Linear feedthrough and processing apparatus for semiconductor substrate using same

Abstract

A linear feedthrough is disclosed. According to an embodiment of the present invention, the linear feedthrough comprises: a hollow housing connected to a chamber; a shaft accommodated in the housing and having one end passing through a wall of the chamber to be connected to a susceptor to lift and lower same; a sealing unit disposed inside the housing to seal the gap between the housing and the shaft and having a plurality of seals for providing sealing even when the shaft linearly moves in the housing; and purge gas inflow paths disposed between the plurality of seals to discharge foreign substances between the seals to the outside.

Description

Linear feedthrough and semiconductor substrate processing device using the same

[0001] The present invention relates to a linear feedthrough and a semiconductor substrate processing apparatus using the same, and more specifically, to a linear feedthrough that prevents fluid leakage between a shaft and a housing, and a semiconductor substrate processing apparatus equipped with the same.

[0002] Semiconductor substrate processing equipment is used for the mass production of integrated circuits. To deposit thin films of a predetermined thickness on substrates such as semiconductor wafers or glass, physical vapor deposition (PVD), such as sputtering, and chemical vapor deposition (CVD), which utilizes chemical reactions, are used. Chemical vapor deposition methods include atmospheric pressure CVD (APCVD), low pressure CVD (LPCVD), and plasma enhanced CVD (PECVD). In addition, furnace equipment is used for the heat treatment of substrates for film deposition, oxidation, annealing, and impurity diffusion treatment of semiconductor wafers.

[0003] Here, Plasma Organic Chemical Vapor Deposition (PECVD) is a method of depositing thin films by forming a plasma through an electric field applied to a mixed gas inside a chamber (reactor), and the deposition is performed using radical particles among the cations, anions, electrons, and radicals generated during plasma formation. Radical particles are very unstable and have the property of easily chemically combining with other elements even at low temperatures, so they are used as a deposition means in Plasma Organic Chemical Vapor Deposition.

[0004] In a deposition apparatus using such plasma, the susceptor moves up and down to secure the semiconductor substrate and ensure stable deposition. Conventionally, bellows were used on the lifting rod to raise and lower the susceptor while maintaining airtightness.

[0005] A bellows is a corrugated tube formed by welding multiple metal plates to maintain airtightness during linear motion of rising and falling. However, since bellows are manufactured by welding, cracks develop during prolonged use, making it impossible to maintain airtightness. If cracks occur in the bellows, there is a problem that contamination within the chamber may occur due to the generation of particles.

[0006] The present invention aims to solve the aforementioned problems by providing a linear feedthrough, which is a linear motion sealing device with integrated sealing and lifting / lowering functions, and a semiconductor substrate processing device utilizing the same, which eliminates the need for separate bellows and lifting / lowering rods, thereby making the structure very concise and simple.

[0007] In addition, the invention provides a linear and rotary motion sealing device that does not require a separate supply of lubricant, and a semiconductor substrate processing device utilizing the same.

[0008] In addition, the invention provides a linear feedthrough and a semiconductor substrate processing device utilizing the same, which can prevent foreign substances, such as particles from the chamber, from entering the interior of the linear motion sealing device and prevent foreign substances from the linear feedthrough from leaking into the chamber.

[0009] The problems to be solved by the present invention are not limited to those mentioned above, and other unmentioned technical problems will be clearly understood by a person skilled in the art from the description below.

[0010] According to one embodiment of the present invention, a linear feedthrough mounted in a chamber that processes a semiconductor substrate while raising and lowering a susceptor that loads a semiconductor substrate comprises: a hollow housing connected to the chamber; a shaft accommodated within the housing, with one end penetrating the wall of the chamber and connected to the susceptor to raise and lower the susceptor; a sealing portion having a plurality of seals disposed within the housing to seal the gap between the housing and the shaft, and which perform sealing even when the shaft moves linearly within the housing; and a purge channel disposed between the plurality of seals to discharge foreign matter between the seals to the outside.

