Electronic device and vehicle

Abstract

The present disclosure relates to an electronic device and a vehicle. The electronic device comprises: a housing, a piezoelectric assembly and a conductive member, wherein the housing is provided with a closed accommodating cavity; the piezoelectric assembly is disposed in the accommodating cavity, and the piezoelectric assembly is configured to be able to generate a first electrical signal in response to passive vibration, and / or the piezoelectric assembly is configured to be able to generate deformation in response to a second electrical signal; and a first end of the conductive member is electrically connected to the piezoelectric assembly, and the first electrical signal and / or the second electrical signal is transmitted by means of the conductive member.

Description

An electronic device and a vehicle

[0001] Cross-references to related applications

[0002] This disclosure claims priority to Chinese Patent Application No. 202423106562.2, filed on December 14, 2024, by PATEO Vehicle Connectivity Technology (Shanghai) Co., Ltd., entitled "An Electronic Device and Vehicle"; and also claims priority to Chinese Patent Application No. 202411855020.7, filed on December 14, 2024, by PATEO Vehicle Connectivity Technology (Shanghai) Co., Ltd., entitled "An Electronic Device and Vehicle". The disclosure further claims priority to Chinese Patent Application No. 202411855020.7, filed on April 14, 2025. The Chinese patent application filed on the 9th, with application number 202520665431.3, filed by PATEO Vehicle Connectivity Technology (Shanghai) Co., Ltd., entitled "An Electronic Device and Vehicle", claims priority to the Chinese patent application filed on May 20, 2025, with application number 202510652910.6, filed by PATEO Vehicle Connectivity Technology (Shanghai) Co., Ltd., entitled "An Electronic Device and Vehicle". The full text of these four Chinese patent applications is incorporated herein by reference. Technical Field

[0003] This application relates to the field of electronic device technology, and more particularly to an electronic device and a vehicle. Background Technology

[0004] Piezoelectric ceramics are functional ceramic materials capable of converting mechanical energy and electrical energy into each other. In addition to piezoelectricity, piezoelectric ceramics also possess dielectric and elastic properties, and have been widely used in medical imaging, acoustic sensors, acoustic transducers, and ultrasonic motors. Piezoelectric ceramics are manufactured by utilizing the polarization caused by the relative displacement of the positive and negative charge centers within the material under mechanical stress, resulting in bound charges of opposite signs on the surfaces at both ends of the material. Piezoelectric ceramics also possess sensitive properties. Therefore, they can be used to manufacture ultrasonic transducers, underwater acoustic transducers, electroacoustic transducers, ceramic filters, and ceramic transformers.

[0005] Piezoelectric ceramics have a wide range of applications, but they share the common characteristics of ceramics, namely, low tensile and shear strength, which makes them brittle. This affects their use and the performance of devices made from them. Summary of the Invention

[0006] One embodiment of this application provides an electronic device and a vehicle including the electronic device. The electronic device includes a housing, a piezoelectric component, and a conductive component. The piezoelectric component is disposed within a closed cavity of the housing. The first end of the conductive component is electrically connected to the piezoelectric component. The electronic device can provide good protection for the piezoelectric component, thereby improving the reliability and stability of the electronic device and simplifying the assembly process of the electronic device.

[0007] Another embodiment of this application provides an electronic device and a vehicle including the electronic device, wherein a connector is provided on the housing, allowing a second end of a conductive element to be electrically connected to a portion of the connector located within a receiving cavity. After the electronic device is installed on a target device, it can be electrically connected to the controller of the target device via the connector, facilitating the electrical connection of the piezoelectric component to the controller and simplifying installation.

[0008] Another embodiment of this application provides an electronic device and a vehicle including the electronic device, wherein the conductive component is located in a closed accommodating cavity and is connected to the piezoelectric assembly and the connector respectively. This not only protects the piezoelectric assembly and the conductive component through the housing, but also reduces the need for additional waterproof and dustproof protection measures for the conductive component and the piezoelectric assembly, which helps to simplify the assembly process of the electronic device.

[0009] Another embodiment of this application provides an electronic device and a vehicle including the electronic device, wherein no other components are mounted on the circuit board disposed within the accommodating cavity. The controller for controlling the piezoelectric component, the signal processing circuit for processing the first electrical signal generated by the piezoelectric component, etc., can be disposed outside the housing. This facilitates the design and modification of the controller, signal processing circuit, etc., according to the application environment of the electronic device, thereby improving the flexibility of the electronic device's application. Furthermore, compared to placing the signal processing circuit, etc., inside the housing, not mounting other components on the circuit board avoids redundant protection circuits, thus saving costs.

[0010] Another embodiment of this application provides an electronic device and a vehicle including the electronic device, wherein one end of a conductive element is fixedly connected to one of a piezoelectric assembly and a circuit board, and the other end of the conductive element is abutted against the other of the piezoelectric assembly and the circuit board. Thus, during the assembly of the electronic device, it is only necessary to fix one end of the conductive element to the piezoelectric assembly or the circuit board, without the need for a special connection process for the other end of the conductive element, thereby simplifying the assembly process of the electronic device.

[0011] Another embodiment of this application provides an electronic device and a vehicle including the electronic device, wherein the second end of a conductive element is connected to a portion of a connector located within a receiving cavity, and the first end of the conductive element abuts against a piezoelectric component. Thus, during the assembly of the electronic device, only the conductive element needs to be connected to the connector, without the need for a dedicated connection process between the first end of the conductive element and the piezoelectric component, thereby simplifying the assembly process of the electronic device.

[0012] Another embodiment of this application provides an electronic device and a vehicle including the electronic device, wherein a vent is provided on the connector, through which the accommodating cavity is connected to the outside of the outer casing. This allows the pressure inside the accommodating cavity to change with the air pressure at different ambient temperatures, which helps to maintain pressure balance inside and outside the accommodating cavity. Furthermore, by providing the vent on the connector, a vent is not required on the outer casing, simplifying the casing structure. Simultaneously, after the connector is inserted into the socket of the target device, the connector is covered by the socket, maintaining a sealed state of the accommodating cavity.

[0013] Another embodiment of this application provides an electronic device and a vehicle including the electronic device, wherein a connection through hole matching the connector is provided on the circuit board, which facilitates the connector to extend directly through the connection through hole to the position connected to the second end of the conductive element. This reduces the length required for the connector to bypass the circuit board, thereby reducing the weight of the connector and contributing to the lightweighting of the electronic device.

[0014] Another embodiment of this application provides an electronic device and a vehicle including the electronic device, wherein the piezoelectric assembly includes a substrate and a piezoelectric element, the piezoelectric element being attached to the substrate, and a positive electrode region and a negative electrode region being respectively disposed on the piezoelectric element and the substrate. This allows for greater flexibility in the arrangement of the positive and negative electrode regions on the piezoelectric assembly, meaning that the connection area of ​​the conductive element on the piezoelectric assembly is more flexibly arranged, facilitating the placement of the conductive element within the accommodating cavity based on available space. Furthermore, during the assembly of the conductive element and the piezoelectric assembly, it is easier to determine the connection area between the conductive element and the piezoelectric assembly, which improves assembly efficiency and accuracy.

[0015] Another embodiment of this application provides an electronic device and a vehicle including the electronic device, wherein the conductive component is an elastic conductive component. By selecting the elastic coefficient and length of the elastic conductive component, it can be compressed after the electronic device is assembled, thereby ensuring a tight connection between the elastic conductive component and the piezoelectric assembly, circuit board, or connector. Furthermore, during the assembly of the electronic device, the elastic conductive component can deform, which helps reduce the risk of damage to the piezoelectric assembly from impacts. Simultaneously, during the use or transportation of the electronic device, when the electronic device is subjected to vibration, the elastic conductive component can absorb and reduce the transmission of vibration, thereby reducing the risk of damage to the piezoelectric assembly from strong vibration impacts.

[0016] Another embodiment of this application provides an electronic device and a vehicle including the electronic device, wherein the piezoelectric component and the housing are an integral structure, that is, the piezoelectric component is injection molded into the housing by insert molding, which helps to reduce the process of fixing the piezoelectric component to the housing, thereby improving the assembly efficiency of the electronic device.

[0017] Another embodiment of this application provides an electronic device and a vehicle including the electronic device, wherein the piezoelectric component can sense external vibrations and / or cause components of a target device to be connected to the electronic device to vibrate, so that the electronic device can be used as an elastic wave sensor or a speaker component.

[0018] Another embodiment of this application provides an electronic device and vehicle, wherein a controller electrically connected to a piezoelectric component is provided on a circuit board. The controller can control the piezoelectric component to generate vibration and / or process the electrical signals generated by the piezoelectric component. Furthermore, the controller is also housed within a sealed cavity, and the housing provides protection for the controller, thereby eliminating the need for redundant protective shells or similar components.

[0019] Another embodiment of this application provides an electronic device and a vehicle including the electronic device, wherein a transmission circuit is provided between the controller and connector of the electronic device, which can control the transmission of data between the electronic device and the target device, thereby improving the data transmission rate between the electronic device and the target device and reducing the error rate during data transmission.

[0020] Another embodiment of this application provides an electronic device and a vehicle including the electronic device, wherein a signal processing circuit electrically connected to a piezoelectric component is provided on a circuit board. The signal processing circuit can process the electrical signal generated by the piezoelectric component, thereby converting the electrical signal generated by the piezoelectric component into a signal that can be received and recognized by the controller. At the same time, by placing both the piezoelectric component and the signal processing circuit inside a housing, electromagnetic shielding protection for circuits located outside the housing can be omitted, which is beneficial to improving anti-interference capability.

[0021] Another embodiment of this application provides an electronic device and a vehicle including the electronic device, wherein a voltage regulator output circuit is provided for the signal processing circuit, which can supply power to the components in the signal processing circuit. Furthermore, the voltage regulator output circuit can precisely control the voltage applied to the signal processing circuit, which helps improve the accuracy of the voltage applied to the signal processing circuit, thereby improving the stability and reliability of the signal processing circuit's operation.

[0022] Another embodiment of this application provides an electronic device and a vehicle including the electronic device, wherein the circuit board is configured with at least two sub-circuit boards. The presence of at least two sub-circuit boards increases the area of ​​the circuit board, allowing multiple circuits in the electronic device to be disposed on different sub-circuit boards. Furthermore, by stacking multiple sub-circuit boards at intervals within a receiving cavity, compared to configuring multiple sub-circuit boards as a single integrated circuit board, the dimensions of the electronic device in the closing direction perpendicular to the cover and the support member can be reduced. Moreover, the spacing between adjacent sub-circuit boards facilitates heat dissipation for the devices on the sub-circuit boards.

[0023] Another embodiment of this application provides an electronic device and a vehicle including the electronic device, wherein the connecting component is configured as a conductive structure, and while the first sub-circuit board and the second sub-circuit board are fixedly connected by the connecting component, the first sub-circuit board and the second sub-circuit board can also be electrically connected, which is beneficial to saving the wires and the like for setting the electrical connection between the first sub-circuit board and the second sub-circuit board.

[0024] Another embodiment of this application provides an electronic device and a vehicle including the electronic device, wherein the same piezoelectric assembly includes at least two piezoelectric elements, and at least one of the structures, properties, and connection methods with the housing of the at least two piezoelectric elements is different, which can cause the piezoelectric assembly to generate vibrations of different frequencies and / or amplitudes, thereby driving the components of the target device to generate vibrations of different frequencies and / or amplitudes, and thus causing the components of the target device to emit sounds of different pitches.

[0025] Another embodiment of this application provides an electronic device and a vehicle including the electronic device, wherein at least one of the cover and the carrier is provided with an abutment portion corresponding to the circuit board, which can press and fix the circuit board in the accommodating cavity; and can also transmit the external force on one of the cover and the carrier to the other through the abutment portion and the circuit board, thereby enabling the cover and the carrier to better resist deformation and breakage when subjected to external impact.

[0026] Another embodiment of this application provides an electronic device and a vehicle including the electronic device, wherein at least one of the cover and the carrier is provided with an abutment portion corresponding to the circuit board. After the cover is closed on the opening of the carrier, the interiors of the cover and the carrier can abut against each other through the abutment portion, thereby allowing an external force on one of the cover and the carrier to be transmitted to the other through the abutment portion and the circuit board, thereby improving the ability of the cover and the carrier to resist deformation and breakage when subjected to external impact.

[0027] Another embodiment of this application provides an electronic device and a vehicle including the electronic device, wherein the piezoelectric component can sense external vibrations and / or drive the components of the target device to which the electronic device is connected to vibrate, so that the electronic device can be used as both an elastic wave sensor and a speaker component.

[0028] Another embodiment of this application provides an electronic device and a vehicle including the electronic device, wherein the same piezoelectric assembly includes at least two piezoelectric elements, and at least one of the structures, properties, and connection methods with the housing of the at least two piezoelectric elements is different, which can cause the piezoelectric assembly to generate vibrations of different frequencies and / or amplitudes, thereby driving the components of the target device to generate vibrations of different frequencies and / or amplitudes, and thus causing the components of the target device to emit sounds of different pitches.

[0029] Another embodiment of this application provides an electronic device and a vehicle including the electronic device, wherein a second adhesive is provided on the outside of the connecting wall of the housing, and the electronic device can be bonded to the target device by means of the second adhesive. This can maximize the connection area between the connecting wall of the housing and the target device, thereby improving the sufficiency of vibration transmission to the target device during the vibration of the piezoelectric component, which is beneficial to ensure that the vibration is transmitted to the target device as completely as possible. Alternatively, during the deformation of the connecting wall caused by the deformation of the target device, the deformation of the target device can be transmitted to the piezoelectric component as completely as possible, thereby improving the accuracy of the electronic device's operation.

