A method of manufacturing a lead frame and a clip frame
A combined manufacturing process for lead frames and clip frames addresses the inefficiencies of existing methods by integrating stamping, bending, and singulating in a single step, achieving reduced costs and time while enhancing quality and performance.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- NEXPERIA BV
- Filing Date
- 2025-12-12
- Publication Date
- 2026-06-18
AI Technical Summary
Existing methods for manufacturing lead frames and clip frames are costly and time-consuming due to the need for high-quality starting materials and inflexible manufacturing machines, which require redesign or new installations for design changes, leading to increased time-to-market and costs.
A combined manufacturing process for lead frames and clip frames involving stamping, bending, and singulating in a single process, utilizing a grid arrangement with connecting bars to enhance efficiency and flexibility, allowing for reduced material usage and processing steps.
The combined process reduces material waste, processing time, and costs while ensuring higher quality and standardization of parts, with improved electrical and thermal performance through plating and anti-oxidation protection layers.
Smart Images
Figure EP2025086951_18062026_PF_FP_ABST
Abstract
Description
[0001] TITLE
[0002] A method of manufacturing a lead frame and a clip frame
[0003] TECHNICAL FIELD
[0004] The present disclosure relates to a method of manufacturing a lead frame and a clip frame.
[0005] BACKGROUND OF THE DISCLOSURE
[0006] In semiconductor packages, lead frames and clip frames contribute significantly to the price of said semiconductor package. This has to do with the fact that high quality starting materials are being processed requiring many process steps to obtain the final lead frames and clip frames. Typically, sheet material is processed in stamping, bending, cleaning and singulating steps to obtain the actual final component.
[0007] The machines used to manufacture these components at large industrial scales are not flexible for design changes, meaning that for new package designs the machines have to be rebuild or complete new machines have to be installed. This reduces the time to market and increases the overall cost of the semiconductor package.
[0008] Accordingly, it is a goal of the present disclosure to provide an improved method of manufacturing lead frames and clip frames.
[0009] SUMMARY OF THE DISCLOSURE
[0010] The disclosure pertains to a method of manufacturing a lead frame and a clip frame in a combined process, comprising the steps of: i) providing a sheet material; ii) removing residual material from the sheet material, thereby, creating an array or a grid of a plurality of flat frame layouts, the array having a first array direction and a second array direction perpendicular to the first array direction, each flat frame layout consisting of lead frames and clip frames, the plurality of flat frame layouts interconnected by connecting bars extending along one array direction; iii) bending the array of a plurality of flat frame layouts to create an array of a plurality of bended frame layouts along one or more bending lines parallel to the first array direction; iv) singulating the bended frame layouts from the array of bended frame layouts, thereby obtaining individual lead frames and clip frames.
[0011] The method according to the disclosure provides an improved method of manufacturing lead frames and clip frames by combining both manufacturing processing into one single process, thereby saving costs by means of material usage and required processing steps.
[0012] Since the raw material costs are high and the manufacturing processes are time-expensive, a combined manufacturing process can be more efficient in terms of reduced residual starting material and reduced overall processing time.
[0013] To do so efficiently, the lead frames and clip frames are arranged in an array or grid having connecting bars, which keep the individual frames / elements / units connected to each other, and which will be sacrificed during step iv) of singulating the lead frames and clip frames. This grid can be understood as a two-dimensional arrangement of individual elements, wherein the lead frames and clip frames may be formed as a single element or as two separate elements. However, the array is characterized by having a high degree of repetition and / or symmetry.
[0014] More importantly, the raw sheet material may be used more efficiently. Because clip frames are typically smaller than lead frames, the clip frames can be stamped out of otherwise residual material of a solely lead frame stamping process. Furthermore, having a second smaller object to-be stamped out allows for alignment and arrangement of the two frames with more flexibility in the stamping mold.
[0015] It should be noted that step ii) of removing residual material from the sheet material can be performed by stamping or etching, or another material removal technique. Stamping may be particularly beneficial, and the reader should consider these other techniques when reading stamping or removal of residual material.