[0011] Additionally, the chamber side between the housing and the shaft further includes a bushing for supporting the linear motion of the shaft; the plurality of seals includes three lip seals in which a curved lip is formed on the inner circumference of an annular sealing, and within the housing, from the chamber side, the bushing, the first lip seal, the first purge path, the second lip seal, the second purge path, and the third lip seal may be arranged sequentially.

[0012] Additionally, the housing includes a first inner diameter portion and a second inner diameter portion having different inner diameters, the bushing is disposed in the first inner diameter portion, and a plurality of lip seals and purge passages are disposed in the second inner diameter portion, and the inner diameter of the first inner diameter portion may be larger than the inner diameter of the second inner diameter portion.

[0013] In addition, one or more O-rings may be provided on the outer surface of the bushing that contacts the inner diameter of the housing to prevent relative rotation between the bushing and the housing.

[0014] In addition, a pressure sensor capable of measuring pressure may be provided in the first purge path and the second purge path.

[0015] In addition, each of the above lip seals may be provided with a plurality of curved lip portions in a single body portion.

[0016] In addition, at least two of the plurality of curved ribs may be curved in different directions.

[0017] In addition, an annular anti-rotation member may be provided on the outer surface of the lip seal facing the housing to prevent relative rotation with respect to the housing within the housing of the lip seal.

[0018] A semiconductor substrate processing apparatus for processing a semiconductor substrate according to one embodiment of the present invention comprises: a chamber for receiving the semiconductor substrate; a susceptor provided within the chamber for loading the semiconductor substrate; and a linear feedthrough mounted in the chamber for sealing the chamber while rotating and raising and lowering the susceptor. The linear feedthrough may include: a hollow housing connected to the chamber; a shaft received within the housing, one end of which penetrates the wall of the chamber and is connected to the susceptor to raise and lower the susceptor; a sealing part having a plurality of seals disposed within the housing to seal the gap between the housing and the shaft, and which perform sealing even when the shaft moves linearly within the housing; and a purge channel disposed between the plurality of seals to discharge foreign matter between the seals to the outside.

[0019] A linear feedthrough according to one embodiment of the present invention and a semiconductor substrate processing device using the same do not require a separate bellows and a lifting / lowering rod, so the structure can be made very concise and simple, and the sealing function and the lifting / lowering function can be integrated.

[0020] In addition, a separate supply of lubricant is not required.

[0021] In addition, it is possible to prevent foreign substances, such as particles from the chamber, from entering the interior of the linear motion sealing device, and to prevent foreign substances from the linear feedthrough from flowing out into the chamber.

[0022] The effects of the present invention are not limited to those mentioned above, and other unmentioned effects will be clearly understood by a person skilled in the art from the description below.

[0023] FIG. 1 is a drawing showing a linear feedthrough according to one embodiment of the present invention and a semiconductor substrate processing apparatus using the same.

[0024] FIG. 2 is a drawing showing the states in which the shaft is raised and lowered in a linear feedthrough according to one embodiment of the present invention.

[0025] FIG. 3 is a detailed drawing showing the structure of a linear feedthrough according to one embodiment of the present invention.

[0026] FIG. 4 illustrates various lip seals that can be used in a linear feedthrough according to one embodiment of the present invention.

[0027] Embodiments of the present invention are described below with reference to the attached drawings so that those skilled in the art can easily implement the invention. However, the present invention may be embodied in various different forms and is not limited to the embodiments described herein. Furthermore, in order to clearly explain the embodiments of the present invention in the drawings, parts unrelated to the explanation have been omitted.

[0028] The terms used in this specification are used merely to describe specific embodiments and are not intended to limit the invention. Singular expressions may include plural expressions unless the context clearly indicates otherwise.

[0029] In this specification, terms such as “comprising,” “having,” or “having” are intended to indicate the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in the specification, and should be understood as not excluding in advance the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0030] In addition, the following embodiments are provided to explain more clearly to those with average knowledge in the industry, and the shapes and sizes of the elements in the drawings may be exaggerated for clearer explanation.

[0031] Hereinafter, a preferred embodiment according to the present invention will be described with reference to the attached drawings.

