System, method, and computer program product for integrated manufacturing using metrology

The integration of metrology sensors in laser processing systems provides real-time feedback for immediate adjustments, addressing manufacturing bottlenecks and reducing waste in laser processing by ensuring parts meet specifications during production.

WO2026107064A1PCT designated stage Publication Date: 2026-05-21AEROTECH
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Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
AEROTECH
Filing Date
2025-11-12
Publication Date
2026-05-21

AI Technical Summary

Technical Problem

Laser processing of products, such as medical device hypotubes, often involves lengthy feedback loops and manual inspections, leading to manufacturing bottlenecks, increased scrap, and waste due to latency in determining whether parts meet specifications.

Method used

An integrated manufacturing system that incorporates metrology sensors to provide real-time feedback to the laser processing system, allowing for immediate adjustments based on measurements compared to predetermined templates, reducing the need for manual inspection and minimizing bottlenecks.

Benefits of technology

Enhances manufacturing efficiency by minimizing waste and latency, improving the production of laser-processed products by integrating metrology directly into the laser processing system.

✦ Generated by Eureka AI based on patent content.

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Abstract

Provided is a system for integrated manufacturing using metrology, that comprises at least one processor configured to: receive data associated with a measurement of a working piece from a metrology sensor based on the working piece being processed by a laser processing system; compare the measurement of the working piece to a predetermined template associated with the working piece; and transmit a feedback signal to the laser processing system based on comparing the data associated with the measurement of the working piece to the predetermined template associated with the working piece, wherein the feedback signal comprises data associated with a difference between the measurement of the working piece and the predetermined template associated with the working piece. Methods and computer program products are also disclosed.
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Description

Attorney Ref. 00005-2503870SYSTEM, METHOD, AND COMPUTER PROGRAM PRODUCT FOR INTEGRATED MANUFACTURING USING METROLOGYCROSS REFERENCE TO RELATED APPLICATION

[0001] The present application claims the benefit of United States Provisional Patent Application No. 63 / 719,388, filed on November 12, 2024, the disclosure of which is hereby incorporated by reference in its entirety.BACKGROUND1. Field

[0002] This disclosure relates generally to manufacturing processes and, in particular, to systems, methods, and computer program products for integrated manufacturing using metrology.2. Technical Considerations

[0003] Laser processing of products, such as tubes, has become a widely used process in the manufacturing of various products. Laser processing systems may offer several advantages over other manufacturing systems. Lasers used in laser processing systems provide a versatile set of capabilities, including cutting, machining, etching, drilling, welding, texturing, marking, and / or joining materials. Additionally, laser processing may require minimal consumables, operate through non-contact machining, and ensure consistent and / or highly reproducible parts. All of these attributes make laser processing an ideal choice for manufacturing various types of products.

[0004] Laser processing of products may present unique manufacturing challenges compared to other manufacturing methods. Laser processing of products to create finished products often involves multiple complex steps, which can vary depending on the specific part and / or manufacturer. In at least some instances, laser processing may require a step of determining whether a part of a product is within predetermined specifications. A primary detection method for determining whether the part is within specification may include manual inspection of the part. In some instances, manual inspection of the part as processed may involve the use of basic microscopes.

[0005] However, in high-volume production of products, such as medical device hypotubes, inspection, whether manual, automated, or otherwise, is often a manufacturing bottleneck and requires a trained operator to identify defects. Furthermore, at the point of an inspection, muchPage 1 of 315Y96705.DOCXAttorney Ref. 00005-2503870of the work-in-progress involved in laser processing, including processing time and labor, may all be wasted if the part is not within the specification. Inspections may occur well downstream from the laser processing. Consequently, there is a lengthy feedback loop between identifying errors and implementing adjustments in manufacturing. As a result, manufacturers may experience reduced overall manufacturing efficiency when producing laser-processed products.

[0006] Additionally, laser processing methods that involve multiple steps between processing and inspection, may result in significant latency when determining whether parts meet specifications and when making subsequent manual adjustments to a laser cutting process. Given the relatively high cost of materials used in these products, this latency often leads to increased scrap and waste of work-in-process (WIP).SUMMARY

[0007] Accordingly, disclosed are systems, methods, and computer program products that provide for integrated manufacturing using metrology.

[0008] Further non-limiting embodiments or aspects will be set forth in the following numbered clauses:

[0009] Clause 1: A method for integrated manufacturing using metrology, comprising: receiving, with at least one processor, data associated with a measurement of a working piece from a metrology sensor based on the working piece being processed by a laser processing system; comparing, with the at least one processor, the measurement of the working piece to a predetermined template associated with the working piece; and transmitting, with the at least one processor, a feedback signal to the laser processing system based on comparing the data associated with the measurement of the working piece to the predetermined template associated with the working piece, wherein the feedback signal comprises data associated with a difference between the measurement of the working piece and the predetermined template associated with the working piece.

[0010] Clause 2: The method of clause 1, wherein receiving the data associated with the measurement of the working piece from the metrology sensor comprises: receiving the data associated with the measurement of the working piece in substantially real time as the working piece is being processed by the laser processing system.

[0011] Clause 3: The method of clauses 1 or 2, further comprising: adjusting the laser processing system based at least on the feedback signal.Page 2 of 315Y96705.DOCXAttorney Ref. 00005-2503870

[0012] Clause 4: The method of any of clauses 1-3, wherein the metrology sensor is positioned adjacent to a laser delivery device of the laser processing system and a fixturing device of the laser processing system, and wherein the metrology sensor is positioned to measure the working piece after the working piece is processed by the laser processing system.

[0013] Clause 5: The method of any of clauses 1-4, wherein comparing the measurement of the working piece to the predetermined template associated with the working piece comprises: comparing the measurement of the working piece to a threshold value of a measurement associated with the predetermined template.

[0014] Clause 6: The method of any of clauses 1-5, further comprising: completing processing of the working piece based on determining that the measurement of the working piece corresponds to the predetermined template associated with the working piece.

[0015] Clause 7: The method of any of clauses 1-6, wherein the metrology sensor is a noncontact sensor.

[0016] Clause 8: The method of any of clauses 1-7, wherein the non-contact sensor comprises at least one of the following: a confocal microscope; a digital imaging equipment; a confocal three-dimensional sensor; a white light sensor; a focal sensor; or any combination thereof.

[0017] Clause 9: A system for integrated manufacturing using metrology, comprising: at least one processor configured to: receive data associated with a measurement of a working piece from a metrology sensor based on the working piece being processed by a laser processing system; compare the measurement of the working piece to a predetermined template associated with the working piece; and transmit a feedback signal to the laser processing system based on comparing the data associated with the measurement of the working piece to the predetermined template associated with the working piece, wherein the feedback signal comprises data associated with a difference between the measurement of the working piece and the predetermined template associated with the working piece.

[0018] Clause 10: The system of clause 9, further comprising: the laser processing system, wherein the laser processing system comprises a laser delivery device; and a measurement system, wherein the measurement system comprises: the at least one processor; the metrology sensor; and a motion system, wherein the motion system is configured to impart motion to the working piece after the working piece is processed by the laser processing system.

[0019] Clause 11 : The system of clauses 9 or 10, wherein the working piece comprises a tube material, and wherein the laser delivery device is configured to: perform laser processing operations on the tube material as the tube material is held in place by a fixturing device.Page 3 of 315Y96705.DOCXAttorney Ref. 00005-2503870

[0020] Clause 12: The system of any of clauses 9-11, wherein the at least one processor is further configured to: adjust the laser processing system based at least on the feedback signal.

[0021] Clause 13: The system of any of clauses 9-12, wherein, when adjusting the laser processing system, the at least one processor is configured to: adjust processing parameters of a laser delivery device of the laser processing system in relation to the working piece based on the feedback signal.

