Probe head having movable contact bump array and probe card using same

Abstract

Disclosed are a probe head having a movable contact bump array, and a probe card using same. A probe head having a movable contact bump array according to the present invention is for inspecting an electronic device and comprises a movable contact bump array including a plurality of movable contact bump modules in electrical contact with a portion to be measured of the electronic device, the plurality of movable contact bump modules being provided in a predetermined arrangement. The movable contact bump modules each include: a contact bump in electrical contact with the portion to be measured; a movable plate which is coupled to or integrated with the contact bump and is moved in a vertical direction by the action of an external force generated due to electrical contact with the portion to be measured; one or more suspension springs having one side elastically supporting the movable plate; and one or more posts fixing and supporting the other side of the suspension springs.

Description

A probe head having a movable contact bump array, and a probe card applying the same.

[0001] The present invention relates to a probe head having a movable contact bump array and a probe card applying the same, and more specifically, to a probe head having a movable contact bump array capable of improving high-frequency response characteristics and a probe card applying the same.

[0002] Generally, semiconductor devices are manufactured through a front-end process of forming circuit patterns and contact pads for inspection on a wafer, and a back-end process of packaging the wafer, on which the circuit patterns and contact pads are formed, into individual semiconductor chips.

[0003] Between the upstream and downstream processes, an inspection process is performed to inspect the electrical characteristics of the wafer by applying an electrical signal to contact pads formed on the wafer. This inspection process is performed to inspect for defects in the wafer and remove defective dies.

[0004] In the inspection process, a tester is used to apply an electrical signal to a wafer and obtain an output signal from the semiconductor chip to analyze the result; at this time, a probe card serves as an interface between the wafer and the tester.

[0005] The probe card includes a plurality of probes that contact electrical input / output terminal pads formed on a printed circuit board and a wafer, which receive electrical signals applied from a tester.

[0006] Recently, as the demand for highly integrated semiconductor chips increases, the circuit patterns formed on the wafer by the entire process become highly integrated, and as a result, the spacing between adjacent input / output terminal pads, that is, the pitch, is formed very narrowly.

[0007] At this time, the probe pin used must penetrate the oxide film on the aforementioned wafer pad and make electrical contact, so it is essential to have sufficient contact force. Accordingly, the probe pin requires an external force of a certain level or higher for the purpose of producing a certain scrubbing on the wafer pad, and for this reason, buckling type pins or cantilever type pins are used.

[0008] Meanwhile, with the recent rapid advancement of 2.5D and 3D advanced packaging technologies, new technologies are also required for probe cards. Advanced packaging technology creates a single semiconductor by connecting different types of semiconductors vertically or horizontally using fine wiring, and the core of this technology is heterogeneous integration. Heterogeneous integration is a technology that efficiently arranges semiconductors with different functions, such as memory and system semiconductors, to operate as a single chip. By connecting multiple independent semiconductor chips horizontally or vertically, it is possible to integrate more transistors into a smaller semiconductor (package) and provide solutions that surpass the performance of each individual chip.

[0009] As these advanced packages integrate multiple chips at the wafer level, they have various types of input / output terminals. Since there are often terminals for bonding, such as solder bumps or micropillars, in addition to pads, there are cases where the terminals of the workpiece are damaged when using probe pins used for pad contact on the wafer.

[0010] This is an inevitable phenomenon caused by high-intensity external forces, and it is a factor that imposes significant constraints on the design of test flows in semiconductor processes and is a major cause of defects in the inspection process.

[0011] As explained above, the recent trend of narrow pitch, in which the pitch is formed very narrowly, inevitably creates various difficulties in devising countermeasures for pitches that do not guarantee price competitiveness due to limitations in machining, price limitations, and alignment errors caused by differences in the coefficient of thermal expansion.

[0012] Furthermore, as the driving frequency increases, the driving voltage decreases, and the size of semiconductor chips decreases, high quality and accurate verification of the semiconductor chips are required. Accordingly, probe cards are required to possess electrical transmission characteristics, specifically high-efficiency transmission characteristics for high frequencies.

[0013] However, conventional probe cards include multilayer PCBs, interposers, space transformers (STF), and probe tips, and also form discontinuous surfaces caused by various signal lines, via holes, probe tips, and Zero Insertion Force (ZIF) connectors. These discontinuous surfaces act as factors that rapidly alter electromagnetic waves, generating High Order Mode (HOM) electromagnetic waves. Consequently, reflected waves are generated from the semiconductor tester equipment to the wafer through the probe card, hindering smooth signal transmission. Furthermore, as the pitch narrows, electromagnetic fields are formed between adjacent signal lines, causing crosstalk.

