Electronic circuit unit and electronic device

Abstract

Provided is an electronic circuit unit capable of improving noise resistance performance. This electronic circuit unit includes an external connection connector, a cooling passage, a lid, and a first reduction portion, and is configured such that a circuit board is housed in a case. The cooling passage is disposed in the case, and a refrigerant flows through the cooling passage to cool heat generated by operation of an electronic component mounted on the circuit board. The lid is interposed between the cooling passage and the circuit board, and closes the cooling passage from a space in which the circuit board is disposed. The first reduction portion is formed integrally with the lid and is configured to reduce noise propagating from the external connection connector side.

Description

Electronic Circuit Unit and Electronic Device

[0001] The present invention relates to an electronic circuit unit mounted in a liquid-cooled housing and an electronic device that houses a plurality of electronic circuit units in a housing.

[0002] Patent Document 1 describes a liquid-cooled electronic module, an electronic device, and its housing that enable easy and safe attachment and detachment of a wiring board (electronic module) in an electronic device during addition or maintenance of the wiring board. Each wiring board is a rack-type housing that can be inserted and removed, and the refrigerant flow path is arranged to reciprocate inside a liquid-cooled jacket. Further, the refrigerant inlet and outlet are arranged on the backplane connector side.

[0003] Japanese Patent Application Laid-Open No. 2004-246615

[0004] By the way, in the case of in-vehicle electronic devices, a housing structure that allows individual detachment of circuit boards in the market is required in anticipation of maintenance inspections and hardware updates by automobile manufacturers. For example, in an electronic device for vehicle control assuming a driving automation level of 3 or higher, further high performance and safety design are required. Therefore, by making the housings of a plurality of electronic circuit units into a multi-stage configuration, it is possible to individually detach the electronic circuit units even after market shipment and perform hardware updates.

[0005] However, when the component and connector arrangements are changed due to hardware updates, it may have an adverse effect on the EMC (Electromagnetic Compatibility) performance and heat dissipation performance. Therefore, it is necessary to review the design of the water-cooled housing each time an update is made, and there is a problem of poor expandability.

[0006] The present invention has been made in view of the above circumstances, and an object thereof is to provide an electronic circuit unit and an electronic device capable of improving noise resistance performance.

[0007] According to one aspect of the present invention, an electronic circuit unit is provided, comprising an external connection connector and a circuit board housed in a case, the electronic circuit unit comprising: a cooling passage located within the case through which a refrigerant flows to cool the heat generated by the operation of electronic components mounted on the circuit board; a lid located between the cooling passage and the circuit board, which closes the cooling passage from the space in which the circuit board is arranged; and a first noise reduction unit integrally formed with the lid and configured to reduce noise propagated from the external connection connector side. Furthermore, an electronic device is provided in which a plurality of the above electronic circuit units are housed in a housing and the interconnection connectors of each electronic circuit unit are connected by a connecting wiring section.

[0008] By forming a first noise reduction section on the lid and providing EMC resistance, various changes associated with hardware updates can be accommodated simply by changing the lid. This improves hardware update compatibility and expandability to other models, while also suppressing cost increases by reducing the number of parts and assembly man-hours. Furthermore, by providing a first noise reduction section integrated with the lid, noise entering the case from the external connection connector side can also be suppressed. Moreover, by suppressing noise intrusion, it is possible to suppress the superposition of noise on signals transmitted and received by the electronic circuit unit. Therefore, according to the present invention, it is possible to provide an electronic circuit unit and electronic device that can improve noise resistance.

