Main bonding fixture, main bonding apparatus, and main bonding system

Abstract

The present application discloses a main bonding fixture, a main bonding apparatus, and a main bonding system. The main bonding fixture comprises a main bonding film, located on a light exit side of a light-emitting element; and a main bonding pad, located on the side of the main bonding film facing away from the light-emitting element, the main bonding pad comprising a pad body and protrusions protruding from the surface of the pad body. During main bonding, at least part of the protrusions is embedded into the main bonding film. The main bonding fixture of the present application can reduce misalignment of the light-emitting element during a main bonding process, thereby improving product yield.

Description

Pressure fixture, pressure device, and pressure system

[0001] Cross-references to related applications

[0002] This application claims priority to Chinese Patent Application No. 202411844625.6, filed on December 13, 2024, the entire contents of which are incorporated herein by reference. [Technical Field]

[0003] This application relates to the field of pressure technology, and in particular to a pressure fixture, pressure device, and pressure system. [Background Technology]

[0004] Micro-LEDs have advantages such as high brightness, small size, low power consumption, long lifespan, and faster response time, and are regarded as the next generation of display technology.

[0005] The current common manufacturing process for Micro-LED screens involves transferring LED chips from the substrate to the driver backplane using a mass transfer process for pre-fixation. Then, pressure and heat bonding are applied to electrically connect and permanently fix the LEDs to the driver backplane – this is known as local bonding. However, when using this local bonding process, LED misalignment is prone to occur, and the product yield needs further improvement.

[0006] [Application Content]

[0007] This application provides a bonding fixture, a bonding device, and a bonding system, which can reduce the misalignment of the light-emitting element during the bonding process and improve product yield.

[0008] The first technical solution provided in this application is: to provide a self-bonding fixture for realizing the self-bonding of a light-emitting element, comprising: a self-bonding film, configured to be located on the light-emitting surface side of the light-emitting element during self-bonding; a self-bonding pad, configured to be located on the side of the self-bonding film away from the light-emitting element during self-bonding, the self-bonding pad including a pad body and a protrusion protruding from the surface of the pad body; during self-bonding, at least a portion of the protrusion is embedded in the self-bonding film.

[0009] The material of the gasket body includes at least one of inorganic materials, metals, and organic materials.

[0010] The material of the gasket body includes at least one of silicon, sapphire, glass, quartz, and silicon carbide.

[0011] The gasket body and the protrusion are made of the same material.

[0012] The gasket body and the protrusion are integrally formed.

[0013] The thickness of the protrusion is less than the thickness of the pressure film.

[0014] The thickness of the protrusion ranges from 0.1 to 50 micrometers; and / or, the orthographic projection of the protrusion on the gasket body is rectangular, circular, semi-circular, annular, cross-shaped, or serpentine.

[0015] The protrusion, perpendicular to the cross-section of the gasket body, is rectangular, circular, trapezoidal, triangular, or semi-circular.

[0016] The number of protrusions is multiple, and the multiple protrusions are spaced apart.

[0017] In this embodiment, at least a portion of the protrusions are arranged along a first direction, wherein, during the bonding process, the two electrodes of the light-emitting element are arranged along the first direction.

[0018] The protrusions are block-shaped, strip-shaped, or needle-shaped.

[0019] The protrusions are block-shaped structures, and multiple protrusions are arranged in multiple rows, with each row extending along the first direction.

[0020] The protrusions are arranged in a matrix, or the protrusions in adjacent rows are staggered.

[0021] Wherein, the orthographic projection of the pressure film on the gasket body is located within the gasket body.

[0022] The material of the pressure film includes at least one of polytetrafluoroethylene, polyimide, and polyethylene terephthalate.

[0023] The gasket body includes a first sub-body and a second sub-body that are independently stacked, and the protrusion is disposed on the surface of the first sub-body.

[0024] There are multiple second sub-bodies.

[0025] The second technical solution provided by this application is: to provide a pressing device, including a display panel and the pressing fixture described in any of the above claims; the display panel includes a driving back plate and a light-emitting element, and when the light-emitting element on the driving back plate is pressed, the pressing film is located on the side of the light-emitting element away from the driving back plate, the pressing pad is located on the side of the pressing film away from the driving back plate, and at least a portion of the protrusion is embedded in the pressing film.

[0026] The light-emitting elements are multiple and spaced apart. The protrusions are also multiple and spaced apart. The orthographic projection of each light-emitting element on the driving back plate covers the orthographic projection of at least one protrusion on the driving back plate. Alternatively, the orthographic projection of the protrusion on the driving back plate is located between the orthographic projections of two adjacent light-emitting elements on the driving back plate.

[0027] Wherein, the orthographic projection of the drive backplate on the gasket body is covered by the orthographic projection of the pressure film on the gasket body, and the orthographic projection of the pressure film on the gasket body is located within the gasket body.

[0028] The third technical solution provided in this application is: to provide a pressure system, including: a pressure fixture as described above; and a platform for supporting the pressure fixture.

