Power device, system, method for producing a power device, and method for producing a system

Abstract

A power device (2) is specified, comprising at least one power semiconductor chip arranged on a mounting portion (4), a package body (6), for the at least one power semiconductor chip, with at least one recess (7) exposing at least one connection region (13), and at least one terminal connection structure (5) arranged within the at least one recess (7), wherein the at least one terminal connection structure (5) comprises an electrically insulating portion (8) and at least one electrically conductive portion (9), the electrically insulating portion (8) surrounds the at least one electrically conductive portion (9) in lateral directions, the at least one electrically conductive portion (9) comprises an opening (10) for receiving at least one terminal (15), and the at least one electrically conductive portion (9) is electrically conductively connected to the at least one connection region (13). Furthermore, a system, a method for producing a power device, and a method for producing a system are specified.

Description

[0001] P2024,0929 WO E / P240115WO01 December 11, 2024

[0002] 1

[0003] Description

[0004] POWER DEVICE, SYSTEM, METHOD FOR PRODUCING A POWER DEVICE, AND METHOD FOR PRODUCING A SYSTEM

[0005] The present disclosure relates to a power device, a system, a method for producing a power device, and a method for producing a system.

[0006] Typically, integration of vertically arranged terminals in a transfer molded power device is a complex challenge.

[0007] Embodiments of the disclosure relate to a power device which can be provided with vertically arranged terminals particular reliable and which is particularly easy to manufacture. Further embodiments relate to a system, and to a method for producing such a power device.

[0008] This is achieved by the subj ect-matter of the independent claims. Further embodiments are evident from the dependent claims and the following description.

[0009] A power device is described. The term "power" here and in the following refers, for example, to power semiconductor devices and / or power semiconductor chips adapted for processing voltages and currents of more than 100 V and / or more than 10 A, exemplarily voltages of up to 10 kv and electrical currents of up to 10 kA.

[0010] According to an embodiment, the power device comprises at least one power semiconductor chip arranged on a mounting portion. The power semiconductor chip comprises, for example, a semiconductor material such as at least one of silicon P2024,0929 WO E / P240115WO01 December 11, 2024

[0011] (Si), silicon carbide (SiC), and gallium nitride (GaN). The power semiconductor chip is, for example, a power diode and / or a power metal insulating semiconductor field-effect transistor, power MISFET for short. The term MISFET shall also include MOSFETs, which have an oxide as an insulating material at a gate. The power semiconductor chip may also be an insulated-gate bipolar transistor, IGBT, or a high electron mobility transistor, HEMT.

[0012] The mounting portion is, for example, part of a carrier, a lead frame, a die pad, a baseplate, an insulated metal substrate or a ceramic -based substrate of the power device. The mounting portion has, for example, a main extension plane. The main extension plane extends particularly in lateral directions. A vertical direction is oriented perpendicular to the lateral directions. Exemplarily, the power semiconductor chip has a main extension plane parallel to the lateral directions.

[0013] According to the embodiment, the power device comprises a package body for the at least one power semiconductor chip, having at least one recess exposing at least one connection region. The power semiconductor chip and / or the mounting portion is, for example, embedded in the package body.

[0014] " Embedded" means here and in the following that the package body is arranged at least partly on at least one outer surface of the power semiconductor chip and / or the mounting portion. For example, the power semiconductor chip is surrounded completely, e.g. three - dimensionally, by the package body and the mounting portion.

[0015] Exemplarily, the package body comprises or consists of an electrically insulating material. A length and / or a width in P2024,0929 WO E / P240115WO01 December 11, 2024

[0016] lateral directions of the package body is, for example, at least 10 mm or at least 20 mm and / or at most 100 mm. A height in the vertical direction of the package body is, for example, at least 2 mm.

[0017] Exemplarily, the connection region comprises an electrically conductive material and exemplarily comprises a metal or a metallic alloy. The connection region preferably comprises or consists of copper, aluminum, and / or a corresponding alloy, particularly a top surface of the connection region comprises the before mentioned materials. The connection region is, for example, electrically conductively connected to a contact portion of the power semiconductor device. The connection region can have an optional conductive coating such as a nickel, silver, and / or gold layer. Exemplarily, the connection region comprises at least one of a metal pattern of a substrate, a coated region e.g. of a carrier with a coating, a die pad and / or a terminal of a leadframe.

[0018] For example, the recess completely penetrates the package body in a vertical direction up to the connection region for exposing the connection region. " Exposing" means that at least a partial region of the connection region or the whole area of the connection region is not covered by the package body. In particular, the partial region of the connection region and the recess overlap in lateral directions in a top view.