[0014] In addition, as the number of I / Os on the semiconductor wafer being measured increases, the supplied voltage decreases and the current consumed increases, thereby inducing noise in the power plane and ground plane of the probe card. Consequently, voltage fluctuations and signal transmission in the probe card may deteriorate, so designing the probe card with high-frequency response characteristics is an important matter for improving the performance of the probe card.

[0015] A critical part of the frequency response characteristics of a probe card is the probe tip that contacts the object to be measured. It is required to lower the electrical resistance of this probe tip. Furthermore, when using buckling pins or vertical MEMS spring pins, the probe tip must have a minimum length because an overdrive is required to apply constant pressure to the electrode pads of the semiconductor chip, which poses a significant constraint on improving frequency response characteristics.

[0016] Therefore, a solution to the aforementioned problems is required.

[0017] Accordingly, the present invention was created to solve the above-mentioned problems, and the objective of the present invention is to provide a probe head having a movable contact bump array capable of improving high-frequency response characteristics, and a probe card to which the same is applied.

[0018] The purpose of the invention is not limited to the purposes mentioned above, and other unmentioned purposes will be clearly understood by those skilled in the art from the description below.

[0019] A probe head having a movable contact bump array according to the first aspect of the present invention for achieving the above objective is a probe head for inspecting an electronic device, comprising a plurality of movable contact bump modules that make electrical contact with a part to be measured of the electronic device, and a movable contact bump array having a plurality of movable contact bump modules arranged in a predetermined arrangement, wherein the movable contact bump module comprises a contact bump that makes electrical contact with the part to be measured, a movable plate that is coupled or integrally formed with the contact bump and moves in an up-and-down direction due to an external force acting on the part to be measured, one or more suspension springs that elastically support the movable plate on one side, and one or more posts that fixedly support the other side of the suspension spring.

[0020] When the above-mentioned movable plate moves downward, it may include a through-electrode pad located in an area that contacts the contact bump electrically contacting the above-mentioned measurement area, and electrically connects the above-mentioned measurement area and the through-substrate electrode.

[0021] The above-mentioned through electrode pad can be electrically connected to the above-mentioned post.

[0022] The height of the end portion of the contact bump may be characterized as being greater than the height of the movable plate.

[0023] The above contact bump may be provided with any one of nickel, nickel alloy, nickel composite, copper, and copper alloy.

[0024] The above contact bump may be coated with one or more of gold, silver, and copper.

[0025] One or more of rhodium, rhodium alloy, ruthenium, ruthenium alloy, tungsten, tungsten alloy, palladium, and palladium alloy may be further coated on the above contact bump.

[0026] The above suspension spring may be provided as any one of a coil type, meander type, mesh type, and strip beam type corresponding to the operating stroke range.

[0027] The device further includes a movable contact bump array panel comprising the above-mentioned movable contact bump array, and the movable contact bump array panel can be fixed by adhesive fixation or through a mechanical connection means in a state where each through electrode pad corresponding to each contact bump of the movable contact bump array panel is mutually matched.

[0028] And, according to the second aspect of the present invention for achieving the above objective, a probe card having a movable contact bump array is a probe card for inspecting an electronic device, comprising: a plurality of movable contact bump modules that make electrical contact with a part to be measured of the electronic device, and a movable contact bump array having a plurality of movable contact bump modules arranged in a predetermined arrangement; a probe head including a through electrode pad that electrically connects the part to be measured and a through-substrate electrode through contact with the movable contact bump module, and a stacked structure extending to a PCB board connected to the probe head and transmitting an electrical signal obtained from the part to be measured to an inspection device that performs inspection of the electronic device, wherein the movable contact bump module comprises a contact bump that makes electrical contact with the part to be measured, a movable plate that is combined or integrated with the contact bump and moves in an up-and-down direction due to an external force acting on the part to be measured, one or more suspension springs that elastically support the movable plate on one side, and one or more posts that fixedly support the other side of the suspension spring.

[0029] The above-mentioned through-electrode pad can be directly provided on a space transformer (STF), which is one of the stacked structures that compensates for the difference in spacing between the contact bump and the terminal located on the PCB substrate.

[0030] The above probe head can be stacked on the upper side of a space transformer (STF), which is one of the stacked structures.

