Two-component resin composition

Abstract

The present invention provides a two-component resin composition having excellent storage stability and excellent curability after storage. The present invention relates to a two-component resin composition composed of a component A and a component B, said two-component resin composition characterized in that the component A contains a reaction accelerator, the reaction accelerator contains a metal compound, the component B contains a reaction acceleration aid, the reaction acceleration aid contains a ketone compound, the component A and / or component B contains a radically polymerizable monomer, and the component A and / or component B contains inorganic particles having a thermal conductivity of 2 W / m·K or more.

Description

Two-component resin composition 【0001】 This invention relates to a two-component resin composition. More specifically, it relates to a two-component resin composition useful for heat dissipation materials and the like. 【0002】 In recent years, with the improvement of performance in electronic devices such as automobile batteries and personal computers, the amount of heat generated has increased, and there is a need for heat dissipation materials that can efficiently dissipate heat. As a heat dissipation material, for example, a thermally conductive composition in which metal fillers are dispersed in a resin is known. 【0003】 Regarding resin compositions for heat dissipation materials, Patent Document 1 discloses a two-component resin composition for heat dissipation materials comprising liquid A and liquid B, wherein liquid A contains a (meth)acrylic polymer, a radical polymerizable monomer, a reaction accelerator, and at least one crosslinking agent selected from the group consisting of (meth)acrylate crosslinking agents and allyl crosslinking agents, and liquid B contains a (meth)acrylic polymer and a peroxide polymerization initiator. 【0004】 Patent Document 2 discloses a curable resin composition that hardens when liquid A and liquid B are mixed, wherein liquid A contains a thiourea compound and liquid B contains a hydroperoxide compound, and the mass ratio of the thiourea compound to the hydroperoxide compound (mass of thiourea compound / mass of hydroperoxide compound) is 5 / 95 to 90 / 10, and it is also disclosed that the composition can be used as a heat dissipation agent. 【0005】 Although Patent Document 3 does not disclose a composition having sufficient thermal conductivity as a heat dissipation material, it does disclose a two-component, room-temperature curing adhesive in which 2-hydroxyethyl methacrylate, vinyl acetate polymer, cobalt naphthenate, and acetyl butyrolactone are essential components, and liquid A containing cobalt naphthenate and liquid B containing acetyl butyrolactone are stored separately from each other until immediately before use. 【0006】 Non-patent document 1 does not disclose a composition having sufficient thermal conductivity as a heat dissipation material, but it does disclose a metal compound (Mn(acac) ３ The cured properties using (etc.) and acetylbutyrolactone have been investigated. 【0007】 International Publication No. 2021 / 039749, Japanese Patent Publication No. 2023-059307, Japanese Patent Publication No. Hei 11-140384 【0008】 Patxi Garra et al., “Peroxide-Free and Amine-Free Redox Free Radical Polymerization: Metal Acetylacetonates / Stable Carbonyl Compounds for Highly Efficient Synthesis of Composites,” Macromolecules, August 14, 2018, DOI: 10.1021 / acs.macromol.8b01360 【0009】 As mentioned above, resin compositions for heat dissipation applications have been developed for some time. However, the radical initiators typically used in room-temperature curing methods undergo thermal decomposition, resulting in a problem where the physical properties deteriorate after long-term storage. Furthermore, resin compositions used for heat dissipation applications typically incorporate inorganic particles with high thermal conductivity, such as alumina, to improve thermal conductivity. However, such resin compositions suffer from poor curability after storage. 【0010】 This invention has been made in view of the above-mentioned circumstances, and aims to provide a two-component resin composition that has good storage stability and good curability after storage. 【0011】 The inventors of the present invention have conducted various studies on two-component resin compositions and have found that a two-component resin composition comprising liquid A and liquid B, wherein liquid A contains a reaction accelerator, the reaction accelerator contains a metal compound, liquid B contains a reaction accelerator aid, the reaction accelerator aid contains a ketone compound, liquid A and / or liquid B contain a radical polymerizable monomer, and liquid A and / or liquid B contain inorganic particles with a thermal conductivity of 2 W / m·K or higher, exhibits good storage stability and good curing properties after storage. The inventors have thus arrived at the present invention, conceiving that this can brilliantly solve the above problems. 【0012】The present invention encompasses the following two-component resin compositions, etc. [1] A two-component resin composition comprising liquid A and liquid B, wherein liquid A contains a reaction accelerator, the reaction accelerator contains a metal compound, liquid B contains a reaction accelerator aid, the reaction accelerator aid contains a ketone compound, liquid A and / or liquid B contain a radical polymerizable monomer, and liquid A and / or liquid B contain inorganic particles with a thermal conductivity of 2 W / m·K or more. [2] The two-component resin composition according to [1], wherein the ketone compound is a dicarbonyl compound. [3] The two-component resin composition according to [1] or [2], wherein the inorganic particles are at least one selected from the group consisting of carbonate particles, oxide particles, hydroxide particles, silicate particles, nitride particles, sulfate particles, metal particles, and carbon black particles. [4] The radical polymerizable monomer is a radical polymerizable monomer whose glass transition temperature when formed into a homopolymer is 0°C or lower, as described in any of [1] to [3] above, and is the two-component resin composition described in any of [1] to [4] above, wherein the liquid A and / or liquid B further contains a polyfunctional monomer. [6] The liquid A and / or liquid B further contains a plasticizer, as described in any of [1] to [5] above, and is the two-component resin composition described in any of [1] to [6] above, wherein the liquid A and / or liquid B further contains a (meth)acrylic polymer. [8] The two-component resin composition described in any of [1] to [7] above, used for heat dissipation applications. [9] A cured product obtained by curing the two-component resin composition described in any of [1] to [8] above.