[0030] Another embodiment of this application provides an electronic device and a vehicle including the electronic device, wherein a connecting wall of the housing is connected to a piezoelectric component on its side located within the accommodating cavity and to a target device on its side located outside the accommodating cavity, thereby shortening the vibration transmission path between the piezoelectric component in the electronic device and the target device, which is beneficial to the vibration transmission between the piezoelectric component in the electronic device and the target device and improves the sensitivity of the electronic device.

[0031] Another embodiment of this application provides an electronic device and a vehicle including the electronic device, wherein a protective member is provided on the housing to surround the connector. During the process of electrically connecting the connector to the controller of the target device, the protective member can also be connected to a part in the target device that matches the protective member to block the opening of the protective member. Thus, the connector can be shielded and sealed by the protective member, thereby achieving the waterproof and dustproof protection functions of the connector.

[0032] Another embodiment of this application provides an electronic device and a vehicle including the electronic device, wherein a circuit board is provided in the accommodating cavity, and a piezoelectric component can be electrically connected to the circuit board, and the circuit board can be electrically connected to a connector, thereby meeting the performance requirements of pull-out force and improving the safety and reliability of the electrical connection between the piezoelectric component and the connector.

[0033] To achieve one or more of the above objectives, the electronic device provided in the first aspect of the present application includes: a housing, a piezoelectric component, and a conductive element; wherein the housing has a closed accommodating cavity; the piezoelectric component is disposed within the accommodating cavity, the piezoelectric component is configured to generate a first electrical signal in response to passive vibration, and / or the piezoelectric component is configured to deform in response to a second electrical signal; a first end of the conductive element is electrically connected to the piezoelectric component, and the first electrical signal and / or the second electrical signal are transmitted through the conductive element.

[0034] The electronic device provided in this application, by incorporating a piezoelectric component within a housing cavity and configuring the piezoelectric component to generate a first electrical signal in response to passive vibration and / or deform in response to a second electrical signal, can function as a vibration-generating drive or a vibration-detecting sensor. Furthermore, the housing cavity is designed as a closed chamber, providing a sealed protective environment for the piezoelectric component. This reduces the impact of dust and water on the piezoelectric component and minimizes the risk of damage from impacts, thus improving the device's reliability. Simultaneously, electrically connecting the first end of a conductive element to the piezoelectric component allows for the transmission of the first electrical signal generated by the component and the application of a second electrical signal. The placement and fixing method of the conductive element within the housing cavity simplify the connection process between the conductive element and other components, such as the piezoelectric component, thereby simplifying the assembly process. Therefore, the electronic device provided in this application provides excellent protection for the piezoelectric component, enhancing its reliability and simplifying its assembly process.

[0035] A second aspect of the embodiments of this application provides a vehicle, which includes a vehicle body and the aforementioned electronic devices. The vehicle body includes multiple body panels, multiple interior trim pieces, and vehicle components connected to the body panels and / or interior trim pieces; at least one of the body panels, interior trim pieces, and vehicle components is provided with electronic devices. Attached Figure Description

[0036] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this disclosure and, together with the specification, serve to illustrate the technical solutions of this disclosure.

[0037] Figure 1 is a schematic diagram of the structure of the electronic device provided in an embodiment of this application;

[0038] Figure 2 is a cross-sectional structural schematic diagram of the electronic device provided in an embodiment of this application;

[0039] Figure 3 is a second cross-sectional structural diagram of the electronic device provided in the embodiment of this application;

[0040] Figure 4 is a cross-sectional structural schematic diagram of the electronic device provided in the embodiment of this application;

[0041] Figure 5 is a cross-sectional structural schematic diagram of the electronic device provided in the embodiment of this application;

[0042] Figure 6 is a schematic diagram of the structure of a piezoelectric component in an electronic device provided in an embodiment of this application;

[0043] Figure 7 is a schematic diagram of the structure of the piezoelectric component in the electronic device provided in the embodiment of this application;

[0044] Figure 8 is a schematic diagram of the circuit in the electronic device provided in the embodiment of this application;

[0045] Figure 9 is a cross-sectional structural schematic diagram of the electronic device provided in the embodiment of this application;

[0046] Figure 10 is a schematic diagram of the structure of the carrier in the electronic device provided in the embodiment of this application;

[0047] Figure 11 is a cross-sectional structural diagram of the electronic device provided in the embodiment of this application.

[0048] Explanation of reference numerals in the attached drawings: 1-Outer shell; 11-Cover; 111-Groove; 12-Bearing component; 121-Fixing post; 122-Raised ring; 13-Receiving groove; 14-Abutting part; 15-Slot; 16-Snap-on; 17-Connecting wall; 18-Accommodating cavity; 2-Piezoelectric component; 21-Base; 22-Piezoelectric element; 23-Positive electrode area; 24-Negative electrode area; 3-Conductive component; 4-Connector; 5-Circuit board; 51-Connecting through hole; 52-First sub-circuit board; 53-Second sub-circuit board; 54-Connecting component; 55-Connecting circuit; 61-First adhesive component; 62-Second adhesive component; 7-Protective component; 8-Sealing component; 91-Controller; 92-Transmission circuit; 93-Signal processing circuit; 94-Regulated output circuit; 95-Wire; Z-Covering direction. Detailed Implementation

[0049] Various exemplary embodiments, features, and aspects of this disclosure will now be described in detail with reference to the accompanying drawings. The same reference numerals in the drawings denote elements that have the same or similar functions. Although various aspects of the embodiments are shown in the drawings, they are not necessarily drawn to scale unless specifically indicated otherwise.

[0050] The piezoelectric effect includes the direct piezoelectric effect and the inverse piezoelectric effect. When certain dielectrics are deformed by an external force along a certain direction, polarization occurs within them, resulting in opposite charges appearing on their two opposing surfaces. When the external force is removed, they return to their uncharged state; this phenomenon is called the direct piezoelectric effect. When the direction of the force changes, the polarity of the charges also changes. Conversely, when an electric field is applied along the polarization direction of the dielectric, these dielectrics will also deform; when the electric field is removed, the deformation disappears; this phenomenon is called the inverse piezoelectric effect.

[0051] Piezoelectric ceramics are functional ceramic materials that can convert mechanical energy and electrical energy into each other, based on the piezoelectric effect. Like other ceramics, piezoelectric ceramics are brittle and easily break upon impact, affecting their usability and the reliability of devices using them. Assembling electronic devices incorporating piezoelectric ceramics requires connecting these components electrically with wires, making the assembly process cumbersome. Furthermore, if welding is used to connect the wires to the piezoelectric ceramics, certain requirements must be placed on the size of the solder joints and the thickness of the wires to meet pull-out force requirements. However, the added weight of the solder joints and wires can negatively impact the sound performance of the electronic devices.

[0052] This application provides an electronic device. Referring to Figures 1, 2, 3 and 4, Figure 1 is a structural schematic diagram of the electronic device provided in this application, Figure 2 is a cross-sectional structural schematic diagram one of the electronic device provided in this application, Figure 3 is a cross-sectional structural schematic diagram two of the electronic device provided in this application, and Figure 4 is a cross-sectional structural schematic diagram three of the electronic device provided in this application.

[0053] The electronic device provided in this application includes: a housing 1, a piezoelectric component 2, and a conductive element 3; wherein, the housing 1 has a closed accommodating cavity; the piezoelectric component 2 is disposed in the accommodating cavity, and the piezoelectric component 2 is configured to generate a first electrical signal in response to passive vibration, and / or the piezoelectric component 2 is configured to deform in response to a second electrical signal; the first end of the conductive element 3 is electrically connected to the piezoelectric component 2, and the first electrical signal and / or the second electrical signal are transmitted through the conductive element 3.

[0054] In this embodiment, the outer casing 1 is used to support and protect other components in the electronic device. For ease of processing and assembly, the outer casing 1 can be configured as a structure including a support member 12 and a cover 11. As shown in Figures 1 and 2, the support member 12 can be configured as an approximately cuboid shape, and an approximately cuboid groove can be provided within the support member 12, serving as a receiving groove 13. One side of the support member 12 has an opening communicating with the receiving groove 13, making the support member 12 a box-like structure with an opening, allowing piezoelectric components such as the piezoelectric element 2 in the electronic device to be mounted within the receiving groove 13 through the opening. Alternatively, the support member 12 can be configured as an approximately flat plate shape, allowing other components in the electronic device to be stacked on one side surface of the flat support member 12.

[0055] In this embodiment, the shape of the cover 11 can be set according to the shape of the carrier 12. For example, as shown in Figures 1 and 2, when the carrier 12 is a box-shaped structure with an opening, the cover 11 is used to cover the opening of the carrier 12 to seal the opening of the carrier 12. For example, the cover 11 and the edge of the opening of the carrier 12 can be sealed and connected by means of interference fit, bonding, welding, etc., so that a sealed receiving cavity is formed by the cover 11 and the carrier 12. Alternatively, if the support member 12 has an approximately flat plate structure, the cover 11 can be configured as a box-shaped structure along the covering direction Z of the cover 11 and the support member 12. That is, the cover 11 has a top plate and side walls. The side walls surround the edge of the top plate and extend along the thickness direction of the top plate (covering direction Z). The outer diameter of the cover 11 is set to be smaller than the outer diameter of the support member 12. The side walls of the cover 11 can be connected to the surface of the flat support member 12 perpendicular to the covering direction Z, such as by bonding or welding the side walls of the cover 11 to the surface of the support member 12 perpendicular to the covering direction Z, so that the cover 11 covers the support member 12, thereby forming a closed accommodating cavity through the enclosure of the cover 11 and the support member 12. The specific structures of the support member 12 and the cover 11 are not limited in this application embodiment.

[0056] For example, a sealing element 8 can be provided between the cover 11 and the carrier 12, and the cover 11 and the carrier 12 are sealed together by the sealing element 8. For instance, a layer of sealing element 8 can be applied to the opening edge of the carrier 12, and then the cover 11 can be placed over the opening of the carrier 12 to bond and fix the cover 11 and the carrier 12 together by the sealing element 8, and to seal the gap between the cover 11 and the carrier 12 by the sealing element 8. The sealing element 8 can be made of materials with adhesive properties such as epoxy resin or silicone sealant.

[0057] In another example, as shown in Figures 2 and 3, one of the cover 11 and the carrier 12 has a groove, and the other has a protruding ring that matches the groove, with at least a portion of the protruding ring extending into the groove. For example, the protruding ring can be provided at the edge of the opening on the carrier 12, allowing it to surround the opening. Correspondingly, a groove matching the protruding ring can be provided on the cover 11, and the groove can be configured as an annular groove. Alternatively, a groove can be provided at the edge of the opening on the carrier 12, and this groove can be configured as an annular groove. Correspondingly, a protruding ring matching the groove can be provided on the cover 11. In this way, when the cover 11 is placed over the opening of the carrier 12, the protruding ring can extend entirely into the groove, or only a portion of the protruding ring can extend into the groove, so that the cover 11 and the carrier 12 are connected by the fit between the groove and the protruding ring. Alternatively, the protruding ring and the groove can be connected by an interference fit to achieve a seal between the cover 11 and the carrier 12.

[0058] In another example, at least a portion of the seal 8 can be located between the groove and the convex ring. That is, the seal 8 is filled into the groove, and then the cover 11 is placed over the opening of the carrier 12 so that the gap between the convex ring and the groove is filled with the seal 8. In this way, the seal 8 can not only seal the gap between the convex ring and the groove, but also bond and fix the walls of the convex ring and the groove.

[0059] As another example, as shown in Figure 1, one of the cover 11 and the support member 12 is provided with a slot 15, and the other is provided with a buckle 16 that matches the slot 15. The buckle 16 cooperates with the slot 15 to restrict the relative movement of the cover 11 and the support member 12. For example, the slot 15 can be provided on the cover 11, and the slot 15 can be a through hole or groove formed on the edge of the cover 11. Correspondingly, the buckle 16 that matches the slot 15 can be provided on the outer wall of the support member 12, and the buckle 16 can be set as a protrusion that matches the slot 15. Alternatively, a groove that serves as the slot 15 can be provided on the outer wall of the support member 12, and correspondingly, a protrusion that matches the groove and serves as the buckle 16 can be provided on the cover 11. In this way, during the process of covering the cover 11 with the opening of the carrier 12, the buckle 16 can be engaged in the slot 15, so that the movement of the cover 11 relative to the carrier 12 can be restricted by the slot 15 and the buckle 16, and the seal 8 between the cover 11 and the carrier 12 can be pressed, which helps to improve the adhesion between the cover 11 and the carrier 12.

[0060] In this embodiment of the application, as shown in FIG2, the piezoelectric component 2 can be fixedly disposed within the accommodating cavity. The piezoelectric component 2 can be installed within the accommodating cavity by means of bonding, clamping, or other methods. In some embodiments, when a second electrical signal is applied to the piezoelectric component 2, the piezoelectric component 2 can deform. In other embodiments, when the outer shell 1 is subjected to an external force and deforms (e.g., vibrates after being subjected to force), the vibration is transmitted to the piezoelectric component 2, causing the piezoelectric component 2 to passively vibrate. During this passive vibration, the piezoelectric component 2 itself can generate a first electrical signal.