[0022] Clause 14: The system of any of clauses 9-13, wherein, when receiving the data associated with the measurement of the working piece from the metrology sensor, the at least one processor is configured to: receive the data associated with the measurement of the working piece in substantially real time as the working piece is being processed by the laser processing system.

[0023] Clause 15: The system of any of clauses 9-14, wherein, when receiving the data associated with the measurement of the working piece in substantially real time as the working piece is being processed by the laser processing system, the at least one processor is configured to: receive the data associated with the measurement of the working piece from a second sensor in substantially real time as the working piece is being processed by the laser processing system, wherein the second sensor is positioned on a laser delivery device of the laser processing system.

[0024] Clause 16: The system of any of clauses 9-15, wherein the metrology sensor is positioned adjacent to a laser delivery device of the laser processing system and a fixturing device of the laser processing system, and wherein the metrology sensor is positioned to measure the working piece after the working piece is processed by the laser processing system.

[0025] Clause 17: The system of any of clauses 9-16, wherein, when comparing the measurement of the working piece to the predetermined template associated with the working piece, the at least one processor is configured to: compare the measurement of the working piece to a threshold value of a measurement associated with the predetermined template.

[0026] Clause 18: The system of any of clauses 9-17, wherein the at least one processor is further configured to: complete processing of the working piece based on determining that the measurement of the working piece corresponds to the predetermined template associated with the working piece.

[0027] Clause 19: The system of any of clauses 9-18, wherein the metrology sensor is a noncontact sensor.

[0028] Clause 20: The system of any of clauses 9-19, wherein the non-contact sensor comprises at least one of the following: a confocal microscope; a digital imaging equipment; a Page 4 of 315Y96705.DOCXAttorney Ref. 00005-2503870confocal three-dimensional sensor; a white light sensor; a focal sensor; or any combination thereof.

[0029] Clause 21: A non-transitory computer readable medium for integrated manufacturing using metrology, wherein the computer readable medium comprises one or more instructions that, when executed by at least one processor, cause the at least one processor to: receive data associated with a measurement of a working piece from a metrology sensor based on the working piece being processed by a laser processing system; compare the measurement of the working piece to a predetermined template associated with the working piece; and transmit a feedback signal to the laser processing system based on comparing the data associated with the measurement of the working piece to the predetermined template associated with the working piece, wherein the feedback signal comprises data associated with a difference between the measurement of the working piece and the predetermined template associated with the working piece.

[0030] Clause 22: The non-transitory computer readable medium of clause 21, wherein the one or more instructions that cause the at least one processor to receive the data associated with the measurement of the working piece from the metrology sensor, cause the at least one processor to: receive the data associated with the measurement of the working piece in substantially real time as the working piece is being processed by the laser processing system.

[0031] These and other features and characteristics of the present disclosure, as well as the methods of operation and functions of the related elements of structures and the combination of parts and economies of manufacture, will become more apparent upon consideration of the following description and the appended claims with reference to the accompanying drawings, all of which form a part of this specification, wherein like reference numerals designate corresponding parts in the various figures. It is to be expressly understood, however, that the drawings are for the purpose of illustration and description only and are not intended as a definition of the limits of the disclosed subject matter.BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Additional advantages and details of non-limiting embodiments are explained in greater detail below with reference to the exemplary embodiments that are illustrated in the accompanying schematic figures, in which:

[0033] FIG. 1A is a diagram of a non-limiting embodiment of an environment in which systems, methods, and / or computer program products described herein, may be implemented according to the present disclosure;Page 5 of 315Y96705.DOCXAttorney Ref. 00005-2503870

[0034] FIG. IB is a diagram of a non-limiting embodiment of a metrology system;

[0035] FIG. 2 is a diagram of a non-limiting embodiment of components of one or more devices and / or one or more systems of FIGS. 1A and IB;

[0036] FIG. 3 is a flowchart of a non-limiting embodiment of a process for integrated manufacturing using metrology;

[0037] FIGS. 4A-4B are diagrams of an overview of an example implementation;

[0038] FIG. 5 is a diagram of a non-limiting embodiment of a laser cutting head; and

[0039] FIGS. 6A-6D are diagrams of an overview of an example implementation.DESCRIPTION

[0040] For purposes of the description hereinafter, the terms “end,” “upper,” “lower,” “right,” “left,” “vertical,” “horizontal,” “top,” “bottom,” “lateral,” “longitudinal,” and derivatives thereof shall relate to the disclosure as it is oriented in the drawing figures. However, it is to be understood that the disclosure may assume various alternative variations and step sequences, except where expressly specified to the contrary. It is also to be understood that the specific devices and processes illustrated in the attached drawings, and described in the following specification, are simply exemplary embodiments of the disclosure. Hence, specific dimensions and other physical characteristics related to the embodiments or aspects disclosed herein are not to be considered as limiting unless otherwise indicated.

[0041] No aspect, component, element, structure, act, step, function, instruction, and / or the like used herein should be construed as critical or essential unless explicitly described as such. Also, as used herein, the articles “a” and “an” are intended to include one or more items and may be used interchangeably with “one or more” and “at least one.” Furthermore, as used herein, the term “set” is intended to include one or more items (e.g., related items, unrelated items, a combination of related and unrelated items, and / or the like) and may be used interchangeably with “one or more” or “at least one.” Where only one item is intended, the term “one” or similar language is used. Also, as used herein, the terms “has,” “have,” “having,” or the like are intended to be open-ended terms. Further, the phrase “based on” is intended to mean “based at least partially on” unless explicitly stated otherwise. In addition, reference to an action being “based on” a condition may refer to the action being “in response to” the condition. For example, the phrases “based on” and “in response to” may, in some non-limiting embodiments or aspects, refer to a condition for automatically triggering an action (e.g., a specific operation of an electronic device, such as a computing device, a processor, and / or the like).Page 6 of 315Y96705.DOCXAttorney Ref. 00005-2503870

[0042] As used herein, the term “communication” may refer to the reception, receipt, transmission, transfer, provision, and / or the like of data (e.g., information, signals, messages, instructions, commands, and / or the like). For one unit (e.g., a device, a system, a component of a device or system, combinations thereof, and / or the like) to be in communication with another unit means that the one unit is able to directly or indirectly receive information from and / or transmit information to the other unit. This may refer to a direct or indirect connection (e.g., a direct communication connection, an indirect communication connection, and / or the like) that is wired and / or wireless in nature. Additionally, two units may be in communication with each other even though the information transmitted may be modified, processed, relayed, and / or routed between the first and second units. For example, a first unit may be in communication with a second unit even though the first unit passively receives information and does not actively transmit information to the second unit. As another example, a first unit may be in communication with a second unit if at least one intermediary unit processes information received from the first unit and communicates the processed information to the second unit. In some non-limiting embodiments or aspects, a message may refer to a network packet (e.g., a data packet and / or the like) that includes data. It will be appreciated that numerous other arrangements are possible.

[0043] As used herein, the term “computing device” may refer to one or more electronic devices configured to process data. In some non-limiting embodiments, computing device may, in some examples, include the necessary components to receive, process, and output data, such as a processor, a display, a memory, an input device, a network interface, and / or the like. In some non-limiting embodiments, computing device may be a mobile device. As an example, a mobile device may include a cellular phone (e.g., a smartphone or standard cellular phone), a portable computer, a wearable device (e.g., watches, glasses, lenses, clothing, and / or the like), a personal digital assistant (PDA), and / or other like devices. In some non-limiting embodiments, computing device may also be a desktop computer or other form of non-mobile computer.