[0009] This is a perspective view showing an electronic device according to an embodiment of the present invention. This is a front view of the electronic device shown in Figure 1. This is a perspective view showing the first stage electronic circuit unit removed from the electronic device shown in Figure 1. This is a perspective view of the main body of the electronic circuit unit according to an embodiment of the present invention. This is a front view of the electronic circuit unit shown in Figure 4. This is a cross-sectional view of the electronic circuit unit shown in Figure 4 along the line VI-VI. This is an exploded perspective view of the electronic circuit unit shown in Figure 4. This is a perspective view showing the circuit board side of the water-cooled cover shown in Figure 7. This is a perspective view showing the cooling passage side of the water-cooled cover shown in Figure 7. This is a perspective view showing the water-cooled housing and water-cooled cover joined together to form a cooling passage as shown in Figure 7. This is a plan view showing the water-cooled housing and water-cooled cover joined together to form a cooling passage as shown in Figure 7.

[0010] Embodiments of the present invention will now be described with reference to the drawings. Figures 1 to 3 each show an electronic device according to an embodiment of the present invention. Figure 1 is a perspective view, Figure 2 is a front view, and Figure 3 is a perspective view showing the first stage electronic circuit unit removed. This electronic device 10 houses a plurality of electronic circuit units in a rack enclosure (housing enclosure).

[0011] Here, as shown in Figures 1 and 2, an example is shown in which water-cooled electronic circuit units 11-1 to 11-6 are stacked vertically and housed in a rack enclosure 12. Figure 3 shows the state in which the first electronic circuit unit 11-1 has been removed from the rack enclosure 12 in the direction of arrow AA. This electronic circuit unit 11-1 is inserted into the opening (insertion port) 12a of the rack enclosure 12 in the direction of arrow AB. The other electronic circuit units 11-2 to 11-6 are also configured to be individually insertable and removable from the opening 12a of the rack enclosure 12, similar to electronic circuit unit 11-1.

[0012] The mounting portions 11-1a to 11-6a at one end of each electronic circuit unit 11-1 to 11-6 are fixed to a mounting plate 12b protruding from one side of the opening 12a of the rack housing 12 using fastening components, such as bolts and nuts (not shown). Similarly, the mounting portions 11-1b to 11-6b at the other end of each electronic circuit unit 11-1 to 11-6 are fixed to a mounting plate 12c protruding from the other side of the opening 12a of the rack housing 12 using fastening components, such as bolts and nuts (not shown). Screw holes 2, 2, 2, ... are formed on both sides of the mounting plates 12b and 12c, respectively, for use when mounting on a vehicle.

[0013] On the side of the rack enclosure 12 facing the opening 12a in each electronic circuit unit 11-1 to 11-6, external connection connectors 13-1 to 13-6, cooling ports 15-1 to 15-6, cooling ports 16-1 to 16-6, and handles 17-1 to 17-6, 18-1 to 18-6 are arranged. In this example, cooling ports 15-1, 16-2, 15-3, 16-4, 15-5, and 16-6 are the refrigerant introduction side, and cooling ports 16-1, 15-2, 16-3, 15-4, 16-5, and 15-6 are the refrigerant discharge side.

[0014] Specifically, the cooling port 16-1 of electronic circuit unit 11-1 and the cooling port 16-2 of electronic circuit unit 11-2 are connected by a piping connector 20-1. The cooling port 15-2 of electronic circuit unit 11-2 and the cooling port 15-3 of electronic circuit unit 11-3 are connected by a piping connector 20-2. The cooling port 16-3 of electronic circuit unit 11-3 and the cooling port 16-4 of electronic circuit unit 11-4 are connected by a piping connector 20-3. Similarly, electronic circuit units 11-4 to 11-6 are also connected by piping connectors 20-4 and 20-5.

[0015] In other words, the cooling ports 15-2 to 15-5 and cooling ports 16-1 to 16-6 of adjacent stacked electronic circuit units 11-1 to 11-6, such as 11-1 and 11-2, 11-2 and 11-3, 11-3 and 11-4, 11-4 and 11-5, and 11-5 and 11-6, are connected by piping connectors 20-1 to 20-5, respectively, forming a cooling passage through which a refrigerant (cooling water) that cools the heat generated by the operation of the electronic components can be circulated.

