Camera actuator and camera module

Abstract

A camera actuator according to an embodiment of the invention comprises: a substrate including a pad; and a coil part disposed on one side of the substrate, wherein the coil part includes a body part on which coils are wound, and a lead-out wire drawn out from the body part, the lead-out wire including a bonding part extending onto the pad, wherein the bonding part is bonded onto the pad so as to be electrically connected thereto, and the bonding part can be disposed to be closer to an edge of the pad than to a central region thereof.

Description

Camera actuator and camera module

[0001] The present invention relates to a camera actuator and a camera module.

[0002] Generally, the adoption of cameras is gradually expanding in electronic devices, including mobile phones, laptops, and tablets. One of the technologies for improving camera performance is Autofocus (AF). The Autofocus function enables the acquisition of sharp images on the image sensor's imaging plane by moving the lens positioned in front of the image sensor along the optical axis direction according to the distance to the subject.

[0003] AF actuators generally serve to focus by moving the lens back and forth over a certain distance, and their core component is the voice coil motor (VCM). A voice coil motor typically consists of a coil and a magnet; when current flows through the coil, the generated magnetic field interacts with the magnetic field of the magnet to create a Lorentz force, which moves the lens module to the desired position. Here, the reliability of the electrical connection between the coil and the substrate is critical because if the coil is not electrically connected to the substrate, current does not flow, the magnetic field cannot be formed, and the voice coil motor loses its function. However, conventionally, when the coil wire and the substrate pad are welded, the heat and pressure applied to the wire cause bending forces to be generated in the pad, and a noticeable problem has occurred where the pad bends, resulting in a failure of electrical connection between the wire and the pad.

[0004] The technical problem of the present invention is to provide a camera actuator that improves the reliability of the electrical connection between the wire and the pad.

[0005] A camera actuator according to an embodiment includes a substrate including a pad and a coil portion disposed on one side of the substrate, wherein the coil portion includes a body portion on which coils are wound and an outgoing wire drawn from the body portion, and the outgoing wire includes a bonding portion extended onto the pad, wherein the bonding portion is bonded onto the pad and electrically connected, and the bonding portion may be disposed closer to the edge than to the central region of the pad.

[0006] A camera actuator according to another embodiment of the present invention comprises a substrate including a pad and a coil portion disposed on one side of the substrate, wherein the coil portion includes a body portion on which coils are wound and an outgoing wire drawn from the body portion, and the outgoing wire includes a bonding portion extending onto the pad, wherein the bonding portion is joined to the pad and electrically connected, and the pad includes a first pad to which the bonding portion is joined; and a second pad disposed below the first pad, wherein the bonding portion may overlap the first pad and the second pad in a vertical direction.

[0007] A camera actuator according to another embodiment of the present invention comprises a substrate including a pad and a coil portion disposed on one side of the substrate, wherein the coil portion includes a body portion on which coils are wound and an outgoing wire drawn from the body portion, and the outgoing wire includes a bonding portion extending onto the pad, wherein the bonding portion is joined to the pad and electrically connected, and wherein the pad includes a first pad and a second pad disposed spaced apart horizontally from the first pad, and a portion of the bonding portion may be disposed to be in contact between the first pad and the second pad.

[0008] An actuator according to another embodiment of the present invention comprises a substrate including a pad and a coil portion disposed on one side of the substrate, wherein the coil portion comprises a body portion on which coils are wound and a lead wire drawn out from the body portion, and the lead wire comprises a bonding portion extending onto the pad, wherein the bonding portion is joined to the pad and electrically connected, and the pad has a concave recess narrower than the width of the bonding portion, and a part of the bonding portion may be disposed in the recess.

[0009] An actuator according to another embodiment of the present invention comprises a substrate having a coil portion corresponding to a magnet, wherein the substrate comprises an insulating layer, a via penetrating the insulating layer, a pad disposed on the insulating layer and electrically connected to the via, and a protective layer disposed on the insulating layer and on the side of the pad, and the pad may have a concave groove to which a bonding portion of the coil portion is joined.

