Storage system

Abstract

The present invention comprises: a laminate (ST) in which a plurality of holding members (90) each capable of holding one wafer (W) are laminated in the vertical direction; a container (80) that accommodates the laminate (ST); a replacement device (20) that can transfer the wafers (W) to the holding members (90) constituting the laminate (ST); and an accommodation device (30) that can take the laminate (ST) into and out of the container (80). The accommodation device (30) has: a lifting table (26B) that lifts and lowers the laminate (ST) in a state of being supported by a bottom part (84); and a container placement part (29) that is disposed above the lifting table (26B) and onto which the peripheral edge of a lid part (81) is placed from the outside of an opening (29C) allowing the laminate (ST) in a state of being supported by the bottom part (84) to pass therethrough. The lifting table (26B) lifts and lowers the laminate (ST) placed on the bottom part (84), thereby taking the laminate (ST) into and out of the container (80) via the opening (29C).

Description

Storage system

[0001] One aspect of the present invention relates to a storage system.

[0002] For example, Patent Document 1 below discloses a wafer transfer device that transfers wafers to a wafer storage container for storing semiconductor wafers. The wafer storage container is composed of a laminate in which a plurality of holding members (rings) for holding one wafer are stacked, and a sandwiching body (upper lid portion and bottom portion) that sandwiches the laminate from above and below.

[0003] International Publication No. 2021 / 044791, Japanese Patent Application Laid-Open No. 2004-241705

[0004] In the storage system as described above, usually, an inert gas is filled inside the container to prevent deterioration of the wafers. A high sealing performance is required to maintain the gas concentration inside the container. However, in the above conventional container, although the holding members adjacent to each other are held in a close contact state by the sandwiching body, since they are separate members independent of each other, there is a possibility that an unintentional gap may occur. Therefore, it is conceivable to store the above conventional laminate in the internal space of a container composed of a lid portion and a bottom portion as shown in Patent Document 2. In that case, when storing the laminate in the container, it is required to reduce the entry of foreign matter into the container.

[0005] Therefore, an object of one aspect of the present invention is to provide a storage system capable of reducing the entry of foreign matter when storing a laminate in the internal space of a container composed of a lid portion and a bottom portion.

[0006] (1) A storage system according to one aspect of the present invention comprises a laminate in which a plurality of holding members capable of holding one wafer are stacked vertically, a container for storing the laminate, a transfer device capable of transferring wafers to the holding members constituting the laminate, and a storage device capable of loading and unloading the laminate into and out of the container, wherein the container has a lid portion having an upper portion that covers the top of the laminate and a lateral portion that covers the sides of the laminate, and a bottom portion having a lower portion that supports the laminate from below and is engageable with the lid portion, and the laminate is stored in the internal space formed by the lid portion and the bottom portion when the lid portion and the bottom portion are engaged, and the storage device has a lifting platform for raising and lowering the laminate supported by the bottom portion, and a container mounting portion positioned above the lifting platform for placing the periphery of the lid portion from the outside of an opening through which the laminate supported by the bottom portion can pass, and the lifting platform raises and lowers the laminate placed on the bottom portion, thereby loading and unloading the laminate into and out of the container through the opening.

[0007] In this storage system configuration, the lid is positioned above a lifting platform with the periphery of the stacked material, supported at the bottom, resting on the outside of an opening through which the stacked material can pass. By raising and lowering the stacked material at the bottom, the stacked material can be inserted into and removed from the container through the opening. This allows the lid to seal off the outside air, reducing the risk of foreign matter contamination. Therefore, when storing the stacked material in the internal space of the container, which consists of a lid and a bottom, the risk of foreign matter contamination is reduced.

[0008] (2) In the storage system described in (1) above, an elastic member that supports the periphery of the lid may be placed in the container mounting section. In this configuration, when the lid is placed on the container mounting section, the space between the container mounting section and the lid is sealed. As a result, when storing the laminate in the internal space of the container, which is composed of the lid and the bottom, the inclusion of foreign matter can be effectively reduced.

[0009] (3) In the storage system described in (1) or (2) above, the lifting platform may be provided with an elastic member that supports the outer edge of the bottom. In this configuration, the internal space between the bottom and the lifting platform is sealed when the bottom is placed on the lifting platform. As a result, foreign matter attached to the bottom during lifting operations is prevented from being scattered into the internal space.

[0010] (4) In any one of the storage systems described in (1) to (3) above, the storage device may include a housing that forms a lifting space through which the stacked items are raised and lowered by a lifting platform, and a suction device provided in the housing that sucks up gas in the lifting space. In this configuration, foreign matter floating in the lifting space can be sucked up and removed.

[0011] (5) In the storage system described in (4) above, the suction device may be located on at least one of the sides and below the lifting space. This configuration allows for effective suction of foreign matter floating in the lifting space.

[0012] (6) In any one of the storage systems described in (1) to (5) above, the container has a locking part that locks the bottom to the lid, and the storage device may have a switching device that switches between a locked state in which the locking part locks the bottom to the lid and an unlocked state in which the locking part does not lock the bottom to the lid. In this configuration, the lid and the bottom can be securely fixed, and the airtight state of the internal space can be maintained.

[0013] (7) In the storage system described in (6) above, the container may have its bottom and lid in contact with each other via an elastic member when locked. In this configuration, the internal space is sealed when the bottom and lid are fixed, so that foreign matter does not enter the internal space.

[0014] (8) The storage system described in any one of (1) to (7) above further comprises a plurality of storage shelves for storing containers and a first conveying device for transporting containers between the plurality of storage shelves, wherein the first conveying device may have a transfer section for supporting containers from below.

[0015] (9) The storage system described in any one of (1) to (8) above further comprises a second transport device for transporting containers between a plurality of storage shelves for storing containers and a container placement section, and the second transport device may have a gripping section for gripping containers.

[0016] (10) In the storage system described in (9) above, the lid may have a flange that protrudes laterally from the side and is gripped by the gripping portion. In this configuration, the container can be properly gripped by the conveying device or the like supporting the flange. The flange is formed to protrude laterally from the side of the lid. As a result, the increase in the vertical dimension of the container can be reduced compared to the case where the flange is formed to protrude upward from the top surface of the lid. Consequently, containers can be stored at high density in the storage device or the like.

[0017] (11) In the storage system described in (8) above, a recess may be formed on the lower surface of the bottom portion that fits into a positioning portion which is formed in the transfer portion and protrudes upward. In this configuration, when a transport device or the like supports the bottom portion of the container from below and moves it, the container can be moved while in an appropriate position.

