Heat dissipation assembly, power module, electronic device and vehicle

Abstract

The present application relates to a heat dissipation assembly, a power module, an electronic device and a vehicle. The heat dissipation assembly comprises: a housing having an accommodating cavity, and an inlet and an outlet each communicating with the accommodating cavity, wherein the housing is adapted to be connected to heat-generating members; and heat dissipation units connected to the housing, wherein the heat dissipation area of the heat dissipation units gradually increases from an inlet side to an outlet side.

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