Resin composition, production method therefor and cured object thereof, element, and electronic appliance

Abstract

Provided is a resin composition including an organosilicon compound having structures represented by formulae (A) and (B). In the organosilicon compound, the proportion of structures represented by formula (B) in which m is 2 is higher than the proportion of structures represented by formula (B) in which m is 1. In formula (A), the R1 moieties are each independently a C1-C40 alkyl group, a C5 or C6 cycloalkyl group, or a C6-C20 aryl group and the R2 moieties are each independently a C1-C40 alkyl group, a C5 or C6 cycloalkyl group, or a C6-C20 aryl group. In formula (B), the R3 moieties are each independently a C1-C40 alkyl group, a C5 or C6 cycloalkyl group, or a C6-C20 aryl group and m is an integer of 1-30.

Description

Resin composition and method for producing the same, cured product, and element and electronic device. 【0001】 The present invention relates to resin compositions, methods for producing the same, cured products, and elements and electronic devices. 【0002】 Organosilicon compounds containing a silsesquioxane skeleton have a unique structure based on siloxane bonds (Si-O-Si) with high bond energy, and are attracting attention from various fields due to the unique effects that can be expected from this structure. Among such organosilicon compounds containing a silsesquioxane skeleton, silicon-based polymers containing a silsesquioxane skeleton as the main chain are known. These silicon-based polymers are particularly expected to be useful in semiconductor devices due to their excellent heat resistance and electrical insulation properties, in lenses due to their excellent transparency, and in adhesives due to their excellent adhesion properties, and further research is being conducted to improve their functionality. For example, Patent Document 1 discloses a silicon-based polymer that can produce a silicone film with excellent heat resistance. Furthermore, studies have also been conducted on compositions using silicon-based polymers with other components, and Patent Document 2 discloses a composition that can form a cured product with excellent heat resistance by using a silicon-based polymer along with a compound containing a specific element. Patent Document 3 discloses a technique for obtaining a laminate for semiconductor devices with high electrical connection reliability by using a film obtained using a silicon-based polymer as an insulating film. 【0003】 Japanese Patent Publication No. 2010-116464, International Publication No. 2022 / 215759, International Publication No. 2021 / 261403 【0004】As described above, organosilicon compounds containing a silsesquioxane skeleton have primarily been studied for their heat resistance and electrical insulation properties, given their applications. However, organosilicon compounds containing a silsesquioxane skeleton are not particularly easy to handle, and further improvements in terms of handling during manufacturing have been needed when used in resin compositions containing these compounds. One indicator of handling ease is the rate of change in viscosity over time, but little research has been done on the rate of change in viscosity over time for resin compositions containing the above-mentioned organosilicon compounds, leaving room for further investigation. Therefore, the object of the present invention is to provide a resin composition containing an organosilicon compound that has a low rate of change in viscosity over time and excellent handling properties. 【0005】 As a result of diligent research, the inventors of the present invention discovered that the above problem can be solved by controlling the number of two specific structures in the entire compound containing a specific silsesquioxane skeleton in the resin composition, and thus completed the present invention. 【0006】 In other words, the gist of the present invention is as follows: Item 1. A resin composition comprising an organosilicon compound having structures represented by the following formulas (A) and (B), wherein the proportion of the organosilicon compound having a structure represented by the following formula (B) with m=2 is greater than the proportion of the structure represented by the following formula (B) with m=1. (In the above formula (A), R １ R is independently an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms; ２ R is independently an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms; in formula (B) above, R ３ R is independently an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms; m is an integer from 1 to 30; R １ , R ２ , and R ３When at least one of them is an alkyl group having 1 to 40 carbon atoms, the alkyl group having 1 to 40 carbon atoms is independently such that at least one hydrogen atom is independently a halogen atom, a cycloalkyl group A having 5 or 6 carbon atoms １２ , or an aryl group A having 6 to 20 carbon atoms １４ and may be replaced, and at least one -CH ２ - is independently -O-, -CO-, a cycloalkylene group A having 5 or 6 carbon atoms １３ , or an arylene group A having 6 to 20 carbon atoms １５ and may be replaced; R １ , R ２ , and R ３ When at least one of them is a cycloalkyl group having 5 or 6 carbon atoms, the cycloalkyl group having 5 or 6 carbon atoms is independently such that at least one hydrogen atom is independently a halogen atom, an alkyl group A having 1 to 40 carbon atoms ２１ , a cycloalkyl group A having 5 or 6 carbon atoms ２２ , or an aryl group A having 6 to 20 carbon atoms ２４ and may be replaced, and at least one -CH ２ - may be independently replaced by -O- or -CO-; R １ , R ２ , and R ３ When at least one of them is an aryl group having 6 to 20 carbon atoms, the aryl group having 6 to 20 carbon atoms is independently such that at least one hydrogen atom is independently a halogen atom, an alkyl group A having 1 to 40 carbon atoms ３１ , a cycloalkyl group A having 5 or 6 carbon atoms ３２ , or an aryl group A having 6 to 20 carbon atoms ３４ and may be replaced; the alkyl group A ２１ and the alkyl group A ３１ are independently such that at least one hydrogen atom is independently a halogen atom, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms and may be replaced, and at least one -CH ２- may be independently replaced by -O-, -CO-, a cycloalkylene group having 5 or 6 carbon atoms, or an arylene group having 6 to 20 carbon atoms; the cycloalkyl group A １２ , the cycloalkylene group A １３ , the cycloalkyl group A ２２ and the cycloalkyl group A ３２ may each independently have at least one hydrogen atom independently replaced by a halogen atom, an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms, and at least one -CH ２ - may be independently replaced by -O-, -CO-; the aryl group A １４ , the arylene group A １５ , the aryl group A ２４ and the aryl group A ３４ may each independently have at least one hydrogen atom independently replaced by a halogen atom, an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms.) 【0007】 Item 2. The resin composition according to Item 1, wherein the organosilicon compound is composed of a compound represented by the following formula (1), contains at least the structure represented by the following formula (3), and the proportion of the structure represented by the following formula (3) with n = 2 is larger than the proportion of the structure represented by the following formula (3) with n = 1. (In the above formula (1), X contains one or more structures represented by the above formula (2) and does not contain structures other than the structure; when X contains two or more structures represented by the above formula (2), the two or more structures may be the same or different; Y １ is a single bond or the structure represented by the above formula (3); in the above formula (2), R １ is independently synonymous with R １ in the above formula (A); R ２ is independently synonymous with R ２ in the above formula (A); Y ２ is a single bond or the structure represented by the above formula (3), and may be the same as or different from the above Y １ ; in the above formula (3), R ３is independently R in the formula (B) ３ is synonymous with; n is an integer from 1 to 30.) 【0008】 Item 3. Furthermore, the resin composition according to Item 1 or 2, comprising a compound having a functional group capable of chemically bonding to the organosilicon compound. Item 4. The resin composition according to Item 3, wherein the compound having the functional group is a compound having two or more groups selected from any one or more of the groups represented by the following formulas (F-1) to (F-8). (In the above formulas (F-1) to (F-8), R ４ is independently a hydrogen atom, an alkyl group having 1 to 20 carbon atoms in which at least one hydrogen atom may be independently replaced by a halogen atom, a cycloalkyl group having 3 to 6 carbon atoms in which at least one hydrogen atom may be independently replaced by a halogen atom, or an aryl group having 6 to 20 carbon atoms in which at least one hydrogen atom may be independently replaced by a halogen atom; * represents a bonding site.) 【0009】 Item 5. The resin composition according to Item 4, wherein the compound having the functional group contains any one or more silicon compounds of a hydrolyzable organosilane compound represented by the following formula (10) and a partial hydrolysis condensate of the hydrolyzable organosilane compound. R ５ ４－ａ SiZ ａ (10) (In the above formula (10), R ５ is independently an alkyl group having 1 to 20 carbon atoms in which at least one hydrogen atom may be independently replaced by a halogen atom, a cycloalkyl group having 3 to 6 carbon atoms in which at least one hydrogen atom may be independently replaced by a halogen atom, or an aryl group having 6 to 20 carbon atoms in which at least one hydrogen atom may be independently replaced by a halogen atom; Z is independently any one of the groups represented by the above formulas (F-1) to (F-8); a is an integer from 2 to 4.) 【0010】 Item 6. The resin composition according to Item 5, wherein the formula (10) is the following formula (11). R ６ ４－ｂ Si(OR ７ ) ｂ(11) (In the above formula (11), R ６ R is an alkyl group having 1 to 20 carbon atoms in which at least one hydrogen atom may be independently replaced by a halogen atom, a cycloalkyl group having 3 to 6 carbon atoms in which at least one hydrogen atom may be independently replaced by a halogen atom, or an aryl group having 6 to 20 carbon atoms in which at least one hydrogen atom may be independently replaced by a halogen atom; ７ (b is independently a hydrogen atom or an alkyl group having 1 to 10 carbon atoms; b is an integer from 2 to 4.) 【0011】 Item 7. The resin composition according to any one of items 1 to 6, further comprising a curing catalyst. 【0012】 Item 8. The resin composition according to item 7, wherein the curing catalyst has one or more elements selected from Zr, Ti, Al, S, I, N, and P. 【0013】 Item 9. A cured product of any one of the resin compositions described in items 1 to 8. 【0014】 Item 10. An element having a layer containing the cured product described in Item 9. 【0015】 Item 11. Electronic equipment having the element described in Item 10. 【0016】 Item 12. A method for producing a resin composition, comprising a compound manufacturing step of reacting a compound represented by the following formula (4) with at least one of the compounds represented by the following formula (5) and the following formula (6) at a temperature of 20°C or higher and 70°C or lower to obtain a silicon compound. (In the above formula (4), R Ａ１ R is independently an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms; Ａ２ R is independently an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms; Ａ７ These are, independently, hydrogen atoms, or -(Si(R Ｂ３ ) ２ -O) ｐ -Si(R Ｂ３ ) ２-OH (where p independently represents an integer from 0 to 30); R Ｂ３ R is independently an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms; in formula (5) above, Ａ３ These are independently C1-C40 alkyl groups, C5 or C6 cycloalkyl groups, or C6-C20 aryl groups; n Ａ１ R is an integer between 1 and 30; in the above formula (6), Ａ４ These are independently C1-C40 alkyl groups, C5 or C6 cycloalkyl groups, or C6-C20 aryl groups; n Ａ２ is an integer between 3 and 30; R Ａ１ , R Ａ２ , R Ａ３ , R Ａ４ , and R Ｂ３ If at least one of the C1-C40 alkyl groups is an alkyl group having 1 to 40 carbon atoms, then the alkyl group having 1 to 40 carbon atoms may independently have at least one hydrogen atom that is a halogen atom, or a cycloalkyl group having 5 or 6 carbon atoms. Ｂ２ , or an aryl group A having 6 to 20 carbon atoms Ｂ４ It may be replaced by at least one -CH ２ The hyphens independently form -O-, -CO-, or a cycloalkylene group A with 5 or 6 carbon atoms. Ｂ３ , or an arylene group A having 6 to 20 carbon atoms Ｂ５ It may be replaced with; R Ａ１ , R Ａ２ , R Ａ３ , R Ａ４ , and R Ｂ３ If at least one of the C5 or C6 cycloalkyl group is a C5 or C6 cycloalkyl group, then at least one hydrogen atom of the C5 or C6 cycloalkyl group is independently a halogen atom, and C1 to C40 alkyl group A Ｃ１ , a cycloalkyl group A having 5 or 6 carbon atoms Ｃ２ , or an aryl group A having 6 to 20 carbon atoms Ｃ４ It may be replaced by at least one -CH ２- may be independently replaced by -O- or -CO-; R Ａ１ R Ａ２ R Ａ３ R Ａ４ and R Ｂ３ when at least any one of them is an aryl group having 6 to 20 carbon atoms, the aryl group having 6 to 20 carbon atoms may be independently such that at least one hydrogen atom is independently a halogen atom, an alkyl group A having 1 to 40 carbon atoms Ｄ１ a cycloalkyl group A having 5 or 6 carbon atoms Ｄ２ or an aryl group A having 6 to 20 carbon atoms Ｄ４ and may be replaced; the alkyl group A Ｃ１ and the alkyl group A Ｄ１ may be independently such that at least one hydrogen atom is independently a halogen atom, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms, and at least one -CH ２ - may be independently replaced by -O-, -CO-, a cycloalkylene group having 5 or 6 carbon atoms, or an arylene group having 6 to 20 carbon atoms; the cycloalkyl group A Ｂ２ the cycloalkylene group A Ｂ３ the cycloalkyl group A Ｃ２ and the cycloalkyl group A Ｄ２ may be independently such that at least one hydrogen atom is independently a halogen atom, an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms, and at least one -CH ２ - may be independently replaced by -O-, -CO-; the aryl group A Ｂ４ the arylene group A Ｂ５ the aryl group A Ｃ４ and the aryl group A Ｄ４ may be independently such that at least one hydrogen atom is independently a halogen atom, an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms. ) 【0017】According to the present invention, it is possible to provide a resin composition containing an organosilicon compound, having a small rate of change in viscosity over time, and excellent handling properties. 【0018】 The present invention will be described in detail below. The following descriptions of constituent elements may be based on representative embodiments or specific examples, but the present invention is not limited to such embodiments. In this specification, numerical ranges expressed using "~" mean a range that includes the numbers written before and after "~" as the lower and upper limits. Also, in this specification, "hydrogen" in the description of structural formulas means "hydrogen atom (H)". Similarly, "carbon atom (C)" may be referred to as "carbon". In this specification, "adjacent groups" means two groups each bonded to one atom, or two groups each bonded to two adjacent atoms in a structural formula (two atoms directly bonded by a covalent bond). Also, in this specification, the expression "A or B" can be read as "at least one selected from the group consisting of A and B". Also, in this specification, when considering the structure "A-B-C", the structure in which B is a single bond means the structure "A-C". 【0019】 Compounds represented by formula (1) are sometimes abbreviated as compound (1). At least one compound selected from the group of compounds represented by formula (1) is sometimes abbreviated as compound (1). "Compound (1)" means one compound represented by formula (1), a mixture of two compounds, or a mixture of three or more compounds. These rules also apply to compounds represented by other formulas. In the chemical formula of a compound, substituent R Ｘ１ The symbol was used for several compounds. In these compounds, any two R Ｘ１ The two groups represented by may be the same or different. For example, R of compound (2-1) Ｘ１ The group is a phenyl group, and the R of compound (2-2) Ｘ１ In some cases, it is a phenyl group. R of compound (2-1) Ｘ１ The group is a phenyl group, and the R of compound (2-2) Ｘ１ In some cases, it is a cyclohexyl group. This rule is RＸ２ , R Ｘ３ This also applies to symbols such as the following. Furthermore, in the chemical formula of a compound, the repeating unit n ５ The symbol was used for several compounds. In these compounds, any two n ５ The two numbers represented by may be the same or different. This rule applies to j ３ , k ２ This also applies to symbols such as: The expression "at least one 'A'" means that the number of 'A's is arbitrary. The expression "at least one 'A' may be replaced by a 'B'" means that when there is one 'A', the position of the 'A' is arbitrary, and when there are two or more 'A's, their positions can be chosen without restriction. This rule also applies to the expression "at least one 'A' has been replaced by a 'B'". The expression "at least one 'A' may be replaced by a 'B', 'C', or 'D'" means that any 'A' is replaced by a 'B', any 'A' is replaced by a 'C', and any 'A' is replaced by a 'D', and furthermore, multiple 'A's are replaced by at least two of 'B', 'C', and / or 'D'. Note that two consecutive -CH ２ This does not include cases where the - sign is replaced by -O-, resulting in -O-O-. In alkyl groups, the methyl portion (-CH) is not included. ２ -H) of -CH ２ This does not include groups where a - is replaced by -O- to become -O-H. Alkyl and alkylene groups may be straight-chain or branched in either case. This means that even if any hydrogen in these groups is replaced by a halogen or a cyclic group, any -CH ２ The same applies when - is replaced by -O-, -CO-, a cycloalkylene group, an arylene group, etc. Note that in this specification, "R １ , R ２ , and R ３ The expression "at least one of the following" is used for multiple R １ , multiple R ２ , and multiple R ３This indicates that at least one of the following is true, and specifically, the object is, for example, multiple R １ One of the R １ This may be the only example. A halogen atom means a fluorine atom, a chlorine atom, a bromine atom, or an iodine atom. Furthermore, while multiple embodiments are described herein, various conditions in each embodiment can be applied to each other to the extent applicable. 【0020】 <Resin Composition> A resin composition according to one embodiment of the present invention (hereinafter also simply referred to as "resin composition") contains an organosilicon compound having the structures represented by the following formulas (A) and (B), wherein the proportion of the organosilicon compound having the structure represented by the following formula (B) with m=2 is greater than the proportion of the structure represented by the following formula (B) with m=1. In this specification, a composition containing the above organosilicon compound is referred to as a resin composition. 【0021】 [Organosilicon Compound (Component A)] (Aspect 1) Hereinafter, organosilicon compounds will be described using formulas (A) and (B), and the aspect of the organosilicon compound described in this section will also be referred to as "Aspect 1". In this specification, numerous aspects of the organosilicon compound are shown, and the conditions in these aspects can be arbitrarily combined with each other to the extent that they are applicable. 【0022】 【0023】In this specification, "organosilicon compounds having structures represented by formulas (A) and (B)" is a concept consisting of a group of organosilicon compounds having structures represented by multiple formulas (A) and (B). In this specification, the "organosilicon compounds having structures represented by formulas (A) and (B)" contained in the resin composition may be one type or two or more types. Furthermore, the structure represented by formula (B) with m=2 is the "structure represented by formula (B) with m=2" contained in all of the above organosilicon compounds contained in the resin composition. Similarly, the structure represented by formula (B) with m=1 is the "structure represented by formula (B) with m=1" contained in all of the above organosilicon compounds contained in the resin composition. Moreover, an organosilicon compound contains at least the structure represented by formula (B), specifically at least the structure represented by formula (B) with m=2, but the structure represented by formula (B) may exist between the structures represented by formula (A) or may exist without being between the structures represented by formula (A). 【0024】 In this specification, the structure represented by the above formula (B) where m=2 is (-O-Si(-R ３ ) ２ This refers to a structure where the number of consecutive structures represented by (-) is 2. In other words, (-O-Si(-R ３ ) ２ A structure in which three consecutive (-) are bonded includes a structure represented by formula (B) where m=1 or 2, but is treated as a structure represented by formula (B) where m=3. Similarly, a structure represented by the above formula (B) where m=1 is treated as (-O-Si(-R ３ ) ２ This refers to a structure where the number of consecutive structures represented by (-O-Si(-R) is 1. ３ ) ２ A structure consisting of consecutive -s is not treated as a structure represented by equation (B) where m=1. 【0025】The inventors have conducted thorough research and found that the resin composition containing the above-mentioned organosilicon compound exhibits a small rate of viscosity change over time. The inventors speculate that the reason for this is as follows: When the proportion of structures represented by formula (B) with m=2 is greater than the proportion of structures represented by formula (B) with m=1, aggregation of the organosilicon compound can be suppressed, and the rate of viscosity change over time can be reduced. Therefore, the above-mentioned resin composition not only yields molded articles with excellent heat resistance and insulation properties because it contains compounds with a silsesquioxane skeleton, but also has excellent storage properties as a resin composition due to its small rate of viscosity change over time. 【0026】 In equation (A), R １ From the viewpoint of ease of synthesis and the viewpoint of being able to adjust various properties such as heat resistance, refractive index, mechanical properties, and optical properties (hereinafter collectively referred to as "the viewpoint of ease of synthesis and adjustment of various properties"), independently, the R is an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms; ２ The above R １ From a similar viewpoint, these are independently C1-C40 alkyl groups, C5-C6 cycloalkyl groups, or C6-C20 aryl groups. 【0027】 In the above formula (B), R ３ The above R １ From a similar viewpoint, independently, the members are C1-C40 alkyl groups, C5 or C6 cycloalkyl groups, or C6-C20 aryl groups; in formula (B) above, m is an integer from 1 to 30, but is preferably 2 to 25, and more preferably 2 to 20, from the viewpoint of ease of synthesis. 【0028】 R １ When R is an aryl group, the following effects can be obtained: improved heat resistance, improved refractive index, and improved rigidity (allowing for adjustment of mechanical properties). １When the alkyl group is used, a moderate and well-balanced refractive index is easily obtained (it is possible to lower the refractive index compared to when it is an aryl group), and toughness is easily improved (mechanical properties can be adjusted). For the effects obtained when these aryl or alkyl groups are used, see R ２ or R ３ The same applies when it is an aryl group or an alkyl group. 【0029】 Below, R １ , R ２ , and R ３ The substituents that can be present are described below, and these groups make it easier to ensure ease of synthesis while maintaining a small rate of change in viscosity over time when used in a resin composition. 【0030】 R １ , R ２ , and R ３ If at least one of the C1-C40 alkyl groups is an alkyl group having 1 to 40 carbon atoms, then the alkyl group having 1 to 40 carbon atoms may independently have at least one hydrogen atom that is a halogen atom, or a cycloalkyl group having 5 or 6 carbon atoms. １２ , or an aryl group A having 6 to 20 carbon atoms １４ It may be replaced by at least one -CH ２ The hyphens independently form -O-, -CO-, or a cycloalkylene group A with 5 or 6 carbon atoms. １３ , or an arylene group A having 6 to 20 carbon atoms １５ It can be replaced with this. 【0031】 R １ , R ２ , and R ３ If at least one of the C5 or C6 cycloalkyl group is a C5 or C6 cycloalkyl group, then at least one hydrogen atom of the C5 or C6 cycloalkyl group is independently a halogen atom, and C1 to C40 alkyl group A ２１ , a cycloalkyl group A having 5 or 6 carbon atoms ２２ , or an aryl group A having 6 to 20 carbon atoms ２４ It may be replaced by at least one -CH ２ The dash can be independently replaced by -O- or -CO-. 【0032】 R １ , R ２ , and R ３ If at least one of the C6-C20 aryl groups, then the C6-C20 aryl group independently comprises at least one hydrogen atom independently comprising a halogen atom and an alkyl group A having 1-C40 atoms. ３１ , a cycloalkyl group A having 5 or 6 carbon atoms ３２ , or an aryl group A having 6 to 20 carbon atoms ３４ It can be replaced with this. 