Imaging unit and imaging device

Abstract

This imaging unit comprises: an imaging element which images a subject; a first magnetic unit which is for moving the imaging element, and which generates a first magnetic field; and a second magnetic unit which generates a second magnetic field that reduces the first magnetic field.

Description

Imaging Unit and Imaging Device 【0001】 It relates to an imaging unit and an imaging device. 【0002】 An image sensor in which a plurality of pixels are arranged in a two-dimensional array is known. Conventionally, improvement in image quality has been desired. 【0003】 Japanese Patent Application Laid-Open No. 2008-186894 【0004】 According to a first aspect, the imaging unit includes an image sensor that images a subject, and a unit for moving the image sensor, the unit including a first magnetic unit that generates a first magnetic field, and a second magnetic unit that generates a second magnetic field for reducing the first magnetic field. 【0005】 According to a second aspect, the imaging device includes the above imaging unit and an imaging optical system that forms an image of a subject on the imaging surface of the image sensor. 【0006】 Note that the configuration of the embodiments described below may be appropriately improved, and at least a part thereof may be replaced with other components. Furthermore, constituent elements that are not particularly limited in terms of their arrangement are not limited to the arrangements disclosed in the embodiments, and can be arranged at positions where their functions can be achieved. 【0007】Figure 1(A) is a schematic diagram showing an example of the configuration of an imaging device according to an embodiment, and Figure 1(B) is a side view showing the configuration of an imaging module. Figure 2 is a diagram showing the schematic configuration of an image sensor. Figure 3 is an exploded perspective view showing an example of the configuration of an imaging unit according to the first embodiment. Figure 4(A) is a plan view showing the configuration of an imaging unit according to a comparative example, and Figure 4(B) is a diagram for explaining the mechanism by which noise is generated in the captured image. Figure 5(A) is a front view of the imaging unit according to the first embodiment, and Figure 5(B) is a diagram for explaining the mechanism by which noise is reduced in the first embodiment. Figure 6(A) is a diagram for explaining the driving method of the VR coil and counter coil, and Figures 6(B) and 6(C) are diagrams for explaining another example of the driving method of the VR coil and counter coil. Figures 7(A) and 7(B) are diagrams showing another example of the arrangement of the counter coil. Figures 8(A) and 8(B) are diagrams showing an example of a driving method of the VR coil and counter coil arranged as shown in Figure 7(A), for example. Figure 9 is a diagram illustrating an example of magnet arrangement when the counter unit is equipped with a magnet. Figure 10(A) is a plan view showing the configuration of the imaging unit according to the second embodiment, and Figure 10(B) is a diagram illustrating the mechanism by which noise is reduced in the second embodiment. Figure 11 is a diagram showing an example of a method for driving the VR coil and counter coil in the second embodiment. Figure 12 is a diagram showing another example of a method for driving the VR coil and counter coil in the second embodiment. Figure 13(A) is a cross-sectional view showing an example of the configuration of the vibration-damping lens unit equipped in the imaging optical system, and Figure 13(B) is a diagram showing an example of a method for driving the counter coil in the third embodiment. Figure 14 is a diagram showing the structure of an image sensor according to a modified example. 【0008】Figure 1(A) is a schematic diagram showing an example of the configuration of the imaging device 100 according to the embodiment. For the purposes of explanation and understanding, the following drawings include an XYZ Cartesian coordinate system where appropriate. In this coordinate system, the direction from the subject toward the camera body 10 at the camera position (hereinafter referred to as the positive position) when the photographer is capturing a horizontal image with the optical axis OA horizontal is defined as the +Z direction. The direction toward the right in the positive position is defined as the +X direction. The direction toward the upwards in the positive position is defined as the +Y direction. Note that the shapes, lengths, thicknesses, and other scales of the parts shown in the embodiment do not necessarily correspond to the actual objects, and parts not necessary for explanation have been omitted or simplified as appropriate. 【0009】 The imaging device 100 includes an interchangeable lens 20 and a camera body 10. The interchangeable lens 20 is mounted on the camera body 10. Alternatively, the imaging device 100 may be configured as a camera with an integrated lens instead of an interchangeable lens type. 【0010】 The interchangeable lens 20 includes, for example, an imaging optical system 21 including a zoom lens, a focus lens, an aperture, an image stabilization lens unit, etc., a lens control unit 22, and lens-side electronic contacts 23. The imaging optical system 21 emits a light beam from the subject. The lens control unit 22 includes a CPU (Central Processing Unit) and peripheral components such as memory. The lens control unit 22 performs functions such as drive control of the focus lens and aperture, position detection of the zoom lens and focus lens, transmission of lens information to the camera body 10 via the lens-side electronic contacts 23, and reception of camera information from the camera body 10. 【0011】 The camera body 10 includes, for example, a display unit 13, an operation unit 14, a body control unit 16, a body-side electronic contact 17, and an imaging unit 110. 【0012】 The display unit 13 is, for example, a liquid crystal monitor (also called a rear monitor) mounted on the back of the camera body 10. The operation unit 14 includes a shutter button and operating elements for various settings. 【0013】The body control unit 16 includes a CPU and peripheral components such as memory. The body control unit 16 controls the operation of the imaging device 100, including driving the imaging module 11 (described later), reading image signals from the imaging module 11, performing focus detection calculations and adjusting the focus of the interchangeable lens 20, displaying and recording image data, and driving the drive module 12 (described later). The body control unit 16 also communicates with the lens control unit 22 via the body-side electronic contacts 17 to receive lens information and transmit camera information (such as defocus amount and aperture value). 