[0019] For example, the package body comprises a plurality of recesses exposing a plurality of connection regions.

[0020] Exemplarily, a number of recesses and a number of connection regions are equal to one another. Each of the recesses exposes at least one of the connection regions, in particular P2024,0929 WO E / P240115WO01 December 11, 2024

[0021] exactly one of the connection regions, particularly a part thereof. At least one or at least some of the connection regions can be part of the mounting portion. Alternatively or additionally, at least one or at least some of the connection regions can be part of the semiconductor chip.

[0022] According to the embodiment, the power device comprises at least one terminal connection structure arranged within the at least one recess. Exemplarily, the connection region is configured to be connected to at least one terminal by the terminal connection structure. Exemplarily, the terminal connection structure comprises or consists partly of an electrically conductive material configured to provide an electrically conductive connection between the terminal and the connection region.

[0023] For example, the terminal connection structure is in direct contact with the package body, in particular with at least one side surface of the recess delimited by the package body.

[0024] Exemplarily, the terminal connection structure, particularly an electrically conductive portion thereof, is a socket for receiving a terminal.

[0025] According to the embodiment of the power device, the at least one terminal connection structure comprises an electrically insulating portion and at least one electrically conductive portion. Exemplarily, the electrically insulating portion comprises or consists of an electrically insulating material, and the electrically conductive portion comprises an electrically conductive material. P2024,0929 WO E / P240115WO01 December 11, 2024

[0026] Exemplarily, the electrically insulating material can comprise at least one of a plastic material, a resin material, e.g. a thermoplastic or a thermosetting resin material, and a ceramic insulator or another organic or inorganic insolating material. Exemplarily, the electrically conductive material can comprise at least one of copper, nickel, aluminum, silver, gold, or alloys thereof, e.g. a cooper alloy or an aluminum alloy. Exemplarily, a bulk material of the electrically conductive material can comprise or consist of copper or aluminum or a corresponding alloy. The bulk material can have an optional conductive coating such as a copper, nickel, silver, and / or gold layer.

[0027] For example, the electrically insulating portion has a first resistivity, and the electrically conductive portion has a second resistivity, wherein the first resistivity is at least 10 orders of magnitude higher than the second resistivity. Exemplarily, the first resistivity is at least 1010Ω·m, and / or the second resistivity is at least in the range of 10-8Ω·m.

[0028] For example, the electrically conductive portion is a pin holder or a hollow sleeve, in particular a socket.

[0029] Exemplarily, the pin holder has a mainly cylindrical shape extending to the connection region, or the pin holder has a holding portion and a connecting portion, which is fixed to the connection region.

[0030] According to the embodiment of the power device, the electrically insulating portion surrounds the at least one electrically conductive portion in lateral directions. For example, the electrically insulating portion is located in a peripheral region of the terminal connection structure P2024,0929 WO E / P240115WO01 December 11, 2024

[0031] surrounding a central region. For example, the electrically conductive portion is located in the central region.

[0032] Exemplarily, the electrically insulating portion is located between the electrically conductive portion and the package body, particularly as seen in cross - sectional views in lateral directions. For example, the electrically insulating portion is in direct contact with the package body, in particular with the side surface of the recess delimited by the package body.

[0033] In particular, a plurality of electrically conductive portions is surrounded by the electrically insulating portion for forming a common terminal connection structure. Each electrically conductive portion is, for example, spaced apart in lateral directions from the other electrically conductive portions, particularly by the electrically insulating portion.

[0034] According to the embodiment of the power device, the at least one electrically conductive portion comprises an opening for receiving at least one terminal. The opening penetrates the electrically conductive portion in the vertical direction, for example at least partly. At least one side surface of the opening extending in the vertical direction is delimited particularly by the electrically conductive portion. If the opening penetrates the electrically conductive portion in the vertical direction partly, a bottom surface of the opening extending in lateral directions is delimited particularly by the electrically conductive portion. If the opening penetrates the electrically conductive portion in the vertical direction completely, a bottom surface of the opening extending in lateral directions is delimited P2024,0929 WO E / P240115WO01 December 11, 2024

[0035] 7

[0036] particularly at least regionally by the connection region or a connection element.

[0037] Exemplarily, a diameter of the opening is at most 10 mm or at most 5 mm.

[0038] If the package body comprises a first number of recesses, at least some, particularly all, of the recesses comprise each one terminal connection structure. If one terminal connection structure comprises more than two electrically conductive portions being surrounded by the electrically insulating portion, a second number of the openings can be higher than the first number of recesses.