【0033】 The alkyl group A ２１ and the alkyl group A ３１ The hydrogen atom may be independently replaced by a halogen atom, a carbon-5 or carbon-6 cycloalkyl group, or a carbon-6 to carbon-20 aryl group, and at least one -CH ２ The - can be independently replaced by -O-, -CO-, a cycloalkylene group having 5 or 6 carbon atoms, or an arylene group having 6 to 20 carbon atoms. The cycloalkyl group A １２ , the cycloalkylene group A １３ , the cycloalkyl group A ２２ and the cycloalkyl group A ３２ The hydrogen atom may be independently replaced by at least one halogen atom, a C1-C40 alkyl group, a C5 or C6 cycloalkyl group, or a C6-C20 aryl group, and at least one -CH ２ The - can be independently replaced by -O- or -CO-. The aryl group A １４ , the arylene group A １５ , the aryl group A ２４ and the aryl group A ３４ The hydrogen atom may be independently replaced by at least one halogen atom, a C1-C40 alkyl group, a C5 or C6 cycloalkyl group, or a C6-C20 aryl group. 【0034】Furthermore, organosilicon compounds having the structures represented by formulas (A) and (B) above are preferably free of vinyl groups or alkenyl groups, from the viewpoint of minimizing the risk of polymerization reactions occurring and affecting viscosity. 【0035】 Furthermore, the organosilicon compound contains at least one structure represented by formula (B) with m=2, while it may or may not contain one structure represented by formula (B) with m=1. If no structure represented by formula (B) with m=1 is included, the proportion of such structures is 0%. 【0036】 [Aspect 2] The organosilicon compound according to the above-described aspect 1 consists of a compound represented by the following formula (1), and contains at least a structure represented by the following formula (3), wherein the proportion of structures represented by the following formula (3) with n=2 is greater than the proportion of structures represented by the following formula (3) with n=1. This aspect is also referred to as "Aspect 2". The proportion of structures with n=1 or the proportion of structures with n=2 represents the ratio of the number of structures represented by the above formula (B) with m=1 or m=2 to the total number of structures represented by the above formula (B). 【0037】 【0038】 In formula (1) above, X includes one or more structures represented by formula (2) above, and does not include any other structures; when X includes two or more structures represented by formula (2) above, the two or more structures may be the same or different; Y １ is a single bond or a structure represented by formula (3) above; in formula (2) above, R １ R in formula (A) above is independent of R １ It is synonymous with; R ２ R in formula (A) above is independent of R ２ It is synonymous with; Y ２ This is a single bond or a structure represented by formula (3) above, and Y １ It may be the same as or different from; in the above formula (3), R ３ R in formula (B) above is independent of R ３is synonymous with; n is an integer of 1 to 30 from the viewpoint of ease of synthesis, preferably an integer of 2 to 25, and more preferably an integer of 2 to 20. The organosilicon compound contains two or more structures in which X is represented by the above formula (2) and two or more Ys ２ may have a structure represented by the above formula (3). 【0039】 In this specification, the structure represented by the above formula (3) with n = 2 means a structure in which the number of consecutive structures represented by (—O—Si(—R ３ )) ２ —) is 2. That is, a structure in which three consecutive (—O—Si(—R ３ )) ２ —) are bonded is included in the structure represented by the formula (3) with n = 1 or 2, but is treated as the structure represented by the formula (3) with n = 3. Similarly, the structure represented by the above formula (3) with n = 1 means a structure in which the number of consecutive structures represented by (—O—Si(—R ３ )) ２ —) is 1. That is, a structure in which (—O—Si(—R ３ )) ２ —) is consecutive is not treated as the structure represented by the formula (3) with n = 1. 【0040】 (Aspect 3) The organosilicon compound according to the above-described Aspect 1 or 2 preferably further satisfies the following conditions. The aspect in this section is also referred to as "Aspect 3". 【0041】 R １ is independently an alkyl group having 1 to 20 carbon atoms, a cyclohexyl group, or a phenyl group from the viewpoints of ease of synthesis and obtaining various properties such as optical properties. R ２ is independently an alkyl group having 1 to 20 carbon atoms, a cyclohexyl group, or a phenyl group from the same viewpoints as R １ . R ３ is independently an alkyl group having 1 to 20 carbon atoms or a cyclohexyl group from the same viewpoints as R １ . 【0042】From the viewpoint of maintaining a small rate of change in viscosity over time when used in a resin composition, and ensuring ease of synthesis, the following substituents are preferred among the substituents in the above embodiment 1 or 2. 【0043】 R １ , R ２ , and R ３ If at least one of the C1-C20 alkyl groups is an alkyl group having 1 to 20 carbon atoms, then at least one hydrogen atom of the C1-C20 alkyl group may be independently replaced by a fluorine atom, and at least one -CH ２ The dash can be independently replaced by -O- or -CO-. 【0044】 R １ , R ２ , and R ３ If at least one of the groups is a cyclohexyl group, the cyclohexyl group may independently have at least one hydrogen atom independently of a fluorine atom, a C1-C20 alkyl group (at least one hydrogen atom in the alkyl group may be replaced by a fluorine atom, and at least one -CH ２ - may be replaced by -O- or -CO- independently, and at least one -CH ２ The dash can be independently replaced by -O- or -CO-. 【0045】 R １ , and R ２ If at least one of the groups is a phenyl group, the phenyl group may independently have at least one hydrogen atom independently have a fluorine atom, or have a C1-C20 alkyl group (at least one hydrogen atom in the alkyl group may be replaced by a fluorine atom, and at least one -CH ２ (The - may be replaced independently with -O- or -CO-.) 【0046】 (Aspect 4) The organosilicon compound according to the above-described aspect 3 is preferably further satisfied with the following conditions. This aspect is also referred to as "Aspect 4". 【0047】 R １From the viewpoint of ease of synthesis and the ability to obtain various properties such as optical properties, the following are independently available: an alkyl group having 1 to 20 carbon atoms, a cyclohexyl group, or a phenyl group. ２ R １ From a similar viewpoint, independently, it is an alkyl group having 1 to 20 carbon atoms, a cyclohexyl group, or a phenyl group. ３ R １ From a similar viewpoint, they are independently alkyl groups having 1 to 20 carbon atoms, or cyclohexyl groups. 【0048】 From the viewpoint of maintaining a small rate of change in viscosity over time when used in a resin composition, while also ensuring ease of synthesis, the following substituents are preferred among the substituents in the above embodiment 3. 【0049】 R １ , R ２ , and R ３ If at least one of the C1-C20 alkyl groups is an alkyl group having 1 to 20 carbon atoms, then the alkyl group having 1 to 20 carbon atoms independently comprises at least one -CH ２ The dash can be replaced independently with -O-. 【0050】 R １ , R ２ , and R ３ If at least one of the groups is a cyclohexyl group, the cyclohexyl group independently has at least one hydrogen atom in an alkyl group having 1 to 20 carbon atoms (at least one of the alkyl groups is -CH ２ - may be replaced by -O- independently, and at least one -CH ２ The dash can be replaced independently with -O-. 【0051】 R １ , and R ２ If at least one of the groups is a phenyl group, the phenyl group independently has at least one hydrogen atom in an alkyl group having 1 to 20 carbon atoms (at least one of the alkyl groups is -CH ２ (The - can be replaced independently with -O-) 【0052】(Aspect 5) The organosilicon compound according to the above-described aspect 4 is preferably further satisfied with the following conditions. This aspect is also referred to as "Aspect 5". 【0053】 R １ From the viewpoint of ease of synthesis and adjustment of various properties, this is a phenyl group in which, independently, a cyclohexyl group or at least one hydrogen atom may be replaced by an alkyl group having 1 to 20 carbon atoms. ２ The above R １ From a similar viewpoint, independently, a phenyl group may be replaced by an alkyl group having 1 to 20 carbon atoms, or at least one hydrogen atom may be replaced by an alkyl group having 1 to 20 carbon atoms. ３ The above R １ From a similar perspective, it is an alkyl group having 1 to 20 carbon atoms. 【0054】 (Aspect 6) The organosilicon compound according to the above-described aspect 5 is preferably further satisfied with the following conditions. This aspect is also referred to as "Aspect 6". 【0055】 R １ This is a phenyl group in which at least one hydrogen atom may be replaced by an alkyl group having 1 to 20 carbon atoms, from the viewpoint of ease of synthesis and adjustment of various properties. ３ The above R １ From a similar perspective, it is an alkyl group having 1 to 20 carbon atoms. 【0056】 (Aspect 7) The organosilicon compound according to the above-described aspect 6 is preferably further satisfied with the following conditions. This aspect is also referred to as "Aspect 7". 【0057】 R ２ and R ３ From the viewpoint of ease of synthesis and adjustment of various properties, it is an alkyl group having 1 to 6 carbon atoms. 【0058】 (Aspect 8) The organosilicon compound according to the above-described aspect 7 is preferably further satisfied with the following conditions. This aspect is also referred to as "Aspect 8". 【0059】 R １ From the viewpoint of ease of synthesis and adjustment of various properties, it is a phenyl group. ２and R ３ This is a methyl group, from the viewpoint of ease of synthesis and adjustment of various properties. The above describes embodiments 1 to 8. 【0060】 The structure of organosilicon compounds is, １ This can be identified by H-NMR analysis. This identification also allows for the analysis of the proportion of structures represented by formula (B) above where m=2 (in the case of embodiment 2, the proportion of structures represented by formula (3) where n=2) and the proportion of structures where m=1 (in the case of embodiment 2, the proportion of structures represented by formula (3) where n=1). For example, the proportion of structures represented by formula (B) where m=2 is the proportion when the proportion of all structures represented by formula (B) is set to 100%. In other words, the denominator of this proportion is the sum of the number of all structures represented by formula (B) with different numbers of m when an organosilicon compound having structures represented by formulas (A) and (B) is composed of multiple types of organosilicon compounds with different numbers of m. The same applies to the proportion of structures where m=1, and also to the proportion of structures with n=2 and n=1 in embodiment 2. 【0061】 When considering the structure represented by formula (B) in the entirety of all organosilicon compounds having structures represented by formulas (A) and (B) contained in the resin composition, the proportion of structures represented by formula (B) with m=2 should be greater than the proportion of structures represented by formula (B) with m=1. The ratio of the proportion of structures represented by formula (B) with m=2 to the proportion of structures represented by formula (B) with m=1 (m=2 / m=1) is not particularly limited as long as it is greater than 1. However, when the proportion of all structures represented by formula (B) is taken as 100%, from the viewpoint of reducing the rate of change in viscosity over time when it is made into a resin composition, it is preferable that the proportion of structures with m=1 is 30% or less and m=2 / m=1 is 1.05 or more, and more preferably that the proportion of structures with m=1 is 25% or less and m=2 / m=1 is 1.1 or more. Furthermore, the upper limit of this ratio may be 9.0 or less. 【0062】The ratio of the number of structures represented by formula (B) where m=1 to the total number of structures represented by formula (B) is not particularly limited, but from the viewpoint of ensuring a small rate of change in viscosity over time when made into a resin composition, it is preferably 25% or less, more preferably 23% or less, and even more preferably 20% or less. The ratio of structures represented by formula (B) where m=2 to the total number of structures represented by formula (B) is not particularly limited, but from the viewpoint of ensuring a small rate of change in viscosity over time when made into a resin composition, it is preferably 20% or more, more preferably 23% or more, and even more preferably 25% or more. The ratio of structures represented by formula (B) where m=1 and the ratio of structures represented by formula (B) where m=2 can be achieved by adjusting the reaction temperature, reaction time, amount of catalyst, solid content concentration, etc. 【0063】 Furthermore, if there are multiple types of organosilicon compounds with different structures, as represented by formulas (A) and (B), the "proportion of structures represented by formula (B) with m=2" refers to the proportion of structures with m=2 included in the total number of organosilicon compounds. The same applies to the "proportion of structures represented by formula (B) with m=1". 【0064】 There are no particular limitations on how to make the proportion of structures represented by formula (B) with m=2 greater than the proportion of structures represented by formula (B) with m=1. This can be achieved, for example, by adjusting synthesis conditions such as reaction temperature, reaction time, catalyst amount, and solid content concentration. Specifically, for example, if the reaction temperature is too high or the reaction time is too long, the cleavage of siloxane bonds will proceed, making it easier for the proportion of structures with m=1 to increase. If the reaction temperature is too low or the reaction time is too short, raw materials will remain, and the amount of organosilicon compound obtained will decrease. 【0065】The organosilicon compounds having the structures represented by formulas (A) and (B) above may more specifically be organosilicon compounds having the structure represented by the following formula (1-1), wherein they contain at least the structure represented by the following formula (1-2), and the proportion of the structure represented by the following formula (1-2) is greater than the proportion of the structure represented by the following formula (1-3). 【0066】 【0067】 In the above formulas (1-1), (1-2), and (1-3), R Ｘ１ , R Ｘ２ , and R Ｘ３ These are, independently, the R mentioned above. １ , R ２ , and R ３ This is synonymous with n. １ n is independently, from the viewpoint of ease of composition, 0 or an integer from 1 to 30, more preferably an integer from 1 to 30, even more preferably 2 to 25, and particularly preferably 2 to 20. ２ n is independently, from the viewpoint of ease of composition, 0 or an integer from 1 to 30, more preferably an integer from 1 to 30, even more preferably 2 to 25, and particularly preferably 2 to 20. ３ n is independently, from the viewpoint of ease of composition, 0 or an integer from 1 to 30, more preferably an integer from 1 to 30, even more preferably 2 to 25, and particularly preferably 2 to 20. １ +n ２ +n ３ j is 1 or greater. １ j is independently either 0 or 1. ２ j is independently either 0 or 1. １ +j ２ k is either 1 or 2. １ n represents an integer between 1 and 1,000. In the above formula (1-1), n ​​represents an integer between 1 and 1,000. １ , n ２ , or n ３ If it is 2, then these symbols correspond to (-O-Si(-R Ｘ３ ) ２The structure represented by -) is given by equation (1-2), n １ , n ２ , or n ３ If it is 1, then these symbols correspond to (-O-Si(-R Ｘ３ ) ２ The structure represented by -) is given by formula (1-3). In this specification, the structure represented by formula (1-2) is (-O-Si(-R Ｘ３ ) ２ This refers to a structure where the number of consecutive structures represented by (-) is 2. In other words, (-O-Si(-R Ｘ３ ) ２ A structure in which three consecutive (-) are linked together includes the structure represented by formula (1-3) or (1-2), but is not treated as a structure represented by formula (1-3) or (1-2). Similarly, the structure represented by the above formula (1-3) is treated as (-O-Si(-R Ｘ３ ) ２ This refers to a structure where the number of consecutive structures represented by (-O-Si(-R) is 1. Ｘ３ ) ２ Structures with consecutive -s are not treated as structures represented by equation (1-3). 【0068】 More specifically, an organosilicon compound having the structure represented by formula (1-1) includes one or more compounds selected from the group consisting of compounds represented by the following formulas (2-1), (2-2), and (2-3). In this case as well, it similarly includes at least the structure represented by formula (1-2), and the proportion of the structure represented by formula (1-2) is greater than the proportion of the structure represented by formula (1-3). 【0069】 【0070】 【0071】 【0072】 In the above equations (2-1), (2-2), and (2-3), R Ｘ１ , R Ｘ２ , and R Ｘ３ These are independently R in the above equations (1-1), (1-2), and (1-3), respectively. Ｘ１ , R Ｘ２ , and RＸ３ It is synonymous with j. ３ , j ４ , and k ２ The conditions are independent of each other, and each is j in equation (1-1) above. １ , j ２ , and k １ The same conditions can be applied to n. ４ These are independent integers from 1 to 30, and n ５ n is an integer, independently of 0 or 1 to 30. ６ n are independent integers between 1 and 30. However, in equation (2-3), n ５ n is 1 or greater. For preferred numerical ranges, each of the following is independently determined by n in the above formula (1-1): １ , n ２ and n ３ The same conditions can be applied. 【0073】 The embodiment comprising one or more compounds selected from the group consisting of compounds represented by the above formulas (2-1), (2-2), and (2-3) may more specifically be, for example, an embodiment comprising one or more compounds selected from the group consisting of compounds represented by the above formulas (2-2) and (2-3). 【0074】 Furthermore, the organosilicon compounds having the structures represented by formulas (A) and (B) above may be, for example, compounds represented by the following formula (1'). In this case as well, the compound contains at least the structure represented by formula (B) above, and the proportion of the structure represented by formula (B) with m=2 is greater than the proportion of the structure represented by the following formula (B) with m=1. 【0075】 【0076】 In the above equation (1'), R Ｐ１ , R Ｐ２ , and R Ｐ３ These are, independently, the R mentioned above. １ , R ２ , and R ３ This is synonymous with n. Ｐ１ Independently, from the viewpoint of ease of synthesis, the above-mentioned n １ It is synonymous with n Ｐ２ The above n is independent of the above１ This is equivalent to the above. In formula (1') above, k represents an integer from 1 to 1,000. Note that when specifying the structure of organosilicon compounds, the weight-average molecular weight or number-average molecular weight shown below may be used instead of k. 【0077】 The weight-average molecular weight of the organosilicon compound is not particularly limited, but is preferably 3,000 to 700,000, more preferably 5,000 to 600,000, and even more preferably 7,000 to 500,000. When the weight-average molecular weight is within the above range, the resin composition containing the organosilicon compound can be adjusted to a viscosity that facilitates stirring and coating. The weight-average molecular weight can be adjusted by the reaction temperature, the amount of raw materials, the amount of catalyst used if one is used, etc. 【0078】 The weight-average molecular weight mentioned above can be measured by gel permeation chromatography (GPC) analysis. An example of specific measurement conditions for GPC analysis is shown below. (Example of GPC analysis measurement conditions) Column: Two Shodex KF805L + Shodex KF804L columns in series, manufactured by Resonaq Corporation Mobile phase: THF Flow rate: 1.0 ml / min Temperature: 40°C Detector: RI Molecular weight standard sample: Polystyrene with known molecular weight 【0079】 [NMR (Nuclear Magnetic Resonance Spectrum)] As described above １ For H-NMR measurements, for example, the JNM-ECZ500R manufactured by JEOL Ltd. can be used. １ In 1H-NMR measurements, the sample is dissolved in a deuterated solvent such as deuterated acetone (manufactured by Wako Pure Chemical Industries, Ltd.), and measurements can be performed at room temperature, 500 MHz, and with 16 integration cycles. １ From the integral ratio of H-NMR, the proportion of structures represented by equation (B) with m=2 and the proportion of structures represented by equation (B) with m=1 can be calculated. 【0080】 [Viscosity Measurement] The viscosity of the resin composition containing the above compound can be measured using, for example, an E-type rotational viscometer manufactured by Toki Sangyo Co., Ltd. This measurement can be performed, for example, under conditions of 25°C and 20 rpm. 【0081】[Method for Producing Organosilicon Compounds] The method for producing the organosilicon compounds described above is not particularly limited. An example of a production method is shown below, but is not limited to this. 【0082】 An example of a method for producing organosilicon compounds is a method for producing organosilicon compounds that includes a step of reacting a compound represented by the following formula (4) (a compound containing a silsesquioxane skeleton) with at least one of the compounds represented by the following formula (5) and the following formula (6) at a temperature of 0°C or higher and less than 80°C. Specifically, it is preferable to produce the compounds by polymerizing each of the above components in the presence of a catalyst. The reaction temperature is preferably 20°C or higher and 70°C or lower, from the viewpoint of the weight-average molecular weight of the resulting organosilicon compound and from the viewpoint of the ratio of the proportion of n=2 structures to the proportion of n=1 structures being likely to exceed 1. 【0083】 【0084】 R in equation (4) above Ａ１ and R Ａ２ The condition is R in equation (A) above. １ and R ２ The conditions can be applied similarly to each of them. Also, R in equations (5) and (6) above. Ａ３ and R Ａ４ The condition is independent of R in equation (B) above. ３ The same conditions can be applied to n in equations (5) and (6) above. Ａ１ and n Ａ２ The condition of can be applied independently to the same condition for m in equation (B) described above. That is, R Ａ１ , R Ａ２ , R Ａ３ , R Ａ４ , n Ａ１ , and n Ａ２ These are R in each of the above-described embodiment 1. １ , R ２ , R ３ , R ３ The conditions of , m, and m are met, and specifically the following conditions are met. 【0085】 In the above formula (4), RＡ１ R is independently an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms; Ａ２ R is independently an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms; Ａ７ These are, independently, hydrogen atoms, or -(Si(R Ｂ３ ) ２ -O) ｐ -Si(R Ｂ３ ) ２ -OH (where p independently represents an integer from 0 to 30); R Ｂ３ R is independently an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms; in formula (5) above, Ａ３ These are independently C1-C40 alkyl groups, C5 or C6 cycloalkyl groups, or C6-C20 aryl groups; n Ａ１ R is an integer from 1 to 30, and from the viewpoint of availability, it is preferably an integer from 1 to 6, and more preferably an integer from 1 to 4; in the above formula (6), R Ａ４ These are independently C1-C40 alkyl groups, C5 or C6 cycloalkyl groups, or C6-C20 aryl groups; n Ａ２ R is an integer between 3 and 30; Ａ１ , R Ａ２ , R Ａ３ , R Ａ４ , and R Ｂ３ If at least one of the C1-C40 alkyl groups is an alkyl group having 1 to 40 carbon atoms, then the alkyl group having 1 to 40 carbon atoms may independently have at least one hydrogen atom that is a halogen atom, or a cycloalkyl group having 5 or 6 carbon atoms. Ｂ２ , or an aryl group A having 6 to 20 carbon atoms Ｂ４ It may be replaced by at least one -CH ２ The hyphens independently form -O-, -CO-, or a cycloalkylene group A with 5 or 6 carbon atoms. Ｂ３ , or an arylene group A having 6 to 20 carbon atoms Ｂ５ It may be replaced with; R Ａ１ , RＡ２ , R Ａ３ , R Ａ４ , and R Ｂ３ If at least one of the C5 or C6 cycloalkyl group is a C5 or C6 cycloalkyl group, then at least one hydrogen atom of the C5 or C6 cycloalkyl group is independently a halogen atom, and C1 to C40 alkyl group A Ｃ１ , a cycloalkyl group A having 5 or 6 carbon atoms Ｃ２ , or an aryl group A having 6 to 20 carbon atoms Ｃ４ It may be replaced by at least one -CH ２ The - can be independently replaced by -O- or -CO-; R Ａ１ , R Ａ２ , R Ａ３ , R Ａ４ , and R Ｂ３ If at least one of the C6-C20 aryl groups, then the C6-C20 aryl group independently comprises at least one hydrogen atom independently comprising a halogen atom and an alkyl group A having 1-C40 atoms. Ｄ１ , a cycloalkyl group A having 5 or 6 carbon atoms Ｄ２ , or an aryl group A having 6 to 20 carbon atoms Ｄ４ It may be replaced by the alkyl group A Ｃ１ and the alkyl group A Ｄ１ The hydrogen atom may be independently replaced by a halogen atom, a carbon-5 or carbon-6 cycloalkyl group, or a carbon-6 to carbon-20 aryl group, and at least one -CH ２ The - can be independently replaced by -O-, -CO-, a cycloalkylene group having 5 or 6 carbon atoms, or an arylene group having 6 to 20 carbon atoms; the cycloalkyl group A Ｂ２ , the cycloalkylene group A Ｂ３ , the cycloalkyl group A Ｃ２ and the cycloalkyl group A Ｄ２ The hydrogen atom may be independently replaced by at least one halogen atom, a C1-C40 alkyl group, a C5 or C6 cycloalkyl group, or a C6-C20 aryl group, and at least one -CH ２The - can be independently replaced by -O-, -CO-, etc.; the aryl group A Ｂ４ , the arylene group A Ｂ５ , the aryl group A Ｃ４ and the aryl group A Ｄ４ The hydrogen atom may be independently replaced by at least one halogen atom, a C1-C40 alkyl group, a C5 or C6 cycloalkyl group, or a C6-C20 aryl group. 【0086】 Furthermore, R Ａ１ , R Ａ２ , R Ａ３ , R Ａ４ , R Ｂ３ , n Ａ１ , and n Ａ２ The conditions of not only Embodiment 1 described above, but also Embodiments 2 to 7, which are embodiments that limit Embodiment 1, can be applied in the same way. 