[0010] According to the camera actuator of an embodiment of the invention, the reliability of the electrical connection between the wire and the pad can be improved. The contact area between the wire and the pad is improved, thereby preventing the wire from detaching from the pad.

[0011] Figure 1 shows a part of the actuator of a camera module.

[0012] Figure 2 shows an example in which the bonding part of the coil of the actuator of Figure 1 and the pad of the substrate are connected.

[0013] Figure 3 shows another example in which the bonding part of the coil portion of the actuator of Figure 1 and the pad of the substrate are connected.

[0014] Figure 4 is a cross-sectional view of 4-4' of Figure 2.

[0015] Figure 5 shows a cross-section of a wire according to an embodiment.

[0016] Figure 6 is an example diagram showing the bonding of the bonding part and the pad of the comparative example.

[0017] (A) and (B) of FIG. 7a are examples of a side cross-sectional view and a plan view showing the connection between the bonding part of a wire and the pad of a substrate according to the first embodiment of the present invention.

[0018] (A) and (B) of FIG. 7b are other examples of side cross-sectional and plan views showing the connection between the bonding part of the wire and the pad of the substrate according to the first embodiment of the present invention.

[0019] (A) and (B) of FIG. 7c are other examples of side cross-sectional and plan views showing the connection between the bonding part of the wire and the pad of the substrate according to the first embodiment of the present invention.

[0020] (A) and (B) of FIG. 8a are examples of a side cross-sectional view and a plan view showing the connection between the bonding part of the wire and the pad of the substrate according to a second embodiment of the present invention.

[0021] (A) and (B) of FIG. 8b are first modified examples of side cross-sectional and plan views showing the connection between the bonding part of the wire and the pad of the substrate according to the second embodiment of the present invention.

[0022] (A) and (B) of FIG. 8c are other examples of side cross-sectional and plan views showing the connection between the bonding part of the wire and the pad of the substrate according to the second embodiment of the present invention.

[0023] (A) and (B) of FIG. 8d are other examples of side cross-sectional and plan views showing the connection between the bonding part of the wire and the pad of the substrate according to the second embodiment of the present invention.

[0024] (A) and (B) of FIG. 8e are other examples of side cross-sectional and plan views showing the connection between the bonding part of the wire and the pad of the substrate according to the second embodiment of the present invention.

[0025] (A) and (B) of FIG. 9a are examples of side cross-sectional and plan views showing the connection between the bonding part of the wire and the pad of the substrate according to the third embodiment.

[0026] (A) and (B) of FIG. 9b are examples of a side cross-sectional view and a plan view showing an example of the connection between the bonding part of the wire and the pad of the substrate according to the third embodiment.

[0027] FIG. 10 shows the connection arrangement of a wire and a pad according to a fourth embodiment.

[0028] FIG. 11 is an SEM photograph showing a part of a camera actuator in an embodiment of the present invention.

[0029] Figure 12 is a cross-sectional photograph of 12-12' of Figure 11.

[0030] Figure 13 is a cross-sectional photograph according to comparison.

[0031] Hereinafter, embodiments disclosed in this specification will be described in detail with reference to the attached drawings. The suffixes 'module' and 'part' for components used in the following description are assigned or used interchangeably for the sake of ease of drafting the specification and do not inherently possess distinct meanings or roles. Furthermore, the attached drawings are intended to facilitate an easy understanding of the embodiments disclosed in this specification, and the technical concepts disclosed in this specification are not limited by the attached drawings. Additionally, when an element such as a layer, region, or substrate is referred to as existing 'on' another component, this includes existing directly on the other element or having other intermediate elements existing between them.

[0032] FIG. 1 shows a part of an actuator of a camera module, FIG. 2 shows an example in which the bonding part of the coil portion of the actuator of FIG. 1 is connected to a pad of a substrate, FIG. 3 shows another example in which the bonding part of the coil portion of the actuator of FIG. 1 is connected to a pad of a substrate, and FIG. 4 is a cross-sectional view of 4-4' of FIG. 2.