[0039] For example, the electrically conductive portion, e.g. being a pin holder, provides the opening on the top surface, particularly for receiving the terminal, which is, exemplarily, a simple pin terminal or which has, for example, a press - fit portion. The electrically conductive portion can thus be an open tube delimited by the connection region or the connection element, or a tube with the bottom surface delimited by the electrically conductive portion. For example, the pin holder has a cylindrical shape extending to the connection region, or the pin holder has a holding portion and a connection portion, which is fixed to the connection region.

[0040] According to the embodiment of the power device, the at least one electrically conductive portion is electrically conductively connected to the at least one connection region. P2024,0929 WO E / P240115WO01 December 11, 2024

[0041] Advantageously, with such a power device, a terminal connection structure or multiple terminal connection structure - each having a conductive porion being exemplarily a socket - are integrated into the package body. The terminal connection structure provides at least one opening on their top surface, such that terminals, particularly pin terminals, can be inserted similar to pin holders realized as hollow sleeves.

[0042] One terminal connection structure can incorporate one or more electrically conductive portions with corresponding openings, e.g. corresponding to pin holders. The electrically conductive portions are embedded particularly in the electrically insulating portion. Advantageously, the openings are working as female connectors for the terminals which are to be inserted in the terminal connection structure.

[0043] The use of the described terminal connection structure has particular advantages compared to a direct embedding of pin holders or hollow sleeves into the package body or to the use of a molded body with openings, where the terminals are mounted after molding, e.g. can be mounted to portions of the substrate, i. e. mounting portions, which are exposed by openings of the package body of the finished power package. In particular, this advantageously leads to a reduction of manufacturing steps, where single terminals or a complete building block can be mounted to the finished power package, which particularly results in a cost reduction on system level. This can be done exemplarily on a customer site during PCB assembly, e.g. a terminal arrangement can be customer specific. Further, the use of the terminal connection structure advantageously leads to a massive simplif ication of P2024,0929 WO E / P240115WO01 December 11, 2024

[0044] alignment features and of electrical testing, also leading to a cost reduction on system level.

[0045] Advantageously, such a power device provides an improved mechanical elasticity of the terminal connection structure e.g. preventing stress and consequently cracks in a comparably brittle package body.

[0046] According to a further embodiment of the power device, the package body comprises a first material and the electrically insulating portion of the terminal connection part comprises a second material different from the first material.

[0047] Exemplarily, a resin material being the first material is different from a resin material being the second material. This means that two resin materials are used that are different from one another.

[0048] According to a further embodiment of the power device, the first material has a first Young modulus and the second material has a second Youngs modulus being equal to or lower than the first Young modulus.

[0049] According to a further embodiment of the power device, the package body comprises a filler material. Exemplarily, the package body comprises a thermosetting resin or thermoplastic resin in which the filler material is incorporated, wherein the filler material comprises or consists of an inorganic filler like fibers, particles, or mesh. The package body with the filler material is, for example, produced by transfer molding or inj ection molding. P2024,0929 WO E / P240115WO01 December 11, 2024

[0050] 10

[0051] According to a further embodiment of the power device, the electrically insulating portion comprises a further filler material.

[0052] For example, the filler material and / or the further filler material comprise (s) fibers and / or particles or mesh. The filler material and / or the further filler material is / are, exemplarily, evenly distributed within the package body and / or the electrically insulating portion.

[0053] According to a further embodiment of the power device, the mounting portion comprises a circuit metallization layer and an insulating layer. The circuit metallization layer can comprise a plurality of parts. At least some of the parts of the circuit metallization layer are spaced apart from one another in lateral directions. At least some of the parts spaced apart from one another have no direct electrical connection. Exemplarily, the power semiconductor chip is arranged on a part of the circuit metallization layer. The circuit metallization layer can comprise a coating, e.g. of a noble metal like nickel, gold or silver.

[0054] According to a further embodiment of the power device, a partial region of the circuit metallization layer is exposed by the at least one recess of the package body for forming the at least one connection region. For example, the coating is formed solely on the connection region.

[0055] According to a further embodiment of the power device, a further partial region of the at least one power semiconductor chip is exposed by the at least one recess of the package body for forming the at least one connection region. P2024,0929 WO E / P240115WO01 December 11, 2024

[0056] According to a further embodiment of the power device, the at least one electrically conductive portion is connected to the at least one connection region by a connection element. In particular, the at least one terminal connection structure is connected to the connection region by a connection element. Exemplarily, the connection element comprises or consists of an electrically conductive material configured to provide an electrically conductive connection between the terminal connection structure, in particular the electrically conductive portion, and the connection region.

