Laser drilling device for processing a substrate for an electrochemical cell, method for processing a substrate for an electrochemical cell, and substrate for an electrochemical cell
The laser drilling device with dual deflection units and pulsed operation enhances efficiency and precision in electrochemical cell substrate processing by ensuring high energy input at drilling points and minimal energy between points, thereby increasing the drilling rate.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- ROBERT BOSCH GMBH
- Filing Date
- 2025-12-09
- Publication Date
- 2026-06-18
AI Technical Summary
Existing laser drilling devices for electrochemical cell substrates lack efficiency and precision in processing, particularly in creating precise and efficient drilling patterns.
A laser drilling device employing a first and second deflection unit to alternately and oppositely deflect a laser beam in different directions, combined with pulsed operation, to achieve precise and efficient drilling by ensuring high energy input at drilling points and minimal energy between points.
Enables more efficient and precise laser guidance, significantly increasing the drilling rate and processing speed.
Smart Images
Figure EP2025085988_18062026_PF_FP_ABST
Abstract
Description
[0001] R. 416915
[0002] -1 -
[0003] Description
[0004] title
[0005] Laser drilling device for processing a substrate for an electrochemical cell, method for processing a substrate for an electrochemical cell, and substrate for an electrochemical cell
[0006] The present invention relates to a laser drilling device for processing a substrate for an electrochemical cell, and to a method for processing a substrate for an electrochemical cell using a laser drilling device comprising a laser unit which is designed to generate a laser beam for processing the substrate. The invention also relates to a substrate for an electrochemical cell which has been processed using such a laser drilling device and / or using such a method.
[0007] State of the art
[0008] Laser drilling devices for processing substrates for electrochemical cells are known.
[0009] Disclosure of the invention
[0010] The present laser drilling device with the features of the main claim is advantageously characterized by a first deflection unit, which is provided for causing a first deflection of the laser beam in a first deflection direction with respect to a surface of the substrate, and a second deflection unit, which is provided for causing a second deflection of the laser beam in a second deflection direction with respect to the same surface of the substrate, wherein the second deflection unit can be operated such that in at least one, in particular a first, time interval the second deflection direction is opposite to the first deflection direction and in at least one, R. 416915
[0011] -2- especially the second period, the second direction of deflection parallel to the first
[0012] The direction of deflection is
[0013] In this context, a "substrate for an electrochemical cell" can preferably be understood to mean a substrate intended for use in a fuel cell. Alternatively, the substrate can also preferably be intended for use in an electrolyte cell. The substrate is particularly preferably used in a solid oxide fuel cell. Preferably, the substrate for an electrochemical cell is designed as a sheet. Furthermore, other materials that would appear suitable to a person skilled in the art are also conceivable.
[0014] Within the scope of the invention, the phrase "the second direction of deflection is opposite to the first direction of deflection" can be understood to mean, in particular, that the second direction of deflection, preferably the vector of the second deflection, is oriented opposite to the first direction of deflection, preferably to the vector of the first deflection. In particular, the second direction of deflection and the first direction of deflection, preferably the vector of the second deflection and the vector of the first deflection, can be oriented parallel to each other.
[0015] Within the scope of the invention, the phrase "the second deflection direction is in the same direction as the first deflection direction" can be understood to mean, in particular, that the second deflection direction, preferably the vector of the second deflection, is oriented in the same direction as the first deflection direction, preferably the vector of the first deflection. In particular, the second deflection direction and the first deflection direction, preferably the vector of the second deflection and the vector of the first deflection, can be oriented parallel to each other.
[0016] Within the scope of the present invention, the term "provided for" can be understood to mean, in particular, specifically designed, programmed, configured, and / or equipped. The fact that an object is provided for a specific function is understood to mean, in particular, that the object fulfills and / or performs this specific function in at least one application and / or operating state, or that the object fulfills and / or performs this specific function in at least one application and / or operating state.
[0017] Advantageous embodiments of the laser drilling device according to the main claim are possible due to the features listed in the dependent claims. For example, it is advantageous if R. 416915
[0018] -3- the first deflection unit is a galvo scanner or a movable support for the substrate.
[0019] It is also advantageous if the second deflection unit is an optical deflector, in particular an acoustic-optical deflector or an electro-optical deflector.