[0033] Referring to FIGS. 1 and 2, an actuator (10) according to an embodiment may include a substrate (100) and a coil portion (200) disposed on the substrate (100). The actuator (10) may have a magnet (not shown) facing the coil portion (200). The coil portion (200) and the magnet function as a driving unit and can move or tilt a lens holder or lens carrier in the direction of the optical axis. The actuator may be an AF actuator or an OIS actuator. That is, the coil portion (200) and the magnet may be an AF driving unit or an OIS driving unit.

[0034] According to an embodiment, the coil portion (200) includes a body portion (210) around which the coil is wound and a pull wire (220). The pull wire (220) may include first and second pull wires (221, 222) pulled out from the body portion (210). The first and second pull wires (221, 222) may be pulled out from each end of the coil of the body portion (210). A pad (300) may be exposed on the surface of the substrate (100). A plurality of pads (300) may be spaced apart from each other. The first and second pull wires (221, 222) may each extend onto the plurality of pads (300). Each of the first and second pull wires (221, 222) may be electrically connected to the plurality of pads (300) of the substrate (100). Each of the first and second lead wires (221, 222) has a bonding portion (B1), and the bonding portion (B1) is placed on the pad (300) and can be bonded to the pad (300).

[0035] Referring to FIGS. 2 to 4, a substrate (100) according to an embodiment includes an insulating layer (140), vias (110, 120), a protective layer (160), a pad (300), a conductive layer (150), and a bottom protective layer (165). The insulating layer (140) may include prepreg. The vias (110, 120) may be metal layers formed by penetrating the insulating layer (140). The vias (110, 120) may extend vertically and electrically connect the pad (300) and the conductive layer (150). The protective layer (160) is disposed on the insulating layer (140) and may expose the pad (300) while not exposing a portion other than the pad (300). The protective layer (160) may include solder resist.

[0036] The bonding portion (B1) can be placed on the pad (300) and welded by applying heat and pressure. Due to the force applied when the bonding portion (B1) is welded to the pad (300), a portion of the pad (300) is subjected to a downward bending force, and the pad (300) may have a groove (350) in the area where the bonding portion (B1) is joined to the pad (300).

[0037] The bonding portion (B1) illustrated in FIG. 2 may be placed on the pad (300) in an area that does not overlap vertically with the plurality of vias (110, 120). As another example, the bonding portion (B1) illustrated in FIG. 3 may be placed on the pad (300) in an area that overlaps vertically with the plurality of vias (110, 120). As a result, electrical connection between the vias (110, 120) and the bonding portion (B1) may be made easier.

[0038] FIG. 5 shows a cross-section of a wire according to an embodiment. Referring to FIG. 4 and FIG. 5, the lead wire (220) according to an embodiment is a coil and includes a metal layer (201), a coil insulation layer (202), and an adhesive layer (203). The coil insulation layer (202) is disposed around the metal layer (201), and the adhesive layer (203) may be disposed around the coil insulation layer (202). The adhesive layer (203) may be removed when welding the lead wire (220). The metal layer (201) may include copper (Cu).

[0039] The coil insulation layer (202) may include polyurethane, polyester, polyamide, polyimide, or epoxy materials. The adhesive layer (203) may be formed to secure the body portion (210) on which the lead wire (220) is wound. The adhesive layer (203) may include silicone, epoxy, acrylic, or polyamide materials. When the lead wire (220) is welded to the pad (300), the coil insulation layer (202) and the adhesive layer (203) of the bonding portion (B1) are melted and moved outward in the area where the bonding portion (B1) and the pad (300) are joined by heat and pressure, and the metal layer (201) and the pad (300) can be joined to each other.