【0014】 The imaging unit 110 comprises an imaging module 11 and a drive module 12. 【0015】 Figure 1(B) is a side view showing the configuration of the imaging module 11. The imaging module 11 includes an image sensor 111 and a mounting substrate 112. The mounting substrate 112 is an example of a first substrate. 【0016】 The image sensor 111 is, for example, a CMOS image sensor or a CCD image sensor, and has an imaging surface 111a in which multiple pixels are arranged in a matrix in the row and column directions. The imaging surface 111a is parallel to the XY plane. The image sensor 111 is mounted on a mounting substrate 112 (Chip On Board). 【0017】 Figure 2 shows a schematic configuration of the image sensor 111. The image sensor 111 comprises a pixel section 300, a signal processing section 400, and a peripheral circuit section 500. 【0018】 In the pixel section 300, pixels 301 are arranged in a matrix in the row and column directions. Each pixel 301 is assigned one of four pixels, for example, according to a Bayer array: green pixels Gb, Gr, blue pixels B, and red pixels R. 【0019】The signal processing unit 400 comprises an analog signal processing unit 410 and a digital signal processing unit 420. The analog signal processing unit 410 performs signal processing on the analog signal output from the pixel unit 300. In this embodiment, the analog signal processing unit 410 includes an analog-to-digital converter (ADC) 411. In this embodiment, an ADC 411 is provided for each pixel row. The ADC 411 converts the pixel signal output from the pixel 301 into a digital signal. 【0020】 The digital signal processing unit 420 includes, for example, a memory 421. The memory 421 stores the pixel signals output from the analog signal processing unit 410. The digital signal processing unit 420 may, for example, perform signal processing on the pixel signals output from the analog signal processing unit 410 and store the processed pixel signals in the memory 421. 【0021】 The peripheral circuit section 500 includes a drive control unit 501, a vertical drive unit 502, a horizontal drive unit 503, and an output unit 504, etc. The drive control unit 501 generates clock signals and control signals that serve as a reference for the operation of the vertical drive unit 502, analog signal processing unit 410, digital signal processing unit 420, and horizontal drive unit 503 based on a master clock input from an external source and control signals input from the body control unit 16, and outputs them to the vertical drive unit 502, analog signal processing unit 410, digital signal processing unit 420, and horizontal drive unit 503. 【0022】 The vertical drive unit 502 controls the driving of the pixels 301 provided in the pixel unit 300. 【0023】 The horizontal drive unit 503 outputs a drive signal to the digital signal processing unit 420 in response to a scanning signal from the drive control unit 501, and causes the signal stored in the memory 421 of the digital signal processing unit 420 to be output to the output unit 504. 【0024】 The output unit 504 temporarily stores the pixel signals output from the memory 421 and outputs the pixel signals to the image processing unit (not shown) in response to instructions from the image processing unit. 【0025】Returning to Figure 1(A), the drive module 12 suppresses blurring of the captured image due to camera shake, etc., by driving the imaging module 11. 【0026】 Next, we will describe the details of the configuration of the drive module 12. Figure 3 is an exploded perspective view of the imaging unit 110. 【0027】 The drive module 12 comprises a movable member 12a and a fixed member 12b. The movable member 12a is an example of a second substrate. 【0028】 The imaging module 11 is positioned on the movable member 12a. In Figure 3, the area on the movable member 12a where the imaging module 11 is attached (fixed) is shown by a dotted line. 【0029】 The fixed member 12b is fixed within the camera body 10 and does not move relative to the camera body 10. The movable member 12a is supported so as to be movable relative to the fixed member 12b. As a result, the imaging module 11, which is positioned on the movable member 12a, can move relative to the camera body 10 as an integral part of the movable member 12a. 【0030】 The drive module 12 includes a first drive unit 70X that drives the movable member 12a (the imaging module 11 mounted on the movable member 12a) in the X direction, and two second drive units 70Y1 and 70Y2 that drive the imaging module 11 around the Y and Z directions. In this embodiment, a VCM (Voice Coil Motor) is used as the first drive unit 70X and the second drive units 70Y1 and 70Y2. In the following description, the first drive unit 70X will be referred to as the first VCM unit 70X, and the two second drive units 70Y1 and 70Y2 will be referred to as the second VCM unit 70Y1 and the third VCM unit 70Y2, respectively. 【0031】The first VCM unit 70X comprises a coil 71X (hereinafter referred to as VR coil 71X) and two magnets 72Xa and 72Xb. The second VCM unit 70Y1 comprises a coil 71Y1 (hereinafter referred to as VR coil 71Y1) and two magnets 72Y1a and 72Y1b. The third VCM unit 70Y2 comprises a coil 71Y2 (hereinafter referred to as VR coil 71Y2) and two magnets 72Y2a and 72Y2b. The VR coils 71X, 71Y1, and 71Y2 are supported (fixed) to the movable member 12a. 【0032】 The two magnets 72Xa and 72Xb of the first VCM unit 70X are supported (fixed) to the fixing member 12b. The magnets 72Xa and 72Xb are arranged on the fixing member 12b so that they have opposite polarities. 【0033】 By passing an electric current through the VR coil 71X, which is placed in the magnetic field formed by magnets 72Xa and 72Xb, the VR coil 71X is subjected to a Lorentz force, and as a result, the movable member 12a moves in the X direction. 【0034】 The two magnets 72Y1a and 72Y1b ​​of the second VCM unit 70Y1 are supported (fixed) to the fixing member 12b. Magnets 72Y1a and 72Y1b ​​are arranged on the fixing member 12b so that they have opposite polarities. Similarly, the two magnets 72Y2a and 72Y2b of the third VCM unit 70Y2 are supported (fixed) to the fixing member 12b. Magnets 72Y2a and 72Y2b are arranged on the fixing member 12b so that they have opposite polarities. 