a second adhesive 237. The fourth adhesives 239 and the second adhesive 237 are spaced apart.

[0112] In this embodiment, the third colloid 238 can be pre-positioned between the edge portion 2333 of the connector 233 and the housing 231. The fourth colloid 239 can be pre-positioned between the middle position of the connector 233 and the chip 232.

[0113] The third colloid 238 and the fourth colloid 239 can fix the relative positions of the connector 233, the housing 231 and the chip 232 before the first colloid 236 and the second colloid 237 have cured, so that the first colloid 236 and the second colloid 237 can stably connect the three in a predetermined position under high temperature baking.

[0114] The electronic device 23 also includes a heat conductor 240. There can be two heat conductors 240. One heat conductor 240 is connected between the first connecting groove 2335 of the intermediate portion 2334 of the packaging substrate 2321 and the connector 233, with the heat conductor 240 spaced apart from the first colloid 236. The other heat conductor 240 is connected between the third connecting groove 2337 of the intermediate portion 2334 of the packaging substrate 2321 and the connector 233.

[0115] In this embodiment, the heat conductor 240 can transfer the heat of the chip 232 to the connector 233 in a timely manner, and then transfer the heat from the connector 233 to the environment to complete the heat dissipation of the chip 232, thereby avoiding the accumulation of heat in the chip 232 and preventing the chip 232 from becoming too hot and unable to work properly.

[0116] The heating element 234 is connected to the second connection surface 2332 of the connector 233. The heating element 234 is used to heat the working environment temperature of the chip 232 when the ambient temperature of the electronic device 23 is lower than or equal to a preset temperature threshold.

[0117] In this embodiment, the heating element 234 can heat the ambient temperature of the chip 232 when the ambient temperature is low, so that the chip 232 can work at a suitable ambient temperature and ensure that the chip 232 can operate normally and stably.

[0118] Specifically, referring to Figure 3, the heating element 234 includes a main body 2341 and an electrical connection wire 2342. The main body 2341 is connected to the second connecting surface 2332. One end of the electrical connection wire 2342 is electrically connected to the main body 2341, and the other end passes through the gap between the second segment 2352 of the limiting body 235 and the second connecting surface 2332 to be electrically connected to the controller 21.

[0119] Electronic device 20 may have a preset temperature threshold. The preset temperature threshold can be the minimum temperature at which chip 232 can operate normally. When the ambient temperature is higher than the preset temperature threshold, chip 232 can start up and operate normally. When the ambient temperature is lower than or equal to the preset temperature threshold, chip 232 has difficulty starting up and operating at low temperatures.

[0120] The sensor 22 of the electronic device 20 can identify the ambient temperature. When the ambient temperature is lower than or equal to a preset temperature threshold, the sensor 22 can send a signal to the controller 21. The controller 21 can send a working command to the heating element 234 through the electrical connection line 2342 according to the signal of the sensor 22, and control the body 2341 of the heating element 234 to heat up.

[0121] When the main body 2341 of the heating element 234 heats up, it can heat the ambient temperature where the chip 232 is located. This ensures that the ambient temperature is greater than or equal to a preset temperature threshold, thereby enabling the chip 232 to start working normally.

[0122] The above are exemplary embodiments of this application. It should be noted that those skilled in the art can make several improvements and modifications without departing from the principles of this application, and these improvements and modifications are also considered to be within the scope of protection of this application.

Claims

1. An electronic device, characterized by include: The housing includes a mounting surface, and the housing is provided with a receiving groove, which is recessed from the mounting surface. The chip includes a packaging substrate and a functional part, both of which are located within the receiving groove. A connector includes an edge portion and a middle portion, the edge portion being connected to the periphery of the middle portion and to the mounting surface, the middle portion being connected to the encapsulation substrate, the difference between the thermal expansion coefficients of the housing and the encapsulation substrate being greater than or equal to a preset threshold, and the thermal expansion coefficient of the connector being between the thermal expansion coefficients of the housing and the encapsulation substrate.

2. Electronic device according to claim 1, characterized in that The preset threshold is greater than or equal to 30*10 -6 / ℃.

3. Electronic device according to claim 1 or 2, characterized in that The difference between the coefficient of thermal expansion of the connecting member and the coefficient of thermal expansion of the housing is between 12*10 -6 / °C and 18*10 -6 / °C.

4. Electronic device according to claim 3, characterized in that The electronic device further includes a first colloid and a second colloid, the first colloid being connected between the middle portion and the encapsulation substrate, and the second colloid being connected between the edge portion and the mounting surface, with the first colloid and the second colloid being spaced apart.

5. Electronic device according to claim 4, characterized in that The connector includes a first connecting surface facing the encapsulation substrate, a connecting groove recessed in the middle portion of the first connecting surface, and the first colloid connecting the connecting groove and the encapsulation substrate.

6. Electronic device according to claim 4 or 5, characterized in that The connector is provided with a buffer groove, and the orthogonal projection of the buffer groove onto the encapsulation substrate is located between the first colloid and the second colloid.

7. Electronic device according to claim 4 or 5, characterized in that The electronic device further includes a third colloid and a fourth colloid. The third colloid is connected between the middle portion and the encapsulation substrate, and is spaced apart from the first colloid. The fourth colloid is connected between the edge portion and the mounting surface, and is spaced apart from the second colloid.

8. Electronic device according to claim 5, characterized in that The electronic device further includes a heating element, and the connector further includes a second connecting surface. In the thickness direction of the connector, the second connecting surface is opposite to the first connecting surface. The heating element is connected to the second connecting surface. The heating element is used to heat the working environment temperature of the chip when the ambient temperature of the electronic device is lower than or equal to a preset temperature threshold.

9. Electronic device according to claim 8, characterized in that The heating element includes a main body and an electrical connection wire. The main body is connected to the second connection surface. One end of the electrical connection wire is electrically connected to the main body, and the other end is used to electrically connect to the controller. When the ambient temperature is lower than or equal to the preset temperature threshold, the controller is used to control the main body to heat up through the electrical connection wire.

10. Electronic device according to claim 9, characterized in that The connector is provided with a limiting body, which includes a first segment and a second segment. One end of the first segment is bent and connected to the second segment, and the other end is connected to the second connecting surface. There is a gap between the second segment and the second connecting surface, and part of the electrical connection wire is located between the second segment and the second connecting surface.

11. Electronic device according to claim 4 or 5, characterized in that The electronic device further includes a heat conductor connected between the packaging substrate and the middle portion of the connector, and the heat conductor is spaced apart from the first colloid.

12. Electronic device according to claim 1 or 2, characterized in that The electronic device also includes a light source, and the housing is provided with a light-transmitting channel, which is connected to the receiving slot; The functional unit includes a light-transmitting plate and a liquid crystal layer. The light-transmitting plate is stacked with the encapsulation substrate to form a receiving space. The liquid crystal layer is located in the receiving space. The light-transmitting plate is connected to the bottom wall of the receiving groove. The light source is used to emit light, which enters the housing and passes through the light-transmitting channel and the light-transmitting plate, and is reflected on the surface of the liquid crystal layer.

13. Electronic device according to claim 1 or 2, characterized in that The connector and the housing form the outer casing structure of the electronic device.

14. An electronic device, comprising: It includes a controller, a sensor, and an electronic device as described in any one of claims 1-13, wherein the controller is electrically connected to the electronic device, the controller is capable of recognizing the temperature signal from the sensor, and issuing an operating command to the heating element of the electronic device.

15. A vehicle, characterized by It includes a body and an electronic device as described in claim 14, wherein the electronic device is mounted on the body.

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