[0040] FIG. 6 is an example of a comparative example. Referring to FIG. 6, in order for the pad (300) and the bonding part (B1) to be electrically connected, the metal layer (201) of the bonding part (B1) must come into contact with the pad (300). However, according to the comparative example, pressure may be applied to the pad (300) by the pressure applied to the bonding part (B1), and the pad (300) may be bent concavely by the force applied. The force applied to the pad (300) acts most strongly in the central region of the pad (300). That is, the central region of the pad (300) is bent most concavely by the external force. Therefore, when welding the bonding part (B1) of the coil, the heat and pressure transmitted to the area where the bonding part (B1) and the pad (300) come into contact may be weakened as the pad (300) is bent. As a result, the coil insulation layer (202) and the adhesive layer (203) may not melt sufficiently, so the metal layer (201) and the pad (300) may not come into contact and thus may not be electrically connected.

[0041] FIGS. 7a to 7d illustrate the arrangement of a wire and a pad according to a first embodiment of the present invention, where (A) is a side cross-sectional view and (B) is a plan view. In the drawings, the size of the bonding portion (B1) is somewhat exaggerated to explain the position where the bonding portion (B1) of the pull-out wire (220) is placed on the pad (300), but the size of the pull-out wire (220) may be smaller than shown. Additionally, in the drawings, the pull-out wire (220) is drawn in a rectangular shape, but the other end of the pull-out wire (220) can be understood as being connected to the body portion (210).

[0042] Referring to FIGS. 7a through 7d, the pad (300) can be divided into first to fifth regions (A1, A2, A3, A4, A5) by first to sixth virtual lines (L1, L2, L3, L4, L5, L6). The pad (300) can form a rectangular shape having a first side (S1), a second side (S2), a third side (S3), and a fourth side (S4). The first and third sides (S1, S3) are the edges on both sides of the first direction (X) of the pad, and the second and fourth sides (S2, S4) are the edges on both sides of the second direction (Y) that is orthogonal to the first direction (X).

[0043] The above-mentioned lead wire (220) is a portion drawn out from the coil portion, the bonding portion (B1) is a coil extending from the lead wire (220) onto the pad (300), and the end portion (BD1) may be the end portion where the lead wire is bonded to the pad (200). On the pad (200), the end portion (BD1) of the bonding portion (B1) may extend from the second side (S2) toward the fourth side (S4), or extend to an area adjacent to at least one of the second, third, and fourth sides (S2, S3, S4) or at least one of the edges of the pad (200). The edge of the pad (200) is the edge of the area exposed on the upper surface of the substrate.

[0044] When the bonding portion (B1) is welded to the pad (300), a groove (303) and a protrusion (304) may be formed in the pad (300) by the heat and pressure applied to the bonding portion (B1). The groove (303) and the protrusion (304) may overlap with the bonding portion (B1) in a third direction (Z). The third direction (Z) is a direction orthogonal to the first and second directions (X, Y). On the substrate, the groove (303) and the protrusion (304) of the pad (100) may be spaced apart from the central region of the pad (300). Here, the central region may be a third region (A3) between the first and second regions (A1, A2) on one side and the fourth and fifth regions (A4, A5) on the other side among the first to fifth regions (A1-A5) separated along the first direction (X) with respect to the second direction (Y) on the upper surface of the pad (100). Additionally, the central region may be an area within the third region (A3) that passes through or is adjacent to the center line (CL1) of the second direction (Y). Furthermore, the central region may be an area spaced apart from the first to fourth sides (S1-S4) of the pad (100).

[0045] Referring to FIG. 7a, the extraction wire (220) may be positioned inside the first to fifth regions (A1 to A5) of the pad (300). The first region (A1) is adjacent to the first side (S1), the fifth region (A5) is adjacent to the second side (S2), and the second to fourth regions (A2, A3, A4) are positioned between the first and fifth regions (A1, A5). A via disclosed above may be formed on the lower part of the pad in at least one of the first and fifth regions (A1, A5).

[0046] The bonding portion (B1) may be positioned spaced apart from the third region (A3), which is the central region of the pad (300). Preferably, the bonding portion (B1) may be positioned in the second region (A2) or the fourth region (A4), which is spaced apart from the third region (A3), which is the central region. The bonding portion (B1) may be positioned parallel to the virtual lines (L1 to L6). The bonding portion (B1), the groove (303), and the convex portion (304) may be positioned on at least one of the first and second regions (A1, A2). The bonding portion (B1), the groove (303), and the convex portion (304) may be positioned on at least one of the fourth and fifth regions (A4, A5). By positioning the bonding portion (B1) apart from the central region of the pad (300), when the bonding portion (B1) is welded to the pad (300), the bending force applied to the pad (300) can be weakened, and as a result, the metal layer (201) of the wire and the pad (300) can easily come into contact.

