Gluing method and associated gluing system
The gluing method and system use linear lasers to guide and inspect the gluing nozzle in real-time, addressing precision and complexity issues, and dynamically adjust dispensing speed, resulting in improved gluing precision and reduced complexity.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- ABB (SCHWEIZ) AG
- Filing Date
- 2024-12-09
- Publication Date
- 2026-06-18
AI Technical Summary
Existing gluing methods and systems face challenges in achieving higher precision, faster cycling time, lower cost, and smaller size, particularly in the 3C industry, with complex requirements for robots and on-site commissioning.
A gluing method and system that utilizes linear lasers to simultaneously scan the surface and guide a gluing nozzle along a planned path, with lasers positioned in front of and behind the nozzle to provide real-time guidance and quality inspection, and dynamically adjusts dispensing speed based on the nozzle's movement speed.
This approach enhances the precision of gluing, reduces complexity, and improves consistency and quality while reducing the need for complex robot requirements and on-site commissioning.
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