[0061] For example, a piezoelectric component 2 for generating vibration can be provided within the accommodating cavity. When a second electrical signal is applied to the piezoelectric component 2, it deforms in response to the applied signal. By controlling the second electrical signal, the piezoelectric component 2 can undergo regular deformation, thus generating vibration. Alternatively, a piezoelectric component 2 for detecting vibration can be provided within the accommodating cavity. This involves placing electronic devices on the target device. When the target device vibrates, causing the outer casing 1 to vibrate, the vibration is transmitted to the piezoelectric component 2, which then generates a first electrical signal corresponding to the vibration, thereby detecting the vibration. Alternatively, at least two piezoelectric components 2 can be provided simultaneously within the accommodating cavity, with at least one component generating vibration and at least another component detecting it. Furthermore, the same piezoelectric component 2 can be configured to both generate and detect vibration. The embodiments of this application do not limit the specific function and structure of the piezoelectric component 2.

[0062] In this embodiment, a conductive element 3 can be provided in the electronic device to apply a second electrical signal to the piezoelectric component 2 and to transmit the first electrical signal generated by the piezoelectric component 2. Exemplarily, the first end of the conductive element 3 is abutted, welded, or bonded to the piezoelectric component 2 to make the first end of the conductive element 3 electrically connected to the piezoelectric component 2.

[0063] The conductive element 3 includes flexible conductive elements, rigid conductive elements, and elastic conductive elements. Flexible conductive elements can be, for example, linear or strip-shaped conductors such as metal wires. Rigid conductive elements can be, for example, solid conductive elements that are not easily deformed, such as metal pins. At least a portion of the elastic conductive element can undergo elastic deformation under external force; that is, when an external force is applied to the elastic conductive element, part or all of the elastic conductive element is compressed and deformed, and when the external force is removed, the elastic conductive element returns to its state before compression and deformation.

[0064] For example, as shown in Figure 2, the elastic conductive component can be a device with overall elasticity, such as a spring or conductive foam. For instance, the elastic conductive component can be a cylindrical helical spring or a cylindrical wave spring, and the conductive foam can include a substrate, conductive filler, adhesive, and additives.

[0065] In another example, the elastic conductive element can also be a device that is partly elastic and partly rigid. For example, the elastic conductive element can be a composite elastic connector such as a spring pin, which includes three basic components: a needle shaft, a spring, and a needle tube. As another example, the elastic conductive element can also be a combined elastic structure of a metal pin and a spring, that is, a spring is fixedly connected (e.g., sleeved) to one end of the metal pin. This application does not limit the type of elastic conductive element.

[0066] In this way, by using an elastic conductive component 3, the elastic conductive component can be compressed after the electronic device is assembled, allowing it to be tightly connected to the piezoelectric assembly 2, circuit board 5, or connector 4, by selecting its elastic coefficient and length. Furthermore, the elastic conductive component can deform during the assembly process, reducing the risk of damage to the piezoelectric assembly 2 from impacts. Simultaneously, when the electronic device is subjected to vibration during use, the elastic conductive component can absorb and reduce the transmission of vibration, thus reducing the risk of damage to the piezoelectric assembly 2 from strong vibration impacts. If the conductive component 3 were a flexible conductive component such as a metal wire, the wire welded to the piezoelectric assembly 2 would need to be led out to a corresponding position in the electronic device (such as above the circuit board 5) before welding. Given the limited space within the electronic device, the welding operation requires precision, making the assembly process more complex. However, by using a rigid conductive component such as a pin or an elastic conductive component, the conductive component 3 only needs to be welded to one of the piezoelectric assembly 2 or circuit board 5 before assembly, simplifying the assembly process.

[0067] The electronic device provided in this application embodiment, because a piezoelectric component 2 is disposed within the accommodating cavity of the housing 1, and the piezoelectric component 2 is configured to generate a first electrical signal in response to passive vibration and / or deform in response to a second electrical signal, can be used as a driving component capable of generating vibration, or as a sensor capable of detecting vibration. Furthermore, by configuring the accommodating cavity of the housing 1 as a closed cavity, a sealed protective environment is provided for the piezoelectric component 2, which helps reduce the impact of dust, water, etc., on the piezoelectric component 2, and also reduces the risk of damage to the piezoelectric component 2 from impacts, thus improving the reliability of the electronic device. Simultaneously, by electrically connecting the first end of the conductive component 3 to the piezoelectric component 2, the first electrical signal generated by the piezoelectric component 2 can be transmitted through the conductive component 3, and a second electrical signal can also be applied to the piezoelectric component 2 through the conductive component 3. Thus, with the conductive component 3 located within the accommodating cavity, the need for additional waterproof and dustproof protection measures for the conductive component 3 and the piezoelectric component 2 is reduced, which simplifies the assembly process of the electronic device. Therefore, the electronic device provided in this application embodiment can provide good protection for the piezoelectric component 2, thereby improving the reliability of the electronic device and simplifying the assembly process of the electronic device.

[0068] In some possible embodiments of this application, as shown in Figures 2, 3 and 4, the electronic device further includes a connector 4 and / or a circuit board 5. The connector 4 passes through the housing 1 and extends from inside the cavity to outside the cavity. The connector 4 is used for electrical connection with the controller 91 of the target device. The circuit board 5 is disposed inside the cavity. The second end of the conductive element 3 is electrically connected to the portion of the connector 4 located inside the cavity or the circuit board 5.

[0069] In this embodiment of the application, a connector 4 can be provided in the electronic device to electrically connect the piezoelectric component 2 to the controller 91 of the target device through the connector 4.

[0070] For example, as shown in Figure 2, the connector 4 can be a metal pin that passes through the wall of the carrier 12 or the wall of the cover 11, so that part of the metal pin is outside the receiving cavity and the other part is inside the receiving cavity. For example, both the carrier 12 and the cover 11 can be manufactured by injection molding. During the injection molding process, the metal pin can be placed in the mold to fix the metal pin in the carrier 12 and / or the cover 11.

[0071] In another example, the portion of the metal pin outside the receiving cavity can be configured to facilitate insertion, so that the metal pin can be inserted into a socket that is electrically connected to the controller 91 of the target device.

[0072] Another example, as shown in Figure 4, is that the portion of the metal pin located within the receiving cavity can be electrically connected to the piezoelectric component 2. For instance, the metal pin can be extended to a position close to the piezoelectric component 2, and the second end of the conductive element 3 can be electrically connected to the metal pin, such as by welding or bonding the second end of the conductive element 3 to the metal pin, so that the piezoelectric component 2 and the metal pin are electrically connected through the conductive element 3.

[0073] In this embodiment of the application, the circuit board 5 can be disposed in the electronic device. For example, the circuit board 5 can be disposed in a closed accommodating cavity.

[0074] For example, no other components may be placed on the circuit board 5; only pads and traces for electrical connection with the conductive element 3 may be provided on the circuit board 5. The second end of the conductive element 3 may be soldered to the pads on the circuit board 5 to electrically connect the conductive element 3 to the circuit board 5.

[0075] In another example, the controller 91 for controlling the piezoelectric component 2 and the signal processing circuit 93 for processing the first electrical signal generated by the piezoelectric component 2 can be located outside the housing 1. For example, the controller 91, the signal processing circuit 93, etc., can be located in the control system of the target device using the electronic device, or an independent control component can be set outside the housing 1, and the controller 91, the signal processing circuit 93, etc. can be located in the independent control component. Different control components with different functions can be set according to different application scenarios of the electronic device, and then the control component is electrically connected to the connector 4 of the electronic device.

[0076] In this embodiment, the connector 4 and the circuit board 5 can also be provided simultaneously in the electronic device, and the second end of the conductive element 3 is electrically connected to the part of the connector 4 located in the accommodating cavity or the circuit board 5.

[0077] In the above embodiments, since a connector 4 is provided on the outer casing 1, the second end of the conductive element 3 can be electrically connected to the portion of the connector 4 located within the accommodating cavity. After the electronic device is installed on the target device, it can be electrically connected to the controller 91 of the target device via the connector 4, facilitating the electrical connection between the piezoelectric component 2 and the controller 91. Furthermore, since a circuit board 5 is provided within the accommodating cavity, the second end of the conductive element 3 can also be electrically connected to the circuit board 5. By not providing other components on the circuit board 5, the controller 91 for controlling the piezoelectric component 2, the signal processing circuit 93 for processing the first electrical signal generated by the piezoelectric component 2, etc., can be located outside the outer casing 1. This facilitates the design and modification of the controller 91, signal processing circuit 93, etc., according to the application environment of the electronic device, thereby improving the flexibility of the electronic device application. Simultaneously, compared to placing the signal processing circuit 93, etc., outside the outer casing 1, not providing other components on the circuit board 5 avoids redundant protection circuits, thus saving costs.

[0078] In some possible embodiments of this application, as shown in Figures 2 and 3, the first end of the conductive element 3 abuts against the piezoelectric component 2, and the second end of the conductive element 3 is fixedly connected to the circuit board 5; or, the first end of the conductive element 3 is fixedly connected to the piezoelectric component 2, and the second end of the conductive element 3 abuts against the circuit board 5.

[0079] In this embodiment, the conductive element 3 can be electrically connected to the piezoelectric component 2 and the circuit board 5 in different ways. For example, the second end of the conductive element 3 can be fixedly connected to the circuit board 5 by welding, bonding with conductive adhesive, etc., so that the second end of the conductive element 3 is fixedly connected and electrically connected to the circuit board 5. By setting the length of the conductive element 3, after the circuit board 5 is installed in the accommodating cavity, the first end of the conductive element 3 abuts against the piezoelectric component 2. If the length of the conductive element 3 is greater than the distance between the circuit board 5 and the piezoelectric component 2, the circuit board 5 can press the conductive element 3 tightly against the piezoelectric component 2, so that the first end of the conductive element 3 is electrically connected to the piezoelectric component 2.

[0080] In some embodiments, the first end of the conductive element 3 can be fixedly connected to the piezoelectric component 2 by welding, bonding with conductive adhesive, or other methods, so that the conductive element 3 and the piezoelectric component 2 are fixedly connected and electrically connected. Furthermore, the length of the conductive element 3 can be greater than the distance between the circuit board 5 and the piezoelectric component 2. After both the piezoelectric component 2 and the circuit board 5 are installed in the accommodating cavity, the second end of the conductive element 3 can be pressed tightly against the circuit board 5, so that the second end of the conductive element 3 is electrically connected to the circuit board 5.

[0081] In the above embodiments, since one end of the conductive element 3 is fixedly connected to one of the piezoelectric component 2 and the circuit board 5, and the other end of the conductive element 3 is abutted against the other of the piezoelectric component 2 and the circuit board 5, during the assembly of electronic devices, it is only necessary to fix one end of the conductive element 3 to the piezoelectric component 2 or the circuit board 5, without the need to set a special connection process for the other end of the conductive element 3, which helps to simplify the assembly process of electronic devices.

[0082] In some possible embodiments of this application, as shown in FIG4, the first end of the conductive element 3 abuts against the piezoelectric component 2, and the second end of the conductive element 3 is connected to the portion of the connector 4 located in the accommodating cavity.

[0083] In this embodiment, the portion of connector 4 located within the accommodating cavity can be electrically connected to circuit board 5. Alternatively, the portion of connector 4 located within the accommodating cavity can be electrically connected to the second end of conductive element 3. For example, the second end of conductive element 3 and the portion of connector 4 located within the accommodating cavity can be fixedly connected by welding, bonding with conductive adhesive, or other methods. Alternatively, the second end of conductive element 3 can be fitted onto the end of connector 4 located within the accommodating cavity, i.e., by matching the inner and outer diameters, the second end of conductive element 3 and the end of connector 4 located within the accommodating cavity can be combined in a nested or sleeved manner. When the second end of conductive element 3 is fitted onto connector 4, the second end of conductive element 3 and connector 4 can be either an interference fit or a transition fit.

[0084] For example, the length of the conductive element 3 can be set such that the length of the portion of the conductive element 3 located between the connector 4 and the piezoelectric component 2 is greater than the distance between the connector 4 and the piezoelectric component 2. In this way, after the second end of the conductive element 3 is connected to the connector 4, the first end of the conductive element 3 can be pressed against the piezoelectric component 2, so that the piezoelectric component 2 and the connector 4 are electrically connected through the conductive element 3.

[0085] In the above embodiments, since the second end of the conductive element 3 is connected to the portion of the connector 4 located in the accommodating cavity, and the first end of the conductive element 3 is abutted against the piezoelectric component 2, during the assembly of electronic devices, it is only necessary to connect the conductive element 3 to the connector 4, without the need for a special connection process between the first end of the conductive element 3 and the piezoelectric component 2, which helps to simplify the assembly process of electronic devices.

[0086] In some possible embodiments of this application, connector 4 has a vent hole, one end of which extends into the receiving cavity and the other end extends out of the receiving cavity.

[0087] In this embodiment, a vent hole can be provided on the connector 4 to keep the air pressure inside the accommodating cavity and the air pressure outside the accommodating cavity balanced.

[0088] For example, connector 4 can be configured as a hollow tubular structure, that is, along the axis of connector 4, connector 4 has a through hole that penetrates connector 4, and the through hole in connector 4 can be used as a vent. Alternatively, the middle part of connector 4 can be configured as a hollow tubular structure with a cavity (the two ends of connector 4 are solid strips), and two through holes can be provided on connector 4 radially. Both through holes connect to the cavity in connector 4, and the two through holes are located at the two ends of the cavity, with one of the two through holes located inside the cavity and the other outside the cavity, thereby connecting the inside and outside of the cavity.