[0047] The length of the bonding portion (B1) may be at least 45% of the length of the second direction (Y) of the pad (300). The length of the bonding portion (B1) is the length of the area that overlaps with the pad (300) in the third direction (Z). The bonding portion (B1), the groove (303), and the convex portion (304) may be closer to the via connected to the pad (300) than the central area. The bonding portion (B1), the groove (303), and the convex portion (304) may overlap in a perpendicular direction with at least one or all of the vias disclosed above.

[0048] Referring to FIG. 7b, the end of the bonding portion (B1) may be positioned to the side furthest from the body portion (210). For example, the end of the bonding portion (B1) may be extended to the fourth side (S4) of the pad (300). By extending the bonding portion (B1) to the fourth side (S4), the contact area between the metal layer (201) of the bonding portion (B1) and the pad (300) may be increased.

[0049] Referring to FIG. 7c, the bonding portion (B1) may be positioned at an angle to the virtual lines (L1 to L6) separating the pad (300). Since the bonding portion (B1) is positioned diagonally across the area of ​​the pad portion (300), the pressure applied when welding the bonding portion (B1) to the pad portion (300) is applied to areas other than the central area of ​​the pad portion (300), thereby weakening the bending force generated in the central area of ​​the pad portion (300). Consequently, the adhesive layer (202) and the insulating layer (203) of the bonding portion (B1) may sufficiently melt due to heat and pressure, allowing the metal layer (201) and the pad (300) to come into contact.

[0050] The second side (S2) of the pad (300) may be extended in a straight line toward the fourth side (S4), or extended diagonally between the first side (S1) and the fourth side (S4), or extended diagonally between the third side (S3) and the fourth side (S4). Here, the second side (S2) is an area adjacent to the coil portion of the pad (300).

[0051] The bonding portion (B1), the groove (303), and the convex portion (304) may be superimposed in a vertical direction on the third region (A3). The bonding portion (B1), the groove (303), and the convex portion (304) may be placed on at least one or all of the second, third, and fourth regions (A2, A3, A4).

[0052] Referring to FIG. 7d, the bonding portion (B1) may be positioned to form an angle with the virtual lines (L1 to L6) separating the pad (300). In order to traverse a large area of ​​the pad (300), the bonding portion (B1) may be positioned to the side furthest from the body portion (210). For example, the bonding portion (B1) may be positioned to extend to at least one side of the first side (S1) or the fourth side (S4).

[0053] FIGS. 8a to 8c illustrate the arrangement of a wire and a pad connected according to a second embodiment of the present invention. In the drawings, the size of the bonding part (B1) is somewhat exaggerated to explain the position where the bonding part (B1) is placed on the pad (300), but the size of the pull-out wire (220) may be smaller than shown. Additionally, in the drawings, the bonding part (B1) is drawn in a rectangular shape, but one end of the bonding part (B1) is connected to the body part (210).

[0054] Referring to FIGS. 8a through 8c, the first to fifth regions (A1, A2, A3, A4, A5) can be divided by the first to sixth virtual lines (L1, L2, L3, L4, L5, L6). The pad (300) may include a first pad (310) and a second pad (320). The first pad (310) and the second pad (320) may have the same thickness. As another example, the first pad (310) and the second pad (320) may have different thicknesses. For example, the first pad (310) may be thicker than the second pad (320) for bonding with the bonding part (B1). For example, the second pad (320) may be thicker than the first pad (310) to support the pressure of the bonding part (B1).