【0087】 The order in which the reaction is carried out is not restricted. The reaction may be carried out by heating a mixture containing all the raw materials, or by adding and mixing each raw material as it is added. 【0088】 The ratio of the total amount of at least one of the compounds represented by formula (5) and formula (6) to the total amount of the compound represented by formula (4) is not particularly limited, but it is preferably 0.3 or more, more preferably 0.5 or more, even more preferably 0.7 or more, and preferably 15 or less, more preferably 10 or less, and even more preferably 5 or less in molar ratio. If the ratio is above the lower limit of the above range, it is easy to obtain an organosilicon compound with flexibility. If the ratio is below the upper limit of the above range, it is easy to obtain an organosilicon compound with high heat resistance. 【0089】The compound represented by formula (4) above can be obtained, for example, by reacting the compound represented by formula (7) below with the compound represented by formula (8) below and hydrolyzing them, as described in Japanese Patent Publication No. 2006-222207. Here, X represents a halogen atom or a hydrogen atom. The compound represented by formula (7) can also be obtained by hydrolyzing and condensing the compound represented by formula (9) in the presence of sodium hydroxide and water, as described in Japanese Patent Publication No. 2006-222207. 【0090】 【0091】 In equations (7) to (9) above, R Ａ１ and R Ａ２ These are R in equations (4) to (6) above, respectively. Ａ１ and R Ａ２ It is synonymous with [the above]. 【0092】The reaction of the compounds represented by formulas (4) to (6) above typically uses an acid or a base as a catalyst. In the method for producing the organosilicon compound described above in this embodiment, an acid is preferred as a catalyst, considering the stability of silsesquioxane during the reaction. Examples of acid catalysts include hydrochloric acid, phosphoric acid, toluenesulfonic acid, methanesulfonic acid, trifluoromethanesulfonic acid, sulfuric acid, fluorosulfuric acid, nitric acid, acetic acid, activated clay, or cation exchange resins such as sulfonic acid-based ion exchange resins (commercial products include RCP-160M ​​(strong acid cation exchange resin, manufactured by Mitsubishi Chemical Corporation)). Among these, sulfuric acid, methanesulfonic acid, trifluoromethanesulfonic acid, activated clay, or cation exchange resins are preferred, with sulfuric acid being more preferred. The shape of the catalyst is not particularly limited, but from the viewpoint of reaction rate, it is preferable to be liquid rather than solid. The amount of catalyst used (content in a mixture) is not particularly limited, as long as it is sufficient to promote the polymerization reaction. From the viewpoint of promoting the reaction, the amount of the organosilicon compound raw material is preferably 0.5% by mass or more, more preferably 0.7% by mass or more, and even more preferably 0.9% by mass or more, relative to the total mass of the raw material. Furthermore, from the viewpoint of cost-effectiveness and polymerization stability, it is preferably 40% by mass or less, preferably 20% by mass or less, and more preferably 10% by mass or less. 【0093】The above reaction is preferably carried out using a solvent. The solvent is not particularly limited as long as it is capable of dissolving the compound represented by formula (4) above, and at least one of the compounds represented by formula (5) and formula (6) above, and does not react with the catalyst when a catalyst is used. Examples of such solvents include hydrocarbon solvents such as butane, hexane, heptane, octane, or cyclohexane; aromatic hydrocarbon solvents such as benzene, toluene, xylene, mesitylene, or anisole; ether solvents such as diethyl ether, diisopropyl ether, 1,2-dimethoxyethane, tetrahydrofuran (THF), 2-methyltetrahydrofuran (2MTHF), 4-methyltetrahydropyran (MTHP), cyclopentyl methyl ether (CPME), or dioxane; methylene chloride, chloroform, etc. Examples include halogenated hydrocarbon solvents such as carbon tetrachloride; ester solvents such as ethyl acetate; glycol ester solvents such as propylene glycol monomethyl ether acetate (PGMEA); sulfur-containing or nitrogen-containing solvents such as dimethylformamide (DMF), dimethylacetamide (DMAc), dimethyl sulfoxide (DMSO), N-methylpyrrolidone (NMP), or pyridine; alcohol-containing solvents such as methanol, ethanol, isopropanol, or butanol; and ketone-containing solvents such as acetone or methyl ethyl ketone. Among these, toluene, xylene, mesitylene, anisole, THF, 2MTHF, MTHP, or CPME are preferred, and toluene, MTHP, or CPME are more preferred. The solvent may be a single solvent or two or more solvents. The amount of solvent used is not particularly limited and may be set appropriately according to the size of the reactor used and the amount of components to be dissolved. However, for example, the total content of the compound represented by formula (4) above, and at least one of the compounds represented by formula (5) above and formula (6) below is preferably 20 to 80% by mass, more preferably 30 to 70% by mass, and even more preferably 40 to 60% by mass. 【0094】Furthermore, the reactions of the compounds represented by formulas (4) to (6) above may be carried out with the addition of water. 【0095】 The reactions of the compounds represented by formulas (4) to (6) above may be carried out using other components, as long as they allow for the production of the organosilicon compounds described above. 【0096】 The reaction temperature should be between 0°C and 80°C, but preferably between 10°C and 75°C, more preferably between 15°C and 70°C, and even more preferably between 20°C and 70°C, from the viewpoint of making the proportion of structures represented by formula (B) with m=2 greater than the proportion of structures represented by formula (B) with m=1 in the target product group. 【0097】 The reaction time is not particularly limited; for example, it may be between 0.5 hours and 48 hours, between 1 hour and 40 hours, or between 2 hours and 30 hours. 【0098】 The reaction atmosphere is not particularly limited; for example, the reaction may be carried out in the atmosphere or in the presence of an inert gas such as nitrogen or argon. 【0099】 For more specific methods of synthesizing organosilicon compounds, refer to the methods described in, for example, Japanese Patent Publication No. 2010-116464 and Japanese Patent Publication No. 2020-90572. 【0100】 The content of organosilicon compounds in the resin composition is not particularly limited, but it is preferably 5% by mass or more and 90% by mass or less, more preferably 10% by mass or more and 85% by mass or less, and even more preferably 15% by mass or more and 80% by mass or less, based on 100% by mass of the resin composition. To obtain the desired film thickness after coating, it is preferable that the content is above the lower limit of the above range. Also, from the viewpoint of solubility, it is preferable that the content is below the upper limit of the above range. 【0101】 The resin composition may also contain components other than the organosilicon compounds described above, such as a compound (component B) having a functional group that can chemically bond with component A, which will be described later. 【0102】[Compounds having functional groups that can chemically bond with organosilicon compounds] The resin composition may contain components other than the organosilicon compounds (component A) described above. For example, the resin composition may contain a compound (component B) having functional groups that can chemically bond with component A described above. In particular, if component B has two or more functional groups that can chemically bond with component A, component B acts as a crosslinking agent, so that a crosslinked product (siloxane polymer) of component A bonded via component B can be obtained. Note that component B may be used alone or in combination of two or more types. 【0103】 Component B, which has a functional group that can chemically bond with component A, is a compound having two or more of one or more of the groups represented by the following formulas (F-1) to (F-8). 【0104】 【0105】 In the above formulas (F-1) to (F-8), R ４ This group is independently a hydrogen atom, a C1-C20 alkyl group in which at least one hydrogen atom may be independently replaced by a halogen atom, a C3-C6 cycloalkyl group in which at least one hydrogen atom may be independently replaced by a halogen atom, or a C6-C20 aryl group in which at least one hydrogen atom may be independently replaced by a halogen atom; * represents a bonding site. Of the above groups, those that can take on either a linear or branched chain structure may take either a linear or branched chain structure. 【0106】 R ４The functional group is not particularly limited as long as it is independently a hydrogen atom, a C1-C20 alkyl group in which at least one hydrogen atom may be independently replaced by a halogen atom, a C3-C6 cycloalkyl group in which at least one hydrogen atom may be independently replaced by a halogen atom, or a C6-C20 aryl group in which at least one hydrogen atom may be independently replaced by a halogen atom. However, from the viewpoint of reactivity with component A, it is preferably a hydrogen atom, a methyl group, an ethyl group, a propyl group, or a butyl group, and is particularly preferably a hydrogen atom, a methyl group, or an ethyl group. Of the above functional groups, the propyl group or butyl group may have either a linear or branched structure. 【0107】 From the viewpoint of curability and viscosity change rate over time, among the groups represented by formulas (F-1) to (F-8) above, one or more groups represented by formulas (F-1) to (F-6) are preferred, and one or more groups represented by formulas (F-2) and (F-6) are particularly preferred. 【0108】 The following describes the more specific structure of component B. Component B can take the form of either a linear or branched chain, and may also have a ring structure. 【0109】 From the viewpoint of the heat resistance of the product obtained by chemically bonding with component A, component B preferably contains one or more silicon compounds from among the hydrolyzable organosilane compounds represented by the following formula (10) and the partially hydrolyzed condensates of said hydrolyzable organosilane compounds. Note that in this specification, the expression "compound X includes compound Y and compound Z" may also be expressed as "compound X includes compound Y and compound Z." ５ ４－ａ SiZ ａ (10) In the above formula (10), R ５F is independently a C1-C20 alkyl group in which at least one hydrogen atom may be independently replaced by a halogen atom, a C3-C6 cycloalkyl group in which at least one hydrogen atom may be independently replaced by a halogen atom, or an aryl group in which at least one hydrogen atom may be independently replaced by a halogen atom; Z is independently one of the groups represented by formulas (F-1) to (F-8); and a is an integer from 2 to 4. 【0110】 R ５ The group is not particularly limited as long as it is an alkyl group having 1 to 20 carbon atoms in which at least one hydrogen atom may be independently replaced by a halogen atom, a cycloalkyl group having 3 to 6 carbon atoms in which at least one hydrogen atom may be independently replaced by a halogen atom, or an aryl group having 6 to 20 carbon atoms in which at least one hydrogen atom may be independently replaced by a halogen atom. However, from the viewpoint of the heat resistance of the product obtained by chemically bonding with component A, it is preferable that the group is an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 3 to 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms, and is particularly preferable that it is an alkyl group having 1 to 6 carbon atoms or an aryl group having 6 to 20 carbon atoms. 【0111】 Furthermore, from the viewpoint of reactivity with component A, the above formula (10) is preferably the following formula (11). ６ ４－ｂ Si(OR) ７ ) ｂ (11) In the above formula (11), R ６ R is an alkyl group having 1 to 20 carbon atoms in which at least one hydrogen atom may be independently replaced by a halogen atom, a cycloalkyl group having 3 to 6 carbon atoms in which at least one hydrogen atom may be independently replaced by a halogen atom, or an aryl group having 6 to 20 carbon atoms in which at least one hydrogen atom may be independently replaced by a halogen atom; ７ b is independently a hydrogen atom or an alkyl group having 1 to 10 carbon atoms; b is an integer from 2 to 4. 【0112】 R ６The group is not particularly limited as long as it is an alkyl group having 1 to 20 carbon atoms in which at least one hydrogen atom may be independently replaced by a halogen atom, a cycloalkyl group having 3 to 6 carbon atoms in which at least one hydrogen atom may be independently replaced by a halogen atom, or an aryl group having 6 to 20 carbon atoms in which at least one hydrogen atom may be independently replaced by a halogen atom. However, from the viewpoint of the heat resistance of the product obtained by chemically bonding with component A, it is preferable that the group is an alkyl group having 1 to 10 carbon atoms, a cycloalkyl group having 3 to 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms, and is particularly preferable that it is an alkyl group having 1 to 6 carbon atoms or an aryl group having 6 to 20 carbon atoms. 【0113】 R ７ The elements are not particularly limited as long as they are a hydrogen atom or an alkyl group having 1 to 10 carbon atoms, but from the viewpoint of reactivity with component A, an alkyl group having 1 to 6 carbon atoms is particularly preferred. 【0114】 Furthermore, component B may be a compound having one or more structural units of the following formulas (B-1) to (B-4). 【0115】 【0116】 In formulas (B-1) to (B-4), R Ｂ１ Independently, each of the above formulas (F-1) to (F-8) represents any of the groups, or alkyl groups such as methyl, ethyl, propyl, butyl, pentyl, hexyl, cyclohexyl, octyl, nonyl, or decyl groups; aryl groups such as phenyl, tolyl, xylyl, or naphthyl groups; aralkyl groups such as benzyl, phenylethyl, or phenylpropyl groups; or groups in which at least one hydrogen atom is independently replaced by a halogen atom such as a fluorine, chlorine, or bromine atom, such as chloromethyl, chloropropyl, bromoethyl, trifluoropropyl, or cyanoethyl groups, where * represents a bonding site. Of the above functional groups, groups that can take on either a linear or branched structure, such as propyl, butyl, or pentyl groups, may take either a linear or branched structure. 【0117】Component B can be obtained, for example, by using at least one compound of the following formulas (B-5) and (B-6) by known methods such as ring-opening polymerization and hydrolysis condensation, or by the method described in International Publication No. 2014 / 098189. 【0118】 【0119】 In formula (B-5), R Ｂ２ These are independently any of the groups represented by the above formulas (F-1) to (F-8), or alkyl groups such as methyl, ethyl, propyl, butyl, pentyl, hexyl, cyclohexyl, octyl, nonyl, or decyl groups; aryl groups such as phenyl, tolyl, xylyl, or naphthyl groups; aralkyl groups such as benzyl, phenylethyl, or phenylpropyl groups; or groups in which at least one hydrogen atom is independently replaced by a halogen atom such as a fluorine, chlorine, or bromine atom, such as chloromethyl, chloropropyl, bromoethyl, or trifluoropropyl groups. Of the above functional groups, groups that can take on either a linear or branched structure, such as propyl, butyl, or pentyl groups, may take either a linear or branched structure. 【0120】 R in equation (B-6) Ｂ４ These are independently any of the groups represented by the above formulas (F-1) to (F-8), or alkyl groups such as methyl, ethyl, propyl, butyl, pentyl, hexyl, cyclohexyl, octyl, nonyl, or decyl groups; aryl groups such as phenyl, tolyl, xylyl, or naphthyl groups; aralkyl groups such as benzyl, phenylethyl, or phenylpropyl groups; or groups in which at least one hydrogen atom is independently replaced by a halogen atom such as a fluorine, chlorine, or bromine atom, such as chloromethyl, chloropropyl, bromoethyl, or trifluoropropyl groups. Of the above functional groups, groups that can take on either a linear or branched structure, such as propyl, butyl, or pentyl groups, may have either a linear or branched structure. 【0121】In formulas (B-5) and (B-6), b １ b is an integer between 3 and 6. ２ It is 0 or an integer from 1 to 9. 【0122】 More specifically, examples of component B include 1,3-dimethoxytetramethyldisiloxane, 1,5-dimethoxyhexamethyltrisiloxane, polydimethylsiloxane with dimethylmethoxysiloxy sealed at both ends of the molecular chain, polymethylphenylsiloxane with dimethylmethoxysiloxy sealed at both ends of the molecular chain, polydiphenylsiloxane with dimethylmethoxysiloxy sealed at both ends of the molecular chain, dimethylsiloxane / dimethoxysiloxane copolymer with dimethylmethoxysiloxy sealed at both ends of the molecular chain, methylphenylsiloxane / dimethoxysiloxane copolymer with dimethylmethoxysiloxy sealed at both ends of the molecular chain, diphenylsiloxane / dimethoxysiloxane copolymer with dimethylmethoxysiloxy sealed at both ends of the molecular chain, polydimethylsiloxane with methyldimethoxysiloxy sealed at both ends of the molecular chain, polymethylphenylsiloxane with methyldimethoxysiloxy sealed at both ends of the molecular chain, and methyldimethoxysiloxane C-sealed polydiphenylsiloxane, molecular chain end-to-end methyldimethoxysiloxy sealed dimethylsiloxane / dimethoxysiloxane copolymer, molecular chain end-to-end methyldimethoxysiloxy sealed methylphenylsiloxane / dimethoxysiloxane copolymer, molecular chain end-to-end methyldimethoxysiloxy sealed diphenylsiloxane / dimethoxysiloxane copolymer, molecular chain end-to-end trimethoxysiloxy sealed polydimethylsiloxane, molecular chain end-to-end trimethoxysiloxy sealed polymethylphenylsiloxane, molecular chain end-to-end trimethoxysiloxy sealed polydiphenylsiloxane, molecular chain end-to-end trimethoxysiloxy sealed dimethylsiloxane / dimethoxysiloxane copolymer, molecular chain end-to-end trimethoxysiloxy sealed methylphenylsiloxane / dimethoxysiloxane copolymer, or molecular chain end-to-end trimethoxysiloxy sealed diphenylsiloxane / dimethoxysiloxane copolymer; 【0123】1,3-Diethoxytetramethyldisiloxane, 1,5-Diethoxyhexamethyltrisiloxane, Polydimethylsiloxane with dimethylethoxysiloxy sealed at both ends of the molecular chain, Polymethylphenylsiloxane with dimethylethoxysiloxy sealed at both ends of the molecular chain, Polydiphenylsiloxane with dimethylethoxysiloxy sealed at both ends of the molecular chain, Dimethylsiloxane / Diethoxysiloxane copolymer with dimethylethoxysiloxy sealed at both ends of the molecular chain Body, molecular chain with dimethylethoxysiloxy sealed at both ends: methylphenylsiloxane / diethoxysiloxane copolymer, molecular chain with dimethylethoxysiloxy sealed at both ends: diphenylsiloxane / diethoxysiloxane copolymer, molecular chain with methyldiethoxysiloxy sealed at both ends: polydimethylsiloxane, molecular chain with methyldiethoxysiloxy sealed at both ends: polymethylphenylsiloxane, molecular chain with methyldiethoxysiloxy sealed at both ends: polydiphenylsiloxane Nylsiloxane, dimethylsiloxane / diethoxysiloxane copolymer with methyldiethoxysiloxy sealed at both ends of the molecular chain, methylphenylsiloxane / diethoxysiloxane copolymer with methyldiethoxysiloxy sealed at both ends of the molecular chain, diphenylsiloxane / diethoxysiloxane copolymer with methyldiethoxysiloxy sealed at both ends of the molecular chain, polydimethylsiloxane with triethoxysiloxy sealed at both ends of the molecular chain, triethoxysiloxane copolymer with triethoxysiloxy sealed at both ends of the molecular chain Sisiloxy-bound polymethylphenylsiloxane, triethoxysiloxy-bound polydiphenylsiloxane at both ends of the molecular chain, triethoxysiloxy-bound dimethylsiloxane / diethoxysiloxane copolymer at both ends of the molecular chain, triethoxysiloxy-bound methylphenylsiloxane / diethoxysiloxane copolymer at both ends of the molecular chain, or triethoxysiloxy-bound diphenylsiloxane / diethoxysiloxane copolymer at both ends of the molecular chain; 【0124】1,3-Dihydroxytetramethyldisiloxane, 1,5-Dihydroxyhexamethyltrisiloxane, 1,5-Dihydroxyhexaphenyltrisiloxane, Polydimethylsiloxane with dimethylhydroxysiloxy sealed at both ends of the molecular chain, Polymethylphenylsiloxane with dimethylhydroxysiloxy sealed at both ends of the molecular chain, Polydiphenylsiloxane with dimethylhydroxysiloxy sealed at both ends of the molecular chain, Dimethylsiloxane / Dihydroxysiloxane copolymer with dimethylhydroxysiloxy sealed at both ends of the molecular chain, Methylphenylsiloxane / Dihydroxysiloxane copolymer with dimethylhydroxysiloxy sealed at both ends of the molecular chain, Diphenylsiloxane / Dihydroxysiloxane copolymer with methyldihydroxysiloxy sealed at both ends of the molecular chain, Polydimethylsiloxane with methyldihydroxysiloxy sealed at both ends of the molecular chain, Polymethylphenylsiloxane with methyldihydroxysiloxy sealed at both ends of the molecular chain, Methyldihydroxy Sisiloxy-bound polydiphenylsiloxane, molecular chain end-to-end methyldihydroxysiloxy-bound dimethylsiloxane / dihydroxysiloxane copolymer, molecular chain end-to-end methyldihydroxysiloxy-bound methylphenylsiloxane / dihydroxysiloxane copolymer, molecular chain end-to-end methyldihydroxysiloxy-bound diphenylsiloxane / dihydroxysiloxane copolymer, molecular chain end-to-end trihydroxysiloxy-bound polydimethylsiloxane, molecular chain end-to-end trihydroxysiloxy-bound polymethylphenylsiloxane, molecular chain end-to-end trihydroxysiloxy-bound polydiphenylsiloxane, molecular chain end-to-end trihydroxysiloxy-bound dimethylsiloxane / dihydroxysiloxane copolymer, molecular chain end-to-end trihydroxysiloxy-bound methylphenylsiloxane / dihydroxysiloxane copolymer, or molecular chain end-to-end trihydroxysiloxy-bound diphenylsiloxane / dihydroxysiloxane copolymer; 【0125】1,1,3,3-tetramethyldisiloxane, 1,1,3,3,5,5-hexamethyltrisiloxane, dimethylhydrogensiloxy-bound polydimethylsiloxane at both ends of the molecular chain, dimethylhydrogensiloxy-bound polymethylphenylsiloxane at both ends of the molecular chain, dimethylhydrogensiloxy-bound polydiphenylsiloxane at both ends of the molecular chain, dimethylsiloxane / dihydrogensiloxane copolymer at both ends of the molecular chain, Copolymer of methylphenylsiloxane / dihydrogensiloxane with dimethylhydrogensiloxy sealed at both ends of the subchain, copolymer of diphenylsiloxane / dihydrogensiloxane with dimethylhydrogensiloxy sealed at both ends of the molecular chain, polydimethylsiloxane with methyldihydrogensiloxy sealed at both ends of the molecular chain, polymethylphenylsiloxane with methyldihydrogensiloxy sealed at both ends of the molecular chain, polydiphenylsiloxane with methyldihydrogensiloxy sealed at both ends of the molecular chain, copolymer of methylphenylsiloxane / dihydrogensiloxane with methyldihydrogensiloxy sealed at both ends of the molecular chain, copolymer of diphenylsiloxane / dihydrogensiloxane with methyldihydrogensiloxy sealed at both ends of the molecular chain, polydimethylsiloxane with trihydrogensiloxy sealed at both ends of the molecular chain, trihydro Polymethylphenylsiloxane with trihydrogensiloxy sealed at both ends of the molecular chain; polydiphenylsiloxane with trihydrogensiloxy sealed at both ends of the molecular chain; dimethylsiloxane / dihydrogensiloxane copolymer with trihydrogensiloxy sealed at both ends of the molecular chain; methylphenylsiloxane / dihydrogensiloxane copolymer with trihydrogensiloxy sealed at both ends of the molecular chain; or diphenylsiloxane / dihydrogensiloxane copolymer with trihydrogensiloxy sealed at both ends of the molecular chain; 【0126】1,3-diacetoxytetramethyldisiloxane, 1,5-diacetoxyhexamethyltrisiloxane, polydimethylsiloxane with dimethylacetoxysiloxy sealed at both ends of the molecular chain, polymethylphenylsiloxane with dimethylacetoxysiloxy sealed at both ends of the molecular chain, polydiphenylsiloxane with dimethylacetoxysiloxy sealed at both ends of the molecular chain, dimethylsiloxane / diacetoxysiloxane copolymer with dimethylacetoxysiloxy sealed at both ends of the molecular chain, methylphenylsiloxane / diacetoxysiloxane copolymer with dimethylacetoxysiloxy sealed at both ends of the molecular chain, diphenylsiloxane / diacetoxysiloxane copolymer with methyldiacetoxysiloxy sealed at both ends of the molecular chain, polydimethylsiloxane with methyldiacetoxysiloxy sealed at both ends of the molecular chain, polymethylphenylsiloxane with methyldiacetoxysiloxy sealed at both ends of the molecular chain Phenylsiloxane, dimethylsiloxane / diacetoxysiloxane copolymer with methyldiacetoxysiloxy sealed at both ends of the molecular chain, methylphenylsiloxane / diacetoxysiloxane copolymer with methyldiacetoxysiloxy sealed at both ends of the molecular chain, diphenylsiloxane / diacetoxysiloxane copolymer with methyldiacetoxy sealed at both ends of the molecular chain, polydimethylsiloxane with triacetoxysiloxy sealed at both ends of the molecular chain, polymethylphenylsiloxane with triacetoxysiloxy sealed at both ends of the molecular chain, polydiphenylsiloxane with triacetoxysiloxy sealed at both ends of the molecular chain, dimethylsiloxane / diacetoxysiloxane copolymer with triacetoxysiloxy sealed at both ends of the molecular chain, methylphenylsiloxane / diacetoxysiloxane copolymer with triacetoxysiloxy sealed at both ends of the molecular chain, or diphenylsiloxane / diacetoxysiloxane copolymer with triacetoxysiloxy sealed at both ends of the molecular chain; 【0127】1,3-Diethylmethylketoximetetramethyldisiloxane, 