[0016] On the other hand, backplane board connectors (interconnection connectors) 14-1 to 14-6 are provided on the rear side of the electronic circuit units 11-1 to 11-6 in the insertion direction. Figure 1 shows a typical backplane board connector 14-6, but each of the electronic circuit units 11-1 to 11-5 is similarly provided with backplane board connectors 14-1 to 14-5. The backplane board connectors 14-1 to 14-6 electrically connect each of the electronic circuit units 11-1 to 11-6 to each other, enabling communication and / or transmission and reception of signals.

[0017] On the inside of the rear of the rack enclosure 12, a backplane board (BP-PCB) 14 is arranged to electrically connect the stacked electronic circuit units 11-1 to 11-6 via backplane board connectors 14-1 to 14-6. When the electronic circuit units 11-1 to 11-6 are individually inserted through the opening 12a of the rack enclosure 12, they slide in and are electrically connected to the backplane board 14 by the backplane board connectors 14-1 to 14-6.

[0018] In this way, the electronic circuit units 11-1 to 11-6 can be electrically connected to the backplane board 14 by individually inserting them from the opening 12a side of the rack enclosure 12 and pushing them inwards. Alternatively, the electronic circuit units 11-1 to 11-6 can be electrically isolated from the backplane board 14 by individually pulling them out.

[0019] Figure 4 shows an electronic circuit unit according to an embodiment of the present invention, with the mounting portion and handle omitted, and shows the main body of the electronic circuit unit 11-n (n=1 to 6) housed in the rack enclosure 12. Figure 5 is a front view of the electronic circuit unit 11-n, Figure 6 is a cross-sectional view of the electronic circuit unit 11-n shown in Figure 4 along the line VI-VI, and Figure 7 is an exploded perspective view of the electronic circuit unit 11-n. As shown in Figures 4 and 5, the electronic circuit unit 11-n has a thin rectangular parallelepiped shape and is designed to match the number and size of connectors for standardization. On the front of the electronic circuit unit 11-n, there is an external connection connector portion 13-n and cooling ports 15-n and 16-n on the introduction and exhaust sides.

[0020] The external connection connector section 13-n is equipped with various connectors (external connection connectors) 13a to 13f for electrically connecting to or communicating with electrical components mounted on the vehicle, such as other electronic circuit units, actuators, sensors, etc. Connectors with harnesses are connected to these connectors 13a to 13f. The cooling ports 15-n and 16-n are symmetrically arranged on both sides of the external connection connector section 13-n (external connection connectors 13a to 13f). A partition section 21 is provided to narrow the gap between the openings of the external connection connectors 13a to 13f and the main body.

[0021] As shown in Figures 6 and 7, the electronic circuit unit 11-n consists of a water-cooled enclosure (case) 11a, a water-cooled lid (lid portion) 11b, a circuit board (PCB) 11c, and a cover 11d. The water-cooled enclosure 11a and the water-cooled lid 11b form a cooling passage 27 through which a coolant circulates to cool the heat generated by the operation of the electronic components mounted on the circuit board 11c. The water-cooled lid 11b is made of a metal material (copper, iron, stainless steel, aluminum, silver, etc.). This water-cooled lid 11b has a first reduction portion 11b1 and a second reduction portion 11b2. The first reduction portion 11b1 and the second reduction portion 11b2 are integrally formed with the water-cooled lid 11b.

[0022] The first noise reduction section 11b1 is located in the space where the openings of the external connection connectors 13a to 13f are arranged, and is configured to reduce noise propagated from the external connection connectors 13a to 13f into the interior of the water-cooled housing 11a. In this example, the first noise reduction section 11b1 is a partition section 21 that narrows the gap between the openings of the external connection connectors 13a to 13f and the water-cooled housing (case) 11a. The second noise reduction section 11b2 is formed on the cooling passage 27 side of the water-cooled lid 11b at a position where the water-cooled lid 11b and electronic components face each other, and is configured to reduce the thermal characteristics of the circuit board 11c. In this example, the second noise reduction section 11b2 is a heat dissipation section 28 in which a number of heat dissipation pins 28-1, 28-2, 28-3, ... are erected facing into the cooling passage 27.