[0055] The lower surface of the first pad (310) may come into contact with the upper surface of the second pad (320). At least one of the first pad (310) and the second pad (320) may be connected to the via disclosed above. For example, the second pad (320) may be connected to the via. The first pad (310) is a pad area where the bonding portion (B1) is bonded and exposed to the surface of the substrate, and the second pad (320) may be a conductive layer supporting the first pad (310) on the lower surface of the first pad (310). The second pad (320) may be offset from the lower portion of the first pad (310). Although not illustrated, only the first pad (310) may be exposed from the substrate (100), and the second pad (320) may not be exposed to the outside by a protective layer. The first pad (310) exposed to the outside may have a polygonal, circular, or elliptical shape, and for example, the first pad (310) may have a rectangular shape having a first side (S1), a second side (S2), a third side (S3), and a fourth side (S4).

[0056] The first pad (310) is positioned within the second to fifth regions (A2-A5), and the second pad (320) is positioned within the first to fourth regions (A2-A4). The portion of the second pad (320) in the first region (A1) may not be exposed to the outside. The first pad (310) and the second pad (320) may overlap vertically in the second to fourth regions (A2-A4). In other words, the first pad (310) and the second pad (320) may each overlap each other vertically by an area of ​​3 / 4. However, not limited thereto, the first pad (310) and the second pad (320) may each overlap each other vertically by an area of ​​1 / 2 or 2 / 5. The first and third sides (S1, S3) are the two edges of the first direction (X) on the pad, and the second and fourth sides (S2, S4) are the two edges of the second direction (Y) perpendicular to the first direction (X). The end (BD1) of the bonding portion (B1) may extend from the second side (S3) adjacent to the coil portion to any one of the first, third, and fourth sides (S1, S3, S4). The end (BD1) may be positioned to pass through at least the center line (CL1).

[0057] Referring to FIG. 8a, the bonding portion (B1) may be positioned in the third area (A3), which is the central area of ​​the second to fourth areas (A2 to A4) where the first pad (310) and the second pad (320) overlap in a vertical direction. Since the bonding portion (B1) is positioned at the location where the first pad (310) and the second pad (320) overlap in a vertical direction, when heat and pressure are applied to the bonding portion (B1) to weld it to the first pad (310), the second pad (320) can support the first pad (310). In particular, by not positioning the bonding portion (B1) in the central area of ​​each of the first pad (310) and the second pad (320), the bending force applied to the first pad (310) and the second pad (320) may be further weakened. That is, the first pad (310) and the second pad (320) may not be bent.

[0058] Referring to FIG. 8b, the bonding portion (B1) may be placed in the central area of ​​the first pad (310) or the second pad (320). For example, the bonding portion (B1) may be placed in the central area of ​​the first pad (310), that is, at the location of the fourth virtual line (L4) in FIG. 8b. Even if the bonding portion (B1) is placed in the central area of ​​the first pad (310), by supporting the first pad (310) at a location other than the central area of ​​the second pad (320), the first pad (310) may be prevented from bending under a bending force.

[0059] Referring to FIG. 8c, the bonding portion (B1) is positioned in the central area of ​​the first pad (310) or the second pad (320), and the end of the bonding portion (B1) may be positioned to the side furthest from the body portion (210). For example, the end of the bonding portion (B1) may be positioned to the fourth side (S4). The area where the metal layer (203) of the bonding portion (B1) contacts the pad (300) is widened, making electrical connection easier.

[0060] Referring to FIG. 8d, the bonding portion (B1) may be positioned to form an angle with the virtual lines (L1 to L6) separating the pad (300). The bonding portion (B1) may be positioned on the first pad (310) to cross the third region (A3) and the fourth region (A4), which are the central regions of the first pad (310). The bending force of the first pad (310) caused by the pressure applied when welding the bonding portion (B1) is supported by the second pad (320) positioned below, thereby preventing the pad (300) from bending.

[0061] Referring to FIG. 8e, the bonding portion (B1) may be positioned to form an angle with the virtual lines (L1 to L6) separating the pad (300). In order to traverse a large area of ​​the pad (300), the bonding portion (B1) may be positioned to the side furthest from the body portion (210). For example, the bonding portion (B1) may be positioned to extend to at least one side of the first side (S1) or the fourth side (S4).