[0044] As used herein, the term “server” may refer to or include one or more computing devices that are operated by or facilitate communication and processing for multiple parties in a network environment, such as the Internet, although it will be appreciated that communication may be facilitated over one or more public or private network environments and that various other arrangements are possible. Further, multiple computing devices (e.g., servers, point-of-sale (POS) devices, mobile devices, etc.) directly or indirectly communicating in the network environment may constitute a “system.”Page 7 of 315Y96705.DOCXAttorney Ref. 00005-2503870

[0045] As used herein, the term “system” may refer to one or more computing devices or combinations of computing devices (e.g., processors, servers, client devices, software applications, components of such, and / or the like). Reference to “a device,” “a server,” “a processor,” and / or the like, as used herein, may refer to a previously-recited device, server, or processor that is recited as performing a previous step or function, a different device, server, or processor, and / or a combination of devices, servers, and / or processors. For example, as used in the specification and the claims, a first device, a first server, or a first processor that is recited as performing a first step or a first function may refer to the same or different device, server, or processor recited as performing a second step or a second function.

[0046] Some non-limiting embodiments or aspects may be described herein in connection with thresholds. As used herein, satisfying a threshold may refer to a value being greater than the threshold, more than the threshold, higher than the threshold, greater than or equal to the threshold, less than the threshold, fewer than the threshold, lower than the threshold, less than or equal to the threshold, equal to the threshold, within a threshold range, outside a threshold range, etc.

[0047] Systems, methods, and computer program products are disclosed that provide solutions to the above mentioned challenges. For example, as disclosed herein, a metrology system for integrated manufacturing using metrology may include a processor and a metrology sensor. In some non-limiting embodiments, the processor may receive data from the metrology sensor of the system. For example, the data can be a measurement of a working piece being processed (e.g., cut, drilled, welded, textured, marked, joined, etc.) by a laser processing system. In some non-limiting embodiments, the processor of the system may compare the measurement of the working piece to a predetermined template (e.g., one or more desired specifications, measurements, finishes, tolerances, acceptable ranges, etc.) associated with the working piece. In some non-limiting embodiments, the predetermined template may have certain tolerances that may define acceptable deviations from the desired specifications within which the working piece is considered to meet the predetermined template. In some non-limiting embodiments, each processor may transmit a feedback signal (e.g., a signal, data, message, command, indicator, instruction, notification, communication, information, etc.) to the laser processing system based on comparing the data associated with the measurement of the working piece to the predetermined template associated with the working piece. In some non-limiting embodiments, the feedback signal may comprise data associated with a difference between the measurement of the working piece and the predetermined template associated with the working piece.Page 8 of 315Y96705.DOCXAttorney Ref. 00005-2503870

[0048] In some non-limiting embodiments, the system may include the laser processing system and a measurement system. Furthermore, the laser processing system may include a laser delivery device (e.g., a laser cutting head). In some non-limiting embodiments, the measurement system may include the processor, the metrology sensor, and a motion system that is configured to impart motion to the working piece before, during, and / or after the working piece is processed by the laser processing system.

[0049] In some non-limiting embodiments, the working piece may include a tube material and the laser delivery device may perform cutting operations on the tube material as the tube material is held in place by a fixturing device (e.g., a steady rest bushing).

[0050] In some non-limiting embodiments, the processor may adjust the laser processing system based on at least the feedback signal. Furthermore, when adjusting the laser processing system, the processor may adjust processing parameters of the laser delivery device of the laser processing system in relation to the working piece based on the feedback signal. For example, when adjusting the laser processing system, the processor may realign a laser cutting head of the laser processing system in relation to the working piece based on at least the feedback signal. In some non-limiting embodiments, the processor may adjust the laser processing system based on the feedback signal to satisfy a threshold or conform to the predetermined template.

[0051] In some non-limiting embodiments, the processor may receive the data associated with the measurement of the working piece in substantially real time as the working piece is being cut by the laser processing system. In some non-limiting embodiments, substantially real time may refer to the processor receiving data within time intervals as short as 1 second, l / 10 second, 1 / 100 second, 1 / 1000 second, or even faster, or within a period corresponding to the processing of one or more working pieces, allowing the system to detect potential defects before they occur, as they occur, and / or immediately after they occur, and to adjust processing parameters accordingly to satisfy a threshold of a predetermined template in the same piece and / or subsequent pieces. Furthermore, the processor may receive the data associated with the working piece from a second sensor (e.g., a camera sensor) in substantially real time, as the working piece is being processed by the laser processing system. For example, the camera sensor may be positioned on the laser delivery device of the laser processing system.

[0052] In some non-limiting embodiments, the metrology sensor is positioned adjacent to the laser delivery device and / or the fixturing device, such that the metrology sensor is positioned to measure the working piece after the working piece is processed by the laser processing system.Page 9 of 315Y96705.DOCXAttorney Ref. 00005-2503870

[0053] In some non-limiting embodiments, the processor may compare the measurement of the working piece to a threshold value of a measurement associated with the predetermined template.

[0054] In some non-limiting embodiments, the processor may complete processing of the working piece based on determining that the measurement of the working piece corresponds to the predetermined template associated with the working piece. In some non-limiting embodiments, the processor may complete processing once a threshold is satisfied. For example, the processor may complete processing once the working piece is within tolerance. In some non-limiting embodiments, the processor may retain adjustments to the laser processing system for future and / or subsequent working pieces (e.g., a second working piece).

[0055] In some non-limiting embodiments, the metrology sensor may be a non-contact sensor. In some non-limiting embodiments, the metrology sensor may include a confocal microscope, a digital imaging equipment, a confocal three-dimensional sensor, a white light sensor, a focal sensor, or any combination thereof.

[0056] The present disclosure enhances manufacturing efficiency by integrating metrology directly into the laser processing system, reducing or eliminating the need for manual inspection during processing (e.g., cutting, machining, etching, etc.). Unlike traditional automated inspections that occur downstream of laser cutting, this integrated approach minimizes manufacturing bottlenecks and / or eliminates the need for trained operators to identify defects during processing. As a result, overall efficiency in producing laser-cut products is improved.

[0057] Referring now to FIG. 1 A, FIG. 1 A is a diagram of a non-limiting embodiment of an environment 100 in which devices, systems, methods, and / or computer program products, described herein, may be implemented. As shown in FIG. 1A, environment 100 includes metrology system 102, laser processing system 104, measurement system 106, and communication network 108.

[0058] Metrology system 102 may include one or more devices capable of receiving information from and / or communicating information (e.g., directly via wired or wireless communication connection, indirectly via communication network 108, etc.) to laser processing system 104 and / or measurement system 106 via communication network 108. For example, model metrology system 102 may include a computing device, a server, a group of servers, a cloud platform, and / or other like devices. In some non-limiting embodiments, metrology system 102 may include one or more devices capable of being in communication with laser processing system 104 and / or measurement system 106 via communication network Page 10 of 315Y96705.DOCXAttorney Ref. 00005-2503870108. For example, metrology system 102 may include a server, a group of servers, such as a cloud-based solution that includes a plurality of servers (e.g., a private cloud solution, a public cloud, a hybrid cloud, a multi-cloud, etc.), and / or other like devices. Additionally or alternatively, metrology system 102 may include a computing device, such as a desktop computer, a mobile device (e.g., a tablet, a smartphone, a wearable device, etc.), and / or the like. In some non-limiting embodiments, metrology system 102 may include an application (e.g., a software application) that performs a set of functionalities on an external application programming interface (API) to send and / or recite data to or from an external system, such as laser processing system 104 or measurement system 106, associated with the external API. In some non-limiting embodiments, metrology system 102 may include one or more subsystems.