1,5-Diethylmethylketoximehexamethyltrisiloxane, Polydimethylsiloxane with dimethylethylmethylketoximesiloxy sealed at both ends of the molecular chain, Polymethylphenylsiloxane with dimethylethylmethylketoximesiloxy sealed at both ends of the molecular chain, Polydiphenylsiloxane with dimethylethylmethylketoximesiloxy sealed at both ends of the molecular chain, Dimethylsiloxane / Diethylmethylketoximesiloxane copolymer with dimethylethylmethylketoximesiloxy sealed at both ends of the molecular chain Body, molecular chain with dimethylethylmethylketoximesiloxane sealed methylphenylsiloxane / diethylmethylketoximesiloxane copolymer, molecular chain with dimethylethylmethylketoximesiloxane sealed diphenylsiloxane / diethylmethylketoximesiloxane copolymer, molecular chain with methyldiethylmethylketoximesiloxane sealed polydimethylsiloxane, molecular chain with methyldiethylmethylketoximesiloxane sealed polymethylphenylsiloxane, molecular chain with methyldiethylmethylketoximesiloxane sealed polydiphenylsiloxane Lusiloxane, molecular chain end-to-end methyldiethylmethylketoximesiloxane / diethylmethylketoximesiloxane copolymer, molecular chain end-to-end methyldiethylmethylketoximesiloxane / diethylmethylketoximesiloxane copolymer, molecular chain end-to-end methyldiethylmethylketoxime-locked diphenylsiloxane / diethylmethylketoximesiloxane copolymer, molecular chain end-to-end triethylmethylketoximesiloxane / polydimethylsiloxane, molecular chain end-to-end triethylmethylketoximesiloxane Symsiloxy-bound polymethylphenylsiloxane, triethylmethylketoximesiloxy-bound polydiphenylsiloxane at both ends of the molecular chain, triethylmethylketoximesiloxy-bound dimethylsiloxane / diethylmethylketoximesiloxane copolymer at both ends of the molecular chain, triethylmethylketoximesiloxy-bound methylphenylsiloxane / diethylmethylketoximesiloxane copolymer at both ends of the molecular chain, or triethylmethylketoximesiloxy-bound diphenylsiloxane / diethylmethylketoximesiloxane copolymer at both ends of the molecular chain; 【0128】 (CH ３ )２ (OCH ３ ) SiO １／２ Units and (CH ３ ) ２ SiO ２／２ Units and SiO ４／２ A copolymer consisting of units, (CH ３ ) ３ SiO １／２ Units and (CH ３ ) ２ SiO ２／２ Units and (CH ３ ) ( OCH ３ ) SiO ２／２ Units and (CH ３ ) SiO ３／２ A copolymer consisting of units, (CH ３ ) ２ (OCH ３ ) SiO １／２ Units and (CH ３ ) ２ SiO ２／２ Units and (CH ３ ) SiO ３／２ A copolymer consisting of units, or (CH ３ ) ２ (OCH ３ ) SiO １／２ Units and (CH ３ ) ２ SiO ２／２ Units and (C ６ H ５ ) ２ SiO ２／２ Units and (CH ３ ) SiO ３／２ A copolymer consisting of units; (CH ３ ) ２ (OC ２ H ５ ) SiO １／２ Units and (CH ３ ) ２ SiO ２／２ Units and SiO ４／２ A copolymer consisting of units, (CH ３ ) ３ SiO １／２ Units and (CH ３ ) ２ SiO ２／２ Units and (CH ３ ) (OC ２ H５ ) SiO ２／２ Units and (CH ３ ) SiO ３／２ A copolymer consisting of units, (CH ３ ) ２ (OC ２ H ５ ) SiO １／２ Units and (CH ３ ) ２ SiO ２／２ Units and (CH ３ ) SiO ３／２ A copolymer consisting of units, or (CH ３ ) ２ (OC ２ H ５ ) SiO １／２ Units and (CH ３ ) ２ SiO ２／２ Units and (C ６ H ５ ) ２ SiO ２／２ Units and (CH ３ ) SiO ３／２ A copolymer consisting of units; 【0129】 (CH ３ ) ２ (OH)SiO １／２ Units and (CH ３ ) ２ SiO ２／２ Units and SiO ４／２ A copolymer consisting of units, (CH ３ ) ３ SiO １／２ Units and (CH ３ ) ２ SiO ２／２ Units and (CH ３ )(OH)SiO ２／２ Units and (CH ３ ) SiO ３／２ A copolymer consisting of units, (CH ３ ) ２ (OH)SiO １／２ Units and (CH ３ ) ２ SiO ２／２ Units and (CH ３ ) SiO ３／２ A copolymer consisting of units, (CH ３ )２ (OH)SiO １／２ Units and (CH ３ ) ２ SiO ２／２ Units and (C ６ H ５ ) ２ SiO ２／２ Units and (CH ３ ) SiO ３／２ A copolymer consisting of units; (CH ３ ) ２ (CH=CH ２ ) SiO １／２ Units and (CH ３ ) ２ SiO ２／２ Units and SiO ４／２ A copolymer consisting of units, (CH ３ ) ３ SiO １／２ Units and (CH ３ ) ２ SiO ２／２ Units and (CH ３ ) (CH=CH ２ ) SiO ２／２ Units and (CH ３ ) SiO ３／２ A copolymer consisting of units, (CH ３ ) ２ (CH=CH ２ ) SiO １／２ Units and (CH ３ ) ２ SiO ２／２ Units and (CH ３ ) SiO ３／２ A copolymer consisting of units, or (CH ３ ) ２ (CH=CH ２ ) SiO １／２ Units and (CH ３ ) ２ SiO ２／２ Units and (C ６ H ５ ) ２ SiO ２／２ Units and (CH ３ ) SiO ３／２ A copolymer consisting of units; 【0130】 (CH ３ ) ２ HSiO １／２Units and (CH ３ ) ２ SiO ２／２ Units and SiO ４／２ A copolymer consisting of units, (CH ３ ) ３ SiO １／２ Units and (CH ３ ) ２ SiO ２／２ Units and (CH ３ ) HSiO ２／２ Units and (CH ３ ) SiO ３／２ A copolymer consisting of units, (CH ３ ) ２ HSiO １／２ Units and (CH ３ ) ２ SiO ２／２ Units and (CH ３ ) SiO ３／２ A copolymer consisting of units, (CH ３ ) ２ HSiO １／２ Units and (CH ３ ) ２ SiO ２／２ Units and (C ６ H ５ ) ２ SiO ２／２ Units and (CH ３ ) SiO ３／２ Copolymers consisting of units, and in each of these exemplary compounds, some or all of the methyl groups are replaced with ethyl groups, other alkyl groups such as propyl groups, or aryl groups such as phenyl groups; 【0131】Methyltrimethoxysilane, methyltriethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, glycidyltrimethoxysilane, mercaptotrimethoxysilane, mercaptotriethoxysilane, aminopropyltriethoxysilane, tetramethoxysilane, partially condensed tetramethoxysilane, tetraethoxysilane, partially condensed tetraethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, isobutyltrimethoxysilane, ethyltrimethoxysilane, vinyltriethoxysilane, phenyltrimethoxysilane, 3,3,3-trifluoropropyltrimethoxysilane, methyltriacetate Examples include toxysilane, vinyltriacetoxysilane, ethyltriacetoxysilane, dibutoxydiacetoxysilane, phenyl-tripropionoxysilane, methyltris(methylethylketoxymo)silane, vinyltris-methylethylketoxymosilane, methyltris(methylethylketoximuino)silane, methyltris(isopropeneoxy)silane, vinyltris(isopropeneoxy)silane, ethyl polysilicate, n-propyl orthosilicate, ethyl orthosilicate, dimethyltetraacetoxydisiloxane, oximesilane, acetoxysilane, acetoxymosilane, or enoxysilane. 【0132】Furthermore, compounds having one or more structural units of the above formulas (B-1) to (B-4) also include the following compounds: 1,6-bis(trimethoxysilyl)hexane, bis(trialkoxysilylalkyl)amine, bis(dialkoxyalkylsilylalkyl)amine, bis(trialkoxysilylalkyl)N-alkylamine, bis(dialkoxyalkylsilylalkyl)N-alkylamine, bis(trialkoxysilylalkyl)urea, bis(dialkoxyalkylsilylalkyl)urea, bis(3-trimethoxysilylpropyl)amine, bis(3-triethoxysilylpropyl)amine, bis(4-trimethoxysilyl Bis(4-triethoxysilylbutyl)amine, bis(3-trimethoxysilylpropyl)N-methylamine, bis(3-triethoxysilylpropyl)N-methylamine, bis(4-trimethoxysilylbutyl)N-methylamine, bis(4-triethoxysilylbutyl)N-methylamine, bis(3-trimethoxysilylpropyl)urea, bis(3-triethoxysilylpropyl)urea, bis(4-trimethoxysilylbutyl)urea, bis(4-triethoxysilylbutyl)urea, bis(3 -Dimethoxymethylsilylpropyl)amine, bis(3-diethoxymethylsilylpropyl)amine, bis(4-dimethoxymethylsilylbutyl)amine, bis(4-diethoxymethylsilylbutyl)amine, bis(3-dimethoxymethylsilylpropyl)N-methylamine, bis(3-diethoxymethylsilylpropyl)N-methylamine, bis(4-dimethoxymethylsilylbutyl)N-methylamine, bis(4-diethoxymethylsilylbutyl)N-methylamine, bis(3-dimethoxymethylsilylpropyl ) Urea, bis(3-diethoxymethylsilylpropyl)urea, bis(4-dimethoxymethylsilylbutyl)urea, bis(4-diethoxymethylsilylbutyl)urea, bis(3-dimethoxyethylsilylpropyl)amine, bis(3-diethoxyethylsilylpropyl)amine, bis(4-dimethoxyethylsilylbutyl)amine, bis(4-diethoxyethylsilylbutyl)amine, bis(3-dimethoxyethylsilylpropyl)N-methylamine, bis(3-diethoxyethylsilylpropyl)N-methylamine,Bis(4-dimethoxyethylsilylbutyl)N-methylamine, bis(4-diethoxyethylsilylbutyl)N-methylamine, bis(3-dimethoxyethylsilylpropyl)urea, bis(3-diethoxyethylsilylpropyl)urea, bis(4-dimethoxyethylsilylbutyl)urea, and / or bis(4-diethoxyethylsilylbutyl)urea; bis(triethoxysilylpropyl)amine, bis(trimethoxysilylpropyl)amine, bis(trimethoxysilylpropyl)urea, bis(triethoxysilylpropyl)urea, or bis(diethoxymethylsilylpropyl) Compounds containing organic groups in the main chain, such as N-methylamine; di- or trialkoxysilane-terminated polydialkylsiloxanes, di- or trialkoxysilyl-terminated polyarylalkylsiloxanes, di- or trialkoxysilyl-terminated polypropylene oxides, polyurethanes, or polyacrylates; polyisobutylene; di- or triacetoxy-terminated polydialkyls; polyarylalkylsiloxanes; di- or trioxyiminosilyl-terminated polydialkyls; polyarylalkylsiloxanes; or di- or triacetonoxy-terminated polydialkyls, or polyarylalkyls. 【0133】 Examples of commercially available products of component B include the Cyraplane FM11 series, Cyraplane FM88 series, Cyraplane FM99 series, and Cyraplane FM08 series (all product names) manufactured by JNC Corporation, the SR series (product name) manufactured by Konishi Chemical Industry Co., Ltd., MKC Silicate MS57 (product name), MKC Silicate MS51 (product name) (average tetramethoxysilane pentamer), MKC Silicate MS56, and MS56S (all product names) manufactured by Mitsubishi Chemical Corporation, and Methyl Silicate 51 (average tetramethoxysilane tetramer), Methyl Silicate 53 (average tetramethoxysilane heptamer), Ethyl Silicate 40 (average tetraethoxysilane pentamer), or Ethyl Silicate 48 (average tetraethoxysilane decaper) manufactured by Colcoat Co., Ltd. 【0134】 Specifically, a preferred example of component B is having one or more of the structures of the above formulas (B-1) to (B-4), and having at least two or more R in the said formula. Ｂ１However, it is preferable that it be one of the above formulas (F-1) to (F-8). 【0135】 More specifically, examples of preferred component B include 1,3-dimethoxytetramethyldisiloxane, 1,5-dimethoxyhexamethyltrisiloxane, polydimethylsiloxane with dimethylmethoxysiloxy sealed at both ends of the molecular chain, polymethylphenylsiloxane with dimethylmethoxysiloxy sealed at both ends of the molecular chain, polydiphenylsiloxane with dimethylmethoxysiloxy sealed at both ends of the molecular chain, dimethylsiloxane / dimethoxysiloxane copolymer with dimethylmethoxysiloxy sealed at both ends of the molecular chain, methylphenylsiloxane / dimethoxysiloxane copolymer with dimethylmethoxysiloxy sealed at both ends of the molecular chain, and dimethylmethylsiloxy sealed at both ends of the molecular chain. Tylmethoxysiloxy-bound diphenylsiloxane / dimethoxysiloxane copolymer, trimethoxysiloxy-bound polydimethylsiloxane at both ends of the molecular chain, trimethoxysiloxy-bound polymethylphenylsiloxane at both ends of the molecular chain, trimethoxysiloxy-bound polydiphenylsiloxane at both ends of the molecular chain, trimethoxysiloxy-bound dimethylsiloxane / dimethoxysiloxane copolymer at both ends of the molecular chain, trimethoxysiloxy-bound methylphenylsiloxane / dimethoxysiloxane copolymer at both ends of the molecular chain, or trimethoxysiloxy-bound diphenylsiloxane / dimethoxysiloxane copolymer at both ends of the molecular chain; 【0136】1,3-Diethoxytetramethyldisiloxane, 1,5-Diethoxyhexamethyltrisiloxane, Polydimethylsiloxane with dimethylethoxysiloxy sealed at both ends of the molecular chain, Polymethylphenylsiloxane with dimethylethoxysiloxy sealed at both ends of the molecular chain, Polydiphenylsiloxane with dimethylethoxysiloxy sealed at both ends of the molecular chain, Dimethylsiloxane / diethoxysiloxane copolymer with dimethylethoxysiloxy sealed at both ends of the molecular chain, Methylphenylsiloxane / diethoxysiloxane copolymer with dimethylethoxysiloxy sealed at both ends of the molecular chain, Diphenylsiloxane / diethoxysiloxane with dimethylethoxysiloxy sealed at both ends of the molecular chain Copolymers, diphenylsiloxane / diethoxysiloxane copolymers with methyldiethoxysiloxy sealed at both ends of the molecular chain, polydimethylsiloxane with triethoxysiloxy sealed at both ends of the molecular chain, polymethylphenylsiloxane with triethoxysiloxy sealed at both ends of the molecular chain, polydiphenylsiloxane with triethoxysiloxy sealed at both ends of the molecular chain, dimethylsiloxane / diethoxysiloxane copolymers with triethoxysiloxy sealed at both ends of the molecular chain, methylphenylsiloxane / diethoxysiloxane copolymers with triethoxysiloxy sealed at both ends of the molecular chain, or diphenylsiloxane / diethoxysiloxane copolymers with triethoxysiloxy sealed at both ends of the molecular chain; 【0137】1,3-Dihydroxytetramethyldisiloxane, 1,5-Dihydroxyhexamethyltrisiloxane, 1,5-Dihydroxyhexaphenyltrisiloxane, Polydimethylsiloxane with dimethylhydroxysiloxy sealed at both ends of the molecular chain, Polymethylphenylsiloxane with dimethylhydroxysiloxy sealed at both ends of the molecular chain, Polydiphenylsiloxane with dimethylhydroxysiloxy sealed at both ends of the molecular chain, Dimethylsiloxane / dihydroxysiloxane copolymer with dimethylhydroxysiloxy sealed at both ends of the molecular chain, Methylphenylsiloxane / dihydroxysiloxane copolymer with dimethylhydroxysiloxy sealed at both ends of the molecular chain, Di Methylhydroxysiloxy-bound diphenylsiloxane / dihydroxysiloxane copolymer, trihydroxysiloxy-bound polydimethylsiloxane at both ends of the molecular chain, trihydroxysiloxy-bound polymethylphenylsiloxane at both ends of the molecular chain, trihydroxysiloxy-bound polydiphenylsiloxane at both ends of the molecular chain, trihydroxysiloxy-bound dimethylsiloxane / dihydroxysiloxane copolymer, trihydroxysiloxy-bound methylphenylsiloxane / dihydroxysiloxane copolymer at both ends of the molecular chain, or trihydroxysiloxy-bound diphenylsiloxane / dihydroxysiloxane copolymer at both ends of the molecular chain; 【0138】1,1,3,3-tetramethyldisiloxane, 1,1,3,3,5,5-hexamethyltrisiloxane, polydimethylsiloxane with dimethylhydrogensiloxy sealed at both ends of the molecular chain, polymethylphenylsiloxane with dimethylhydrogensiloxy sealed at both ends of the molecular chain, polydiphenylsiloxane with dimethylhydrogensiloxy sealed at both ends of the molecular chain, dimethylsiloxane / dihydrogensiloxane copolymer with dimethylhydrogensiloxy sealed at both ends of the molecular chain, methylphenylsiloxane / dihydrogensiloxane copolymer with dimethylhydrogensiloxy sealed at both ends of the molecular chain Diphenylsiloxane / dihydrogensiloxane copolymer, polydimethylsiloxane with trihydrogensiloxy sealed at both ends of the molecular chain, polymethylphenylsiloxane with trihydrogensiloxy sealed at both ends of the molecular chain, polydiphenylsiloxane with trihydrogensiloxy sealed at both ends of the molecular chain, dimethylsiloxane / dihydrogensiloxane copolymer with trihydrogensiloxy sealed at both ends of the molecular chain, methylphenylsiloxane / dihydrogensiloxane copolymer with trihydrogensiloxy sealed at both ends of the molecular chain, or diphenylsiloxane / dihydrogensiloxane copolymer with trihydrogensiloxy sealed at both ends of the molecular chain; 【0139】 Methyltrimethoxysilane, methyltriethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, tetramethoxysilane, partially condensed tetramethoxysilane, tetraethoxysilane, or partially condensed tetraethoxysilane; 【0140】 (CH ３ ) ２ (OCH ３ ) SiO １／２ Units and (CH ３ ) ２ SiO ２／２ Units and SiO ４／２ A copolymer consisting of units, (CH ３ ) ３ SiO １／２ Units and (CH ３ ) ２ SiO ２／２ Units and (CH ３) ( OCH ３ ) SiO ２／２ Units and (CH ３ ) SiO ３／２ A copolymer consisting of units, (CH ３ ) ２ (OCH ３ ) SiO １／２ Units and (CH ３ ) ２ SiO ２／２ Units and (CH ３ ) SiO ３／２ A copolymer consisting of units, or (CH ３ ) ２ (OCH ３ ) SiO １／２ Units and (CH ３ ) ２ SiO ２／２ Units and (C ６ H ５ ) ２ SiO ２／２ Units and (CH ３ ) SiO ３／２ A copolymer consisting of units; (CH ３ ) ２ (OC ２ H ５ ) SiO １／２ Units and (CH ３ ) ２ SiO ２／２ Units and SiO ４／２ A copolymer consisting of units, (CH ３ ) ３ SiO １／２ Units and (CH ３ ) ２ SiO ２／２ Units and (CH ３ ) (OC ２ H ５ ) SiO ２／２ Units and (CH ３ ) SiO ３／２ A copolymer consisting of units, (CH ３ ) ２ (OC ２ H ５ ) SiO １／２ Units and (CH ３ ) ２ SiO ２／２ Units and (CH ３ ) SiO ３／２A copolymer consisting of units, or (CH ３ ) ２ (OC ２ H ５ ) SiO １／２ Units and (CH ３ ) ２ SiO ２／２ Units and (C ６ H ５ ) ２ SiO ２／２ Units and (CH ３ ) SiO ３／２ A copolymer consisting of units; 【0141】 (CH ３ ) ２ (OH)SiO １／２ Units and (CH ３ ) ２ SiO ２／２ Units and SiO ４／２ A copolymer consisting of units, (CH ３ ) ３ SiO １／２ Units and (CH ３ ) ２ SiO ２／２ Units and (CH ３ )(OH)SiO ２／２ Units and (CH ３ ) SiO ３／２ A copolymer consisting of units, (CH ３ ) ２ (OH)SiO １／２ Units and (CH ３ ) ２ SiO ２／２ Units and (CH ３ ) SiO ３／２ A copolymer consisting of units, or (CH ３ ) ２ (OH)SiO １／２ Units and (CH ３ ) ２ SiO ２／２ Units and (C ６ H ５ ) ２ SiO ２／２ Units and (CH ３ ) SiO ３／２ A copolymer consisting of units; 【0142】 (CH ３ )２ HSiO １／２ Units and (CH ３ ) ２ SiO ２／２ Units and SiO ４／２ A copolymer consisting of units, (CH ３ ) ３ SiO １／２ Units and (CH ３ ) ２ SiO ２／２ Units and (CH ３ ) HSiO ２／２ Units and (CH ３ ) SiO ３／２ A copolymer consisting of units, (CH ３ ) ２ HSiO １／２ Units and (CH ３ ) ２ SiO ２／２ Units and (CH ３ ) SiO ３／２ A copolymer consisting of units, or (CH ３ ) ２ HSiO １／２ Units and (CH ３ ) ２ SiO ２／２ Units and (C ６ H ５ ) ２ SiO ２／２ Units and (CH ３ ) SiO ３／２ Examples include copolymers composed of units. 【0143】Since component A has hydroxyl groups, component B can be, for example, a condensation-crosslinkable compound having three or more groups or atoms that undergo a condensation reaction with the hydroxyl groups in component A. Specifically, examples of compounds having three condensation-reactive groups include methyltrimethoxysilane, methyltriethoxysilane, phenyltrimethoxysilane, phenyltriethoxysilane, glycidyltrimethoxysilane, mercaptotrimethoxysilane, mercaptotriethoxysilane, aminopropyltriethoxysilane, methyltris(isopropeneoxy)silane, or vinyltris(isopropeneoxy)silane; examples of compounds having four condensation-reactive groups include tetramethoxysilane or tetraethoxysilane; and examples of compounds having five or more condensation-reactive groups include the partial hydrolysis condensates of the above compounds. When these are used, for example, the resin composition can be crosslinked with component A by placing it in a water-containing atmosphere such as ordinary air at room temperature and under light irradiation or heating conditions. 【0144】 The content ratio of component B in the resin composition is not particularly limited, but it is preferably 0.1 parts by mass or more and 50 parts by mass or less, more preferably 0.3 parts by mass or more and 40 parts by mass or less, and even more preferably 0.5 parts by mass or more and 30 parts by mass or less, per 100 parts by mass of component A. If the content ratio is above the lower limit of the above range, a cured film with excellent heat resistance can be obtained. If the content ratio is below the upper limit of the above range, a resin composition and cured film with excellent solubility and toughness can be obtained. 【0145】 [Other Components] The resin composition may contain components other than components A and B (other components), such as organopolysiloxanes other than components A and B, curing catalysts, solvents, fillers, ion scavengers, surfactants, flame retardants, ultraviolet absorbers, light stabilizers, antioxidants, pigments, inorganic oxides, ion adsorbents, photosensitizers, curing retarders, curing inhibitors, organic resins, or heat dissipation fillers. Examples of other components are shown below. 【0146】(Curing Catalyst) The resin composition may contain a curing catalyst (component C). The catalyst can, for example, promote the chemical reaction between crosslinkable functional groups in component A when chemically reacting components A with each other, or, when component B is used, promote the chemical reaction between component A and component B. Component C may be used alone or in combination of two or more types. When a solvent is used, it is preferable that component C dissolves in the solvent from the viewpoint of reaction efficiency. 【0147】 From the viewpoint of curability, the curing catalyst (component C) preferably contains one or more elements from among tin (Sn), zirconium (Zr), titanium (Ti), aluminum (Al), sulfur (S), iodine (I), nitrogen (N), phosphorus (P), platinum (Pt), iron (Fe), zinc (Zn), cobalt (Co), and rhodium (Rh), more preferably contains one or more elements from among Zr, Ti, Al, S, I, N, and P, and particularly preferably contains the elements Zr, Ti, S, I, N, and P. 【0148】 Examples of Sn-containing compounds include dibutyltin dilaurate, dioctyltin dilaurate, dibutyltin diacetate, dioctyltin diacetate, dibutyltin maleate, dioctyltin maleate, or 2-ethylhexanoate. 【0149】 Examples of Zr-containing compounds include n-propyl zirconate, n-butyl zirconate, zirconium tetraacetylacetonate, or zirconium monoacetylacetonate. 【0150】 Examples of Ti-containing compounds include tetraisopropyl titanate, tetran-butyl titanate, butyl titanate dimer, tetraoctyl titanate, titanium acetylacetonate, titanium tetraacetylacetonate, titanium ethylacetoacetate, titanium dodecylbenzenesulfonate compounds, titanium phosphate ester complexes, titanium octylene glycolate, titanium lactate ammonium salt, titanium lactate, or titanium triethanolamine. 【0151】Examples of Al-containing compounds include aluminum secondary butoxide, aluminum trisacetylacetonate, aluminum bisethylacetoacetate monoacetylacetonate, or aluminum trisethylacetoacetate. 【0152】S-containing compounds include 2-butenyldimethylsulfonium, 2-butenyltetramethylenesulfonium, 3-methyl-2-butenyldimethylsulfonium, 4-hydroxyphenylcinnamylmethylsulfonium, α-naphthylmethyltetramethylenesulfonium, cinnamyldimethylsulfonium, cinnamyltetramethylenesulfonium, biphenylmethyldimethylsulfonium, biphenylmethyltetramethylenesulfonium, [biphenyl]-4-yl[4-[[biphenyl]-4-ylthio]phenyl](phenyl)sulfonium, and phenyl Methyldimethylsulfonium, phenylmethyltetramethylenesulfonium, fluorenylmethyldimethylsulfonium, fluorenylmethyltetramethylenesulfonium, (9-oxo-9H-thioxanthene-2-yl)[4-[(9-oxo-9H-thioxanthene-2-yl)thio]phenyl](phenyl)sulfonium, bis[4-(diphenylsulfonio)phenyl]sulfide, diphenyl[4-(phenylthio)phenyl]sulfonium, triphenylsulfonium, bis[4-(di(4-(2-hydroxyethoxy))phenylsulfonium] [Nio)phenyl]sulfide, benzylmethylphenylsulfonium, benzyl(4-hydroxyphenyl)methylsulfonium, (4-hydroxyphenyl)methyl(2-methylbenzyl)sulfonium, (4-hydroxyphenyl)methyl(4-methylbenzyl)sulfonium, (4-hydroxyphenyl)methyl(1-naphthyl)sulfonium, dibenzyl-4-hydroxyphenylsulfonium, 4-acetoxyphenylbenzylsulfonium, 4-acetoxyphenyldimethylsulfonium, or 4-acetoxyphenylmethyl(2-methylbenzyl) Cations such as dinitryl sulfonium, tris(pentafluoroethyl)trifluorophosphate, trifluorotris(pentafluoroethyl)phosphate, hexafluorophosphate, tetrafluoroborate, tetrakis(pentafluorophenyl)borate, hexafluoroantimonate, p-toluenesulfonate, dodecylbenzenesulfonate, trifluoromethanesulfonate, perfluorobutanesulfonate, bis(trifluorosulfonyl)imide, trifluoromethanesulfonate, perfluorobutanesulfonate,Examples include sulfonium salts consisting of anions such as methanesulfonate or camphor sulfonate, or TA-90, TA-100, TA-100FG, TA-120, TA-160, CPI-200K, CPI-210S, or LW-S1 from Sunapro Co., Ltd. 【0153】 Compounds containing I include diphenyliodonium chloride, diphenyliodonium trifluoromethanesulfonate, diphenyliodonium mesylate, diphenyliodonium tosylate, diphenyliodonium bromide, diphenyliodonium tetrafluoroborate, diphenyliodonium hexafluoroantimonate, diphenyliodonium hexafluoroarsenate, bis(p-tert-butylphenyl)iodonium hexafluorophosphate, bis(p-tert-butylphenyl)iodonium mesylate, bis(p-ter Examples include iodonium salts such as t-butylphenyl)iodonium tosylate, bis(p-tert-butylphenyl)iodonium trifluoromethanesulfonate, bis(p-tert-butylphenyl)iodonium tetrafluoroborate, bis(p-tert-butylphenyl)iodonium chloride, bis(p-chlorophenyl)iodonium chloride, (4-isopropylphenyl)(p-tolyl)iodonium trifluorotris(perfluoroethyl)phosphate, or bis(p-chlorophenyl)iodonium tetrafluoroborate. 【0154】Examples of N-containing compounds include silazanes such as trimethylsilylamine, bis(trimethylsilyl)amine, tris(trimethylsilyl)amine, methyldiphenylsilylamine, bis(methyldiphenylsilyl)amine, or tris(methyldiphenylsilyl)amine; cyclic silazanes such as hexamethylcyclotrisilazane, octamethylcyclotetrasilazane, decamethylcyclopentasilazane, trimethyltriphenylcyclotrisilazane, tetramethyltetraphenylcyclotetrasilazane, pentamethylpentaphenylcyclopentasilazane, hexaphenylcyclotrisilazane, octaphenylcyclotetrasilazane, or decaphenylcyclopentasilazane; inorganic polysilazanes such as perhydropolysilazane, or organic polysilazanes such as methylpolysilazane; Aminoguanidine, 1,1,3,3-tetramethylguanidine, n-dodecylguanidine, methylolguanidine, dimethylolguanidine, 1-phenylguanidine, 1,3-diphenylguanidine, 1,3-di-o-tolylguanidine, triphenylguanidine, or 1-benzyl-2,3-dimethylcyanoguanidine, 1,2-diisopropyl-3-[bis(dimethylamino)methylene]guanidium=2-(3-benzoylphenyl)propionate, 1,2-dicyclohexyl-4,4,5,5- Organic guanidines such as tetramethylbiguanidium-n-butyltriphenyl borate, (Z)-{[bis(dimethylamino)methylidene]amino}-N-cyclohexyl(cyclohexylamino)methaneiminium-tetrakis(3-fluorophenyl) borate; carbamates such as N,N-diethylcarbamate 9-anthrylmethyl, imidazole-1-carboxylic acid 1-(anthraquinone-2-yl)ethyl, and 4-(methacryloyloxy)piperidine-1-carboxylic acid (2-nitrophenyl)methyl; amides such as dicyandiamide and (E)-1-piperidino-3-(2-hydroxyphenyl)-2-propen-1-one;Alkylimidazoles such as 2-ethyl-4-methylimidazole, 1-methylimidazole, 1,2-dimethylimidazole, 2-methylimidazole, 2-ethylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, and 2-isopropylimidazole; carbamylalkyl-substituted imidazoles such as 1-(2-carbamylethyl)imidazole; cyanoalkyl-substituted imidazoles such as 1-cyanoethyl-2-methylimidazole; aromatic-substituted imidazoles such as 2-phenylimidazole, 2-phenyl-4-methylimidazole, and 1-benzyl-2-methylimidazole; alkenyl-substituted imidazoles such as 1-vinyl-2-methylimidazole; or allyl-substituted imidazoles such as 1-allyl-2-ethyl-4-methylimidazole; or polyimidazoles; Ureas such as 1,1'-(4-methyl-1,3-phenylene)bis(3,3-dimethylurea) or 3-{3-[(3,3-dimethylureido)methyl]-3,5,5-trimethylcyclohexyl}-1,1-dimethylurea; amines such as bis(2-morpholinoethyl) ether and 1,1'-[[3-(dimethylamino)propyl]imino](2-propanol); ammonium such as 2-ethylhexanoic acid of triethylmethylammonium; 【0155】 Furthermore, examples include 1,5,7-triazabicyclo[4.4.0]deca-5-ene 2-(9-oxoxanthene-2-yl)propionic acid, 1,8-diazabicyclo[5.4.0]undecene-7 (DBU), 1,5-diazabicyclo[4.3.0]nonene-5 (DBN), the phenol salt of the above DBU, the 2-ethylhexanoate of the above DBU, the formate of the above DBU, the o-phthalate of the above DBU, the p-toluenesulfonate of the above DBU, the phenol novolac resin salt of the above DBU, the trimellitate of the above DBU, the tetraphenyl borate salt of the benzyl modified product of the above DBU, the 2-ethylhexanoate of the above DBN, the phenol resin salt of the above DBN, or the biphenyl-type phenol resin salt of the above DBN. 