[0062] FIGS. 9a and 9b illustrate the connection arrangement of a wire and a pad according to a third embodiment. In the drawings, the size of the bonding portion (B1) is depicted somewhat exaggerated to explain the position where the bonding portion (B1) is placed on the pad (300), but the size of the wire (200) may be smaller than depicted. Additionally, although the bonding portion (B1) is drawn in a rectangular shape in the drawings, it can be understood that one end of the bonding portion (B1) is connected to the body portion (210). Furthermore, the pad (300) may be placed within the first to third virtual lines (L1 to L3).

[0063] Referring to FIG. 9a, the pad (300) may include a first pad (310) and a second pad (320). Although the first pad (310) and the second pad (320) are depicted as having the same area, they are not limited thereto and may have different areas. The first pad (310) and the second pad (320) may be spaced apart at a certain distance in the horizontal direction to form a spaced-apart space (311a). The length of the first direction (X direction) of the spaced-apart space may be smaller than the width of the bonding portion (B1). When the bonding portion (B1) is welded to the first pad (310) and the second pad (320), the bonding portion (B1) can be electrically connected so that the first pad (310) comes into contact with the edge and side of the second pad (320).

[0064] According to the third embodiment, the first pad (310) and the second pad (320) may not be affected by bending force due to pressure applied to the bonding part (B1). Additionally, since the contact area between the bonding part (B1) and the first pad (310) and the second pad (320) increases, the adhesion between the pads (310, 320) and the bonding part (B1) can be improved. As a result, the phenomenon of the bonding part (B1) detaching from the pad (300) due to the repulsive force generated on the bonding part (B1) after the welding step can be prevented.

[0065] Referring to FIG. 9b, the pad (300) according to the third embodiment is formed as a single pad and may have a concave recess (303) on the pad (300). The length of the width of the recess (303) in the first direction (X-axis direction) may be smaller than the length of the width of the bonding portion (B1).

[0066] The recess (303) may be formed at the location of the second virtual line (L2), which is the central position of the pad (300). However, it is not limited thereto, and the recess (303) may be formed at a certain distance from the second virtual line (L2) or may be formed to cross the second virtual line (L2) at an angle. The bonding portion (B1) may be welded onto the recess (303). The bonding portion (B1) may be melted into the recess (303) by heat and pressure and electrically connected. The recess (303) increases the contact area with the bonding portion (B1) and improves adhesion, thereby preventing the bonding portion (B1) from detaching from the pad (300) due to the repulsive force generated on the bonding portion (B1) after the welding step.

[0067] FIG. 10 shows the connection arrangement of a wire and a pad according to a fourth embodiment.

[0068] Referring to FIG. 10, the pad (300) may include a first pad (310) and a second pad (320). The second pad (320) may be positioned below the first pad (310). The second pad (320) may overlap the first pad (310) in a vertical direction. The center of the second pad (320) and the center of the first pad (310) may overlap in a vertical direction. When the bonding portion (B1) is welded, a first force (F1), which is compressive stress, may be generated on the first pad (310) at the surface in contact with the bonding portion (B1), and a second force (F2), which is tensile stress, may be generated on the surface opposite to the surface in contact with the bonding portion (B1). In the second pad (320), a third force (F3), which is a compressive stress generated by the second force (F2) on the surface in contact with the first pad (310), and a fourth force (F4), which is a tensile stress generated on the surface opposite to the surface in contact with the first pad (310), may be generated. The first force (F1) is offset by the fourth force (F4), and the second force (F2) is offset by the third force (F3), so that the bending force generated in the pad (300) can be reduced. That is, when the bonding part (B1) is combined with the first pad (310), the pad is not bent, thereby improving the reliability of the bonding of the bonding part (B1) with the first pad (310).