[0023] The circuit board 11c is mounted with heat-generating electronic components 24-1, 24-2, 24-3, ... such as a CPU and GPU. The electronic components 24-1, 24-2, 24-3, ... are connected to heat dissipation bases 31-1, 31-2, 31-3, ... via heat conductive members 30-1, 30-2, 30-3, ... respectively. The cross-sectional view in Figure 6 shows the state in which electronic component 24-2 mounted on the lower surface of the circuit board 11c is thermally connected to the heat dissipation base 31-2 via the heat conductive member 30-2. Heat dissipation sections 28 are positioned at locations corresponding to the electronic components 24-1, 24-2, 24-3, ...

[0024] These electronic components 24-1, 24-2, 24-3, ... are cooled by a coolant flowing through the cooling passage 27 via the heat dissipation bases 31-1, 31-2, 31-3, .... The water-cooled cover 11b is located between the cooling passage 27 and the circuit board 11c, blocking the cooling passage 27 from the space 33 where the circuit board 11c is located. The circuit board 11c of the electronic circuit unit 11 is electrically connected to the backplane board 14 via the backplane board connector 14-n.

[0025] Figure 8 is a perspective view showing the circuit board side (top surface) of the water cooling lid 11b shown in Figure 7, and Figure 9 is a perspective view showing the cooling passage side (bottom surface) of the water cooling lid 11b shown in Figure 7. A partition portion 21 is formed on the front surface of the water cooling housing 11a to narrow the gap between the openings of the external connection connectors 13a to 13f and the water cooling housing 11a. Notches 19a to 19f are provided in the partition portion 21 for fixing the insulators of the external connection connectors 13a to 13f, forming connector openings. Inside the notches 19a to 19f is an opening space 32, and a lid portion 22 that closes the cooling passage 27 is provided following the opening space 32.

[0026] A heat dissipation section 28 is formed on the surface of the lid 22 facing the cooling passage 27 to dissipate the heat transferred to the lid 22. The heat dissipation section 28 has a shape in which a part of the surface of the lid 22 exposed into the cooling passage 27 protrudes in the direction of the refrigerant, such as a fin shape, cylindrical shape, or base shape. Figure 9 shows a heat dissipation structure in which a number of heat dissipation pins 28-1, 28-2, 28-3, ... are erected. By molding the heat dissipation pins 28-1, 28-2, 28-3, ... on the lid 22 side, cooling performance can be guaranteed while only the design of the lid 22 needs to be changed, thus providing expandability.

[0027] The connector opening is formed by turning the tip of the lid portion 22 inward to create a partition plate, and forming notches 19a to 19f for fixing the insulators of the external connection connectors 13a to 13f. This connector opening allows the lid portion 22 of the water cooling housing 11a and the water cooling lid 11b to be aligned. This prevents the circuit board 11c from becoming loose due to misalignment and ensures a proper heat dissipation path. Moreover, by covering the connector opening with the partition plate, noise immunity is improved, resulting in a structure that can handle high-speed communication. Because the cooling passage 27 is covered by the lid portion 22, the connector can be changed simply by modifying the design of the lid portion 22.

[0028] Since the height of the insulator differs depending on the connector, the connector opening on the lid 22 side is designed to match the connector. That is, the notches 19a to 19f for fixing the insulators of the external connection connectors 13a to 13f are made to the size (width and height) of each connector to which they are connected. In this case, it is best to design the notches to allow for tolerance insertion so that the connectors do not interfere with each other.

[0029] In this way, by extending and bending the lid portion 22 to form a partition plate, it is possible to improve expandability, reduce the number of parts and assembly man-hours, and suppress cost increases. By providing a partition wall formed by extending the lid portion 22, it is possible to suppress noise entering the water-cooled housing 11a from the external connection connectors 13a to 13f. By suppressing this noise intrusion, it is possible to suppress the superposition of noise on signals (high-speed communication, etc.) transmitted and received by the electronic circuit unit 11-n.