[0057] According to a further embodiment of the power device, the connection element is at least one of a glue connection, a solder connection and a sinter connection. For example, the glue connection is an electrically conductive glue, the solder connection comprises a solder material, and / or the sinter connection comprises a sinter material. The glue, the solder material and / or the sinter material is in particular directly arranged on the connection region and / or on the terminal.

[0058] Alternatively, the electrically conductive portion is connected to the connection region via welding such as resistive welding or laser welding.

[0059] According to a further embodiment of the power device, the at least one electrically conductive portion is directly electrically conductively connected to the at least one connection region. In particular, the electrically conductive portion is in direct contact to the connection region, e.g. by welding. P2024,0929 WO E / P240115WO01 December 11, 2024

[0060] - 12 -

[0061] According to a further embodiment of the power device, the at least one electrically conductive portion comprises at least one connection structure. The connection structure is configured to establish the connection to the connection region, particularly to the connection element, and / or to the electrically insulating portion, and / or to the terminal to be connected to the electrically conductive portion.

[0062] For example, the connection structure of the electrically conductive portion can have a cut-out or a protrusion.

[0063] Exemplarily, the connection of the electrically conductive portion to the electrically insulating portion can be improved.

[0064] Exemplarily, the electrically insulating portion can have a further connection structure, for mechanically stably connecting the electrically insulating portion to the package body. For example, the further connection structure can have a further cut-out or a further protrusion. Exemplarily, the connection of the electrically insulating portion to the package body can be improved.

[0065] Exemplarily, the connection element is a glue connection, an elastic connection, a solder connection or a press-fit connector, when the connection structure is configured to establish the connection to the terminal to be connected to the electrically conductive portion.

[0066] For example, the glue connection is an electrically conductive glue, and / or the solder connection comprises a solder material. The glue and / or the solder material is in particular directly arranged on the electrically conductive portion and / or on the terminal to be connected to the P2024,0929 WO E / P240115WO01 December 11, 2024

[0067] 13

[0068] electrically conductive portion. Exemplarily, the elastic connection is a spring. For example, the press-fit connector is a counterpart for the press-fit portion of the terminal to be connected to the electrically conductive portion.

[0069] Alternatively, the terminal is connected to the electrically conductive portion via welding such as resistive welding or laser welding.

[0070] According to a further embodiment of the power device, the package body and the at least one terminal connection structure terminate flush with one another in the vertical direction. In particular, a top surface of the package body, a top surface of the terminal connection structure, particularly including a top surface of the electrically conductive portion and a top surface of the electrically insulating portion, extend within a common plane in lateral directions.

[0071] According to a further embodiment of the power device, a top surface of the package body protrudes beyond a top surface of the at least one terminal connection structure in the vertical direction, in particular in the direction facing away from the mounting portion.

[0072] It is possible that when the top surface of the package body protrudes beyond the top surface of the at least one terminal connection structure in the vertical direction, in particular in the direction facing or facing away from the mounting portion, the top surface of the electrically insulating portion can terminate flush with the electrically conductive portion. P2024,0929 WO E / P240115WO01 December 11, 2024

[0073] 14

[0074] According to a further embodiment of the power device, a top surface of the at least one terminal connection structure protrudes beyond a top surface of the package body in the vertical direction, in particular in the direction facing away from the mounting portion.

[0075] According to a further embodiment of the power device, a top surface of the electrically insulating portion protrudes beyond a top surface of the at least one electrically conductive portion in the vertical direction, in particular in the direction facing away from the mounting portion.

[0076] According to a further embodiment of the power device, a top surface of the at least one electrically conductive portion protrudes beyond a top surface of the electrically insulating portion in the vertical direction, in particular in the direction facing away from the mounting portion.

[0077] It is possible that when the top surface of the electrically insulating portion protrudes beyond the top surface of the at least one electrically conductive portion in the vertical direction, in particular in the direction facing away from the mounting portion, the top surface of the electrically insulating portion protrudes beyond the top surface of the package body in the vertical direction, in particular in the direction facing or facing away from the mounting portion, and the top surface of the electrically conductive portion protrudes beyond the top surface of the package body in the vertical direction, in particular in the direction facing or facing away from the mounting portion, or terminates flush with the top surface of the package body. P2024,0929 WO E / P240115WO01 December 11, 2024

[0078] 15

[0079] It is possible that when the top surface of the electrically conductive portion protrudes beyond the top surface of the at least one electrically insulating portion in the vertical direction, in particular in the direction facing or facing away from the mounting portion, the top surface of the electrically conductive portion protrudes beyond the top surface of the package body in the vertical direction, in particular in the direction facing or facing away from the mounting portion, and the top surface of the electrically insulating portion protrudes beyond the top surface of the package body in the vertical direction, in particular in the direction facing or facing away from the mounting portion, or terminates flush with the top surface of the package body.