[0031] In the case where an interposer supporting an electrical connection between the electronic device and the PCB substrate is provided as one of the above stacked structures, some or all of the through electrodes of the interposer may be formed as POGO pins to distribute the overdrive for the external force action.

[0032] Accordingly, the present invention has the advantage of being able to flexibly cope with height differences of solder bumps or micropillars of a workpiece, significantly reduce the transmission path of electrical signals, and eliminate the guide plate used in conventional technology, thereby reducing dielectric loss that occurs when applying a guide plate and improving the high-frequency response characteristics of the probe head and probe card.

[0033] In addition, the present invention has the advantage of minimizing damage to solder bumps or micro-pillars of a workpiece by reducing the contact force with the workpiece through the elastic action of a suspension spring when contacting the workpiece via an external force.

[0034] In addition, since the present invention has a structure that eliminates the need for a guide plate supporting the probe pin, the process of forming the guide plate can be omitted, which has the advantage of enabling the production of low-cost probe heads and probe cards.

[0035] In addition, the present invention has the advantage of being able to provide a probe head and a probe card composed of probe pins having a high yield strength that can correspond to a narrow pitch, which is the distance between adjacent contact pads of an electronic device.

[0036] In addition, the present invention has the advantage of being able to provide a probe head and a probe card that can improve the Current Carrying Capacity (CCC) based on high electrical conductivity and reduce noise in the detection signal caused by electrical resistance.

[0037] The effects of the present invention are not limited to those mentioned above, and other unmentioned effects will be clearly understood by those skilled in the art from the description in the claims.

[0038] FIG. 1 is a drawing showing a movable contact bump module according to one embodiment of the present invention.

[0039] FIG. 2 is a drawing showing a first example of operation of a probe head including the movable contact bump module of FIG. 1.

[0040] FIG. 3 is a drawing showing a second example of operation of a probe head including the movable contact bump module of FIG. 1.

[0041] FIG. 4 is a drawing showing other suspension spring types of the present invention.

[0042] FIG. 5 is a drawing showing a probe head according to one embodiment of the present invention.

[0043] FIG. 6 is a drawing showing a probe head according to another embodiment of the present invention.

[0044] FIG. 7 is a drawing showing a probe card according to one embodiment of the present invention.

[0045] FIG. 8 is a drawing showing a probe card according to another embodiment of the present invention.

[0046] FIG. 9 is a drawing showing a probe card according to another embodiment of the present invention.

[0047] Figure 10 is a graph showing the experimental results of S-Parameters for the probe head and probe card of the present invention.

[0048] And, FIG. 11 is a graph showing the results of an experiment on crosstalk for the probe head and probe card of the present invention.

[0049] Hereinafter, embodiments will be described in detail with reference to the attached drawings. However, the scope of the patent application is not limited or restricted by these embodiments. Identical reference numerals in each drawing indicate identical components.

[0050] Various modifications may be made to the embodiments described below. The embodiments described below are not intended to limit the forms of practice and should be understood to include all modifications, equivalents, and substitutions thereof.

[0051] Terms such as "first" or "second" may be used to describe various components, but these terms should be understood solely for the purpose of distinguishing one component from another. For example, a first component may be named a second component, and similarly, a second component may be named a first component.

[0052] The terms used in the embodiments are used merely to describe specific embodiments and are not intended to limit the embodiments. A singular expression includes a plural expression unless the context clearly indicates otherwise. In this specification, phrases such as “A or B,” “at least one of A and B,” “at least one of A or B,” “A, B or C,” “at least one of A, B and C,” and “at least one of A, B, or C” may each include any one of the items listed together with the corresponding phrase, or any possible combination thereof. In this specification, terms such as “comprising” or “having” are intended to indicate the presence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not precluding the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0053] Unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by those skilled in the art to which the embodiments pertain. Terms such as those defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant technology, and should not be interpreted in an ideal or overly formal sense unless explicitly defined in this application.

[0054] In addition, when describing with reference to the attached drawings, identical components are assigned the same reference numeral regardless of drawing symbols, and redundant descriptions thereof are omitted. When describing the embodiments, if it is determined that a detailed description of related prior art could unnecessarily obscure the essence of the embodiments, such detailed description is omitted.

[0055] The probe head having a movable contact bump array of the present invention and the probe card applying the same are configured to improve high-frequency response characteristics.

[0056] Hereinafter, embodiments of the present invention will be described in detail with reference to the attached drawings.

[0057] FIG. 1 is a drawing showing a movable contact bump module according to one embodiment of the present invention.