【0035】The magnets 72Xa and 72Xb and the VR coil 71X are arranged to face each other in a direction perpendicular to the imaging surface 111a of the image sensor 111 (Z direction). The magnets 72Y1a and 72Y1b ​​and the VR coil 71Y1 are arranged to face each other in a direction perpendicular to the imaging surface 111a of the image sensor 111 (Z direction). The magnets 72Y2a and 72Y2b and the VR coil 71Y2 are arranged to face each other in a direction perpendicular to the imaging surface 111a of the image sensor 111 (Z direction). 【0036】 By passing an electric current through the VR coil 71Y1, which is placed in a magnetic field formed by magnets 72Y1a and 72Y1b, the VR coil 71Y1 experiences a Lorentz force. Similarly, by passing an electric current through the VR coil 71Y2, which is placed in a magnetic field formed by magnets 72Y2a and 72Y2b, the VR coil 71Y2 also experiences a Lorentz force. 【0037】 When current is passed through the VR coils 71Y1 and 71Y2 so that they are subjected to forces in the same direction, the movable member 12a (imaging module 11) moves in the Y direction. When current is passed through the coils 71Y1 and 71Y2 so that they are subjected to forces in opposite directions, the movable member 12a (imaging module 11) rotates around a rotation axis parallel to the Z direction. Therefore, the imaging module 11 can move both in translation and rotationally around the Z axis within the imaging plane (XY plane). 【0038】 The first VCM unit 70X, the second VCM unit 70Y1, and the third VCM unit 70Y2 are examples of the first magnetic unit. 【0039】 Furthermore, the imaging unit 110 includes counter units 80X, 80Y1, and 80Y2, which generate magnetic fields to reduce the magnetic field within the image sensor 111, which is generated by the VR coils 71X, 71Y1, and 71Y2, respectively. In other words, in the first embodiment, the imaging unit 110 includes a number of counter units equal to the number of VCM units. 【0040】The counter units 80X, 80Y1, and 80Y2 each include counter coils 81X, 81Y1, and 81Y2. The counter coils 81X, 81Y1, and 81Y2 are provided on the movable member 12a. 【0041】 In the direction (Z direction) orthogonal to the imaging surface 111a of the imaging element 111, each of the counter coils 81Y1, 81Y2, and 81X does not face the magnet. 【0042】 Here, the reason why the imaging unit 110 includes the counter units 80X, 80Y1, and 80Y2 will be described. 【0043】 FIG. 4(A) is a plan view showing the configuration of the imaging unit 110X according to the comparative example. As shown in FIG. 4(A), VR coils 71Y1, 71Y2, and 71X are arranged on the movable member 12a. Inside the imaging element 111, for example, a loop-shaped wiring pattern WP1 is formed. 【0044】 When a current is supplied to the VR coils 71X, 71Y1, and 71Y2 to move the movable member 12a, the VR coils 71X, 71Y1, and 71Y2 may generate noise inside the imaging element 111, and noise (horizontal stripe noise) may be superimposed on the captured image generated using the signal output from the imaging module 11. Here, the mechanism by which noise is generated will be described. 【0045】 FIG. 4(B) is a diagram for explaining the mechanism by which noise occurs in the captured image. As shown in FIG. 4(B), for example, when a current I1 flows through the VR coil 71Y1, the VR coil 71Y1 generates a magnetic field MF1. When the magnetic field MF1 in the wiring pattern WP1 changes, an induced current flows through the wiring pattern WP1 in the imaging element 111 due to electromagnetic induction. The induced electromotive force V2 generated by this induced current is expressed by the following equation. 【0046】 Here, M ２１is the self-inductance of the wiring pattern WP1. As described above, due to the transient voltage fluctuations caused by the induced current, the signal in the wiring pattern WP1 in the imaging element 111 fluctuates. As a result, horizontal stripe noise appears in the captured image. For example, when the wiring pattern WP1 is a wiring for supplying a reference potential used in a signal processing unit such as an ADC 411 for converting a pixel signal read from a pixel 301 arranged on the imaging surface 111a into a digital signal or an amplifier circuit for amplifying the pixel signal, the influence of noise is large. 【0047】 Therefore, in the present embodiment, as shown in FIG. 3, counter units 80X, 80Y1, and 80Y2 are provided that generate magnetic fields that reduce the magnetic fields in the imaging element 111, which are respectively generated by the VR coils 71X, 71Y1, and 71Y2. 【0048】 FIG. 5(A) is a front view of the imaging unit 110 according to the present embodiment. As shown in FIG. 5(A), the counter coil 81Y1 is arranged on the same side of the imaging element 111 as the VR coil 71Y1. That is, the counter coil 81Y1 and the VR coil 71Y1 are arranged along the X direction. The counter coil 81Y1 and the VR coil 71Y1 are arranged adjacent to each other along the X direction. In other words, the counter coil 81Y1 is arranged on the -X side of the VR coil 71Y1. The counter coil 81Y2 is arranged on the same side of the imaging element 111 as the VR coil 71Y2. That is, the counter coil 81Y2 and the VR coil 71Y2 are arranged along the X direction. The counter coil 81Y2 and the VR coil 71Y2 are arranged adjacent to each other along the X direction. In other words, the counter coil 81Y2 is arranged on the +X side of the VR coil 71Y2. The counter coil 81X is arranged on the same side of the imaging element 111 as the VR coil 71X. That is, the counter coil 81X and the VR coil 71X are arranged along the Y direction. The counter coil 81X and the VR coil 71X are arranged adjacent to each other along the Y direction. In other words, the counter coil 81X is arranged on the -Y side of the VR coil 71X. 【0049】Counter coil 81Y1 generates a magnetic field to reduce the magnetic field generated by VR coil 71Y1. Counter coil 81Y2 generates a magnetic field to reduce the magnetic field generated by VR coil 71Y2. Counter coil 81X generates a magnetic field to reduce the magnetic field generated by VR coil 71X. 【0050】 Figure 5(B) is a diagram illustrating the mechanism by which noise can be reduced in this embodiment. As shown in Figure 5(B), when current is passed through the VR coils 71Y1, 71Y2, and 71X in the direction indicated by the arrows, the VR coils 71Y1, 71Y2, and 71X generate a magnetic field MF11. At this time, a current is supplied to the counter coils 81Y1, 81Y2, and 81X, which are arranged adjacent to the VR coils 71Y1, 71Y2, and 71X, to generate a magnetic field MF21 that cancels out the magnetic field MF11. As a result, the magnetic flux of the magnetic field MF11 passing through the image sensor 111 is weakened by the magnetic flux of the magnetic field MF21, thereby reducing transient voltage fluctuations generated in the wiring pattern WP1 due to induced currents caused by changes in the magnetic field MF11. In other words, it is possible to suppress the generation of noise in the captured image. As a result, the image quality of the captured image can be improved. 