[0080] The embodiments regarding relative positions of the top surfaces of the electrically conductive portion, the electrically insulating portion and the package body are exemplary and any combinations can be realized.

[0081] According to a further embodiment of the power device, the at least one terminal connection structure comprises at least two electrically conductive portions, and the at least two electrically conductive portions are spaced apart from one another in lateral directions by the electrically insulating portion.

[0082] According to a further embodiment, the power device comprises at least two terminal connection structures, and the at least two terminal connection structures are spaced apart from one another in lateral directions by the package body.

[0083] A further embodiment relates to a system, in particular comprising a power device as described herein above. P2024,0929 WO E / P240115WO01 December 11, 2024

[0084] - 16 -

[0085] Therefore, the features as described in connection with the system are also applicable to the power device and vice versa.

[0086] According to the embodiment, the system comprises a power device described herein above.

[0087] According to the embodiment, the system comprises a terminal arrangement comprising at least one terminal. The terminal has, for example, the form of a pin. Exemplarily, the terminal has a cylindrical shape, a conical shape, or a tapered shape. Exemplarily, the terminal has a diameter in lateral directions of at least 0.1 mm to at most 5 mm.

[0088] The terminal exemplarily comprises or consists of an electrically conductive material, such as a metal such as copper, aluminum, nickel, silver and / or gold, in particular alloys thereof. Exemplarily, the terminal can have a coating comprising or consisting of a further electrically conductive material covering the electrically conductive material.

[0089] Exemplarily, the coating comprises or consists of nickel, silver and / or gold.

[0090] According to the embodiment of the system, the at least one terminal extends mainly perpendicular to a main extension plane of the power device. Exemplarily, the terminal has a main extension direction being parallel to the vertical direction.

[0091] According to the embodiment of the system, the at least one terminal is arranged in the opening of the at least one electrically conductive portion. Exemplarily, the terminal has a top part facing away from the recess, an intermediate P2024,0929 WO E / P240115WO01 December 11, 2024

[0092] 17

[0093] part, and a bottom part arranged in the recess. In particular, the intermediate part is arranged in the vertical direction between the top part and the bottom part. The bottom part is configured to be electrically connected to the electrically conductive portion. In particular, the bottom part is inserted in the opening.

[0094] Exemplarily, the terminal is fixed in the opening by a press-fit portion, particularly located in the bottom part.

[0095] According to the embodiment of the system, the terminal arrangement comprises a connection board, wherein the at least one terminal is arranged on the connection board.

[0096] Exemplarily, the connection board has a main extension direction parallel to the lateral directions. The connection board is particularly spaced apart from the package body in the vertical direction.

[0097] Exemplarily, the top part of the terminal is connected to the connection board. The connection board is, for example, formed of a printed circuit board.

[0098] According to the embodiment of the system, the terminal arrangement comprises an intermediate board, wherein the intermediate board is arranged between the connection board and the power device. For example, the intermediate board has a main extension plane extending parallel to the main extension plane of the connection board.

[0099] For example, the intermediate board is arranged downstream of the connection board. In particular, the intermediate board is spaced apart from the connection board in the vertical direction. For example, the terminal is connected to the P2024,0929 WO E / P240115WO01 December 11, 2024

[0100] 18

[0101] intermediate board in an electrically conductive or electrically insulated manner, and / or in a mechanically stable manner. If there is more than one terminal, one of the terminals can be connected to the intermediate board in an electrically conductive or electrically insulated manner and in a mechanically stable manner and another one of the terminals can be connected to the intermediate board in an electrically insulated or electrically conductive manner and not in a mechanically stable manner.

[0102] The intermediate board comprises, for example, at least one further opening. Exemplarily, the terminal extends through the at least one further opening in the vertical direction. In particular, the terminal can extend through the further opening with or without being in electrical contact with the intermediate board. For example, in plan view along the vertical direction, the opening and the further opening overlap in lateral directions. For example, the intermediate board comprises horizontal connections, and some of the terminals can only extend between the connection board and the intermediate board and / or between the intermediate board and the package body. At least some of the terminals can be electrically connected by at least one of the horizontal connections.