[10] A heat dissipation material obtained by curing the two-component resin composition described in [8] above. 【0013】 The two-component resin composition of the present invention has the above-described structure, exhibits good storage stability and good curing properties after storage, and can be suitably used, for example, as a resin for heat dissipation materials, adhesives, and sealants. 【0014】Preferred embodiments of the present invention will be described below in detail, but the present invention is not limited to the following descriptions and can be modified and applied as appropriate without changing the gist of the present invention. Furthermore, embodiments combining two or more of the individual preferred embodiments of the present invention described below also constitute preferred embodiments of the present invention. 【0015】 The present invention provides a two-component resin composition comprising liquid A and liquid B. A cured product can be obtained by reacting liquid A and liquid B. 【0016】 The above-mentioned liquid A contains a reaction accelerator, and the reaction accelerator is characterized by containing a metal compound. The above-mentioned liquid B contains a reaction accelerator, and the reaction accelerator is characterized by containing a ketone compound. The above-mentioned liquid A and / or liquid B are characterized by containing a radical polymerizable monomer. Furthermore, the above-mentioned liquid A and / or liquid B are characterized by containing inorganic particles with a thermal conductivity of 2 W / m·K or higher. The two-component resin composition of the present invention, consisting of such liquid A and liquid B, has good storage stability and good curability after storage. 【0017】The reason why the two-component resin composition of the present invention has good storage stability and curability after storage is thought to be as follows. That is, during storage of the composition, for example, a peroxide-based initiator gradually decomposes and generates radicals when stored at high temperatures, and when radical polymerizable monomers are present, there is a risk that the polymerization reaction will proceed and the composition will solidify. Such solidification can be suppressed to some extent by using a peroxide-based initiator with a high half-life temperature and by not having it in the presence of radical polymerizable monomers, but when mixed with inorganic particles, the peroxide-based initiator gradually decomposes due to the influence of functional groups such as hydroxyl groups on the surface of the inorganic particles, and the residual rate of the initiator after storage becomes low, so there is a risk that the two liquids will not solidify (failure to cure) when mixed after storage. On the other hand, in the two-component resin composition of the present invention, radicals are generated only when the liquid containing a metal compound and the liquid containing a ketone compound react when the two compounds are mixed, so it is possible to sufficiently prevent solidification before mixing and also sufficiently prevent the failure to cure when the two liquids containing inorganic particles are mixed after storage. Furthermore, regardless of the type of metal compound, if the two-component resin composition of the present invention is mixed with a liquid containing a metal compound and a liquid containing a ketone compound, the reaction between the two compounds to generate radicals is considered to be the same, as it is possible to sufficiently prevent solidification before mixing and to sufficiently prevent curing defects when the two liquids containing inorganic particles are mixed after storage. Furthermore, as will be described later, when the ketone compound is a β-dicarbonyl compound, when the metal compound and the β-dicarbonyl compound react as exemplified by the following formulas (α) and (β), the β-dicarbonyl compound becomes a radical (for example, the radical shown in (5) below). Since such radicals derived from β-dicarbonyl compounds are less likely to react with oxygen in the air due to steric hindrance and are less likely to be deactivated, it is presumed that the curability of the air-contact portion during curing will be even better. 【0018】 【0019】 In the above formula (α), R represents an organic group. １ represents a metallic element (preferably a transition metal element). In the above formula (β), M ２ represents a metallic element (preferably a transition metal element). 【0020】 The proportion of metal by mass in the metal compound that acts as a reaction accelerator in the above-mentioned solution A is preferably 0.001 to 5% by mass, relative to 100% by mass of the amount of solution A excluding inorganic particles. More preferably 0.005 to 3% by mass, even more preferably 0.01 to 2% by mass, and particularly preferably 0.02 to 1% by mass. Furthermore, the proportion of metal by mass in the above-mentioned metal compound that acts as a reaction accelerator is preferably 0.00002 to 2% by mass, relative to 100% by mass of the amount of solution A containing inorganic particles. More preferably 0.0002 to 1% by mass, even more preferably 0.001 to 0.3% by mass, and particularly preferably 0.004 to 0.1% by mass. 