[0089] In the above embodiments, since a vent is provided on the connector 4, the accommodating cavity can be connected to the outside of the outer shell 1 through the vent. This allows the pressure inside the accommodating cavity to change with the air pressure at different ambient temperatures, which helps to maintain the air pressure balance inside and outside the accommodating cavity. Furthermore, by providing the vent on the connector 4, a vent is not required on the outer shell 1, simplifying the structure of the outer shell 1. Simultaneously, after the connector 4 is inserted into the socket of the target device, the connector 4 is covered by the socket. The socket can be provided with a flexible material matching the connector 4, such as rubber or silicone, with the rubber or silicone located within the socket's insertion hole. The connector 4 can be inserted into the rubber or silicone and extended to contact the pin inside the socket. This ensures that the part of the connector 4 outside the accommodating cavity remains in a sealed environment, thus maintaining the accommodating cavity in a sealed state. This achieves waterproofing and dustproofing of the part of the connector 4 outside the accommodating cavity, and the cooperation with the vent helps to balance the air pressure inside and outside the accommodating cavity.

[0090] In some possible embodiments of this application, as shown in Figures 3 and 4, the circuit board 5 is electrically connected to the portion of the connector 4 located within the accommodating cavity.

[0091] In this embodiment, the circuit board 5 and the portion of the connector 4 located within the accommodating cavity can be electrically connected. For example, the portion of the connector 4 located within the accommodating cavity can extend to the circuit board 5, and the connector 4 and the pads on the circuit board 5 can be electrically connected by soldering, bonding, or other methods. The second end of the conductive element 3 is electrically connected to the circuit board 5, thereby electrically connecting the piezoelectric component 2 to the circuit board 5 via the conductive element 3.

[0092] In the above embodiments, since connector 4 is electrically connected to circuit board 5, piezoelectric component 2 and circuit board 5 can be electrically connected via conductive element 3, thereby enabling piezoelectric component 2 and connector 4 to be electrically connected to circuit board 5 via conductive element 3. In this way, active and / or passive devices can be mounted on circuit board 5, and circuit board can be electrically connected to the controller or power supply circuit of the target device using the electronic device via connector 4.

[0093] In some possible embodiments of this application, as shown in Figures 2 and 4, the circuit board 5 has a connection through hole 51 that matches the connector 4. The edge of the connection through hole 51 has a pad. The connector 4 extends through the connection through hole 51 to connect with the second end of the conductive element 3, and the connector 4 is electrically connected to the pad.

[0094] In this embodiment, a connection through-hole 51 matching the portion of the connector 4 located within the accommodating cavity can be provided on the circuit board 5. A portion of the connector 4 can pass through the connection through-hole 51, allowing the connector 4 to extend into the area near the conductive element 3. Pads can also be provided on the circuit board 5, for example, pads can be provided around the edge of the connection through-hole 51 on the circuit board 5. The portion of the connector 4 passing through the connection through-hole 51 can be soldered to the pad, bonded with conductive adhesive, etc., to electrically connect the connector 4 to the pad.

[0095] For example, along the extension direction of the conductive element 3 (the covering direction Z as shown in FIG. 4), the connecting through hole 51 can be provided on the extension path of the conductive element 3, so that after the connector 4 is passed through the connecting through hole 51, the connector 4 can contact the second end of the guide. Alternatively, after the connector 4 is passed through the connecting through hole 51, depending on the position of the second end of the conductive element 3, the connector 4 can be bent or otherwise extended to contact the second end of the conductive element 3.

[0096] In another example, the second end of the conductive element 3 can be fitted onto the connector 4 to fix the second end of the conductive element 3 to the connector 4. Alternatively, the second end of the conductive element 3 can be fixedly connected to the connector 4 by welding, bonding, or other methods.

[0097] In this embodiment, after the connector 4 passes through the connecting through hole 51, the connector 4 can be soldered to the pads on the edge of the connecting through hole 51 to achieve electrical connection between the connector 4 and the circuit board 5. This also allows the second end of the conductive element 3 to be electrically connected to the circuit board 5. Thus, the piezoelectric component 2 can be electrically connected to the connector 4 via the conductive element 3, the circuit board 5, and so on.

[0098] For example, as shown in FIG5, a connection through-hole 51 can be provided on the circuit board 5 to partially match the connector 4 located within the receiving cavity 18. The circuit board 5 can be inserted into the connector 4 through the connection through-hole 51. A first pad can also be provided on the circuit board 5, and a second pad can be provided at the edge of the connection through-hole 51. The first pad and the second pad can be connected by a connection circuit 55, so that one end of the connection circuit 55 extends to the edge of the connection through-hole 51. The connector 4 can be soldered to the second pad to electrically connect the connection circuit 55 to the connector 4.

[0099] In another example, a flexible wire can be used as the conductive element 3. For instance, the piezoelectric element 22 in the piezoelectric assembly 2 can be electrically connected to the first pad via a flexible wire. One end of the wire is soldered to the piezoelectric element 22, and the other end is soldered to the first pad, thus electrically connecting the piezoelectric assembly 2 to the other end of the connecting circuit 55. Alternatively, the other end of the wire can be soldered to the other end of the connecting circuit. For example, a clearance notch can be provided at the edge of the circuit board 5, allowing the wire to extend from the piezoelectric element 22 through the clearance notch to the side of the circuit board 5 away from the piezoelectric element 22, before being soldered to the first pad. In this way, the soldering position of the wire to the first pad is on the surface of the circuit board 5. When soldering the wire and the first pad, the positions of the first pad and the wire can be easily determined using images captured by a camera, which helps improve the reliability of the soldering.

[0100] In the above embodiments, since the circuit board 5 is provided with a connection through hole 51 that matches the connector 4, the connector 4 can be directly extended through the connection through hole 51 to the position where it is connected to the second end of the conductive component 3. This helps to reduce the length that the connector 4 needs to extend around the circuit board 5, thereby reducing the weight of the connector 4 and contributing to the lightweighting of electronic devices.

[0101] In some possible embodiments of this application, referring to Figures 6 and 7, Figure 6 is a schematic diagram of the structure of a piezoelectric component in an electronic device provided in an embodiment of this application, and Figure 7 is a schematic diagram of the structure of a piezoelectric component in an electronic device provided in an embodiment of this application. The electronic device includes at least two conductive elements 3, and the piezoelectric component 2 includes a positive electrode region 23 and a negative electrode region 24. The first end of one conductive element 3 is connected to the positive electrode region 23, and the first end of the other conductive element 3 is connected to the negative electrode region 24.

[0102] In this embodiment, when the piezoelectric component 2 generates a first electrical signal in response to passive vibration, a portion of the piezoelectric component 2 will generate a positive charge, and another portion will generate a negative charge. The region on the piezoelectric component 2 that generates a positive charge can be designated as the positive electrode region 23, and the region on the piezoelectric component 2 that generates a negative charge can be designated as the negative electrode region 24. During the process of the piezoelectric component 2 generating the first electrical signal or applying a second electrical signal to the piezoelectric component 2, a conductive loop needs to be formed between the piezoelectric component 2 and the conductive element 3. Therefore, at least two conductive elements 3 can be provided in the electronic device, and two of the at least two conductive elements 3 can be used as part of the conductive loop forming the transmission of the first and second electrical signals.

[0103] For example, the first end of one conductive element 3 can be electrically connected to the positive electrode region 23 of the piezoelectric component 2, while the first end of the other conductive element 3 can be electrically connected to the negative electrode region 24 of the piezoelectric component 2. For instance, the first ends of the two conductive elements 3 can be welded and fixed to the positive electrode region 23 and the negative electrode region 24 of the piezoelectric component 2, respectively, or the first ends of the two conductive elements 3 can be made to abut against the positive electrode region 23 and the negative electrode region 24 of the piezoelectric component 2, respectively.

[0104] In the above embodiments, since at least two conductive elements 3 are provided in the electronic device, two of the conductive elements 3 can be connected to the positive electrode region 23 and the negative electrode region 24 of the piezoelectric component 2 respectively, thereby facilitating the transmission of the first electrical signal generated by the piezoelectric component 2 through the conductive elements 3, or the application of the second electrical signal to the piezoelectric component 2 through the conductive elements 3.

[0105] In some possible embodiments of this application, as shown in FIG6, the piezoelectric component 2 includes a substrate 21 and a piezoelectric element 22, the piezoelectric element 22 being attached to the substrate 21; the positive electrode region 23 and the negative electrode region 24 are both located on the piezoelectric element 22; or, the positive electrode region 23 is located on one of the piezoelectric element 22 and the substrate 21, and the negative electrode region 24 is located on the other of the piezoelectric element 22 and the substrate 21.

[0106] In this embodiment, a substrate 21 and a piezoelectric element 22 can be provided in the piezoelectric assembly 2. The piezoelectric element 22 is provided on the substrate 21, and the shape of the substrate 21 can be set according to the shape of the piezoelectric element 22. The substrate 21 can be made of metal materials such as stainless steel and aluminum, or it can be made of rigid plastics such as polycarbonate (PC), polystyrene (PS), and polyformaldehyde (POM). The substrate 21 can also be made of PCB board or flexible circuit board 5, etc. This embodiment does not limit the specific material of the substrate 21. The substrate 21 can be set as a sheet structure. The piezoelectric element 22 can be made of lead zirconate titanate (PZT) piezoelectric ceramic sheet. The piezoelectric element 22 can be attached to the substrate 21. For example, the piezoelectric element 22 can be provided on one side surface of the substrate 21, or it can be provided on both opposite sides of the substrate 21.

[0107] For example, the substrate 21 can be bonded to the wall of the carrier 12. For instance, the area on the substrate 21 where the piezoelectric element 22 is not provided can be bonded to the wall of the carrier 12 to fix the substrate 21 to the wall, thereby fixing the piezoelectric assembly 2 to the shell wall of the housing 1.

[0108] In another example, the piezoelectric component 2 can be used as a driving device. That is, when a voltage is applied to the piezoelectric component 2, it can deform to drive the movement of other devices. Specifically, under the action of an applied electric field with the same or opposite polarization direction, the piezoelectric component 22 undergoes expansion and contraction deformation in the horizontal plane where the substrate 21 is located. At the same time, the substrate 21 is bonded to the wall of the support member 12, so that the two ends of the substrate 21 are fixed to the support member 12. This causes the substrate 21 to vibrate perpendicular to the horizontal plane, and then transmits the vibration to the support member 12 through the substrate 21, thereby causing the target device using the electronic device to vibrate and produce sound, etc.

[0109] As another example, as shown in Figure 6, the positive electrode region 23 and the negative electrode region 24 of the piezoelectric component 2 can both be set on the piezoelectric element 22. That is, the first end of one conductive element 3 is connected to the positive electrode region 23 of the piezoelectric element 22, and the first end of another conductive element 3 is connected to the negative electrode region 24 of the piezoelectric element 22, so as to realize the electrical connection between the two conductive elements 3 and the piezoelectric component 2.

[0110] In another example, as shown in Figure 7, the positive electrode region 23 and the negative electrode region 24 of the piezoelectric component 2 can be respectively disposed on the piezoelectric element 22 and the substrate 21. In this case, the substrate 21 can be made of a conductive metal material or plastic material, etc. For example, the positive electrode region 23 can be disposed on the piezoelectric ceramic sheet, while the negative electrode region 24 can be disposed on the substrate 21. Alternatively, the positive electrode region 23 can be disposed on the substrate 21, while the negative electrode region 24 can be disposed on the piezoelectric ceramic sheet. Then, the first end of one conductive element 3 can be connected to the positive electrode region 23 or the negative electrode region 24 on the piezoelectric ceramic sheet, and the first end of another conductive element 3 can be connected to the positive electrode region 23 or the negative electrode region 24 on the substrate 21 to achieve electrical connection between the two conductive elements 3 and the piezoelectric component 2.

[0111] In another example, as shown in Figure 7, the substrate 21 can be configured as a plate-like structure with convex edges. That is, the first portion of the substrate 21 matches the shape (e.g., rectangular) and size (e.g., slightly larger than the piezoelectric element) of the piezoelectric element 22. The piezoelectric element 22 can be bonded to the first portion of the substrate 21, and the surface of the piezoelectric element 22 away from the substrate 21 can serve as an electrode region (e.g., positive electrode region 23). The second portion of the substrate 21 extends from the edge of the first portion, and the first and second portions of the substrate 21 can be an integral structure. The area of ​​the second portion of the substrate 21 is smaller than the area of ​​the first portion, and the second portion of the substrate 21 can serve as another electrode region with opposite polarity (e.g., negative electrode region 24).

[0112] In the above embodiments, since a base 21 is provided for the piezoelectric element 22, the piezoelectric assembly 2 can be fixed to the wall of the support member 12 through the base 21, and the deformation from the piezoelectric element 22 is borne by the base 21 to generate vibration, thereby transmitting the vibration to the support member 12, so that the target device has acoustic performance. Furthermore, by providing both the positive electrode region 23 and the negative electrode region 24 on the piezoelectric element 22, or by providing the positive electrode region 23 and the negative electrode region 24 on the piezoelectric assembly 2 respectively, the arrangement of the positive electrode region 23 and the negative electrode region 24 on the piezoelectric assembly 2 can have high flexibility. That is, the arrangement of the connection area of ​​the conductive element 3 on the piezoelectric assembly 2 is more flexible, making it easier to set the position of the conductive element 3 in the accommodating cavity according to the space within the accommodating cavity. In some possible embodiments of this application, as shown in Figures 3 and 4, the piezoelectric assembly 2 and the outer shell 1 are an integral structure.

