Substrate processing system, substrate processing method, and program

Abstract

A substrate processing system according to one aspect of the present disclosure comprises a batch processing unit that collectively processes a lot including a plurality of substrates according to a batch recipe, a single-wafer processing unit that processes the substrates in the lot one by one according to a single-wafer recipe, an interface unit that transfers the substrates from the batch processing unit to the single-wafer processing unit, and a control circuit, wherein the control circuit: sets the single-wafer recipe for each of the substrates in the lot; transfers the substrates in the lot that have been processed by the batch processing unit to the single-wafer processing unit; and processes the substrates according to the single-wafer recipe set for each of the substrates.

Description

Substrate Processing System, Substrate Processing Method, and Program

[0001] The present disclosure relates to a substrate processing system, a substrate processing method, and a program.

[0002] A substrate processing system including a batch processing unit and a single wafer processing unit is known. The batch processing unit performs batch processing for collectively processing a lot including a plurality of substrates. The single wafer processing unit performs single wafer processing for processing each substrate one by one.

[0003] Japanese Patent Application Laid-Open No. 2023-155280, Japanese Patent Application Laid-Open No. 2022-178486

[0004] The present disclosure provides a technique capable of executing different single wafer processes on substrates within the same lot in a substrate processing system that continuously performs batch processing and single wafer processing on a substrate.

[0005] A substrate processing system according to an aspect of the present disclosure includes a batch processing unit that collectively processes a lot including a plurality of substrates according to a batch recipe, a single wafer processing unit that processes each of the substrates in the lot one by one according to a single wafer recipe, an interface unit that conveys the substrates from the batch processing unit to the single wafer processing unit, and a control circuit. The control circuit executes setting the single wafer recipe for each of the substrates in the lot, conveying the substrates in the lot processed by the batch processing unit to the single wafer processing unit, and processing the substrates according to the single wafer recipe set for each substrate.

[0006] According to the present disclosure, different single wafer processes can be executed on substrates within the same lot in a substrate processing system that continuously performs batch processing and single wafer processing on a substrate.

[0007] Figure 1 is a schematic plan view showing a substrate processing system according to an embodiment. Figure 2 is a diagram showing a second transfer table according to an embodiment. Figure 3 is a flowchart showing a substrate processing method according to an embodiment. Figure 4 is a diagram showing a processing recipe according to a first example. Figure 5 is a diagram showing a processing recipe according to a second example. Figure 6 is a flowchart showing a method for creating a processing recipe according to an embodiment. Figure 7 is a flowchart showing an example of the first recipe creation process. Figure 8 is a diagram showing a first example of a transport recipe created by the first recipe creation process in Figure 7. Figure 9 is a diagram showing a second example of a transport recipe created by the first recipe creation process in Figure 7. Figure 10 is a diagram showing a third example of a transport recipe created by the first recipe creation process in Figure 7. Figure 11 is a flowchart showing another example of the first recipe creation process. Figure 12 is a diagram showing a first example of a transport recipe created by the first recipe creation process in Figure 11. Figure 13 is a diagram showing a second example of a transport recipe created by the first recipe creation process in Figure 11. Figure 14 is a diagram showing a third example of a transport recipe created by the first recipe creation process in Figure 11. Figure 15 is a diagram showing a fourth example of a transport recipe created by the first recipe creation process in Figure 11. Figure 16 is a flowchart showing an example of the second recipe creation process. Figure 17 is a diagram showing a first example of a transport recipe created by the second recipe creation process in Figure 16. Figure 18 is a diagram showing a second example of a transport recipe created by the second recipe creation process in Figure 16. Figure 19 is a diagram illustrating the order in which substrates are transported from the immersion tank to the single-wafer processing unit. Figure 20 is a diagram illustrating a method for sorting substrates discharged from the single-wafer processing unit.

[0008] Hereinafter, exemplary embodiments of the present disclosure, not limited to those described herein, will be described with reference to the attached drawings. In all attached drawings, identical or corresponding members or components are denoted by the same or corresponding reference numerals, and redundant descriptions are omitted.

[0009] In the following explanation, the XYZ Cartesian coordinate system is used, but this coordinate system is defined for explanatory purposes only and is not limited to the orientation of the substrate processing system 1. The view from the XY plane is referred to as the plan view, and from any point, the positive Z-axis side may be referred to as "up," and the negative Z-axis side may be referred to as "down."

[0010] [Substrate Processing System] Referring to Figure 1, the substrate processing system 1 according to the embodiment will be described. Figure 1 is a schematic plan view showing the substrate processing system 1 according to the embodiment.

[0011] As shown in Figure 1, the substrate processing system 1 comprises an input / output unit 2, a first interface unit 3, a batch processing unit 4, a second interface unit 5, a single-wafer processing unit 6, and a control circuit 9.

[0012] The loading / unloading section 2 serves as both the loading and unloading section. This allows the substrate processing system 1 to be miniaturized. The loading / unloading section 2 includes a load port 21, a stocker 22, a loader 23, and a cassette transport device 24.

[0013] The load port 21 is located on the negative X-axis side of the loading / unloading section 2. Multiple load ports 21 (for example, four) are arranged along the Y-axis. The number of load ports 21 is not particularly limited. Cassettes C are placed on the load ports 21. Cassette C contains multiple (for example, 25) substrates W. Cassette C is loaded into and out of the load port 21. Inside the cassette C, the substrates W are held horizontally and along the Z-axis at a second pitch P2 (P2 = N × P1) which is N times the first pitch P1. N is a natural number of 2 or more, and in this embodiment it is 2, but it may be 3 or more.

[0014] Multiple (for example, four) stockers 22 are arranged along the Y-axis at the center of the X-axis of the loading / unloading section 2. Multiple (for example, two) stockers 22 are arranged along the Y-axis adjacent to the first interface section 3 on the positive X-axis side of the loading / unloading section 2. Stockers 22 may be arranged in multiple stages along the Z-axis. Stockers 22 temporarily store cassettes C containing substrates W before cleaning, and cassettes C that have become empty after the substrates W have been removed. The number of stockers 22 is not particularly limited.

[0015] The loader 23 is adjacent to the first interface section 3. The loader 23 is positioned on the positive X-axis side of the loading / unloading section 2. The cassette C is placed on the loader 23. The loader 23 is provided with a lid opening / closing mechanism (not shown) for opening and closing the lid of the cassette C. Multiple loaders 23 may be provided. The loaders 23 may be arranged in multiple stages along the Z-axis.

[0016] The cassette transport device 24 transports the cassette C between the load port 21, the stocker 22, and the loader 23. The cassette transport device 24 is, for example, a multi-joint transport robot.

[0017] The first interface unit 3 is positioned on the positive X-axis side of the loading / unloading unit 2. The first interface unit 3 transports the substrate W between the loading / unloading unit 2, the batch processing unit 4, and the single-wafer processing unit 6. The first interface unit 3 includes a substrate transfer device 31, a lot formation unit 32, and a first transfer table 33.

[0018] The substrate transfer device 31 transports the substrate W between the cassette C placed on the loader 23, the lot forming unit 32, and the first transfer table 33. The substrate transfer device 31 consists of a multi-axis (e.g., 6-axis) arm robot, and has a substrate holding arm 31a at its tip. The substrate holding arm 31a has a plurality of holding claws (not shown) capable of holding a plurality of substrates W (e.g., 25). The substrate holding arm 31a can assume any position and orientation in three-dimensional space while holding the substrate W with its holding claws.

[0019] The lot formation unit 32 is positioned on the positive X-axis side of the first interface unit 3. The lot formation unit 32 holds multiple substrates W at a first pitch P1 (P1 = P2 / N) to form a lot L.