[0018] According to one aspect of the present invention, when storing a laminate in the internal space of a container consisting of a lid and a bottom, the inclusion of foreign matter can be reduced.

[0019] Figure 1 is a plan view showing an overall overview of a storage system according to one embodiment. Figure 2 is a side view taken along line II-II shown in Figure 1. Figure 3 is an exploded perspective view of a wafer container showing a laminated structure stored inside. Figure 4(A) is a perspective view of the lid of the wafer container included in Figure 3, taken from diagonally above. Figure 4(B) is a perspective view of the lid of the wafer container included in Figure 3, taken from diagonally below. Figure 5(A) is a perspective view of the bottom of the wafer container included in Figure 3, taken from diagonally above. Figure 5(B) is a perspective view of the bottom of the wafer container included in Figure 3, taken from diagonally below. Figure 6(A) is a perspective view of the retaining part of the wafer container included in Figure 3, taken from diagonally above. Figure 6(B) is a perspective view of the retaining part of the wafer container included in Figure 3, taken from diagonally below. Figure 7 is a perspective view of the wafer container with a laminated structure stored inside, taken from diagonally below. Figure 8 is a perspective view of the cell ring that holds the wafer, taken from diagonally above. Figure 9 is a perspective view of the laminated structure, in which the cell rings that hold the wafers are stacked, taken from diagonally above. Figure 10 is a front view of the first overhead transport vehicle, seen from the front. Figure 11 is a perspective view of the robot arm included in the transfer device, seen from diagonally above. Figure 12 is a front view of the inside of the ring opener included in the storage device, seen from the front. Figure 13 is a diagram illustrating the operation of the ring opener. Figure 14 is a diagram illustrating the operation of the ring opener. Figure 15(A) is a top view of the container mounting section of the ring opener, seen from above. Figure 15(B) is a perspective view of the switching device provided in the container mounting section, seen from diagonally above. Figure 16 is a side view of the second overhead transport vehicle, seen from the side. Figure 17 is a plan view showing an overall overview of the storage system according to a modified example. Figure 18 is a side view of the storage system according to a modified example, further comprising a pre-device storage device. Figure 19(A) is a front view of the pre-device storage device of Figure 18, seen from the front. Figure 19(B) is a side view of the pre-device storage device of Figure 18, seen from the side. Figure 20 is a plan view showing an overall overview of the storage system according to a further modified example.

[0020] Hereinafter, a storage system 1 according to one embodiment will be described with reference to the drawings. In the description of the drawings, the same elements are denoted by the same reference numerals, and redundant explanations are omitted. The dimensional ratios in the drawings do not necessarily match those in the description. Also, for the sake of convenience of explanation, the directions in Figures 1, 2, 10, 17, 18, and 20 will be described using the XYZ coordinate system. In this XYZ coordinate system, the plane parallel to the horizontal plane is defined as the XY plane. In this XY plane, the travel direction of the first overhead transport vehicle 2 (hereinafter referred to as "first transport vehicle 2") and the second overhead transport vehicle 57 (hereinafter referred to as "second transport vehicle 57") and the first sliding direction of the relay device (second transport device) 60 are denoted as the X direction, and the direction perpendicular to the X direction in the XY plane is denoted as the Y direction. Also, the direction perpendicular to the XY plane is denoted as the Z direction. The X direction (first direction), Y direction (second direction), and Z direction (vertical direction) are perpendicular to each other.

[0021] The storage system 1 shown in Figures 1 and 2 is a system that takes out wafers W stored in a FOUP (Front Opening Unified Pod) 70, stores them in a wafer container (container) 80, and then puts the wafer container 80 containing the wafers W into a storage device 50. The storage system 1 is also a system that takes out wafers W from the wafer container 80 that has been taken out of the storage device 50, and stores the taken out wafers W in the FOUP 70. The wafer container 80 is a container that can accommodate wafers W in a higher density and more airtight state than the FOUP 70.

[0022] The wafer W is, for example, disc-shaped. However, the wafer W does not have to be disc-shaped. The wafer W may have a shape in which a part of the disc is missing (for example, a flat notch cut along a straight line corresponding to a chord, or a notched notch in which a part of the periphery is cut in a triangular shape). The wafer W has at least an arc portion. The center of the wafer W is determined with respect to the said arc portion.

[0023] First, the FOUP 70 and wafer container 80 used in the storage system 1 will be described. The FOUP 70 has a box body 71 having an opening that opens horizontally, a lid 72 that covers the opening, and a flange 73 that is positioned on the top of the box body 71 and is gripped by a chuck provided on the lifting platform 3E of the first transport vehicle 2, which will be described in detail later. The FOUP 70 is suspended and held by the first transport vehicle 2 by the flange 73 being gripped by the chuck.

[0024] As shown in Figure 3, the wafer container 80 houses a laminated body ST of cell rings (holding members) 90 that hold (support) the wafer W. Note that the wafer W is not shown in Figure 3. The wafer container 80 has a lid portion 81, a bottom portion 84, and a cover portion 87. The wafer container 80 houses the laminated body ST, which is held between the bottom portion 84 and the cover portion 87, and is covered from above by the lid portion 81. The lid portion 81, the bottom portion 84, and the cover portion 87 are made of a material such as resin.

[0025] As shown in Figures 3, 4(A), and 4(B), the lid portion 81 has an upper surface portion 81A, a side portion 81B, a flange 81C, a rim portion 81D, and a locking portion 81E. The upper surface portion 81A covers the top of the laminate ST. The upper surface portion 81A is formed in a rectangular shape in plan view. The side portion 81B covers the sides of the laminate ST. The side portion 81B is a member consisting of four surfaces that hang down from the four outer edges of the upper surface portion 81A. Flanges 81C are formed on two of the four surfaces of the side portion 81B that are opposite each other. Each of the four surfaces of the side portion 81B is formed in a rectangular shape when viewed from the horizontal direction.

[0026] The flange 81C is the part that is gripped by the chuck 65A provided on the lifting section 65 of the relay device 60. The flange 81C is located on two of the four side portions 81B that are facing each other. The flange 73 of the FOUP 70, which has a similar function, is formed on the upper surface of the box body 71, whereas the flange 81C of the wafer container 80 is formed on the side portion 81B of the lid portion 81, which is the difference between the two.

