Method for tungsten-based thin film deposition via fabrication and decomposition of precursor metastable complexes (molecular species)

The controlled generation and delivery of vapor phase metastable complexes address the need for precise tungsten-based thin film deposition on thermally fragile substrates, achieving high-quality films with controlled composition and morphology at reduced temperatures.

WO2026106846A1PCT designated stage Publication Date: 2026-05-21KALARK NANOSTRUCTURE SCIENCES INC
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Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
KALARK NANOSTRUCTURE SCIENCES INC
Filing Date
2025-11-05
Publication Date
2026-05-21

AI Technical Summary

Technical Problem

The challenge in semiconductor and hetero-device manufacturing is the need for a low-temperature process to deposit tungsten-based thin films with precise composition, morphology, structure, and thickness, while avoiding thermal degradation and halide-induced reactions, especially on thermally fragile substrates and materials.

Method used

A method involving the controlled generation and delivery of vapor phase metastable complexes from tungsten source precursors, using temperature and plasma conditions to form tungsten-based thin films on substrates at reduced temperatures, preventing self-reaction and ensuring precise film conformality and composition.

Benefits of technology

Enables the deposition of high-quality tungsten-based thin films on various substrates, including thermally fragile materials, with controlled composition, morphology, and thickness, while maintaining low processing temperatures below 600°C.

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Abstract

A method and system are provided for the low temperature deposition of tungsten (W) and W-based thin films through the planned and engineered ex-situ or in-situ creation of vapor phase mctastablc clusters or mctastablc complexes to achieve precise film conformality, composition, morphology, structure, and thickness. The tungsten based thin film deposition techniques include chemical vapor deposition (CVD), atomic layer deposition (ALD), pulsed CVD, molecular layer deposition (MED), self-assembled monolayer (SAM) deposition, and Click chemistry deposition (CCD).
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