Curable composition

Abstract

[Problem] To provide a curable composition which can form a cured product that exhibits adhesive strength to a metal such as copper, mechanical properties, electrical properties (low relative dielectric constant, low dielectric loss tangent, etc.), insulating properties, etc., and which exhibits excellent handleability and narrow gap penetration properties, which are useful in electronic component device applications such as sealing materials for semiconductor devices, build-up films and underfilling materials. [Solution] Provided is a curable composition which contains: epoxy resins including a bisphenol epoxy resin and a glycidylamine type epoxy resin; silica particles; and an amine-based curing agent. The content of the bisphenol type epoxy resin is less than 60 mass% and the content of the glycidylamine type epoxy resin is more than 40 mass%, each relative to the total amount of the epoxy resins. The silica particles include solid silica particles and hollow silica particles. The content of the hollow silica particles is more than 1 vol% of the total amount of the silica particles.

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