[0027] The flange portion 81D is the part into which the base portion 84 is fitted. The flange portion 81D is located at the lower end of the lateral portion 81B in the vertical direction. In other words, the flange portion 81D is provided on the side of the lateral portion 81B opposite to the upper surface portion 81A in one direction. The flange portion 81D has a protruding portion 81Da that extends horizontally at the lower end of the lateral portion 81B and a hanging portion 81Db that hangs down from the protruding portion 81D. The flange portion 81D is formed in an L-shape in cross-section. The flange portion 81D is formed such that when the base portion 84 is inserted into the flange portion 81D from below, the upper surface of the periphery of the base portion 84 and the inner surface of the protruding portion 81D come into contact with each other via an elastic member 84F, which will be described in detail later.

[0028] The locking portion 81E is the part that locks the bottom portion 84, which is fitted into the flange portion 81D. The locking portion 81E is attached to four hanging portions 81Db that hang down from the four outer edges of the protruding portion 81Da. Two locking portions 81E are attached to each of the four hanging portions 81Db, which are opposite pairs of hanging portions 81Db, for a total of four. The locking portions 81E are attached to the hanging portions 81Db so that two locking portions 81E are slidable in opposing directions. The locking portion 81E is formed to be operable by a switching device 29B, which will be described in detail later.

[0029] As shown in Figures 3, 5(A), and 5(B), the bottom portion 84 has a main surface portion 84A, a locking portion 84B, a protrusion 84C, a support portion 84D, a gas supply portion 84E, and an elastic member 84F. The main surface portion 84A covers the bottom of the laminate ST. The main surface portion 84A is a rectangular plate-shaped member. In plan view, the main surface portion 84A is formed to be slightly larger than the laminate ST (cell ring 90). A recess 84G is formed on the lower surface of the main surface portion 84A, which fits into a positioning portion 57E formed on the transfer portion 57D of the second transport vehicle (first transport device) 57 and protruding upward.

[0030] The locking portion 84B is a portion that can be locked to the locking portion 81E. Two locking portions 84B are formed on each of the two opposing sides of the four sides of the main surface portion 84A. The locking portions 84B are recesses formed on the lower surface of the main surface portion 84A that can be locked by the locking portion 81E. Figure 7 shows the bottom portion 84 locked by the locking portion 81E of the lid portion 81. The elastic member 84F is arranged on the periphery of the main surface portion 84A. The elastic member 84F contacts the flange portion 81D when the lid portion 81 is locked. The elastic member 84F is made of a material such as rubber. That is, in the locked state, the bottom portion 84 and the lid portion 81 of the wafer container 80 are in contact with each other via the elastic member 84F.

[0031] As shown in Figures 3, 5(A), and 5(B), the protrusion 84C is a part that positions the cell ring 90 that forms the laminate ST. The protrusion 84C is formed on the upper surface of the main surface 84A and is arranged to face each other diagonally among the four corners. The support part 84D is a part that supports a part of the cell ring 90 that holds the wafer W. The support part 84D is formed on the upper surface of the main surface 84A and is formed to protrude above the main surface 84A. The gas supply part 84E is a part to which inert gas is supplied from a nozzle (not shown) installed on the lifter 26B. The wafer container 80 is supplied with inert gas from the outside via the gas supply part 84E.

[0032] As shown in Figures 3, 6(A), and 6(B), the cover portion 87 is a member that contacts the upper surface of the laminate ST and covers the laminate ST from above. The cover portion 87 functions as a member that prevents the wafer W, which is placed on the cell ring 90 located at the uppermost stage of the laminate ST, from being exposed and protects it from dust. The cover portion 87 has a frame portion 87A, an inner surface portion 87B, an upper surface portion 87C, and a positioning portion 87D.

[0033] The frame portion 87A is formed in a frame shape. In a plan view, the frame portion 87A is formed to be the same size as the laminate ST (cell ring 90). The frame portion 87A has thickness in the height direction. The inner surface portion 87B is formed to be able to contact the laminate ST (cell ring 90) when the laminate ST (cell ring 90) is stored in the wafer container 80, and the upper surface portion 87C is formed to face the inner surface of the upper surface portion 81A of the lid portion 81. The positioning portion 87D is formed on the frame portion 87A and is arranged to face each other diagonally among the four corners.

[0034] As shown in Figures 3 and 7, the wafer container 80 has an internal space S formed by the space enclosed by the lid 81 and the bottom 84 when the bottom 84 is fitted into the flange 81D of the lid 81. The wafer container 80 stores the laminate ST and the cover 87 in the internal space S. The wafer container 80 is fitted with the lid 81 and the bottom 84 by the storage device 30, which will be described in detail later, so that the laminate ST and the cover 87 are arranged in the internal space S. In addition, the locking portion 81E of the lid 81 is operated by the switching device 29B of the storage device 30 and is locked into the locking portion 84B of the bottom 84.

[0035] Next, the cell ring 90 that forms the laminate ST will be described. The cell ring 90 is, for example, a molded product made of resin. As shown in Figures 8 and 9, the cell ring 90 comprises a rectangular outer frame 91, a holding portion 93, a first channel forming portion 94, and a second channel forming portion 95.

[0036] The outer frame 91 is formed in a rectangular shape, for example, a rectangular or square shape. The holding portion 93 protrudes inward from the outer frame 91. The holding portion 93 supports the wafer W from below. Multiple (for example, four) holding portions 93 are formed. The holding portion 93 protrudes above the outer frame 91, for example, and holds the wafer W above the outer frame 91. The multiple holding portions 93 are arranged to be located on a virtual circumference equal to the diameter of the wafer W. The holding portion 93 supports the wafer W at the horizontal tip of the holding portion 93.

[0037] Furthermore, in two cell rings 90, 90 adjacent to each other in the vertical direction, the cell rings 90 may be designed so that the retaining portions 93, 93 provided in a certain part of the circumferential direction are slightly offset from each other in the circumferential direction. Such circumferential offset between the retaining portions 93, 93 can be achieved by rotating the cell ring 90 by 180°.

[0038] The first channel forming section 94 is connected to a part of the outer frame 91, forming an opening OP that penetrates vertically. The opening OP forms an inert gas channel P1 when the cell rings 90 are stacked (when the stacked body ST is formed). When placed on the ring opener 25, the channel P1 forms an upward channel through which the inert gas supplied via the gas supply section 84E at the bottom 84 flows from below to above. In addition, the gaps between adjacent first channel forming sections 94, 94 in the stacking direction form a supply port for supplying inert gas to the region where the wafer W is held.