[0020] The first transfer table 33 is adjacent to the single-wafer processing unit 6. The first transfer table 33 is positioned on the positive Y-axis side of the first interface unit 3. The first transfer table 33 receives the substrates W from the fourth transport device 61 and temporarily stores them until they are handed over to the loading / unloading unit 2. The first transfer table 33 may include a plurality of transfer areas (for example, the first transfer area 33a and the second transfer area 33b shown in Figure 20). The plurality of transfer areas are arranged in a vertical direction. Each transfer area, for example, holds a plurality of substrates W along the Z-axis at a second pitch P2 and holds each of the plurality of substrates W horizontally.

[0021] The batch processing unit 4 is located on the positive X-axis side of the first interface unit 3. The loading / unloading unit 2, the first interface unit 3, and the batch processing unit 4 are arranged in this order, from the negative X-axis side to the positive X-axis side. The batch processing unit 4 processes a lot L containing multiple substrates W (for example, 50 or 100) at a first pitch P1 all at once. One lot L consists of, for example, M cassettes C with substrates W. M is a natural number greater than or equal to 2. M may be the same natural number as N, or a different natural number from N. The batch processing unit 4 includes a chemical tank 41, a rinse tank 42, a first transport device 43, a processing tool 44, and a drive device 45.

[0022] The chemical solution tank 41 and the rinse solution tank 42 are arranged along the X-axis. For example, the chemical solution tank 41 and the rinse solution tank 42 are arranged in this order from the positive side of the X-axis to the negative side of the X-axis. The chemical solution tank 41 and the rinse solution tank 42 are collectively referred to as the treatment tank. The number of chemical solution tanks 41 and rinse solution tanks 42 is not limited to that shown in Figure 1. For example, although there is one set of chemical solution tank 41 and rinse solution tank 42 in Figure 1, there may be multiple sets.

[0023] The chemical tank 41 stores the chemical solution into which the lot L is immersed. The chemical solution is, for example, an aqueous phosphoric acid solution (H ３ PO ４The phosphoric acid aqueous solution selectively etches and removes the silicon nitride film from the silicon oxide film. The chemical solution is not limited to phosphoric acid aqueous solution. The chemical solution may also be DHF (dilute hydrofluoric acid), BHF (mixture of hydrofluoric acid and ammonium fluoride), dilute sulfuric acid, SPM (mixture of sulfuric acid, hydrogen peroxide and water), SC1 (mixture of ammonia, hydrogen peroxide and water), SC2 (mixture of hydrochloric acid, hydrogen peroxide and water), TMAH (mixture of tetramethylammonium hydroxide and water), plating solution, etc. The chemical solution may be for stripping treatment or plating treatment. The number of chemical solutions is not particularly limited and may be multiple.

[0024] The rinsing solution tank 42 stores the first rinsing solution into which the lot L is immersed. The first rinsing solution is pure water that removes the chemical solution from the substrate W, for example, DIW (deionized water).

[0025] The first transport device 43 includes a guide rail 43a and a first transport arm 43b. The guide rail 43a is positioned on the negative side of the Y-axis relative to the processing tank. The guide rail 43a extends along the X-axis from the first interface unit 3 to the batch processing unit 4. The first transport arm 43b moves along the guide rail 43a. The first transport arm 43b may move along the Z-axis or rotate around the Z-axis. The first transport arm 43b transports a lot L in a single batch between the first interface unit 3 and the batch processing unit 4.

[0026] The processing device 44 receives and holds the lot L from the first transport arm 43b. The processing device 44 holds the multiple substrates W along the Y axis at a first pitch P1, and holds each of the multiple substrates W vertically.

[0027] The drive unit 45 moves the processing tool 44 along the X and Z axes. The processing tool 44 immerses the lot L in the chemical solution stored in the chemical solution tank 41, then immerses the lot L in the first rinse solution stored in the rinse solution tank 42, and then passes the lot L to the first conveying device 43.

[0028] In this embodiment, there is one unit for the processing tool 44 and the drive unit 45, but there may be multiple units. In the latter case, one unit immerses the rod L in the chemical solution stored in the chemical solution tank 41, and another unit immerses the rod L in the first rinse solution stored in the rinse solution tank 42. In this case, the drive unit 45 only needs to move the processing tool 44 along the Z-axis, and does not need to move the processing tool 44 along the X-axis.

[0029] The second interface unit 5 is positioned on the positive Y-axis side of the batch processing unit 4. The second interface unit 5 transports the substrate W between the batch processing unit 4 and the single-wafer processing unit 6. The second interface unit 5 includes an immersion tank 51, a second transport device 52, a third transport device 53, and a second transfer table 54.

[0030] The immersion tank 51 is positioned outside the movement range of the first transport arm 43b. For example, the immersion tank 51 is positioned offset to the positive Y-axis relative to the processing tank. The immersion tank 51 stores the second rinse liquid into which the lot L is immersed. The second rinse liquid is, for example, DIW (deionized water). The substrate W is held in the second rinse liquid until it is lifted out of the second rinse liquid by the third transport device 53. Since the substrate W is below the liquid surface of the second rinse liquid, the surface tension of the second rinse liquid does not act on the substrate W, preventing the collapse of the uneven pattern on the substrate W.

[0031] The second transport device 52 includes a Y-axis drive device 52a, a Z-axis drive device 52b, and a second transport arm 52c.

[0032] The Y-axis drive unit 52a is positioned on the positive X-axis side of the second interface unit 5. The Y-axis drive unit 52a extends along the Y-axis from the second interface unit 5 to the batch processing unit 4. The Y-axis drive unit 52a moves the Z-axis drive unit 52b and the second transport arm 52c along the Y-axis. The Y-axis drive unit 52a may include a ball screw.

[0033] The Z-axis drive unit 52b is movably mounted on the Y-axis drive unit 52a. The Z-axis drive unit 52b moves the second transport arm 52c along the Z-axis. The Z-axis drive unit 52b may include a ball screw.

[0034] The second transport arm 52c is movably mounted to the Z-axis drive unit 52b. The second transport arm 52c receives and holds the lot L from the first transport arm 43b. The second transport arm 52c holds multiple substrates W along the Y-axis at a first pitch P1, and holds each of the multiple substrates W vertically. The second transport arm 52c moves along the Y-axis and Z-axis by the Y-axis drive unit 52a and the Z-axis drive unit 52b. The second transport arm 52c is configured to be movable to multiple positions, including a handover position, an immersion position, and a standby position.

[0035] The transfer position is the position where the lot L is transferred between the first transport arm 43b and the second transport arm 52c. The transfer position is on the negative side of the Y axis and the positive side of the Z axis.

[0036] The immersion position is the position in which the rod L is immersed in the immersion tank 51. The immersion position is located on the positive side of the Y-axis and the negative side of the Z-axis compared to the handover position.

[0037] The standby position is the position where the second transport arm 52c waits when the lot L is not being transferred or when the lot L is not being immersed in the immersion tank 51. The standby position is directly below the transfer position (negative Z-axis side) and does not obstruct the movement of the first transport arm 43b. In this case, the second transport arm 52c can move to the transfer position by moving only upward (positive Z-axis side), thus improving throughput. The standby position may also be the same position as the immersion position. In this case, it is possible to prevent particles that may be generated as a result of the operation of the first transport device 43 from adhering to the second transport arm 52c. The standby position may also be directly above the immersion position (positive Z-axis side). In this way, by setting the standby position to a position different from the transfer position, contact between the first transport arm 43b and the second transport arm 52c can be prevented.

[0038] The second conveying device 52 moves the second conveying arm 52c to an immersion position or standby position while the first conveying device 43 is operating. This prevents contact between the first conveying arm 43b and the second conveying arm 52c.