【0051】 Note that the positions of the VR coil 71Y1 and the counter coil 81Y1 may be reversed. Also, the positions of the VR coil 71Y2 and the counter coil 81Y2 may be reversed. Also, the positions of the VR coil 71X and the counter coil 81X may be reversed. In this case, magnets 72Xa, 72Xb, 72Y1a, 72Y1b, 72Y2a, and 72Y2b are positioned on the fixing member 12b in a position opposite to the VR coils 71X, 71Y1, and 71Y2, respectively. 【0052】(Method for driving the VR coil and counter coil) Next, the method for driving the VR coil and counter coil will be explained. Figure 6(A) is a diagram illustrating the method for driving the VR coil and counter coil. As an example, the VR coil 71Y1 and counter coil 81Y1 will be explained, but the same applies to the combination of VR coil 71Y2 and counter coil 81Y2, and the combination of VR coil 71X and counter coil 81X. 【0053】 As shown in Figure 6(A), in the first embodiment, the VR coil 71Y1 and the counter coil 81Y1 are connected in series, and one end of the VR coil 71Y1 and one end of the counter coil 81Y1 are connected to a single driver 90Y1. The driver 90Y1 supplies current to the VR coil 71Y1 and the counter coil 81Y1. In the configuration shown in Figure 6(A), since the same waveform and the same value of current flow through the VR coil 71Y1 and the counter coil 81Y1, the magnetic field generated by the VR coil 71Y1 can be effectively reduced by the magnetic field generated by the counter coil 81Y1 without any special control. 【0054】 Note that the driving method for the VR coil and counter coil is not limited to the configuration shown in Figure 6(A). Figures 6(B) and 6(C) illustrate alternative examples of the driving method for the VR coil and counter coil. 【0055】As shown in Figure 6(B), a driver 73Y1 for driving the VR coil 71Y1 and a driver 83Y1 for driving the counter coil 81Y1 may be provided separately, and the VR coil 71Y1 and the counter coil 81Y1 may be driven separately. The driver 73Y1 controls the direction and magnitude of the current supplied to the VR coil 71Y1, and the driver 83Y1 controls the direction and magnitude of the current supplied to the counter coil 81Y1. For example, the body control unit 16 instructs the driver 73Y1 on the direction and magnitude of the current to be supplied to the VR coil 71Y1. The body control unit 16 supplies current to the VR coil 71Y1 based on a predetermined method (formula, table, etc.). The body control unit 16 can also calculate the direction and magnitude of the current to be supplied to the counter coil 81Y1 from the direction and magnitude of the current supplied to the VR coil 71Y1. The body control unit 16 instructs the driver 83Y1 on the direction and magnitude of the current to be supplied to the counter coil 81Y1, so that a current with a direction and magnitude that reduces the magnetic field generated by the VR coil 71Y1 is supplied to the counter coil 81Y1. 【0056】 Alternatively, as shown in Figure 6(C), the VR coil 71Y1 and the counter coil 81Y1 may be connected in parallel, and the current supplied to the VR coil 71Y1 and the counter coil 81Y1 may be controlled by a single driver 90Y1. 【0057】 The number of turns of the VR coils 71Y1 and 71Y2 and the number of turns of the counter coils 81Y1 and 81Y2 may be the same or different. However, from the viewpoint of generating a magnetic field of similar strength in opposite phase to the magnetic field generated by the VR coils 71Y1 and 71Y2, it is preferable that the number of turns of the counter coils 81Y1 and 81Y2 is the same as that of the VR coils 71Y1 and 71Y2. Also, the inductance of the VR coils 71Y1 and 71Y2 and the inductance of the counter coils 81Y1 and 81Y2 may be the same or different. The same applies to the VR coil 71X and the counter coil 81X. 【0058】Furthermore, although the sizes of the VR coils 71Y1, 71Y2, and 71X and the counter coils 81Y1, 81Y2, and 81X were shown to be the same, the sizes of the VR coils 71Y1, 71Y2, and 71X and the counter coils 81Y1, 81Y2, and 81X may be different. 【0059】 As described in detail above, according to the first embodiment, the imaging unit 110 includes an image sensor 111 for imaging a subject, a second VCM unit 70Y1 for moving the image sensor 111 and generating a magnetic field MF 11, and a counter unit 80Y1 for generating a magnetic field MF 21 that reduces the magnetic field MF 11. As a result, the magnetic flux of the magnetic field MF 11 passing through the image sensor 111 is weakened by the magnetic flux of the magnetic field MF 21, thereby reducing transient voltage fluctuations generated in the wiring pattern WP1 due to induced currents caused by changes in the magnetic field MF 11, and suppressing the generation of noise in the captured image. As a result, the image quality of the captured image can be improved. 【0060】 Furthermore, in the first embodiment, the second VCM unit 70Y1 includes a VR coil 71Y1 and magnets 72Y1a and 72Y1b, and the counter unit 80Y1 includes a counter coil 81Y1. When viewed from a direction perpendicular to the imaging surface 111a of the image sensor 111 (Z direction), the counter coil 81Y1 is provided on the same side as the VR coil 71Y1 with respect to the image sensor 111. Because the counter coil 81Y1 is provided in close proximity to the VR coil 71Y1, the magnetic field inside the image sensor 111 generated by the VR coil 71Y1 can be effectively reduced by the magnetic field generated by the counter coil 81Y1. 【0061】 Furthermore, in the first embodiment, the number of VCM units is equal to the number of counter units. This allows the magnetic field generated by the VR coil of each VCM unit to be effectively reduced by the magnetic field generated by the counter coil of the corresponding counter unit. 【0062】Furthermore, in the first embodiment, the imaging unit 110 includes a driver 90Y1 that supplies current to the VR coil 71Y1 and the counter coil 81Y1. This allows the VR coil 71Y1 and the counter coil 81Y1 to be supplied with the same waveform and the same value of current, thereby effectively reducing the magnetic field generated by the VR coil 71Y1 without requiring special control by the magnetic field generated by the counter coil 81Y1. 