[0020] The present method for processing a substrate for an electrochemical cell has the advantage that a first deflection of the laser beam in a first direction is caused by means of a first deflection unit, with respect to a surface of the substrate, and a second deflection of the laser beam in a second direction is caused by means of a second deflection unit, with respect to the same surface of the substrate, wherein the second deflection unit is operated such that in at least one, in particular a first, time interval the second deflection direction is opposite to the first deflection direction and in at least one, in particular a second, time interval the second deflection direction is in the same direction as the first deflection direction.
[0021] Advantageous further developments of the method are possible through the features listed in the dependent claims. For example, it is advantageous if the second deflection direction is reversed relative to the first deflection direction alternately in different, particularly regular, time intervals, preferably after each completed first time interval and after each completed second time interval.
[0022] It is also advantageous if the first deflection unit is operated in such a way that the first deflection of the laser light in the first deflection direction is continuous.
[0023] It is also advantageous if the second deflection unit is operated in such a way that the second deflection of the laser light occurs abruptly, particularly in the at least one, especially the second, time period in which the second deflection direction is opposite to the first deflection direction.
[0024] It is particularly advantageous if the laser unit is operated in pulsed mode, in particular if it generates a pulsed laser beam, and the second deflection unit is operated such that the at least one, in particular the first, time interval in which the second deflection direction is opposite to the first deflection direction corresponds to a time interval in which the laser beam, in particular at least one pulse, preferably a single pulse or a plurality of pulses, of the laser beam strikes the substrate. R. 416915
[0025] -4-
[0026] It is also particularly advantageous if the laser unit is operated in pulsed mode, in particular if it generates a pulsed laser beam, and the second deflection unit is operated in such a way that the at least one, in particular second, time period in which the second deflection direction is in the same direction as the first deflection direction corresponds to a time period in which the laser beam does not, in particular no pulse of the laser beam, hit the substrate.
[0027] The laser drilling device and the previously described method for processing a substrate for an electrochemical cell enable more efficient substrate processing. In particular, the laser guidance can be more precise and therefore faster. A significant increase in the drilling rate is especially advantageous.
[0028] Drawings
[0029] The drawings schematically illustrate exemplary embodiments of the invention, which are explained in more detail in the following description. They show
[0030] Fig. 1 shows a schematic representation of an embodiment of a laser drilling device for processing a substrate for an electrochemical cell,
[0031] Fig. 2 is an exemplary, schematic representation to illustrate a deflection resulting from a superposition of a first deflection and a second deflection, with respect to a surface of the substrate.
[0032] Description of the exemplary implementations
[0033] Figure 1 shows a schematic representation of an embodiment of a laser drilling device 10 for processing a substrate 12 for an electrochemical cell. The laser drilling device 10 comprises a laser unit 14, which is designed to generate a laser beam 16, in the shown case a pulsed laser beam 18, for processing the substrate 12. R. 416915
[0034] -5-
[0035] The laser drilling device 10 is characterized by a first deflection unit 20, which is intended to cause a first deflection Xi of the laser beam 16, or of the pulsed laser beam 18, in a first deflection direction with respect to a surface 22 of the substrate 12, and a second deflection unit 24, which is intended to cause a second deflection X2 of the laser beam 16, or of the pulsed laser beam 18, in a second deflection direction with respect to the same surface 22 of the substrate 12.
[0036] In the illustrated embodiment, the second deflection unit 24 can be operated in such a way that in at least one, in the illustrated case first, time period Ati the second deflection direction is opposite to the first deflection direction and in at least one, in the illustrated case second, time period At2 the second deflection direction is in the same direction as the first deflection direction.
[0037] In the illustrated embodiment, the first deflection unit 20 is a galvo scanner 26. Alternatively, it would also be possible for the first deflection unit 20 to be a movable holder for the substrate 12.
[0038] In the illustrated embodiment, the second deflection unit 24 is an optical deflector 28. In the illustrated case, the optical deflector is an acoustic-optical deflector 30. Alternatively, it would also be possible for the optical deflector 28 to be an electro-optical deflector.
[0039] In the illustrated embodiment, the laser drilling device 10 is operated such that the first deflection Xi of the laser beam 16, or the pulsed laser beam 18, is generated in the first deflection direction by means of the first deflection unit 20, with respect to the surface 22 of the substrate 12, and the second deflection X2 of the laser beam 16, or the pulsed laser beam 18, is generated in the second deflection direction by means of the second deflection unit 24, with respect to the same surface 22 of the substrate 12. With respect to said surface 22 of the substrate 12, the first deflection Xi and the second deflection X2 superimpose to form a resultant deflection xi,2.