【0021】 The proportion of the metal in the metal compound that acts as a reaction accelerator in Solution A is preferably 0.001 to 10% by mass, relative to 100% by mass of the total mass of the radical polymerizable monomers contained in Solution A and / or Solution B. More preferably, it is 0.005 to 8% by mass, even more preferably 0.01 to 6% by mass, even more preferably 0.02 to 4% by mass, and particularly preferably 0.05 to 1% by mass. When each of Solution A and Solution B contains a radical polymerizable monomer, the total mass of the radical polymerizable monomers contained in Solution A and / or Solution B is the total mass of the radical polymerizable monomers contained in Solution A and Solution B. 【0022】 The proportion of the metal compound in the reaction accelerator contained in the above-mentioned solution A is preferably 1 to 100% by mass, relative to 100% by mass of the reaction accelerator contained in the above-mentioned solution A. More preferably, it is 50 to 100% by mass, even more preferably 90 to 100% by mass, and particularly preferably 100% by mass. The standard amount of 100% by mass of the reaction accelerator is the amount of the active ingredient. 【0023】The mass ratio of the ketone compound, which is a reaction acceleration aid contained in the above-mentioned Liquid B, is preferably 0.1 to 50% by mass based on 100% by mass of the amount of Liquid B excluding inorganic particles. More preferably, it is 0.2 to 30% by mass, still more preferably 0.5 to 20% by mass, and particularly preferably 1 to 15% by mass. Also, based on 100% by mass of the amount of Liquid B containing inorganic particles, the mass ratio of the ketone compound, which is the above-mentioned reaction acceleration aid, is preferably 0.002 to 10% by mass. More preferably, it is 0.005 to 5% by mass, still more preferably 0.01 to 3% by mass, and particularly preferably 0.05 to 2% by mass. 【0024】 The mass ratio of the ketone compound, which is a reaction acceleration aid contained in the above-mentioned Liquid B, is not particularly limited, but is preferably 0.1 to 40% by mass based on 100% by mass of the total mass of the radically polymerizable monomers contained in the above-mentioned Liquid A and / or Liquid B. More preferably, it is 0.5 to 20% by mass, still more preferably 1 to 15% by mass. 【0025】 The ratio of the ketone compound, which is a reaction acceleration aid contained in the above-mentioned Liquid B, is preferably 0.1 to 100 moles per 1 mole of the metal compound in the reaction accelerator contained in Liquid A. More preferably, it is 0.5 to 90 moles, still more preferably 1 to 80 moles, even more preferably 2 to 70 moles, and particularly preferably 5 to 60 moles. 【0026】 The ratio of the ketone compound in the reaction acceleration aid contained in the above-mentioned Liquid B is preferably 1 to 100% by mass based on 100% by mass of the reaction acceleration aid contained in the above-mentioned Liquid B. More preferably, it is 50 to 100% by mass, still more preferably 90 to 100% by mass, and particularly preferably 100% by mass. Note that the amount of 100% by mass of the reference reaction acceleration aid is the amount of the active ingredient. 【0027】 The total ratio of the metal in the ketone compound, which is a reaction acceleration aid contained in the above-mentioned Liquid B, and the metal compound, which is a reaction accelerator contained in the above-mentioned Liquid A, is preferably 0.1 to 100% by mass based on 100% by mass of the total mass of the radically polymerizable monomers contained in the above-mentioned Liquid A and / or Liquid B. More preferably, it is 0.5 to 50% by mass, still more preferably 1 to 20% by mass. 【0028】 The content ratio of the radically polymerizable monomer contained in the above liquid A is not particularly limited, but is preferably 30 to 99.9% by mass based on 100% by mass of the total amount of liquid A excluding inorganic particles. More preferably, it is 33 to 90% by mass, still more preferably 36 to 80% by mass, and particularly preferably 39 to 70% by mass. In the present specification, when the liquid A does not contain inorganic particles, the total amount of the liquid A excluding inorganic particles is the total amount of the liquid A. Further, based on 100% by mass of the total amount of the liquid A containing inorganic particles, the content ratio of the radically polymerizable monomer contained in the above liquid A is preferably 0.5 to 40% by mass. More preferably, it is 0.8 to 30% by mass, still more preferably 1 to 20% by mass, and particularly preferably 1.2 to 15% by mass. 