【0063】 In the first embodiment described above, the counter coil 81Y1 was positioned on the -X side of the VR coil 71Y1, the counter coil 81Y2 was positioned on the +X side of the VR coil 71Y2, and the counter coil 81X was positioned on the -Y side of the VR coil 71X, but the configuration is not limited to this. Figures 7(A) and 7(B) show alternative arrangements of the counter coils 81X, 81Y1, and 81Y2. 【0064】 For example, as shown in Figure 7(A), the counter coil 81X may be placed on the +X side of the VR coil 71X, the counter coil 81Y1 may be placed on the +Y side of the VR coil 71Y1, and the counter coil 81Y2 may be placed on the +Y side of the VR coil 71Y2. It is preferable that the counter coil 81X is placed adjacent to the VR coil 71X in the +X direction, the counter coil 81Y1 is placed adjacent to the VR coil 71Y1 in the +Y direction, and the counter coil 81Y2 is placed adjacent to the VR coil 71Y2 in the +Y direction. 【0065】 Furthermore, as shown in Figure 7(B), the arrangement of the counter coils 81Y1, 81Y2, and 81X is not limited to being adjacent to the VR coils 71Y1, 71Y2, and 71X. For example, in the movable member 12a, the counter coils 81Y1, 81Y2, and 81X and the VR coils 71Y1, 71Y2, and 71X are arranged to surround the image sensor 111. Alternatively, the counter coils 81Y1, 81Y2, and 81X may be positioned opposite the VR coils 71Y1, 71Y2, and 71X when viewed from a direction perpendicular to the imaging surface 111a of the imaging module 11 (Z direction), with the imaging module 11 in between. 【0066】 Figures 8(A) and 8(B) show examples of driving methods for a VR coil 71Y1 and a counter coil 81Y1 arranged as shown in Figure 7(A). In Figure 8(A), similar to Figure 6(A), the VR coil 71Y1 and the counter coil 81Y1 are connected in series, and one end of the VR coil 71Y1 and one end of the counter coil 81Y1 are connected to a single driver 90Y1. However, since the method of connecting the VR coil 71Y1 and the counter coil 81Y1 is different from that in Figure 6(A), the direction of the current flowing through the VR coil 71Y1 and the direction of the current flowing through the counter coil 81Y1 are the same. Also, in Figure 8(B), similar to Figure 6(C), the VR coil 71Y1 and the counter coil 81Y1 are connected in parallel, and the VR coil 71Y1 and the counter coil 81Y1 are connected to a single driver 90Y1. However, since the connection method between the VR coil 71Y1 and the counter coil 81Y1 is different from that shown in Figure 6(C), the direction of the current flowing through the VR coil 71Y1 and the direction of the current flowing through the counter coil 81Y1 are the same. In this way, the connection method between the VR coil 71Y1 and the counter coil 81Y1, the winding direction of the VR coil 71Y1, the winding direction of the counter coil 81Y1, etc., can be appropriately changed depending on the arrangement of the VR coil and the counter coil. 【0067】 Furthermore, in the first embodiment described above, no magnets were placed in positions opposite to the counter coils 81X, 81Y1, and 81Y2 in the Z direction. However, the counter units 80X, 80Y1, and 80Y2 may be equipped with magnets placed in positions opposite to the counter coils 81Y1, 81Y2, and 81X in the Z direction. Figure 9 is a diagram illustrating an example of magnet arrangement when the counter units 80X, 80Y1, and 80Y2 are equipped with magnets. In Figure 9, the VR coils 71X, 71Y1, and 71Y2 and the counter coils 81X, 81Y1, and 81Y2 provided on the movable member 12a are shown by dotted lines. 【0068】The counter unit 80X includes magnets 82Xa and 82Xb positioned in the fixed member 12b opposite the counter coil 81X in the Z direction. Magnets 82Xa and 82Xb are smaller than the magnets 72Xa and 72Xb of the first VCM unit 70X. Magnets 82Xa and 72Xa are positioned in the fixed member 12b with opposite polarities. Magnets 82Xb and 72Xb are positioned in the fixed member 12b with opposite polarities. 【0069】 Furthermore, the counter unit 80Y1 includes magnets 82Y1a and 82Y1b positioned in the fixing member 12b opposite to the counter coil 81Y1 in the Z direction. Magnets 82Y1a and 82Y1b are smaller than the magnets 72Y1a and 72Y1b ​​of the second VCM unit 70Y1. Magnets 82Y1a and 72Y1a are positioned in the fixing member 12b with opposite polarities. Magnets 82Y1b and 72Y1b ​​are positioned in the fixing member 12b with opposite polarities. 【0070】 Furthermore, the counter unit 80Y2 includes magnets 82Y2a and 82Y2b positioned in the fixing member 12b opposite to the counter coil 81Y2 in the Z direction. Magnets 82Y2a and 82Y2b are smaller than the magnets 72Y2a and 72Y2b of the third VCM unit 70Y2. Magnets 82Y2a and 72Y2a are positioned in the fixing member 12b with opposite polarities. Magnets 82Y2b and 72Y2b are positioned in the fixing member 12b with opposite polarities. 【0071】 As shown in Figure 9, by providing a magnet at a position opposite the counter coil, the magnetic flux generated by the corresponding VR coil can be weakened at a position away from the VR coil (inside the image sensor 111) without weakening the magnetic flux in the vicinity of the VR coil. 【0072】Furthermore, in the first embodiment described above, one counter unit (counter coil) was provided for each VCM unit (VR coil), but this is not the only option. Two or more counter units (counter coils) may be provided for each VCM unit (VR coil). 【0073】 《Second Embodiment》 In the first embodiment described above, the same number of counter units (counter coils) as the number of VCM units (VR coils) were provided, but the number of counter units may be less than the number of VCM units. 【0074】 Figure 10(A) is a plan view showing the configuration of the imaging unit 110A according to the second embodiment. The imaging unit 110A includes a counter unit 80 that generates a magnetic field to reduce the magnetic field generated by the first VCM unit 70X (VR coil 71X), the second VCM unit 70Y1 (VR coil 71Y1), and the third VCM unit 70Y2 (VR coil 71Y2). 【0075】 The counter unit 80 includes a counter coil 81. In the second embodiment, the counter unit 80 does not have a magnet. Note that the counter coil 81 is fixed to the movable member 12a and is therefore shown by a dotted line in Figure 10(A). 【0076】 As shown in Figure 10(A), the external dimensions of the counter coil 81 are larger than the external dimensions of the VR coils 71X, 71Y1, and 71Y2, respectively. As shown in Figure 10(A), the counter coil 81 is positioned so as to overlap with the image sensor 111 when viewed from a direction perpendicular to the imaging surface 111a of the image sensor 111 (Z direction). In other words, the counter coil 81 is positioned opposite the image sensor 111 in the direction perpendicular to the imaging surface 111a of the image sensor 111 (Z direction). Alternatively, the counter coil 81 may be positioned within the range of the image sensor 111 in an XY planar view. 