[0039] The second channel forming section 95 is connected to a part of the outer frame 91, forming an opening OP that penetrates vertically. When the cell rings 90 are stacked (when the stacked body ST is formed), the opening OP forms an inert gas channel P2. When placed on the ring opener 25, the channel P2 forms a downward channel through which the inert gas supplied via channel P1 flows from top to bottom. In addition, the gaps between adjacent second channel forming sections 95, 95 in the stacking direction form suction ports that draw in inert gas from the area where the wafer W is held. In the storage device 30, the cleanliness can be further enhanced by forming such an inert gas supply path (forming a purging facility).

[0040] At the corners of each cell ring 90, for example, holes 98 and protrusions 99 are provided. One cell ring 90 is stacked on another cell ring 90 that is rotated 180 degrees with respect to the former cell ring 90. At this time, the protrusions 99 of one cell ring 90 are inserted into the holes 98 of the other cell ring 90, thereby positioning the plurality of cell rings 90. As shown in FIG. 9, the plurality of cell rings 90 have the same outer shape and are stacked precisely in the vertical direction. By stacking the plurality of cell rings 90 holding the wafer W, a laminate ST is formed. The plurality of cell rings 90 constitute a container body 90A for storing the wafer W.

[0041] The stacked structure of the plurality of cell rings 90 can be realized by known structures, mechanisms, and / or methods, for example, as disclosed in International Publication No. 2021 / 044791.

[0042] As shown in FIGS. 1 and 2, the storage system 1 includes a transfer device 10, a storage device 50, and a relay device 60. In FIG. 1, for the sake of convenience of explanation, only the lifting part 65 of the relay device 60 is shown.

[0043] The transfer device 10 is a device that takes out the wafer W stored in the FOUP 70 and stores it in the wafer container 80, or takes out the wafer W stored in the wafer container 8 and stores it in the FOUP 70. The transfer device 10 includes a first port 11, a replacement device 20, and a storage device 30.

[0044] The first port 11 is where the FOUP 70 storing the wafer W is placed. The first port is used to transfer the FOUP 70 between the first transport vehicle 2 or an operator and the replacement device 20. The first port 11 is disposed below the track 6 on which the first transport vehicle 2 travels. In the present embodiment, a plurality (for example, four) of the first ports 11 are arranged along the extending direction of the track 6.

[0045] Here, the first transfer vehicle 2 will be described. As shown in FIG. 1, the first transfer vehicle 2 travels in one direction D1 along the track 6 and transfers the FOUP 70. The first transfer vehicle 2 is configured to be able to transfer the FOUP 70. The first transfer vehicle 2 is a ceiling-running unmanned transfer vehicle. The first transfer vehicle 2 includes a main body portion 3, a traveling portion 4, and a transfer vehicle controller 5.

[0046] The main body portion 3 includes a main body frame 3A, a lateral feed portion 3B, a θ drive 3C, a lifting drive portion 3D, a lift table 3E, and a fall prevention cover 3F. The lateral feed portion 3B laterally feeds the θ drive 3C, the lifting drive portion 3D, and the lift table 3E together in a direction perpendicular to the extending direction of the track 6. The θ drive 3C rotates at least one of the lifting drive portion 3D and the lift table 3E within a predetermined angle range in the horizontal plane. The lifting drive portion 3D raises and lowers the lift table 3E by winding or unwinding a suspension member such as a wire, a rope, and a belt.

[0047] The lift table 3E is provided so as to be able to move up and down with respect to the lifting drive portion 3D. A chuck 3Ea is provided on the lift table 3E, and the FOUP 70 can be freely gripped or released. A pair of fall prevention covers 3F are provided, for example, before and after the first transfer vehicle 2 in the traveling direction. The fall prevention cover 3F prevents the FOUP 70 from falling during transfer by causing a claw (not shown) or the like to protrude and retract below the FOUP 70 being transferred.

[0048] The traveling portion 4 is configured to include a motor and the like, and causes the first transfer vehicle 2 to travel along the track 6. The traveling portion 4 has, for example, a power receiving communication portion 4A that receives power from the track 6 side by non-contact power supply. The transfer vehicle controller 5 is an electronic control unit including a CPU (Central Processing Unit), a ROM (Read Only Memory), a RAM (Random Access Memory), and the like. The transfer vehicle controller 5 controls various operations in the first transfer vehicle 2.

[0049] Returning to Figures 1 and 2, the transfer device 20 is a device that retrieves wafers W stored in the FOUP 70 placed on the first port 11, holds each of the retrieved wafers W in a cell ring 90, and transfers the wafers W to the cell rings 90 held at intervals by the storage device 30. The transfer device 20 is also a device that retrieves wafers W from the cell rings 90 held at intervals by the storage device 30 and transfers them to the FOUP 70 placed on the first port 11. The transfer device 20 is mainly composed of a robot arm 21.

[0050] The robot arm 21 retrieves wafers W stored in the FOUP 70 placed on the first port 11, and holds each of the retrieved wafers W in a cell ring 90 housed in a ring opener 25. The robot arm 21 is, for example, a horizontal articulated robot. As shown in Figure 11, the robot arm 21 has two arms 22A, 22B, two slide forks 23A, 23B, and a base 24.

[0051] The two arms 22A and 22B are fixed to the base 24. One end of arm 22A is connected to the upper surface of the base 24, and the other end is connected to the base end of the slide fork 23A. One end of arm 22B is connected to the upper surface of the base 24, and the other end is connected to the base end of the slide fork 23B. The base ends of the two arms 22A and 22B are rotatably provided by a drive unit (not shown). Each of the two slide forks 23A and 23B moves by scooping up the wafer W.

[0052] The robot arm 21 transfers the wafer W to each cell ring 90 supported by the first ring support section 27A and the third ring support section 28A, as described later. More specifically, the slide fork 23A transfers the wafer W to each cell ring 90 supported by the first ring support section 27A, and the slide fork 23B transfers the wafer W to each cell ring 90 supported by the third ring support section 28A. The robot arm 21 is not limited to the above configuration, and various known devices such as an EFEM (Equipment Front End Module) can also be used.

[0053] The storage device 30 holds the wafers W received from the transfer device 20 in the cell rings 90, stacks the wafers W held by the cell rings 90 to form a laminate ST, and stores the formed laminate ST in the wafer container 80. The storage device 30 also removes the laminate ST from the wafer container 80 and opens the gaps between the cell rings 90 that hold the wafers W forming the removed laminate ST, so that the wafers W held by the cell rings 90 can be transferred to the transfer device 20. The storage device 30 includes a ring opener 25 and a container mounting section 29.