[0032] FIG. 1 is a drawing showing a linear feedthrough according to an embodiment of the present invention and a semiconductor substrate processing apparatus using the same, and FIG. 2 is a drawing showing the state in which a shaft is raised and lowered in a linear feedthrough according to an embodiment of the present invention, respectively. FIG. 3 is a drawing showing the structure of a linear feedthrough according to an embodiment of the present invention in detail.

[0033] Referring to FIGS. 1 to 3, a semiconductor substrate processing device (10) according to one embodiment of the present invention may include a linear feedthrough (100) and a chamber (20). Examples of the semiconductor substrate processing device (10) may include chemical vapor deposition equipment, furnace equipment, etching equipment, etc. The semiconductor substrate processing device (10) may include a loading unit (22) capable of loading a semiconductor wafer inside the chamber (20) and a linear feedthrough (100) for raising and lowering the loading unit (22). The linear feedthrough (100) raises and lowers the loading unit (22) at an appropriate speed, while simultaneously preventing process gas inside the chamber (20) from leaking out of the chamber (20) or foreign substances from outside the chamber (20) from entering the chamber (20).

[0034] A linear feedthrough (100) according to one embodiment of the present invention can be mounted in a chamber (20) while raising and lowering a susceptor (loading unit; 22) that loads a semiconductor substrate. The linear feedthrough (100) may include a hollow housing (110), a shaft (120), a sealing part (150), and a purge path (140A, 140B).

[0035] A hollow housing (110) is provided with a flange portion (112) at one end so that it can be connected to a chamber (20), and a shaft (120) can be accommodated inside so that it can move in a straight line.

[0036] The shaft (120) can be mounted to enable linear movement inside the hollow housing (110), and one end (121) can penetrate the wall of the chamber (20) and be connected to the susceptor (22) to raise and lower the susceptor (22).

[0037] The sealing portion (150) is disposed within the housing (110) to seal the gap between the housing (110) and the shaft (120), and may be provided with a plurality of seals (150; 150A, 150B, 150C) so that sealing can be performed even when the shaft (120) moves in a straight line within the housing (110). In this embodiment, each of the plurality of seals (150) may be a lip seal. That is, each of the plurality of seals (150) may be in the form of a curved lip formed on the inner circumference of an annular seal. The sealing portion (150) can prevent foreign substances (particles, etc.) that may occur in the linear feedthrough (100) from entering the vacuum chamber (20) provided on the upper side of the linear feedthrough (100), and can seal the chamber (20) to maintain a vacuum. The sealing portion (150) may be configured such that a plurality of seals (150A, 150B, 150C) are combined and disposed within the housing (110), and the plurality of seals (150A, 150B, 150C) are provided so that sealing is performed even when the shaft (120) moves linearly within the housing (110).

[0038] The purge channels (140A, 140B) are arranged between multiple seals (150) to discharge foreign substances between the seals to the outside. In this embodiment, three lip seals (150) are arranged, and two purge channels (140A, 140B) can each be arranged between the seals (150). Additionally, a purge port (142A, 142B) can be provided at one end of each purge channel (140A, 140B) to which a pneumatic device for forming pressurized or negative pressure can be connected. That is, the first purge channel (150A) can be arranged between the first lip seal (150A) and the second lip seal (150B), and the second purge channel (150B) can be arranged between the second lip seal (150B) and the third lip seal (150C). By applying negative pressure to the purge channels (140A, 140B), foreign matter between the lip seals (150A, 150B, 150C) can be sucked in and removed. Additionally, the purge channels (140A, 140B) may serve to prevent process gas inside the chamber (20) from being released to the outside through the linear feedthrough (100).

[0039] A linear feedthrough (100) according to one embodiment of the present invention may further include a bushing (130). The bushing (130) is provided to reduce frictional force during linear motion of the shaft (120) within the housing (110) by being coupled to the inner circumference of the housing (110) through which the shaft (120) passes. In this embodiment, the bushing (130) may be provided near the chamber (20) side between the housing (110) and the shaft (120). More specifically, within the housing (110), the bushing (130), the first lip seal (150A), the first purge path (140A), the first lip seal (150B), the second purge path (140B), and the third lip seal (150C) may be sequentially arranged from the chamber (20) side.