[0029] The pressure system further includes a pneumatic membrane. During the pressure bonding process, the pressure fixture, the light-emitting element, and the driving backplate are located between the stage and the pneumatic membrane. During the pressure bonding process, atmospheric pressure is applied to the pneumatic membrane to bond the light-emitting element.

[0030] The pressing system further includes a support member disposed on the platform and on the periphery of the drive back plate; wherein, during the pressing process, when the light-emitting element is located on the side of the drive back plate away from the platform, the periphery of the pressing pad and the periphery of the pressing film are supported by the support member.

[0031] The pressing system further includes a first mold and a second mold. The first mold and the second mold together form a receiving space for accommodating the platform and the pressing fixture. The first mold can move relative to the second mold to close or open the receiving space.

[0032] The beneficial effects are as follows: This application provides that the pressure pad includes a pad body and protrusions protruding from the surface of the pad body. During bonding, under pressure, at least a portion of the protrusions are embedded in the pressure film, thereby generating a large fixing force or friction between the pressure film and the pressure pad. This prevents the pressure film from easily sliding relative to the pressure pad. Therefore, under the action of the pressure pad, the pressure film will not easily slide relative to the drive backplate during the bonding process, thereby reducing the offset of the light-emitting element caused by the sliding of the pressure film, ensuring accurate bonding between the light-emitting element and the drive backplate, and improving the bonding yield. [Attached Image Description]

[0033] Figure 1 is a structural schematic diagram of one embodiment of the pressure fixture of this application;

[0034] Figure 2 is a schematic diagram of the structure of a pressing fixture in Figure 1 used for pressing timing in one embodiment.

[0035] Figure 3 is a schematic diagram of the structure of the pressing fixture in Figure 1 used for pressing timing in another embodiment;

[0036] Figure 4 is a structural schematic diagram of another embodiment of the pressure fixture of this application;

[0037] Figure 5 is a schematic diagram of the state between the pressure film and the pressure pad during the pressure bonding process using the method shown in Figure 3.

[0038] Figure 6 is a schematic diagram of the state between the pressure film and the pressure pad during the pressure bonding process using the method shown in Figure 4.

[0039] Figure 7 is a top view of the pressure pad in one embodiment of Figure 1;

[0040] Figure 8 is a top view of the pressure pad in Figure 1 in another embodiment;

[0041] Figure 9 is a top view of the pressure pad in Figure 1 in another embodiment;

[0042] Figure 10 is a top view of the pressure pad in Figure 1 in another embodiment;

[0043] Figure 11 is a top view of the pressure pad in Figure 1 in another embodiment;

[0044] Figure 12 is a top view of the pressure pad in Figure 1 in another embodiment;

[0045] Figure 13 is a top view of the pressure pad in Figure 1 in another embodiment;

[0046] Figure 14 is a top view of the pressure pad in Figure 1 in another embodiment;

[0047] Figure 15 is a cross-sectional structural diagram of the pressure pad in one embodiment of Figure 1;

[0048] Figure 16 is a cross-sectional structural diagram of the pressure pad in Figure 1 in another embodiment;

[0049] Figure 17 is a cross-sectional structural diagram of the pressure pad in Figure 1 in another embodiment;

[0050] Figure 18 is a cross-sectional structural diagram of the pressure pad in Figure 1 in another embodiment;

[0051] Figure 19 is a cross-sectional structural diagram of the pressure pad in Figure 1 in another embodiment;

[0052] Figure 20 is a cross-sectional view of the pressure pad in Figure 1 in another embodiment;

[0053] Figure 21 is a structural schematic diagram of another embodiment of using the pressure jig in Figure 1 for pressure timing;

[0054] Figure 22 is a structural schematic diagram of the pressing timing using the pressing fixture in Figure 1 in another embodiment;

[0055] Figure 23 is a structural schematic diagram of the pressure system in one embodiment of this application during the pressure bonding timing;

[0056] Figure 24 is a structural schematic diagram of the pressure system in another embodiment of this application during the pressure bonding timing;

[0057] Figure 25 is a schematic diagram of the structure of the pressure system in another embodiment of this application during the pressure bonding time. 【Detailed Implementation Methods】

[0058] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0059] It should be noted that the terms "first" and "second" in this application are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0060] Referring to Figure 1, the pressure fixture 100 of this application includes a pressure film 110 and a pressure pad 120. The pressure pad 120 includes a pad body 121 and a protrusion 122 protruding from the surface of the pad body 121.

[0061] Referring to Figures 2 and 3, the pressure film 110 is configured to be located on the light-emitting surface side of the light-emitting element 210 during the pressure bonding process; the pressure pad 120 is configured to be located on the side of the pressure film 110 away from the light-emitting element 210 during the pressure bonding process, and at least a portion of the protrusion 122 is embedded in the pressure film 110 during the pressure bonding process.