[0039] The third transport device 53 consists of a multi-axis (e.g., 6-axis) arm robot and has a third transport arm 53a at its tip. The third transport arm 53a has a holding claw (not shown) capable of holding one substrate W. The third transport arm 53a can take any position and orientation in three-dimensional space while holding the substrate W with the holding claw. The third transport device 53 transports the substrate W between the second transport arm 52c, which is in the immersion position, and the second transfer table 54. At this time, since the immersion tank 51 is located outside the movement range of the first transport arm 43b, the first transport arm 43b and the third transport arm 53a do not interfere with each other. As a result, one of the first transport device 43 and the third transport device 53 can be operated independently of the operating state of the other. Therefore, the first transport device 43 and the third transport device 53 can be operated at any timing, so the time required to transport the substrate W can be shortened. As a result, the productivity of the substrate processing system 1 is improved.

[0040] The second transfer table 54 is adjacent to the single-wafer processing unit 6. The second transfer table 54 is located on the negative X-axis side of the second interface unit 5. The second transfer table 54 receives the substrate W from the third transport device 53 and temporarily stores it until it is handed over to the single-wafer processing unit 6. The substrate W removed from the immersion tank 51 is placed on the second transfer table 54. It is preferable that the substrate W placed on the second transfer table 54 has its surface wet with the second rinsing liquid. In this case, the surface tension of the second rinsing liquid does not act on the substrate W, and the collapse of the uneven pattern on the substrate W can be suppressed. There may be one or more second transfer tables 54. Details of the second transfer table 54 will be described later.

[0041] The single-wafer processing unit 6 is located on the negative X-axis side of the second interface unit 5. The single-wafer processing unit 6 is located on the positive Y-axis side of the loading / unloading unit 2, the first interface unit 3, and the batch processing unit 4. The single-wafer processing unit 6 processes the substrates W one by one. The single-wafer processing unit 6 includes a fourth transport device 61, a liquid processing device 62, and a drying device 63.

[0042] The fourth transport device 61 includes a guide rail 61a and a fourth transport arm 61b.

[0043] The guide rail 61a is arranged on the negative Y-axis side of the sheet processing unit 6. The guide rail 61a extends along the X-axis in the sheet processing unit 6.

[0044] The fourth transfer arm 61b moves along the guide rail 61a. The fourth transfer arm 61b rotates around the Z-axis. The fourth transfer arm 61b transfers the substrate W between the second delivery stage 54, the liquid processing device 62, the drying device 63, and the first delivery stage 33. The number of the fourth transfer arms 61b may be one or plural. In the latter case, the fourth transfer device 61 transfers a plurality of (for example, five) substrates W at once.

[0045] The liquid processing device 62 is arranged on the positive X-axis side and the positive Y-axis side of the sheet processing unit 6. The liquid processing device 62 is of a single-sheet type and processes the substrate W one by one with a processing liquid. The liquid processing device 62 is arranged in multiple stages (for example, three stages) along the Z-axis. Thereby, a plurality of substrates W can be processed with the processing liquid simultaneously. The processing liquid may be plural, for example, pure water such as DIW and a drying liquid having a lower surface tension than pure water. The drying liquid may be an alcohol such as IPA (isopropyl alcohol).

[0046] The drying device 63 is arranged adjacent to the liquid processing device 62 on the negative X-axis side. In this case, it can be arranged such that the end face on the positive Y-axis side of the sheet processing unit 6 is flush or substantially flush with the end face on the positive Y-axis side of the second interface portion 5. Therefore, almost no dead space occurs, and the footprint of the substrate processing system 1 can be reduced. On the other hand, if the drying device 63 is arranged adjacent to the liquid processing device 62 on the positive Y-axis side, the end face on the positive Y-axis side of the sheet processing unit 6 protrudes beyond the end face on the positive Y-axis side of the second interface portion 5, and dead space may occur. The drying device 63 is of a single-sheet type and dries the substrate W one by one with a supercritical fluid. The drying device 63 is arranged in multiple stages (for example, three stages) along the Z-axis. Thereby, a plurality of substrates W can be dried simultaneously.

[0047] Both the liquid processing device 62 and the drying device 63 do not have to be single wafer type, and the liquid processing device 62 may be single wafer type and the drying device 63 may be batch type. The drying device 63 may dry a plurality of substrates W collectively with a supercritical fluid. The number of substrates W processed collectively in the drying device 63 may be equal to or more than the number of substrates W processed collectively in the liquid processing device 62, or may be less. Devices other than the liquid processing device 62 and the drying device 63 may be arranged in the single wafer processing section 6.

[0048] The control circuit 9 is, for example, a computer. The control circuit 9 includes an arithmetic unit 91 such as a CPU (Central Processing Unit) and a storage unit 92 such as a memory. In the storage unit 92, programs for controlling various processes executed in the substrate processing system 1 are stored. The control circuit 9 controls the operation of the substrate processing system 1 by causing the arithmetic unit 91 to execute the programs stored in the storage unit 92. The programs may be stored in a storage medium (device) such as a hard disk, a compact disk, a magneto-optical disk, a memory card, a non-volatile memory, etc., and installed from the storage medium into the computer.

[0049] The control circuit 9 includes one or more electronic circuits such as a CPU, an FPGA (Field Programmable Gate Array), or an ASIC (Application Specific Integrated Circuit), and executes various control operations described in this specification by executing instruction codes stored in a memory or by being circuit-designed for special purposes.

[0050] In the substrate processing system 1, the substrate W is conveyed to each part and processed according to a processing recipe 100 described later. For example, the substrate W is conveyed in the order of the carry-in / carry-out section 2, the first interface section 3, the batch processing section 4, the second interface section 5, and the single wafer processing section 6 according to the processing recipe 100, and returns to the carry-in / carry-out section 2. In the first interface section 3, the batch processing section 4, the second interface section 5, and the single wafer processing section 6, the substrate W is processed according to the processing recipe 100, respectively.

[0051] [Second Transfer Platform] The second transfer platform 54 will be described with reference to Figure 2. Figure 2 is a diagram showing the second transfer platform 54 according to this embodiment. Figure 2(a) is a plan view, and Figure 2(b) is a cross-sectional view. Figure 2(b) corresponds to a cross-sectional view along the line IIb-IIb in Figure 2(a).

[0052] As shown in Figure 2, the second transfer table 54 has a substrate holding section 70 and a pure water supply section 80. In Figure 2(a), the pure water supply section 80 is omitted.

[0053] The substrate holder 70 has a liquid receiving section 71 and a plurality of pins 72. The liquid receiving section 71 has a bottom plate 71a and a wall section 71b. The bottom plate 71a has a disc shape. The wall section 71b is provided in an annular shape on the bottom plate 71a. The plurality of pins 72 are provided on the bottom plate 71a. In the example of Figure 2, there are three pins 72, but there may be four or more. The surface including the upper end of each pin 72 is horizontal. The upper end of each pin 72 is located above the upper end of the wall section 71b. The plurality of pins 72 support the substrate W from below above the bottom plate 71a. A first liquid film LF1, which is a liquid film of the second rinsing liquid, may be formed on the upper surface of the substrate W.

[0054] The pure water supply unit 80 includes a nozzle 81, a pure water supply line 82, and a return line 83. The pure water supply line 82 is connected to the nozzle 81. The nozzle 81 discharges pure water supplied through the pure water supply line 82. A branching point 85 is provided in the pure water supply line 82, and the return line 83 is connected to the branching point 85. Even when pure water is not being discharged from the nozzle 81, pure water flows through the portion of the pure water supply line 82 upstream of the branching point 85 and through the return line 83. The pure water supply unit 80 configured in this way supplies pure water to the upper surface of the substrate W.

[0055] [Operation of the Substrate Processing System] Referring to Figures 1 and 3, the operation of the substrate processing system 1 according to the embodiment, that is, the substrate processing method, will be described. Figure 3 is a flowchart of the substrate processing method according to the embodiment. The processing shown in Figure 3 is executed under the control of the control circuit 9.

[0056] First, cassette C, containing multiple circuit boards W, is loaded into the loading / unloading section 2 and placed on the load port 21. Inside cassette C, the circuit boards W are held horizontally and along the Z-axis at a second pitch P2 (P2 = N × P1). N is a natural number of 2 or more; in this embodiment, it is 2, but it may be 3 or more.