【0029】 The content ratio of the radically polymerizable monomer contained in the above liquid B is not particularly limited, but is preferably 99.9% by mass or less based on 100% by mass of the total amount of the liquid B excluding inorganic particles. More preferably, it is 90% by mass or less, still more preferably 80% by mass or less, and particularly preferably 70% by mass or less. In the present specification, when the liquid B does not contain inorganic particles, the total amount of the liquid B excluding inorganic particles is the total amount of the liquid B. Further, based on 100% by mass of the total amount of the liquid B containing inorganic particles, the content ratio of the radically polymerizable monomer contained in the above liquid B is preferably 40% by mass or less. More preferably, it is 30% by mass or less, still more preferably 20% by mass or less, and particularly preferably 15% by mass or less. 【0030】The content of radical polymerizable monomers contained in the above-mentioned Solution A and / or Solution B is not particularly limited, but is preferably 10 to 99.9% by mass relative to 100% by mass of the total amount of Solution A and Solution B excluding inorganic particles. More preferably 15 to 90% by mass, even more preferably 20 to 80% by mass, and particularly preferably 25 to 70% by mass. Furthermore, the content of radical polymerizable monomers contained in the above-mentioned Solution A and / or Solution B relative to 100% by mass of the total amount of Solution A and Solution B including inorganic particles is preferably 0.4 to 40% by mass. More preferably 0.6 to 30% by mass, even more preferably 0.8 to 20% by mass, and particularly preferably 1 to 15% by mass. 【0031】 The above-mentioned liquid A and / or liquid B contain inorganic particles with a thermal conductivity of 2 W / m·K or higher. The content ratio of the inorganic particles with a thermal conductivity of 2 W / m·K or higher is not particularly limited, but it is preferably 60 to 98% by mass per 100% by mass of the two-component resin composition (total amount of liquid A and liquid B). This results in a cured product with superior thermal conductivity. The content ratio of the inorganic particles with a thermal conductivity of 2 W / m·K or higher is more preferably 75 to 97% by mass, even more preferably 80 to 96% by mass, and particularly preferably 85 to 95% by mass. When each of the above-mentioned liquid A and liquid B contains inorganic particles with a thermal conductivity of 2 W / m·K or higher, the content ratio of the inorganic particles with a thermal conductivity of 2 W / m·K or higher is calculated from the total amount of inorganic particles with a thermal conductivity of 2 W / m·K or higher contained in liquid A and inorganic particles with a thermal conductivity of 2 W / m·K or higher contained in liquid B. 【0032】 The content of the inorganic particles is preferably 100 to 10,000% by mass, relative to 100% by mass of the total amount of the (meth)acrylic polymer and radical polymerizable monomer in the two-component resin composition. More preferably, it is 150 to 8,000% by mass, even more preferably 200 to 6,000% by mass, and particularly preferably 300 to 4,000% by mass. 【0033】The above-mentioned liquid A and / or liquid B preferably contain a (meth)acrylic polymer, as described later. The content of the (meth)acrylic polymer in the above-mentioned two-component resin composition is not particularly limited, but the content of the (meth)acrylic polymer is preferably 0 to 60% by mass per 100% by mass of the two-component resin composition (total amount of liquid A and liquid B excluding inorganic particles). More preferably it is 5 to 40% by mass, and even more preferably 10 to 30% by mass. 【0034】 The content of the (meth)acrylic polymer is preferably 0 to 25% by mass per 100% by mass of the two-component resin composition containing inorganic particles (total amount of liquid A and liquid B). More preferably, it is 0.1 to 15% by mass, and even more preferably 0.3 to 10% by mass. 【0035】 Furthermore, if each of the above-mentioned liquids A and B contains a (meth)acrylic polymer, the proportion of the (meth)acrylic polymer is calculated from the total amount of the (meth)acrylic polymer contained in liquid A and the (meth)acrylic polymer contained in liquid B. 【0036】 Furthermore, the content of the (meth)acrylic polymer in the above two-component resin composition is preferably 0 to 150% by mass, relative to 100% by mass of the radical polymerizable monomer. More preferably, it is 10 to 120% by mass, and even more preferably 15 to 100% by mass. 【0037】 The above-mentioned liquid A and / or liquid B preferably contain a plasticizer, as described later. The content of the plasticizer is not particularly limited, but it is preferably 10 to 80% by mass per 100% by mass of the two-component resin composition excluding the inorganic particles (total amount of liquid A and liquid B excluding the inorganic particles). More preferably it is 15 to 70% by mass, and even more preferably 20 to 60% by mass. Furthermore, the content of the plasticizer is preferably 0.1 to 30% by mass per 100% by mass of the two-component resin composition containing the inorganic particles (total amount of liquid A and liquid B). More preferably it is 1 to 25% by mass, and even more preferably 0.6 to 20% by mass. 