【0156】Other examples include ketimines, which are reaction products of polyamines and carbonyl compounds. Examples of polyamines include diamines such as ethylenediamine, propylenediamine, trimethylenediamine, tetramethylenediamine, 1,3-diaminobutane, 2,3-diaminobutane, pentamethylenediamine, 2,4-diaminopentane, hexamethylenediamine, p-phenylenediamine, and p,p'-biphenylenediamine; polyhydramines such as 1,2,3-triaminopropane, triaminobenzene, tris(2-aminoethyl)amine, or tetra(aminomethyl)methane; polyalkylene polyamines such as diethylenetriamine, triethylenetriamine, or tetraethylenepentamine; or polyoxyalkylene polyamines. Carbonyl compounds include Examples include aldehydes such as acetaldehyde, propionaldehyde, n-butyraldehyde, isobutyraldehyde, diethylacetaldehyde, glyoxal, or benzaldehyde; cyclic ketones such as cyclopentanone, trimethylcyclopentanone, cyclohexanone, or trimethylcyclohexanone; aliphatic ketones such as acetone, methyl ethyl ketone, methyl propyl ketone, methyl isopropyl ketone, methyl isobutyl ketone, diethyl ketone, dipropyl ketone, diisopropyl ketone, dibutyl ketone, or diisobutyl ketone; or β-dicarbonyl compounds such as acetylacetone, methyl acetoacetate, ethyl acetoacetate, dimethyl malonate, diethyl malonate, methyl ethyl malonate, or dibenzoylmethane. 【0157】 Examples of P-containing compounds include benzyltriphenylphosphonium bromide and ethyltriphenylphosphonium methanesulfonate. 【0158】Examples of Pt-containing compounds include platinum-based compounds such as platinum powder, platinum black, platinum-supported silica powder, platinum-supported activated carbon, chloroplatinic acid, an alcoholic solution of chloroplatinic acid, platinum olefin complexes, or platinum alkenylsiloxane complexes. Examples of these alkenylsiloxanes include 1,3-divinyl-1,1,3,3-tetramethyldisiloxane, 1,3,5,7-tetramethyl-1,3,5,7-tetravinylcyclotetrasiloxane, alkenylsiloxanes in which some of the methyl groups of these alkenylsiloxanes are replaced with ethyl groups, phenyl groups, etc., and alkenylsiloxanes in which the vinyl groups of these alkenylsiloxanes are replaced with allyl groups, hexenyl groups, etc. 【0159】Commercially available products containing component C include TA-90, TA-100, TA-100FG, TA-120, TA-160, CPI-200K, CPI-210S, CPI-101A, CPI-110A, CPI-100B, CPI-100P, CPI-110, CPI-110B, CPI-110P, CPI-310B, and CPI-310F, all manufactured by Sunapro Co., Ltd. G, CPI-410B, CPI-410S, ES-1B, VC-1S, VC-1FG, HS-1, HS-1A, HS-1P, HS-1N, HS-1TF, HS-1NF, HS -1MS, HS-1CS, LW-S1, LW-S1NF, IK-1, IK-2, IK-1FG, NP-TM2, NA-CS1, NP-SE10, PURECAT (registered trademark) TX-1, DBU (registered trademark), DBN, NP-TM2, NP-SE10, NA-CS1, U-CAT881, U-CAT SA1, U-CAT SA102, U-CAT SA603, U-CAT SA810, U-CAT SA506, U-CAT SA841, U-CAT SA851, U-CAT SA838A, U-CAT5002, U-CAT891, U-CAT1102, U-CAT881, U-CAT891, U-CAT5003, U-CAT5050, U-CAT3512T, U-CAT3513N, U-CAT660M, U-CAT2024, or U-CAT18X, etc.; or SAN-AID SI-45, SAN-AID SI-60, SAN-AID SI-80, SAN-AID SI-100, SAN-AID SI-150, SAN-AID SI-300, SAN-AID SI-360, SAN-AID SI-110, SAN-AID manufactured by Sanshin Chemical Industry Co., Ltd. SI-B2A, SAN-AID SI-B7, SAN-AID SI-B3A, SAN-AID SI-B3, SAN-AID SI-B4, or SAN-AID SI-B5, etc.;Alternatively, TA-8, TA-21, TA-23, TA-30, TC-100, TC-401, TC-710, TC-810, TC-1040, TC-245, TC-750, TC-300, TC-310, TC-400, TA-12, TA-80, TA-90, TC-120, TC-230 manufactured by Matsumoto Fine Chemical Co., Ltd. Examples include TC-800, TC-315, TC-335, TC-500, TC-510, ZA-45, ZA-65, ZC-150, ZC-162, ZC-540, ZC-700, ZC-580, ZC-200, ZC-320, ZC-126, ZC-300, AL-3001, AL-3100, AL-3200, etc. 【0160】Among these, dibutyltin dilaurate, n-propyl zirconate, n-butyl zirconate, zirconium tetraacetylacetonate, zirconium monoacetylacetonate, titanium acetylacetonate, titanium tetraacetylacetonate, titanium ethyl acetoacetate, aluminum trisacetylacetonate, aluminum bis-ethyl acetoacetate monoacetylacetonate, aluminum trisethyl acetoacetate, benzyl (4-hydroxyphenyl)methylsulfonium tris(pentafluoroethyl) trifluorophosphate, TA-100FG, (4-isopropylphenyl)(p-tolyl)iodonium trifluorotris(perfluoroethyl) phosphate, IK-1, IK-1FG, SAN-AID SI-B7, SAN-AID SI-B3A, SAN-AID SI-B3, SAN-AID SI-B4, SAN-AID SI-B5, diphenyl[4-(phenylthio)phenyl]sulfonium hexafluorophosphate, diphenyl[4-(phenylthio)phenyl]sulfonium trifluorotris(pentafluoroethyl)phosphate, diphenyl[4-(phenylthio)phenyl]sulfonium tetrakis(pentafluorophenyl)borate, biphenyl-4-yl[4-[[biphenyl]-4-ylthio]phenyl](phenyl)sulfonium tetrakis(pentafluorophenyl)borate, (9-oxo-9H-thioxanthene-2-yl)[4-[(9-oxo-9H-thioxanthene-2-yl)thio]phenyl](phenyl)sulfonium trifluorotris(pentafluoroethyl)phosphate, (9-oxo-9H-thioxanthene-2-yl)[4-[(9-oxo-9H-thioxanthene-2-yl)thio]phenyl](phenyl)sulfonium tetrakis(pentafluorophenyl)borate, Preferred are 1,2-diisopropyl-3-[bis(dimethylamino)methylene]guanidium=2-(3-benzoylphenyl)propionate, o-phthalate of the above DBU, p-toluenesulfonate of the above DBU, and phenol novolac resin salt of the above DBU. 【0161】The content ratio of component C in the resin composition is not particularly limited, but the content of the catalyst relative to 100 parts by mass of the total of components A and B is preferably, for example, 0.00001 parts by mass or more and 20 parts by mass or less, more preferably 0.00002 parts by mass or more and 15 parts by mass or less, and even more preferably 0.00004 parts by mass or more and 10 parts by mass or less. 【0162】 (Solvent) The resin composition may further contain a solvent. The solvent is preferably capable of dissolving components A and B and does not condense with components A and B, and more preferably is a solvent that does not react with any of the components. One type of solvent may be used alone, or two or more types may be used in combination. 【0163】Examples of solvents include aliphatic hydrocarbons, aromatic hydrocarbons, ethers, halogenated hydrocarbons, or ester solvents. More specifically, methanol, ethanol, propanol, isopropanol, butanol, t-butyl alcohol, tetrahydrofuran, 2-methyltetrahydrofuran, 4-methyltetrahydropyran, cyclopentyl methyl ether, methyl ethyl ketone, methyl isobutyl ketone, acetonitrile, propionitrile, benzonitrile, ethyl acetate, isobutyl acetate, butyl acetate, butyl propionate, lactic acid Tyl, methyl oxyacetate, ethyl oxyacetate, butyl oxyacetate, methyl methoxyacetate, ethyl methoxyacetate, butyl methoxyacetate, methyl ethoxyacetate, ethyl ethoxyacetate, methyl 3-oxypropionate, ethyl 3-oxypropionate, methyl 3-methoxypropionate, ethyl 3-methoxypropionate, methyl 3-ethoxypropionate, ethyl 3-ethoxypropionate, methyl 2-hydroxyisobutyrate, methyl 2-oxypropionate, ethyl 2-oxypropionate, propyl 2-oxypropionate, 2-methoxypropion Methyl phosphate, ethyl 2-methoxypropionate, propyl 2-methoxypropionate, methyl 2-ethoxypropionate, ethyl 2-ethoxypropionate, methyl 2-oxy-2-methylpropionate, ethyl 2-oxy-2-methylpropionate, methyl 2-methoxy-2-methylpropionate, ethyl 2-ethoxy-2-methylpropionate, methyl pyruvate, ethyl pyruvate, propyl pyruvate, methyl acetoacetate, ethyl acetoacetate, methyl 2-oxobutanoate, ethyl 2-oxobutanoate, methyl hydroxyisobutyrate, acetylacetone, dioxane, ethylene glycol, diethyl ether, diethylene glycol, propylene glycol, dipropylene glycol, propylene glycol monomethyl ether, propylene glycol monoethyl ether, propylene glycol monopropyl ether, propylene glycol monobutyl ether, propylene glycol monophenyl ether, ethylene glycol monoisopropyl ether, ethylene glycol monobutyl ether, ethylene glycol monophenyl ether, diethylene glycol monomethyl ether,Diethylene glycol monoethyl ether, diethylene glycol monopropyl ether, diethylene glycol monobutyl ether, diethylene glycol monophenyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monoethyl ether, dipropylene glycol monopropyl ether, dipropylene glycol monobutyl ether, dipropylene glycol monophenyl ether, glycerin, cyclohexanol, 1,4-butanediol, triethylene glycol, tripropylene glycol, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, dipropylene glycol monoethyl ether acetate, dipropylene glycol monobutyl ether acetate, ethylene glycol monobutyl ether acetate, cyclohexanone, cyclopentanone, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, diethylene glycol Methyl ether, diethylene glycol diethyl ether, diethylene glycol ethyl methyl ether, tripropylene glycol dimethyl ether, triethylene glycol dimethyl ether, tetraethylene glycol dimethyl ether, hexane, heptane, cyclohexane, benzene, toluene, xylene, anisole, benzaldehyde, 1,3-dimethoxybenzene, acetophenone, 4'-methoxyacetophenone, 4'-ethoxyacetophenone, phenyl acetate, 3-methoxyphenol, 1,2-methylenedioxybenzene, 2-Phenoxyethanol, diethylene glycol monophenyl ether, 1,2,4-trimethoxybenzene, 2'-hydroxyacetophenone, 1,4-diethoxybenzene, 1,3,5-trimethoxybenzene, t-butyl benzoate, benzyl alcohol, 1,4-dimethoxybenzene, 1,2,3-trimethoxybenzene, 2-methoxytoluene, 3-methoxytoluene, 4-methoxytoluene, 2,5-dimethylanisole, thioanisole, 4-ethylanisole, t-butylbenzene, 4-t-butyltoluene, 2-phenylanisole,Examples include t-anethole, 3,4-dimethoxytoluene, γ-butyrolactone, N,N-dimethylacetamide, N,N-dimethylformamide, N,N-diethylformamide, N-methyl-2-pyrrolidone, dimethylimidazolidinone, dimethyl sulfoxide, methylene chloride, chloroform, or carbon tetrachloride. 【0164】 Among these, from the viewpoint of solubility in resin compositions, methyl ethyl ketone, methyl isobutyl ketone, ethyl acetate, isobutyl acetate, butyl acetate, methyl 3-methoxypropionate, acetylacetone, propylene glycol monomethyl ether acetate, toluene, anisole, benzaldehyde, benzonitrile, tetrahydrofuran, diethylene glycol ethyl methyl ether, tetraethylene glycol dimethyl ether, diethylene glycol dimethyl ether, tripropylene glycol dimethyl ether, triethylene glycol dimethyl ether, 1,3-dimethoxybenzene, acetophenone, 4'-methoxyacetophenone, 4'-ethoxyacetophenone, phenyl acetate, 3- Methoxyphenol, 1,2-methylenedioxybenzene, 2-phenoxyethanol, 1,2,4-trimethoxybenzene, 2'-hydroxyacetophenone, 1,4-diethoxybenzene, 1,3,5-trimethoxybenzene, benzyl alcohol, 1,4-dimethoxybenzene, 1,2,3-trimethoxybenzene, 2-methoxytoluene, 3-methoxytoluene, 4-methoxytoluene, 2,5-dimethylanisole, thioanisole, 4-ethylanisole, t-butylbenzene, 4-t-butyltoluene, 2-phenylanisole, 3,4-dimethoxytoluene, N,N-dimethylacetamide, N,N-dimethylformamide, N,N-diethylformamide, or dimethyl sulfoxide are preferred. 【0165】 The proportion of solvent in the resin composition is not particularly limited, but it is preferably 5 to 80% by mass, more preferably 10 to 75% by mass, and even more preferably 15 to 70% by mass, based on 100% by mass of the resin composition. 【0166】(Specific element-containing compounds) The resin composition may further contain compounds having one or more of the elements Ce, La, Pr, Nd, Y, and Fe (hereinafter also referred to as "specific element-containing compounds"). 【0167】 The valencies of Ce, La, Pr, Nd, Y, and Fe can be divalent to tetravalent. 【0168】 The compound containing a specific element may contain one or more of the elements Ce, La, Pr, Nd, Y, and Fe. 【0169】 A specific element-containing compound having one or more of the elements Ce, La, Pr, Nd, Y, and Fe may be in hydrate or non-hydrate form. 【0170】Examples of specific element-containing compounds having one or more elements from Ce, La, Pr, Nd, Y, and Fe include cerium(IV) oxide, cerium(III) bromide, cerium(III) acetylacetonate, cerium(IV) methoxyethoxide, cerium(IV) isopropoxide, tris(isopropylcyclopentadienyl)cerium, tris(cyclopentadienyl)cerium, cerium silicide, diammonium cerium(IV) nitrate, cerium hydroxide(IV), cerium acetate(III), cerium tungstate(III), cerium oxalate(III), cerium perchlorate(III), cerium bromide(III), and tetrakis(2,2,6,6-tetramethyl-3,5- Cerium compounds such as heptanedionatocerium (IV), tris(1,2,3,4-tetramethyl-2,4-cyclopentadienyl)cerium (III), 2,4-pentanedionatocerium (III), trifluoroacetylacetonatecerium (III), cerium fluoride (III), cerium sulfide (III), cerium phosphate (III), cerium stearate (III), cerium 2-ethylhexanoate (III), cerium trifluoromethanesulfonate (III), cerium chloride (III), cerium fluoride (IV), cerium sulfate (IV), cerium iodide (III), cerium nitrate (III), cerium carbonate (III), and cerium trifluoromethanesulfonate (IV). 【0171】Yttrium(III) oxide, yttrium(III) isopropoxide, yttrium(III) hexafluoroacetylacetonate, tris(cyclopentadienyl)yttrium, tris(butylcyclopentadienyl)yttrium, tris(methylcyclopentadienyl)yttrium, tris(n-propylcyclopentadienyl)yttrium, tris[N,N-bis(trimethylsilyl)amide]yttrium(III), yttrium(III) perchlorate, tris(2,2,6,6-tetramethyl-3,5-heptanedionato)yttrium(III), yttrium(I II) Yttrium compounds such as acetylacetonate, yttrium chloride (III), yttrium oxalate (III), yttrium acetate (III), yttrium fluoride (III), yttrium iodide (III), yttrium 2-ethylhexanoate (III), yttrium nitrate (III), yttrium sulfide (III), yttrium bromide (III), yttrium trifluoromethanesulfonate (III), yttrium neodecanoate (III), yttrium phosphate (III), yttrium carbonate (III), yttrium sulfate (III), yttrium naphthenate (III), etc. 【0172】Lanthanum(III) oxide, lanthanum(III) isopropoxide, lanthanum tris(hexamethyldisilazide), lanthanum(III) ethoxide, tris(cyclopentadienyl)lanthanum, tris[N,N-bis(trimethylsilyl)amide]lanthanum, tris(isopropylcyclopentadienyl)lanthanum, lanthanum carbonate, tris(6,6,7,7,8,8-heptafluoro-2,2-dimethyl-3,5-octanedionato)lanthanum(III), lanthanum perchlorate(III), tris(2,2,6,6-tetramethyl-3,5-heptanedionato)lanthanum(III), tris[N,N-bis(trimethyl Compounds containing lanthanum such as silyl amide lanthanum (III), lanthanum (III) acetylacetonate, lanthanum chloride, lanthanum sulfate (III), lanthanum 2-ethylhexanoate (III), lanthanum fluoride (III), lanthanum chloride, lanthanum iodide (III), lanthanum boride, lanthanum sulfide (III), lanthanum bromide (III), lanthanum nitride (III), lanthanum trifluoromethanesulfonic acid (III), lanthanum nitrate (III), lanthanum carbonate (III), lanthanum acetate (III), tris(N,N'-di-i-propylformamidinate)lanthanum (III), lanthanum phosphate (III), etc. 【0173】Praseodymium(III) oxide, praseodymium(IV) oxide, praseodymium(III) hexafluoroacetylacetonate, praseodymium(III) hexafluoro-2,4-pentanedione, praseodymium(III) acetylacetonate, tris(2,2,6,6-tetramethyl-3,5-heptanedionato)praseodymium(III), tris(6,6,7,7,8,8,8-heptafluoro-2,2-dimethyl-3,5-octanedionato)praseodymium(III), tris(isopropyl Praseodymium compounds such as cyclopentadienyl praseodymium (III), isopropoxypraseodymium (III), praseodymium chloride (III), praseodymium fluoride (III), praseodymium acetate (III), praseodymium sulfate (III), praseodymium bromide (III), praseodymium iodide (III), praseodymium phosphate (III), praseodymium carbonate (III), praseodymium trifluoromethanesulfonate (III), praseodymium nitrate (III), praseodymium perchlorate (III), etc. 【0174】Neodymium(III) oxide, neodymium(III) isopropoxide, trifluoroacetylacetonate neodymium(III), tris(2,2,6,6-tetramethyl-3,5-heptanedionato) neodymium, tris(tetramethylcyclopentadienyl) neodymium, trifluoroacetylacetonate neodymium, tris(isopropylcyclopentadienyl) neodymium, neodymium trifluoromethanesulfonate(III), neodymium fluoride, tris(cyclopentadienyl) neodinium, neodymium perchlorate(III), neodymium fluoride(III), 2,4-pentanedione neodymium(III), tris[N,N-bis(trimethylsilyl) Neodymium compounds such as [Mido]neodinium(III), tris(2,2,6,6-tetramethyl-3,5-heptanedionato)neodymium(III), tris(6,6,7,7,8,8,8-heptafluoro-2,2-dimethyl-3,5-octanedionato)neodymium(III), neodymium(III) hexafluoroacetylacetonate, neodymium(III) 2-ethylhexanoate, neodymium(III) chloride, neodymium(III) titanate, neodymium(III) bromide, neodymium(III) iodide, neodymium(III) nitride, neodymium(III) acetate, neodymium(III) nitrate, neodymium carbonate, neodymium sulfate, neodymium(III) oxalate, etc. 【0175】Iron(II) oxide, iron(III) oxide, iron(III) acetylacetonate, iron(III) ethoxide, iron(III) isopropoxide, iron(III) 2,4-pentanedione, iron(III) trifluoroacetylacetonate, tris(2,2,6,6-tetramethyl-3,5-heptanedionate)ferric(III), tris(hexafluoroacetylacetonate)ferric(III), iron(III) sulfate, iron(III) hexacyanoferrate, iron(III) acrylate, ferric(III) ethylenediaminetetraacetate-sodium salt, ammonium iron(III) citrate, triammonium iron(III) trioxalate, tris(2-ethic) Examples of iron compounds include iron(III) oxyhexanoate, iron(III) phosphate, iron(III) fluoride, iron(III) chloride, iron(III) oxyhydroxide, iron(III) bromide, iron(III) trifluoromethanesulfonate, iron(III) tetraphenylporfin chloride, iron(III) ammonium hexacyanoferrate, iron(III) nitrate, potassium hexacyanoferrate, sodium pentacyanonitrosylferrate(III), iron(III) citrate, iron(III) diphosphate, iron(III) perchlorate, potassium iron(III) trisoxalate, iron(III) 1,3,5-benzenetricarboxylate, and iron(III) phosphate. 【0176】 In addition to the compounds listed above, compounds containing one or more elements from Ce, La, Pr, Nd, Y, and Fe, into which a siloxane skeleton has been introduced, can also be used. For example, in the case of compounds containing cerium, a reaction product of a cerium carboxylate and a siloxane compound having a carboxylate can be used, as described in Japanese Patent Publication No. 2020-132789. 【0177】Among these, cerium(III) acetylacetonate, cerium(III) nitrate, cerium(III) 2-ethylhexanoate, tris(cyclopentadienyl)cerium, yttrium(III) acetylacetonate, yttrium(III) nitrate, yttrium(III) 2-ethylhexanoate, tris(cyclopentadienyl)yttrium, lanthanum(III) acetylacetonate, lanthanum(III) 2-ethylhexanoate, tris(cyclo Lopentadienyl lanthanum, praseodymium(III) nitrate, neodymium(III) nitrate, neodymium(III) 2-ethylhexanoate, tris(cyclopentadienyl)neodinium, iron(III) acetylacetonate, iron(III) 2,4-pentanedione, tris(2,2,6,6-tetramethyl-3,5-heptanedionate)ferric(III), iron(III) acrylate, tris(2-ethylhexanoate)ferric(III), and iron(III) nitrate are preferred. 【0178】 As a compound containing specific elements, commercially available products such as the trade name "Octope R" (manufactured by Hope Pharmaceutical Co., Ltd.) may be used. 【0179】 The content of the compound containing the specific element is not particularly limited, but in terms of the balance between heat resistance and solubility, it is preferably 5 ppm or more and less than 5,000 ppm, more preferably 7 ppm or more and less than 3,000 ppm, and even more preferably 10 ppm or more and less than 2,000 ppm, based on the total mass of the resin composition excluding the solvent. 【0180】 (Organopolysiloxanes other than components A and B) The resin composition may further contain organopolysiloxanes other than components A and B. The other organopolysiloxanes may be used individually or in combination of two or more. The other organopolysiloxanes are compounds having at least one of the structures of the following formulas (E-1) to (E-4) and do not contain a group that crosslinks with component A. 【0181】 【0182】 In formulas (E-1) to (E-4), R ＥThese include alkyl groups such as methyl, ethyl, propyl, isopropyl, butyl, pentyl, hexyl, cyclohexyl, octyl, nonyl, and decyl groups, independently; aryl groups such as phenyl, tolyl, xylyl, and naphthyl groups; aralkyl groups such as benzyl, phenylethyl, or phenylpropyl groups; or groups in which at least one hydrogen atom is independently replaced by a halogen atom such as fluorine, chlorine, or bromine, such as chloromethyl, chloropropyl, bromoethyl, or trifluoropropyl groups. Of the above functional groups, groups that can take on either a linear or branched structure, such as propyl, butyl, or pentyl groups, may take either a linear or branched structure. In formulas (E-1) to (E-4), * represents a bonding site. 【0183】 Other organopolysiloxane structures may be linear, partially branched, or cyclic. Commercially available products include KF-96L, KF-96A, KF-96, KF-96H, KF-50, KF-54, KF-965, KF-968, KF-410, and KF-412 (all product names) from Shin-Etsu Chemical Co., Ltd., TSF451-0.65, TSF451-5A, TSF451-10, and TSF451-100 (all product names) from Momentive Corporation, and WACKER® SILICONE FLUID AK0.65 to 10, WACKER® SILICONE FLUID AK20 to 5,000 and WACKER® SILICONE FLUID from Asahi Kasei Wacker Silicone Co., Ltd. Examples include AS100, WACKER® L053, WACKER® L060, or WACKER® MQ803 (all are product names). 【0184】 The content of other organopolysiloxanes is 0.1 to 30 parts by mass, preferably 0.5 to 25 parts by mass, and more preferably 1 to 20 parts by mass, per 100 parts by mass of the total mass of the resin composition excluding the solvent. 【0185】(Curing retarder) The resin composition may further contain a curing retarder from the viewpoint of storage stability. One type of curing retarder may be used alone, or two or more types may be used in combination. 【0186】 As curing retarders, for example, known ones used in hydrosilylation reactions can be used. Specifically, these include compounds containing two or more alkenyl groups, compounds containing aliphatic unsaturated bonds, organophosphorus compounds, or tin compounds and organic peroxides. 【0187】 Examples of compounds containing two or more alkenyls include disiloxanes and trisiloxanes containing vinyl or allyl at both ends, such as 1,3-divinyl-1,1,3,3-tetramethyldisiloxane, 1,3-diallyl-1,1,3,3-tetramethyldisiloxane, 1,3-divinyl-1,3-dimethyl-1,3-diphenyldisiloxane, and 1,3-divinyl-1,1,3,3-tetraphenyldisiloxane, or vinyl-containing cyclic siloxanes such as 1,3,5,7-tetravinyltetramethylcyclotetrasiloxane. 【0188】 Examples of compounds containing aliphatic unsaturated bonds include propargyl alcohols such as 3-methyl-1-dodecine-3-ol, 3,5-dimethyl-1-hexyn-3-ol, or 1-ethynyl-1-cyclohexanol, or en-yne compounds, maleic anhydride, or maleic acid esters such as dimethyl maleate. 【0189】 Examples of organophosphorus compounds include triorganophosphines, diorganophosphines, organophosphons, or triorganophosphites. Examples of tin compounds include stannous halide dihydrate and stannous carboxylate. Examples of organic peroxides include di-t-butyl peroxide, dicumyl peroxide, benzoyl peroxide, or t-butyl perbenzoate. 【0190】 Of these, 1,3-divinyldisiloxane, 1,3,5,7-tetravinyltetramethylcyclotetrasiloxane, or 1-ethynyl-1-cyclohexanol are preferred. 【0191】 The content of the curing retarder is 10 to 200,000 times the content (mass) of component C, preferably 20 to 100,000 times, and more preferably 30 to 50,000 times. 【0192】 (Adhesion-improving agent) The resin composition according to this embodiment may contain an adhesion-improving agent from the viewpoint of adhesion. One type of adhesion-improving agent may be used alone, or two or more types may be used in combination. 【0193】 Preferably, the adhesion promoter is an organosilicon compound having a hydroxyl group, a hydrogen atom bonded to Si, or an alkoxy or epoxy bonded to Si, and more preferably having at least one alkoxy bonded to Si. Such a compound can crosslink with other components in the resin composition while bonding with components such as the substrate on which the resin composition is laminated, thereby improving the adhesion of the resulting cured product. Furthermore, from the viewpoint of heat resistance and other factors, the adhesion promoter is more preferably having a silsesquioxane structure. Examples of such preferred adhesion promoters include compounds represented by the following formula (Z). Note that the above-mentioned adhesion promoter having a hydroxyl group, a hydrogen atom bonded to Si, or an alkoxy bonded to Si may also function as component B. In this case, any component that overlaps with component B is treated as component B. 【0194】 【0195】 In formula (Z), R Ｇ０ R in equation (2) above is independent of the R １ This is synonymous with R. Ｇ１ R in equation (3) above is independent of the others. ３ This is synonymous with Q being an independent group represented by the following formulas (Z1), (Z31), (Z32), (Z33), or (Z41), and may include formula (Z2) as a linking group. 【0196】 R Ｇ１ Preferably, the group is an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms, with methyl groups and phenyl groups being more preferred. 【0197】 【0198】 In equations (Z1), (Z2), (Z31), (Z32), (Z33), and (Z41), * represents a bonding site, as described above. 【0199】 In formula (Z2), R Ｇ２ R is independently an alkyl group having 1 to 6 carbon atoms, a cyclopentyl group, a cyclohexyl group, or a phenyl group. g is an average value satisfying 1 to 20. Ｇ２ A methyl group or a phenyl group is preferred as the element. 【0200】 In formula (Z41), R Ｇ３ R is independently a methyl group, an ethyl group, a butyl group, or an isopropyl group. Ｇ３ A methyl group or an ethyl group is preferred. 【0201】 The amount of adhesion promoter added is preferably 0.1 to 10 parts by mass, more preferably 0.3 to 9 parts by mass, and even more preferably 0.5 to 8 parts by mass, per 100 parts by mass of the total mass of the resin composition excluding the solvent. 【0202】 (Fillers) The resin composition may further contain fillers from the viewpoint of heat resistance, optical properties, thixotropy, etc. One type of filler may be used alone, or two or more types may be used in combination. 【0203】 There are no particular limitations on the filler material; known materials can be used. Furthermore, the structure of the filler material may be amorphous or crystalline. The combination of fillers is also not limited. 【0204】 As fillers, for example, various phosphors and metal oxides can be suitably used. 