[0057] Next, the cassette transport device 24 transports the cassette C from the load port 21 to the loader 23. Once the cassette C is transported to the loader 23, the lid is opened by the lid opening / closing mechanism.

[0058] Next, the substrate transfer device 31 receives the substrate W contained in the cassette C (S1 in Figure 3) and transports it to the lot formation unit 32.

[0059] Next, the lot forming unit 32 holds multiple substrates W at a first pitch P1 (P1 = P2 / N) to form a lot L (S2 in Figure 3). One lot L consists of, for example, M substrates W for cassette C. Since the pitch of the substrates W narrows from the second pitch P2 to the first pitch P1, the number of substrates W processed at once can be increased.

[0060] Next, the first conveying device 43 receives the lot L from the lot forming unit 32 and conveys it to the processing device 44.

[0061] Next, the processing tool 44 descends from above the chemical solution tank 41, immersing the rod L in the chemical solution and performing treatment with the chemical solution (S3 in Figure 3). After that, the processing tool 44 rises to lift the rod L out of the chemical solution, and then moves toward the negative side of the X axis toward above the rinse solution tank 42.

[0062] Next, the processing tool 44 descends from above the rinse liquid tank 42, immerses the lot L in the first rinse liquid, and performs treatment with the rinse liquid (S3 in Figure 3). After that, the processing tool 44 rises to lift the lot L out of the first rinse liquid. Then, the first conveying device 43 receives the lot L from the processing tool 44 and hands it over to the second conveying device 52.

[0063] Next, the second transport arm 52c of the second transport device 52 moves to the positive side of the Y-axis and descends from above the immersion tank 51, immersing the lot L in the second rinsing liquid (S4 in Figure 3). The multiple substrates W of the lot L are held in the second rinsing liquid until they are pulled out of the second rinsing liquid by the third transport device 53. Since the substrates W are below the liquid surface of the second rinsing liquid, the surface tension of the second rinsing liquid does not act on the substrates W, preventing the collapse of the uneven pattern on the substrates W.

[0064] Next, the third transport device 53 transports the substrates W of the lot L, which are held by the second transport arm 52c in the second rinsing liquid, to the second transfer table 54. The third transport device 53 transports the substrates W one by one to the second transfer table 54. On the second transfer table 54, pure water is discharged onto the upper surface of the substrates W to prevent the surface from drying out and the uneven pattern from collapsing, and a second liquid film LF2, which is a liquid film of pure water, is formed.

[0065] Next, the fourth transport device 61 receives the substrate W from the second transfer table 54 and transports it to the liquid processing device 62.

[0066] Next, the liquid processing apparatus 62 processes each substrate W with liquid (S5 in Figure 3). The liquid may consist of multiple liquids, for example, pure water such as DIW and a drying liquid with a lower surface tension than pure water. The drying liquid may be an alcohol such as IPA. The liquid processing apparatus 62 supplies pure water and the drying liquid in this order to the upper surface of the substrate W, forming a liquid film of the drying liquid.

[0067] Next, the fourth transport device 61 receives the substrate W from the liquid processing device 62 and holds the substrate W horizontally with the drying liquid film facing upwards. The fourth transport device 61 then transports the substrate W from the liquid processing device 62 to the drying device 63.

[0068] Next, the drying apparatus 63 dries the substrates W one by one with supercritical fluid (S5 in Figure 3). The drying liquid can be replaced with supercritical fluid, and the collapse of the uneven pattern on the substrate W due to the surface tension of the drying liquid can be suppressed. Since the supercritical fluid requires a pressure vessel, the process is carried out on a sheet-by-sheet basis rather than in batches in order to miniaturize the pressure vessel.

[0069] In this embodiment, the drying apparatus 63 is a single-wafer type, but as described above, it may also be a batch type. The batch type drying apparatus 63 dries multiple substrates W, each with a liquid film formed on it, all at once using a supercritical fluid. While the single-wafer type drying apparatus 63 has one transport arm for holding the substrates W, the batch type drying apparatus 63 has multiple transport arms.

[0070] In this embodiment, the drying apparatus 63 dries the substrate W by supercritical drying, but the drying method is not particularly limited. Any drying method that can suppress the collapse of the uneven pattern of the substrate W is acceptable, and may be, for example, spin drying, scan drying, or water-repellent drying. In spin drying, the liquid processing apparatus 62 rotates the substrate W and removes the drying liquid from the substrate W by centrifugal force. In scan drying, the substrate W is rotated while the supply position of the drying liquid is moved from the center of the substrate W toward the outer circumference of the substrate W, and the liquid film is removed from the substrate W by centrifugal force. In scan drying, the supply position of the drying gas, such as nitrogen gas, may also be moved from the center of the substrate W toward the outer circumference of the substrate W in accordance with the supply position of the drying liquid.

[0071] Next, the fourth transport device 61 receives the substrate W from the drying device 63 and transports it to the first transfer table 33.

[0072] Next, the substrate transfer device 31 receives the substrate W from the first transfer table 33 and stores it in the cassette C (S6 in Figure 3). The cassette C, containing multiple substrates W, is then discharged from the loading / unloading section 2. This completes the process shown in Figure 3.

[0073] [Processing Recipe] (First Example) Referring to Figure 4, an example of the processing recipe 100 for the first example will be described. Figure 4 is a diagram showing the processing recipe 100 for the first example.

[0074] The processing recipe 100 includes various information that sets the content of the processing to be performed on the substrate W in the substrate processing system 1. The processing recipe 100 is set before processing is performed on the substrate W in the substrate processing system 1.

[0075] The processing recipe 100 is used, for example, when determining the processing conditions for product substrates to be processed by the batch processing unit 4. The conditions for the batch processing unit 4 are determined immediately after the batch processing unit 4 is started up, immediately after maintenance of the batch processing unit 4, etc.

[0076] The processing recipe 100 is used, for example, when determining the processing conditions for product substrates to be processed by the single-wafer processing unit 6. The conditions for the single-wafer processing unit 6 are determined immediately after the start-up of the single-wafer processing unit 6, immediately after maintenance of the single-wafer processing unit 6, etc.

[0077] The processing recipe 100 includes a batch recipe 110 and a single-wafer recipe 120.

[0078] The batch recipe 110 is a recipe for setting the processing conditions of the batch processing unit 4. The processing conditions of the batch processing unit 4 include the transport order of lot L in the batch processing unit 4, the processing conditions of the chemical tank 41, and the processing conditions of the rinse liquid tank 42. The batch recipe 110 is set for each lot L. In other words, one batch recipe 110 is set for each lot L.

[0079] The single-wafer recipe 120 is a recipe for setting the processing conditions of the single-wafer processing unit 6. The processing conditions of the single-wafer processing unit 6 include the transport order of the substrates W in the single-wafer processing unit 6, the processing conditions of the liquid processing device 62, the processing conditions of the drying device 63, and so on. Multiple single-wafer recipes 120 are set for one lot L. For example, a single-wafer recipe 120 is set for each substrate W within lot L. If there are substrates W within lot L for which the same single-wafer recipe 120 is set, the multiple substrates W for which the same single-wafer recipe 120 is set may be managed as one group, and a single-wafer recipe 120 may be set for each group.

[0080] In the example shown in Figure 4, one batch recipe 110 and two single-wafer recipes 120 (single-wafer recipe A and single-wafer recipe B) are set for one lot L. Single-wafer recipe A is set for multiple substrates W within lot L, and single-wafer recipe B is set for the remaining multiple substrates W within lot L. Single-wafer recipe A and single-wafer recipe B are recipes in which the processing conditions of the single-wafer processing unit 6 are different from each other.