[0058] As illustrated in FIG. 1, the movable contact bump module (110) makes electrical contact with a part to be measured of an electronic device (e.g., electrode pad, solder bump, micropillar, etc.), and includes a contact bump (114) that makes electrical contact with the part to be measured, a movable plate (113) that is combined or integrated with the contact bump (114) and moves up and down by an external force acting on the part to be measured, one or more suspension springs (112) that elastically support the movable plate on one side, and one or more posts (111) that fixedly support the other side of the suspension spring (112).

[0059] The contact bump (114) is a structure that acts as a probe tip to contact the part of the object to be measured and connect an electrical signal to the outside (e.g., an inspection device), and the movable plate (113) is a structure that is connected to the suspension spring (112) and can move in the up-and-down direction (i.e., vertical direction), and can be provided as a combined type that is integrated with the contact bump (114) or separated from the contact bump (114).

[0060] The contact bump (114) can be provided with any one of nickel, nickel alloy, nickel composite, copper, and copper alloy, and it is also possible to apply a metal with better conductivity, such as gold, silver, etc., to further improve electrical properties.

[0061] At this time, the contact bump (114) may be provided with the entire material of the aforementioned metal or plated with the aforementioned metal, and for example, the entire material of the contact bump (114) may be provided with any one of nickel, nickel alloy, nickel composite, copper and copper alloy, and then coated with any one of gold, silver, and copper.

[0062] In addition, when the movable plate (113) is provided integrally with the contact bump (114), it is also possible to provide it with a material having the aforementioned electrical characteristics.

[0063] Since the tip of the contact bump (114) is a part responsible for physical contact with the part of the object to be measured, one or more of rhodium, rhodium alloy, ruthenium, ruthenium alloy, tungsten, tungsten alloy, palladium, and palladium alloy may be applied to prevent or reduce mechanical wear and contamination by debris. Here, to improve the durability of the tip portion of the contact bump, it is not limited to any one of rhodium, rhodium alloy, ruthenium, ruthenium alloy, tungsten, tungsten alloy, palladium, and palladium alloy, and other metals may also be applied.

[0064] In addition to being formed with one contact bump (114) and one movable plate (113), it is also structurally possible for multiple contact bumps (114) to be formed on one movable plate (113).

[0065] The post (111) is a structure for supporting the contact bump (114) and the movable plate (113) on the through-electrode substrate and is electrically connected to the through-substrate electrode. Such a post (111) may be plated with the previously described highly conductive metal to improve electrical properties.

[0066] The suspension spring (112) is a spring designed to allow the movable plate (113) to move in the up and down direction by an external force, and may be provided in one or more numbers. Additionally, the suspension spring (112) is designed to have a thickness and width that do not cause plastic deformation until it moves to the air gap and comes into contact with the through-substrate electrode, and a material (e.g., nickel or nickel alloy) capable of having high yield stress under this physical structure may be applied.

[0067] Additionally, the suspension spring (112) can also be plated with the aforementioned highly conductive material to improve electrical properties.

[0068] FIG. 2 is a drawing showing a first example of operation of a probe head including a movable contact bump module of FIG. 1, and FIG. 3 is a drawing showing a second example of operation of the movable contact bump module of FIG. 1.

[0069] As shown in FIG. 2, the height of the end portion of the contact bump (114) is greater than the height of the movable plate (113), and the sum of the height of the contact bump (114) and the height of the movable plate (113) is greater than the air gap.

[0070] In addition, the first operation of the probe head (100) illustrated in FIG. 2 is a state in which the contact bump (114) of the probe head (100) does not contact the measurement area of ​​the electronic device, which is the structure to be measured, and an external force is not applied to move the probe head (100) to the measurement area to measure the electronic device.

[0071] On the other hand, the second operation of the probe head (100) illustrated in FIG. 3 is a state in which the contact bump (114) of the probe head (100) is in contact with the measurement area of ​​the electronic device, which is the structure to be measured, and an external force is applied to move the probe head (100) to the measurement area to measure the measurement area of ​​the electronic device.

[0072] When the second operation of the aforementioned probe head (100) occurs, the movable plate (113) moves downward, and contact is made between the contact bump (114) and the through electrode pad (120) located in the area in contact with the contact bump (114) that has electrically contacted the measurement area.