[0016] Another beneficial effect is that the bending process can be performed on the combined lead and clip frames, creating more stable objects to be bent by the bending tool.
[0017] It should be noted that, in the art, a lead frame may also be known as a die pad and a clip frame may be known as a bond clip.
[0018] In an example of the method, the method further comprises the step of plating the sheet material. Plating the starting sheet material may result in improved electrical performance by reducing the resistance of the material, enhancing its solderability, or improving its corrosion resistance. Furthermore, it may result in enhanced thermal performance by enhancing the heat dissipation. These benefits and effect depend on the exact implementation of the plating and are dependent on the requirements of the lead frame and the bond clip. Examples of plating material may include, Silver (Ag), Gold (Au), Nickel (Ni), and Tin (Sn).
[0019] In another example, the step of plating the sheet material is performed after step i), step ii), step iii), or step iv).
[0020] It is noted that the step of plating may be performed at any stage during the manufacturing process and depends on the requirements. Furthermore, it depends on the effects that particular manufacturing steps have on the final lead frame and clip frame. For instance, a stamping process step may result in the abrasion of the plating layer at the edges of the frames, which could affect the final properties of said frame.
[0021] In another example, the method further comprises the step of cleaning the sheet material.
[0022] In an example thereof, the step of cleaning the sheet material is performed after step i), step ii), step iii), step iv).
[0023] Cleaning the sheet material or lead frames and clip frames may be beneficial to remove residual contaminants, which could from earlier processing steps, but may also come from shipping or handling. The cleaning may be performed by wet chemistry and even in combination with ultrasonic or heat treatment. Alternatively, plasma cleaning or gaseous reactions may be performed to clean the sheet material or lead frames and clip frames. However, in case larger contaminants would need to be removed like burrs or the like simple shaking or blowing would suffice as a cleaning step. It should be noted that the cleaning step may comprise any combination of the above-mentioned examples, and is not limited to what is mentioned in this paragraph. The expert in the field will have certain understanding of what cleaning steps may be required and that typically used for such manufacturing processes.
[0024] In a particular example of the method, the step of cleaning the sheet material is performed prior to the step of plating the sheet material.
[0025] This ensures that a pristine surface is obtained for the plating material to adhere onto. Furthermore, this ensures that delamination of the plating material is less prevalent when the lead frames and clip frames are implemented in their final application. In another example, the method further comprises the step of applying an anti-oxidation protection layer onto the sheet material.
[0026] This is beneficial, because high quality starting materials are typically used for the manufacturing of lead frames and clip frames. Here, typically, a lot of effort and time is spent to ensure that these materials are unoxidized, because the oxidized state usually has different material properties to what is desired. Accordingly, during the manufacturing process an anti-oxidation protection layer may be applied to protect the surface(s) of the sheet material or the lead frames and the clip frames. Such an anti-oxidation protection layer may improve the electrical conductivity or protect against moisture.
[0027] It should be noted that the step of applying an anti-oxidation protection layer may be performed after the plating and / or the cleaning step. Particularly, the step of providing an anti-oxidation layer may be performed multiple times and / or at different steps in the method according to the disclosure. For instance, after providing the starting sheet material a protection layer may be coated, which could be removed prior to stamping with a cleaning step. Subsequently, after the bending step another anti-oxidation layer may be provided which may stay on the lead frame and clip frame after the singulation step until implementation of the lead frame and / or clip frame in the final device. Namely, that way pristine surfaces of the lead frame and / or clip frame can be guaranteed for the manufacturer in their manufacturing process.
[0028] The expert in the field would understand that the previous mentioned steps of plating, cleaning and applying of an anti-oxidation protection layer may be performed multiple times and between different steps of the method according to the disclosure. This can be beneficial for surface modification of the lead frames and / or clip frames for subsequent processing steps.
[0029] In another example of the method, the step iii) of bending further comprises the step of bending the array of a plurality of flat frame layouts along one or more bending lines along the one array direction of first array direction and second array direction.