[0081] According to processing recipe 100, one batch recipe 110 and multiple single-wafer recipes 120 are set for one lot L. In this case, in the substrate processing system 1 that performs batch processing and single-wafer processing on substrates W in succession, different single-wafer processing can be performed on each substrate W within the same lot L. Therefore, the processing conditions of the single-wafer processing unit 6 can be changed according to the position of the substrates W within lot L, so that single-wafer processing can be performed with processing conditions suitable for the position of the substrates W within lot L when processed by the batch processing unit 4. In addition, since the conditions for the single-wafer processing unit 6 can be determined using each substrate W within the same lot L, the number of batch processing required to determine the conditions for the single-wafer processing unit 6 can be reduced. Furthermore, if dummy substrates are included in the same lot L, single-wafer processing can be performed on the dummy substrates with different processing conditions.

[0082] (Second Example) Referring to Figure 5, the processing recipe 100A for the second example will be explained. Figure 5 is a diagram showing the processing recipe 100A for the second example.

[0083] Processing recipe 100A differs from processing recipe 100 in a configuration that includes a provisional single-flesh recipe 130. Other configurations may be the same as those of processing recipe 100. The following description will focus on the configurations that differ from processing recipe 100.

[0084] Processing recipe 100A includes batch recipe 110, single-flesh recipe 120, and provisional single-flesh recipe 130.

[0085] The provisional single-wafer recipe 130 is a recipe for setting the processing conditions of the single-wafer processing unit 6. The processing conditions of the provisional single-wafer recipe 130 include the transport order of the substrates W in the single-wafer processing unit 6, the processing conditions of the liquid processing unit 62, the processing conditions of the drying unit 63, etc. The provisional single-wafer recipe 130 is set for each lot L. In other words, one provisional single-wafer recipe 130 is set for each lot L. The provisional single-wafer recipe 130 can be replaced with multiple single-wafer recipes 120 at a predetermined timing after the processing recipe 100A has been created, by instructions from the control circuit 9, the host computer, etc. The predetermined timing may be after the lot L has been unloaded from the batch processing unit 4 and before the first substrate W in the lot L is transported to the single-wafer processing unit 6. The predetermined timing may be when the lot L is immersed in the immersion tank 51.

[0086] According to processing recipe 100A, similar to processing recipe 100, one batch recipe 110 and multiple single-wafer recipes 120 are set for one lot L. In this case, in a substrate processing system 1 that performs batch processing and single-wafer processing on substrates W in succession, different single-wafer processing can be performed on each substrate W within the same lot L.

[0087] According to processing recipe 100A, a temporary single-wafer recipe 130 is set for each lot L, and the temporary single-wafer recipe 130 can be replaced with multiple single-wafer recipes 120 at a predetermined timing after processing recipe 100A is created. In this case, even after batch processing has started for lot L, different single-wafer recipes 120 can be set for each substrate W within lot L, and different single-wafer processing can be performed.

[0088] [Processing to Create a Processing Recipe] Referring to Figure 6, the method for creating a processing recipe 100 according to the embodiment will be described. Figure 6 is a flowchart showing the method for creating a processing recipe 100 according to the embodiment. The method for creating a processing recipe 100 according to the embodiment is executed automatically under the control of the control circuit 9. The method for creating a processing recipe 100 according to the embodiment includes steps S20, S40, and S60 shown in Figure 6.

[0089] In step S20, the control circuit 9 determines whether or not to create a processing recipe 100 in which multiple sheet-fed recipes 120 are set for one lot L. If, in step S20, it is determined that a processing recipe 100 in which multiple sheet-fed recipes 120 are set for one lot L is to be created (YES in step S20), the control circuit 9 executes the first recipe creation process (step S40). After executing the first recipe creation process, the control circuit 9 terminates the method of creating the processing recipe 100 shown in Figure 6. If, in step S20, it is determined that a processing recipe 100 in which multiple sheet-fed recipes 120 are set for one lot L is not to be created (NO in step S20), the control circuit 9 executes the second recipe creation process (step S60). After executing the second recipe creation process, the control circuit 9 terminates the method of creating the processing recipe 100 shown in Figure 6.

[0090] (First Recipe Creation Process) The first recipe creation process, which is performed in step S40 of the method for creating the processing recipe 100 according to the embodiment, will be described. The first recipe creation process is performed for each substrate W in lot L.

[0091] An example of the first recipe creation process will be described with reference to Figures 7 to 10. Figure 7 is a flowchart of an example of the first recipe creation process. The first recipe creation process includes steps S41 to S44 shown in Figure 7.

[0092] In step S41, the control circuit 9 determines whether the single-wafer recipe 120 of the target substrate W is different from the single-wafer recipe 120 of the previous substrate W. If, in step S41, it is determined that the single-wafer recipe 120 of the target substrate W is different from the single-wafer recipe 120 of the previous substrate W (YES in step S41), the control circuit 9 performs the process in step S42. If, in step S41, it is determined that the single-wafer recipe 120 of the target substrate W is the same as the single-wafer recipe 120 of the previous substrate W (NO in step S41), the control circuit 9 performs the process in step S44.

[0093] In step S42, the control circuit 9 determines whether a waiting time is required for switching the sheet-fed recipe 120. The waiting time for switching the sheet-fed recipe 120 includes the waiting time for switching the liquid treatment device 62 and the waiting time for switching the drying device 63. The waiting time for switching the liquid treatment device 62 includes, for example, the mixing ratio, temperature, and concentration of the processing liquid, the temperature of the pure water heater, and the concentration of the ozone generator.

[0094] In step S42, if it is determined that a waiting time is necessary due to the switching of the sheet-fed recipe 120 (YES in step S42), the control circuit 9 performs the process in step S43. In step S42, if it is determined that a waiting time is not necessary due to the switching of the sheet-fed recipe 120 (NO in step S42), the control circuit 9 performs the process in step S44.

[0095] In step S43, the control circuit 9 creates a transport recipe prioritizing single-wafer processing. The transport recipe specifies the order and timing of switching between the single-wafer recipe 120 for the previous substrate W, the single-wafer recipe 120 for the target substrate W, and the single-wafer recipe 120. The transport recipe prioritizing single-wafer processing is a transport recipe in which the switching of the single-wafer recipe 120 occurs after all the processing included in the single-wafer processing of the previous substrate W has been completed, and then the single-wafer recipe 120 for the target substrate W is started.

[0096] Figure 8 shows a first example of a transport recipe created by the first recipe creation process in Figure 7. Figure 8 shows an example of a transport recipe created in step S43. In Figure 8, the single-wafer recipe R1 for the previous substrate W includes transporting the substrate W from the second transfer table 54 to the liquid processing device 62, liquid processing of the substrate W in the liquid processing device 62, transporting the substrate W from the liquid processing device 62 to the drying device 63, drying the substrate W in the drying device 63, and transporting the substrate W from the drying device 63 to the first transfer table 33. The single-wafer recipe R2 for the target substrate W includes transporting the substrate W from the second transfer table 54 to the liquid processing device 62, liquid processing of the substrate W in the liquid processing device 62, and transporting the substrate W from the liquid processing device 62 to the first transfer table 33. The single-wafer recipe R2 for the target substrate W differs from the single-wafer recipe R1 for the previous substrate W in that it does not include the drying process. In the example shown in Figure 8, the transport recipe is created such that after the liquid treatment and drying treatment of the preceding substrate W is completed, the switch from single-wafer recipe R1 to single-wafer recipe R2 occurs, and then single-wafer recipe R2 for the target substrate W is started.

[0097] In step S44, the control circuit 9 creates a transport recipe that prioritizes liquid processing. The transport recipe that prioritizes liquid processing is a transport recipe in which, after the liquid processing of the previous substrate W is completed, the single-wafer recipe 120 is switched, and then the single-wafer recipe 120 for the target substrate W is started.