[0073] Here, the fact that electrical contact is made between the contact bump (114) and the penetrating electrode pad (120) means that the contact bump (114) is formed in a structure that penetrates the movable plate (113) and comes into direct contact with the penetrating electrode pad (120), or that the entire or part of the movable plate (113) is provided with a conductive material such as the contact bump (114) and the penetrating electrode pad (120) is electrically connected to the part to be measured of the electrical element, thereby enabling electrical connection between the contact bump (114) and the penetrating electrode pad (120).

[0074] Such a through electrode pad (120) may also be electrically connected to a post (111), which is a structure electrically connected to the through-substrate electrode, thereby diversifying the transmission path for electrical signals between the part of the electrical element to be measured and the inspection device.

[0075] FIG. 4 is a drawing showing other suspension spring types of the present invention.

[0076] As illustrated in FIG. 4 a) to f), the suspension spring may be provided in any one of the following types, including coil type, meander type, mesh type, and strip beam type, depending on the contact force with which the contact bump (114) and the movable plate (113) contact the penetrating electrode pad (120) and the maximum movable displacement (i.e., movable stroke range) with which the movable plate (113) moves up and down to contact the penetrating electrode pad (120), but is not limited thereto.

[0077] In addition, the thickness and width of the suspension spring can be determined by a design that considers the condition that plastic deformation does not occur until the movable plate moves to the air gap and contacts the through-substrate electrode, and the overdrive of the external force applied to contact the probe head with the part to be measured of the electronic device, thereby preventing damage to the part to be measured and the resistance requirements of the tip portion of the contact bump.

[0078] FIG. 5 is a drawing showing a probe head according to one embodiment of the present invention.

[0079] As illustrated in FIG. 5, a probe head (100) having a movable contact bump array is a probe head (100) for inspecting an electronic device, and includes a plurality of movable contact bump modules (110) that make electrical contact with a part to be measured of the electronic device, and includes a movable contact bump array having a plurality of movable contact bump modules arranged in a predetermined arrangement.

[0080] Here, the movable contact bump module (110) comprises, as previously described, a contact bump (114) that makes electrical contact with a part of an electronic element being measured, which is a structure being measured; a movable plate (113) that is combined or integrated with the contact bump (114) and moves up and down due to an external force acting on the part being measured through electrical contact; one or more suspension springs (112) that elastically support the movable plate (113) on one side; and one or more posts (111) that fixedly support the other side of the suspension spring.

[0081] Additionally, the probe head (100) may further include a through electrode pad (120) located in an area that contacts a contact bump (114) that electrically contacts a part of an electronic component, which is a structure to be measured, when the movable plate (113) included in the movable flat contact bump module (110) moves downward, a through electrode (130) that electrically connects the part of an electronic component to be measured and an inspection device, which is an external device connected to the probe head (100), through electrical contact between the contact bump (114) and the through electrode pad (120), and an insulating substrate (140) that is laminated in a structure surrounding the through electrode (130).

[0082] FIG. 6 is a drawing showing a probe head according to another embodiment of the present invention.

[0083] The probe head (200) includes a plurality of movable contact bump modules (210) that make electrical contact with a measurement area of ​​an electronic device, and further includes a movable contact bump array panel (250) that includes a movable contact bump array having a plurality of movable contact bump modules arranged in a predetermined arrangement, and the movable contact bump array panel (250) can be fixed by adhesive fixing or through a mechanical connection means in a state where each through electrode pad (220) corresponding to each contact bump of the movable contact bump array panel (250) is mutually matched.

[0084] Likewise, the probe head (200) includes a movable contact bump module (210) as shown in FIG. 6, and may further include a through electrode pad (220), a through substrate electrode (230), and an insulating substrate (240).

[0085] The drawing of FIG. 6 shows the movable contact bump array panel (250) separated from the probe head (200).

[0086] According to one example, the size of the contact bumps varies between a diameter of 50 μm and 200 μm and a height of 100 μm and 500 μm, and the movable contact bump array is provided with tens to hundreds of these contact bumps in a predetermined specific arrangement corresponding to the measurement area of ​​the electronic device, which is the structure to be measured (e.g., 20 to 100 contact bumps are required for small electronic devices, and 200 to 500 contact bumps are required for large electronic devices).

[0087] In addition, the contact bumps are consumables that must be replaced according to the inspection contact cycle and have a lifespan of approximately 10,000 to 100,000 inspection contacts. Therefore, a process or means is required to facilitate manufacturing and to easily replace tens to hundreds of contact bumps in the probe head (200).

[0088] The aforementioned movable contact bump array panel (250) is a movable contact bump array panel having contact bumps arranged within the panel, and can be fixed to the probe head (200) by adhesive fixation or through mechanical connection means.