[0103] In particular, the top part and the bottom part protrude beyond the intermediate board in vertical directions on opposite sides, whereas the intermediate part is arranged in the further opening.

[0104] Exemplarily, the intermediate board being an auxiliary connection board is formed of a further printed circuit board. P2024,0929 WO E / P240115WO01 December 11, 2024

[0105] - 19 -

[0106] According to the embodiment of the system, the terminal arrangement comprises a molded block, wherein the at least one terminal is arranged in the molded block. Exemplarily, the molded block, has a main extension plane parallel to the lateral directions. In particular, the terminal, particular the intermediate part thereof, is embedded in the molded block. Exemplarily, the connection board and / or the intermediate board are formed of or comprise a molded block.

[0107] The molded block has, for example, at least one further recess. Exemplarily, the molded block comprises or consists of an electrically insulating material like a thermosetting or thermoplastic resin. The electrically insulating can comprise a filler. For example, the further recess completely penetrates the molded block in the vertical direction. For example, the terminal extends through the further recess.

[0108] For example, the molded block comprises horizontal connections, and some of the terminals can only extend between the connection board and the molded block and / or between the molded block and the package body. At least some of the terminals can be electrically connected by at least one of the horizontal connections.

[0109] Exemplarily, the intermediate board is a molded block or the terminal arrangement solely comprises the molded block.

[0110] A further embodiment relates to a method for producing a power device, in particular a power device as described herein above. Therefore, the features as described in connection with the method are also applicable to the power device and vice versa. P2024,0929 WO E / P240115WO01 December 11, 2024

[0111] According to the embodiment of the method, at least one power semiconductor chip arranged on a mounting portion is provided, wherein the power semiconductor chip and / or the mounting portion comprise (s) at least one connection region.

[0112] According to the embodiment of the method, at least one terminal connection structure is provided, comprising an electrically insulating portion and at least one electrically conductive portion, wherein the electrically insulating portion surrounds the at least one electrically conductive portion in lateral directions, and the at least one electrically conductive portion comprises an opening for receiving at least one terminal.

[0113] According to the embodiment of the method, the at least one terminal connection structure is electrically conductively connected to the at least one connection region.

[0114] According to the embodiment of the method, a package body is applied on the at least one power semiconductor chip, the mounting portion and the at least one terminal connection structure, such that the at least one terminal connection structure is arranged within at least one recess of the package body.

[0115] Exemplarily, the method is performed in the order indicated.

[0116] A further embodiment relates to a method for producing a system, in particular comprising the power device as described herein above. Therefore, the features as described in connection with the method are also applicable to the P2024,0929 WO E / P240115WO01 December 11, 2024

[0117] 21

[0118] method for producing the power device and the power device and vice versa.

[0119] According to the embodiment of the method for producing the system, the power device according to claim 17 is provided, in particular produced.

[0120] According to the embodiment of the method for producing the system, a terminal arrangement comprising at least one terminal is provided.

[0121] According to the embodiment of the method for producing the system, the terminal arrangement is arranged on the power device, such that the at least one terminal is arranged in the opening of the at least one electrically conductive portion.

[0122] If the terminal arrangement comprises multiple single terminals, e.g. pin terminals, the terminals can be inserted one after the other into the openings of the terminal connection structure. Alternatively, the terminal arrangement comprises multiple terminals, collectively provided on the connection board or the molded block, and the terminals can be inserted together into the openings of the terminal connection structure.

[0123] The accompanying Figure is included to provide a further understanding. It is to be understood that the embodiment shown in the Figure is an illustrative representation and is not necessarily drawn to scale. P2024,0929 WO E / P240115WO01 December 11, 2024

[0124] 22

[0125] Figure 1 is a schematic view of a system to be produced, comprising a power device according to an exemplary embodiment.

[0126] According to the exemplary embodiment of Figure 1, a system 1 is described, comprising a power device 2 on which a terminal arrangement 3 is arranged.

[0127] The terminal arrangement 3 comprises a connection board 16 to which terminals 15 are electrically conductively connected. The connection board 16 extends in a main extension plane, e.g. defining lateral directions, and the terminals 15 each extend perpendicular to the main extension plane, e.g. in a vertical direction. The connection board 16 is, for example, a printed circuit board, particularly configured as a control board with vertically arranged terminals 15.

[0128] Advantageously, such a terminal arrangement 3 can be preassembled according to customer-specific needs, in particular according to customer-specific connection boards 16, therefore reducing alignment issues.

[0129] The terminal arrangement 3 further comprises an intermediate board 17, wherein the intermediate board 17 has a main extension plane extending parallel to the main extension plane of the connection board 16. The intermediate board 17 comprises further openings, wherein the terminals 15 extend through the further openings in the vertical direction.