[0069] FIG. 11 is an SEM photograph showing a part of a camera actuator in an embodiment of the present invention, FIG. 12 is a cross-sectional photograph of 12-12' in FIG. 11, and FIG. 13 is a cross-sectional photograph according to a comparative example. Referring to FIG. 11 and 12, the bonding part (B1) and the pad (300) have an arrangement relationship according to the first embodiment, and the bonding part (B1) is in contact with the pad (300) and is electrically connected. Referring to FIG. 13, the bonding part (B1) according to the comparative example may not be in contact with the pad (300) and may be separated to form a defect area (DF). This may occur when the bonding part (B1) is welded to the pad (300), and the wire (200) and the pad (300) do not come into contact, and the pad (300) bends. As in the comparative example, if the pad (300) and the bonding part (B1) do not come into contact, they cannot be electrically connected, which results in a serious problem where the camera actuator (10) loses its function.

[0070] Although the above description has focused on the embodiments, this is merely an example and is not intended to limit the embodiments. A person skilled in the art will understand that various modifications and applications not exemplified above are possible within the scope of the essential characteristics of the embodiments. For instance, each component specifically shown in the embodiments may be modified and implemented. Furthermore, differences related to such modifications and applications should be interpreted as being included within the scope of the embodiments set forth in the appended claims.

Claims

1. A substrate including a pad; and It includes a coil portion disposed on one side of the above substrate, and The above coil portion includes a body portion on which coils are wound and a wire drawn out from the body portion, and The above-mentioned lead wire is, It includes a bonding portion extended onto the pad above, and The above bonding portion is bonded to the pad and electrically connected, and A camera actuator, wherein the bonding portion is positioned closer to the edge than to the central area of ​​the pad.

2. In Paragraph 1, The above substrate has a plurality of vias electrically connected to the pad, and The above bonding portion is joined to the pad, and The above bonding portion is a camera actuator that overlaps in a vertical direction with at least one of the plurality of vias.

3. In Paragraph 1, The above bonding portion is a camera actuator positioned diagonally from one side of the pad toward the opposite side.

4. In Paragraph 1, The above pad is a camera actuator having a concave groove in the area of ​​the bonding portion.

5. In Paragraph 4, A camera actuator in which the upper surface area of ​​the above-mentioned groove is larger than the upper surface area of ​​the bonding part disposed on the above-mentioned pad.

6. In Paragraph 4, The above pad is a camera actuator having a convex protrusion on the opposite side of the bonding portion.

7. A substrate including a pad; and It includes a coil portion disposed on one side of the above substrate, and The above coil portion includes a body portion on which coils are wound and a wire drawn out from the body portion, and The above-mentioned lead wire is, It includes a bonding portion extended onto the pad above, and The above bonding portion is bonded to the pad and electrically connected, and The above pad is, A first pad to which the above bonding portion is joined; and It includes a second pad disposed below the first pad, and The above bonding portion is a camera actuator that overlaps the first pad and the second pad in a vertical direction.

8. A substrate including a pad; and It includes a coil portion disposed on one side of the above substrate, and The above coil portion includes a body portion on which coils are wound and a wire drawn out from the body portion, and The above-mentioned lead wire is, It includes a bonding portion extended onto the pad above, and The above bonding portion is bonded to the pad and electrically connected, and The above pad is, It includes a first pad and a second pad spaced apart horizontally from the first pad, A camera actuator in which a portion of the bonding portion is positioned to contact between the first pad and the second pad.

9. A substrate including a pad; and It includes a coil portion disposed on one side of the above substrate, and The above coil portion includes a body portion on which coils are wound and a wire drawn out from the body portion, and The above-mentioned lead wire is, It includes a bonding portion extended onto the pad above, and The above bonding portion is bonded to the pad and electrically connected, and The above pad has a concave recess narrower than the width of the bonding portion, and A camera actuator in which a portion of the bonding portion is placed in the recess.

10. In a substrate having a coil portion corresponding to a magnet, The above substrate is, Insulating layer; A via penetrating the above insulating layer; A pad disposed on the insulating layer and electrically connected to the via; and It includes a protective layer disposed on the insulating layer and on the side of the pad, The above pad is a camera actuator having a concave groove to which the bonding portion of the coil portion is joined.

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