[0040] Figure 2 shows an exemplary schematic representation to illustrate the deflection xi,2 resulting from the superposition of the first deflection Xi and the second deflection X2, with respect to a surface 22 of the substrate 12. The upper left diagram R. 416915
[0041] Figure 6 schematically shows the first deflection Xi over time t, while the lower, left diagram schematically shows the deflection X2 over time t. The right diagram schematically shows the deflection xi,2 resulting from the superposition of the first deflection Xi and the second deflection X2, while to the right of it, to illustrate the resulting deflection xi,2, a contrasting schematic representation of a top view of the substrate 12 onto the surface 22 with corresponding drill positions 32 is shown.
[0042] As shown in Fig. 2, in the illustrated embodiment the second deflection unit 22 is operated such that in the, in this case first, time period Ati, in a plurality of, in this case first, time periods Ati, the second deflection direction is opposite to the first deflection direction and in the, in this case second, time period At2, in this case in a plurality of, in this case second, time periods Ati, the second deflection direction is in the same direction as the first deflection direction.
[0043] Furthermore, in the illustrated embodiment, the second deflection unit 24 is operated in such a way that the second deflection direction is reversed after different, in particular regular, time intervals Ati and At2, alternately, in the illustrated case after each time interval Ati and At2, in the present case after each first time interval Ati and after each second time interval At2.
[0044] In the case shown, the first deflection Xi and the second deflection X2 superimpose in the first time interval Ati, or in each of the first time intervals Ati in which the second deflection direction is opposite to the first deflection direction, such that they result in a relative deflection Xi,2 that remains at least substantially unchanged. Thus, the laser beam 16, or the pulsed laser beam 18, strikes the substrate 12 at least at a point within this first time interval Ati, or in each of the first time intervals Ati. During this first time interval Ati, or in each of the first time intervals Ati, a high energy input at the substrate 12 is enabled, which in turn creates a point-like recess in the substrate 12. The points where the laser beam 16, orThe pulsed laser beam 18, which strikes the substrate 12 at least essentially at a point, can be understood as drilling positions 32 with respect to the surface 22 of the substrate 12. R. 416915.
[0045] -7-
[0046] In contrast, in the case shown, the first deflection Xi and the second deflection X2 superimpose in the second time interval At2, or in each of the second time intervals At2 in which the second deflection direction is aligned with the first deflection direction, such that they result in a relative deflection Xi,2 that changes at least substantially to a maximum extent. Thus, the laser beam 16, or the pulsed laser beam 18, does not strike the substrate 12 at a point within this second time interval At2, or in each of the second time intervals At2, at least not substantially. During this second time interval At2, or in each of the second time intervals At2, a point-like energy input at the substrate 12 is therefore avoided, whereby the laser light 16, or the pulsed laser beam 18,The laser beam 18 is deflected relative to the surface 22 of the substrate 12 towards the next recess to be made. Within this, in this case second, time interval At2, or in the case shown within each, in this case second, time interval At2, the laser beam 16, or the pulsed laser beam 18, switches from one drilling position 32 to the next drilling position 32.
[0047] In the illustrated embodiment, the first deflection unit 20 is operated in such a way that the first deflection Xi of the laser light 16, in the illustrated case of the laser beam 18, is carried out continuously in the first deflection direction, thereby enabling a high energy input at the drilling positions 32.
[0048] In contrast, the second deflection unit 24 is operated in such a way that the second deflection X2 of the laser light, especially in at least one, in this case second, time period At2, in the case shown in each of the, in this case second, second periods At2, in which the second deflection direction is opposite to the first deflection direction, occurs abruptly, thereby minimizing the energy input between the drilling positions 32.
[0049] In the illustrated embodiment, the laser unit 14 is operated in pulsed mode. As already mentioned, the laser unit 14 generates a pulsed laser beam 18, in the illustrated case by means integrated within the laser unit 14. Alternatively, it would also be possible to operate the laser unit 14 in pulsed mode by generating the pulsed laser beam 18 by means arranged outside the laser unit 14, for example, a Pockels cell. In this way, the laser beam 18 of the laser unit 14 could be switched on and off at regular intervals, for example, by means of the Pockels cell. R. 416915
[0050] -8- In the case shown, the second deflection unit 24 is operated such that the at least one, in this case first, time interval Ati, in the case shown in each of the, in this case first, second intervals Ati, in which the second deflection direction is opposite to the first deflection direction, corresponds to a time interval in which the laser beam 16, in this case at least one pulse, in this case a single pulse or a plurality of pulses, of the laser beam 16, strikes the substrate 12. This enables a particularly high energy input at the drill positions 32.