[0030] The benefit of the combined manufacturing process of lead frames and clip frames is that larger repeat units / elements of the array or grid are obtained, which are also more stable for manipulation. In this particular example, it has been found that bending lines could be defined perpendicular to the connecting bars. In that way, the connecting bars act as sturdy pillars extending from a first perpendicular tape bar towards a second perpendicular tape bar (but being parallel to the first tape bar). A cage-like arrangement is then obtained with the first and the second tape bar having a plurality of connecting bar extending perpendicularly between them and on each connecting bar a plurality of lead frame and clip frames. The cage-like arrangement brings further stability to the intermediate product, such that bending is does not deform the entire intermediate product, which could lead to disforming other parts of the intermediate product. In order to keep that structure of tape bars and connecting bars intact, the inventors have found, that bending perpendicular to the connecting bars yields the best results, and does not deform the tape bars or the connecting bars, such that a higher quality of lead frames and clip frames can be guaranteed at the end of the process.
[0031] In yet another example of the method the step iv) of singulating the bended frame layouts is performed along the other array direction of the first array direction and the second array direction.
[0032] In a further example, the step iv) of singulating the bended frame layouts further comprises singulating along the one array direction of the first array direction and the second array direction.
[0033] In the final step of the method to obtain singulated lead frames and clip frames, the individual elements / units have to be removed from the array or grid. This may be performed by stamping, cutting, torching, laser cutting, or the like. However, as explained above a cage-like arrangement of tape bars and perpendicular connecting bars is obtained prior to singulation. Therefore, in the first example the lead frames and clip frames are singulated by cutting the connecting bars. In the second example, however, a cut needs to be performed in the direction along (parallel) to the connecting bars. The latter can be used when some sacrificial material is added to the connecting bars, such that after cutting said sacrificial material and the connecting bar remain.
[0034] It is clear for the expert in the field that the two previous examples may be combined, such that the array is being cut in both directions. Particularly, in the combined case, stamping may be beneficial, since it would allow to make cuts in two directions in one single action.
[0035] In a last example of the method, the step ii) of stamping the sheet material creates an array of flat frame layouts such that flat frame layouts of an array column interleave with flat frame layouts of an adjacent array column.
[0036] As mentioned in the beginning, high quality starting sheet material is used, which contributes to part of the cost of the lead frames and clip frames. In order to reduce the amount of residual material, it is beneficial to stagger the individual flat frame layouts.
[0037] Throughout this disclosure, a flat frame layout can be understood as a single unit / element of the grid comprising both a lead frame and a clip frame. Such a flat frame layout is still connected to the connecting bars and the wording “flat” relates to its configural shape, which means that the flat frame layout still lies within the plane of the starting sheet material.
[0038] In a similar fashion, a bend frame layout can be understood as that same single unit / element of the grid / array comprising both a lead frame and a clip frame, but having a three-dimensional configural shape, wherein particular parts are bend.
[0039] All in all, the method according to the disclosure provides an improved method of manufacturing lead frames and clip frames by combining both manufacturing processing into one single process, thereby saving costs by means of material usage and required processing steps, resulting in faster manufacturing times and reduced costs compared to prior art manufacturing methods of lead frames and clip frames.
[0040] BRIEF DESCRIPTION OF THE DRAWINGS
[0041] The disclosure will now be discussed with reference to the drawings, which show in:
[0042] Figures 1a-1 b, 2a-2b and 3a-3b outlining the manufacturing steps of an example of the method according to the disclosure;
[0043] Figures 4-9 various examples of arrays or grids of a plurality of flat frame layouts, each frame layout consisting of lead frames and clip frames.
[0044] DETAILED DESCRIPTION OF THE DISCLOSURE
[0045] For a proper understanding of the disclosure, in the detailed description below corresponding elements or parts of the disclosure will be denoted with identical reference numerals in the drawings.
[0046] An example of the manufacturing steps of an example of the method according to the disclosure is outlined in Figures 1a-1 b, 2a-2b and 3a-3b.