[0113] In this embodiment, the piezoelectric component 2 and the outer shell 1 can be integrally molded, meaning that at least the base 21 of the piezoelectric component 2 and the outer shell 1 are connected as a single unit. For example, both the carrier 12 and the cover 11 can be manufactured by injection molding. During the injection molding process, the piezoelectric component 2 can be placed in the mold. After the carrier 12 cools and solidifies, the base 21 of the piezoelectric component 2 can be fixed in the carrier 12, making the piezoelectric component 2 and the carrier 12 an integral structure.

[0114] In the above embodiments, since the piezoelectric component 2 and the housing 1 are an integral structure, that is, the piezoelectric component 2 is injection molded into the housing 1 by insert molding, it is beneficial to reduce the process of fixing the piezoelectric component 2 to the housing 1, thereby improving the assembly efficiency of electronic devices.

[0115] In some possible embodiments of this application, as shown in Figures 3 and 4, the outer casing 1 includes a carrier 12 and a cover 11. The cover 11 covers the carrier 12 and forms an accommodating cavity with the carrier 12. At least one of the cover 11 and the carrier 12 is provided with an abutment portion 14. Along the covering direction Z of the cover 11 and the carrier 12, the abutment portion 14 extends to a position corresponding to the circuit board 5 and abuts against the circuit board 5 to restrict the movement of the circuit board 5 relative to the carrier 12.

[0116] In this embodiment of the application, when the outer shell 1 is configured to include a support member 12 and a cover 11, an abutment portion 14 may be provided on one of the cover 11 and the support member 12, or an abutment portion 14 may be provided on both the cover 11 and the support member 12, so that the circuit board 5 is fixed in the accommodating cavity by applying force to the circuit board 5 through the abutment portion 14.

[0117] For example, along the closing direction Z of the cover 11 and the support member 12, a post serving as an abutment portion 14 can be provided inside the side wall of the cover 11, or a post serving as an abutment portion 14 can be provided inside the side wall of the support member 12. This allows the posts in the cover 11 and the support member 12 to correspond, and the gap between the corresponding posts on the cover 11 and the support member 12 is consistent with the thickness of the circuit board 5. Alternatively, along the closing direction Z of the cover 11 and the support member 12, if one side of the circuit board 5 abuts against the top of the cover 11 or the inner wall of the support member 12, an abutment portion 14 can be provided only on one of the cover 11 or the support member 12 that does not abut against the other side of the circuit board 5. Alternatively, the side of the circuit board 5 closest to the cover 11 can abut against a protrusion forming a groove on the cover 11, while an abutment portion 14 is provided on the support member 12. The circuit board 5 is fixed by the abutment portion 14 on the support member 12 and the protrusion forming a groove on the cover 11. In this way, after the cover 11 is placed over the opening of the support member 12, the abutment portion 14 can be pressed against the circuit board 5 to press and fix the circuit board 5 in the accommodating cavity.

[0118] In another example, a fixing post 121 can be provided in the accommodating cavity of the carrier 12. Correspondingly, a through hole matching the fixing post 121 can be provided on the circuit board 5. The circuit board 5 can be inserted through the through hole onto the fixing post 121 so as to restrict the movement of the circuit board 5 in a direction perpendicular to the closing direction Z by the fixing post 121.

[0119] In the above embodiments, since the outer shell 1 is configured to include a support member 12 and a cover 11, it is convenient to process the two parts of the outer shell 1 independently. Furthermore, at least one of the cover 11 and the support member 12 is provided with an abutment portion 14 corresponding to the circuit board 5. The circuit board 5 can be pressed and fixed in the accommodating cavity through the abutment portion 14. It can also transmit the external force received by one of the cover 11 and the support member 12 to the other through the abutment portion 14 and the circuit board 5, thereby enabling the cover 11 and the support member 12 to better resist deformation and breakage when subjected to external impact.

[0120] In some possible embodiments of this application, referring to FIG8, FIG8 is a schematic diagram of the circuit in the electronic device provided in the embodiment of this application. The electronic device also includes a controller 91, which is disposed on the circuit board 5. The piezoelectric component 2 and the connector 4 are electrically connected through the controller 91. The controller 91 is used to control the piezoelectric component 2 to generate vibration and / or process the first electrical signal generated by the piezoelectric component 2.

[0121] In this embodiment, a controller 91 can be installed in the electronic device to control the operation of devices such as the piezoelectric component 2. The controller 91 can be a unit with computing functions, capable of interpreting computer instructions and processing data in computer software. For example, the controller 91 may include a microcontroller unit (MCU), which can be fixed on the circuit board 5.

[0122] For example, the controller 91 can be electrically connected to the second end of the conductive element 3. In this way, a voltage signal, serving as a second electrical signal, can be applied to the piezoelectric element 22 via the controller 91, causing the piezoelectric assembly 2 to generate vibrations matching the voltage signal. Alternatively, if the piezoelectric assembly 2 deforms to generate a first electrical signal, the controller 91 can generate a control command based on the first electrical signal and send the control command to other devices in the electronic device, or upload the control command to a target device employing the electronic device, etc.

[0123] In another example, the signal processing circuit 93 can be placed between the piezoelectric component 2 and the controller 91, so that the controller 91 and the piezoelectric component 2 are electrically connected through the signal processing circuit 93, so that the first electrical signal generated by the piezoelectric component 2 is processed by the signal processing circuit 93 and then transmitted to the controller 91.

[0124] In the above embodiments, since a controller 91 is provided on the circuit board 5 of the electronic device, the piezoelectric component 2 can be controlled to vibrate, and / or the first electrical signal generated by the piezoelectric component 2 can be processed by the controller 91. Furthermore, the controller 91 is also located within the enclosed cavity of the housing 1, and the housing 1 can also provide protection for the controller 91, thereby saving the need for a protective shell or similar fixture for the controller 91.

[0125] In some possible embodiments of this application, as shown in FIG8, the electronic device further includes a transmission circuit 92, which is disposed on the circuit board 5. The controller 91 and the connector 4 are electrically connected through the transmission circuit 92. The transmission circuit 92 is used to control the transmission of control signals from the connector 4 to the controller 91.

[0126] In this embodiment, a transmission circuit 92 can be provided in the electronic device to control the control signals transmitted to the controller 91. For example, the transmission circuit 92 can be a Controller Area Network (CAN) bus. The transmission circuit 92 can be mounted on the circuit board 5, with one part of the transmission circuit 92 electrically connected to the connector 4 and the other part electrically connected to the controller 91. Thus, after the electronic device and the controller 91 of the target device are electrically connected via the connector 4, data transmission between the controller of the target device and the controller 91 of the electronic device can be controlled via the transmission circuit 92.

[0127] For example, a signal processing circuit 93, a voltage regulator output circuit 94, a controller 91, and a transmission circuit 92 can be simultaneously provided in an electronic device. The signal processing circuit 93 can be electrically connected to the piezoelectric component 2, the controller 91 can be electrically connected to the signal processing circuit 93, the controller 91 and the connector 4 can be electrically connected through the transmission circuit 92, and the voltage regulator output circuit 94 can be electrically connected to the signal processing circuit 93.

[0128] In the above embodiments, since a transmission circuit 92 is provided between the controller 91 of the electronic device and the connector 4, the transmission circuit 92 can control the data transmission between the electronic device and the target device, which is beneficial to improve the data transmission rate between the electronic device and the target device and can reduce the error rate in the data transmission process.

[0129] In some possible embodiments of this application, as shown in FIG8, the electronic device further includes a signal processing circuit 93, which is disposed on the circuit board 5. The piezoelectric component 2 and the connector 4 are electrically connected through the signal processing circuit 93. The signal processing circuit 93 is used to process the first electrical signal generated by the piezoelectric component 2.

[0130] In this embodiment, a signal processing circuit 93 can be provided on the piezoelectric component 2 to process the first electrical signal generated when the piezoelectric component 2 undergoes deformation. For example, the signal processing circuit 93 can be mounted on the circuit board 5 and electrically connected to the connector 4.

[0131] In this embodiment, the signal processing circuit 93 can be configured as a circuit with functions such as voltage division, voltage amplification and switching, so as to process the first electrical signal generated by the piezoelectric component 2 through the signal processing circuit 93, so as to convert the first electrical signal generated by the piezoelectric component 2 into an electrical signal that can be recognized and received by other devices.

[0132] For example, a voltage divider circuit can be incorporated into the signal processing circuit 93. This could involve using a resistor divider to reduce or distribute the voltage generated by the piezoelectric component 2, thereby distributing different voltage levels generated by the piezoelectric component 2 to different circuits or devices. For instance, the voltage divider circuit can be configured based on the sensitivity of the electronic device to vibration. The voltage divider circuit can control the magnitude of the voltage input from the piezoelectric component 2 to the signal processing circuit 93, reducing the risk of overload damage to the circuit due to excessive voltage generated by the piezoelectric component 2.

[0133] In another example, an amplifier circuit can be provided in the signal processing circuit 93 to amplify the voltage signal generated by the piezoelectric component 2 to the required amplitude, so as to facilitate the processing and utilization of the voltage signal generated by the piezoelectric component 2.

[0134] In another example, a switching circuit can be provided in the signal processing circuit 93 to modulate the analog signal generated by the piezoelectric component 2 into a digital pulse signal by means of the switching circuit's ability to conduct or cut off.

[0135] In the above embodiment, since a signal processing circuit 93 electrically connected to the piezoelectric component 2 is provided on the circuit board 5, the first electrical signal generated by the piezoelectric component 2 can be processed by the signal processing circuit 93, thereby converting the first electrical signal generated by the piezoelectric component 2 into a signal that can be received and recognized by other devices or circuits. At the same time, by placing the piezoelectric component 2 and the signal processing circuit 93 inside the housing 1, electromagnetic shielding protection for the circuits outside the housing 1 can be omitted, which is beneficial to improving anti-interference capability.

[0136] In some possible embodiments of this application, as shown in FIG8, the electronic device further includes a voltage regulator output circuit, which is disposed on a circuit board and electrically connected to the signal processing circuit for supplying power to the signal processing circuit.

[0137] In this embodiment, a voltage regulator output circuit can be provided for the signal processing circuit to supply power to the signal processing circuit. For example, the voltage regulator output circuit can be a low drop-out regulator (LDO), which can supply power to the components in the signal processing circuit. For instance, the LDO circuit can convert 12V to 3.3V or 5V and then apply it to components such as switching transistors in the signal processing circuit.

[0138] In the above embodiments, since a voltage regulator output circuit is provided for the signal processing circuit, the components in the signal processing circuit can be powered through the voltage regulator output circuit. Furthermore, the voltage applied to the signal processing circuit can be precisely controlled using the voltage regulator output circuit, which helps improve the accuracy of the voltage applied to the signal processing circuit, thereby improving the stability and reliability of the signal processing circuit's operation.

[0139] In some possible embodiments of this application, referring to FIG9, FIG9 is a cross-sectional structural schematic diagram of an electronic device provided in an embodiment of this application. The circuit board 5 includes at least two spaced-apart sub-circuit boards 5, and two adjacent sub-circuit boards 5 are fixedly connected by a connecting component 54; at least two sub-circuit boards are provided with a controller 91, a transmission circuit 92, a signal processing circuit 93, and a voltage regulated output circuit 94; the piezoelectric component 2 is electrically connected to at least one of the sub-circuit boards.

[0140] In this embodiment, the structural shape and number of circuit boards 5 can be set according to the space of the cavity inside the outer shell 1. For example, along the closing direction Z of the cover 11 and the support member 12, when the cavity is deep, the circuit board 5 can be set as a structure of multiple small sub-circuit boards, and the multiple sub-circuit boards can be arranged in the cavity along the closing direction Z.

[0141] For example, multiple sub-circuit boards can be stacked at intervals along the Z-direction of the cover in the receiving cavity. Connecting components 54 can be provided for the multiple sub-circuit boards to fix them together. For example, the connecting components 54 can be matching studs and nuts, which can be made of non-conductive plastic. The studs can be passed sequentially through the multiple sub-circuit boards, with nuts on the studs. Each circuit board 5 has nuts on both opposite sides, thus securing the circuit board 5 to the studs with the two nuts, thereby fixing the multiple sub-circuit boards together. Along the stacking direction of the multiple sub-circuit boards, the abutment portions 14 on the cover 11 and the carrier 12 can be configured to match the thickness between the two outermost sub-circuit boards, clamping and fixing the two outermost sub-circuit boards through the abutment portions 14, thereby fixing the multiple sub-circuit boards within the receiving cavity.

[0142] In another example, the controller 91, transmission circuit 92, signal processing circuit 93, and voltage regulator output circuit 94 in the electronic device can be respectively disposed on at least two sub-circuit boards, that is, at least one of the controller 91, transmission circuit 92, signal processing circuit 93, and voltage regulator output circuit 94 can be disposed on each sub-circuit board. For example, the signal processing circuit 93 and voltage regulator output circuit 94 can be disposed on one sub-circuit board, and the controller 91 and transmission circuit 92 can be disposed on another sub-circuit board. Two or three of the controller 91, transmission circuit 92, signal processing circuit 93, and voltage regulator output circuit 94 disposed on multiple sub-circuit boards can be electrically connected by wires. And the piezoelectric component 2 can be electrically connected to the controller 91 and / or the signal processing circuit 93.

[0143] In the above embodiments, by configuring the circuit board 5 as having at least two sub-circuit boards, the area of ​​the circuit board 5 can be increased by having at least two sub-circuit boards, thereby allowing multiple circuits in the electronic device to be respectively placed on different sub-circuit boards. Furthermore, by stacking multiple sub-circuit boards at intervals within the accommodating cavity, compared to configuring multiple sub-circuit boards as a single circuit board 5, the size of the electronic device in the Z-direction perpendicular to the cover 11 and the support member 12 can be reduced. Moreover, the spacing between adjacent sub-circuit boards facilitates heat dissipation for the devices on the sub-circuit boards.