[0030] Furthermore, by providing a partition 21 integrated with the lid 22, noise entering the water-cooled housing 11a from the external connection connectors 13a to 13f can be suppressed, improving EMC resistance. The heat dissipation structure (heat dissipation pins 28-1, 28-2, 28-3, ...) integrated with the lid 22 can cool the heat generated by the electronic circuit unit 11-n. By providing a noise reduction structure and a heat dissipation structure on the lid 22, and simplifying and standardizing the structure of the water-cooled housing 11a, expandability that allows for hardware updates and deployment to other vehicle models can be achieved.

[0031] As shown in Figure 10, the water-cooled cover 11b with the above configuration is fixed to the water-cooled housing 11a so that the heat dissipation section 28 is positioned within the cooling passage 27 of the water-cooled housing 11a. Then, the circuit board 11c and cover 11d are fixed to the water-cooled housing 11a. The circuit board 11c and cover 11d are fixed to the mounting bases 29a to 29f of the water-cooled housing 11a with screws or bolts. At this time, since the circuit board 11c is fixed to the water-cooled housing 11a, the positions of the connector and the cover can be aligned by aligning it with the water-cooled housing 11a.

[0032] Then, as shown in Figure 11, when the cooling water, which is the refrigerant, is introduced into the water-cooled housing 11a from the cooling port 15 on the introduction side, as indicated by the arrow, it spreads inside the cooling passage 27. Numerous heat dissipation pins 28-1, 28-2, 28-3, ... are erected at the mounting positions of the electronic components 24-1, 24-2, 24-3, ... on the circuit board 11c in the cooling passage 27. The heat generated from the electronic components 24-1, 24-2, 24-3, ... is absorbed by the heat dissipation pins 28-1, 28-2, 28-3, ... and dissipated into the cooling water. The cooling water absorbs heat as it passes through the cooling passage 27 and is discharged from the cooling port 16 on the discharge side.

[0033] With the above configuration, a partition wall is formed by extending the lid portion 22 of the water-cooling lid 11b, which improves expandability and reduces the number of parts and assembly man-hours, thereby suppressing cost increases. By extending the lid portion 22 and providing a partition wall, noise entering the case 11a from the external connection connectors 13a to 13f can be suppressed. This noise intrusion suppression prevents noise from being superimposed on signals (high-speed communication, etc.) transmitted and received by the electronic circuit unit.

[0034] Furthermore, by simplifying and standardizing the structure of the electronic circuit unit, and by addressing heat dissipation and noise immunity simply by changing the design of the water cooling cover, it becomes possible to accommodate hardware updates while maintaining EMC immunity and heat dissipation performance, and to deploy the product to different vehicle models. Therefore, it is possible to provide electronic circuit units and electronic devices that can improve noise immunity.

[0035] As described above, the electronic circuit unit and electronic device of the present invention provide the following effects (1) to (10). (1) By providing a first noise reduction section 11b1 integrated with the lid 22, noise entering the case 11a from the external connection connectors 13a to 13f can be suppressed. By suppressing the intrusion of noise, it is possible to suppress the superposition of noise on signals transmitted and received by the electronic circuit unit, such as high-speed communication.

[0036] (2) By forming a partition wall with an extended lid portion 22, the number of parts can be reduced, the number of assembly steps can be reduced, and costs can be suppressed.

[0037] (3) By providing the lid portion 22 with a first reduction portion 11b1 and a second reduction portion 11b2, noise immunity can be improved while efficiently cooling the heat generated by the operation of the electronic circuit unit of the electronic components 24-1, 24-2, 24-3, ... with a coolant. Furthermore, the above two effects can be achieved with the lid portion 22, which can suppress the increase in cost of the electronic circuit unit by reducing the number of components and reduce the complexity of the structure.