[0062] Specifically, before bonding, the light-emitting element 210 is pre-fixed to the driving backplate 220 using bonding adhesive 230. At this time, the two electrodes 211 of the light-emitting element 210 (one electrode 211 is the anode and the other electrode 211 is the cathode) do not pass through the bonding adhesive 230 to form an electrical connection with the driving backplate 220. The bonding adhesive 230 can be ACF (Anisotropic Conductive Film), NCP (NonConductive Paste), or NCF (Nonconductive film).

[0063] During the bonding process, the driving backplate 220 and the light-emitting element 210 are placed on the stage 310, and then pressure is applied so that the two electrodes 211 of the light-emitting element 210 pass through the bonding adhesive 230 and form an electrical connection with the driving backplate 220. When placing the driving backplate 220 and the light-emitting element 210 on the stage 310, the light-emitting element 210 can be positioned below and the driving backplate 220 above (as shown in Figure 2), or the driving backplate 220 can be positioned below and the light-emitting element 210 above (as shown in Figure 3).

[0064] When the placement method shown in Figure 2 is adopted, the pressure film 110 is located below the light-emitting element 210, and the pressure pad 120 is located below the pressure film 110. At this time, the air pressure film 320 can be placed on the side of the drive back plate 220 away from the light-emitting element 210, and then atmospheric pressure is applied to the air pressure film 320, so that the drive back plate 220 moves towards the light-emitting element 210 under the drive of the air pressure film 320, and finally the two electrodes 211 of the light-emitting element 210 are electrically connected to the drive back plate 220 through the bonding adhesive 230. When the placement method shown in Figure 3 is adopted, the pressure film 110 is located above the light-emitting element 210, and the pressure pad 120 is located above the pressure film 110. At this time, an air pressure film 320 can be placed on the side of the pressure pad 120 away from the driving back plate 220, and then atmospheric pressure is applied to the air pressure film 320. Under the action of the air pressure film 320, the light-emitting element 210 moves towards the driving back plate 220, and finally the two electrodes 211 of the light-emitting element 210 pass through the bonding adhesive 230 and are electrically connected to the driving back plate 220. Among them, the pressure bonding method shown in Figure 2 is called reverse pressure, and the pressure bonding method shown in Figure 3 is called positive pressure.

[0065] As can be seen from Figures 2 and 3, regardless of whether it is positive or negative pressure, during the bonding process, the bonding film 110 is located on the side of the light-emitting surface of the light-emitting element 210 (i.e., the surface of the light-emitting element 210 away from the driving back plate 220), and the bonding pad 120 is located on the side of the bonding film 110 away from the light-emitting element 210 (driving back plate 220).

[0066] The pressure film 110 is an elastic film. When there are multiple light-emitting elements 210 and the heights of the multiple light-emitting elements 210 are different, the pressure film 110 has a buffering effect, which can ensure that the multiple light-emitting elements 210 can be bonded to the driving back plate 220 and can also prevent the light-emitting elements 210 from being damaged.

[0067] Bonding is typically performed under pressure and heat. In this environment, the bonding film 110 undergoes lateral expansion, meaning it expands in a direction parallel to the drive backplate 220. As the bonding film 110 expands laterally, the light-emitting element 210 in contact with it slides relative to the drive backplate 220, causing the light-emitting element 210 to become misaligned. Consequently, the light-emitting element 210 cannot be bonded to the correct position on the drive backplate 220. After lighting up, the light-emitting element 210 may fail to emit light, reducing the bonding yield.

[0068] In this application, the pressure pad 120 includes a pad body 121 and a protrusion 122 protruding from the surface of the pad body 121. During bonding, under pressure, at least a portion of the protrusion 122 is embedded in the pressure film 110, thereby generating a large lateral fixing force or friction between the pressure film 110 and the pressure pad 120. This prevents the pressure film 110 from easily sliding relative to the pressure pad 120. Therefore, under the action of the pressure pad 120, the pressure film 110 can be prevented from easily sliding relative to the drive back plate 220 during the bonding process. This reduces the offset of the light-emitting element 210 caused by the sliding of the pressure film 110, thereby reducing the sliding of the light-emitting element 210 relative to the drive back plate 220, ensuring accurate bonding between the light-emitting element 210 and the drive back plate 220, and improving the bonding yield.

[0069] After completing one bonding cycle, the bonding film 110 and the bonding pad 120 are separated. The bonding film 110 then enters the next process along with the light-emitting element 210. In the next process, the film is peeled off manually or by machine, separating the light-emitting element 210 from the bonding film 110. The peeled bonding film 110 can be discarded directly or reused for the next bonding cycle. The bonding pad 120 can be recycled multiple times.

[0070] In one embodiment, during the pressing process, the protrusion 122 is fully embedded in the pressing film 110 to ensure that a sufficiently large lateral fixing force / frictional force is generated between the pressing film 110 and the pressing pad 120.