【0077】Figure 10(B) is a diagram illustrating the mechanism by which noise is reduced in the second embodiment. In Figure 10(B), only the VR coil 71Y1 is shown as a VR coil for clarity. When a current flows through the VR coil 71Y1 in the direction indicated by the arrow, the magnetic field generated by the coil 71Y1 is shown as magnetic field MF12. At this time, if the magnetic field MF12 in the wiring pattern WP1 of the image sensor 111 changes, an induced current is generated in the wiring pattern WP1, and noise is generated. A current is supplied to the counter coil 81 that generates a magnetic field MF22 in a direction that cancels out the magnetic field MF12 in the image sensor 111. Since the magnetic field MF12 in the wiring pattern WP1 is reduced by the magnetic field MF22, transient voltage fluctuations generated in the wiring pattern WP1 due to induced currents caused by changes in the magnetic field MF12 can be reduced, and the generation of noise in the captured image can be suppressed. 【0078】 (Method for driving VR coils and counter coils) Figure 11 shows an example of a method for driving VR coils 71X, 71Y1, 71Y2 and counter coil 81. 【0079】 One end of VR coil 71Y1 is connected to driver 73Y1, and the other end of VR coil 71Y1 is connected to current mirror circuit 74Y1. One end of VR coil 71Y2 is connected to driver 73Y2, and the other end of VR coil 71Y2 is connected to current mirror circuit 74Y2. One end of VR coil 71X is connected to driver 73X, and the other end of VR coil 71X is connected to current mirror circuit 74X. Drivers 73Y1, 73Y2, and 73X control the current supplied to VR coils 71Y1, 71Y2, and 71X, respectively. 【0080】 The current mirror circuit 74Y1 copies the current signal flowing through the VR coil 71Y1 and outputs it to the calculation unit 911 of the drive circuit 91. The current mirror circuit 74Y2 copies the current signal flowing through the VR coil 71Y2 and outputs it to the calculation unit 911 of the drive circuit 91. The current mirror circuit 74X copies the current signal flowing through the VR coil 71X and outputs it to the calculation unit 911 of the drive circuit 91. 【0081】The calculation unit 911 performs predetermined calculations using inputs from the current mirror circuits 74Y1, 74Y2, and 74X, and outputs the calculation results to the drive unit 912 of the drive circuit 91. The predetermined calculations are for determining the magnitude and direction of the current supplied to the counter coil 81. 【0082】 The drive unit 912 supplies a current to the counter coil 81 according to the output (calculation result) of the calculation unit 911. This allows the counter coil 81 to be supplied with a current that takes into account the magnetic fields generated by each VR coil 71Y1, 71Y2, and 71X, and to generate a magnetic field that reduces the magnetic field inside the image sensor 111 generated by each VR coil 71Y1, 71Y2, and 71X. 【0083】 As described in detail above, according to the second embodiment, the imaging unit 110A includes drivers 73X, 73Y1, and 73Y2 that supply current to VR coils 71X, 71Y1, and 71Y2, and a drive circuit 91 that supplies current to a counter coil 81. The drive circuit 91 controls the current supplied to the counter coil 81 based on the current supplied to each of the VR coils 71X, 71Y1, and 71Y2. Specifically, the calculation unit 911 of the drive circuit 91 performs a predetermined calculation to calculate the current to be supplied to the counter coil 81 using the current supplied to each of the VR coils 71X, 71Y1, and 71Y2, and the drive unit 912 supplies a current to the counter coil 81 according to the calculation result. This allows the counter coil 81 to be supplied with a current that takes into account the magnetic fields generated by each VR coil 71Y1, 71Y2, and 71X, thereby generating a magnetic field that reduces the magnetic field within the image sensor 111 generated by each VR coil 71Y1, 71Y2, and 71X. 【0084】 In the second embodiment described above, the method for driving the VR coils 71Y1, 71Y2, 71X and the counter coil 81 is not limited to the method shown in Figure 11. Figure 12 shows another example of the method for driving the VR coils 71Y1, 71Y2, 71X and the counter coil 81. 【0085】In Figure 12, VR coil 71Y1 is connected to driver 73Y1, VR coil 71Y2 is connected to driver 73Y2, and VR coil 71X is connected to driver 73X. Drivers 73Y1, 73Y2, and 73X control the current supplied to VR coils 71Y1, 71Y2, and 71X, respectively. Counter coil 81 is connected to driver 94. Driver 94 controls the current supplied to counter coil 81. 【0086】 In the example shown in Figure 12, a detection unit 92 is provided near the counter coil 81 to detect the magnetic fields generated by each VR coil 71Y1, 71Y2, and 71X. The detection unit 92 may be, for example, a Hall element or a coil. In Figure 12, only one detection unit 92 is provided, but multiple units may be provided. 【0087】 The detection result from the detection unit 92 is input to the calculation unit 93. The calculation unit 93 performs a predetermined calculation using the input from the detection unit 92 and outputs the calculation result to the driver 94. The predetermined calculation is to determine the magnitude and direction of the current supplied to the counter coil 81. 【0088】 The driver 94 supplies a current to the counter coil 81 according to the calculation result of the calculation unit 93. 【0089】 Even with the configuration shown in Figure 12, it is possible to supply a current to the counter coil 81 that takes into account the magnetic fields generated by each VR coil 71Y1, 71Y2, and 71X, thereby generating a magnetic field that reduces the magnetic field inside the image sensor 111, which is generated by each VR coil 71Y1, 71Y2, and 71X. 【0090】 In addition, in the second embodiment described above, various driving methods described in the first embodiment and its modifications may be employed. 【0091】 Furthermore, in the second embodiment described above, one counter coil 81 was provided for the three VR coils 71X, 71Y1, and 71Y2, but two counter coils 81 may be provided. 【0092】 Furthermore, in the second embodiment described above, the counter coil 81 may be formed using the wiring layer within the mounting substrate 112. 【0093】 <Third Embodiment> In the third embodiment, not only the magnetic field generated by the VR coils 71Y1, 71Y2, and 71X of the imaging unit 110 or 110A is considered, but also the magnetic field generated by the VR coil included in the vibration-damping lens unit of the imaging optical system 21 of the interchangeable lens 20. 