[0054] The ring opener 25 is a device for opening (separating) multiple stacked cell rings 90 (laminated ST) in the vertical direction in order to allow the robot arm 21 to access the stacked cell rings 90. The ring opener 25 is also a device for selectively closing (bringing together) the spaces between multiple cell rings 90 in order to stack the vertically opened (separated) cell rings 90 to form a laminate ST, in order to allow the robot arm 21 to access them.

[0055] As shown in Figure 12, the ring opener 25 comprises a base 26A, a lifter (lifting platform) 26B, a pair of ball screws 26C, 26C, a linear guide 26D, a first opening / closing module 27, a second opening / closing module 28, a housing 26E, and a suction device 26F.

[0056] The base 26A is installed at the bottom of the housing 26E. The base 26A houses various mechanisms. The inside of the base 26A is maintained under negative pressure, for example, by an exhaust fan. The lifter 26B is configured to be able to move up and down on the base 26A. Multiple cell rings 90 are arranged on the lifter 26B in a stacked state (stacked body ST). The lifter 26B raises and lowers the stacked body ST, which is supported by the bottom 84. By raising and lowering the stacked body ST placed on the bottom 84, the lifter 26B inserts and removes the stacked body ST into and out of the wafer container 80 through the opening 29C. An elastic member 26Ba is provided on the lifter 26B to support the outer edge of the bottom 84. Examples of elastic members include materials such as rubber. The elastic member 26Ba may be formed in a frame shape along the outer edge of the bottom 84, or it may be intermittent along the outer edge.

[0057] The ball screw 26C is a drive mechanism that drives the lifter 26B. For example, a drive unit that rotates the ball screw 26C around its axis is provided at one end of the ball screw 26C (for example, the end on the base 26A side). The lifter 26B is integrally provided with a female threaded portion (not shown) which is screwed into the ball screw 26C. When the ball screw 26C is rotationally driven by the drive unit, the female threaded portion screwed into the ball screw 26C moves vertically, and the lifter 26B, which is integrally formed with the female threaded portion, moves vertically. Alternatively, another known drive mechanism capable of driving the lifter 26B (for example, a belt drive mechanism) may be used instead of the ball screw 26C. The linear guide 26D guides the raising and lowering of the lifter 26B. The linear guide 26D is fixed to the base 26A.

[0058] The first opening / closing module 27 has a first ring support portion 27A and a second ring support portion 27B capable of supporting the cell ring 90. The second ring support portion 27B supports another cell ring 90 adjacent to the cell ring 90 supported by the first ring support portion 27A, at a position above the holding position of the cell ring 90 supported by the first ring support portion 27A. The first opening / closing module 27 forms a gap between the cell ring 90 supported by the first ring support portion 27A and the cell ring 90 supported by the second ring support portion 27B, through which the slide fork 23A of the robot arm 21 can enter.

[0059] The second opening / closing module 28, like the first opening / closing module 27, has a third ring support portion 28A and a fourth ring support portion 28B capable of supporting the cell ring 90. The fourth ring support portion 28B supports another cell ring 90 adjacent to the cell ring 90 supported by the third ring support portion 28A, at a position above the holding position of the cell ring 90 supported by the third ring support portion 28A. The second opening / closing module 28 forms a gap between the cell ring 90 supported by the third ring support portion 28A and the cell ring 90 supported by the fourth ring support portion 28B, through which the slide fork 23B of the robot arm 21 can enter.

[0060] The housing 26E forms a lifting space S1 through which the stacked body ST is raised and lowered by the lifter 26B. The lifting space S1 is located above the base 26A. The suction device 26F is provided on the housing 26E. The suction device 26F sucks gas from the lifting space S1 through the suction port 26Fa. That is, the suction device 26F sucks up dust and other particles floating in the lifting space S1. The suction port 26Fa of the suction device 26F is located on at least one of the sides and below the lifting space S1. In this embodiment, the suction device 26F is located below the lifting space S1.

[0061] The container mounting section 29 is the part in which the laminated body ST is placed (stored) in the internal space S. The container mounting section 29 is provided on the upper surface 26Ea of the housing 26E. The container mounting section 29 is located above the ring opener 25 (lifter 26B). The container mounting section 29 forms a recessed area from the upper surface 26Ea of the housing 26E. The container mounting section 29 supports the periphery of the lid 81. More specifically, the container mounting section 29 places the periphery of the lid 81 on the outside of the opening 29C through which the laminated body ST, supported by the bottom 84, can pass. An elastic member 29A that supports the periphery of the lid 81 is provided on the container mounting section 29.

[0062] A switching device 29B is provided in the container mounting section 29. The switching device 29B switches between a locked state in which the locking portion 81E locks the bottom portion 84 to the lid portion 81, and an unlocked state in which the locking portion 81E does not lock the bottom portion 84 to the lid portion 81. The switching device 29B is operated by a drive unit (not shown).

[0063] Here, the operation of transferring the wafer W to the cell ring 90 by the ring opener 25 and the operation of storing the laminate ST consisting of the cell ring 90 into the wafer container 80 by the container mounting section 29 will be explained mainly with reference to Figures 12 to 14. First, the operation when storing the wafer W in an empty laminate ST in which no wafer W is held in the container mounting section 29 will be explained. As shown in Figure 13 (1), when an empty laminate ST in which no wafer W is held is placed on the container mounting section 29, the locking section 81E is switched to an unlocked state by the switching device 29B. This releases the engagement between the lid section 81 and the bottom section 84.

[0064] Next, as shown in Figure 13 (2), with the engagement between the lid 81 and the bottom 84 released, the lifter 26B descends to a first predetermined position. When the lifter 26B descends to the first predetermined position and stops, as shown in Figure 14 (3), the fourth ring support portion 28B supports the predetermined cell ring 90. Then, with the fourth ring support portion 28B supporting the predetermined cell ring 90, the lifter 26B descends to a second predetermined position. When the lifter 26B descends to the second predetermined position and stops, the third ring support portion 28A supports the predetermined cell ring 90. As a result, a gap is formed between the cell ring 90 supported by the fourth ring support portion 28B and the cell ring 90 supported by the third ring support portion 28A, into which the slide fork 23B of the robot arm 21 can enter. In this state, the slide fork 23B of the robot arm 21 causes the cell ring 90 to hold the wafer W.