[0144] In some possible embodiments of this application, the sub-circuit board includes a first sub-circuit board 52 and a second sub-circuit board 53; the connecting component 54 includes a connector and a support member, the first sub-circuit board 52 and the second sub-circuit board 53 are respectively provided with pads that match the connector, the connector is electrically connected to the corresponding pads on the first sub-circuit board 52 and the second sub-circuit board 53 to electrically connect the first sub-circuit board 52 and the second sub-circuit board 53; the support member is sleeved on the connector and is located between the first sub-circuit board 52 and the second sub-circuit board 53.

[0145] In this embodiment of the application, a first sub-circuit board 52 and a second sub-circuit board 53 can be provided in the electronic device. For example, the second sub-circuit board 53 can be provided close to the piezoelectric component 2, and the first sub-circuit board 52 can be provided on the side of the second sub-circuit board 53 away from the piezoelectric component 2.

[0146] For example, the signal processing circuit 93 can be disposed on the surface of the second sub-circuit board 53 away from the piezoelectric component 2. The regulated output circuit 94 can be disposed on the surface of the second sub-circuit board 53 close to the piezoelectric component 2. The transmission circuit 92 can be disposed on the surface of the first sub-circuit board 52 close to the second sub-circuit board 53, and the controller 91 can be disposed on the surface of the first sub-circuit board 52 away from the second sub-circuit board 53.

[0147] Alternatively, both the controller 91 and the signal processing circuit 93 can be disposed on the surface of the first sub-circuit board 52 away from the second sub-circuit board 53. Alternatively, the controller 91 and the signal processing circuit 93 can be disposed on the surfaces of the first sub-circuit board 52 and the second sub-circuit board 53 away from the piezoelectric component 2, respectively. This facilitates electrical connection between the piezoelectric component 2 and the signal processing circuit 93 via wires, or between the piezoelectric component 2 and the controller 91 via wires. Furthermore, it allows for the acquisition of images of the surfaces of the first sub-circuit board 52 and the second sub-circuit board 53 away from the piezoelectric component 2 using a camera or similar means. By recognizing these images, it is possible to detect whether the electrical connections between the wires and the signal processing circuit 93, the wires and the controller 91, and the signal processing circuit 93 and the controller 91, etc., meet the requirements.

[0148] Alternatively, the signal processing circuit 93, the voltage stabilizing output circuit 94, the transmission circuit 92, and the controller 91 can be distributed on the two surfaces of the first sub-circuit board 52 and the two surfaces of the second sub-circuit board 53 in other ways. This application embodiment does not limit this.

[0149] In another example, as shown in Figure 8, when the conductor 95 extends from the piezoelectric component 2 to the surface of either the first sub-circuit board 52 or the second sub-circuit board 53 away from the piezoelectric component 2, clearance notches can be provided at the edges of the first and second sub-circuit boards 52 and 53. This allows the conductor 95 to extend from the piezoelectric component 22 through these clearance notches to the side of the first or second sub-circuit board 52 or 53 away from the piezoelectric component 22. The conductor 95 is then soldered to the pads on the first or second sub-circuit board 52 or 53. In this way, the soldering position of the conductor 95 to the pads is located on the upper surface of the first or second sub-circuit board 52 or 53. After soldering the conductor 95 to the pads, the positions of the pads and conductor 95 can be easily determined using images captured by a camera, facilitating the assessment of whether the soldering of the conductor 95 to the pads meets the requirements and improving the reliability of the soldering.

[0150] In another example, the connecting component 54 can be configured as a structure of matching connectors and supports to electrically connect and fix the first sub-circuit board 52 and the second sub-circuit board 53 via the connectors and supports. For example, the connector can be made of a conductive metal and can be configured as a column, while the support can be made of insulating materials such as plastic and can be configured as a cylindrical structure that can be fitted onto the connector. Correspondingly, pads matching the connectors can be provided on the first sub-circuit board 52 and the second sub-circuit board 53, respectively. These pads can be in the form of through holes, through which the connectors can pass and be soldered, thereby electrically connecting the first sub-circuit board 52 and the second sub-circuit board 53 via the connectors. Alternatively, through-hole pads can be provided on the first sub-circuit board 52. One end of the connector passes through the pad on the first sub-circuit board 52 and is soldered to it. Components are placed on the second sub-circuit board 53 using surface mount technology (SMT), and the other end of the connector is fixedly connected to the component on the second sub-circuit board 53, thereby electrically connecting and fixing the connector to the second sub-circuit board 53. For example, two circuits (such as controller 91, signal processing circuit 93, transmission circuit 92, and two voltage regulation output circuits 94) on opposite surfaces of the sub-circuit boards can be correspondingly set with the same through-hole pad. After the connector passes through the pad, it can be soldered to the corresponding two circuits to electrically connect two circuits located on opposite surfaces of the same sub-circuit board. Alternatively, two circuits on two sub-circuit boards can also be electrically connected using the connector. Before welding the connector to the two sub-circuit boards, a cylindrical support can be fitted onto the connector to fix the support onto the connector and position the connector between the first sub-circuit board 52 and the second sub-circuit board 53, so that the first sub-circuit board 52 and the second sub-circuit board 53 are supported by the connecting assembly 54 and a gap is provided between the first sub-circuit board 52 and the second sub-circuit board 53.

[0151] In another example, the connecting assembly 54 can be configured to include a matching plug and socket. For example, the plug can be a cylindrical structure, and the socket has a mating hole that matches the cylindrical plug. Both the plug and socket can be made of a conductive material. The plug can be soldered to the first sub-circuit board 52, and the socket can be soldered to the second sub-circuit board 53 at the corresponding position of the plug. Alternatively, the plug can be soldered to the second sub-circuit board 53, and the socket can be soldered to the first sub-circuit board 52 at the corresponding position of the plug. In this way, the corresponding plug and socket can be plugged in to electrically connect the plug and socket, thereby fixing and electrically connecting the first sub-circuit board 52 and the second sub-circuit board 53. Furthermore, the plug can be located on the same surface of one sub-circuit board (the plug does not penetrate the sub-circuit board), and the socket can be located on the same surface of another sub-circuit board (the socket does not penetrate the sub-circuit board), thereby reducing the surface area occupied by the plug and socket on the sub-circuit board, thus allowing more area on the sub-circuit board for circuit arrangement.

[0152] As another example, as shown in Figure 8, connection through holes 51 matching the connector 4 can be provided on both the first sub-circuit board 52 and the second sub-circuit board 53. Both the first sub-circuit board 52 and the second sub-circuit board 53 can be passed through the connection through holes 51 onto the connector 4. For example, both the first sub-circuit board 52 and the second sub-circuit board 53 can be soldered to the connector 4, or one of the first sub-circuit board 52 and the second sub-circuit board 53 can be soldered to the connector 4 to electrically connect the first sub-circuit board 52 and / or the second sub-circuit board 53 to the connector 4.

[0153] In the above embodiments, since the connecting component 54 is configured to be conductive, while the first sub-circuit board 52 and the second sub-circuit board 53 are fixedly connected by the connecting component 54, the first sub-circuit board 52 and the second sub-circuit board 53 can also be electrically connected, which is beneficial to saving the wires 95 and other wires that are used to electrically connect the first sub-circuit board 52 and the second sub-circuit board 53.

[0154] In some possible embodiments of this application, the electronic device includes one or more piezoelectric components 2; and / or, the shape of the piezoelectric component 2 includes at least one of the following: circular, rectangular, elliptical, irregular polygonal; and / or, the same piezoelectric component 2 includes at least two piezoelectric elements 22, and the at least two piezoelectric elements 22 are different in any of the following aspects: structure, properties, and connection method with the housing 1.

[0155] In this embodiment, a piezoelectric component 2 for generating vibration can be provided in the electronic device, which can then drive the components in the target device to vibrate and produce sound. Alternatively, a piezoelectric component 2 for detecting vibration can be provided in the electronic device, which can then detect the vibration generated by the components in the target device. Or, at least two piezoelectric components 2 for generating vibration or detecting vibration can be provided in the electronic device, or both piezoelectric components 2 for generating vibration and piezoelectric components 2 for detecting vibration can be provided simultaneously in the electronic device.

[0156] In this embodiment, the piezoelectric component 2 can be configured with different shapes. For example, both the piezoelectric sheet and the substrate 21 in the piezoelectric component 2 can be configured as circles, rectangles, squares, ellipses, and irregular polygons. The piezoelectric element 22 can be configured as an irregular hexagonal polygon, that is, one polarity of the piezoelectric element 22 is set as a rectangle with a larger area, and the other polarity of the piezoelectric element 22 is set as a rectangle with a smaller area, such that the smaller rectangle is adjacent to a corner of the larger rectangle. This embodiment does not limit the specific shape of the piezoelectric component 2.

[0157] In this embodiment of the application, at least two piezoelectric elements 22 can be provided in the same piezoelectric component 2, and the performance of the at least two piezoelectric elements 22 can be different.

[0158] For example, the structures of the multiple piezoelectric elements 22 can be different. For instance, the number of stacked piezoelectric ceramic sheets in each piezoelectric element 22 can be different, or the area of ​​the orthographic projection of each piezoelectric element 22 onto the substrate 21 can be different.

[0159] In another example, multiple piezoelectric elements 22 can have different properties. The properties of the piezoelectric element 22 include capacitance and dielectric constant. That is, multiple piezoelectric elements 22 can each be made of piezoelectric materials with different capacitance values, or they can each be made of piezoelectric materials with different dielectric constants.

[0160] In another example, multiple piezoelectric elements 22 can be connected to the connecting wall 17 of the housing 1 in different ways. For instance, if the piezoelectric element 22 is provided on the side of the base 21 facing the connecting wall 17, the area of ​​the base 21 that does not have the piezoelectric element 22 can be fixedly connected to the connecting wall 17, with a gap between the piezoelectric element 22 and the connecting wall 17. This gap can be greater than the amplitude of the piezoelectric assembly 2 along its thickness direction. If the piezoelectric element 22 is provided on the side of the base 21 facing the connecting wall 17, the surface of the piezoelectric element 22 away from the base 21 can also be fixedly connected to the connecting wall 17, such as by adhesive bonding, or by insert molding, etc.

[0161] In this embodiment of the application, a second adhesive member 62 may be provided in the electronic device to adhesively install the electronic device onto the target device.

[0162] For example, one wall of the housing can be used as the connecting wall 17, such as the wall of the box-shaped carrier 12 away from the opening of the receiving cavity. The piezoelectric assembly 2 can be fixed to the surface of the connecting wall 17 located inside the receiving cavity. The second adhesive 62 can be bonded to the surface of the connecting wall 17 located outside the receiving cavity, that is, the second adhesive 62 is located outside the carrier 12. For example, the second adhesive 62 can be double-sided adhesive.

[0163] In the above embodiments, since different numbers of piezoelectric components 2 are provided in the electronic device, the electronic device can be used as a driving component capable of generating vibration or as a sensor capable of detecting vibration. Furthermore, by setting the piezoelectric components 2 to different shapes, a matching piezoelectric component 2 can be selected according to the shape or structure of the target device. Simultaneously, by making the structure, properties, and connection method with the housing 1 different of at least two piezoelectric elements 22 in the same piezoelectric component 2, the piezoelectric component 2 can generate vibrations of different frequencies and / or amplitudes, thereby driving the components of the target device to generate vibrations of different frequencies and / or amplitudes, and thus enabling the components of the target device to emit sounds of different tones.

[0164] In some possible embodiments of this application, at least one of the cover 11 and the carrier 12 is provided with an abutment portion 14, which extends along the covering direction Z of the cover 11 and the carrier 12. After the cover 11 is covered on the carrier 12, the wall of the cover 11 or the wall of the carrier 12 abuts against the abutment portion 14, or two corresponding abutment portions 14 abut against each other.

[0165] In this embodiment, the piezoelectric component 2 and the portion of the connector 4 located within the accommodating cavity can be directly electrically connected via a conductive element 3. For example, an approximately U-shaped bending structure can be provided at one end of the connector 4 located within the accommodating cavity, and the second end of the conductive element 3 can be clamped and fixed within this U-shaped bending structure to electrically connect the second end of the conductive element 3 to the connector 4. This eliminates the need for a separate circuit board 5 in the electronic device.

[0166] For example, along the closing direction Z of the cover 11 and the support member 12, a post serving as an abutment portion 14 can be provided inside the side wall of the cover 11, or a post serving as an abutment portion 14 can be provided inside the side wall of the support member 12, with the posts in the cover 11 and the support member 12 corresponding to each other. Alternatively, an abutment portion 14 can be provided inside the side wall of the support member 12, extending out of the receiving groove 13 along the closing direction Z, so that the abutment portion 14 on the support member 12 corresponds to a protrusion forming a groove on the cover 11. Or, an abutment portion 14 can be provided on the side wall of the cover 11, extending into the receiving groove 13. In this way, after the cover 11 is placed over the opening of the support member 12, the corresponding abutting parts 14 can abut against each other, or the abutting part 14 on the cover 11 abuts against the bottom wall of the support member 12, or the abutting part 14 on the support member 12 abuts against the top of the cover 11, or abuts against the protrusion that forms a groove on the cover 11.

[0167] In the above embodiments, since at least one of the cover 11 and the support member 12 is provided with an abutment portion 14 corresponding to the circuit board 5, after the cover 11 is closed over the opening of the support member 12, the interiors of the cover 11 and the support member 12 can abut against each other through the abutment portion 14. This allows the external force on one of the cover 11 and the support member 12 to be transmitted to the other through the abutment portion 14 and the circuit board 5, thereby improving the ability of the cover 11 and the support member 12 to resist deformation and breakage when subjected to external impact.