【0094】 Figure 13(A) is a cross-sectional view showing an example of the configuration of an image stabilization lens unit 210 provided in the imaging optical system 21. The image stabilization lens unit 210 comprises a lens L1, a retaining frame F1 that holds the lens L1, and a drive unit 213 that drives the retaining frame F1. The drive unit 213 comprises a VR coil 211 and magnets 212a and 212b. 【0095】 By passing an electric current through the VR coil 211, which is placed in the magnetic circuit formed by magnets 212a and 212b, the VR coil 211 receives a Lorentz force, thereby causing the retaining frame F1 to move in the Y direction. Although not shown in the figures, the vibration-damping lens unit 210 also includes a drive unit that drives the retaining frame F1 in the X direction. The configuration of the drive unit that drives the retaining frame F1 in the X direction is the same as that of the drive unit 213, so a detailed explanation is omitted. 【0096】 The magnetic field generated by the VR coil 211 in the interchangeable lens 20 may affect the image sensor 111. Therefore, in the third embodiment, the current supplied to the counter coil is supplied while also considering the current signal supplied to the VR coil 211. 【0097】 Figure 13(B) shows an example of a method for driving the counter coil in the third embodiment. Although Figure 13(B) describes the method for driving the counter coil 81 in the second embodiment, the same method can be applied to driving the counter coils 81Y1, 81Y2, and 81X in the first embodiment. 【0098】In the configuration shown in Figure 13(B), the drive signals for the VR coils 71Y1, 71Y2, and 71X of the imaging unit 110A and the drive signals for the VR coils of the vibration-damping lens unit 210 are input to the calculation unit 95. The drive signals for the VR coils 71Y1, 71Y2, and 71X and the drive signals for the VR coils of the vibration-damping lens unit 210 should be input to the calculation unit 95 from the body control unit 16. 【0099】 The calculation unit 95 performs a predetermined calculation to calculate the current to be supplied to the counter coil 81 using the drive signals of the VR coils 71Y1, 71Y2, and 71X, and the drive signal of the VR coil of the vibration-damping lens unit 210. 【0100】 The driver 96 supplies a current to the counter coil 81 according to the calculation result of the calculation unit 95. With the configuration shown in Figure 13(B), it is possible to supply a current to the counter coil 81 that takes into account the magnetic field generated by the VR coils 71Y1, 71Y2, and 71X in the camera body 10 and the magnetic field generated by the VR coil in the interchangeable lens 20, thereby reducing the magnetic field inside the image sensor 111 generated by the VR coils 71Y1, 71Y2, and 71X and the VR coil of the vibration-damping lens unit 210. 【0101】 In the third embodiment described above, the counter coil 81 may be driven using the configuration shown in Figure 12. Specifically, the detection unit 92 may detect the magnetic fields generated by the VR coils 71Y1, 71Y2, and 71X of the imaging unit 110A and the magnetic fields generated by the VR coil of the vibration-damping lens unit 210, and supply current to the counter coil 81 based on the detection results. 【0102】 Furthermore, in the third embodiment described above, the vibration-damping lens unit 210 may be provided with a counter unit that generates a magnetic field to reduce the magnetic field generated by the VR coil 211. 【0103】Furthermore, in the first to third embodiments described above, the movable member 12a may be provided with magnets 72Xa, 72Xb, 72Y1a, 72Y1b, 72Y2a, and 72Y2b, and the fixed member 12b may be provided with VR coils 71X, 71Y1, 71Y2 and counter coils 81X, 81Y1, 81Y2 or 81. 【0104】 In the first to third embodiments described above, an ADC 411 was provided for each pixel row in the image sensor 111, but this is not the only possible configuration. Figure 14 shows the structure of an image sensor 111A according to a modified example. 【0105】 As shown in Figure 14, the image sensor 111A comprises a substrate 601 and a substrate 602. As shown in Figure 14, substrate 601 is laminated on substrate 602. 【0106】 The substrate 601 has a pixel section 300A. The substrate 602 has a signal processing unit 400 and a peripheral circuit section 500. 【0107】 In a modified example, the pixel section 300A comprises a plurality of pixel blocks 310 arranged along the row and column directions. Each pixel block 310 includes a plurality of pixels 301 arranged along the row and column directions. 【0108】 In the first embodiment, an ADC 411 was provided for each pixel row, but in the modified example, an ADC 411 is provided for each pixel block 310. That is, the ADC 411 is arranged two-dimensionally along the row and column directions. Note that the number of pixels 301 included in the pixel block 310 may be one. In this case, an ADC 411 will be provided for each pixel 301. 【0109】As shown in the modified example, if an ADC 411 is provided for each pixel block 310 or each pixel 301, the number of ADCs 411 increases, and therefore the size of the ADC 411 decreases. The smaller the ADC 411, the greater the impact of noise. Also, if the pixel section 300A and the signal processing section 400 are stacked and the ADC 411 is arranged in two dimensions, a loop circuit is formed near the VR coil, making it susceptible to noise. Therefore, in the drive module that drives the imaging module including the image sensor 111A according to the modified example, the noise reduction effect by arranging the counter unit as in the first to third embodiments is further enhanced. 【0110】 The embodiments described above are examples of preferred implementations. However, they are not limited thereto, and various modifications are possible without departing from the gist of the invention, and any combination of constituent elements may be used. 【0111】 11 Imaging module 12 Drive module 12a Movable member 12b Fixed member 70X First VCM unit 70Y1 Second VCM unit 70Y2 Third VCM unit 71X, 71Y1, 71Y2 VR coil 80X, 80Y1, 80Y2, 80 Counter unit 81X, 81Y1, 81Y2, 81 Counter coil 82Xa, 82Xb, 82Y1a, 82Y1b, 82Y2a, 82Y2b Magnet 91 Drive circuit 92 Detection unit 93 Calculation unit 94 Driver 95 Calculation unit 96 Driver 100 Imaging device 110, 110A Imaging unit 111 Image sensor 111a Imaging surface 112 Mounting board 210 Vibration isolation lens unit 213 Drive unit 211 VR coil 212a, 212b Magnet 911 Calculation unit 912 Drive unit