【0205】Phosphors include various types such as those that emit green light, blue light, yellow light, or red light. Specific examples of phosphors include known phosphors such as organic phosphors, inorganic phosphors, fluorescent pigments, and fluorescent dyes. Examples of organic phosphors include allyl sulfonamide-melamine formaldehyde cocondensation dyes and perylene-based phosphors, with perylene-based phosphors being preferred due to their long-term usability. Inorganic phosphors are a preferred fluorescent substance. Inorganic phosphors will be described below. 【0206】 As a phosphor that emits green light, for example, [SrAl ２ O ４ :Eu], [Y ２ SiO ５ :Ce,Tb], [MgAl １１ O １９ :Ce, Tb], [Sr ７ Al １２ O ２５ :Eu], or [(at least one of Mg, Ca, Sr, Ba) Ga ２ S ４ Examples include [Eu]. 【0207】 As a phosphor that emits blue light, for example, [Sr ５ (PO ４ ) ３ Cl:Eu], [(SrCaBa) ５ (PO ４ ) ３ Cl:Eu], [(BaCa) ５ (PO ４ ) ３ Cl:Eu][(at least one of Mg, Ca, Sr, Ba) ２ B ５ O ９ Cl:Eu,Mn], or [(at least one of Mg, Ca, Sr, Ba) (PO ４ ) ６ Cl ２ Examples include [Eu, Mn], etc. 【0208】Examples of phosphors that emit light from green to yellow include yttrium aluminum oxide phosphors activated with at least cerium, yttrium gadolinium aluminum oxide phosphors activated with at least cerium, yttrium aluminum garnet oxide phosphors activated with at least cerium, or yttrium gallium aluminum oxide phosphors activated with at least cerium (so-called YAG phosphors). Specifically, [Ln ３ M ５ O １２ : R (Ln is at least one selected from Y, Gd, and La, M contains at least one of Al and Ca, and R is a lanthanide system.) or [(Y1-xGax) ３ (Al1-yGay) ５ O １２ : R (where R is at least one selected from Ce, Tb, Pr, Sm, Eu, Dy, Ho, and 0 < Rx < 0.5, 0 < y < 0.5) can be used. 【0209】 For example, [Y ２ O ２ S:Eu], [La ２ O ２ S:Eu], [Y ２ O ３ :Eu] or [Gd ２ O ２ S:Eu] is present. 【0210】 Furthermore, as a phosphor that emits light in response to a blue LED, [Y ３ (Al, Ga) ５ O １２ :Ce, (Y, Gd) ３ Al ５ O １２ : Ce, Lu ３ Al ５ O １２ : Ce, Y ３ Al ５ O １２ YAG-based phosphors such as Ce, [Tb ３ Al ５ O １２ TAG-based phosphors such as Ce, [(Ba, Sr) ２ SiO４ [Eu] phosphors, [Ca ３ Sc ２ Si ３ O １２ Ce-based phosphors, [(Sr, Ba, Mg) ２ SiO ４ Silicate phosphors such as [Eu], [(Ca,Sr) ２ Si ５ N ８ :Eu], [(Ca,Sr)AlSiN ３ :Eu], [CaSiAlN ３ Nitride phosphors such as [Eu], [Cax(Si,Al) １２ (O, N) １６ Oxynitride phosphors such as [Eu], and also [(Ba,Sr,Ca)Si ２ O ２ N ２ [Eu] phosphors, [Ca ８ MgSi ４ O １６ Cl ２ :Eu-based phosphor, or [SrAl ２ O ４ : Eu, Sr ４ Al １４ O ２５ Examples of phosphors include Eu. 【0211】 Among these, YAG-based phosphors, TAG-based phosphors, or silicate-based phosphors are preferred in terms of luminous efficiency and brightness. In addition, other known phosphors can be used depending on the application and the desired emission color. 【0212】 The phosphor content is preferably 1 to 90 parts by mass, and more preferably 2 to 50 parts by mass, based on 100 parts by mass of the total mass of the resin composition excluding the solvent. 【0213】 Next, we will explain the case where the filler is a metal oxide. Suitable metal oxides include silica, alumina, yttrium oxide, zinc oxide, magnesium oxide, antimony oxide, titanium oxide, or zirconium oxide. 【0214】The content of metal oxide in the resin composition is preferably 1 to 95 parts by mass, more preferably 1 to 90 parts by mass, and even more preferably 1 to 85 parts by mass, based on 100 parts by mass of the total mass of the resin composition excluding the solvent. 【0215】 When titanium dioxide or aluminum oxide is used, it can be suitably used as a reflector material. Polyphthalamide resin is widely used as a reflector material. However, it has been pointed out that polyphthalamide resin is prone to degradation, particularly discoloration, with long-term use, and this resin composition can solve that problem. 【0216】 In the case of silica, finely ground naturally occurring silica (natural silica) may be used, or industrially synthesized silica (synthetic silica) may be used. Natural silica has a crystalline axis because it is crystalline. Therefore, optical characteristics derived from the crystal can be expected, but its specific gravity is slightly higher than that of synthetic silica, which may affect its dispersion in the resin composition. Also, when obtained by crushing natural materials, the particles may have an irregular shape or a wide particle size distribution. 【0217】 Synthetic silica can be wet-processed or dry-processed, but there are no particular limitations on its use. However, synthetic silica may contain crystal water regardless of the manufacturing method, and if this crystal water may have any effect on the resin composition, cured product, or various application components using them, it is preferable to select the synthetic silica while considering the number of crystal waters. 【0218】 Synthetic silica is amorphous rather than crystalline, and therefore lacks a crystalline axis, meaning it doesn't exhibit the optical characteristics often associated with crystals. However, it offers advantages such as control over particle size distribution and the ability to create extremely small particles. In particular, fumed silica has nano-order particle sizes and exhibits excellent thixotropy. 【0219】 Furthermore, silica generally has a large surface area and is a hydrophilic material (hydrophilic silica) due to the effect of silanols present on its surface, but it can also be made hydrophobic silica through chemical modification. 【0220】For example, from the viewpoint of being able to dissipate the heat generated when the resin composition is used as an element, it is preferable that the resin composition contains a heat dissipation filler as a filler. The heat dissipation filler may be used alone or two or more types may be used in combination. 【0221】 Examples of heat dissipation fillers include alumina (Al ２ O ３ ), boron nitride (BN), aluminum nitride (AlN), silicon carbide (SiC), magnesium oxide (MgO), zinc oxide (ZnO), aluminum hydroxide (Al(OH) ３ Examples include: 【0222】 (Ion scavenger) The resin composition may further contain an ion scavenger from the viewpoint of insulation reliability. One type of ion scavenger may be used alone, or two or more types may be used in combination. 【0223】 There are no particular restrictions on the ion scavenging agent, and examples include anion trappers, cation trappers, or both ion trappers. Examples include DHT-4A, manufactured by Kyowa Chemical Industry Co., Ltd., and the IXE300 series, IXEPLAS-A series, or IXEPLAS-B series, manufactured by Toagosei Co., Ltd. The average particle size of the ion scavenging agent is preferably 0.1 to 3.0 μm, and the maximum particle size is preferably 10 μm or less. 【0224】 The ion scavenging agent content is preferably 0.1 to 10 parts by mass, and more preferably 0.3 to 9 parts by mass, per 100 parts by mass of the total mass of the resin composition excluding the solvent. 【0225】 (Surfactants) The resin composition may further contain surfactants for the purpose of controlling its wettability to the substrate. One type of surfactant may be used alone, or two or more types may be used in combination. 【0226】Specific examples of surfactants include Polyflow No. 45, Polyflow KL-245, Polyflow No. 75, Polyflow No. 90, Polyflow No. 95 (all product names, manufactured by Kyoeisha Chemical Industry Co., Ltd.), Disperbyk 161, Disperbyk 162, Disperbyk 163, Disperbyk 164, Disperbyk 166, Disperbyk 170, Disperbyk 180, Disperbyk 181, Disperbyk 182, BYK-300, BYK-306, BYK-310, BYK-320, BYK-330, BYK-342, BYK K-344, BYK-346 (product names, manufactured by Big Chemie Japan Co., Ltd.), KP-341, KP-358, KP-368, KF-96-50CS, KF-50-100CS (product names, manufactured by Shin-Etsu Chemical Co., Ltd.), Surflon SC-101, Surflon KH-40 (product names, manufactured by Seimi Chemical Co., Ltd.), Futergent 222F, Futergent 251, FTX-218 (product names, manufactured by Neos Co., Ltd.), TEGO Rad2100, 2200N, 2250, 2500, 2600, 2700 (all product names, manufactured by Evonik Japan Co., Ltd.), EFTOP EF-351, EFTOP EF-352, EFTOP EF-601, EFTOP EF-801, EFTOP EF-802 (product name, manufactured by Mitsubishi Materials Corporation), Megafac F-171, Megafac F-177, Megafac F-475, Megafac F-477, Megafac F-556, Megafac R-08, Megafac R-30 (product name, manufactured by DIC Corporation), fluoroalkylbenzene sulfonate, fluoroalkyl carboxylate, fluoroalkyl polyoxyethylene ether, fluoroalkylammonium iodide, fluoroalkyl betaine, fluoroalkyl sulfonate, diglycerin tetrakis(fluoroalkyl polyoxyethylene ether), fluoroalkyltrimethylammonium salt, fluoroalkylaminosulfonate, polyoxyethylene nonylphenyl ether, polyoxyethylene octylphenyl ether, polyoxyethylene lauryl ether, polyoxyethylene oleyl ether, polyoxyethylene tridecyl ether, polyoxyethylene cetyl ether, polyoxyethylene stearyl ether,Examples include polyoxyethylene laurate, polyoxyethylene oleate, polyoxyethylene stearate, polyoxyethylene laurylamine, sorbitan laurate, sorbitan palmitate, sorbitan stearate, sorbitan oleate, sorbitan fatty acid ester, polyoxyethylene sorbitan laurate, polyoxyethylene sorbitan palmitate, polyoxyethylene sorbitan stearate, polyoxyethylene sorbitan oleate, polyoxyethylene naphthyl ether, alkylbenzene sulfonate, alkyl diphenyl ether disulfonate, or polyether-modified polydimethylsiloxane. 【0227】 When the surfactant content is 0 to 3 parts by mass per 100 parts by mass of the total mass of the resin composition excluding the solvent, the wettability to the substrate tends to be excellent. 【0228】 (Flame retardant) The resin composition may further contain a flame retardant from the viewpoint of flame retardancy. It is preferable for the resin composition to contain a flame retardant because it increases the flame retardancy of the resulting cured film. The flame retardant is not particularly limited as long as it is a compound that can impart flame retardancy, but it is preferable to use an organophosphorus flame retardant from the viewpoint of low toxicity, low pollution, and safety. One type of flame retardant may be used alone, or two or more types may be used in combination. 【0229】 Examples of organophosphorus flame retardants include triphenyl phosphate, tricresyl phosphate, trixylenyl phosphate, cresylphenyl phosphate, 2-ethylhexyldiphenyl phosphate, 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, 10-(2,5-dihydroxyphenyl)-10H-9-oxa-10-phosphaphenanthrene-10-oxide, or condensed 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide. 【0230】 The flame retardant content is preferably 0 to 50 parts by mass per 100 parts by mass of the total mass of the resin composition excluding the solvent. 【0231】(UV absorbers, light stabilizers) The resin composition may contain UV absorbers or light stabilizers (HALS) to prevent degradation by light. These components may be used individually or in combination of two or more types. 【0232】 Examples of UV absorbers include benzotriazole compounds such as 2-(5-methyl-2-hydroxyphenyl)benzotriazole, 2-(3,5-di-t-butyl-2-hydroxyphenyl)benzotriazole, 2-(3,5-di-t-butyl-2-hydroxyphenyl)-5-chlorobenzotriazole, or 2-(3,5-di-t-amyl-2-hydroxyphenyl)benzotriazole; triazine compounds such as 2-(4,6-diphenyl-1,3,5-triazine-2-yl)-5-[(hexyl)oxy]phenol; benzophenone compounds such as 2-hydroxy-4-n-octyloxybenzophenone; and oxalic acid anilide compounds such as 2-ethoxy-2'-ethyloxalic acid bisanilide. 【0233】Examples of light stabilizers (HALS) include TINUVIN® 5100, TINUVIN 292 (compound name: bis(1,2,2,6,6-pentamethyl-4-piperidinyl) sebacate, methyl(1,2,2,6,6-pentamethyl-4-piperidinyl) sebacate), and TINUVIN 152 (compound name: 2,4-bis[N-butyl-N-(1-cyclohexyloxy-2,2,6,6-teto (L-methylpiperidine-4-yl)amino]-6-(2-hydroxyethylamine)-1,3,5-triazine), TINUVIN 144 (Compound name: Bis(1,2,2,6,6-pentamethyl-4-piperidinyl)-[[3,5-bis(1,1-dimethylethyl)-4-hydroxyphenyl]methyl]butylmalonate), TINUVIN 123 (Compound name: Reaction product of decandioic acid and bis(2,2,6,6-tetramethyl-1-(octyloxy)-4-piperidinyl) ester (in the presence of 1,1-dimethylethyl hydroperoxide and octane)), TINUVIN 111FDL (approximately 50%, TINUVIN 622, Compound name: (butanediic acid polymer (4-hydroxy-2,2,6,6-tetramethylpiperidinyl-yl) in the presence of ethanol), approximately 50%, CHIMASSORB 119, Compound names: N-N'-N''-N'''-tetrakis(4,6-bis(butyl-(N-methyl-2,2,6,6-tetramethylpiperidine-4-yl)amino)triazine-2-yl)-4,7-diazadecane-1,10-diamine) (both manufactured by BASF), Adeka Stab LA series (manufactured by Adeka Corporation), specifically LA-52, LA-57, LA-62, or LA-67. 【0234】 The amount of each ultraviolet absorber or light stabilizer is preferably 0 to 20 parts by mass per 100 parts by mass of the total mass of the resin composition excluding the solvent. 【0235】 (Antioxidant) The resin composition may further contain an antioxidant to prevent oxidation of the resulting cured film, etc. One type of antioxidant may be used alone, or two or more types may be used in combination. 【0236】Examples of antioxidants include dibutylhydroxytoluene, 2,6-t-butylphenol, 2,2'-methylenebis(6-t-butyl-4-ethylphenol), tris(4-t-butyl-3-hydroxy-2,6-dimethylbenzyl) isocyanurate, tris(3,5-t-butyl-4-hydroxybenzyl) isocyanurate, 1,1,3-tris(2-methyl-4-hydroxy-5-t-butylphenyl)butane, 4,4'-butylidenebis(6-t-butyl-m-cresol), 3-(3,5-di-t-butyl- Stearyl 4-hydroxyphenyl)propionate, tetrakis[3-(3',5'-di-t-butyl-4'-hydroxyphenyl)propionic acid]pentaerythritol, 2,2'-dimethyl-2,2'-(2,4,8,10-tetraoxaspiro[5,5]undecane-3,9-diyl)dipropane-1,1'-diyl=bis[3-(3-t-butyl-4-hydroxy-5-methylphenyl)propanoate], 2,4,6-tris(3',5'-di-t-butyl-4'-hydroxybenzyl)mesitylene, pentaerythritol Litol tetrakis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate], triethylene glycol-bis-[3-(3-t-butyl-5-methyl-4-hydroxyphenyl)propionate], 1,6-hexanediol-bis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate], octadecyl-3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate, or 3,5-di-t-butyl-4-hydroxybenzylphosphonate diethyl ester Hindered phenol compounds such as; amine compounds such as dinonyldiphenylamine, octylbutyldiphenylamine, n-butylamine, triethylamine, or diethylaminomethyl methacrylate; sulfur compounds such as bis(dibutyldithiocarbamate)methylene, pentaerythritol tetrakis[3-laurylthiopropionate], phenothiazine, dilauryl-3,3'-thiodipropionate, dimyristyl-3,3'-thiodipropionate, or distearyl-3,3'-thiodipropionate;Or triphenyl phosphite, diphenylisodecyl phosphite, phenyl diisodecyl phosphite, tris(nonylphenyl) phosphite, diisodecylpentaerythritol phosphite, tris(2,4-di-t-butylphenyl) phosphite, cyclic neopentanetetraylbis(octadecyl) phosphite, cyclic neopentanetetraylbis(2,4-di-t-butylphenyl) phosphite, cyclic neopentanetetraylbis(2,4-di-t-butyl-4-methylphenyl) phosphite, bis[2-t Phosphorus compounds such as butyl-6-methyl-4-{2-(octadecyloxycarbonyl)ethyl}phenyl]hydrogen phosphite and oxaphosphaphenanthrene oxides (9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, 10-(3,5-di-t-butyl-4-hydroxybenzyl)-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, or 10-decyloxy-9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide) are examples. 【0237】 The antioxidant content is preferably 0 to 10 parts by mass per 100 parts by mass of the total mass of the resin composition excluding the solvent. 【0238】 (Organic Resin) The resin composition may further contain an organic resin. By selecting the type of organic resin, further improvements in functionality can be achieved. One type of organic resin may be used alone, or two or more types may be used in combination. 【0239】Examples of organic resins include acrylic resins, epoxy resins, polyimide resins, cyanate resins, maleimide resins, benzoxazine resins, phenoxy resins, unsaturated polyester resins, phenolic resins, melamine resins, urethane resins, or silicone resins. Among these, resins that harden with a curing agent, such as epoxy resins, are preferably included together with the curing agent. Examples of curing agents for epoxy resins include acid anhydride compounds, phenolic compounds, amine compounds, heat or photoacid generators such as sulfonium salts or iodonium salts, photosensitizers, or active ester compounds. 【0240】 (Photosensitizer) The resin composition may further contain a photosensitizer. Further improvements in functionality can be achieved by selecting the type of photosensitizer. One type of photosensitizer may be used alone, or two or more types may be used in combination. Examples of photosensitizers include anthracene compounds, thioxanthone compounds, cyanine compounds, merocyanine compounds, coumarin compounds, benzylidene ketone compounds, squarylium compounds, (thia)pyrillium compounds, porphyrin compounds, pyrazoline compounds, oxazole compounds, thiophene type, naphthalene type, etc. Examples of commercially available products include the Anthracure UVS series such as Anthracure UVS-1331, Anthracure UVS-1101, Anthracure UVS-581, or Anthracure UVS-2171 manufactured by Air Water Performance Chemical Co., Ltd., and NF-CO-01, NF-CO-02, NF-CO-02-AC, NF-CO-05, NF-CO-06, NF-PY-01, NF-PY-02, NF-TH-01, NF-NA-01, NF-py-A, NF-py-B, NF-py-C, NF-Ox-A, NF-Co-A, etc. manufactured by Nippon Chemical Industrial Co., Ltd. The content of each photosensitizer is preferably 0.001 to 40 parts by mass per 100 parts by mass of the total mass of component C, which is an optional component in the resin composition. 【0241】<Method for producing the resin composition> The method for producing the resin composition described above is not particularly limited, and can be obtained, for example, by mixing each component using a known mixer. For example, a method can be used to mix a predetermined amount of component A, as well as optional components B, C, and other components, at room temperature or under heating using a mixer such as a stirrer, homodisper, homomixer, universal mixer, planetary mixer, kneader, three-roll mixer, or bead mill. 【0242】 Alternatively, the resin composition may be manufactured by preparing and mixing individual components, such as a two-component or three-component type. 【0243】 Another embodiment of the present invention provides a method for producing a resin composition using an organosilicon compound produced by the method for producing organosilicon compounds described above. Specifically, the method for producing a resin composition includes a compound production step of reacting a compound represented by formula (4) described above (a compound containing a silsesquioxane skeleton) with at least one of the compounds represented by formula (5) described above and the compound represented by formula (6) described above at a temperature of 20°C or higher and 70°C or lower to obtain a silicon compound. This embodiment may include steps other than the compound production step. Steps other than the compound production step may include, for example, a mixing step of mixing the components constituting the resin composition. 【0244】 Furthermore, another embodiment of the present invention is a resin composition obtained by the manufacturing method described above. The conditions for this resin composition can be similarly applied to those for the resin composition described above. 【0245】 <Cured Product> Another embodiment of the present invention is a cured product obtained by curing the resin composition described above. The curing method for obtaining the cured product is not particularly limited and can be carried out by known methods, for example, by treatment such as heating or light irradiation. 【0246】Since the viscosity change rate over time of the resin composition using component A is small, it is preferable to cure the above-mentioned resin composition in the form of a film to obtain a cured product as a silicone film. The film of the resin composition can be formed by known methods of coating it onto a substrate or sheet. Furthermore, the curing of the resin composition film can be determined based on conditions such as crosslinking. For example, a silicone film can be formed by heating the resin composition or its film. An example of a curing method is shown below, but the method is not limited to this method. 【0247】 [Curing Method] The cured product can be obtained, for example, by applying the above-mentioned resin composition to the surface of a substrate using a desired printing method (screen printing, letterpress printing, intaglio printing, planographic printing, inkjet printing, etc.), a dispenser, or spin coating, drying as necessary to form a coating film (coating film formation step), and then performing a heating step on the obtained coating film to cure the coating film. 【0248】 [Coating Film Formation Process] In the coating film formation process, a resin composition is applied to the surface of the substrate to form a coating film. Examples of substrates include semiconductor substrates such as aluminum substrates or glass substrates, copper substrates, copper alloy substrates, polyimide substrates, ceramic substrates, printed circuit boards, stainless steel substrates, fiber reinforced substrates such as CFRP or GFRP. 【0249】 In the case of resin compositions containing a solvent, a drying treatment may be performed to remove the solvent before curing. Depending on the composition of the resin composition, the drying temperature is usually 50 to 250°C; the drying time is usually 5 to 120 minutes. Such a drying treatment can form a coating film on the substrate that can maintain its shape. 【0250】 [Heating process] After the coating film is formed, the product is typically heat-treated at 70 to 350°C. The heat treatment is typically performed for 10 to 200 minutes. 【0251】 Furthermore, a cured product is defined as any product in which crosslinking reactions or similar processes have occurred in at least some of the components of a resin composition, resulting in reduced fluidity; it is not limited to products that are completely cured. In other words, cured products include those that are elastic or viscous, or those that soften or melt when heated. 【0252】 The cured product may be a B-stage cured product. A B-stage cured product refers to a cured product in a semi-cured state. Specifically, it is preferable that the B-stage cured product is solid at 25°C and has a softening point in the range of 50°C to 200°C. The B-stage cured product can be obtained by heating the resin composition, for example, in a temperature range of 100 to 350°C for 1 to 5 hours. 【0253】 The shape of the cured product is not particularly limited and may be a shape formed by curing the resin composition in the form of a film, or a molded article formed by curing the resin composition to a predetermined shape using a mold or the like. The shape of the cured product is not particularly limited and may be, for example, a film, a sheet, a powder, granules, or a plate. 【0254】 <Applications> The applications of the compositions and cured products described above are not particularly limited, but because the organosilicon compounds described above have a structure derived from compounds containing a silsesquioxane skeleton, excellent effects in various physical properties such as heat resistance, electrical insulation, transparency, adhesion, solubility, mechanical strength, gas permeability, dielectric constant, flame retardancy, and processability, as well as their use in a wide range of applications, can be expected. 【0255】 Specifically, the cured product described above has excellent heat resistance and insulation properties, and can therefore be suitably used in applications such as electrical and electronic materials. Specifically, it can be suitably used as a coating film for substrates that form metal elution prevention films, gas barrier films, or anti-reflective films; an insulating film, a encapsulant, a light-emitting diode encapsulant, a fouling prevention film, a component of an element such as a microlens, a light guide plate, a wavelength conversion layer, a light reflector, a buffer material, a sealant, an optical waveguide material, a planarization film, a protective film, an underfill material, or a die attach material; an optical resin; an optical film; a contact lens, etc. When used as an insulating film in an element, the insulating film may be, for example, an insulating film that covers a chip or element, or an insulating film for rewiring. Furthermore, because the cured product has excellent transparency, it can be suitably used as a lens including various lenses in the above applications, an optical filter, or a cover glass. The composition described above can be used as a material for forming the above-mentioned various components. 【0256】 Furthermore, the above-mentioned composition has excellent adhesive properties and can therefore be suitably used as an adhesive. 【0257】 When the above-described composition and cured product are used as components of an element, the type of element is not particularly limited and can be used as a semiconductor element, integrated circuit device, actuator element (such as a piezoelectric element like a MEMS), optical element, thermoelectric element, or passive element (such as a capacitor, inductor, or resistor). Examples of applications in which the element is used include devices for moving in at least one area selected from the group consisting of land, underground, air, space, sea, and underwater. Specific examples of such devices include vehicles, ships, and aircraft, which may be manned or unmanned (drones). Other examples of applications in which the element is used include electronic devices selected from the group consisting of home appliances, information equipment, video equipment, audio equipment, and amusement equipment, as well as hybrid equipment thereof. 【0258】 The types of semiconductor devices are not particularly limited, and examples include power semiconductor devices, various transistors such as junction field-effect transistors (JFETs), various diode devices such as light-emitting diodes, metal-oxide-semiconductor field-effect transistors (MOSFETs), Schottky source / drain MOSFETs, avalanche photomultiplier photoelectric conversion devices, solar cell devices, sensor devices, touch sensor devices, switching devices, resistive random-access memory, power conversion devices, or display devices. 