【0038】The content of the plasticizer is preferably 50 to 1000% by mass, relative to 100% by mass of the (meth)acrylic polymer in the two-component resin composition. More preferably, it is 80 to 900% by mass, and even more preferably, 100 to 800% by mass. 【0039】 The content of the plasticizer is preferably 20 to 500% by mass, based on 100% by mass of the radical polymerizable monomer. More preferably, it is 30 to 300% by mass, and even more preferably 40 to 200% by mass. 【0040】 The above-mentioned liquid A and / or liquid B may contain other additives as described later. The content of other additives in the above-mentioned two-component resin composition is not particularly limited, but it is preferable that the content of other additives is 0 to 30% by mass per 100% by mass of the two-component resin composition excluding inorganic particles (total amount of liquid A and liquid B excluding inorganic particles). More preferably, it is 0 to 25% by mass, even more preferably 0 to 20% by mass, and particularly preferably 0 to 10% by mass. Furthermore, it is preferable that the content of other additives is 0 to 12% by mass per 100% by mass of the two-component resin composition containing inorganic particles (total amount of liquid A and liquid B). More preferably, it is 0 to 6% by mass, even more preferably 0 to 2% by mass, and particularly preferably 0 to 1% by mass. 【0041】 The essential and optional components included in the two-component resin composition of the present invention will be further described below. 【0042】<Solution A> Solution A contains a reaction accelerator, and the reaction accelerator is characterized by containing a metal compound. The reaction accelerator is an agent that reacts with the reaction accelerator in Solution B to generate radicals. For example, when Solution A and Solution B are mixed under normal temperature (25°C) and atmospheric pressure conditions, it reacts with the reaction accelerator in Solution B to generate radicals, thereby promoting the polymerization reaction of radical polymerizable monomers. The metal compound that is the reaction accelerator is not particularly limited as long as it reacts with the reaction accelerator to generate radicals, but for example, those containing transition metal elements such as cobalt, iron, manganese, copper, zinc, titanium, chromium, vanadium, zirconium, molybdenum, and nickel (transition metal compounds) are preferred. For example, Non-Patent Document 1 mentions V(acac) as a compound corresponding to the reaction accelerator. ３ Mn(acac) ３ ,Cu(hfacac) ２The following is described. Furthermore, Tables I and II on pages 123 to 129 of the Toyo Soda Research Report, Vol. 10, No. 2 (1966), describe that various metal compounds, including cobalt compounds, can generate radicals in the same scheme upon heating. From these descriptions, it is considered that when various metal compounds, not just the cobalt compound of the examples, are used as the metal species of the metal compound in the reaction accelerator, radicals can be generated through reaction with the reaction accelerator. Therefore, similar to the case where the cobalt compound of the examples is used as the reaction accelerator in the two-component resin composition of the present invention, it is considered that when metal compounds other than cobalt compounds are used, radicals can be generated through reaction with the reaction accelerator, and the same effects as in the examples of this application can be achieved. Among the above reaction accelerators, salts (complexes) of organic compounds having 4 to 20 carbon atoms and the above transition metal elements are preferred. Specific examples of the above metal compounds include metal soaps such as cobalt naphthenate, iron naphthenate, manganese naphthenate, copper naphthenate, zinc naphthenate, cobalt octoate, iron octoate, cobalt neodecanoate, copper neodecanoate, cobalt acetylacetonate, copper acetylacetonate, titanium acetylacetonate, manganese acetylacetonate, chromium acetylacetonate, iron acetylacetonate, vanadyl acetylacetonate, molybdenyl acetylacetonate, and nickel acetylacetonate. The metal elements in the above metal compounds are preferably cobalt, iron, and manganese, and more preferably cobalt. The above metal compounds are preferably cobalt naphthenate, cobalt octoate, cobalt neodecanoate, and cobalt acetylacetonate, and more preferably cobalt naphthenate and cobalt octoate. 