[0071] In another embodiment, referring to Figures 4 and 5, during the bonding process, the protrusion 122 is partially embedded in the bonding film 110. At this time, an air channel 111 can be formed between the bonding film 110 and the gasket body 121 on the outer side of the protrusion 122. The air channel 111 can discharge the gas between the bonding film 110 and the gasket body 121 during the bonding process, preventing the presence of gas between the bonding film 110 and the gasket body 121 from preventing the pressure from being transmitted to the light-emitting element 210, thereby affecting the bonding between the light-emitting element 210 and the driving backplate 220. In addition, after the bonding is completed, the air channel 111 can also allow external gas to enter between the bonding film 110 and the gasket body 121, which is beneficial for the separation between the bonding film 110 and the gasket body 121.

[0072] When there are multiple protrusions 122, during the pressing and bonding process, all protrusions 122 can be fully embedded in the pressing film 110, all protrusions 122 can be partially embedded in the pressing film 110, or some protrusions 122 can be fully embedded in the pressing film 110 and the remaining protrusions 122 can be partially embedded in the pressing film 110.

[0073] In one embodiment, the gasket body 121 and the drive backplate 220 have the same coefficient of thermal expansion. Specifically, considering that the drive backplate 220 itself will expand under pressure and heating, and that the pads on the drive backplate 220 will move as the drive backplate 220 expands, the gasket body 121 and the drive backplate 220 are made to have the same coefficient of thermal expansion in order to ensure that the light-emitting element 210 is bonded to the correct position on the drive backplate 220 under pressure and heating. It should be noted that in other embodiments, the coefficients of thermal expansion of the gasket body 121 and the drive backplate 220 may not be equal.

[0074] In one embodiment, the material of the gasket body 121 includes at least one selected from inorganic materials, metals, and organic materials. In another embodiment, the material of the gasket body 121 includes at least one selected from silicon, sapphire, glass, quartz, and silicon carbide.

[0075] In one embodiment, the protrusion 122 has the same coefficient of thermal expansion as the drive backplate 220. Of course, in other embodiments, the coefficients of thermal expansion of the protrusion 122 and the drive backplate 220 may not be equal.

[0076] In one embodiment, the gasket body 121 and the protrusion 122 are made of the same material, so that the same material can be used to prepare the pressure gasket 120 during the preparation process, which can improve the preparation efficiency and reduce the preparation cost.

[0077] In one embodiment, the gasket body 121 and the protrusion 122 are integrally formed to ensure the connection strength between the two.

[0078] During the manufacturing process, a patterning process can be used to form protrusions 122 on the surface of the gasket body 121. This application does not limit the manufacturing process of the pressure gasket 120.

[0079] In one embodiment, the thickness of the protrusion 122 is less than the thickness of the pressure film 110, which can prevent the protrusion 122 from passing through the pressure film 110 during the pressing process and causing damage to the light-emitting element 210.

[0080] In one embodiment, the thickness of the protrusion 122 ranges from 0.1 to 50 micrometers. For example, the thickness of the protrusion 122 can be 0.1 micrometer, 10 micrometer, 20 micrometer, 40 micrometer, or 50 micrometer, etc., and can be set according to actual needs.

[0081] Referring to Figure 1, in one embodiment, the gasket body 121 has a single-layer structure.

[0082] Referring to Figure 6, in another embodiment, the gasket body 121 includes a first sub-body 1211 and a second sub-body 1212 that are independently and stacked, and a protrusion 122 is disposed on the surface of the first sub-body 1211. The first sub-body 1211 and the second sub-body 1212 are independent in that they are two independent structures that can be separated or stacked. On the one hand, when the application requires a thicker gasket body 121, the first sub-body 1211 and the second sub-body 1212 can be used in combination; conversely, when the application requires a thinner gasket body 121, only the first sub-body 1211 can be used. On the other hand, this embodiment allows the protrusion 122 to be formed on the relatively thin first sub-body 1211, reducing the difficulty of processing.

[0083] The number of second sub-body 1212 can be one or more. For example, Figure 4 shows two second sub-body 1212. When there are multiple second sub-body 1212, it can further meet the different requirements for the thickness of the gasket body 121 in different application scenarios.

[0084] The thicknesses of the first sub-body 1211 and the second sub-body 1212 may be equal or unequal.

[0085] When there are multiple second sub-bodies 1212, the thickness of the multiple second sub-bodies 1212 can be equal or unequal, and the specific choice can be made according to actual needs.

[0086] In one embodiment, the number of first sub-body 1211 can also be multiple. When the number of first sub-body 1211 is multiple, at least one parameter such as the structure and spacing of the protrusions 122 on the multiple first sub-body 1211 is not equal. In this way, in different scenarios, appropriate protrusions 122 can be selected to fix the pressure film 110 according to its characteristics.

[0087] Referring again to Figure 1, in one embodiment, there are multiple protrusions 122, which are spaced apart. The multiple protrusions 122 can further increase the lateral fixing force or friction between the pressure film 110 and the pressure pad 120, and prevent the pressure film 110 from sliding relative to the drive back plate 220 during the pressing process.