[0065] Next, with the third ring support portion 28A supporting the predetermined cell ring 90, the lifter 26B descends to the third predetermined position. When the lifter 26B descends to the third predetermined position and stops, the second ring support portion 27B supports the predetermined cell ring 90. Then, with the second ring support portion 27B supporting the predetermined cell ring 90, the lifter 26B descends to the fourth predetermined position. When the lifter 26B descends to the fourth predetermined position and stops, the first ring support portion 27A supports the predetermined cell ring 90. As a result, a gap is formed between the cell ring 90 supported by the second ring support portion 27B and the cell ring 90 supported by the first ring support portion 27A, into which the slide fork 23A of the robot arm 21 can enter. In this state, the slide fork 23A of the robot arm 21 causes the cell ring 90 to hold the wafer W.

[0066] Next, the lifter 26B begins to rise. Specifically, the lifter 26B waits at the fourth predetermined position for the first ring support 27A to release its support of the cell ring 90. Once the first ring support 27A releases its support of the cell ring 90, the lifter 26B rises to the third predetermined position and stops, waiting for the second ring support 27B to release its support of the cell ring 90. Once the second ring support 27B releases its support of the cell ring 90, the lifter 26B rises to the second predetermined position and stops, waiting for the third ring support 28A to release its support of the cell ring 90. Once the third ring support 28A releases its support of the cell ring 90, the lifter 26B rises to the first predetermined position and stops, waiting for the fourth ring support 28B to release its support of the cell ring 90.

[0067] As shown in Figure 14 (4), when the support of the cell ring 90 by the fourth ring support portion 28B is released, the lifter 26B rises to the container mounting portion 29 and stops. The lid portion 81 is placed on the container mounting portion 29. The lifter 26B raises and lowers the laminated body ST placed on the bottom portion 84, thereby allowing the laminated body ST to enter the lid portion 81 through the opening 29C. When the laminated body ST enters the lid portion 81, the locking portion 81E is switched to the locked state by the switching device 29B. As a result, the lid portion 81 and the bottom portion 84 are fitted together, and the bottom portion 84 engages with the lid portion 81.

[0068] The storage device 50 is a device for storing wafer containers 80. The storage device 50 has a second port 51, a plurality of storage shelves 53, and a second transport cart (first transport device) 57. The storage device 50 is positioned suspended from the ceiling C of a building such as a factory.

[0069] The second port 51 is where the wafer container 80 is placed. The second port 51 is used to transfer the wafer container 80 between the second transport vehicle 57 and the relay device 60. In the Y direction, the second port 51 is located between the track 59 on which the second overhead transport vehicle 57 travels and the relay device 60. In this embodiment, multiple (for example, four) second ports 51 are arranged along the extending direction of the track 59. The second port 51 supports the lower surface of the bottom 84 of the wafer container 80 from below with a pair of support parts 51A, 51A. In the X direction, the pair of support parts 51A, 51A are spaced apart so that the transfer part 57D of the second transport vehicle 57 can pass through.

[0070] The storage rack 53 stores the wafer container 80. The storage rack 53 supports the lower surface of the bottom 84 of the wafer container 80 from below with a pair of support parts 53A, 53A. In the X direction, the pair of support parts 53A, 53A are spaced apart so that the transfer part 57D of the second transport vehicle 57 can pass through. Multiple storage racks 53 are arranged in the X and Z directions. In this embodiment, three storage racks 53 are arranged in the Z direction, and the uppermost of some of them has the second port 51 as described above. In this embodiment, the storage rack 53 has been described as an open configuration exposed to the outside, but it may also be arranged inside a closed space that is closed off by a wall or the like so that it is not exposed to the outside.

[0071] As shown in Figures 1, 2, and 16, the second transport vehicle 57 transports wafer containers 80 between the second port 51 and the storage racks 53. The second transport vehicle 57 also transports wafer containers 80 between the storage racks 53 in the storage device 50. The second transport vehicle 57 may be deployed as a single unit or as a multiple unit (for example, two units). The second transport vehicle 57 comprises a traveling carriage 57A, two masts 57B, 57B, a lifting platform 57C, and a transfer unit 57D.

[0072] The traveling carriage 57A travels in the X direction along a track 59 suspended from the ceiling C by a traveling drive unit (not shown). The two masts 57B, 57B are rectangular prism-shaped members extending in the Z direction and are spaced apart in the X direction. The lifting platform 57C is stretched across the two masts 57B, 57B. The lifting platform 57C moves up and down along the two masts 57B, 57B by a lifting drive unit (not shown). The lifting platform 57C is provided with a transfer section 57D for transferring wafer containers 80. The transfer section 57D uses, for example, a robot arm to support the lower surface of the bottom 84 of the wafer container 80. The transfer section 57D has a positioning section 57E that protrudes upward.

[0073] As shown in Figures 1 and 2, the relay device 60 transports the wafer container 80 containing the laminate ST between the storage device 30 and the second port 51. The relay device 60 includes a suspension support section 61, a first slide section 62, a second slide section 63, and a lifting section 65.

[0074] The suspension support section 61 is suspended from the ceiling. The suspension support section 61 is a member that supports the first slide section 62 so that it can slide in the X direction. The X direction is the arrangement direction of the first port 11 and the storage rack 53, and the direction of travel of the first transport vehicle 2 and the traveling trolley 57A. The first slide section 62 moves in the X direction by a drive unit (not shown). The first slide section 62 is a member that supports the second slide section 63 so that it can slide in the Y direction. The Y direction is perpendicular to the sliding direction of the first slide section 62. The second slide section 63 moves in the Y direction by a drive unit (not shown). The second slide section 63 raises and lowers the lifting section 65 by winding or unwinding a suspension material 63A such as a wire, rope, or belt.

[0075] The lifting section 65 is provided so as to be able to move up and down relative to the second sliding section 63. The lifting section 65 is provided with a chuck (gripping section) 65A that can freely grip or release the flange 81C of the wafer container 80. The relay device 60 receives the wafer container 80 from one of the two storage devices 30 and delivers the wafer container 80 to one of the four second ports 51. The relay device 60 also receives the wafer container 80 from one of the four second ports 51 and delivers the wafer container 80 to one of the two storage devices 30.

[0076] The effects and advantages of the storage system 1 of the above embodiment will now be explained. In the storage system 1 of the above embodiment, the lid portion 81 is positioned above the lifter 26B with its periphery resting on the outside of the opening 29C through which the laminated body ST, supported on the bottom portion 84, can pass. Therefore, by raising and lowering the laminated body ST placed on the bottom portion 84, the laminated body ST can be inserted into and removed from the wafer container 80 through the opening 29C. As a result, the lid portion 81 can seal off the outside air, thus reducing the risk of foreign matter contamination when storing the laminated body ST in the internal space S of the wafer container 80, which is composed of the lid portion 81 and the bottom portion 84.