【0259】 Furthermore, as described above, the compositions and cured products described above have excellent transparency and are therefore suitable as materials for constituting all or part of an optical component. In this specification, "optical component" is used as a general term for components having optical functions. Optical components are broadly classified into single optical elements, which have the function of changing the properties of light on their own, and electro-optical elements, which perform a predetermined function through interaction with electrons. 【0260】Single optical elements have the function of changing the transmission or reflection characteristics of incident light, and specific examples of their functions include polarization adjustment, light intensity adjustment, color tone adjustment, or optical path adjustment. Specific examples of single optical elements include polarizing members, coloring members, dimming members, wavelength conversion members, light shielding members, light-reducing members, reflective members, lenses, or mirrors. Electro-optical elements have the function of changing the characteristics of incident light based on electrical signals, or the function of converting optical signals into electrical signals or emitting light based on electrical signals based on photoelectric conversion. Specific examples of elements with the former function include electrochromic elements and liquid crystal elements. Specific examples of elements with the latter function include light-emitting elements such as LEDs and OLEDs. 【0261】 Furthermore, since the compositions and cured products described above are transparent and adhesive, they can be suitably used as protective or bonding members placed on or near the optical path, similar to conventional optical transparent adhesives. Conventional optical transparent adhesive films (OCAs) are basically made of adhesive materials and therefore do not easily have high heat resistance, but the compositions and cured products described above also have excellent heat resistance, so they can be suitably used in applications with a large amount of transmitted light, such as large projectors for projection mapping. If the cured product is a B-Stage cured product, the cured product described above or a resin-containing member containing the cured product may be usable as a substitute material for conventional OCAs. 【0262】 Furthermore, from the viewpoint of transparency, it can be suitably used as a lens, optical filter, or cover glass, and from the viewpoint of adhesion, it can be suitably used as an adhesive. 【0263】 Another example of the use of the cured material described above is when a composite member comprising a resin-containing member containing the cured material and another member (first member) provided in contact with the resin-containing member constitutes part of an electrical element. As the cured material described above has excellent properties as mentioned above, the resin-containing member may consist only of the cured material, but other materials may be included to obtain the desired properties. Examples of such materials include hard or soft resin materials and non-resin materials such as inorganic fillers. 【0264】 Specific examples of electrical elements include integrated circuit devices, power elements, switching elements, sensor elements, actuator elements such as MEMS, the aforementioned electro-optical elements, energy storage elements such as capacitors, inductors such as choke coils and transformers, and resistors. Examples of applications in which such electrical elements are used include devices for moving in at least one area selected from the group consisting of land, underground, air, space, sea, and underwater. Specific examples of such devices include vehicles, ships, and aircraft, which may be manned or unmanned (drones). Other examples of applications in which electrical elements are used include electrical equipment selected from the group consisting of home appliances, information equipment, video equipment, audio equipment, amusement equipment, and hybrid equipment thereof. 【0265】 One example of the application of the resin-containing member in the composite member described above is as a protective film covering at least a part of the first member. Specific examples of the first member include semiconductor substrates such as Si, GaN, and SiC; metal-based substrates such as copper-based materials, aluminum-based materials, and steel materials such as stainless steel; ceramic substrates such as alumina; glass substrates; and resin-based substrates. The resin-containing member containing the cured product described above has excellent adhesion to such substrates and can therefore be suitably used as a protective film. 【0266】 In particular, the cured products described above contain siloxane bonds (Si-O-Si), such as silsesquioxane groups and siloxane groups, and therefore have superior heat resistance compared to resin-based materials that do not have such bonds, resulting in particularly excellent adhesion to glass substrates, semiconductor substrates, and metal-based substrates. Furthermore, because the cured products described above contain siloxane bonds (Si-O-Si) in a predetermined proportion, they produce less greenhouse gas per unit weight compared to resin cured products that do not contain such bonds (epoxy resin being a specific example). 【0267】The first component may be a wiring board in which wiring is provided on a base material. In this case, the protective film made of the resin-containing material including the cured product described above preferably has insulating properties, and in this case, it becomes an insulating film that covers the wiring. Since the cured product described above also has excellent insulating properties, it can function appropriately as a protective film even when the resin-containing material is made up of the cured product. 【0268】 In this case, wiring may be further provided on the protective film, forming a laminated wiring structure. In this case, the resin-containing material including the cured product described above is positioned as a planarizing film, a rewiring insulating film, or an interlayer insulating film in a member having a multilayer wiring structure. 【0269】 The first component may be a base material on which an integrated circuit is formed. In this case as well, it is preferable that the protective film made of resin-containing material has insulating properties, and in this case, the protective film is positioned as a buffer coat covering the integrated circuit. 【0270】 Another specific example of the application of resin-containing components in the composite components described above is that they can be used as sealing materials, taking advantage of their adhesive properties. In this case, specific examples of the first component include integrated circuit devices, power elements, switching elements, and sensor elements. Because resin-containing components have excellent heat resistance, they can be used as a substitute material for sealing materials conventionally made of epoxy resin, and are particularly suitable for high-temperature environments. 【0271】 The composite member described above may include a second member that is different from the first member and is in contact with the resin-containing member. In this case, the resin-containing member has a bonding function that joins the first member and the second member. The specific example of the first member described above also corresponds to the specific example of the second member. 【0272】One specific example of an application of resin-containing components that focuses on bonding function is a filler component placed in the gap between a first component and a second component. Because the cured material described above has high adhesion to the first component and the second component, a resin-containing component containing this cured material can appropriately maintain the gap between the first component and the second component even when subjected to external force. An example of a filler component is an underfill material. Underfill materials may contain silica particles as a filler, but because the cured material described above has siloxane bonds (Si-O-Si), it also has excellent adhesion to silica particles. Therefore, underfill materials containing silica particles are a particularly suitable example of an application for resin-containing components. 【0273】 Another specific example of a resin-containing member that focuses on bonding function is a sealing material provided to cover the gap between a first member and a second member. The cured material described above has high adhesion to the first member and the second member, as well as flexibility. Therefore, the resin-containing member containing the cured material can maintain contact with the first member and the second member even when subjected to external force. 【0274】 In applications where a resin-containing component performs a bonding function, the first component may be a mounting substrate, and the second component may be an electrical element equipped with electrodes. Electrical elements may generate heat or vibrate when energized, but the cured material described above has excellent heat resistance, excellent adhesion, and high flexibility, making it possible to properly maintain the holding of the electrical element to the mounting substrate. One example of such an application is a die attach material. 【0275】 Furthermore, in recent years, there has been an increasing demand for higher output and higher density mounting of electrical components, requiring higher heat resistance in mounting technologies. The resin-containing components containing the aforementioned cured material can meet this demand. One mounting technology that addresses this increased heat resistance is POL (Power Overlay) technology, and the resin-containing components containing the aforementioned cured material can be suitably used as bonding members in this application. 【0276】In one example of POL technology, an adhesive layer is formed on a substrate made of a heat-resistant resin such as polyimide, and the electrode side of the electrical element is brought into contact with this adhesive layer to fix the electrical element on the substrate. Then, the substrate is drilled from the side opposite to the side on which the electrical element is placed (front side) (back side) (through-hole formation by removal process) to expose the electrode surface. The through-hole is then filled with a conductive material such as copper, and a wiring pattern is formed on the back side using plating technology or the like. After the back side with the wiring pattern is covered with an insulating film, a portion of the insulating film is removed to form external electrodes that connect to the wiring pattern. In addition, the front side is sealed with a resin-based material to cover the electrical element, and a heat dissipation member is attached as needed. 【0277】 The resin-containing material containing the cured product described above has excellent adhesion and high heat resistance, making it suitable for use as an adhesive layer formed on the surface of a substrate. It can also be used as a resin-based material to cover electrical elements that generate heat when energized. In this case, it may be preferable to use a resin-containing material in which a material with high thermal conductivity, such as alumina, is dispersed, taking advantage of the excellent heat resistance and adhesion of the cured product described above. 【0278】 The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples. 【0279】[Synthesis of Organosilicon Compounds] (Synthesis of Organosilicon Compound 1-1) Under a nitrogen atmosphere, silsesquioxane derivative (compound A-1) (170 g), octamethylcyclotetrasiloxane (compound A-2) (63.8 g), toluene (193 g), and 4-methyltetrahydropyran (MTHP) (48.1 g) were placed in a reactor and heated at 55°C. Sulfuric acid (7.39 g) was added dropwise, and the mixture was stirred for 24 hours. Water was poured into the reaction mixture, and the aqueous layer was extracted with toluene. The combined organic layers were washed with water, aqueous sodium bicarbonate solution, and saturated brine, and then dried over anhydrous sodium sulfate. This solution was concentrated under reduced pressure, and the residue was purified by reprecipitation (2-propanol:toluene = 5:1, by weight) to obtain organosilicon compound (1-1) (178 g). GPC analysis revealed that the obtained colorless, transparent solid had a weight-average molecular weight of 98,000 and a number-average molecular weight of 38,000. １ From the H-NMR analysis, the mean value of n in the following formula was 4.1, with 18% of the structures having n=1 and 23% having n=2. The proportion of structures having n=1 or n=2 represents the ratio of the number of structures corresponding to m=1 or m=2 in the above formula (B) to the total number of structures represented by the above formula (B). This is also true for the following examples and comparative examples. 【0280】 【0281】(Synthesis of comparative organosilicon compound P-1) Under a nitrogen atmosphere, silsesquioxane derivative (compound A-1) (300 g), octamethylcyclotetrasiloxane (compound A-2) (125 g), toluene (350 g), and 4-methyltetrahydropyran (87.6 g) were placed in a reactor and heated at 85°C. Sulfuric acid (13.2 g) was added dropwise, and the mixture was stirred for 6 hours. Water was poured into the reaction mixture, and the aqueous layer was extracted with toluene. The combined organic layers were washed with water, aqueous sodium bicarbonate solution, and saturated brine, and then dried over anhydrous sodium sulfate. This solution was concentrated under reduced pressure, and the residue was purified by reprecipitation (2-propanol:toluene:ethyl acetate = 21:3:1, by weight) to obtain organosilicon compound (P-1) (326 g). GPC analysis showed that the obtained colorless, transparent solid had a weight-average molecular weight of 96,000 and a number-average molecular weight of 36,000. １ From the H-NMR analysis, in the following formula (P-1), the mean value of n was 4.2, with 23% of the structures having n=1 and 22% having n=2. 【0282】 【0283】 (Synthesis of Organosilicon Compounds 1-2) Under a nitrogen atmosphere, silsesquioxane derivative (compound A-1) (150 g), octamethylcyclotetrasiloxane (compound A-2) (54.4 g), toluene (43.9 g), and 4-methyltetrahydropyran (176 g) were placed in a reactor and heated at 50°C. Sulfuric acid (15.1 g) was added dropwise, and the mixture was stirred for 6 hours. Water was poured into the reaction mixture, and the aqueous layer was extracted with toluene. The combined organic layers were washed with water, aqueous sodium bicarbonate solution, and saturated brine, and then dried over anhydrous sodium sulfate. This solution was concentrated under reduced pressure, and the residue was purified by reprecipitation (2-propanol:toluene = 6:1, by weight) to obtain organosilicon compound (1-2) (157 g). GPC analysis revealed that the obtained colorless, transparent solid had a weight-average molecular weight of 37,000 and a number-average molecular weight of 20,000. １ From the H-NMR analysis, in the following equation (1-2), the mean value of n was 4.1, with 19% of the structures having n=1 and 22% having n=2. 【0284】 【0285】 (Synthesis of Organosilicon Compounds 1-3) Under a nitrogen atmosphere, silsesquioxane derivative (compound A-1) (150 g), octamethylcyclotetrasiloxane (compound A-2) (54.4 g), toluene (110 g), and 4-methyltetrahydropyran (110 g) were placed in a reactor and heated at 50°C. Sulfuric acid (15.1 g) was added dropwise, and the mixture was stirred for 24 hours. Water was poured into the reaction mixture, and the aqueous layer was extracted with toluene. The combined organic layers were washed with water, aqueous sodium bicarbonate solution, and saturated brine, and then dried over anhydrous sodium sulfate. This solution was concentrated under reduced pressure, and the residue was purified by reprecipitation (2-propanol:toluene = 6:1, by weight) to obtain organosilicon compound (1-3) (157 g). GPC analysis revealed that the obtained colorless, transparent solid had a weight-average molecular weight of 54,000 and a number-average molecular weight of 26,000. １ From the H-NMR analysis, in the following equation (1-3), the mean value of n was 4.4, with 15% of the structures having n=1 and 20% having n=2. 【0286】 【0287】 (Synthesis of comparative organosilicon compound P-2) Under a nitrogen atmosphere, silsesquioxane derivative (compound A-1) (450 g), octamethylcyclotetrasiloxane (compound A-2) (163 g), toluene (330 g), and 4-methyltetrahydropyran (330 g) were placed in a reactor and heated at 90°C. Sulfuric acid (45.4 g) was added dropwise, and the mixture was stirred for 6 hours. Water was poured into the reaction mixture, and the aqueous layer was extracted with toluene. The combined organic layers were washed with water, aqueous sodium bicarbonate solution, and saturated brine, and then dried over anhydrous sodium sulfate. This solution was concentrated under reduced pressure, and the residue was purified by reprecipitation (2-propanol:toluene = 6:1, by weight) to obtain organosilicon compound (P-2) (440 g). GPC analysis revealed that the obtained colorless, transparent solid had a weight-average molecular weight of 39,000 and a number-average molecular weight of 22,000. １ From the 1H-NMR analysis, in the following equation (P-2), the mean value of n was 4.3, with 21% of the structures having n=1 and 19% having n=2. 【0288】 【0289】 (Synthesis of Organosilicon Compounds 1-4) Under a nitrogen atmosphere, silsesquioxane derivative (compound A-1) (15.0 g), octamethylcyclotetrasiloxane (compound A-2) (3.4 g), toluene (9.8 g), and 4-methyltetrahydropyran (9.8 g) were placed in a reactor and heated at 55°C. Sulfuric acid (1.2 g) was added dropwise, and the mixture was stirred for 7 hours. Water was poured into the reaction mixture, and the aqueous layer was extracted with toluene. The combined organic layers were washed with water, aqueous sodium bicarbonate solution, and saturated brine, and then dried over anhydrous magnesium sulfate. This solution was concentrated under reduced pressure, and the residue was purified by reprecipitation (2-propanol:toluene = 6:1, by weight) to obtain organosilicon compound (1-4) (13.9 g). GPC analysis revealed that the obtained colorless, transparent solid had a weight-average molecular weight of 57,000 and a number-average molecular weight of 26,000. １ From the H-NMR analysis, in the following equation (1-4), the mean value of n was 3.0, with 23% of the structures having n=1 and 26% having n=2. 【0290】 【0291】 (Synthesis of Organosilicon Compounds 1-5) Under a nitrogen atmosphere, silsesquioxane derivative (compound A-1) (30.0 g), octamethylcyclotetrasiloxane (compound A-2) (6.8 g), toluene (20.9 g), and 4-methyltetrahydropyran (20.9 g) were placed in a reactor and heated at 55°C. Sulfuric acid (5.0 g) was added dropwise, and the mixture was stirred for 6 hours. Water was poured into the reaction mixture, and the aqueous layer was extracted with toluene. The combined organic layers were washed with water, aqueous sodium bicarbonate solution, and saturated brine, and then dried over anhydrous magnesium sulfate. This solution was concentrated under reduced pressure, and the residue was purified by reprecipitation (2-propanol:toluene = 6:1, by weight) to obtain organosilicon compound (1-5) (25.9 g). GPC analysis revealed that the obtained colorless, transparent solid had a weight-average molecular weight of 60,000 and a number-average molecular weight of 30,000. １ From the H-NMR analysis, in the following equation (1-5), the mean value of n was 3.2, with 20% of the structures having n=1 and 27% having n=2. 【0292】 【0293】 (Synthesis of Organosilicon Compounds 1-6) Under a nitrogen atmosphere, silsesquioxane derivative (compound A-1) (30.0 g), octamethylcyclotetrasiloxane (compound A-2) (6.8 g), toluene (22.1 g), and 4-methyltetrahydropyran (22.1 g) were placed in a reactor and heated at 40°C. Sulfuric acid (7.4 g) was added dropwise, and the mixture was stirred for 4 hours. Water was poured into the reaction mixture, and the aqueous layer was extracted with toluene. The combined organic layers were washed with water, aqueous sodium bicarbonate solution, and saturated brine, and then dried over anhydrous magnesium sulfate. This solution was concentrated under reduced pressure, and the residue was purified by reprecipitation (2-propanol:toluene = 6:1, by weight) to obtain organosilicon compound (1-6) (32.0 g). GPC analysis revealed that the obtained colorless, transparent solid had a weight-average molecular weight of 61,000 and a number-average molecular weight of 31,000. １ From the 1H-NMR analysis, in the following equation (1-6), the mean value of n was 3.2, with 15% of the structures having n=1 and 29% having n=2. 【0294】 【0295】 (Synthesis of Organosilicon Comparative Compound P-3) Under a nitrogen atmosphere, silsesquioxane derivative (compound A-1) (300.0 g), octamethylcyclotetrasiloxane (compound A-2) (67.6 g), toluene (195.6 g), and 4-methyltetrahydropyran (195.6 g) were placed in a reactor and heated at 85°C. Sulfuric acid (23.6 g) was added dropwise, and the mixture was stirred for 6 hours. Water was poured into the reaction mixture, and the aqueous layer was extracted with toluene. The combined organic layers were washed with water, aqueous sodium bicarbonate solution, and saturated brine, and then dried over anhydrous magnesium sulfate. This solution was concentrated under reduced pressure, and the residue was purified by reprecipitation (2-propanol:toluene = 6:1, by weight) to obtain organosilicon compound (P-3) (316.1 g). GPC analysis revealed that the obtained colorless, transparent solid had a weight-average molecular weight of 33,000 and a number-average molecular weight of 18,000. １From the 1H-NMR analysis, in the following equation (P-3), the mean value of n was 3.0, with 27% of the structures having n=1 and 24% having n=2. 【0296】 【0297】 [Preparation of Resin Compositions] The components shown in Tables 1 to 4 were uniformly mixed and dissolved in the masses shown in Tables 1 to 4 to prepare resin compositions (Examples 1 to 23 and Comparative Examples 1 to 11). 【0298】 The components used other than the organosilicon compound (component A) mentioned above are listed below. 【0299】 (Compounds having functional groups that can chemically bond with organosilicon compounds (component B)) ・MS51: MKC Silicate MS51 (trademark), manufactured by Mitsubishi Chemical Corporation, average pentamer of tetramethoxysilane ・ES40: Oligomer of tetraethoxysilane, manufactured by Colcoat Co., Ltd., average degree of polymerization: 4-5 ・Trimethoxyphenylsilane: manufactured by Tokyo Chemical Industry Co., Ltd. ・1,6-Bis(trimethoxysilyl)hexane: manufactured by Tokyo Chemical Industry Co., Ltd. ・Triacetoxyphenylsilane: manufactured by Tokyo Chemical Industry Co., Ltd. 【0300】 (Solvents) Anisole: Manufactured by Fujifilm Wako Pure Chemical Industries, Ltd. EDM: Diethylene glycol ethyl methyl ether, manufactured by Toho Chemical Industry Co., Ltd. PGMEA: Propylene glycol monomethyl ether acetate, manufactured by Fujifilm Wako Pure Chemical Industries, Ltd. 1,3-Dimethoxybenzene: Manufactured by Fujifilm Wako Pure Chemical Industries, Ltd. 【0301】 (Curing catalyst (component C)) ・ZC-150: Zirconium tetraacetylacetonate, manufactured by Matsumoto Fine Chemical Co., Ltd. ・TC-750: Titanium ethyl acetoacetate, manufactured by Matsumoto Fine Chemical Co., Ltd. 【0302】 [Evaluation of Solubility] The appearance of the prepared resin composition was visually evaluated. A was used for transparent, B for cloudy (no insoluble matter), and C for cloudy (with insoluble matter). 【0303】[Evaluation of viscosity change rate over time] Resin compositions were prepared and stored at room temperature (21°C) for two weeks. For each resin composition, the viscosity was measured at 25°C and a rotation speed of 20 rpm using an E-type rotational viscometer manufactured by Toki Sangyo Co., Ltd. The viscosity at the time of preparation and after two weeks were compared, and the viscosity change rate (((viscosity after two weeks - viscosity at preparation) / viscosity at preparation) × 100) was calculated using the following formula. 【0304】 【0305】 【0306】 【0307】 【0308】 Tables 1-3 show that the resin compositions of Examples 1-19 exhibited a smaller rate of viscosity change (viscosity increase) over time compared to the resin compositions of Comparative Examples 1-7. Table 4 shows that even when a curing catalyst was added to the resin composition, the resin compositions of Examples 20-23 exhibited a smaller rate of viscosity change (viscosity increase) over time compared to the resin compositions of Comparative Examples 8-10. Furthermore, the resin compositions of Examples 1-23 were found to be transparent in appearance and to have excellent solubility. In addition, Examples 20 and 21, and 22 and 23 in Table 4 have almost identical compositions except for the presence of a trace component, the catalyst (component C), and therefore have similar viscosities during preparation. On the other hand, Comparative Examples 8 and 9, and 10 and 11, which used comparative organosilicon compounds, exhibited large viscosity variations from the time of preparation despite having similar compositions, making them difficult to handle. 【0309】 From the above, it has been found that in a resin composition containing an organosilicon compound having the structures represented by formulas (A) and (B), by providing a configuration in which the proportion of the organosilicon compound (component A) with the structure represented by formula (B) having m=2 is greater than the proportion of the structure represented by formula (B) having m=1, it is possible to provide a resin composition with a small rate of change in viscosity over time and excellent handling properties.