[0098] Figure 9 shows a second example of a transport recipe created by the first recipe creation process in Figure 7. Figure 9 shows an example of a transport recipe created in step S44 when NO is determined in step S41. In Figure 9, the single-wafer recipe R3 for the previous substrate W and the single-wafer recipe R4 for the target substrate W are the same. The single-wafer recipe R3 for the previous substrate W and the single-wafer recipe R4 for the target substrate W each include the transport of the substrate W from the second transfer table 54 to the liquid processing device 62, the liquid processing of the substrate W in the liquid processing device 62, the transport of the substrate W from the liquid processing device 62 to the drying device 63, the drying of the substrate W in the drying device 63, and the transport of the substrate W from the drying device 63 to the first transfer table 33. In the example in Figure 9, the transport recipe is created so that the liquid processing of the target substrate W starts immediately after the liquid processing of the previous substrate W is completed. In the example in Figure 9, there is a waiting time between the liquid processing and the drying of the target substrate W.

[0099] Figure 10 shows a third example of a transport recipe created by the first recipe creation process in Figure 7. Figure 10 shows an example of a transport recipe created in step S44 when NO is determined in step S42. In Figure 10, the single-wafer recipe R5 for the previous substrate W includes transporting the substrate W from the second transfer table 54 to the liquid processing device 62, liquid processing of the substrate W in the liquid processing device 62, and transporting the substrate W from the liquid processing device 62 to the first transfer table 33. The single-wafer recipe R6 for the target substrate W includes transporting the substrate W from the second transfer table 54 to the liquid processing device 62, liquid processing of the substrate W in the liquid processing device 62, transporting the substrate W from the liquid processing device 62 to the drying device 63, drying the substrate W in the drying device 63, and transporting the substrate W from the drying device 63 to the first transfer table 33. The single-wafer recipe R6 for the target substrate W differs from the single-wafer recipe R5 for the previous substrate W in that it includes a drying process. In the example shown in Figure 10, the transport recipe is created so that the liquid treatment of the target substrate W begins immediately after the liquid treatment of the previous substrate W is completed.

[0100] Referring to Figures 11 to 15, another example of the first recipe creation process will be described. Figure 11 is a flowchart of another example of the first recipe creation process. The first recipe creation process includes steps S51 to S58 shown in Figure 11.

[0101] In step S51, the control circuit 9 determines whether the single-wafer recipe 120 of the target substrate W is different from the single-wafer recipe 120 of the previous substrate W. If, in step S51, it is determined that the single-wafer recipe 120 of the target substrate W is different from the single-wafer recipe 120 of the previous substrate W (YES in step S51), the control circuit 9 performs the process in step S52. If, in step S51, it is determined that the single-wafer recipe 120 of the target substrate W is the same as the single-wafer recipe 120 of the previous substrate W (NO in step S51), the control circuit 9 performs the process in step S56.

[0102] In step S52, the control circuit 9 determines whether a waiting time is required due to the switching of the sheet-fed recipe 120. The waiting time due to the switching of the sheet-fed recipe 120 includes the waiting time due to the switching of the liquid processing device 62 and the waiting time due to the switching of the drying device 63.

[0103] In step S52, if it is determined that a waiting time is necessary due to the switching of the sheet-fed recipe 120 (YES in step S52), the control circuit 9 performs the process in step S53. In step S52, if it is determined that a waiting time is not necessary due to the switching of the sheet-fed recipe 120 (NO in step S52), the control circuit 9 performs the process in step S56.

[0104] In step S53, the control circuit 9 determines whether or not the single-wafer recipe 120 of the target substrate W includes a drying process. If it is determined in step S53 that the single-wafer recipe 120 of the target substrate W includes a drying process (YES in step S53), the control circuit 9 performs the process in step S54. If it is determined in step S53 that the single-wafer recipe 120 of the target substrate W does not include a drying process (NO in step S53), the control circuit 9 performs the process in step S55.

[0105] In step S54, the control circuit 9 creates a transport recipe that prioritizes drying. The transport recipe that prioritizes drying is a transport recipe that transports the substrate W to the single-wafer processing unit 6 at a timing that eliminates any waiting time between the liquid treatment and drying treatment of the substrate W. In this case, the collapse of the uneven pattern of the substrate W due to the evaporation of IPA during transport of the substrate W from the liquid treatment unit 62 to the drying unit 63 can be suppressed.

[0106] Figure 12 shows a first example of a transport recipe created by the first recipe creation process in Figure 11. Figure 12 shows an example of a transport recipe created in step S54. In Figure 12, the single-wafer recipe R7 for the previous substrate W and the single-wafer recipe R8 for the target substrate W each include transporting the substrate W from the second transfer table 54 to the liquid processing device 62, liquid processing of the substrate W in the liquid processing device 62, transporting the substrate W from the liquid processing device 62 to the drying device 63, drying the substrate W in the drying device 63, and transporting the substrate W from the drying device 63 to the first transfer table 33. The single-wafer recipe R8 for the target substrate W differs from the single-wafer recipe R7 for the previous substrate W in at least one of the processing conditions for liquid processing and drying processing. In the example in Figure 12, a transport recipe is created that transports the substrate W to the single-wafer processing unit 6 at a timing that does not result in a waiting time between the liquid processing and drying processing of the target substrate W. Specifically, the drying process recipe is switched immediately after the drying process of the previous substrate W is completed, and a transport recipe is created to transport the substrate W to the single-wafer processing unit 6 at the timing when the drying process of the target substrate W begins immediately after the drying recipe switch is completed. Therefore, the target substrate W is not transported to the single-wafer processing unit 6 immediately after the liquid processing recipe switch is completed.

[0107] In step S55, the control circuit 9 creates a transport recipe that prioritizes liquid processing. The transport recipe that prioritizes liquid processing is a transport recipe in which, after the liquid processing of the previous substrate W is completed, the single-wafer recipe 120 is switched, and then the single-wafer recipe 120 for the target substrate W is started.

[0108] Figure 13 shows a second example of a transport recipe created by the first recipe creation process in Figure 11. Figure 13 shows an example of a transport recipe created in step S55. In Figure 13, the single-wafer recipe R9 for the previous substrate W and the single-wafer recipe R10 for the target substrate W each include the transport of the substrate W from the second transfer table 54 to the liquid processing device 62, the liquid processing of the substrate W in the liquid processing device 62, and the transport of the substrate W from the liquid processing device 62 to the first transfer table 33. The single-wafer recipe R10 for the target substrate W has different liquid processing conditions compared to the single-wafer recipe R8 for the previous substrate W. In the example in Figure 13, the transport recipe is created such that after the liquid processing of the previous substrate W is completed, a switch from single-wafer recipe R9 to single-wafer recipe R10 is performed, and then the liquid processing of the target substrate W is started.

[0109] In step S56, the control circuit 9 determines whether or not the single-wafer recipe 120 of the target substrate W includes a drying process. If it is determined in step S56 that the single-wafer recipe 120 of the target substrate W includes a drying process (YES in step S56), the control circuit 9 performs the process in step S57. If it is determined in step S56 that the single-wafer recipe 120 of the target substrate W does not include a drying process (NO in step S56), the control circuit 9 performs the process in step S58.

[0110] In step S57, the control circuit 9 creates a transport recipe that prioritizes drying. The transport recipe that prioritizes drying is a transport recipe that transports the substrate W to the single-wafer processing unit 6 at a timing that eliminates any waiting time between the liquid treatment and drying treatment of the substrate W. In this case, the collapse of the uneven pattern of the substrate W due to the evaporation of IPA during transport of the substrate W from the liquid treatment unit 62 to the drying unit 63 can be suppressed.