[0047] Figures 1a-1 b depict a step i) of providing a sheet material denoted with reference numeral 10. The sheet material has a first sheet surface side 10a and a second sheet surface side 10b opposite to the first surface sheet side. The sheet material 10 can be made of any suitable electrically conductive material that is commonly used in semiconductor manufacturing processes, such as copper, etc.
[0048] In a further step ii), shown in Figures 2a-2b, the sheet material 10 is subjected to a stamping step. With the stamping step any residual material, denoted with reference numeral 11 , is removed, as seen from the dashed outline of the outer periphery of the sheet material 10. The stamping step ii) thus creates an array or a grid of a plurality of flat frame layouts 20.
[0049] Throughout the detailed description and with reference to the various Figures each array has a first array direction, denoted with x, and a second array direction, denoted with y, the latter being perpendicular to the first array direction x.
[0050] Each flat frame layout consists of lead frames 22 and clip frames 23 and the plurality of flat frame layouts are interconnected by suitable connecting bars 23 extending along one array direction.
[0051] For clarification, reference is made to Figure 4, which shows a first example 300i of an array or a grid of a plurality of flat frame layouts 20. The array 300i exhibits a first array direction x and a second array direction y perpendicular to the first array direction x. The various flat frame layouts 20, making up the array 300i, extend along both the first array direction x and the second array direction y. Each frame layout 20 consists of a lead frame 22 and a clip frame 23.
[0052] The various flat frame layouts 20 extending in a row along the second array direction y are interconnected with each other with the assistance of connecting bars 23, which likewise extend in the second array direction y. The various rows of interconnected flat frame layouts 20, in particular the ends 23a-23b of the various connecting bars 23 of each row, are similarly interconnected with each other by means of peripheral connecting bars 24a-24b. The peripheral connecting bars 24a-24b are interconnected with the corresponding bar ends 23a-23b. As shown in the various Figures, the peripheral connecting bars 24a-24b are each located at opposite sides of the array 300i (seen in the second array direction y) and interconnect the various rows along the first array direction x. Each array or grid 300 can be understood as a two- dimensional arrangement of individual elements 21-22, wherein the lead frames 21 and clip frames 22 may be formed as a single element or as two separate elements. However, the array 300 is characterized by having a high degree of repetition and / or symmetry. It is noted that both the connecting bars 23 and the peripheral connecting bars 24a-24b are formed during the stamping step ii) from the sheet material 20.
[0053] In a next step iii) the compete array 300 of a plurality of flat frame layouts 20 is bended to create an array of a plurality of bended frame layouts along one or more bending lines, which bending lines extend parallel to either the first array direction x or the second array direction y. This is clearly depicted in Figure 3a-3b, wherein the bending lines are denoted with reference numerals 25a-25d, extending parallel to the second array direction 7 (and perpendicular to the first array direction x).
[0054] The final step iv) involves the step of singulating, e.g. by means of stamping, laser cutting, etc., the bended frame layouts from the array 300 of bended frame layouts 20, thereby obtaining individual lead frames 21 and clip frames 22.
[0055] This sequence of manufacturing steps allows the combination of stamping, bending and singulating into one single process, allowing the creation of a large number of parts having identical dimensions and form, thus, next to an improved standardization of parts also saving costs by means of material usage and required processing steps. Since the raw material costs are high and the manufacturing processes are time-expensive, a combined manufacturing process can be more efficient in terms of reduced residual starting material and reduced overall processing time. In addition, a high level of standardization can be achieved with the creation of a large number of parts in a single process, each having identical dimensions.
[0056] To do so efficiently, the lead frames 21 and clip frames 22 are arranged in an array 300 or grid having connecting bars 23, which keep the individual frames / elements / units 21-22 connected to each other. The connecting bars 23 will be sacrificed during the final step iv) of singulating the individual lead frames 21 and clip frames 22.