[0088] Referring to FIG7, in one embodiment, at least a portion of the plurality of protrusions 122 are arranged along the first direction X, wherein, during the bonding process, the two electrodes 211 of the light-emitting element 210 are arranged along the first direction X. Specifically, since the two electrodes 211 of the light-emitting element 210 are arranged along the first direction X, correspondingly, the two pads on the drive backplate 220 corresponding to the two electrodes 211 of the light-emitting element 210 are also arranged along the first direction X. Considering that the spacing between the two electrodes 211 of the light-emitting element 210 is small, the probability that the light-emitting element 210 cannot be lit after being misaligned in the first direction X is greater than the probability that the light-emitting element 210 cannot be lit after being misaligned in the second direction (the second direction is perpendicular to the first direction X), at least a portion of the protrusions 122 are arranged along the first direction X to at least prevent the bonding film 110 from sliding relative to the drive backplate 220 in the first direction X.

[0089] In this embodiment, multiple protrusions 122 may be arranged along the first direction X (as shown in Figure 7), or some of the protrusions 122 may be arranged along the first direction X and some of the protrusions 122 may be arranged along the second direction. It should be noted that in other embodiments, multiple protrusions 122 may also be arranged along the second direction.

[0090] The protrusion 122 can be in the form of a block, a strip, or a needle, as long as it can be at least partially embedded in the pressing film 110 during the pressing process. When there are multiple protrusions 122, their structures can be the same or different, depending on the actual requirements.

[0091] Referring to Figures 8 to 13, in one embodiment, the protrusions 122 have a block-like structure, with multiple protrusions 122 arranged in multiple rows, each row extending along the first direction X. This arrangement can further increase the lateral fixing force or friction between the pressure film 110 and the pressure pad 120, preventing the pressure film 110 from sliding relative to the drive back plate 220 during the pressing process.

[0092] The multiple protrusions 122 can be arranged in a matrix (as shown in Figures 8 to 11), or the protrusions 122 in adjacent rows can be staggered (as shown in Figures 12 and 13).

[0093] The orthographic projection of the protrusion 122 onto the gasket body 121 can be rectangular (as shown in Figures 8 and 12), circular (as shown in Figures 9 and 13), cross-shaped (as shown in Figure 10), annular (as shown in Figure 11, which is a schematic diagram of a square annular shape; in other embodiments, it can also be an annular shape), or serpentine (as shown in Figure 14). Of course, in other embodiments, the orthographic projection of the protrusion 122 onto the gasket body 121 can also be semi-circular, triangular, or other irregular shapes. The specific shape can be set according to the requirements, and no specific limitation is made here.

[0094] The cross-section of the protrusion 122 perpendicular to the gasket body 121 can be rectangular (as shown in Figure 15), triangular (as shown in Figure 16), trapezoidal (as shown in Figures 17 and 18), or semi-circular (as shown in Figure 19). When the cross-section of the protrusion 122 perpendicular to the gasket body 121 is trapezoidal, it can be a regular trapezoid (as shown in Figure 17) or an inverted trapezoid (as shown in Figure 18). In other embodiments, the cross-section of the protrusion 122 perpendicular to the gasket body 121 can also be circular or irregular (as shown in Figure 20). The specific shape can be set according to the requirements, and no specific limitation is made here.

[0095] Referring again to Figures 2 and 3, the orthographic projection of the pressure film 110 onto the gasket body 121 is located within the gasket body 121, that is, the pressure film 110 is recessed relative to the gasket body 121. This setting can reduce the degree to which the entire pressure film 110 slides relative to the drive back plate 220 during the pressing process.

[0096] It should be noted that in other embodiments, the orthographic projection of the pressure film 110 on the gasket body 121 may completely coincide with the gasket body 121, that is, the pressure film 110 and the gasket body 121 are the same size. Alternatively, the orthographic projection of the pressure film 110 on the gasket body 121 may extend beyond the gasket body 121, that is, the pressure film 110 may extend outward relative to the gasket body 121. Both of these arrangements are applicable to bonding a small number of light-emitting elements 210.

[0097] In one embodiment, the material of the pressure film 110 includes at least one of polytetrafluoroethylene, polyimide, and polyethylene terephthalate. The specific material can be set according to actual needs and is not limited here.

[0098] In one embodiment, the pressure pad 120 can be configured to simultaneously perform pressure bonding on multiple light-emitting elements 210 on multiple driving backplates 220. In this case, the orthographic projection of the pad body 121 on the stage 310 can simultaneously cover the orthographic projection of multiple driving backplates 220 on the stage 310. Thus, when the pressure bonding method shown in FIG2 is adopted, after completing one pressure bonding, it is only necessary to remove the driving backplate 220 from the stage 310, while the position of the pressure pad 120 on the stage 310 can remain unchanged, and the next pressure bonding can be performed directly thereafter.