【0043】The above reaction accelerator may contain compounds other than the above metal compounds. Other reaction accelerators other than the above metal compounds are not particularly limited, but examples include imidazole, 2-methylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1,2-dimethylimidazole, 2-ethyl-4-methylimidazole, 2-phenylimidazole, 2-phenyl-4-methylimidazole, 1-benzyl-2-methylimidazole, 1-benzyl-2-phenylimidazole, and 1-cyanoethyl-2-methylimidazole. Compounds having an imidazole skeleton such as 1-cyanoethyl-2-undecylimidazole, 1-cyanoethyl-2-ethyl-4-methylimidazole, 1-cyanoethyl-2-phenylimidazole, 1-aminomethyl-2-methylimidazole, and 1-(2-cyanoethyl)-2-phenylimidazole; aniline, N,N-dimethylaniline, N,N-diethylaniline, m-toluidine, p-toluidine, N-ethyl-m-toluidine, and N,N-dimethylaniline. Examples include compounds having an aniline skeleton such as -p-toluidine, N,N-bis(2-hydroxyethyl)-p-toluidine, N,N-bis(2-hydroxypropyl)-p-toluidine, and N,N-bis(hydroxyethyl)aniline; compounds having an alkanolamine skeleton such as p-tolyldiethanolamine, N-phenyl-N'-ethylethanolamine, N-phenyldiethanolamine, triethanolamine, and diethanolaniline; diethylenetriamine, 4-(N,N-dimethylamino)benzaldehyde, 4-[N,N-bis(2-hydroxyethyl)amino]benzaldehyde, 4-(N-methyl-N-hydroxyethylamino)benzaldehyde, pyridine, piperidine, and phenylimorpholine; and thiourea compounds such as ethylenethiourea, diethylthiourea, dibutylthiourea, tetramethylthiourea, N-acetylthiourea, N-benzoylthiourea, diphenylthiourea, and dicyclohexylthiourea. 【0044】Preferred reaction accelerators include compounds having an alkanolamine skeleton and thiourea compounds. More preferably, the compounds having an alkanolamine skeleton are compounds having an ethanolamine skeleton, and even more preferably p-tolyldiethanolamine and N-phenyldiethanolamine. The thiourea compounds are preferably dialkylthioureas, and more preferably dibutylthiourea. 【0045】 (Radical Polymerizable Monomer) It is preferable that the above-mentioned Solution A contains a radical polymerizable monomer. In the two-component resin composition of the present invention, it is sufficient that Solution A and / or Solution B contain a radical polymerizable monomer, and Solution B may contain a radical polymerizable monomer together with Solution A, or in place of Solution A. 【0046】 The above-mentioned radical polymerizable monomer is a monomer having at least one polymerizable unsaturated bond, and preferably a (meth)acrylate having a hydrocarbon group having 4 to 15 carbon atoms, which may have substituents. The two-component resin composition of the present invention can sufficiently promote acrylic polymerization, which is easily deactivated by oxygen during curing. The above-mentioned (meth)acrylate having a hydrocarbon group having 4 to 15 carbon atoms, which may have substituents, has a bulky structure, which can increase the flexibility of the cured resin composition. This makes it possible to improve the conformability of the heat dissipation material to the heat source and heat sink when used as a heat dissipation material. The inventors have found that by combining a (meth)acrylate having a hydrocarbon group having 4 to 15 carbon atoms, which may have substituents, as a radical polymerizable monomer with a metal compound as a reaction accelerator and a ketone compound as a reaction accelerator aid, it is possible to achieve both conformability to the heat source and heat sink and a high monomer conversion rate. 【0047】 The (meth)acrylate having a hydrocarbon group with 4 to 15 carbon atoms may have substituents, and the substituents are not particularly limited, but examples include hydroxyl groups, alkoxy groups, carboxyl groups, acyl groups, sulfonic acid groups, amino groups, phosphoric acid groups, ether groups, thiol groups, thioether groups, halogen groups, etc. 【0048】In the (meth)acrylate having a hydrocarbon group having 4 to 15 carbon atoms, which may have the above substituents, the number of carbon atoms in the hydrocarbon group may be 4 to 15, but the number of carbon atoms in the hydrocarbon group includes the number of carbon atoms of the substituents. Preferably, the number of carbon atoms in the hydrocarbon group is 4 to 12, more preferably 4 to 10, and particularly preferably 4 to 8. 【0049】 Examples of hydrocarbon groups in the above (meth)acrylate include alkyl groups, alkenyl groups, alkynyl groups, and aryl groups. Preferably, the hydrocarbon group is unsubstituted. 【0050】 Examples of alkyl groups having 4 to 15 carbon atoms include n-butyl group, n-pentyl group (amyl group), n-hexyl group, n-heptyl group, n-octyl group, n-nonyl group, n-decyl group, n-undecyl group, n-dodecyl group, n-tridecyl group, n-tetradecyl group, n-pentadecyl group, sec-butyl group, i-butyl group, t-butyl group, 1-methylbutyl group, 1-ethylpropyl group, 2-methylbutyl group, i-amyl group, neopentyl group, 1,2-dimethylpropyl group, 1,1-dimethylpropyl group, t-amyl group, 1,3-dimethylbutyl group, 3,3-dimethylbutyl group, 2-ethylbutyl group, and 2-ethyl-2-methylpropyl group. Examples include aliphatic alkyl groups such as 1-methylheptyl group, 2-ethylhexyl group, 1,5-dimethylhexyl group, t-octyl group, 2,6-dimethyloctyl group, 2-butyloctyl group, branched nonyl group, decyl group, undecyl group, dodecyl group, tridecyl group, tetradecyl group, and pentadecyl group; and alicyclic alkyl groups such as cyclopropylmethyl group, cyclobutyl group, cyclobutylmethyl group, cyclopentyl group, cyclohexyl group, cyclohexylmethyl group, cycloheptyl group, cyclooctyl group, cyclohexylpropyl group, cyclododecyl group, norbornyl group (C7), adamantyl group (C10), and cyclopentylethyl group. 