Imaging device and method for manufacturing imaging device

Abstract

This imaging device has an imaging element, a substrate, and a side fill. The imaging element is mounted on the substrate. The side fill is continuous over the entire circumference in a circumferential direction with a normal line of a light-receiving surface of the imaging element as an axis. The side fill is positioned in contact with the main surface of the substrate and a part of the side surface of the imaging element along the circumferential direction.

Description

Imaging Device and Method of Manufacturing the Same Cross - Reference to Related Applications 【0001】 This application claims priority to Japanese Patent Application No. 2024 - 212907, filed in Japan on December 5, 2024, the entire disclosure of which is incorporated herein by reference. 【0002】 This disclosure relates to an imaging device and a method of manufacturing the imaging device. 【0003】 In an imaging device, for improving the solder life resistance in mounting an image sensor on a substrate, reinforcement is achieved using a side fill. Also, in the imaging device, a cover is provided between the image sensor and the optical module for dust prevention. Since miniaturization of the imaging device is required, attaching the cover in close contact with the end face of the side fill has been considered. When the space between the image sensor and the substrate is sealed with the side fill, the air in the sealed space expands due to heat curing during manufacturing, which may cause perforation and peeling of the side fill and a load on the solder. Thus, for example, it is conceivable to form through - holes in the substrate to communicate the space between the image sensor and the substrate with the outside (see Patent Document 1). 【0004】 International Publication No. 2014 / 207786 【0005】 An imaging device according to a first aspect includes: an image sensor; a substrate on which the image sensor is mounted; and a side fill that is continuous over the entire circumference in the circumferential direction with the normal line of the light - receiving surface of the image sensor as the axis, and is positioned in contact with a main surface of the substrate and a part along the circumferential direction of a side surface of the image sensor. 【0006】 A method of manufacturing an imaging device according to a second aspect includes: mounting an image sensor on a substrate; applying a side - fill agent so as to be continuous over the entire circumference in the circumferential direction with the normal line of the light - receiving surface of the image sensor as the axis, and in contact with a surface of the substrate on the image - sensor side and a part along the circumferential direction of a side surface of the image sensor; and curing the side - fill agent. 【0007】This is a top view of the image sensor on the substrate in the imaging device according to this embodiment, as seen from the light-receiving surface side. This is a cross-sectional view of the imaging device of Figure 1, cut along a plane parallel to the optical axis. This is a cross-sectional view of the image sensor of Figure 1, cut along the line III-III. This is a cross-sectional view of the image sensor of Figure 1, cut along the line IV-IV. This is a top view of a modified example of Figure 1, as seen from the light-receiving surface side. This is a top view of yet another 【0008】 Hereinafter, embodiments of an imaging device to which the present invention is applied will be described with reference to the drawings. 【0009】 As shown in Figure 1, the imaging device 10 according to this embodiment is configured to include an image sensor 11, a substrate 12, and a side fill 13. As shown in Figure 2, the imaging device 10 may further include a cover 14 and an optical module 15. 【0010】 The image sensor 11 is, for example, a CCD (Charge Coupled Device) image sensor and a CMOS (Complementary Metal Oxide Semiconductor) image sensor, and generates an image signal by capturing an optical image formed on the light-receiving surface. 【0011】 The substrate 12 has an image sensor 11 mounted on its first surface s1. The first surface s1 is one of the main surfaces of the substrate 12. The main surface is the surface with the largest area in the rectangular parallelepiped. As shown in Figure 3, the image sensor 11 may be electrically connected to the substrate 12 by solder 16. The substrate 12 may have other electronic devices mounted on it besides the image sensor 11. 【0012】 The side fill 13 may fix the image sensor 11 to the first surface s1 of the substrate 12. Alternatively, the side fill 13 may fix the cover glass 17 that covers the light-receiving surface of the image sensor 11 to the image sensor 11. The side fill 13 is positioned to be continuous around the entire circumference in the circumferential direction with respect to the normal to the light-receiving surface of the image sensor 11. 【0013】As shown in Figure 1, the side fill 13 is in contact with the first surface s1 of the substrate 12 and a portion of the side surface of the image sensor 11 along the circumferential direction. Specifically, the side fill 13 may have a first portion 18 and a second portion 19. In the second portion 19, the side fill 13 may be in contact with the first surface s1 of the substrate 12 and a portion of the side surface of the image sensor 11 along the circumferential direction. 【0014】 The first portion 18 does not need to be in contact with the side surface of the image sensor 11. In other words, the first portion 18 may be located away from the side surface of the image sensor 11. Therefore, as shown in Figure 4, the first portion 18 may connect the first space sp1 and the second space sp2. The first space sp1 is defined by the substrate 12, the image sensor 11, and the side fill 13. The second space sp2 is the space on the opposite side of the image sensor 11 from the substrate 12. 【0015】 The first portion 18 may be located near the center of each of two opposing sides when viewed from a direction perpendicular to the rectangular light-receiving surface of the image sensor 11. Alternatively, as shown in Figure 5, the first portion 18 may be located at one point in the circumferential direction of the side surface of the image sensor 11. The first portion 18 may be located separately from the second portion 19, bulging outward with approximately the same width as the second portion 19 when viewed from a direction perpendicular to the light-receiving surface. Alternatively, as shown in Figures 6 and 7, the first portion 18 may be formed by cutting out a part of the inner circumference of the side fill 13, which has a rounded rectangle outer circumference, when viewed from a direction perpendicular to the light-receiving surface. 【0016】 The height of the side fill 13 from the substrate 12 may be higher in the portion that contacts the side surface of the image sensor 11 than in the portion that does not contact the image sensor 11. Specifically, as shown in Figure 4, the height of the second portion 19 from the substrate 12 may be higher than the height of the first portion 18 from the substrate 12. In the side fill 13, the portion that does not contact the side surface of the image sensor 11, in other words, the length of the second portion 19 along the circumferential direction may be 1 / 2 or more of the width of the side fill 13. 【0017】 The side fill 13 may be formed by curing a side fill agent, which is a curable resin such as an adhesive. 【0018】As shown in Figure 2, the cover 14 may be cylindrical. One end of the cover 14 in the axial direction may contact the side of the side fill 13 opposite to the substrate 12 over its entire circumference. The circumferential direction is the circumferential direction with respect to the axis of the cover 14 and the circumferential direction with respect to the normal to the light-receiving surface of the image sensor 11 as the axis. Because the cover 14 is elastic, it may conform to the shape of the side fill 13 even in parts of the side fill 13 that are at different heights from the substrate 12, and may contact the surface of the side fill 13 over its entire circumference. 【0019】 On the side of the cover 14 opposite to the side fill 13 in the axial direction, the cover 14 may be in contact with the optical module 15 over its entire circumference in the circumferential direction. The cover 14 may seal the space between the image sensor 11 and the optical module 15 by contacting both the side fill 13 and the optical module 15. 