[0059] In some non-limiting embodiments, laser processing system 104 may include one or more devices capable of being in communication with metrology system 102 and measurement system 106 via communication network 108. For example, laser processing system 104 may include a server, a computing device, and / or the like. In some non-limiting embodiments, laser processing system 104 may be capable of performing processing (e.g., cutting, machining, etching, etc.) of a working piece. In some non-limiting embodiments, laser processing system 104 may include a laser delivery device, a rotary chuck, a rotary axis, a linear axis, and / or a fixturing device. In some non-limiting embodiments or aspects, laser processing system 104 may be associated with a user (e.g., an individual operating laser processing system 104).

[0060] In some non-limiting embodiments, measurement system 106 may include one or more devices capable of being in communication with metrology system 102 and laser processing system 104 via communication network 108. In some non-limiting embodiments, measurement system 106 may be capable of communicating data associated with measurements made by metrology sensor 110. In some non-limiting embodiments, measurement system 106 may include a server, a group of servers, a computing device, such as a desktop computer, a mobile device (e.g., a tablet, a smartphone, a wearable device, etc.), and / or the like.

[0061] In some non-limiting embodiments, communication network 108 may include one or more wired and / or wireless networks. For example, communication network 108 may include a communications link, a computer network, a bus network, a fiber optic-based network, cellular network (e.g., a long-term evolution (LTE) network, a third generation (3G) network, a fourth generation (4G) network, a fifth generation (5G) network, a code division multiple access (CDMA) network, and / or the like), a local area network (LAN), a wide area network (WAN), a wireless LAN (WLAN), a private network, an ad hoc network, an intranet, the Internet, a fiber optic-based network, an Ethernet network, a universal serial bus (USB)Page 11 of315Y96705.DOCXAttorney Ref. 00005-2503870network, a cloud computing network, and / or the like, and / or a combination of some or all of these or other types of networks. In some non-limiting embodiments, communication network 108 may interconnect a plurality of devices.

[0062] Referring now to FIG. IB, FIG. IB is a diagram of a non-limiting embodiment of metrology system 102. As shown in FIG. IB, metrology system 102 may include sensor device 102A and / or image capture device 102B. In some non-limiting embodiments, metrology system 102 may include one or more devices capable of being in communication with sensor device 102A and / or image capture device 102B via a communication network (e.g., communication network 108).

[0063] In some non-limiting embodiments, sensor device 102 A may include one or more devices to generate data associated with a measurement, transmit data associated with a measurement, measure physical properties, monitor conditions, detect physical stimuli, respond to physical stimuli, and / or the like. In some non-limiting embodiments, physical properties may include distance, surface finish, temperature, pressure, light, motion, humidity, and / or the like. In some non-limiting embodiments, sensor device 102A may include a sensor, such as a metrology sensor. In some non-limiting embodiments, the metrology sensor may be a non-contact sensor. In some non-limiting embodiments, the metrology sensor may include a confocal microscope, a digital imaging equipment, a confocal three-dimensional sensor, a white light sensor, a focal sensor, and / or any combination thereof.

[0064] In some non-limiting embodiments, image capture device 102B may include one or more devices to generate data associated with an image, transmit data associated with an image, measure physical properties based on an image, monitor conditions of an image, and / or the like. In some non-limiting embodiments, image capture device 102B may include one or more imaging devices. In some non-limiting embodiments, image capture device 102B may include a camera (e.g., a vision industrial camera, a thermal camera, a high-speed camera, etc.), a scanner (e.g., a three-dimensional scanner), an imaging device (e.g., an infrared imaging device), and / or the like.

[0065] Referring now to FIG. 2, FIG. 2 is a diagram of example components of device 200. Device 200 may correspond to metrology system 102, laser processing system 104, and / or measurement system 106. In some non-limiting embodiments, metrology system 102, laser processing system 104, and / or measurement system 106 may include at least one device 200 and / or at least one component of device 200. As shown in FIG. 2, device 200 may include bus 202, processor 204, memory 206, storage component 208, input component 210, output component 212, and communication interface 214.Page 12 of 315Y96705.DOCXAttorney Ref. 00005-2503870

[0066] Bus 202 may include a component that permits communication among the components of device 200. In some non-limiting embodiments, processor 204 may be implemented in hardware or a combination of hardware and software. For example, processor 204 may include a processor (e.g., a central processing unit (CPU), a graphics processing unit (GPU), an accelerated processing unit (APU), and / or the like), a microprocessor, a digital signal processor (DSP), and / or any processing component (e.g., a field-programmable gate array (FPGA), an application-specific integrated circuit (ASIC), and / or the like) that can be programmed to perform a function. Memory 206 may include random access memory (RAM), read-only memory (ROM), and / or another type of dynamic or static storage device (e.g., flash memory, magnetic memory, optical memory, and / or the like) that stores information and / or instructions for use by processor 204.

[0067] Storage component 208 may store information and / or software related to the operation and use of device 200. For example, storage component 208 may include a hard disk (e.g., a magnetic disk, an optical disk, a magneto-optic disk, a solid state disk, and / or the like), a compact disc (CD), a digital versatile disc (DVD), a floppy disk, a cartridge, a magnetic tape, and / or another type of computer-readable medium, along with a corresponding drive.

[0068] Input component 210 may include a component that permits device 200 to receive information, such as via user input (e.g., a touchscreen display, a keyboard, a keypad, a mouse, a button, a switch, a microphone, a camera, and / or the like). Additionally or alternatively, input component 210 may include a sensor for sensing information (e.g., a global positioning system (GPS) component, an accelerometer, a gyroscope, an actuator, and / or the like). Output component 212 may include a component that provides output information from device 200 (e.g., a display, a speaker, one or more light-emitting diodes (LEDs), and / or the like).

[0069] Communication interface 214 may include a transceiver-like component (e.g., a transceiver, a separate receiver and transmitter, and / or the like) that enables device 200 to communicate with other devices, such as via a wired connection, a wireless connection, or a combination of wired and wireless connections. Communication interface 214 may permit device 200 to receive information from another device and / or provide information to another device. For example, communication interface 214 may include an Ethernet interface, an optical interface, a coaxial interface, an infrared interface, a radio frequency (RF) interface, a universal serial bus (USB) interface, a Wi-Fi® interface, a cellular network interface, and / or the like.

[0070] Device 200 may perform one or more processes described herein. Device 200 may perform these processes based on processor 204 executing software instructions stored by a Page 13 of 315Y96705.DOCXAttorney Ref. 00005-2503870computer-readable medium, such as memory 206 and / or storage component 208. A computer-readable medium (e.g., a non-transitory computer-readable medium) is defined herein as a non-transitory memory device. A non-transitory memory device includes memory space located inside of a single physical storage device or memory space spread across multiple physical storage devices.

[0071] Software instructions may be read into memory 206 and / or storage component 208 from another computer-readable medium or from another device via communication interface 214. When executed, software instructions stored in memory 206 and / or storage component 208 may cause processor 204 to perform one or more processes described herein. Additionally or alternatively, hardwired circuitry may be used in place of or in combination with software instructions to perform one or more processes described herein. Thus, embodiments described herein are not limited to any specific combination of hardware circuitry and software.

[0072] Memory 206 and / or storage component 208 may include data storage or one or more data structures (e.g., a database and / or the like). Device 200 may be capable of retrieving information from, storing information in, or searching for information stored in the data storage or one or more data structures in memory 206 and / or storage component 208.

[0073] The number and arrangement of components shown in FIG. 2 are provided as an example. In some non-limiting embodiments, device 200 may include additional components, fewer components, different components, or differently arranged components than those shown in FIG. 2. Additionally or alternatively, a set of components (e.g., one or more components) of device 200 may perform one or more functions described herein as being performed by another set of components of device 200.