[0038] (4) By making the heat dissipation section 28 such that a part of the surface exposed in the cooling passage 27 of the lid 22 protrudes in the direction of the refrigerant, the heat dissipation section and the cooling section can be integrated. Furthermore, by changing the lid 22 in response to changes in the circuit board 11c or the position of the elements, the arrangement of the heat dissipation section 28 can be changed, thereby suppressing changes to the case side such as the cooling passage and suppressing the increase in cost associated with changes in the size and position of the elements.

[0039] (5) Since the interconnection connectors 14-1 to 14-6 are located on the back surface of the external connection connectors 13-1 to 13-6 relative to their mounting surface, the external connection connectors are less susceptible to noise generated on the external connection connector side during communication with other electronic circuit units and / or transmission and reception of signals.

[0040] (6) Since the interconnection connectors 14-1 to 14-6 are located on the back surface of the external connection connectors 13-1 to 13-6 relative to the mounting surface, the interconnection connectors 14-1 to 14-6 can be electrically connected to other electronic circuit units via the backplane board 14 while the electronic circuit unit is housed in the housing 12.

[0041] (7) By closing the connector opening with the partition portion 21 which is integrated with the lid portion 22, the partition portion 21 can shield against external noise and suppress its intrusion into the case 11a. By suppressing the intrusion of noise, it is possible to suppress the superposition of noise on signals transmitted and received by the electronic circuit unit, such as high-speed communication. Furthermore, by extending the lid portion 22 to form the partition portion 21, it is possible to suppress cost increases by reducing the number of parts and assembly man-hours.

[0042] (8) By making the heat dissipation section 28 such that a part of the surface exposed in the cooling passage 27 of the lid 22 protrudes in the direction of the refrigerant, the heat dissipation section 28 and the cooling section can be integrated, and when the circuit board 11c is changed or the position of the elements is changed, the arrangement of the heat dissipation section 28 can be changed by changing the design of the lid 22, thereby suppressing changes on the case 11a side such as the cooling passage 27 and suppressing the increase in cost associated with changes in the size and position of the elements.

[0043] (9) Since the interconnection connectors 14-1 to 14-6 are located on the back surface of the external connection connectors 13-1 to 13-6 relative to their mounting surface, the external connection connectors are less susceptible to noise generated on the external connection connector side during communication with other electronic circuit units and / or transmission and reception of signals.

[0044] Since the interconnection connectors 14-1 to 14-6 are arranged on the back side with respect to the installation surface of the external connection connector portions 13-1 to 13-6, in a state where the electronic circuit unit is housed in the housing 12, the interconnection connectors 14-1 to 14-6 can be electrically connected to other electronic circuit units via the backplane board 14.

[0045] Note that the configurations, control methods, etc. described in the above-described embodiments are only schematically shown to the extent that the present invention can be understood and implemented. Therefore, the present invention is not limited to the described embodiments, and can be changed into various forms without departing from the scope of the technical idea shown in the claims.

[0046] For example, in the above-described embodiment, an electronic device in which electronic circuit units are stacked in six layers has been described as an example, but it is not limited to this number of layers. Also, although the case of stacking in the vertical direction has been described, the present invention can be similarly applied to a configuration in which they are arranged in the horizontal direction or a plurality of them are arranged in the vertical and horizontal directions, respectively.

[0047] Further, although the case where a water-cooled housing is used for the electronic circuit unit has been described, it is of course possible to use a liquid-cooled housing that uses a coolant other than water as the refrigerant.

[0048] Also, although the case where the heat radiating portion is pin-shaped has been described as an example, any other various shapes can be applied as long as a part of the surface exposed in the cooling passage in the lid portion 22 protrudes in the direction of the refrigerant to increase the surface area.