[0077] In the storage system 1 of the above embodiment, an elastic member 29A is provided in the container mounting section 29 to support the periphery of the lid 81. As a result, when the lid 81 is placed on the container mounting section 29, the space between the container mounting section 29 and the lid 81 is sealed. Consequently, when storing the laminate ST in the internal space S of the wafer container 80, which is composed of the lid 81 and the bottom 84, the inclusion of foreign matter can be effectively reduced.

[0078] In the storage system 1 of the above embodiment, an elastic member 26Ba is provided on the lifter 26B to support the outer edge of the bottom portion 84. As a result, when the bottom portion 84 is placed on the lifter 26B, the internal space S between the bottom portion 84 and the lifter 26B is sealed. This prevents foreign matter adhering to the bottom portion 84 from being scattered into the internal space S during the lifting and lowering operation.

[0079] In the storage system 1 of the above embodiment, the storage device 30 includes a housing 26E that forms a lifting space S1 in which the stacked body ST is raised and lowered by a lifter 26B, and a suction device 26F provided in the housing 26E that sucks up gas from the lifting space S1. This makes it possible to suck up and remove foreign matter floating in the lifting space S1.

[0080] In the above embodiment, the suction device 26F of the storage system 1 is positioned on at least one of the sides and below the lifting space S1. This configuration allows for effective suction of foreign matter floating in the lifting space S1.

[0081] The storage device 30 of the storage system 1 in the above embodiment has a switching device 29B that switches between a locked state in which the locking portion 81E locks the bottom portion 84 to the lid portion 81 and an unlocked state in which the locking portion 81E does not lock the bottom portion 84 to the lid portion 81. With this configuration, the lid portion 81 and the bottom portion 84 can be securely fixed, and the sealed state of the internal space S of the wafer container 80 can be maintained.

[0082] In the storage system 1 of the above embodiment, the wafer container 80 has a bottom portion 84 and a lid portion 81 in contact with each other via an elastic member 84F when locked. In this configuration, when the bottom portion 84 and the lid portion 81 are fixed, the internal space S of the wafer container 80 is sealed, so that foreign matter does not enter the internal space S.

[0083] In the storage system 1 of the above embodiment, the lid 81 of the wafer container 80 has a flange 81C formed on it, which is gripped by a chuck 65A. This allows the relay device 60 to properly grip the wafer container 80 by supporting the flange 81C. Furthermore, the flange 81C is formed to protrude from the lateral portion 81B of the lid 81. As a result, compared to the case where the flange is formed to protrude upward from the upper surface portion 81A of the lid 81, the increase in the vertical dimension of the wafer container 80 can be reduced. Consequently, the wafer containers 80 can be stored at high density in the storage device 50, etc.

[0084] In the storage system 1 of the above embodiment, a recess 84G is formed on the lower surface of the bottom 84 of the wafer container 80 used, which fits into a positioning portion 57E formed on the transfer portion 57D and protruding upward. In this configuration, when the second transport vehicle 57 moves the wafer container 80 by supporting the bottom 84 of the wafer container 80 from below, the wafer container 80 can be moved while being properly positioned.

[0085] Although one embodiment has been described above, one aspect of the present invention is not limited to the above embodiment. Various modifications are possible without departing from the spirit of the invention.

[0086] In the above embodiment of the storage system 1, the first transport vehicle 2 is configured to travel along a track 6 extending in the X direction, and the relay device 60 is configured to move along the X direction. However, the system is not limited to this example. For example, as shown in Figure 17, the first transport vehicle 2 may be configured to travel along a track 6 extending in the Y direction, and the relay device 60 may also be configured to move along the Y direction. In such a modified storage system 1, in an arrangement where the arrangement direction of the plurality of storage shelves 53 and the arrangement direction of the first port 11 are orthogonal to each other, the relay device 60 can appropriately relay wafer containers 80 between the transfer device 20 and the second port 51.

[0087] In addition to the configuration of the storage system 1 in the above embodiment and the above modified example, the relay device 60 may further have a rotating part 63B (see Figure 2) that rotates the chuck 65A around an axis extending vertically relative to the first slide part 62. This configuration increases the degree of freedom in arranging the storage device 50 relative to the storage device 30.

[0088] In the above embodiment and the modified storage system 1, an example was given in which one transfer device 20, one storage device 30, and one relay device 60 are provided. However, depending on the scale of the system, at least one of the transfer device 20, storage device 30, and relay device 60 may be provided in multiple units. This makes it possible to store wafers W more efficiently in accordance with the cycle time requirements.

[0089] In addition to the configuration of the storage system 1 of the above embodiment and the above modified example, a pre-device storage device 40 as shown in Figures 18, 19(A), and 19(B) may be provided. The pre-device storage device 40 comprises a plurality (for example, four) of buffers 42, a plurality (for example, two) of load ports 43, a transfer device 46, and a drive device 47.

[0090] The buffer 42 is a shelf for storing wafer containers 80 and is configured to hold the wafer containers 80. The buffer 42 is fixed to a support member 41, for example, which is fixed to a housing that houses the transfer device 20 and the storage device 30. The buffer 42 is located in the space above the storage device 30. The load port 43 is a shelf for transferring wafer containers 80 between the pre-storage device 40 and the relay device 60. The load port 43 is configured to hold wafer containers 80. Similar to the buffer 42, the load port 43 is fixed to a support member 41 and is located in the space above the storage device 30.

[0091] The transfer device 46 lifts the wafer container 80 placed on the container mounting section 29, buffer 42, and load port 43, and places the wafer container 80 on the container mounting section 29, buffer 42, and load port 43. The transfer device 46 has, for example, two arms 46A, 46A configured to move vertically, and the two arms 46A, 46A transfer the wafer container 80 by supporting the flange 81C of the lid portion 81 of the wafer container 80 from below. The drive device 47 moves the transfer device 46 along guides that extend, for example, horizontally and vertically. The drive device 47 moves the transfer device 46 between the container mounting section 29 and buffer 42, between the container mounting section 29 and load port 43, between buffer 42 and load port 43, and between one load port 43 and another load port 43. The transfer device 46 and the drive device 47 are supported by a housing 45 located on the opposite side of the storage device 30 from the side where the replacement device 20 is located.

[0092] Furthermore, the support member 41 that fixes the buffer 42 may not be fixed to the housing that houses the transfer device 20 and the storage device 30, but may be integrally formed with the housing 45. Also, the housing 45 integrally formed with the support member 41 may have wheels or the like that roll on the floor. In a storage system 1 with such a configuration, the pre-device storage device 40 can be attached to and detached from the housing that houses the transfer device 20 and the storage device 30.