[0099] In another embodiment, the pressure pad 120 can be configured to bond only one light-emitting element 210 on a driving backplate 220 at a time. In this case, the size of the pressure pad 120 matches the size of the driving backplate 220. In this embodiment, when the pressure pad 120 is damaged and replaced, the loss is small, thus reducing the cost.

[0100] In one embodiment, in order to ensure that multiple light-emitting elements 210 can be bonded to the driving backplate 220 and to ensure that the multiple light-emitting elements 210 are subjected to the same force as much as possible, referring to Figures 21 and 22, each light-emitting element 210 is configured to correspond to at least one protrusion 122, that is, the interval between two adjacent protrusions 122 is smaller than the interval between two adjacent light-emitting elements 210, that is, the orthographic projection of each light-emitting element 210 on the driving backplate 220 covers the orthographic projection of at least one protrusion 122 on the driving backplate 220.

[0101] In other embodiments, referring to Figures 2 and 3, the orthographic projection of the protrusion 122 on the drive back plate 220 may be positioned between the orthographic projections of two adjacent light-emitting elements 210 on the drive back plate 220, so as to ensure that each light-emitting element 210 is subjected to the same force during the bonding process.

[0102] In one embodiment, the distance from the protrusion 122 to the two adjacent light-emitting elements 210 is equal.

[0103] In one embodiment, a plurality of protrusions 122 are evenly spaced.

[0104] This application also protects a pressing device. Referring to Figures 2 and 3, the pressing device includes a display panel and a pressing fixture 100. The display panel includes a light-emitting element 210 and a driving back plate 220. When the light-emitting element 210 on the driving back plate 220 is pressed, the pressing film 110 is located on the side of the light-emitting surface of the light-emitting element 210 (away from the driving back plate 220), and the pressing pad 120 is located on the side of the pressing film 110 away from the light-emitting element 210 (driving back plate 220), and at least a portion of the protrusion 122 is embedded in the pressing film 110.

[0105] In one embodiment, the protrusion 122 is fully embedded in the pressure film 110, ensuring that a sufficiently large lateral fixing force / friction force is generated between the pressure film 110 and the pressure pad 120.

[0106] In another embodiment, the protrusion 122 is partially embedded in the pressure film 110. In this case, an air passage 111 can be formed between the pressure film 110 and the gasket body 121 on the outer side of the protrusion 122. The air passage 111 can discharge the gas between the pressure film 110 and the gasket body 121 during the pressure process, avoiding the inability to transmit pressure to the light-emitting element 210 due to the presence of gas between the pressure film 110 and the gasket body 121 during the pressure process, thereby affecting the bonding between the light-emitting element 210 and the driving backplate 220. In addition, after the pressure bonding is completed, the air passage 111 can also allow external gas to enter between the pressure film 110 and the gasket body 121, which is beneficial to the separation between the pressure film 110 and the gasket body 121.

[0107] In one embodiment, when there are multiple protrusions 122, during the pressing and bonding process, all protrusions 122 may be fully embedded in the pressing film 110, all protrusions 122 may be partially embedded in the pressing film 110, or a portion of the protrusions 122 may be fully embedded in the pressing film 110, while the remaining protrusions 122 may be partially embedded in the pressing film 110.

[0108] For details regarding the specific process of using the pressure jig 100 to press-bond the light-emitting element 210 onto the drive backplate 220, please refer to the relevant content mentioned above, which will not be described in detail here.

[0109] Referring again to Figures 2 and 3, in one embodiment, the orthographic projection of the drive backplate 220 on the pad body 121 is covered by the orthographic projection of the pressure film 110 on the pad body 121. That is, the orthographic projection of the drive backplate 220 on the pad body 121 coincides with the orthographic projection of the pressure film 110 on the pad body 121, or the orthographic projection of the drive backplate 220 on the pad body 121 is located within the orthographic projection of the pressure film 110 on the pad body 121. This arrangement can ensure that during the pressing and bonding process, the pressure film 110 contacts each light-emitting element 210 pre-fixed on the drive backplate 220, ensuring that each light-emitting element 210 can be pressed and bonded to the accurate position on the drive backplate 220. It should be noted that in other embodiments, the orthographic projection of the drive backplate 220 on the gasket body 121 may extend beyond the orthographic projection of the pressure film 110 on the gasket body 121, that is, the pressure film 110 may be recessed relative to the drive backplate 220. The specific choice can be made according to actual needs.

[0110] In one embodiment, it may be possible to simply have the portion of the drive backplate 220 located in the display area AA whose orthogonal projection on the pad body 121 is covered by the orthogonal projection of the pressure film 110 on the pad body 121.

[0111] Referring again to Figures 2 and 3, in one embodiment, the orthographic projection of the pressure film 110 onto the gasket body 121 is located within the gasket body 121, that is, the pressure film 110 is recessed relative to the gasket body 121. This arrangement can reduce the degree to which the entire pressure film 110 slides relative to the drive back plate 220 during the pressing process.