[0130] The power device 2 comprises at least one power semiconductor chip arranged on a mounting portion 4, wherein the semiconductor chip is not shown in the Figure for better representability. The mounting portion 4 comprises a circuit P2024,0929 WO E / P240115WO01 December 11, 2024

[0131] 23

[0132] metallization layer 11 and an insulating layer 12, wherein partial regions of the circuit metallization layer 11 are formed as connection regions 13.

[0133] The at least one power semiconductor chip is covered by a package body 6, wherein the package body 6 has recesses 7. In each recess 7, a terminal connection structure 5 is arranged. Each terminal connection structure 5 comprises an electrically insulating portion 8 and at least one electrically conductive portion 9. The terminal connection structure 5 shown on the right side of the power device 2 comprises one electrically conductive portion 9, and the terminal connection structure 5 shown on the left side of the power device 2 comprises two electrically conductive portions 9, particularly incorporated in a common electrically isolating portion.

[0134] In all the terminal connection structures 5, the electrically insulating portion 8 surrounds at least one electrically conductive portion 9, particular one electrically conductive portion 9 on the right hand side and two portions 9 on the right hand side, respectively, in lateral directions. Each electrically conductive portion 9 comprises an opening 10 for receiving a respective terminal 15, and each electrically conductive portion 9 is electrically conductively connected to a respective connection region 13 by a connection element 14.

[0135] In particular, each electrically conductive portion 9 with a corresponding opening 10 forms a socket for receiving a respective terminal 15. P2024,0929 WO E / P240115WO01 December 11, 2024

[0136] 24

[0137] The terminal arrangement 3 can be moved towards the package body 6, e.g. along the vertical direction, such that each of the terminals 15 is arranged in a respective opening 10 of the electrically conductive portion 9, such that each terminal 15 is electrically connected to a respective connection region 13. The terminals 15 can be electrically connected to a respective connection region 13 by the electrically conductive portion 9 and the connection element 14. The connection elements 14 can be equal to or different from one another.

[0138] The package body 6 can be formed of a molded resin body with a size in lateral directions of up to 80 x 80 mm2, inclusive, in the case of being a single-phase package, which is typically prepared from a thermosetting resin by a transfer molding process. If the package body 6 is used for a larger system, the package body 6 may be even larger.

[0139] Thus, according to this exemplarily embodiment, the terminal arrangement 3 is characteristic of a plug- in connector with several connection pins, i. e. terminals 15.

[0140] The exemplary embodiment and the embodiments, in particular features of the exemplary embodiment and the embodiments, of the Figure and the specification can be combined with one another. P2024,0929 WO E / P240115WO01 December 11, 2024

[0141] 25

[0142] Reference Signs

[0143] 1 system

[0144] 2 power device

[0145] 3 terminal arrangement

[0146] 4 mounting portion

[0147] 5 terminal connection structure 6 package body

[0148] 7 recess

[0149] 8 electrically insulating portion 9 electrically conductive portion 10 opening

[0150] 11 circuit metallization layer

[0151] 12 insulating layer

[0152] 13 connection region

[0153] 14 connection element

[0154] 15 terminal

[0155] 16 connection board

[0156] 17 intermediate board

Claims

P2024,0929 WO E / P240115WO01 December 11, 2024Claims1. Power device (2) comprising- at least one power semiconductor chip arranged on a mounting portion (4),- a package body (6), for the at least one power semiconductor chip, having at least one recess (7) exposing at least one connection region (13 ), and- at least one terminal connection structure (5) arranged within the at least one recess (7), wherein- the at least one terminal connection structure (5 ) comprises an electrically insulating portion (8) and at least one electrically conductive portion (9 ),- the electrically insulating portion (8) surrounds the at least one electrically conductive portion (9 ) in lateral directions,- the at least one electrically conductive portion (9 ) comprises an opening (10) for receiving at least one terminal (15 ), and- the at least one electrically conductive portion (9 ) is electrically conductively connected to the at least one connection region (13 ).

2. Power device (2) according to claim 1, wherein- the package body (6) comprises a first material and the electrically insulating portion (8) comprises a second material different from the first material.

3. Power device (2) according to claim 2, wherein- the first material has a first Young modulus and the second material has a second Youngs modulus being equal to or lower than the first Young modulus.P2024,0929 WO E / P240115WO01 December 11, 20244. Power device (2) according to one of claims 1 to 3, wherein- the package body (6) comprises a filler material, and / or - the electrically insulating portion (8) comprises a further filler material.