[0089] That is, by separately manufacturing a movable contact bump array panel (250), a structure in which tens to hundreds of contact bumps are arranged can be easily manufactured.

[0090] When a movable contact bump array panel (250) is bonded to a probe head (200), the process of applying tens to hundreds of contact bumps on the probe head (200) can be easily performed, and when replacing, the fixed bonded movable contact bump array panel (250) can be physically removed and a new movable contact bump array panel (250) can be re-bonded, so this can also be easily performed.

[0091] In addition, when a movable contact bump array panel (250) is fixed to a probe head (200) via a mechanical connection means, the process of applying tens to hundreds of contact bumps on the probe head (200) can be performed more easily than the aforementioned adhesive method, and replacement is also easier than the adhesive method because it is a detachable method.

[0092] Since individual contact bumps are very small structures, it is difficult to attach or detach them one by one using adhesive or mechanical methods; however, as previously explained, applying a movable contact bump array panel structure allows for easy fixing through adhesive or mechanical connection since the focus is on the panel rather than the individual contact bumps.

[0093] FIG. 7 is a drawing showing a probe card according to one embodiment of the present invention.

[0094] A probe card (300) having a movable contact bump array comprises a plurality of movable contact bump modules (310) that make electrical contact with a part of an electronic device to be measured, a movable contact bump array having a plurality of movable contact bump modules arranged in a predetermined arrangement, a probe head including a through-electrode pad that electrically connects the part to be measured and a through-substrate electrode through contact with the movable contact bump module (310), and a stacked structure including a PCB board (340) connected to the probe head and transmitting an electrical signal obtained from the part to be measured to an inspection device that performs an inspection of the electronic device.

[0095] As illustrated in FIG. 7, the probe card (300) can be manufactured in a structure in which a through electrode pad is directly provided on a space transformer (STF: Space Transformer, 320), which is one of the stacked structures that compensates for the difference in spacing between a contact bump and a terminal located on a PCB substrate (340).

[0096] The aforementioned stacked structure may further include an interposer (330) that supports an electrical connection between the electronic device to be measured and the PCB substrate (340).

[0097] At this time, the PCB substrate (340) is a structure that supports the interposer (330) on the electrode substrate and is electrically connected to the through-substrate electrode. Additionally, the PCB substrate (340) may be plated with a metal having excellent conductivity, and if necessary, a certain stiffener may be additionally mounted on the back of the PCB substrate to correct warpage caused by the PCB substrate multilayer.

[0098] Additionally, the interposer (330) forms a multilayer STF (Space Transformer) on the via through electrode to electrically extend the connection between the movable contact bump array and the PCB substrate (340), and the via hole (331) can be filled with a metal material with excellent electrical conductivity such as copper, and the substrate can be provided with a high-resistance silicon wafer, a glass wafer, a plastic substrate (or ceramic substrate) including polyimide.

[0099] That is, the interposer (330) may include a via hole (331) for signal routing and a support structure (332) for supporting it, as shown in FIG. 7.

[0100] The space transformer (STF: Space Transformer, 320) is equipped with a narrow-pitch wiring arrangement and via insulating film lamination for electrical connection between a movable contact bump and an interposer, and the insulating film may be polyimide, silicon nitride, or silicon dioxide.

[0101] FIG. 8 is a drawing showing a probe card according to another embodiment of the present invention.

[0102] As illustrated in FIG. 8, the probe card (400) may be manufactured by forming some or all of the through electrodes of the interposer (430) into POGO pins (431) to distribute overdrive for external force action, when the interposer (430) is provided with an interposer (430) that supports electrical connection between an electronic device and a PCB substrate (440) as one of the stacked structures.

[0103] Here, the probe card (400) may be configured to include a movable contact bump module (410) as shown in FIG. 8, and further include a space transformer (STF: Space Transformer, 420), an interposer (430), and a PCB substrate (340).

[0104] An interposer block (430) having a pogo pin (431) formed thereon can electrically connect the pogo pin (431) to a through electrode after forming a via hole, and distribute the overdrive caused by an external force applied to measure the part of the electronic device to be measured through the operation of the pogo pin (431).

[0105] That is, as shown in FIG. 8, the interposer (430) may include a pogo pin (431) placed in a via hole portion for signal routing and a support structure (432) to support it.