[0074] Referring now to FIG. 3, FIG. 3 is a flowchart of a non-limiting embodiment of process 300 for integrated manufacturing using metrology. In some non-limiting embodiments, one or more of the steps of process 300 may be performed (e.g., completely, partially, etc.) by metrology system 102 (e.g., one or more devices of metrology system 102). In some nonlimiting embodiments, one or more of the steps of process 300 may be performed (e.g., completely, partially, etc.) by another device or a group of devices separate from or including metrology system 102, laser processing system 104, and / or measurement system 106. The steps shown in FIG. 3 are for example purposes only. It will be appreciated that additional, fewer, different, and / or a different order of steps may be used in some non-limiting embodiments or aspects. In some non-limiting embodiments or aspects, a step may be automatically performed in response to performance and / or completion of a prior step.Page 14 of 315Y96705.DOCXAttorney Ref. 00005-2503870

[0075] In some non-limiting embodiments, one or more steps of process 300 may be carried out in real time. In some non-limiting embodiments, real time may refer to a time in which input data is processed in a short amount of time (e.g., within milliseconds) so that it is available virtually immediately to be used as feedback.

[0076] As shown in FIG. 3, at step 302, process 300 includes receiving data associated with a measurement of a working piece from a metrology sensor. For example, metrology system 102 may receive the data associated with the measurement of the working piece from metrology sensor 110. In some non-limiting embodiments, metrology sensor 110 may include a noncontact sensor. In some non-limiting embodiments, metrology sensor 110 may include a confocal microscope, a digital imaging equipment, a confocal three-dimensional sensor, a white light sensor, a focal sensor, or any combination thereof. In some non-limiting embodiments, metrology sensor 110 may include sensor device 102A and / or image capture device 102B.

[0077] In some non-limiting embodiments, metrology system 102 may measure the working piece using sensor device 102A and / or image capture device 102B. For example, metrology system 102 may measure the working piece using sensor device 102A and / or image capture device 102B based on (e.g., during, after, etc.) the working piece being processed by laser processing system 104. In another example, metrology system 102 may measure the working piece using sensor device 102A and / or image capture device 102B based on receiving a user input (e.g., a user input to metrology system 102, laser processing system 104, and / or measurement system 106). In some non-limiting embodiments, metrology system 102 may measure dimensional aspects and / or surface finish aspects (e.g., to determine relative distances, to determine length, width, and / or height of aspects, to verify tolerances) in the submicrometer, micrometer, millimeter, centimeter, decimeter and / or meter range. For example, metrology system 102 may measure dimensional aspects of less than 10 micrometers. In some non-limiting embodiments, metrology system 102 may measure dimensional aspects in a range between 100 nanometers to 10 micrometers. In another example, metrology system 102 may measure surface finish aspects in a range between 1 micrometer to 2 micrometers. In some nonlimiting embodiments, metrology system 102 may measure aspects of a working piece (e.g., tube material) that are less than 1 millimeter. In some non-limiting embodiments, metrology system 102 may measure aspects of a working piece that are in the range of 1 millimeter to 30 millimeters. In some non-limiting embodiments, the working piece (e.g., tube material) diameter may be in the range of less than 5 millimeters to 15 millimeters. In some non-limiting embodiments, metrology system 102 may measure aspects of a working piece length (e.g., tube Page 15 of 315Y96705.DOCXAttorney Ref. 00005-2503870length) in the range of 10 millimeters to 2 meters. In some non-limiting embodiments, metrology system 102 may measure a working piece made of metal and / or biocompatible plastic. In some examples, the working piece may comprise Stainless Steel, Cobalt Chrome (CoCr), and / or Nitinol (Nickel Titanium alloys). In another example, the working piece may comprise biocompatible plastic (e.g., Polyethylene, Polypropylene, Polystyrene, and / or Polyvinyl Chloride).

[0078] In some non-limiting embodiments, sensor device 102A and / or image capture device 102B may be used to measure surface finish aspects and / or dimensional aspects of the working piece during and / or after processing of the working piece. In some non-limiting embodiments, sensor device 102A and / or image capture device 102B may be used to measure surface finish aspects, such as imperfections in a surface of a working piece, a texture of a surface of a working piece, waviness in a surface of a working piece, reflectivity of a surface of a working piece, and / or the like. Additionally or alternatively, sensor device 102A and / or image capture device 102B may be used to measure dimensional aspects of the working piece, such as length, width, diameter (e.g., internal or external), radius (e.g., internal or external), circumference, alignment (e.g., alignment of cutting, alignment of the working piece, etc.), and / or the like.

[0079] In some non-limiting embodiments, metrology system 102 may generate data associated with design tolerance aspects of the working piece. For example, metrology system 102 may generate the data associated with design tolerance aspects of the working piece based on data associated with surface finish aspects of the working piece and / or data associated with a dimensional aspect of the working piece provided by sensor device 102A and / or image capture device 102B.

[0080] In some non-limiting embodiments, metrology system 102 may determine a processing deviation. For example, metrology system 102 may determine one or more processing deviations of the working piece by comparing a measurement of a surface finish and / or dimensional aspect of the working piece to a corresponding aspect of a predetermined template (e.g., a corresponding aspect an original design specification) and determining a difference between the measurement of the surface finish and / or dimensional aspect of the working piece and the corresponding aspect of the predetermined template. The processing deviation of the working piece may include the difference between the measurement of the surface finish and / or dimensional aspect of the working piece and the corresponding aspect of the predetermined template.

[0081] In some non-limiting embodiments, metrology system 102 may receive data associated with a measurement of a working piece from sensor device 102 A and / or image capture device Page 16 of 315Y96705.DOCXAttorney Ref. 00005-2503870102B. In some non-limiting embodiments, metrology system 102 may receive the data associated with the measurement of the working piece from measurement system 106 and / or laser processing system 104. In some non-limiting embodiments, metrology system 102 may receive the data associated with the measurement of the working piece in substantially real time as the working piece is being processed by laser processing system 104.

[0082] In some non-limiting embodiments, the data associated with a measurement of a working piece may include data associated with surface finish aspects and / or data associated with dimensional aspects of the working piece (e.g., during and / or after processing of the working piece). In some non-limiting embodiments, the data associated with surface finish aspects may include data associated with an imperfection in a surface of a working piece, data associated with a texture of a surface of a working piece, data associated with waviness in a surface of a working piece, data associated with reflectivity of a surface of a working piece, and / or the like. In some non-limiting embodiments, the data associated with dimensional aspects of the working piece may include data associated with length, width, diameter (e.g., internal or external), radius (e.g., internal or external), circumference, alignment (e.g., alignment of cutting, alignment of the working piece, etc.) of the working piece, and / or the like.

[0083] As shown in FIG. 3, at step 304, process 300 includes comparing the measurement of the working piece to a predetermined template. In some non-limiting embodiments, metrology system 102 may compare (e.g., perform a comparison of) the measurement of the working piece to the predetermined template, which may include an original design specification. In some non-limiting embodiments, metrology system 102 may compare the measurement of the working piece to a threshold value of a measurement associated with the predetermined template. In some non-limiting embodiments, metrology system 102 may generate data associated with a design tolerance aspect of the working piece based on comparing the measurement of the working piece to a threshold value of a measurement associated with the predetermined template.

[0084] In some non-limiting embodiments, metrology system 102 may receive the predetermined template (e.g., data associated with the predetermined template). For example, metrology system 102 may receive the predetermined template based on an input from a user. In some non-limiting embodiments, the predetermined template may be input by a user to metrology system 102 (e.g., via a user interface of metrology system 102, via a user device that communicates with metrology system 102, etc.). In some non-limiting embodiments, the predetermined template may include predetermined thresholds of physical properties of a Page 17 of 315Y96705.DOCXAttorney Ref. 00005-2503870working piece. In some non-limiting embodiments, the predetermined template may include data retrieved from a database based on data received from measurement system 106 (e.g., based on a reading of a working piece). In some non-limiting embodiments, the predetermined template may include certain design tolerances associated with a working piece. In some nonlimiting embodiments, metrology system 102 may receive the data associated with the predetermined template from laser processing system 104 and / or measurement system 106.