[0111] Figure 14 shows a third example of a transport recipe created by the first recipe creation process in Figure 11. Figure 14 shows an example of a transport recipe created in step S57 when NO is determined in step S51. In Figure 14, the single-wafer recipe R11 for the previous substrate W and the single-wafer recipe R12 for the target substrate W are the same. The single-wafer recipe R11 for the previous substrate W and the single-wafer recipe R12 for the target substrate W each include the transport of the substrate W from the second transfer table 54 to the liquid processing device 62, the liquid processing of the substrate W in the liquid processing device 62, the transport of the substrate W from the liquid processing device 62 to the drying device 63, the drying processing of the substrate W in the drying device 63, and the transport of the substrate W from the drying device 63 to the first transfer table 33. In the example in Figure 12, a transport recipe is created that transports the substrate W to the single-wafer processing device 6 at a timing that does not cause a waiting time between the liquid processing and drying processing of the target substrate W. Specifically, a transport recipe has been created that transports the target substrate W to the single-wafer processing unit 6 at the timing when the drying process for the target substrate W begins immediately after the drying process for the previous substrate W has finished. Therefore, the target substrate W is not transported to the single-wafer processing unit 6 immediately after the liquid treatment of the previous substrate W has finished.

[0112] In step S58, the control circuit 9 creates a transport recipe that prioritizes liquid processing. The transport recipe that prioritizes liquid processing is a transport recipe in which, after the liquid processing of the previous substrate W is completed, the single-wafer recipe 120 is switched, and then the single-wafer recipe 120 for the target substrate W is started.

[0113] Figure 15 shows a fourth example of a transport recipe created by the first recipe creation process in Figure 11. Figure 15 shows an example of a transport recipe created in step S58 when NO is determined in step S51. In Figure 15, the single-wafer recipe R13 for the previous substrate W and the single-wafer recipe R14 for the target substrate W are the same. The single-wafer recipe R13 for the previous substrate W and the single-wafer recipe R14 for the target substrate W each include the transport of the substrate W from the second transfer table 54 to the liquid processing device 62, the liquid processing of the substrate W in the liquid processing device 62, and the transport of the substrate W from the liquid processing device 62 to the first transfer table 33, respectively. In the example in Figure 15, the transport recipe is created so that the liquid processing of the target substrate W starts immediately after the liquid processing of the previous substrate W is completed.

[0114] (Second Recipe Creation Process) The second recipe creation process, which is performed in step S60 of the method for creating the processing recipe 100 according to the embodiment, will now be described. The second recipe creation process is performed for each substrate W in lot L.

[0115] An example of the second recipe creation process will be described with reference to Figures 16 to 18. Figure 16 is a flowchart of an example of the second recipe creation process. The second recipe creation process includes steps S61 to S63 shown in Figure 16.

[0116] In step S61, the control circuit 9 determines whether or not the single-wafer recipe 120 of the target substrate W includes a drying process. If it is determined in step S61 that the single-wafer recipe 120 of the target substrate W includes a drying process (YES in step S61), the control circuit 9 performs the process in step S62. If it is determined in step S61 that the single-wafer recipe 120 of the target substrate W does not include a drying process (NO in step S61), the control circuit 9 performs the process in step S63.

[0117] In step S62, the control circuit 9 creates a transport recipe that prioritizes drying. The transport recipe that prioritizes drying is a transport recipe that transports the substrate W to the single-wafer processing unit 6 at a timing that eliminates any waiting time between the liquid treatment and drying treatment of the substrate W. In this case, the collapse of the uneven pattern of the substrate W due to the evaporation of IPA during transport of the substrate W from the liquid treatment unit 62 to the drying unit 63 can be suppressed.

[0118] Figure 17 shows a first example of a transport recipe created by the second recipe creation process in Figure 16. Figure 17 shows an example of a transport recipe created in step S62. In Figure 17, the single-wafer recipe R15 for the previous substrate W and the single-wafer recipe R16 for the target substrate W are the same. The single-wafer recipe R15 for the previous substrate W and the single-wafer recipe R16 for the target substrate W each include the transport of the substrate W from the second transfer table 54 to the liquid processing device 62, the liquid processing of the substrate W in the liquid processing device 62, the transport of the substrate W from the liquid processing device 62 to the drying device 63, the drying processing of the substrate W in the drying device 63, and the transport of the substrate W from the drying device 63 to the first transfer table 33. In the example in Figure 17, a transport recipe is created that transports the substrate W to the single-wafer processing device 6 at a timing that does not cause any waiting time between the liquid processing and drying processing of the target substrate W. Specifically, a transport recipe has been created that transports the target substrate W to the single-wafer processing unit 6 at the timing when the drying process for the target substrate W begins immediately after the drying process for the previous substrate W has finished. Therefore, the target substrate W is not transported to the single-wafer processing unit 6 immediately after the liquid treatment of the previous substrate W has finished.

[0119] In step S63, the control circuit 9 creates a transport recipe that prioritizes liquid processing. The transport recipe that prioritizes liquid processing is a transport recipe in which, after the liquid processing of the previous substrate W is completed, the single-wafer recipe 120 is switched, and then the single-wafer recipe 120 for the target substrate W is started.

[0120] Figure 18 shows a second example of a transport recipe created by the second recipe creation process in Figure 16. Figure 18 shows an example of a transport recipe created in step S63. In Figure 18, the single-wafer recipe R17 for the previous substrate W and the single-wafer recipe R18 for the target substrate W are the same. The single-wafer recipe R17 for the previous substrate W and the single-wafer recipe R18 for the target substrate W each include the transport of the substrate W from the second transfer table 54 to the liquid processing device 62, the liquid processing of the substrate W in the liquid processing device 62, and the transport of the substrate W from the liquid processing device 62 to the first transfer table 33, respectively. In the example in Figure 18, the transport recipe is created so that the liquid processing of the target substrate W starts after the liquid processing of the previous substrate W is completed.

[0121] [Order of substrates transported from immersion tank to single-wafer processing unit] Referring to Figure 19, an example of the order in which substrates W are transported from immersion tank 51 to single-wafer processing unit 6 will be explained. Figure 19 is a diagram illustrating the order in which substrates W are transported from immersion tank 51 to single-wafer processing unit 6.

[0122] If different single-wafer recipes 120 are set for each substrate W within a single lot L, substrates W with the same single-wafer recipe 120 can be continuously removed from the immersion tank 51 and transported to the single-wafer processing unit 6. In this case, the number of times the single-wafer recipe 120 needs to be changed can be reduced. Therefore, the decrease in productivity due to changing the single-wafer recipe 120 can be reduced. Also, if multiple substrates W with the same single-wafer recipe 120 are managed as a single group, and the single-wafer recipe 120 is set for each group, the optimal transport order can be easily changed.

[0123] In the example shown in Figure 19, substrates W with single-wafer recipe A are placed in slots 1 and 4 of lot L, and substrates W with single-wafer recipe B are placed in slots 2 and 3 of lot L. In this case, for example, the substrates W are removed from the immersion tank 51 in the order of slot 1, slot 4, slot 2, and slot 3 and transported to the single-wafer processing unit 6.

[0124] Alternatively, the substrates W may be removed from the immersion tank 51 and transported to the single-wafer processing unit 6 in the order of the slots. That is, the substrates W may be removed from the immersion tank 51 and transported to the single-wafer processing unit 6 in the order of slot 1, slot 2, slot 3, and slot 4.

[0125] [Method for sorting substrates discharged from the single-wafer processing unit] Referring to Figure 20, an example of a method for sorting substrates W discharged from the single-wafer processing unit 6 will be described. Figure 20 is a diagram illustrating a method for sorting substrates W discharged from the single-wafer processing unit 6.

[0126] If different single-wafer recipes 120 are set for each substrate W within a single lot L, substrates W with the same single-wafer recipe 120 may be allocated to the same transfer area of ​​the first transfer table 33. In this case, substrates W that have undergone the same processing can be collected into the same cassette C.