[0106] Of course, it is possible to mitigate the overdrive caused by the aforementioned external force through the contact bump and suspension spring, but by additionally distributing the overdrive caused by the aforementioned external force through the POGO pin (431), it is possible to design the contact bump and suspension spring structure to consider other characteristics rather than focusing solely on the overdrive.

[0107] Here, the interposer (430) may further include an elastic layer (433) to allow the POGO pin (431) to maintain its original pre-pressed state without being pressed normally, as shown in FIG. 8.

[0108] And, FIG. 9 is a drawing showing a probe card according to another embodiment of the present invention.

[0109] As shown in FIG. 9, the probe card (500) can also be manufactured with a structure in which an interposer (530) replaced with a POGO pin (531) and the probe head of FIG. 5 are applied.

[0110] Here, the probe card (500) may be provided with a structure that includes a movable contact bump module (510) as shown in FIG. 9, and further includes a through-substrate electrode (520), an insulating substrate (550), and a PCB substrate (540).

[0111] At this time, the probe head can be stacked on the upper side of the interposer (530) so that it can move up and down by means of the pogo pin (531) of the interposer (530).

[0112] As shown in FIG. 9, the interposer (530) may further include a support structure (532) for supporting a pogo pin (531) placed in a via hole portion for signal routing and an elastic layer (533) for maintaining the existing pre-pressed state so that the pogo pin (531) is not pressed normally.

[0113] FIG. 10 is a graph showing the experimental results of S-Parameters for the probe head and probe card of the present invention, and FIG. 11 is a graph showing the experimental results of Crosstalk for the probe head and probe card of the present invention.

[0114] As shown in Fig. 10, the results of the S-Parameters experiment for the probe head and probe card of the present invention are summarized as shown in below, and to demonstrate that the performance of the probe head and probe card of the present invention is significant, the results were compared with the experimental results of the POGO type probe pin of the prior art.

[0115] MPBPOGOReturn Loss(@-20dB)>100GHz1.56GHzInsertion Loss(@-20dB)>100GHz6.52GHzPhase(@100GHz)25.632deg408.1258deg

[0116] Here, 'MPB' refers to the probe head and probe card of the present invention, and the 'Return Loss (@-20dB)' performance is maintained in a high-frequency range of 100 GHz or higher. This is significantly meaningful when compared to the 'Return Loss (@-20dB)' performance of the conventional POGO type at 1.56 GHz. Furthermore, since the 'Return Loss (@-20dB)' performance of the conventional technology, including the POGO type, is maintained in a high-frequency range of 1 GHz to 10 GHz, the 'Return Loss (@-20dB)' performance of the probe head and probe card of the present invention provides a significant advantage over the conventional technology.

[0117] In addition, the 'Insertion Loss (@-20dB)' performance of the probe head and probe card of the present invention is maintained in the high-frequency range of 100GHz or higher, whereas the 'Return Loss (@-20dB)' performance of the conventional POGO type is only 6.52GHz. Therefore, the 'Insertion Loss (@-20dB)' performance of the probe head and probe card of the present invention provides a significant advantage over the conventional.

[0118] Also, when examining the 'Phase (@100GHz)' performance of the probe head and probe card of the present invention, it is confirmed by an experimental result of 25.632deg, which means that almost no phase delay occurs. Since the loss and phase change of the electrical signal transmitted through the probe head and probe card of the present invention are not significant, this also confirms the performance of the probe head and probe card of the present invention.

[0119] On the other hand, the 'Phase (@100GHz)' performance of the conventional POGO type is confirmed to be 408.1258deg, and since 408.1258deg means a value exceeding a 360-degree phase change, it is confirmed to be significantly lower performance when compared to the 'Phase (@100GHz)' performance of the probe head and probe card of the present invention.

[0120] As shown in Fig. 11, the results of the crosstalk experiment for the probe head and probe card of the present invention are summarized as shown in below, and in order to show that the performance of the probe head and probe card of the present invention is significant, the results were compared with the experimental results of the POGO type probe pin of the prior art.

[0121] MPBPOGONEXT (@-20dB)>100GHz2.62GHzFEXT (@-20dB)>100GHz4.99GHz

[0122] The 'NEXT (@-20dB)' performance of the probe head and probe card of the present invention is maintained in a high frequency range of 100 GHz or higher. This is significantly meaningful when compared to the 'NEXT (@-20dB)' performance of the conventional POGO type at 2.62 GHz.