[0051] Furthermore, in the case shown, the second deflection unit 24 is operated such that at least one, in this case second, time interval At2, in each of the, in this case second, second intervals At2, in which the second deflection direction is in the same direction as the first deflection direction, corresponds to a time interval in which the laser beam 16 does not, in particular no pulse of the laser beam, strike the substrate. This allows the energy input between the drill positions 32 to be minimized.
[0052] The described aspects allow for more efficient processing of substrate 12. In particular, the laser guidance can be more precise and therefore faster. Consequently, a significant increase in the drilling rate is enabled.
Claims
R. 416915 -9- Claims 1. Laser drilling device (10) for processing a substrate (12) for an electrochemical cell, comprising a laser unit (14) which is provided for generating a laser beam (16) for processing the substrate (12), characterized by a first deflection unit (20) which is provided for causing a first deflection (xi) of the laser beam (16) in a first deflection direction with respect to a surface (22) of the substrate (12), and a second deflection unit (24) which is provided for causing a second deflection (X2) of the laser beam (16) towards the substrate in a second deflection direction with respect to the same surface (22) of the substrate (12), wherein the second deflection unit (20) can be operated such that o in at least one, in particular first, time interval (Ati) the second deflection direction is opposite to the first deflection direction and o in at least one, in particular second,Time period (At2) the second direction of deflection is in the same direction as the first direction of deflection, 2. Laser drilling device (10) according to one of the preceding claims, characterized in that the first deflection unit (20) is a galvo scanner (26) or a movable holder for the substrate (12).
3. Laser drilling device (10) according to one of the preceding claims, characterized in that the second deflection unit (24) is an optical deflector (28), in particular an acousto-optic deflector (30) or an electro-optic deflector. R. 416915 -10- 4. Method for processing a substrate (12) for an electrochemical cell using a laser drilling device (10), in particular using a laser drilling device (10) according to one of claims 1 to 3, comprising a laser unit (14) which is provided to project a laser beam (16) for processing the substrate (12), characterized in that a first deflection (xi) of the laser beam (16) in a first deflection direction is caused by means of a first deflection unit (20) with respect to a surface (22) of the substrate (12), and a second deflection (X2) of the laser beam (16) in a second deflection direction is caused by means of a second deflection unit (24) with respect to the same surface (22) of the substrate (12), wherein the second deflection unit (24) is operated such that o in at least one, in particular first, time interval (AL) the second deflection direction is opposite to the first deflection direction and o in at least one, in particular second, time interval (At2) the second deflection direction is in the same direction as the first deflection direction 5. Method according to claim 4, characterized in that the second deflection unit (24) is operated such that the second deflection direction is reversed to the first deflection direction in different, in particular regular, time intervals (Ati, At2), preferably after each first time interval (Ati) and after each second time interval (At2).
6. Method according to one of claims 4 or 5, characterized in that the first deflection unit (20) is operated such that the first deflection (xi) of the laser beam (16) in the first deflection direction is continuous.
7. Method according to one of claims 4 to 6, characterized in that the second deflection unit (22) is operated in such a way that the second deflection (X2) of the laser beam (16), in particular in the at least one, in particular second, time period (At2), in which the second deflection direction is opposite to the first deflection direction, is carried out abruptly. R. 416915 -11 - 8. Method according to one of claims 4 to 7, characterized in that the laser unit (14) is operated in pulsed mode by generating a pulsed laser beam (18) by means of means integrated in the laser unit (14) and / or by means of means arranged outside the laser unit (14), preferably a Pockels cell.
9. Method according to one of claims 4 to 8, characterized in that the second deflection unit (24) is operated such that the at least one, in particular first, time period (AL) in which the second deflection direction is opposite to the first deflection direction corresponds to a time period in which the laser beam (18), in particular at least one pulse, preferably a single pulse or a plurality of pulses, of the laser beam (18) hits the substrate (12).
10. Method according to one of claims 4 to 9, the second deflection unit (24) is operated such that the at least one, in particular second, time period (At2), in which the second deflection direction is in the same direction as the first deflection direction, corresponds to a time period in which the laser beam (18) does not, in particular no pulse of the laser beam (18), hit the substrate (12).
11. Substrate (12) for an electrochemical cell, which was processed by means of a laser drilling device according to one of claims 1 to 3 and / or by means of a method according to one of claims 4 to 10.