5. Power device (2) according to one of claims 1 to 4, wherein- the mounting portion (4) comprises a circuit metallization layer (11) and an insulating layer (12), and- a partial region of the circuit metallization layer (11) is exposed by the at least one recess (7) of the package body (6) for forming the at least one connection region (13 ), and / or- a further partial region of the at least one power semiconductor chip is exposed by the at least one recess (7) of the package body (6) for forming the at least one connection region (13 ).

6. Power device (2) according to one of claims 1 to 5, wherein- the at least one electrically conductive portion (9 ) is connected to the at least one connection region (13 ) by a connection element (14), and- the connection element (14) is at least one of a glue connection, a solder connection, and a sinter connection, or - the at least one electrically conductive portion (9 ) is directly electrically conductively connected to the at least one connection region (13 ).

7. Power device (2) according to one of claims 1 to 6, whereinP2024,0929 WO E / P240115WO01 December 11, 202428- the at least one electrically conductive portion (9 ) comprises at least one connection structure.

8. Power device (2) according to one of claims 1 to 7, wherein- the package body (6) and the at least one terminal connection structure (5) terminate flush with one another in a vertical direction.

9. Power device (2) according to one of claims 1 to 8, wherein- a top surface of the package body (6) protrudes beyond a top surface of the at least one terminal connection structure (5) in the vertical direction, or- a top surface of the at least one terminal connection structure (5) protrudes beyond a top surface of the package body (6) in the vertical direction.

10. Power device (2) according to one of claims 1 to 9, wherein- a top surface of the electrically insulating portion (8) protrudes beyond a top surface of the at least one electrically conductive portion (9 ) in the vertical direction, or- a top surface of the at least one electrically conductive portion (9 ) protrudes beyond a top surface of the electrically insulating portion (8) in the vertical direction.

11. Power device (2) according to one of claims 1 to 10, whereinP2024,0929 WO E / P240115WO01 December 11, 2024- 29 -- the at least one terminal connection structure (5 ) comprises at least two electrically conductive portions (9 ), and- the at least two electrically conductive portions (9 ) are spaced apart from one another in lateral directions by the electrically insulating portion (8).

12. Power device (2) according to one of claims 1 to 11, wherein- the power device (2) comprises at least two terminal connection structures (5), and- the at least two terminal connection structures ( 5) are spaced apart from one another in lateral directions by the package body (6).

13. System (1) comprising- a power device (2) according to any one of claims 1 to 12, and- a terminal arrangement (3 ) comprising- at least one terminal (15), wherein- the at least one terminal (15) extends perpendicular to a main extension plane of the power device (2), and- the at least one terminal (15) is arranged in the opening (10) of the at least one electrically conductive portion (9 ).

14. System (1) according to claim 13, wherein the terminal arrangement (3 ) comprises- a connection board (16), wherein- the at least one terminal (15) is arranged on the connection board (16).

15. System (1) according to claim 14, wherein the terminal arrangement (3 ) further comprisesP2024,0929 WO E / P240115WO01 December 11, 202430- an intermediate board (17), and- the intermediate board (17) is arranged between the connection board (16) and the power device (2).

16. System (1) according to claim 13, wherein the terminal arrangement (3 ) comprises- a molded block, and- the at least one terminal (15) is arranged in the molded block.

17. Method for producing a power device (2), comprising:- providing at least one power semiconductor chip arranged on a mounting portion (4), wherein the power semiconductor chip and / or the mounting portion (4) comprise (s) at least one connection region (13 ),- providing at least one terminal connection structure (5) comprising an electrically insulating portion (8) and at least one electrically conductive portion (9 ), wherein the electrically insulating portion (8) surrounds the at least one electrically conductive portion (9 ) in lateral directions, and the at least one electrically conductive portion (9 ) comprises an opening (10) for receiving at least one terminal (15),- electrically conductively connecting the at least one terminal connection structure (5) to the at least one connection region (13 ), and- applying a package body (6) on the at least one power semiconductor chip, the mounting portion (4) and the at least one terminal connection structure (5), such that- the at least one terminal connection structure (5 ) is arranged within at least one recess (7) of the package body (6).P2024,0929 WO E / P240115WO01 December 11, 20243118. Method for producing a system (1), comprising:- providing the power device (2) according to claim 17,- providing a terminal arrangement (3 ) comprising at least one terminal (15), and- arranging the terminal arrangement (3 ) on the power device (2 ), such that- the at least one terminal (15) is arranged in the opening (10) of the at least one electrically conductive portion (9 ).

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