[0057] More importantly, the raw sheet material 10 may be used more efficiently. As clip frames 22 are typically smaller than lead frames 21 , the clip frames 22 can be stamped out of otherwise residual material of a solely lead frame stamping process. Furthermore, having a second smaller object to-be stamped out allows for alignment and arrangement of the two frames with more flexibility in the stamping mold.
[0058] Another beneficial effect is that the bending process can be performed on the combined lead frames 21 and clip frames 22 arranged in the array 300. By bending an array having significantly larger dimension compared to the individual lead frames 21 and clip frames 22, a more stable bending by the bending tool can be achieved, without the risk of deformation or damage to individual parts.
[0059] It should be noted that, in the art, a lead frame may also be known as a die pad and a clip frame may be known as a bond clip.
[0060] In a further example of the method according to the disclosure the sheet material is subjected to a plating step. With the plating of the starting sheet material an improved electrical performance is achieved by reducing the resistance of the material, further enhancing its solderability, or by improving its corrosion resistance. Furthermore, it may result in enhanced thermal performance by enhancing the heat dissipation. These benefits and effect depend on the exact implementation of the plating and are dependent on the requirements of the lead frame 21 and the bond clip 22 in the next semiconductor manufacturing process. Examples of plating material may include, Silver (Ag), Gold (Au), Nickel (Ni), and Tin (Sn).
[0061] It is noted that the plating step can be performed after either step i), step ii), step iii), or step iv).
[0062] It is noted that the step of plating may be performed at any stage during the manufacturing process and depends on the requirements of the final end product parts. Furthermore, it depends on the effects that particular manufacturing steps have on the final lead frame 21 and clip frame 22. For instance, a stamping process step may result in the abrasion of the plating layer at the edges of the frames, which could affect the final properties of said frame.
[0063] In another example, the method further comprises the step of cleaning the sheet material 10. Similarly, the cleaning step may be executed after either step i), step ii), step iii), step iv). Cleaning the sheet material 10 or lead frames 21 and clip frames 22 may be beneficial to remove residual contaminants, which could from earlier processing steps, but may also come from shipping or handling. The cleaning may be performed by wet chemistry and even in combination with ultrasonic or heat treatment. Alternatively, plasma cleaning or gaseous reactions may be performed to clean the sheet material 10 or all lead frames 21 and clip frames 22 (either still formed together as an array 300 or singulated as individual parts). However, larger contaminants would need to be removed like burrs or the like simple shaking or blowing would suffice as a cleaning step. It should be noted that the cleaning step may comprise any combination of the above-mentioned examples, and is not limited to what is mentioned in this paragraph. The expert in the field will have certain understanding of what cleaning steps may be required and that typically used for such manufacturing processes.
[0064] In a particular example of the method, the step of cleaning the sheet material 10 is performed prior to the step of plating the sheet material 10.
[0065] This ensures that a pristine surface is obtained for the plated sheet material 10 to adhere onto. Furthermore, this ensures that delamination of the plating material is less prevalent when the lead frames 21cand clip frames 22 are implemented in their final application.
[0066] In another example, the method further comprises the step of applying an anti-oxidation protection layer onto the sheet material 10. This is beneficial, because high quality starting materials are typically used for the manufacturing of lead frames and clip frames. Here, typically, a lot of effort and time is spent to ensure that these materials are unoxidized, because the oxidized state usually has different material properties to what is desired. Accordingly, during the manufacturing process an anti-oxidation protection layer may be applied to protect the surface(s) of the sheet material or the lead frames and the clip frames. Such an anti-oxidation protection layer may improve the electrical conductivity or protect against moisture.
[0067] It should be noted that the step of applying an anti-oxidation protection layer may be performed after the plating and / or the cleaning step. Particularly, the step of providing an anti-oxidation layer may be performed multiple times in the method according to the disclosure. For instance, after providing the starting sheet material a protection layer may be coated, which could be removed prior to stamping with a cleaning step. Subsequently, after the bending step another anti-oxidation layer may be provided which may stay on the lead frame and clip frame after singulation until implementation of the lead frame 21 and / or clip frame 22 in the final device.