[0112] In one embodiment, referring to Figures 21 and 22, in order to ensure that multiple light-emitting elements 210 can be bonded to the driving backplate 220 and to ensure that the multiple light-emitting elements 210 are subjected to the same force as much as possible, each light-emitting element 210 is configured to correspond to at least one protrusion 122, that is, the interval between two adjacent protrusions 122 is smaller than the interval between two adjacent light-emitting elements 210, that is, the orthogonal projection of each light-emitting element 210 on the driving backplate 220 covers the orthogonal projection of at least one protrusion 122 on the driving backplate 220.

[0113] Referring to Figures 2 and 3, in another embodiment, the orthographic projection of the protrusion 122 on the drive back plate 220 may be positioned between the orthographic projections of two adjacent light-emitting elements 210 on the drive back plate 220. This arrangement also ensures that each light-emitting element 210 is subjected to the same force during the bonding process.

[0114] Referring to Figure 23, this application also protects a pressure system, which includes a stage 310 and a pressure fixture 100 as described in any of the above embodiments. For details regarding the specific structure of the pressure fixture 100, please refer to the relevant descriptions above, which will not be repeated here.

[0115] Referring again to FIG23, in one embodiment, the pressure system further includes an air pressure membrane 320. During the pressure bonding process, the light-emitting element 210 and the drive back plate 220 of the pressure fixture 100 are located between the stage 310 and the air pressure membrane 320. During the pressure bonding process, atmospheric pressure is applied to the air pressure membrane 320 to perform pressure bonding on the light-emitting element 210.

[0116] Specifically, when using the reverse pressure bonding method shown in Figure 23, atmospheric pressure is applied to the air pressure film 320, causing the back plate 220 to move toward the light-emitting element 210 under the action of the air pressure film 320, ultimately causing the two electrodes 211 of the light-emitting element 210 to pass through the bonding adhesive 230 and be electrically connected to the back plate 220; when using the positive pressure bonding method shown in Figure 24, atmospheric pressure is applied to the air pressure film 320, causing the light-emitting element 210 to move toward the back plate 220 under the action of the air pressure film 320, ultimately causing the two electrodes 211 of the light-emitting element 210 to pass through the bonding adhesive 230 and be electrically connected to the back plate 220.

[0117] In one embodiment, the material of the air pressure membrane 320 includes organic materials, such as at least one of PET (polyester resin) and PFA (fluoroplastic). This application does not impose specific limitations on the material of the air pressure membrane 320.

[0118] Referring to FIG24, in one embodiment, the pressing system further includes a support member 330, which is disposed on the stage 310 and on the periphery of the drive back plate 220; wherein, during the pressing process, when the light-emitting element 210 is located on the side of the drive back plate 220 away from the stage 310, the periphery of the pressing pad 120 and the periphery of the pressing film 110 are supported by the support member 330.

[0119] Specifically, when a positive pressure bonding method is used and the pressure pad 120 extends outward relative to the drive backplate 220, a support member 330 is used to support the pressure pad 120 and the pressure film 110 to prevent the portion of the pressure pad 120 extending beyond the drive backplate 220 from breaking. The thickness of the support member 330 is equal to or approximately equal to the thickness of the display panel. The material of the support member 330 can be metal or other materials such as silicone; this application does not limit the material of the support member 330.

[0120] Especially when the display panel is a narrow bezel display panel, the distance between the light-emitting element 210 and the outer edge of the driving back plate 220 is small. In order to bond each light-emitting element 210 to the driving back plate 220, the pressure pad 120 and the pressure film 110 are set to expand outward relative to the driving back plate 220. At this time, in order to support the pressure pad 120 and the pressure film 110, the support member 330 is used for support.

[0121] Referring to Figure 25, when the pressure pad 120 and the pressure film 110 do not need to expand outward relative to the driving back plate 220, the support member 330 is not required to support the pressure pad 120 and the pressure film 110. For example, when the bezel area of ​​the display panel is wide, the distance between the light-emitting element 210 and the outer edge of the driving back plate 220 is large, and in this case, the pressure pad 120 and the pressure film 110 do not need to expand outward relative to the driving back plate 220.

[0122] Referring again to Figures 23 to 25, in one embodiment, the pressing system further includes a first mold 340 and a second mold 350 that are capable of relative movement. The first mold 340 and the second mold 350 are used to enclose and form a receiving space 10 for accommodating the platform 310 and the pressing fixture 100. The first mold 340 is capable of moving relative to the second mold 350 to close or open the receiving space 10.

[0123] Specifically, during the bonding process, the bonding pad 120, the bonding film 110, and the display panel (including the driving backplate 220 and the light-emitting element 210) are placed between the stage 310 and the air pressure film 320. Then, the first mold 340 and the second mold 350 are driven to move relative to each other to close the accommodating space 10. Then, atmospheric pressure is input into the accommodating space 10 to make the air pressure film 320 move toward the stage 310, thereby bonding the light-emitting element 210 onto the driving backplate 220. After the bonding is completed, the first mold 340 moves away from the second mold 350 to open the accommodating space 10 so that the display panel can be removed.