[0049] 10...Electronic device, 11-1 to 11-6...Electronic circuit unit, 11a...Water-cooled enclosure (case), 11b...Water-cooled cover, 11c...Circuit board, 11d...Cover, 12...Rack enclosure (enclosure), 13-1 to 13-6...External connection connector section, 13a to 13f...External connection connector, 14...Backplane board, 14-1 to 14-6...Backplane board connector (interconnection connector), 19 a-19f... Notches, 20-1-20-5... Piping connectors, 21... Partition, 22... Cover, 24-1, 24-2, 24-3... Electronic components, 27... Cooling passage, 28... Heat dissipation section, 28-1, 28-2, 28-3... Heat dissipation pins, 29a-29f... Mounting base, 30-1, 30-2, 30-3... Heat conductive members, 31-1, 31-2, 31-3... Heat dissipation base, 32... Opening space, 33... Space for arranging circuit boards

Claims

1. An electronic circuit unit comprising an external connector and a circuit board housed in a case, the electronic circuit unit comprising: a cooling passage located within the case through which a refrigerant flows to cool the heat generated by the operation of electronic components mounted on the circuit board; a lid located between the cooling passage and the circuit board, which closes the cooling passage from the space in which the circuit board is arranged; and a first noise reduction unit integrally formed with the lid and configured to reduce noise propagated from the external connector side.

2. An electronic circuit unit according to claim 1, wherein the first reduction portion is located in the arrangement space where the opening of the external connection connector is arranged, is formed integrally with the lid portion, and is a partition portion that narrows the gap between the opening of the external connection connector and the case.

3. An electronic circuit unit according to claim 1, further comprising a second reduction portion formed integrally with the lid portion and configured to reduce the thermal characteristics of the circuit board.

4. An electronic circuit unit according to claim 3, wherein the second reduction portion is a heat dissipation portion formed on the cooling passage side of the lid at a position where the lid and the electronic component face each other, and which dissipates heat transferred to the lid, and the heat dissipation portion has a shape in which a part of the surface of the lid that is exposed into the cooling passage protrudes in the direction of the refrigerant.

5. An electronic device comprising an electronic circuit unit according to claim 1, further comprising an interconnection connector located on the back surface of the external connection connector with respect to the mounting surface, wherein the interconnection connector is electrically connected to another electronic circuit unit and communication and / or transmission and reception of signals are performed.

6. An electronic device according to claim 5, further comprising a housing capable of housing a plurality of the electronic circuit units, and a connecting wiring portion coupled to the interconnection connector of each of the electronic circuit units, wherein the plurality of electronic circuit units are electrically connected to each other by electrically connecting the interconnection connector of each of the electronic circuit units and the connecting wiring portion when the electronic circuit units are housed in the housing.

7. An electronic circuit unit comprising an external connector and a circuit board housed in a case, the electronic circuit unit comprising: a cooling passage through which a refrigerant flows, positioned in the case opposite to the circuit board; a lid portion positioned between the cooling passage and the circuit board, which closes the cooling passage from the space in which the circuit board is arranged; and a partition portion integrally formed extending from the lid portion in the direction in which the external connector is arranged, which narrows the gap between the opening of the external connector and the case.

8. An electronic circuit unit according to claim 7, wherein the lid is further provided with a heat dissipation portion formed on the cooling passage side of the lid at a position facing the electronic component, which dissipates heat transferred to the lid, and the heat dissipation portion is shaped such that a part of the surface of the lid exposed into the cooling passage protrudes in the direction of the refrigerant.

9. An electronic device comprising an electronic circuit unit according to claim 7, further comprising an interconnection connector located on the back surface of the external connection connector with respect to the mounting surface, wherein it is electrically connected to other electronic circuit units via the interconnection connector, and communication and / or transmission and reception of signals are performed.

10. An electronic device according to claim 9, further comprising a housing capable of housing a plurality of the electronic circuit units, and a connecting wiring section coupled to the interconnection connector of each of the electronic circuit units, wherein the plurality of electronic circuit units are electrically connected to each other by electrically connecting the interconnection connector of each of the electronic circuit units and the connecting wiring section when the electronic circuit units are housed in the housing.

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