Thermoelectric array, thermoelectric module, thermoelectric device, and methods of preparation thereof
The micro-engineered thermoelectric module, featuring a thermally-insulating carrier with in-situ consolidated elements, addresses size limitations in existing technologies, enabling high-volume production of densely packed modules for advanced thermal management applications.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- EURON THERMODYNAMICS
- Filing Date
- 2025-11-26
- Publication Date
- 2026-06-18
AI Technical Summary
Current manufacturing processes for thermoelectric elements are limited by minimum size constraints, leading to excessive material wastage and damage, and existing methods for miniaturization do not achieve the performance of bulk sintered materials.
A micro-engineered thermoelectric module is manufactured using a thermally-insulating carrier with holes containing thermoelectric elements, which are consolidated in situ through sintering, and connected to electrical interconnects on ceramic or silicon-based plates, allowing for high-volume production compatible with micro-packaging.
Enables the production of smaller thermoelectric modules with increased packing density, suitable for telecommunications and micro-packaging, while maintaining performance comparable to bulk sintered materials.
Smart Images
Figure GB2025052593_18062026_PF_FP_ABST