[0085] In some non-limiting embodiments, the predetermined template may include design tolerances associated with surface finish aspects and / or dimensional aspects of the working piece (e.g., during and / or after processing of the working piece). In some non-limiting embodiments, the design tolerances associated with surface finish aspects may include a tolerance (e.g., a threshold) for imperfections in a surface of a working piece, a tolerance for a texture of a surface of a working piece, a tolerance for waviness in a surface of a working piece, a tolerance for reflectivity of a surface of a working piece, and / or the like. In some non-limiting embodiments, design tolerances associated with dimensional aspects of the working piece may include tolerances associated with length, width, diameter (e.g., internal or external), radius (e.g., internal or external), circumference, alignment (e.g., alignment of cutting, alignment of the working piece, etc.) of the working piece, and / or the like.

[0086] As shown in FIG. 3, at step 306, process 300 includes transmitting a feedback signal to a laser processing system. In some non-limiting embodiments, metrology system 102 may transmit the feedback signal to laser processing system 104. In some non-limiting embodiments, metrology system 102 may transmit the feedback signal based on the comparison of the measurement of the working piece to the predetermined template. In some non-limiting embodiments, the feedback signal may include data associated with a difference between the measurement of the working piece and the predetermined template associated with the working piece. For example, the feedback signal may include a data associated with a difference between the measurement of the working piece and a design tolerance. In some nonlimiting embodiments, metrology system 102 may be configured to provide an output associated with an aspect of (e.g., a result of) a laser cutting procedure based on the feedback signal. For example, metrology system 102 may be configured to provide an alert following a laser cutting procedure on a working piece based on the feedback signal. In some non-limiting embodiments, the alert may include data associated with a difference between the measurement of the working piece and the predetermined template associated with the working piece. In some non-limiting embodiments, metrology system 102 may be configured to provide an alert based on a measurement of the working piece and a threshold. For example, metrology system Page 18 of 315Y96705.DOCXAttorney Ref. 00005-2503870102 may be configured to provide an alert based on the measurement of the working piece failing to satisfy the threshold.

[0087] In some non-limiting embodiments, metrology system 102 may adjust the laser processing system based on at least the feedback signal. In some non-limiting embodiments, metrology system 102 may make adjustments to process the working piece until one or more parameters (e.g., aspects of surface finish and / or aspects of dimensionality) of the working piece satisfy a threshold. In some non-limiting embodiments, metrology system 102 may make adjustments to the procedure for laser processing the working piece. For example, metrology system 102 may make adjustments to the procedure for laser processing the working piece based on the feedback signal. In some non-limiting embodiments, metrology system 102 may make adjustments to the procedure for laser processing the working piece based on data associated with processing deviations associated with the working piece included in the feedback signal. In some non-limiting embodiments, adjustments may include adjustments to laser cutting, for example, in the single-digit micrometer range. In some non-limiting embodiments, metrology system 102 may make adjustments to the procedure for laser processing of the working piece in the sub-micrometer, micrometer, millimeter, centimeter, decimeter, and / or meter range. For example, metrology system 102 may adjust the procedure for laser processing the working piece less than 10 micrometers. In another example, metrology system 102 may adjust the procedure for laser processing the working piece in a range between 100 nanometers to 10 micrometers. In some non-limiting embodiments, metrology system 102 may make adjustments to the laser kerf (e.g., width of a single pass of the laser on the working piece). For example, metrology system 102 may make adjustments to the laser kerf in a range between 100 nanometers to 10 micrometers. In some non-limiting embodiments, metrology system 102 may adjust the laser power and / or repetition frequency (e.g., repetition rate). In some non-limiting embodiments, metrology system 102 may adjust laser power and / or repetition frequency to improve surface finish aspects (e.g., reduce imperfections in a surface of a working piece).

[0088] In some non-limiting embodiments, metrology system 102 may complete processing of the working piece based on determining that the measurement of the working piece corresponds to the predetermined template associated with the working piece. In some non-limiting embodiments, the laser processing system may output the working piece once a threshold is satisfied. In some non-limiting embodiments, the processor may retain adjustments to the laser processing system for future and / or subsequent working pieces (e.g., a second working piece).Page 19 of 315Y96705.DOCXAttorney Ref. 00005-2503870

[0089] Referring now to FIGS. 4A and 4B, FIGS. 4A and 4B are diagrams of an overview of example implementation 400 described herein. As shown in FIG. 4A, implementation 400 may include laser processing system 404, which includes laser cutting head 406, steady -rest bushing 408, tube 410, laser cut section 412 of tube 410, rotary chuck 422, rotary axis 424, and linear axis 426. In some non-limiting embodiments, laser cutting head 406 may be the same as or similar to the laser delivery device, as described above. In some non-limiting embodiments, steady-rest bushing 408 may be the same as or similar to the fixturing device, as described above. In some non-limiting embodiments, laser processing system 404 may be the same as or similar to laser processing system 104. In some non-limiting embodiments, tube 410 may be the same as or similar to a working piece, as described above. In FIG. 4A, rotary chuck 422 holds tube 410 so that tube 410 is able to be rotated via rotary axis 424 and so that tube 410 is able to be moved linearly via linear axis 426. Steady-rest bushing 408 is configured to hold tube 410 so that laser cutting head 406 may process tube 410 to provide laser cut section 412 of tube 410. In some non-limiting embodiments, steady-rest bushing 408 is positioned adjacent linear axis 426 to stabilize tube 410.

[0090] With regard to implementation 400, producing laser-cut products may present unique manufacturing challenges. The process of creating finished laser-cut products, such as tubes (e.g., hypotubes), may involve multiple steps, which can vary depending on the specific part and manufacturer. In some non-limiting embodiments, laser cutting processes (e.g., a procedure for laser processing) may include tube formation (e.g., welding or drawing), precision laser cutting, deburring, heat treatment, shape setting, surface refinement (e.g., cleaning, surface treatment, electropolishing, etc.), quality inspection, sterilization, packaging, and / or the like. A primary detection method for determining if a part is within specification is manual inspection of the part.

[0091] However, manual inspection may be a manufacturing bottleneck and may require a trained operator to identify defects. Furthermore, at the point of a manual inspection, much of the work-in-progress involved in laser processing (e.g., materials, processing time, labor, etc.) may all be wasted if the part is not within the specification. In some non-limiting embodiments, laser-cut products may not satisfy a threshold due to at least some of the following reasons: inadequate motion tracking of a predetermined template (e.g., a commanded part profile), inadequate servo loop tuning of rotary axis 424 and / or linear axis 426 of laser processing system 404, mechanical wear of components of rotary axis 424 and / or linear axis 426, wear of steady -rest bushing 408, torsional windup of tube 410 caused by excessive fit of steady -rest bushing 408, laser power variation of laser cutting head 406, laser cutting head 406 being out Page 20 of 315Y96705.DOCXAttorney Ref. 00005-2503870of focus, vibration between laser cutting head 406 and tube 410, temperature fluctuations in laser processing system 404, slipping of the part in rotary chuck 422, and / or the like.

[0092] As shown in FIG. 4B, implementation 400 may include laser processing system 404, metrology system 402, and metrology sensor 432. In some non-limiting embodiments, metrology system 402 may be the same as or similar to metrology system 102.