【0051】Examples of alkenyl groups having 4 to 15 carbon atoms include 1-butenyl group, 2-butenyl group, pentenyl group, hexenyl group, heptenyl group, octenyl group, nonenyl group, decenyl group, dodecenyl group, tridecenyl group, tetradecenyl group, and pentadecenyl group. 【0052】 Examples of alkynyl groups having 4 to 15 carbon atoms include butynyl, pentynyl, hexynyl, heptynyl, octinyl, noninyl, desynyl, dodecynyl, tridecynyl, tetradecynyl, and pentadecynyl groups. Examples of aryl groups having 4 to 15 carbon atoms include phenyl, naphthyl, anthracenyl, benzyl, 1-phenylethyl, 2-phenylethyl, 3-phenylpropyl, and 4-phenylbutyl groups. 【0053】 The hydrocarbon group in the above (meth)acrylate is preferably an alkyl group, more preferably a linear or branched aliphatic alkyl group, even more preferably a dodecyl group, isodecyl group, nonyl group, isononyl group, octyl group, 1-methylheptyl group, 2-ethylhexyl group, or butyl group, and particularly preferably an octyl group, 1-methylheptyl group, or 2-ethylhexyl group. 【0054】The above (meth)acrylates having a hydrocarbon group with 4 to 15 carbon atoms include, specifically, n-butyl (meth)acrylate, n-pentyl (meth)acrylate, n-hexyl (meth)acrylate, n-heptyl (meth)acrylate, n-octyl (meth)acrylate, 2-octyl (meth)acrylate, n-nonyl (meth)acrylate, isononyl (meth)acrylate, n-decyl (meth)acrylate, isodecyl (meth)acrylate, and n-undecyl (meth)acrylate. Examples include acrylates, n-dodecyl (meth)acrylate, n-tridecyl (meth)acrylate, n-tetradecyl (meth)acrylate, n-pentadecyl (meth)acrylate, methylbutyl (meth)acrylate, dimethylpropyl (meth)acrylate, dimethylbutyl (meth)acrylate, ethylbutyl (meth)acrylate, methylpropyl (meth)acrylate, ethylhexyl (meth)acrylate, dimethylhexyl (meth)acrylate, and the like. Preferably, the compounds are n-dodecyl (meth)acrylate, isodecyl (meth)acrylate, n-nonyl (meth)acrylate, isononyl (meth)acrylate, n-octyl (meth)acrylate, 2-octyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, and n-butyl (meth)acrylate; more preferably, n-octyl (meth)acrylate, 2-octyl (meth)acrylate, and 2-ethylhexyl (meth)acrylate; and particularly preferably, n-octyl acrylate, 2-octyl acrylate (2OA), and 2-ethylhexyl acrylate (2EHA). 【0055】 The above radical polymerizable monomer preferably includes a polyfunctional monomer. Such monomers act as crosslinking agents in the resin composition, allowing the resin composition to cure more thoroughly. As the polyfunctional monomer, monomers having two or more polymerizable unsaturated bonds are preferred, and polyfunctional (meth)acrylates having two or more (meth)acrylate groups, polyfunctional allyl esters having two or more allyl groups, and polyfunctional allyl ethers having two or more allyl groups are more preferred. 【0056】Examples of the above polyfunctional (meth)acrylates include (poly)ethylene glycol di(meth)acrylate such as tetraethylene glycol di(meth)acrylate, (poly)propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, 1,6-hexanediol diacrylate (1,6-HXA), 1,6-hexanediol dimethacrylate, 1,4-butanediol di(meth)acrylate, and trimethylolpropane di(meth)acrylate. Examples include difunctional (meth)acrylates such as trimethylolpropane tri(meth)acrylate, pentaerythritol tri(meth)acrylate, and cyanurate compounds containing (meth)acrylate groups such as tris(2-acryloyloxyethyl) isocyanurate; pentaerythritol tetra(meth)acrylate, ethoxylated pentaerythritol tetra(meth)acrylate, dipentaerythritol penta(meth)acrylate, and dipentaerythritol hexa(meth)acrylate. 【0057】 Examples of the above-mentioned polyfunctional allyl esters include allyl group-containing cyanurate compounds such as triallyl isocyanurate and triallyl cyanurate; and aliphatic polyfunctional allyl esters such as diallyl oxalate, diallyl malonate, diallyl succinate, diallyl glutarate, diallyl adipate, diallyl pimelate, diallyl suberate, diallyl azelaate, diallyl sebacate, diallyl fumarate, diallyl maleate, triallyl citrate, diallyl tartrate, diallyl itaconate, diallyl citraconate, and triallyl trimellitate. 【0058】Examples of the above polyfunctional allyl ethers include diallyl ether, glycerin diallyl ether, glycerin triallyl ether, 1,4-butanediol diallyl ether, nonanediol diallyl ether, 1,4-cyclohexanedimethanol diallyl ether, triethylene glycol diallyl ether, trimethylolpropane diallyl ether, trimethylolpropane triallyl ether, ditrimethylolpropanetetraallyl ether, pentaerythritol diallyl ether, pentaerythritol triallyl ether, pentaerythritol tetraallyl ether, dipentaerythritol pentaallyl ether, dipentaerythritol hexaallyl ether, sorbitol diallyl ether, and 1,3-bis(allyloxy) Examples include damantane, 1,3,5-tris(allyloxy)adamantane, bisphenol S diallyl ether, bisphenol A diallyl ether, bisphenol A alkylene oxide diallyl ether, bisphenol F alkylene oxide diallyl ether, 2,5-diallylphenol allyl ether, novolacphenol allyl ether, allylated polyphenylene oxide, compounds in which the glycidyl group of epoxy resin is substituted with an allyl group, 1,1,2,2-tetraallyloxyethane, ethylene glycol diallyl ether, diethylene glycol diallyl ether, polyethylene glycol diallyl ether, propylene glycol diallyl ether, butylene glycol diallyl ether, hexanediol diallyl ether, and the like. 