【0020】 The optical module 15 may form an image of the subject onto the image sensor 11. Specifically, the optical module 15 may have an optical system 20 that forms an image of the subject onto the image sensor 11. The optical system 20 may include at least one refractive element. The refractive element may be, for example, an element that has a light refraction effect, such as a lens or a mirror. The optical module 15 may further have a lens barrel 21. The lens barrel 21 may have a cylindrical portion and support the optical system 20 on its inner circumference. The axis of the cylindrical lens barrel 21 and the optical axis of the optical system 20 supported by the lens barrel 21 may coincide. 【0021】 The optical module 15 may be positioned in the imaging device 10 such that its optical axis is perpendicular to the light-receiving surface of the image sensor 11. In this configuration, the end of the lens barrel 21 on the image sensor 11 side may be in contact with the cover 14 over its entire circumference. For example, by placing the cover 14 over the end of the lens barrel 21 on the image sensor 11 side, the lens barrel 21 and the cover 14 may be in contact over their entire circumference. 【0022】 Next, the manufacturing method of the imaging device 10 will be described below. 【0023】First, the image sensor 11 is mounted on the substrate 12. During the mounting of the image sensor 11, the substrate 12 and the image sensor 11 may be electrically connected using solder 16. After the image sensor 11 is mounted, a side fill agent is applied so as to be continuous around the entire circumference of the image sensor 11 with respect to the surface s1 of the substrate 12 on the side of the image sensor 11 and a portion of the side of the image sensor 11 along the circumference. After the application of the side fill agent, the side fill agent is cured to form the side fill 13. 【0024】 A cover 14 may be fixed to the side fill 13 on the side opposite to the substrate 12 so as to be in continuous contact with it over its entire circumference. Furthermore, an optical module 15 may be fixed to the cover 14 so as to be in continuous contact with the end opposite to the end that is in contact with the side fill 13 over its entire circumference. As described above, the imaging device 10 may be manufactured by providing the image sensor 11, side fill 13, cover 14, and optical module 15 on the substrate 12. 【0025】 The imaging device 10 of this embodiment, having the configuration described above, comprises an image sensor 11, a substrate 12 on which the image sensor 11 is mounted, and a side fill 13 that is continuous around the entire circumference in the circumferential direction with respect to the normal to the light-receiving surface of the image sensor 11, and is located in contact with the main surface of the substrate 12 and a portion of the side surface of the image sensor 11 along the circumferential direction. With this configuration, since the side fill 13 is continuous around the entire circumference in the circumferential direction, the cover 14 can be tightly attached to the side of the side fill 13 opposite to the substrate 12. Therefore, the imaging device 10 can be miniaturized while maintaining dust protection for the image sensor 11. Furthermore, with the above configuration, the imaging device 10 can avoid sealing the space sandwiched between the image sensor 11 and the substrate 12. 【0026】 Furthermore, the imaging device 10 according to this embodiment further includes a cover 14 that contacts the side of the side fill 13 opposite to the substrate 12 over its entire circumference, sealing the space between the image sensor 11 and the optical module 15 that forms an image of a subject on the image sensor 11. With this configuration, the imaging device 10 can prevent foreign matter from entering because the space between the optical module 15 and the image sensor 11 is sealed. 【0027】Furthermore, in the imaging device 10 according to this embodiment, the height of the side fill 13 from the substrate 12 is higher in the portion that contacts the side surface of the image sensor 11 than in the portion that does not contact the image sensor 11. Generally, when the side fill agent is applied without being divided into multiple applications, the portion that does not contact the image sensor 11 is lower than the portion that does contact it. Therefore, the imaging device 10 having the above configuration allows the side fill agent for forming the side fill 13 to be applied in a single application, thus reducing manufacturing costs. 【0028】 In one embodiment, (1) the imaging device comprises an image sensor, a substrate on which the image sensor is mounted, and a side fill that is continuous over the entire circumference in the circumferential direction with respect to the normal to the light-receiving surface of the image sensor, and is in contact with the main surface of the substrate and a portion of the side surface of the image sensor along the circumferential direction. 【0029】 (2) In the imaging apparatus described in (1) above, the portion of the side fill that does not come into contact with the side surface of the image sensor connects the space defined by the substrate, the image sensor, and the side fill with the space on the side of the image sensor opposite to the substrate. 【0030】 (3) The imaging device according to (1) or (2) above further comprises a cover that contacts the side fill on the side opposite to the substrate over the entire circumference in the circumferential direction and seals the space between the image sensor and the optical module that forms an image of a subject on the image sensor. 【0031】 (4) In any of the imaging devices described in (1) to (3) above, the height of the side fill from the substrate is higher in the portion that contacts the side surface of the image sensor than in the portion that does not contact the image sensor. 【0032】 In one embodiment, the method for manufacturing the imaging device of (5) involves mounting an image sensor on a substrate, applying a side fill agent so as to be continuous over the entire circumference in the circumferential direction with respect to the normal to the light-receiving surface of the image sensor, and in contact with the surface of the substrate on the side of the image sensor and a portion of the side surface of the image sensor along the circumferential direction, and then curing the side fill agent. 【0033】The diagrams illustrating the embodiments described herein are schematic. Dimensions and proportions shown in the drawings do not necessarily correspond to actual dimensions. 【0034】 While embodiments relating to this disclosure have been described based on the drawings and examples, it should be noted that those skilled in the art can make various modifications or alterations based on this disclosure. Therefore, it should be noted that these modifications or alterations are within the scope of this disclosure. For example, the functions included in each component can be rearranged in a logically consistent manner, and multiple components can be combined into one or separated. 【0035】 All of the constituent elements described in this disclosure, and / or all of the disclosed methods or steps of processing, can be combined in any combination except for any combination in which these features are mutually exclusive. Furthermore, each of the features described in this disclosure can be replaced by an alternative feature that works for the same, equivalent, or similar purposes, unless expressly disregarded. Thus, unless expressly disregarded, each of the disclosed features is merely an example of a comprehensive set of identical or equivalent features. 【0036】 Furthermore, the embodiments relating to this disclosure are not limited to any specific configuration of the embodiments described above. The embodiments relating to this disclosure can be extended to all novel features or combinations thereof described herein, or all novel methods or processing steps or combinations thereof described herein. 【0037】 10 Imaging device 11 Image sensor 12 Substrate 13 Side fill 14 Cover 15 Optical module 16 Solder 17 Cover glass 18 First part 19 Second part 20 Optical system 21 Lens barrel s1 First surface