Claims

1. A resin composition containing an organosilicon compound having a structure represented by the following formulas (A) and (B), wherein the proportion of the structure represented by the following formula (B) with m = 2 is more than the proportion of the structure represented by the following formula (B) with m = 1. (In the above formula (A), R ２ , ２ , １３ is independently an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms; R ２ is independently an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms; in the above formula (B), R ３ is independently an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms; m is an integer from 1 to 30; when at least one of R １ , R ２ , and R ３ is an alkyl group having 1 to 40 carbon atoms, the alkyl group having 1 to 40 carbon atoms may be independently replaced by at least one hydrogen atom with a halogen atom, a cycloalkyl group A １２ having 5 or 6 carbon atoms, or an aryl group A １４ having 6 to 20 carbon atoms, and at least one -CH ２ - may be independently replaced by -O-, -CO-, a cycloalkylene group A １３ having 5 or 6 carbon atoms, or an arylene group A １５ having 6 to 20 carbon atoms; when at least one of R １ , R ２ , and R ３ is a cycloalkyl group having 5 or 6 carbon atoms, the cycloalkyl group having 5 or 6 carbon atoms may be independently replaced by at least one hydrogen atom with a halogen atom, an alkyl group A ２１ having 1 to 40 carbon atoms, a cycloalkyl group A ２２ having 5 or 6 carbon atoms, or an aryl group A ２４ having 6 to 20 carbon atoms, and at least one -CH ２ The - can be independently replaced by -O- or -CO-; R １ , R ２ , and R ３ If at least one of the C6-C20 aryl groups, then the C6-C20 aryl group independently comprises at least one hydrogen atom independently comprising a halogen atom and an alkyl group A having 1-C40 atoms. ３１ , a cycloalkyl group A having 5 or 6 carbon atoms ３２ , or an aryl group A having 6 to 20 carbon atoms ３４ It may be replaced by the alkyl group A ２１ and the alkyl group A ３１ The hydrogen atom may be independently replaced by a halogen atom, a carbon-5 or carbon-6 cycloalkyl group, or a carbon-6 to carbon-20 aryl group, and at least one -CH ２ The - can be independently replaced by -O-, -CO-, a cycloalkylene group having 5 or 6 carbon atoms, or an arylene group having 6 to 20 carbon atoms; the cycloalkyl group A １２ , the cycloalkylene group A １３ , the cycloalkyl group A ２２ and the cycloalkyl group A ３２ The hydrogen atom may be independently replaced by at least one halogen atom, a C1-C40 alkyl group, a C5 or C6 cycloalkyl group, or a C6-C20 aryl group, and at least one -CH ２ The - can be independently replaced by -O-, -CO-, etc.; the aryl group A １４ , the arylene group A １５ , the aryl group A ２４ and the aryl group A ３４ (Independently, at least one hydrogen atom may be independently replaced by a halogen atom, a C1-C40 alkyl group, a C5 or C6 cycloalkyl group, or a C6-C20 aryl group.) 2. The resin composition according to claim 1, wherein the organosilicon compound comprises a compound represented by the following formula (1), contains at least a structure represented by the following formula (3), and the proportion of the structure represented by the following formula (3) with n=2 is greater than the proportion of the structure represented by the following formula (3) with n=1. (In formula (1) above, X includes one or more structures represented by formula (2) above, and does not include any other structures; when X includes two or more structures represented by formula (2) above, the two or more structures may be the same or different; Y １ is a single bond or a structure represented by formula (3) above; in formula (2) above, R １ R in formula (A) is independent of the above. １ It is synonymous with; R ２ R in formula (A) is independent of the above. ２ It is synonymous with; Y ２ This is a single bond or a structure represented by formula (3) above, and Y １ It may be the same as or different from; in the above formula (3), R ３ R in formula (B) is independent of the above. ３ This is synonymous with [the above]; n is an integer between 1 and 30.

3. The resin composition according to claim 1, further comprising a compound having a functional group that can chemically bond with the organosilicon compound.

4. The resin composition according to claim 3, wherein the compound having the functional group is a compound having two or more of one or more groups represented by the following formulas (F-1) to (F-8). (In the above formulas (F-1) to (F-8), R ４ (These are independently a hydrogen atom, a C1-C20 alkyl group in which at least one hydrogen atom may be independently replaced by a halogen atom, a C3-C6 cycloalkyl group in which at least one hydrogen atom may be independently replaced by a halogen atom, or a C6-C20 aryl group in which at least one hydrogen atom may be independently replaced by a halogen atom; * indicates a bonding site.) 5. The resin composition according to claim 4, wherein the compound having the functional group comprises one or more silicon compounds selected from hydrolyzable organosilane compounds represented by the following formula (10) and partially hydrolyzed condensates of said hydrolyzable organosilane compounds. ５ ４－ａ SiZ ａ (10) (In the above formula (10), R ５ (i) is independently a C1-C20 alkyl group, a C3-C6 cycloalkyl group, or a C6-C20 aryl group, in which at least one hydrogen atom may be independently replaced by a halogen atom; Z is independently one of the groups represented by formulas (F-1) to (F-8); and a is an integer from 2 to 4.

6. The resin composition according to claim 5, wherein formula (10) is the following formula (11). ６ ４－ｂ Si(OR) ７ ) ｂ (11) (In the above formula (11), R ６ R is an alkyl group having 1 to 20 carbon atoms in which at least one hydrogen atom may be independently replaced by a halogen atom, a cycloalkyl group having 3 to 6 carbon atoms in which at least one hydrogen atom may be independently replaced by a halogen atom, or an aryl group having 6 to 20 carbon atoms in which at least one hydrogen atom may be independently replaced by a halogen atom; ７ (b is independently a hydrogen atom or an alkyl group having 1 to 10 carbon atoms; b is an integer from 2 to 4.) 7. The resin composition according to claim 3, further comprising a curing catalyst.

8. The resin composition according to claim 7, wherein the curing catalyst has one or more elements selected from Zr, Ti, Al, S, I, N, and P.

9. A cured product of the resin composition according to any one of claims 1 to 8.

10. An element having a layer containing the cured product described in claim 9.

11. An electronic device having the element described in claim 10.

12. A method for producing a resin composition, comprising a compound manufacturing step of reacting a compound represented by the following formula (4) with at least one of the compounds represented by the following formula (5) and the following formula (6) at a temperature of 20°C to 70°C to obtain a silicon compound. (In the above formula (4), R Ａ１ R is independently an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms; Ａ２ R is independently an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms; Ａ７ These are, independently, hydrogen atoms, or -(Si(R Ｂ３ ) ２ -O) ｐ -Si(R Ｂ３ ) ２ -OH (where p independently represents an integer from 0 to 30); R Ｂ３ R is independently an alkyl group having 1 to 40 carbon atoms, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms; in formula (5) above, Ａ３ These are independently C1-C40 alkyl groups, C5 or C6 cycloalkyl groups, or C6-C20 aryl groups; n Ａ１ R is an integer between 1 and 30; in the above formula (6), Ａ４ These are independently C1-C40 alkyl groups, C5 or C6 cycloalkyl groups, or C6-C20 aryl groups; n Ａ２ is an integer between 3 and 30; R Ａ１ , R Ａ２ , R Ａ３ , R Ａ４ , and R Ｂ３ If at least one of the C1-C40 alkyl groups is an alkyl group having 1 to 40 carbon atoms, then the alkyl group having 1 to 40 carbon atoms may independently have at least one hydrogen atom that is a halogen atom, or a cycloalkyl group having 5 or 6 carbon atoms. Ｂ２ , or an aryl group A having 6 to 20 carbon atoms Ｂ４ It may be replaced by at least one -CH ２ - is independently -O-, -CO-, a cycloalkylene group A having 5 or 6 carbon atoms Ｂ３ , or an arylene group A having 6 to 20 carbon atoms Ｂ５ may be replaced; R Ａ１ , R Ａ２ , R Ａ３ , R Ａ４ , and R Ｂ３ when at least one of them is a cycloalkyl group having 5 or 6 carbon atoms, the cycloalkyl group having 5 or 6 carbon atoms is independently such that at least one hydrogen atom is independently a halogen atom, an alkyl group A having 1 to 40 carbon atoms Ｃ１ , a cycloalkyl group A having 5 or 6 carbon atoms Ｃ２ , or an arylene group A having 6 to 20 carbon atoms Ｃ４ may be replaced, and at least one -CH ２ - may be independently replaced by -O- or -CO-; R Ａ１ , R Ａ２ , R Ａ３ , R Ａ４ , and R Ｂ３ when at least one of them is an aryl group having 6 to 20 carbon atoms, the aryl group having 6 to 20 carbon atoms is independently such that at least one hydrogen atom is independently a halogen atom, an alkyl group A having 1 to 40 carbon atoms Ｄ１ , a cycloalkyl group A having 5 or 6 carbon atoms Ｄ２ , or an arylene group A having 6 to 20 carbon atoms Ｄ４ may be replaced; the alkyl group A Ｃ１ and the alkyl group A Ｄ１ are independently such that at least one hydrogen atom may be independently replaced by a halogen atom, a cycloalkyl group having 5 or 6 carbon atoms, or an aryl group having 6 to 20 carbon atoms, and at least one -CH ２ - may be independently replaced by -O-, -CO-, a cycloalkylene group having 5 or 6 carbon atoms, or an arylene group having 6 to 20 carbon atoms; the cycloalkyl group A Ｂ２ , the cycloalkylene group A Ｂ３ , the cycloalkyl group A Ｃ２ and the cycloalkyl group A Ｄ２ The hydrogen atom may be independently replaced by at least one halogen atom, a C1-C40 alkyl group, a C5 or C6 cycloalkyl group, or a C6-C20 aryl group, and at least one -CH ２ The - can be independently replaced by -O-, -CO-, etc.; the aryl group A Ｂ４ , the arylene group A Ｂ５ , the aryl group A Ｃ４ and the aryl group A Ｄ４ (Independently, at least one hydrogen atom may be independently replaced by a halogen atom, a C1-C40 alkyl group, a C5 or C6 cycloalkyl group, or a C6-C20 aryl group.)

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