[0093] In some non-limiting embodiments, metrology sensor 432 may be positioned to monitor laser cut section 412. In some non-limiting embodiments, metrology sensor 432 may be positioned adjacent to laser cutting head 406. In some non-limiting embodiments, metrology sensor 432 may be configured to measure data associated with a measurement of tube 410 and / or laser cut section 412. In some non-limiting embodiments, metrology sensor 432 may be configured to provide data associated with a measurement of tube 410 and / or laser cut section 412 to metrology system 402.

[0094] In some non-limiting embodiments, metrology system 402 may be configured to process feedback from metrology sensor 432, allowing for adjustments in the cutting process if necessary. For example, if metrology system 402 detects any deviations in tube 410 or laser cut section 412 from a predetermined template, metrology system 402 may provide instructions to adjust laser processing parameters (e.g., laser cutting parameters such as peak laser power, average laser power, laser repetition frequency, laser beam diameter, and / or laser spot size). In some non-limiting embodiments, metrology system 402 may be configured to receive data from metrology sensor 432, compare the data to a predetermined template, and transmit a feedback signal to laser processing system 404. In this way, metrology system 402 may allow for high precision cutting and enhancements to the accuracy and repeatability of laser processing system 404.

[0095] In some non-limiting embodiments, metrology system 402 may provide feedback to laser processing system 404. In some non-limiting embodiments, metrology sensor 432 may be placed adjacent steady -rest bushing 408 to measure tube 410. In some non-limiting embodiments, metrology system 402 may transmit a feedback signal to laser processing system 404 and laser processing system 404 may be adjusted based on the feedback signal. In some non-limiting embodiments, metrology system 402 may receive data associated with a measurement of tube 410 in substantially real time as tube 410 is being processed (e.g., cut) by laser processing system 404.

[0096] Different recommendations may be made to laser processing system 404 based upon the nature of the parts variation compared to the targeted cut profile to improve the subsequent parts cut. These recommendations may be made based on codified operator experience. After Page 21 of 315Y96705.DOCXAttorney Ref. 00005-2503870a sufficient amount of measurement data is collected, machine learning algorithms may be applied to further enhance the fidelity and understanding of variations of tube 410. In some non-limiting embodiments, the machine learning algorithms may selectively be deployed (e.g., based on a subscription model). Assuming tube 410 is processed to meet a predetermined template, tube 410 will then be shuttled along for subsequent processing.

[0097] Referring now to FIG. 5, FIG. 5 is a diagram of an example of laser cutting head 506. In some non-limiting embodiments, laser cutting head 506 may be the same or similar to laser cutting head 406. In some non-limiting embodiments, laser cutting head 506 may include camera 510, laser collimator 514, dichroic beam splitter 520, focusing lens 518, and focused laser beam 516. In some non-limiting embodiments, laser collimator 514 may be used to prepare, condition, and / or collimate laser beam 512 from a laser source. For example, laser collimator 514 may ensure that laser beam 512 light rays are parallel and / or non-divergent prior to reaching dichroic beam splitter 520. In some non-limiting embodiments, dichroic beam splitter 520 may be configured to reflect laser beam 512 to focusing lens 518, while simultaneously passing other wavelengths of light (e.g., visible wavelengths) from camera 510 to focusing lens 518. For example, dichroic beam splitter 520 may permit viewing, inspection, and / or measurement from camera 510 of the laser cutting operation through focusing lens 518 in substantially real time. In some non-limiting embodiments, focusing lens 518 may concentrate laser beam 512 energy to a very small focal point, creating very high energy density at the focal point. For example, focusing lens 518 may be configured as convex to bend light rays inward to create focused laser beam 516. In some non-limiting embodiments, camera 510 may be replaced by and / or include a metrology sensor to allow measurements specific to the cutting operation being performed to be taken in substantially real time.

[0098] Referring now to FIGS. 6A-6D, FIGS. 6A-6D are diagrams of a non-limiting embodiment of an implementation 600 in which laser processing system 604 and metrology system 602 may be included. In some non-limiting embodiments, laser processing system 604 may be the same or similar to laser processing system 104 and / or laser processing system 404. In some non-limiting embodiments, metrology system 602 may be the same or similar to metrology system 102 and / or metrology system 402.

[0099] As shown by reference number 610 in FIG. 6 A, laser processing system 604 may receive raw tube material to be processed. For example, laser processing system 604 may receive raw tube material prior to laser processing system 604 processing the received raw tube material. In some non-limiting embodiments, the raw tube material to be processed may be delivered to laser processing system 604. For example, the raw tube material may be delivered Page 22 of 315Y96705.DOCXAttorney Ref. 00005-2503870manually and / or by an automated system and / or device (e.g., a delivery robot). In some nonlimiting embodiments, laser processing system 604 may include a laser cutting head which may be the same or similar to laser cutting head 406 and / or laser cutting head 506. In some non-limiting embodiments, the laser cutting head may include a camera and / or metrology sensor for taking measurements of the raw tube material to be processed. The camera may be the same as or similar to image capture device 102B and the metrology sensor may be the same as or similar to sensor device 102A. For example, the measurements may include distance (e.g., relative distance of aspects), dimensions, surface finish, temperature, pressure, light, motion, humidity, and / or the like. Additionally or alternatively, the metrology sensor and / or camera may measure positioning of the tube material with respect to the laser cutting head before, during, and / or after cutting operations.

[0100] As further shown by reference number 612 in FIG. 6 A, laser processing system 604 may process the raw tube material based on an original design specification. For example, laser processing system 604 may process the raw tube material according to the original design specification based on receiving the raw tube material. Additionally or alternatively, measurements of the tube material may be taken before, during, and / or after processing of the tube material. In some non-limiting embodiments, measurements of the tube material may be taken in substantially real time.

[0101] As shown by reference number 614 in FIG. 6B, once the raw tube material has been processed, the processed tube material may be moved to metrology system 602 manually and / or by an automated system and / or device. For example, a robot and / or motion system may move the processed tube material to a predefined location in preparation for measurement.

[0102] As further shown by reference number 616 in FIG. 6B, metrology system 602 may measure the processed tube material. For example, the processed tube material may be measured by a metrology sensor (e.g., metrology sensor 110, which includes sensor device 102A and / or image capture device 102B) of metrology system 602. In some non-limiting embodiments, the measurements may include distance, surface finish, temperature, pressure, light, motion, humidity, and / or the like.

[0103] In some non-limiting embodiments, metrology system 602 may generate data associated with a measurement of a processed tube material based on the measurements of the processed tube material. For example, the metrology sensor of metrology system 602 may generate (e.g., during and / or after processing of the processed tube material) data associated with surface finish aspects of the processed tube material and / or data associated with dimensional aspects of the processed tube material. In some non-limiting embodiments, the Page 23 of 315Y96705.DOCXAttorney Ref. 00005-2503870data associated with surface finish aspects may include data associated with an imperfection in a surface of a processed tube material, data associated with a texture of a surface of a processed tube material, data associated with waviness in a surface of a processed tube material, data associated with reflectivity of a surface of a processed tube material, and / or the like. In some non-limiting embodiments, the data associated with dimensional aspects of the processed tube material may include data associated with length, width, diameter (e.g., internal or external), radius (e.g., internal or external), circumference, alignment (e.g., alignment of cutting, alignment of the processed tube material, etc.) of the processed tube material, and / or the like.

[0104] In some non-limiting embodiments, metrology system 602 may receive data associated with the measurement of the processed tube material from the metrology sensor. In some nonlimiting embodiments, metrology system 602 may receive the data associated with the measurement of the processed tube material in substantially real time as the processed tube material is being processed by laser processing system 604.