[0123] In addition, the 'FEXT (@-20dB)' performance of the probe head and probe card of the present invention is maintained in the high-frequency range of 100GHz or higher, whereas the 'FEXT (@-20dB)' performance of the conventional POGO type is only 6.52GHz. Therefore, the 'FEXT (@-20dB)' performance of the probe head and probe card of the present invention provides a significant advantage over the conventional.

[0124] Although embodiments of the present invention have been described above with reference to the attached drawings, those skilled in the art will understand that the present invention may be implemented in other specific forms without changing its technical concept or essential features. Therefore, the embodiments described above should be understood as illustrative in all respects and not restrictive.

[0125] Furthermore, since the present invention provides a probe head having a movable contact bump array capable of improving high-frequency response characteristics and a probe card to which the same is applied, it is an invention with industrial applicability as it is not only sufficiently possible for commercial sale or business but also clearly feasible in reality.

Claims

1. In a probe head for testing electronic components, A movable contact bump array comprising a plurality of movable contact bump modules that make electrical contact with a measurement portion of the electronic device, and a plurality of movable contact bump modules arranged in a predetermined array, The above-described movable contact bump module comprises a contact bump that makes electrical contact with the area to be measured; A movable plate that is combined with or integrated with the above contact bump and moves in the up and down direction due to the action of an external force resulting from electrical contact with the area to be measured; One or more suspension springs, one side of which elastically supports the movable plate; and A probe head having a movable contact bump array comprising one or more posts that fixedly support the other side of the suspension spring.

2. In Paragraph 1, A probe head having a movable contact bump array, which includes a through electrode pad that electrically connects the contact bump that is electrically in contact with the measurement site when the movable plate moves downward, and which is located in an area that contacts the contact bump that is electrically in contact with the measurement site.

3. In Paragraph 2, A probe head having a movable contact bump array in which the above-mentioned through electrode pad is electrically connected to the above-mentioned post.

4. In Paragraph 1, A probe head having a movable contact bump array characterized in that the height of the end portion of the contact bump is greater than the height of the movable plate.

5. In Paragraph 1, The above contact bump is a probe head having a movable contact bump array equipped with any one of nickel, nickel alloy, nickel composite, copper, and copper alloy.

6. In Paragraph 5, The above contact bump is a probe head having a movable contact bump array coated with one or more of gold, silver, and copper.

7. In Paragraph 6, The above contact bump is a probe head having a movable contact bump array to which one or more of rhodium, rhodium alloy, ruthenium, ruthenium alloy, tungsten, tungsten alloy, palladium, and palladium alloy are further applied.

8. In Paragraph 1, The above suspension spring is a probe head having a movable contact bump array configured as any one of a coil type, meander type, mesh type, and strip beam type corresponding to the movable stroke range.

9. In Paragraph 2, A probe head having a movable contact bump array, further comprising a movable contact bump array panel including the above-mentioned movable contact bump array, wherein the movable contact bump array panel is fixed by adhesive fixation or through a mechanical connection means in a state in which each through electrode pad corresponding to each contact bump of the movable contact bump array panel is mutually matched.

10. In a probe card for testing electronic components, A movable contact bump array comprising a plurality of movable contact bump modules that make electrical contact with a measurement portion of the electronic device, and a plurality of movable contact bump modules arranged in a predetermined arrangement; and a probe head comprising a through electrode pad that electrically connects the measurement portion and a through substrate electrode through contact with the movable contact bumps, A stacked structure extending to a PCB substrate connected to the probe head and transmitting an electrical signal obtained from the area to be measured to an inspection device that performs an inspection of the electronic device, wherein The above-described movable contact bump module comprises a contact bump that makes electrical contact with the area to be measured; A movable plate that is combined with or integrated with the above contact bump and moves in the up and down direction due to the action of an external force resulting from electrical contact with the area to be measured; One or more suspension springs, one side of which elastically supports the movable plate; and A probe card having a movable contact bump array comprising one or more posts that fixedly support the other side of the suspension spring.

11. In Paragraph 10, A probe card having a movable contact bump array that directly provides the through electrode pad on a space transformer (STF), which is one of the stacked structures that compensates for the difference in spacing between the contact bump and the terminal located on the PCB substrate.

12. In Paragraph 10, A probe card having a movable contact bump array that stacks the probe head on the upper side of a space transformer (STF), which is one of the stacked structures.

13. In Paragraph 10, A probe card having a movable contact bump array in which some or all of the through electrodes of the interposer are formed as POGO pins to distribute overdrive for the external force action, wherein one of the above stacked structures is provided with an interposer that supports an electrical connection between the electronic device and the PCB substrate.

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