[0127] In the example shown in Figure 20, the immersion tank 51 contains substrates W discharged from cassette C1 and substrates W discharged from cassette C2. Specifically, slot 1 contains a substrate W discharged from cassette C1 with single-wafer recipe A set. Slot 2 contains a substrate W discharged from cassette C2 with single-wafer recipe B set. Slot 3 contains a substrate W discharged from cassette C1 with single-wafer recipe A set. Slot 4 contains a substrate W discharged from cassette C2 with single-wafer recipe A set. Slot 5 contains a substrate W discharged from cassette C1 with single-wafer recipe B set. For example, when the lot forming unit 32 forms lot L, the substrates W discharged from cassette C1 and the substrates W discharged from cassette C2 are arranged alternately within lot L.

[0128] In the example shown in Figure 20, when each substrate W processed by the single-wafer processing unit 6 is transported to the first transfer table 33, substrates W with single-wafer recipe A are allocated to the first transfer area 33a, and substrates W with single-wafer recipe B are allocated to the second transfer area 33b.

[0129] The embodiments disclosed herein should be considered in all respects as illustrative and not restrictive. The above embodiments may be omitted, replaced, or modified in various ways without departing from the scope and spirit of the appended claims.

[0130] This international application claims priority based on Japanese Patent Application No. 2024-199297, filed on 14 November 2024, and Japanese Patent Application No. 2025-134260, filed on 12 August 2025, and the entire contents of said application are incorporated herein by reference.

[0131] 1. Substrate processing system 4. Batch processing unit 5. Second interface unit 6. Single-wafer processing unit 9. Control circuit 100. Processing recipe 110. Batch recipe 120. Single-wafer recipe L. Lot W. Substrate

Claims

1. A substrate processing system comprising: a batch processing unit that processes a lot containing multiple substrates at once using a batch recipe; a single-wafer processing unit that processes the substrates in the lot one by one using a single-wafer recipe; an interface unit that transports the substrates from the batch processing unit to the single-wafer processing unit; and a control circuit, wherein the control circuit performs the following actions: setting the single-wafer recipe for each substrate in the lot; transporting the substrates in the lot processed by the batch processing unit to the single-wafer processing unit; and processing the substrates using the single-wafer recipe set for each substrate.

2. The substrate processing system according to claim 1, wherein the lot includes a plurality of substrates for which the same single-wafer recipe is set, and the control circuit manages the plurality of substrates for which the same single-wafer recipe is set as a single group when setting the single-wafer recipe for each substrate.

3. The substrate processing system according to claim 2, wherein the control circuit transports a plurality of substrates managed as the same group to the single-wafer processing unit in succession when transporting the substrate to the single-wafer processing unit.

4. The substrate processing system according to claim 1, wherein the interface unit has an immersion tank for storing rinsing liquid, and the control circuit holds the substrates in the lot in the immersion tank before being transported to the single-wafer processing unit.

5. The substrate processing system according to claim 1, wherein the single-wafer processing unit comprises a liquid processing unit for processing the substrate with a processing liquid, and a drying unit for drying the substrate, and when the liquid processing and the drying processing are performed on the substrate in this order, the control circuit transports the substrate to the single-wafer processing unit at a timing that does not result in a waiting time between the liquid processing and the drying processing.

6. A substrate processing system according to claim 1, comprising a transfer table for receiving the substrates processed in the single-wafer processing unit, the transfer table having a plurality of transfer areas, and the control circuit for distributing a plurality of substrates, each having the same single-wafer recipe, to the same transfer area.

7. The substrate processing system according to claim 1, wherein the control circuit performs the following: setting the batch recipe for each lot, and processing the lot with the batch recipe set for each lot.

8. The substrate processing system according to any one of claims 1 to 7, wherein the control circuit sets the single-wafer recipe before the lot is transported to the batch processing unit.

9. The substrate processing system according to any one of claims 1 to 7, wherein the control circuit sets the single-wafer recipe after the lot has been discharged from the batch processing unit and before the first substrate in the lot is transported to the single-wafer processing unit.

10. The substrate processing system according to any one of claims 1 to 7, wherein the control circuit creates a transport recipe that prioritizes single-wafer processing when the single-wafer recipe of the target substrate differs from the single-wafer recipe of the immediately preceding substrate, and a waiting time is required for switching from the single-wafer recipe of the immediately preceding substrate to the single-wafer recipe of the target substrate.

11. The substrate processing system according to any one of claims 1 to 7, wherein the control circuit creates a transport recipe prioritizing liquid processing when the single-wafer recipe of the target substrate is different from the single-wafer recipe of the immediately preceding substrate, and there is no waiting time required for switching from the single-wafer recipe of the immediately preceding substrate to the single-wafer recipe of the target substrate.

12. The substrate processing system according to any one of claims 1 to 7, wherein the control circuit creates a transport recipe prioritizing liquid processing when the single-wafer recipe for a symmetrical substrate is the same as the single-wafer recipe for the immediately preceding substrate.

13. The substrate processing system according to any one of claims 1 to 7, wherein the control circuit creates a transport recipe that prioritizes drying when the single-wafer recipe of the target substrate is different from the single-wafer recipe of the immediately preceding substrate, a waiting time is required for switching from the single-wafer recipe of the immediately preceding substrate to the single-wafer recipe of the target substrate, and the single-wafer recipe of the target substrate includes a drying process.

14. The substrate processing system according to any one of claims 1 to 7, wherein the control circuit creates a transport recipe prioritizing liquid processing when the single-wafer recipe of the target substrate differs from the single-wafer recipe of the immediately preceding substrate, a waiting time is required for switching from the single-wafer recipe of the immediately preceding substrate to the single-wafer recipe of the target substrate, and the single-wafer recipe of the target substrate does not include a drying process.

15. The substrate processing system according to any one of claims 1 to 7, wherein the control circuit creates a transport recipe that prioritizes drying when the single-wafer recipe of the target substrate is different from the single-wafer recipe of the immediately preceding substrate, and there is no waiting time required for switching from the single-wafer recipe of the immediately preceding substrate to the single-wafer recipe of the target substrate, and the single-wafer recipe of the target substrate includes a drying process.

16. The substrate processing system according to any one of claims 1 to 7, wherein the control circuit creates a transport recipe prioritizing liquid processing when the single-wafer recipe of the target substrate is different from the single-wafer recipe of the immediately preceding substrate, and there is no waiting time required for switching from the single-wafer recipe of the immediately preceding substrate to the single-wafer recipe of the target substrate, and the single-wafer recipe of the target substrate does not include a drying process.

17. The substrate processing system according to any one of claims 1 to 7, wherein the control circuit creates a transport recipe that prioritizes drying when the single-wafer recipe of the target substrate is the same as the single-wafer recipe of the immediately preceding substrate and the single-wafer recipe of the target substrate includes a drying process.

18. The substrate processing system according to any one of claims 1 to 7, wherein the control circuit creates a transport recipe prioritizing liquid processing when the single-wafer recipe for the target substrate is the same as the single-wafer recipe for the immediately preceding substrate, and the single-wafer recipe for the target substrate does not include a drying process.

19. A substrate processing method performed by a substrate processing system comprising: a batch processing unit that processes a lot containing multiple substrates at once using a batch recipe; a single-wafer processing unit that processes the substrates in the lot one by one using a single-wafer recipe; and an interface unit that transports the substrates from the batch processing unit to the single-wafer processing unit, the method comprising: setting a single-wafer recipe for each substrate in the lot; transporting the substrates in the lot processed by the batch processing unit to the single-wafer processing unit; and processing the substrates using the single-wafer recipe set for each substrate.

20. A program for a computer that controls a substrate processing system comprising a batch processing unit that processes a lot containing multiple substrates at once using a batch recipe, a single-wafer processing unit that processes the substrates in the lot one by one using a single-wafer recipe, and an interface unit that transports the substrates from the batch processing unit to the single-wafer processing unit, to perform the following actions: setting the single-wafer recipe for each substrate in the lot; transporting the substrates in the lot processed by the batch processing unit to the single-wafer processing unit; and processing the substrates using the single-wafer recipe set for each substrate.

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