[0040] Meanwhile, the housing (110) may be divided into two parts with different inner diameters. That is, the housing (110) may include a first inner diameter part (110A) and a second inner diameter part (110B) having different inner diameters. A bushing (130) may be disposed in the first inner diameter part (110A), and a plurality of lip seals (150) and an inlet end of a purge path (140A, 140B) may be provided in the second inner diameter part (110B). Since the inner diameter of the first inner diameter portion (110A) is larger than the inner diameter of the second inner diameter portion (110B), the movement of the bushing (130) can be prevented by the step difference between them, and also, the inlet ends of the plurality of lip seals (150) and purge passages (140A, 140B) can be stably maintained without moving within the housing (110) by one end of the bushing (130).

[0041] Meanwhile, in one embodiment, one or more O-rings may be provided on the outer surface of the bushing (130) that contacts the first inner diameter portion (110A) of the housing (110) to prevent relative rotation between the bushing (130) and the housing (110).

[0042] In one embodiment, a pressure sensor capable of measuring pressure may be provided in the first purge path (140A) and the second purge path (140B). In one embodiment, a pressure sensor may be provided in the first purge port (142A) of the first purge path (140A) and the second purge port (142B) of the second purge path (140B). Through the pressure sensor, fluctuations in the pressure of the purge paths (140A, 140B) can be measured, and through this, damage and wear of a plurality of lip seals (150) can be detected. For example, if a fluctuation in the pressure of the first purge path (140A) is detected, damage to the first lip seal (150A) or the second lip seal (150B) can be inferred, and if a fluctuation in the pressure of the second purge path (140B) is detected, damage to the second lip seal (150B) or the third lip seal (150C) can be inferred.

[0043] FIG. 4 illustrates various lip seals that can be used in a linear feedthrough according to one embodiment of the present invention.

[0044] Referring to FIG. 4, each lip seal (150) used in a linear feedthrough (100) according to one embodiment of the present invention may be in the form of a plurality of curved lip portions (154) provided in a single body portion (152).

[0045] As illustrated in FIG. 4(a), when three lip seals (150) are used, the curving direction of the lip portions (154) is the same. As illustrated in FIG. 4(b), the curving directions of the lip portions (154A, 154B) among the plurality of lip seals (150) may be different from each other. As illustrated in FIG. 4(c), each lip seal (150) may include a plurality of lip portions (154), but at least two of the plurality of curved lip portions (154) may be curved in different directions. In the case of FIG. 4(a), when a vacuum is formed on the upper side, the lip portion (154) has a shape that is curved to the right to prevent foreign matter from flowing from the linear feedthrough (100) side of the lip seal (150) into the chamber (20) side, and in the case of FIG. 4(b), it can be configured to respond even if a vacuum is formed in either the upper or lower direction, or so that if one lip portion (154A) is consumed or damaged, the other lip portion (154B) can respond.

[0046] In one embodiment, an annular anti-rotation member (156) may be provided on the outer surface of the lip seal (150) facing the housing (110) to prevent relative rotation with respect to the housing (110) within the housing (110) of the lip seal (150). The anti-rotation member (156) serves to further press the lip seal (150) toward the shaft (120). Additionally, compared to when the anti-rotation member (156) is absent, that is, when the lip seal (150) is in direct contact with the inner surface of the housing (110), the frictional force between the anti-rotation member (156) and the lip seal (150) is greater. Accordingly, relative rotation of the lip seal (150) with respect to the housing (110) within the housing (110) can be suppressed.

[0047] In addition, when attempting to disassemble and reassemble the linear feedthrough (100) for reasons such as damage or inspection, even if the surface roughness of the housing (110) is relatively rough, the anti-rotation member (156) is in friction with the inner surface of the housing (110) during the disassembly and reassembly process, so the sealing part (150) can minimize damage caused by the low surface roughness of the housing (110). In addition, since there is an advantage that the anti-rotation member (156) can be reused even if it is damaged to some extent, the linear feedthrough (100) can be disassembled and reassembled more easily.