[0068] Figures 4-9 depict various arrays 300I-3002-3003-3004-300S-3006 wherein the plurality of frame layouts 20, each composed of a lead frame 21 and a clip frame 22 are arranged in various orientations along both array directions x and y.
[0069] Figure 4 depicts the array 300i similarly as depicted in Figures 1a-1 b, 2a-2b, 3a-3b, which depict one frame layout 20. The various frame layouts 20 are arranged linearly in rows 31 extending in the second array direction y and interconnected by connecting bars 23 extending in the second array direction y. The various rows 31 are interconnected by means of peripheral connecting bars 24a-24b extending in the first array direction x, such that the various frame layouts 20 in each row 31 are aligned in columns 32. Reference numerals 25a-25d reveal the various bending lines extending parallel to the second array direction y.
[0070] The array 300i of Figure 4 requires a singulating process step in the array direction y to separate the connecting bars 23 from the clip frames 22 and lead frames 21.
[0071] The layout of array 3002 of Figure 5 has a similar x-y arrangement of the various frame layouts 20, yet the various rows 31 are alternatingly mirrored. Similarly, the alternately mirrored rows 31 extending in the second array direction y are interconnected by connecting bars 23 extending in the second array direction y. The peripheral connecting bars 24a-24b extending in the first array direction x are connected with the bar ends 23a and 23b respectively of the various connecting bars 23. Likewise, reference numerals 25a-25d reveal the various bending lines extending parallel to the second array direction y.
[0072] The array 3002 of Figure 5 also requires a singulating process step in the array direction y to separate the connecting bars 23 from the clip frames 22 and lead frames 21 .
[0073] The layout of array 300a of Figure 6 depict yet another x-y arrangement of the various frame layouts 20. Each main row 31 extends parallel to the second array direction y and consists of two sub-rows 31a-31b, each sub-row 31a being mirrored with respect to the other sub-row 31 b. The lead frames 21 of each sub-row are interconnected with each other by means of junction lines 33 extending parallel to the first array direction x. Similarly, of two adjacent main rows 31 , the clip frames 22 of one sub-row 31 b interleave with similar clip frames 22 of the adjacent or neighboring mirrored sub-row 31a. This layout of Figure 6 achieves a significant further reduction of residual material 11. Each sub-row 31a-31b are interconnected by intermediate connecting bars 23i and 232 respectively, which - seen in the first array direction x - are alternatingly connected with their bar end 23a or 23b with peripheral connecting bars 24a-24b. Likewise, reference numerals 25a-25d reveal the various bending lines extending parallel to the second array direction y.
[0074] The array SOOa of Figure 6 requires (simultaneous) singulating process steps in both array directions x and y. The singulating step in the y direction separates the connecting bars 23 from the clip frames 22 and lead frames 21 , whereas the singulating step in the x-direction singulates the interconnected lead frames along their junction lines 33. Figure 7 depicts an array 3OO4 wherein the frame layouts 20 of the neighboring rows 32 are oriented in a staggered way with respect to their neighbors. In particular, of a particular row 31 , the clip frames 22 interleave with the lead frames 21 of the adjacent or neighboring row 31 . In a fashion similar as in Figure 6, each row 31 is interconnected by intermediate connecting bars 23i and 232 respectively, which - seen in the first array direction x - are alternatingly connected with their bar end 23a or 23b with peripheral connecting bars 24a-24b. Likewise, reference numerals 25a- 25d reveal the various bending lines extending parallel to the second array direction y-
[0075] The array 3004 of Figure 7 also requires a singulating process step in the array direction y to separate the connecting bars 23 from the clip frames 22 and lead frames 21 .
[0076] Figure 8 depicts an array 300s of a row 31 formed by various clip frames 22 and lead frames 22 interconnected with each other by a connecting bar 31. The connecting bar 23 is connected with its bar ends 23a-23b with respective peripheral connecting bars 24a-24b, each provided with an index opening 26a and 26b allowing the array 300s to be properly contained and aligned by a singulating tool. Likewise, reference numerals 25a-25d reveal the various bending lines extending parallel to the second array direction y.