[0168] In some possible embodiments of this application, the housing 1 has a protective member 7 that surrounds the portion of the connector 4 located outside the receiving cavity along the circumference of the portion outside the receiving cavity.

[0169] In this embodiment of the application, a protective element 7 may be provided on the carrier 12 and / or the cover 11 to shield and protect the connector 4.

[0170] For example, the protective member 7 can be configured as an annular structure, surrounding the portion of the connector 4 located outside the receiving cavity. For instance, if the connector 4 is mounted on the support member 12, the annular protective member 7 can extend from the support member 12. Alternatively, if the connector 4 is mounted on the cover 11, the annular protective member 7 can extend from the cover 11. Or, a portion of the annular protective member 7 can extend from the cover 11, and another portion can extend from the support member 12. Along the axial direction of the portion of the connector 4 located outside the receiving cavity, the length of the protective member 7 can be greater than the length of that portion.

[0171] In another example, the protective component 7 and the carrier component 12, as well as the protective component 7 and the cover 11, can be integrally injection molded, or they can be processed separately and then the protective component 7 is sealed and fixedly connected to the carrier component 12 and / or the cover 11. A snap-fit ​​structure can also be provided on the protective component 7, allowing it to snap into the socket in the target device during the electrical connection of the connector 4 to the controller 91 of the target device.

[0172] In the above embodiments, since a protective member 7 is provided on the outer shell 1 to surround the connector 4, during the process of electrically connecting the connector 4 to the controller 91 of the target device, the protective member 7 can also be connected to a part in the target device that matches the protective member 7 to block the opening of the protective member 7. Thus, the connector 4 can be shielded and sealed by the protective member 7, thereby achieving the functions of waterproofing and dustproofing of the connector 4.

[0173] In some possible embodiments of this application, referring to Figures 10 and 11, Figure 10 is a structural schematic diagram of the carrier in the electronic device provided in the embodiment of this application, and Figure 11 is a cross-sectional structural schematic diagram of the electronic device provided in the embodiment of this application. The electronic device also includes a first adhesive member 61, which is disposed between the piezoelectric assembly 2 and the housing 1, and the piezoelectric assembly 2 is bonded to the wall of the housing 1 through the first adhesive member 61.

[0174] In this embodiment, a third adhesive (not shown in the figure) can be provided between the cover 11 and the carrier 12, and the cover 11 and the carrier 12 are sealed together by the third adhesive. For example, a layer of the third adhesive can be applied to the opening edge of the carrier 12, and then the cover 11 can be placed over the opening of the carrier 12 to bond and fix the cover 11 and the carrier 12 together by the third adhesive, and to seal the gap between the cover 11 and the carrier 12 by the third adhesive. The third adhesive can be made of materials with adhesive properties such as epoxy resin or silicone sealant.

[0175] In another example, as shown in Figures 5 and 9, one of the cover 11 and the support member 12 is provided with a groove 111, and the other is provided with a protruding ring 122 that matches the groove 111, with at least a portion of the protruding ring 122 extending into the groove 111. For example, the protruding ring 122 can be provided at the edge of the opening on the support member 12, so that the protruding ring 122 surrounds the opening. Correspondingly, the groove 111 that matches the protruding ring 122 can be provided on the cover 11, and the groove 111 can be configured as an annular groove. Alternatively, the groove can be provided at the edge of the opening on the support member 12, and the groove can be configured as an annular groove. Correspondingly, the protruding ring that matches the groove 111 can be provided on the cover 11. In this way, when the cover 11 is closed on the opening of the support member 12, the protruding ring 122 can be inserted entirely into the groove 111, or a portion of the protruding ring 122 can be inserted into the groove 111, so that the cover 11 and the support member 12 are connected by the engagement of the groove 111 and the protruding ring 122. Alternatively, the protruding ring 122 and the groove 111 can be connected by an interference fit to achieve a seal between the cover 11 and the carrier 12.

[0176] In another example, at least a portion of the third adhesive can be located between the groove 111 and the protruding ring 122. That is, the third adhesive is filled into the groove 111, and then the cover 11 is placed over the opening of the carrier 12, so that the gap between the protruding ring 122 and the groove 111 is filled with the third adhesive. In this way, the third adhesive not only seals the gap between the protruding ring 122 and the groove 111, but also bonds and fixes the walls of the protruding ring 122 and the groove 111.

[0177] As another example, as shown in Figure 1, one of the cover 11 and the support member 12 is provided with a slot 15, and the other is provided with a buckle 16 that matches the slot 15. The buckle 16 cooperates with the slot 15 to restrict the relative movement of the cover 11 and the support member 12. For example, the slot 15 can be provided on the cover 11, and the slot 15 can be a through hole or a groove 111 formed on the edge of the cover 11. Correspondingly, the buckle 16 that matches the slot 15 can be provided on the outer wall of the support member 12, and the buckle 16 can be set as a protrusion that matches the slot 15. Alternatively, a groove 111 that serves as the slot 15 can be provided on the outer wall of the support member 12, and correspondingly, a protrusion that matches the groove 111 and serves as the buckle 16 can be provided on the cover 11. In this way, during the process of covering the cover 11 with the opening of the support member 12, the buckle 16 can be engaged in the slot 15, so that the movement of the cover 11 relative to the support member 12 can be restricted by the slot 15 and the buckle 16, and the third adhesive between the cover 11 and the support member 12 can be pressed tightly, which helps to improve the adhesion between the cover 11 and the support member 12.

[0178] In this embodiment of the application, as shown in FIG2, the piezoelectric component 2 can be fixedly disposed within the accommodating cavity 18. The piezoelectric component 2 can be installed within the accommodating cavity 18 by means of bonding, clamping, or other methods. In some embodiments, the piezoelectric component 2 can deform when a voltage is applied to it. In other embodiments, the piezoelectric component 2 can generate a first electrical signal when an external force is applied to it, causing it to deform.

[0179] For example, a piezoelectric component 2 for generating vibration can be provided within the accommodating cavity 18. Alternatively, a piezoelectric component 2 for detecting vibration can be provided within the accommodating cavity 18. Or, at least two piezoelectric components 2 can be provided simultaneously within the accommodating cavity 18, with at least one piezoelectric component 2 used for generating vibration and at least another piezoelectric component 2 used for detecting vibration. Alternatively, the same piezoelectric component 2 can be configured to both generate and detect vibration. The embodiments of this application do not limit the specific function and structure of the piezoelectric component 2.

[0180] In this embodiment of the application, as shown in FIG10, a first adhesive member 61 can be provided in the electronic device to bond and fix the piezoelectric component 2 in the accommodating cavity 18. For example, the first adhesive member 61 can be double-sided adhesive, which can bond the piezoelectric component 2 to the wall of the carrier 12 and place the piezoelectric component 2 in the accommodating cavity 18.

[0181] The electronic device provided in this application embodiment, by setting the housing cavity as a closed housing cavity 18, provides a sealed protective environment for the piezoelectric component 2. This helps reduce the impact of dust, water, etc., on the piezoelectric component 2, and also reduces the risk of damage to the piezoelectric component 2 from impacts, thus improving the reliability of the electronic device. Furthermore, by bonding the piezoelectric component 2 to the housing wall using the first adhesive member 61, the piezoelectric component 2 can be tightly connected to the housing, allowing vibrations generated by the piezoelectric component 2 to be transmitted to the housing as completely as possible; or allowing deformations of the housing to act on the piezoelectric component 2 as completely as possible, thereby improving the stability and accuracy of the electronic device's operation. Therefore, the electronic device provided in this application embodiment can provide good protection for the piezoelectric component 2, thereby improving the reliability of the electronic device and enhancing its operational stability and accuracy.

[0182] In some possible embodiments of this application, as shown in FIG7, the piezoelectric component 2 includes a substrate 21 and a piezoelectric element 22, the piezoelectric element 22 being attached to the substrate 21, and the substrate 21 being bonded to the shell wall of the outer casing.

[0183] In this embodiment, a substrate 21 and a piezoelectric element 22 can be provided in the piezoelectric assembly 2. The piezoelectric element 22 is provided on the substrate 21, and the shape of the substrate 21 can be set according to the shape of the piezoelectric element 22. The substrate 21 can be made of metal materials such as stainless steel and aluminum, or it can be made of rigid plastics such as polycarbonate (PC), polystyrene (PS), and polyformaldehyde (POM). This embodiment does not limit the specific material of the substrate 21. The substrate 21 can be set as a sheet structure. The piezoelectric element 22 can be made of lead zirconate titanate (PZT) piezoelectric ceramic sheet. The piezoelectric element 22 can be attached to the substrate 21. For example, the piezoelectric element 22 can be provided on one side surface of the substrate 21, or it can be provided on both opposite sides of the substrate 21.

[0184] For example, the substrate 21 can be bonded to the wall of the carrier 12. For instance, the area on the substrate 21 where the piezoelectric element 22 is not provided can be bonded to the wall of the carrier 12 to fix the substrate 21 to the wall, thereby fixing the piezoelectric assembly 2 to the shell wall of the housing.

[0185] In another example, the piezoelectric component 2 can be used as a driving device. That is, when a voltage is applied to the piezoelectric component 2, it can deform to drive the movement of other devices. Specifically, under the action of an applied electric field with the same or opposite polarization direction, the piezoelectric component 22 undergoes expansion and contraction deformation in the horizontal plane where the substrate 21 is located. At the same time, the substrate 21 is bonded to the wall of the support member 12, so that the two ends of the substrate 21 are fixed to the support member 12. This causes the substrate 21 to vibrate perpendicular to the horizontal plane, and then transmits the vibration to the support member 12 through the substrate 21, thereby causing the target device using the electronic device to vibrate and produce sound, etc.

[0186] In the above embodiments, since a base 21 is provided for the piezoelectric component 22, the piezoelectric component 2 can be fixed on the wall of the support component 12 through the base 21, and the deformation from the piezoelectric component 22 is carried by the base 21 to generate vibration, thereby transmitting the vibration to the support component 12, so that the target device has acoustic performance.

[0187] In some possible embodiments of this application, the orthographic projection of the piezoelectric element 22 onto the substrate 21 does not coincide with the bonding area between the substrate 21 and the wall.

[0188] In this embodiment, the area of ​​the substrate 21 can be set to be larger than the area of ​​the piezoelectric element 22. This way, after the piezoelectric element 22 is bonded to the substrate 21, there will still be an unused bonding area on the surface of the substrate 21 where the piezoelectric element 22 is located. Alternatively, if the piezoelectric element 22 is located on one side of the substrate 21 and not on the other side, the orthographic projection of the piezoelectric element 22 onto the other side of the substrate 21 where the piezoelectric element 22 is not located can not completely cover the other side of the substrate 21. The area on the other side of the substrate 21 not covered by the orthographic projection of the piezoelectric element 22 can be used as the bonding area. Then, the first adhesive member 61 can be bonded to the bonding area on the substrate 21, so that the substrate 21 is bonded to the shell wall of the outer casing through the first adhesive member 61. This ensures that the orthographic projection of the piezoelectric element 22 onto the substrate 21 does not coincide with the bonding area of ​​the substrate 21 and the shell wall. In the above embodiments, since the orthographic projection of the piezoelectric element 22 on the substrate 21 does not coincide with the bonding area between the substrate 21 and the wall, the influence of the bonding area on the vibration is reduced during the process of the piezoelectric element 22 generating vibration and driving the substrate 21 to vibrate, or during the process of the substrate 21 deforming with the deformation of the wall. For example, the influence on the vibration amplitude of the substrate is reduced, and the influence on the sound characteristics of the mid-low frequency is reduced.

[0189] In some other possible embodiments, the orthographic projection of the piezoelectric element 22 onto the substrate 21 coincides with the bonding area between the substrate 21 and the wall. This is beneficial for the acoustic performance of the piezoelectric assembly 2 in the mid-to-high frequencies.

[0190] In some possible embodiments of this application, the housing includes a connecting wall 17, and the piezoelectric assembly 2 is bonded to the side of the connecting wall 17 located within the accommodating cavity 18 by a first adhesive member 61; the electronic device also includes a second adhesive member 62, which is disposed on the side of the connecting wall 17 located outside the accommodating cavity 18, and the second adhesive member 62 is used to bond the electronic device to the target device.

[0191] In this embodiment of the application, a second adhesive member 62 may be provided in the electronic device to adhesively install the electronic device onto the target device.

[0192] For example, one wall of the housing can be used as the connecting wall 17, such as the wall of the box-shaped carrier 12 away from the opening of the receiving cavity 18. The piezoelectric assembly 2 can be bonded to the surface of the connecting wall 17 located inside the receiving cavity 18 using the first adhesive 61. The second adhesive 62 can be bonded to the surface of the connecting wall 17 located outside the receiving cavity 18, that is, the second adhesive 62 is located outside the carrier 12. For example, the second adhesive 62 can be double-sided adhesive.

[0193] In the above embodiments, since the piezoelectric component 2 and the second adhesive 62 are respectively disposed on opposite sides of the connecting wall 17 in the housing, when the electronic device is bonded to the target device by the second adhesive 62, the vibration transmission path between the piezoelectric component 2 in the electronic device and the target device can be shortened, which is beneficial to the vibration transmission between the piezoelectric component 2 in the electronic device and the target device and improves the sensitivity of the electronic device.