Claims

1. An imaging unit comprising an image sensor for capturing an image of a subject, and a unit for moving the image sensor, the unit comprising a first magnetic unit for generating a first magnetic field and a second magnetic unit for generating a second magnetic field for reducing the first magnetic field.

2. The imaging unit according to claim 1, wherein the first magnetic unit comprises a first coil and a first magnet, and the second magnetic unit comprises a second coil, and when viewed from a direction perpendicular to the imaging plane of the image sensor, the second coil is provided on the same side as the first coil with respect to the image sensor.

3. The imaging unit according to claim 1, wherein the first magnetic unit comprises a first coil and a first magnet, and the second magnetic unit comprises a second coil, and when viewed from a direction perpendicular to the imaging surface of the image sensor, the second coil is positioned opposite the first coil with the image sensor in between.

4. The imaging unit according to claim 2 or claim 3, wherein the number of first magnetic units is equal to the number of second magnetic units.

5. The imaging unit according to claim 1, wherein the first magnetic unit comprises a first coil and a first magnet, and the second magnetic unit comprises a second coil, the second coil is provided so as to overlap with the image sensor when viewed from a direction perpendicular to the imaging surface of the image sensor.

6. The imaging unit according to claim 5, wherein the external dimensions of the second coil are larger than the external dimensions of the first coil.

7. The imaging unit according to claim 5 or 6, wherein the number of second magnetic units is less than the number of first magnetic units.

8. The imaging unit according to any one of claims 2 to 7, wherein the second coil does not face the magnet in a direction perpendicular to the imaging surface of the image sensor.

9. The imaging unit according to any one of claims 2 to 7, wherein the second magnetic unit comprises a second magnet, and the arrangement of the magnetic poles of the second magnet is opposite to the arrangement of the magnetic poles of the first magnet.

10. The imaging unit according to any one of claims 2 to 9, further comprising a drive unit that supplies current to the first coil and the second coil.

11. The imaging unit according to any one of claims 2 to 9, comprising: a first drive unit that supplies current to the first coil; and a second drive unit that supplies current to the second coil.

12. The imaging unit according to claim 11, wherein a plurality of first magnetic units are provided, and the second drive unit controls the current supplied to the second coil based on the current supplied to the first coil of each of the plurality of first magnetic units.

13. The imaging unit according to claim 12, comprising a calculation unit that calculates information relating to the current supplied to a third coil in a third magnetic unit that drives a lens included in the imaging optical system by electromagnetic force, information relating to the current supplied to the first coil, and the current supplied to the second coil.

14. The imaging unit according to claim 12, comprising: a detection unit for detecting a change in the first magnetic field generated by the first magnetic unit; and a calculation unit for calculating a current to be supplied to the second coil based on the detection result by the detection unit.

15. The imaging unit according to any one of claims 1 to 14, comprising: a first substrate on which the image sensor is mounted; a part of the first magnetic unit; and a second substrate on which the second magnetic unit is mounted.

16. The imaging unit according to any one of claims 1 to 15, wherein the first magnetic unit is used for image stabilization.

17. An imaging device comprising: an imaging unit according to any one of claims 1 to 16; and an imaging optical system for forming an image of a subject on the imaging surface of the image sensor.

18. The imaging apparatus according to claim 17, wherein the imaging optical system comprises a lens, a unit for moving the lens, a third magnetic unit for generating a third magnetic field, and a fourth magnetic unit for generating a fourth magnetic field for reducing the third magnetic field.

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