Claims

1. An imaging device comprising: an image sensor; a substrate on which the image sensor is mounted; and a side fill that is continuous over the entire circumference in the circumferential direction with respect to the normal to the light-receiving surface of the image sensor, and is in contact with the main surface of the substrate and a portion of the side surface of the image sensor along the circumferential direction.

2. An imaging device according to claim 1, wherein the portion of the side fill that does not come into contact with the side surface of the image sensor connects the space defined by the substrate, the image sensor, and the side fill with the space on the side of the image sensor opposite to the substrate.

3. An imaging apparatus according to claim 1 or 2, further comprising a cover that contacts the side fill on the side opposite to the substrate over the entire circumference in the circumferential direction and seals the space between the image sensor and the optical module that forms an image of a subject on the image sensor.

4. An imaging apparatus according to any one of claims 1 to 3, wherein the height of the side fill from the substrate is higher in the portion that contacts the side surface of the image sensor than in the portion that does not contact the image sensor.

5. A method for manufacturing an imaging device, comprising mounting an image sensor on a substrate, applying a side fill agent continuously over the entire circumference in the circumferential direction with respect to the normal to the light-receiving surface of the image sensor, and in contact with the surface of the substrate on the side of the image sensor and a portion of the side surface of the image sensor along the circumferential direction, and curing the side fill agent.

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