[0194] In some possible embodiments of this application, as shown in FIG2, the area of ​​the connecting wall 17 bonded to the second adhesive 62 is greater than the area of ​​the connecting wall 17 bonded to the first adhesive 61.

[0195] In this embodiment, the opposing surfaces of the connecting wall 17 of the outer casing can be configured with different area sizes. For example, the area of ​​the surface of the connecting wall 17 outside the outer casing where the second adhesive 62 is disposed can be larger than the area of ​​the surface of the connecting wall 17 inside the outer casing where the first adhesive 61 is disposed.

[0196] For example, a portion of the surface of the connecting wall 17 located inside the housing 1 can be used as the area for providing the first adhesive 61, while other portions of the surface of the connecting wall 17 located inside the housing 1 can be used as the area for mounting other devices, such as bases. The entire surface of the connecting wall 17 located outside the housing 1 can be used as the surface for providing the second adhesive 62. Alternatively, the connecting wall 17 can be extended so that the surface area of ​​the connecting wall 17 located outside the housing 1 is larger than the surface area of ​​the connecting wall 17 located inside the housing 1. Extending the connecting wall 17, for example, means that the connecting wall 17 extends beyond the sidewall of the support member 12 in a direction perpendicular to the closing direction Z. In this way, when the second adhesive 62 is provided on the connecting wall 17, the second adhesive 62 can be a double-sided adhesive with a larger area, or the like.

[0197] In the above embodiments, since the surface area of ​​the connecting wall 17 outside the accommodating cavity 18 is greater than the surface area of ​​the connecting wall 17 inside the accommodating cavity 18, when the electronic device is bonded to the target device, the connection area between the connecting wall 17 and the target device can be increased. This allows the vibration generated by the piezoelectric component 2 to be transmitted to the target device more fully, or the deformation generated by the target device to be transmitted to the piezoelectric component 2 more completely, thereby improving the accuracy of the electronic device's operation.

[0198] In addition, this application also provides a vehicle, which includes: a vehicle body and electronic devices provided in any of the above embodiments. The vehicle body includes multiple body panels, multiple interior trim pieces, and vehicle components connected to the body panels and / or interior trim pieces; at least one of the body panels, interior trim pieces, and vehicle components is provided with electronic devices.

[0199] In some possible embodiments of this application, the electronic devices provided in the embodiments of this application can be installed on a vehicle. The term "vehicle" or other similar terms used in the embodiments of this application include motor vehicles in a broad sense: for example, passenger / freight vehicles including SUVs, sedans, buses, off-road vehicles, tractors, trucks, special vehicles, buses, trucks, and various commercial vehicles; watercraft including various boats and ships, and aircraft; and including hybrid vehicles, electric vehicles, hybrid electric vehicles, hydrogen-powered vehicles, and other alternative fuel vehicles (e.g., fuels derived from resources other than petroleum). The embodiments of this application do not limit the type and structure of the vehicle.

[0200] For example, a vehicle typically includes a frame, body, powertrain, and electrical system. The body and powertrain are both mounted on the frame, while the electrical system is mounted on both the body and frame. The body typically includes multiple body panels, multiple interior trim pieces, and multiple vehicle components. These body panels can be assembled to form the overall structure of the vehicle, such as a cabin or cargo compartment. Examples of body panels include doors, windows, hood, trunk lid, roof, front bumper, rear bumper, and fenders. Interior trim pieces are installed in the cabin and cargo compartment to enhance vehicle comfort and provide interfaces and equipment. Vehicle components are located within the cabin and cargo compartment and include seats, steering wheel, instrument panel, center console screen, armrest, and license plate.

[0201] In another example, electronic devices can be installed on at least one of the vehicle's body panels, interior trim, and vehicle components, i.e., the electronic devices can be fixed to the vehicle body by adhesive bonding. The electronic devices can be electrically connected to the vehicle's overall controller, i.e., connector 4 is plugged into the socket of the vehicle controller, so that the vehicle controller applies a voltage signal to the electronic devices. This causes the piezoelectric element 22 in the electronic devices to vibrate in response to the voltage signal, thereby causing the body panels, interior trim, or vehicle components to vibrate and produce sound. Alternatively, during the deformation of the body panels, interior trim, or vehicle components due to vibration, the piezoelectric element 22 in the electronic devices can deform, causing the piezoelectric element 22 to generate an electrical signal, thereby detecting the vibration of the body panels, interior trim, or vehicle components.

[0202] The vehicle provided in this application embodiment has electronic devices installed on at least one of the body panels, interior trim, and vehicle components. Therefore, the electronic devices can drive the body panels, interior trim, or vehicle components in the vehicle body to vibrate, causing the vehicle to emit sound. Furthermore, the electronic devices can detect the vibration of the body panels, interior trim, or vehicle components. This provides good protection for the piezoelectric component 2, thereby improving the reliability of the electronic devices.

[0203] The various embodiments of this disclosure have been described above. These descriptions are exemplary and not exhaustive, nor are they limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used in this disclosure is chosen to best explain the principles, practical application, or improvement of the technology in the market, or to enable others skilled in the art to understand the embodiments disclosed herein. Industrial applicability

[0204] The electronic device disclosed herein includes a housing, a piezoelectric component, and a conductive component. The piezoelectric component is disposed within a closed cavity of the housing, and the first end of the conductive component is electrically connected to the piezoelectric component. This electronic device can provide good protection for the piezoelectric component, thereby improving the reliability of the electronic device and simplifying the assembly process of the electronic device.

Claims

An electronic device, including The outer casing has a closed accommodating cavity; A piezoelectric component disposed within the accommodating cavity, the piezoelectric component being configured to generate a first electrical signal in response to passive vibration, and / or the piezoelectric component being configured to deform in response to a second electrical signal; A conductive element, the first end of which is electrically connected to the piezoelectric component, through which the first electrical signal and / or the second electrical signal are transmitted. The electronic device according to claim 1, wherein, The electronic device further includes a connector and / or a circuit board, the connector extending through the housing from inside the cavity to outside the cavity, the connector being used for electrical connection with the controller of the target device, the circuit board being disposed inside the cavity, and the second end of the conductive element being electrically connected to the portion of the connector located inside the cavity or the circuit board. The electronic device according to claim 2, wherein, The first end abuts against the piezoelectric component, and the second end is fixedly connected to the circuit board; or, the first end is fixedly connected to the piezoelectric component, and the second end abuts against the circuit board. The electronic device according to claim 2, wherein, The first end abuts against the piezoelectric component, and the second end of the conductive element is connected to the portion of the connector located within the accommodating cavity. The electronic device according to claim 2, wherein, The connector has a vent hole, one end of which extends into the receiving cavity and the other end extends outside the receiving cavity. The electronic device according to claim 2, wherein, The circuit board and the connector are electrically connected to the portion located within the accommodating cavity. The electronic device according to claim 6, wherein, The circuit board has a connection through hole that matches the connector. The edge of the connection through hole has a pad. The connector extends through the connection through hole to connect to the second end of the conductive element, and the connector is electrically connected to the pad. The electronic device according to claim 2, wherein, The circuit board has a connection through hole that matches the connector, and the circuit board is mounted on the connector through the connection through hole; the circuit board has a connection circuit, one end of the connection circuit extends to the edge of the connection through hole and is electrically connected to the connector, and the second end of the conductive element is electrically connected to the other end of the connection circuit. The electronic device according to claim 2, wherein, The housing has a protective element that surrounds the portion of the connector located outside the receiving cavity around its circumference. The electronic device according to any one of claims 2 to 9, wherein, The housing includes a carrier and a cover. The cover covers the carrier and together with the carrier, forms the accommodating cavity. At least one of the cover and the carrier is provided with an abutment portion. Along the covering direction of the cover and the carrier, the abutment portion extends to a position corresponding to the circuit board and abuts against the circuit board to restrict the movement of the circuit board relative to the carrier. The electronic device according to any one of claims 2 to 9, wherein, The electronic device also includes a controller, which is disposed on the circuit board. The piezoelectric component and the connector are electrically connected through the controller. The controller is used to control the piezoelectric component to generate vibration and / or process the first electrical signal generated by the piezoelectric component. The electronic device according to claim 11, wherein, The electronic device further includes a transmission circuit disposed on the circuit board. The controller and the connector are electrically connected through the transmission circuit. The transmission circuit is used to control the transmission of control signals from the connector to the controller. The electronic device according to any one of claims 2 to 9, wherein, The electronic device further includes a signal processing circuit, which is disposed on the circuit board. The piezoelectric component and the connector are electrically connected through the signal processing circuit, which is used to process the first electrical signal generated by the piezoelectric component. The electronic device according to claim 13, wherein, The electronic device also includes a voltage regulator output circuit, which is disposed on the circuit board and electrically connected to the signal processing circuit for supplying power to the signal processing circuit. The electronic device according to any one of claims 2 to 9, wherein, The circuit board includes at least two spaced-apart sub-circuit boards, with adjacent sub-circuit boards fixedly connected by a connecting component; at least two sub-circuit boards are provided with a controller, a transmission circuit, a signal processing circuit, and a voltage regulated output circuit; the piezoelectric component is electrically connected to at least one of the sub-circuit boards. The electronic device according to claim 15, wherein, The sub-circuit board includes a first sub-circuit board and a second sub-circuit board; the connection component includes a connector and a support member, the first sub-circuit board and the second sub-circuit board are respectively provided with pads that match the connector, the connector is electrically connected to the corresponding pads on the first sub-circuit board and the second sub-circuit board to electrically connect the first sub-circuit board and the second sub-circuit board; the support member is sleeved on the connector and is located between the first sub-circuit board and the second sub-circuit board. The electronic device according to claim 16, wherein, The sub-circuit board includes a first sub-circuit board and a second sub-circuit board; the connection assembly includes a mating plug and a socket, the plug being electrically connected to one of the first sub-circuit board and the second sub-circuit board, and the socket being electrically connected to the other of the first sub-circuit board and the second sub-circuit board, the plug and the socket being inserted to electrically connect the first sub-circuit board and the second sub-circuit board. The electronic device according to any one of claims 1 to 17, wherein, The electronic device includes at least two conductive elements, and the piezoelectric component includes a positive electrode region and a negative electrode region. The first end of one conductive element is connected to the positive electrode region, and the first end of the other conductive element is connected to the negative electrode region. The electronic device according to claim 18, wherein, The piezoelectric component includes a substrate and a piezoelectric element, wherein the piezoelectric element is attached to the substrate; Both the positive electrode region and the negative electrode region are located on the piezoelectric element; or, the positive electrode region is located on one of the piezoelectric element and the substrate, and the negative electrode region is located on the other of the piezoelectric element and the substrate. The electronic device according to any one of claims 1 to 19, wherein, The conductive element includes an elastic conductive element, at least a portion of which can undergo elastic deformation when subjected to external force. The electronic device according to claim 20, wherein, At least a portion of the elastic conductive element includes at least one of the following: a spring, conductive foam, and a spring pin. The electronic device according to any one of claims 1 to 21, wherein, The piezoelectric component and the housing are an integral structure. The electronic device according to claim 1, wherein, The electronic device further includes a first adhesive member disposed between the piezoelectric component and the housing, wherein the piezoelectric component is bonded to the wall of the housing via the first adhesive member. The electronic device according to claim 23, wherein, The piezoelectric assembly includes a substrate and a piezoelectric element, the piezoelectric element being attached to the substrate, and the substrate being bonded to the shell wall of the outer casing. The electronic device according to claim 24, wherein, The orthographic projection of the piezoelectric element onto the substrate does not coincide with the bonding area between the substrate and the shell wall. The electronic device according to claim 23, wherein, The housing includes a connecting wall, and the piezoelectric component is bonded to the side of the connecting wall located within the accommodating cavity via the first adhesive; The electronic device further includes a second adhesive member disposed on the side of the connecting wall outside the accommodating cavity, and the second adhesive member is used to adhere the electronic device to the target device. The electronic device according to claim 26, wherein, The area where the connecting wall is bonded to the second adhesive is greater than the area where the connecting wall is bonded to the first adhesive. The electronic device according to any one of claims 1 to 27, wherein, The electronic device includes one or more of the piezoelectric components; And / or, the shape of the piezoelectric component includes at least one of the following: circular, rectangular, elliptical, or irregular polygonal; And / or, the same piezoelectric assembly includes at least two piezoelectric elements, which differ in any of the following aspects: structure, properties, or connection method with the housing. The electronic device according to any one of claims 1 to 28, wherein, The outer casing includes a cover and a support member. At least one of the cover and the support member is provided with an abutment portion. The abutment portion extends along the closing direction of the cover and the support member. After the cover is closed onto the support member, the wall of the cover or the wall of the support member abuts against the abutment portion, or two corresponding abutment portions abut against each other. The electronic device according to claim 29, wherein, A third adhesive is provided between the cover and the carrier, and the cover and the carrier are sealed together by the third adhesive. The electronic device according to claim 30, wherein, One of the cover and the carrier is provided with a groove, and the other is provided with a protruding ring that matches the groove. At least a portion of the protruding ring extends into the groove, and at least a portion of the third adhesive is located between the groove and the protruding ring. The electronic device according to claim 29, wherein, One of the cover and the carrier is provided with a slot, and the other is provided with a buckle that matches the slot. The buckle cooperates with the slot to restrict the relative movement of the cover and the carrier. A vehicle comprising: The vehicle body includes multiple body panels, multiple interior trim pieces, and vehicle components connected to the body panels and / or interior trim pieces; The electronic device according to any one of claims 1 to 32, wherein the electronic device is disposed on at least one of the vehicle body panel, the interior trim, and the vehicle assembly.

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