[0124] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A self-bonding fixture for achieving self-bonding of a light-emitting element, comprising: This lamination film is configured to be located on the light-emitting surface side of the light-emitting element during the lamination process; This pressure pad is configured to be located on the side of the pressure film away from the light-emitting element during the pressing process. The pressure pad includes a pad body and a protrusion protruding from the surface of the pad body. During the pressing process, at least a portion of the protrusion is embedded in the pressing film.

2. The pressure fixture according to claim 1, wherein, The material of the gasket body includes at least one of inorganic materials, metals, and organic materials.

3. The pressure fixture according to claim 2, wherein, The material of the gasket body includes at least one of silicon, sapphire, glass, quartz, and silicon carbide.

4. The pressure fixture according to claim 1, wherein, The material of the gasket body is the same as that of the protrusion; And / or, the gasket body and the protrusion are integrally formed; And / or, the protrusions are block-shaped, strip-shaped, or needle-shaped.

5. The pressure fixture according to claim 1, wherein, The thickness of the protrusion is less than the thickness of the pressure film.

6. The pressure fixture according to claim 5, wherein, The thickness of the protrusion ranges from 0.1 to 50 micrometers.

7. The pressure fixture according to claim 1, wherein, The orthographic projection of the protrusion on the gasket body is rectangular, circular, semi-circular, annular, cross-shaped, or serpentine. And / or, the protrusion is rectangular, circular, trapezoidal, triangular or semi-circular in cross-section perpendicular to the gasket body.

8. The pressure fixture according to claim 1, wherein, The number of protrusions is multiple, and the multiple protrusions are spaced apart.

9. The pressure fixture according to claim 8, wherein, At least a portion of the protrusions are arranged along a first direction, wherein, during the bonding process, the two electrodes of the light-emitting element are arranged along the first direction.

10. The pressure fixture according to claim 9, wherein, The protrusions have a block-like structure, and multiple protrusions are arranged in multiple rows, with each row extending along the first direction.

11. The pressure fixture according to claim 10, wherein, The protrusions are arranged in a matrix, or the protrusions in adjacent rows are staggered.

12. The pressure fixture according to claim 1, wherein, The orthographic projection of the pressure film onto the gasket body is located within the gasket body; And / or, the material of the diaphragm includes at least one of polytetrafluoroethylene, polyimide, and polyethylene terephthalate.

13. The pressure fixture according to claim 1, wherein, The gasket body includes a first sub-body and a second sub-body that are independently and stacked, and the protrusion is disposed on the surface of the first sub-body.

14. The pressure fixture according to claim 13, wherein, The number of the second sub-entities is multiple.

15. A pressure device, comprising a display panel and a pressure fixture as described in any one of claims 1 to 14; The display panel includes a driving backplate and light-emitting elements. When the light-emitting elements on the driving backplate are pressed together, the pressing film is located on the side of the light-emitting elements away from the driving backplate, the pressing pad is located on the side of the pressing film away from the driving backplate, and at least a portion of the protrusion is embedded in the pressing film.

16. The pressure device according to claim 15, wherein, There are multiple light-emitting elements, which are spaced apart. There are also multiple protrusions, which are spaced apart. The orthographic projection of each light-emitting element on the driving back plate covers the orthographic projection of at least one protrusion on the driving back plate. Alternatively, the orthographic projection of the protrusion on the driving back plate is located between the orthographic projections of two adjacent light-emitting elements on the driving back plate.

17. The pressure device according to claim 16, wherein, The orthographic projection of the drive backplate onto the gasket body is covered by the orthographic projection of the pressure film onto the gasket body, and the orthographic projection of the pressure film onto the gasket body is located within the gasket body.

18. A local pressure system, comprising: The pressure fixture as described in any one of claims 1 to 14; A platform is used to support the aforementioned pressure fixture.

19. The pressure system according to claim 18, wherein, The pressure system also includes: During the pressure bonding process, the pressure bonding fixture, the light-emitting element, and the driving backplate are located between the stage and the pressure bonding membrane. During the pressure bonding process, atmospheric pressure is applied to the pressure bonding membrane to bond the light-emitting element.

20. The pressure system according to claim 19, wherein, The pressing system further includes a support member disposed on the platform and on the periphery of the drive back plate; wherein, during the pressing process, when the light-emitting element is located on the side of the drive back plate away from the platform, the periphery of the pressing pad and the periphery of the pressing film are supported by the support member. And / or, the pressing system further includes a first mold and a second mold, the first mold and the second mold together forming a receiving space for accommodating the platform and the pressing fixture, and the first mold is movable relative to the second mold to close or open the receiving space.

Images