[0105] As shown by reference number 618 in FIG. 6C, metrology system 602 may compare a measurement of a processed tube material to a predetermined template. For example, metrology system 602 may compare the measurement of a processed tube material to the predetermined template to provide a processing deviation. The processing deviation of the processed tube material may include the difference between the measurement of the surface finish and / or dimensional aspect of the processed tube material and a corresponding aspect of the predetermined template. In some non-limiting embodiments, metrology system 602 may determine a processing deviation. For example, metrology system 602 may determine one or more processing deviations of the processed tube material by determining a difference between the measurement of the surface finish and / or dimensional aspect of the processed tube material and the corresponding aspect of the predetermined template.

[0106] As shown by reference number 620 in FIG. 6D, metrology system 602 may transmit a feedback signal, which includes processing deviations, based on measurement data. For example, metrology system 602 may transmit the feedback signal to laser processing system 604. In some non-limiting embodiments, metrology system 602 may generate the feedback signal based on determining the processing deviation of the processed tube material.

[0107] In some non-limiting embodiments, laser processing system 604 may receive the feedback signal. In some non-limiting embodiments, laser processing system 604 may determine adjustments to the laser processing based on at least the feedback signal. For example, adjustments may be made to the laser cutting process related to cutting speed, laser power, and / or cutting path. As shown by reference number 622 in FIG. 6D, the finished tube Page 24 of 315Y96705.DOCXAttorney Ref. 00005-2503870material may be removed after processing and measurements have been collected by a metrology sensor. For example, the finished tube material may be removed manually and / or by an automated system and / or device. In some non-limiting embodiments, the feedback signal received by laser processing system 604 and / or adjustments determined by laser processing system 604 are used for a subsequent cutting operation of subsequent raw tube material, which may be delivered to laser processing system 604, as shown by reference number 610 in FIG.6A.

[0108] Although embodiments have been described in detail for the purpose of illustration, it is to be understood that such detail is solely for that purpose and that the disclosure is not limited to the disclosed embodiments or aspects, but, on the contrary, is intended to cover modifications and equivalent arrangements that are within the spirit and scope of the appended claims. For example, it is to be understood that the present disclosure contemplates that, to the extent possible, one or more features of any embodiment or aspect can be combined with one or more features of any other embodiment or aspect.Page 25 of 315Y96705.DOCX

Claims

Attorney Ref. 00005-2503870WHAT IS CLAIMED IS:

1. A method, comprising:receiving, with at least one processor, data associated with a measurement of a working piece from a metrology sensor based on the working piece being processed by a laser processing system;comparing, with the at least one processor, the measurement of the working piece to a predetermined template associated with the working piece; andtransmitting, with the at least one processor, a feedback signal to the laser processing system based on comparing the data associated with the measurement of the working piece to the predetermined template associated with the working piece, wherein the feedback signal comprises data associated with a difference between the measurement of the working piece and the predetermined template associated with the working piece.

2. The method of claim 1, wherein receiving the data associated with the measurement of the working piece from the metrology sensor comprises:receiving the data associated with the measurement of the working piece in substantially real time as the working piece is being processed by the laser processing system.

3. The method of claim 1, further comprising:adjusting the laser processing system based at least on the feedback signal.

4. The method of claim 1, wherein the metrology sensor is positioned adjacent to a laser delivery device of the laser processing system and a fixturing device of the laser processing system, and wherein the metrology sensor is positioned to measure the working piece after the working piece is processed by the laser processing system.

5. The method of claim 1, wherein comparing the measurement of the working piece to the predetermined template associated with the working piece comprises:comparing the measurement of the working piece to a threshold value of a measurement associated with the predetermined template.Page 26 of 315Y96705.DOCXAttorney Ref. 00005-25038706. The method of claim 1, further comprising:completing processing of the working piece based on determining that the measurement of the working piece corresponds to the predetermined template associated with the working piece.

7. The method of claim 1, wherein the metrology sensor is a non-contact sensor.

8. The method of claim 7, wherein the non-contact sensor comprises at least one of the following:a confocal microscope;a digital imaging equipment;a confocal three-dimensional sensor;a white light sensor;a focal sensor; orany combination thereof.

9. A system, comprising:at least one processor configured to:receive data associated with a measurement of a working piece from a metrology sensor based on the working piece being processed by a laser processing system;compare the measurement of the working piece to a predetermined template associated with the working piece; andtransmit a feedback signal to the laser processing system based on comparing the data associated with the measurement of the working piece to the predetermined template associated with the working piece, wherein the feedback signal comprises data associated with a difference between the measurement of the working piece and the predetermined template associated with the working piece.

10. The system of claim 9, further comprising:the laser processing system, wherein the laser processing system comprises a laser delivery device; anda measurement system, wherein the measurement system comprises:Page 27 of 315Y96705.DOCXAttorney Ref. 00005-2503870the at least one processor;the metrology sensor; anda motion system, wherein the motion system is configured to impart motion to the working piece after the working piece is processed by the laser processing system.

11. The system of claim 10, wherein the working piece comprises a tube material, and wherein the laser delivery device is configured to:perform laser processing operations on the tube material as the tube material is held in place by a fixturing device.

12. The system of claim 9, wherein the at least one processor is further configured to:adjust the laser processing system based at least on the feedback signal.

13. The system of claim 12, wherein, when adjusting the laser processing system, the at least one processor is configured to:adjust processing parameters of a laser delivery device of the laser processing system in relation to the working piece based on the feedback signal.

14. The system of claim 9, wherein, when receiving the data associated with the measurement of the working piece from the metrology sensor, the at least one processor is configured to:receive the data associated with the measurement of the working piece in substantially real time as the working piece is being processed by the laser processing system.

15. The system of claim 14, wherein, when receiving the data associated with the measurement of the working piece in substantially real time as the working piece is being processed by the laser processing system, the at least one processor is configured to:receive the data associated with the measurement of the working piece from a second sensor in substantially real time as the working piece is being processed by the laser processing system, wherein the second sensor is positioned on a laser delivery device of the laser processing system.Page 28 of 315Y96705.DOCXAttorney Ref. 00005-250387016. The system of claim 9, wherein the metrology sensor is positioned adjacent to a laser delivery device of the laser processing system and a fixturing device of the laser processing system, and wherein the metrology sensor is positioned to measure the working piece after the working piece is processed by the laser processing system.

17. The system of claim 9, wherein, when comparing the measurement of the working piece to the predetermined template associated with the working piece, the at least one processor is configured to:compare the measurement of the working piece to a threshold value of a measurement associated with the predetermined template.

18. The system of claim 9, wherein the at least one processor is further configured to:complete processing of the working piece based on determining that the measurement of the working piece corresponds to the predetermined template associated with the working piece.

19. The system of claim 9, wherein the metrology sensor is a non-contact sensor.

20. The system of claim 19, wherein the non-contact sensor comprises at least one of the following:a confocal microscope;a digital imaging equipment;a confocal three-dimensional sensor;a white light sensor;a focal sensor; orany combination thereof.

21. A non-transitory computer readable medium, wherein the computer readable medium comprises one or more instructions that, when executed by at least one processor, cause the at least one processor to:receive data associated with a measurement of a working piece from a metrology sensor based on the working piece being processed by a laser processing system;Page 29 of 315Y96705.DOCXAttorney Ref. 00005-2503870compare the measurement of the working piece to a predetermined template associated with the working piece; andtransmit a feedback signal to the laser processing system based on comparing the data associated with the measurement of the working piece to the predetermined template associated with the working piece, wherein the feedback signal comprises data associated with a difference between the measurement of the working piece and the predetermined template associated with the working piece.

22. The non-transitory computer readable medium of claim 21, wherein the one or more instructions that cause the at least one processor to receive the data associated with the measurement of the working piece from the metrology sensor, cause the at least one processor to:receive the data associated with the measurement of the working piece in substantially real time as the working piece is being processed by the laser processing system.Page 30 of 315Y96705.DOCX