[0048] The linear feedthrough and the semiconductor substrate processing device using the same according to the above-described embodiments do not require a separate bellows and a lifting / lowering rod, so the structure can be made very concise and simple, and the sealing function and the lifting / lowering function can be integrated.

[0049] In addition, no separate supply of lubricating oil is required, and it is possible to prevent foreign substances such as particles from the chamber from entering the linear motion sealing device, and to prevent foreign substances from the linear feedthrough from leaking into the chamber.

[0050] In the embodiments described above, the linear feedthrough was explained as being applied to a semiconductor substrate processing apparatus; however, it is obvious that it can also be applied to various chemical processing chambers and the like that require shaft lifting and lowering motion and must perform a sealing function, in addition to semiconductor substrate processing apparatus.

[0051] Although the present invention has been described above with specific details such as specific components, limited embodiments, and drawings, this is provided only to aid in a more comprehensive understanding of the invention, and the invention is not limited to the above embodiments, and a person skilled in the art to which the invention belongs can make various modifications and variations from this description.

[0052] Accordingly, the scope of the present invention should not be limited to the embodiments described above, and all modifications equivalent to or equivalent to the claims set forth below, as well as the claims described below, shall be considered to fall within the scope of the concept of the present invention.

Claims

1. A linear feedthrough mounted in a chamber that processes a semiconductor substrate while raising and lowering a susceptor that loads the semiconductor substrate, A hollow housing connected to the above chamber; A shaft accommodated within the above housing, with one end penetrating the wall of the chamber and connected to the susceptor to raise and lower the susceptor; A sealing part comprising a plurality of seals disposed within the housing to seal the gap between the housing and the shaft, wherein the sealing is performed even when the shaft moves linearly within the housing; and A linear feedthrough comprising a purge channel disposed between the plurality of seals to discharge foreign matter between the seals to the outside.

2. In Paragraph 1, The chamber side between the housing and the shaft further includes a bushing for supporting the linear motion of the shaft. The plurality of seals above include three lip seals having curved lips formed on the inner circumference of an annular sealing, and A linear feedthrough in which, within the housing above, from the chamber side, the bushing, the first lip seal, the first purge path, the second lip seal, the second purge path, and the third lip seal are sequentially arranged.

3. In Paragraph 2, The above housing includes a first inner diameter portion and a second inner diameter portion having different inner diameters, and The bushing is disposed in the first inner diameter portion, and a plurality of the lip seals and the purge passages are disposed in the second inner diameter portion, and A linear feedthrough in which the inner diameter of the first inner diameter portion is larger than the inner diameter of the second inner diameter portion.

4. In Paragraph 2, A linear feedthrough having one or more O-rings provided on the outer surface of the bushing in contact with the inner diameter of the housing to prevent relative rotation between the bushing and the housing.

5. In Paragraph 2, A linear feedthrough in which a pressure sensor capable of measuring pressure is provided in the first purge path and the second purge path.

6. In Paragraph 2, Each of the above lip seals is a linear feedthrough in which a plurality of curved lip portions are provided in a single body portion.

7. In Paragraph 6, A linear feedthrough in which at least two of the plurality of curved lip portions are curved in different directions.

8. In Paragraph 2, A linear feedthrough having an annular anti-rotation member provided on the outer surface of the lip seal facing the housing to prevent relative rotation with respect to the housing within the housing of the lip seal.

9. A semiconductor substrate processing device for processing semiconductor substrates, A chamber for accommodating the above semiconductor substrate; A susceptor provided within the chamber for loading the semiconductor substrate; and It includes a linear feedthrough mounted in the chamber that seals the chamber while rotating and raising / lowering the susceptor; The above linear feedthrough is, A hollow housing connected to the above chamber; A shaft accommodated within the above housing, with one end penetrating the wall of the chamber and connected to the susceptor to raise and lower the susceptor; A sealing part comprising a plurality of seals disposed within the housing to seal the gap between the housing and the shaft, wherein the sealing is performed even when the shaft moves linearly within the housing; and A semiconductor substrate processing apparatus comprising: a purge channel disposed between the plurality of seals to discharge foreign substances between the seals to the outside.

Images