[0077] The array 300s of Figure 8 also requires a singulating process step in the array direction y to separate the connecting bars 23 from the clip frames 22 and lead frames 21 .
[0078] Figure 9 depicts an array 300e wherein the various clip frames 22 are arranged in a sub-row 31a and interconnected with each other by individual intermediate connecting bars 23i. Likewise, the various lead frames 21 are also arranged in a sub-row 31 b and interconnected with each other by individual intermediate connecting bars 232. Peripheral connecting bars 24a-24b are provided at each end of the sub-rows 31a and 31b, thereby forming one combined row 31 and are each provided with an index opening 26a and 26b allowing the array 300e to be properly contained and aligned by a singulating tool. Likewise, reference numerals
[0079] 25a-25d reveal the various bending lines extending parallel to the second array direction y.
[0080] The array 300e of Figure 9 requires a singulating process step in the array direction x to separate the intermediate connecting bars 23i and 232 from the various clip frames 22 and lead frames 21. LIST OF REFERENCE NUMERALS USED x first array direction y second array direction
[0081] 10 sheet material
[0082] 10a first sheet surface side
[0083] 10b second sheet surface side
[0084] 11 residual material
[0085] 20 flat frame layouts
[0086] 21 lead frames
[0087] 22 clip frames
[0088] 23 connecting bars
[0089] 23I-232 intermediate connecting bars
[0090] 24a-24b peripheral connecting bars
[0091] 25a-25d bending lines
[0092] 26a-26b indexing holes
[0093] 30 bent frame layout
[0094] 300narray of plurality of bent frame layouts (n-th example)
Claims
CLAIMS1. A method of manufacturing a lead frame and a clip frame in a combined process, comprising the steps of: i) providing a sheet material; ii) removing residual material from the sheet material, thereby, creating an array of a plurality of flat frame layouts, the array having a first array direction and a second array direction perpendicular to the first array direction, each flat frame layout consisting of lead frames and clip frames, the plurality of flat frame layouts interconnected by connecting bars extending along one array direction of the first array direction and second array direction; iii) bending the array of a plurality of flat frame layouts to create an array of a plurality of bended frame layouts along one or more bending lines parallel to the one array direction; iv) singulating the bended frame layouts from the array of bended frame layouts, thereby obtaining individual lead frames and clip frames.
2. The method of manufacturing according to claim 1 , further comprising the step of:- plating the sheet material.
3. The method of manufacturing according to claim 2, wherein the step of plating the sheet material is performed after step i), step ii), step iii), or step iv).
4. The method of manufacturing according to any of the preceding claims, further comprising the step of:- cleaning the sheet material.
5. The method of manufacturing according to claim 4, wherein the step of cleaning the sheet material is performed after step i), step ii), step iii), or step iv).
6. The method of manufacturing according to claim 4 or 5 in combination with claim 2 or 3, wherein the step of cleaning the sheet material is performed prior to the step of plating the sheet material.
7. The method of manufacturing according to any of the preceding claims, further comprising the step of:- applying an anti-oxidation protection layer onto the sheet material.
8. The method of manufacturing according to any of the preceding claims, wherein the step iii) of bending further comprises the array of a plurality of flat frame layouts along one or more bending lines along the other array direction of the first array direction and the second array direction.
9. The method of manufacturing according to any of the preceding claims, wherein the step iv) of singulating the bended frame layouts is performed along the other array direction of the first array direction and the second array direction.
10. The method of manufacturing according to any of the preceding claims, wherein the step iv) of singulating the bended frame layouts further comprises singulating along the one array direction of the first array direction and the second array direction.
11. The method of manufacturing according to any of the preceding claims, wherein the step ii) of removing residual material of the sheet material creates an array of flat frame layouts such that flat frame layouts of an array column interleave with flat frame layouts of an adjacent array column.