[0093] In this modified configuration, wafer containers 80 intended for relatively long-term storage can be stored on the storage shelves 53 of the storage device 50, while wafer containers 80 intended for relatively short-term retrieval can be stored in the buffer 42 of the pre-storement device 40. As a result, wafer containers 80 intended for relatively short-term retrieval can be retrieved in a shorter time than wafer containers 80 intended for relatively long-term storage.

[0094] Furthermore, the transfer device 46 and the drive device 47 only need to be configured to move the wafer container 80, and are not limited to the configuration described above. Also, even if the pre-stored device 40 is replaced with a configuration in which multiple mounting sections (third mounting sections) that can be transferred by the relay device 60 of the above embodiment are provided, the above-described effects can still be obtained.

[0095] In the above embodiment and the above modified example of the storage system 1, the storage device 50 is equipped with a second transport cart 57 for transporting wafer containers 80 within the storage device 50. However, as shown in Figure 20, for example, the second overhead transport cart 57 does not necessarily have to be provided. In this case, for example, the relay device 60 described above may take on the role of the second transport cart 57, and the relay device 60 may be configured to directly transfer the wafers to the storage shelves 53 of the storage device 50.

[0096] In the above embodiment and the modified storage system 1, an example was given in which a purging facility is formed in the storage device 30 to further improve the cleanliness inside the storage device 30, but the system is not limited to this. Such a purging facility does not have to be formed in the storage device 30, and may be formed not only in the storage device 30, but also in the space in which the storage device 50 and the transfer device 20 are stored.

[0097] In the above embodiments and modifications, the second transport vehicle 57 with the configuration shown in Figure 16 was used as an example, but the invention is not limited thereto. For example, the second transport vehicle 57 may have the same configuration as the first overhead transport vehicle 2 shown in Figure 10. In this case, instead of or in addition to the storage racks 53 arranged to the side of the second transport vehicle 57, a storage rack 53 on which wafer containers 80 can be placed may be provided below the second transport vehicle 57. Furthermore, the second transport vehicle 57 may not be suspended from the ceiling, but may be configured to travel on a track.

[0098] In the storage device 30 of the above embodiment and the above modified example of the storage system 1, an example was given in which an elastic member 29A is provided on the container mounting section 29 to support the periphery of the lid 81. However, the elastic member 29A may not be provided, and the container mounting section 29 may directly support the periphery of the lid 81. Also, in the example given in which an elastic member 26Ba is provided on the lifter 26B to support the outer edge of the bottom 84 of the wafer container 80. However, the elastic member 26Ba may not be provided, and the lifter 26B may directly support the outer edge of the bottom 84. Furthermore, in the example given in which the bottom 84 and the lid 81 of the wafer container 80 are in contact with each other via an elastic member 84F when locked, the elastic member 84F may not be provided, and the bottom 84 and the lid 81 may be in direct contact.

[0099] 1...Storage system, 2...First overhead transport vehicle, 10...Transfer device, 11...First port, 20...Replacement device, 21...Robot arm, 25...Ring opener, 26B...Lifter (lifting platform), 26Ba...Elastic member, 26F...Suction device, 29...Container placement section, 29A...Elastic member, 29B...Switching device, 29C...Opening, 30...Storage device, 40...Pre-device storage device, 42...Buffer, 43...Load port, 50...Storage device, 51...Second port 53...Storage shelf, 57...Second overhead transport vehicle (first transport device), 60...Transfer device (second transport device), 61...Suspension support part, 62...First slide part, 63...Second slide part, 63B...Rotating part, 65A...Chuck (gripping part), 70...FOUP, 80...Wafer container (container), 81...Lid part, 84...Bottom part, 87...Cover part, 90...Cell ring (holding member), 90A...Container body, S...Internal space, S1...Lifting space, ST...Laminate, W...Wafer.

Claims

1. A storage system comprising: a laminate in which a plurality of holding members, each capable of holding a single wafer, are stacked vertically; a container for storing the laminate; a transfer device capable of transferring the wafer to the holding members constituting the laminate; and a storage device capable of loading and unloading the laminate into and out of the container, wherein the container has a lid portion having an upper portion covering the top of the laminate and a lateral portion covering the sides of the laminate, and a bottom portion having a lower portion supporting the laminate from below and capable of engaging with the lid portion, and the laminate is stored in an internal space formed by the lid portion and the bottom portion when the lid portion and the bottom portion are engaged; the storage device has a lifting platform for raising and lowering the laminate supported by the bottom portion, and a container mounting portion positioned above the lifting platform for placing the periphery of the lid portion from the outside of an opening through which the laminate supported by the bottom portion can pass, and the lifting platform raises and lowers the laminate placed on the bottom portion, thereby loading and unloading the laminate into and out of the container through the opening.

2. The storage system according to claim 1, wherein an elastic member is provided in the container mounting section to support the periphery of the lid.

3. The storage system according to claim 1 or 2, wherein an elastic member is provided on the lifting platform to support the outer edge of the bottom.

4. The storage system according to claim 1 or 2, comprising: a housing that forms a lifting space in which the stacked body moves up and down by the lifting platform; and a suction device provided in the housing for sucking gas from the lifting space.

5. The storage system according to claim 4, wherein the suction device is located at least one of the sides and below the lifting space.

6. The storage system according to claim 1 or 2, wherein the container has a locking portion for locking the bottom portion to the lid, and the storage device has a switching device for switching between a locked state in which the locking portion locks the bottom portion to the lid and an unlocked state in which the locking portion does not lock the bottom portion to the lid.

7. The storage system according to claim 6, wherein, in the locked state, the bottom and the lid of the container are in contact with each other via an elastic member.

8. The storage system according to claim 1 or 2, further comprising: a plurality of storage shelves for storing the containers; and a first conveying device for transporting the containers between the plurality of storage shelves, wherein the first conveying device has a transfer section for supporting the containers from below.

9. The storage system according to claim 1 or 2, further comprising a second transport device for transporting the containers between a plurality of storage shelves for storing the containers and the container placement section, wherein the second transport device has a gripping section for gripping the containers.

10. The storage system according to claim 9, wherein the lid portion has a flange that protrudes laterally from the lateral portion and is gripped by the gripping portion.

11. The storage system according to claim 8, wherein a recess is formed on the lower surface of the bottom portion, which fits into a positioning portion formed in the transfer portion and protruding upward.

Images