【0059】 Preferably, the monomer having two or more polymerizable unsaturated bonds is a polyfunctional (meth)acrylate or a polyfunctional allyl ester, more preferably 1,9-nonanediol di(meth)acrylate, 1,6-hexanediol diacrylate (1,6-HXA), 1,6-hexanediol dimethacrylate, 1,4-butanediol di(meth)acrylate, a (meth)acrylate group-containing cyanurate compound, or an allyl group-containing cyanurate compound, and even more preferably 1,6-hexanediol diacrylate (1,6-HXA), tris(2-acryloyloxyethyl) isocyanurate, or triallyl isocyanurate. 【0060】 The above-mentioned radical polymerizable monomer may include other radical polymerizable monomers other than (meth)acrylates having a hydrocarbon group having 4 to 15 carbon atoms, which may have substituents, and monomers having two or more polymerizable unsaturated bonds. Other radical polymerizable monomers are not particularly limited, but include alkyl (meth)acrylates having 1 to 3 carbon atoms such as methyl (meth)acrylate, ethyl (meth)acrylate, and propyl (meth)acrylate; vinyl group-containing monomers such as styrene, vinyltoluene, α-methylstyrene, and N-vinyl-2-pyrrolidone; and reactive light stabilizers such as 1,2,2,6,6-pentamethyl-4-piperidyl methacrylate and 2,2,6,6-tetramethyl-4-piperidyl methacrylate. 【0061】 The content of the (meth)acrylate having a hydrocarbon group having 4 to 15 carbon atoms, which may have the above substituents, is not particularly limited, but is preferably 40 to 100% by mass with respect to 100% by mass of the radical polymerizable monomer. More preferably it is 50 to 99.99% by mass, even more preferably 60 to 99.98% by mass, and particularly preferably 70 to 99.97% by mass. 【0062】 The content of the monomer having two or more polymerizable unsaturated bonds is not particularly limited, but is preferably 0.001 to 10% by mass with respect to 100% by mass of the radical polymerizable monomer. More preferably it is 0.002 to 8% by mass, even more preferably 0.005 to 6% by mass, and particularly preferably 0.01 to 4% by mass. 【0063】 The content of the above-mentioned other radical polymerizable monomers is not particularly limited, but is preferably 0 to 40% by mass relative to 100% by mass of the radical polymerizable monomer. More preferably 0 to 30% by mass, even more preferably 0 to 25% by mass, and particularly preferably 0 to 20% by mass. 【0064】(Inorganic particles with a thermal conductivity of 2 W / m·K or higher) It is preferable that the above-mentioned liquid A contains inorganic particles with a thermal conductivity of 2 W / m·K or higher. This can improve the thermal conductivity of the resin composition. In the two-component resin composition of the present invention, it is sufficient that liquid A and / or liquid B contain inorganic particles with a thermal conductivity of 2 W / m·K or higher, and liquid B may contain inorganic particles with a thermal conductivity of 2 W / m·K or higher together with liquid A, or in place of liquid A. 【0065】 The thermal conductivity is preferably 5 W / m·K or higher, more preferably 10 W / m·K or higher, even more preferably 15 W / m·K or higher, and particularly preferably 20 W / m·K or higher. The thermal conductivity is preferably 350 W / m·K or lower, more preferably 340 W / m·K or lower, and even more preferably 330 W / m·K or lower. The thermal conductivity of the inorganic particles is the value obtained when measured at a temperature of 25°C using a rapid thermal conductivity meter (model number: QTM-500) manufactured by Kyoto Electronics Manufacturing Co., Ltd. 【0066】The inorganic particles mentioned above are not particularly limited, but at least one selected from the group consisting of carbonate particles, oxide particles, hydroxide particles, silicate particles, nitride particles, sulfate particles, metal particles, and carbon black particles is preferred. Examples include alkali metal carbonate particles such as sodium carbonate particles, sodium bicarbonate particles, potassium carbonate particles, and potassium bicarbonate particles; alkaline earth metal carbonate particles such as magnesium carbonate particles, calcium carbonate particles, and barium carbonate particles; metal carbonate particles such as ammonium carbonate particles, ammonium bicarbonate particles, and ammonium carbonate salt particles; metal oxide particles such as zinc oxide particles, aluminum oxide particles, magnesium oxide particles, beryllium oxide particles, calcium oxide particles, zirconium oxide particles, aluminum oxide (alumina) particles, and titanium dioxide particles; metal hydroxide particles such as magnesium hydroxide particles and aluminum hydroxide particles; silicate particles such as calcium silicate particles, aluminum silicate particles, and silicon carbide particles; nitride particles such as silicon nitride particles, boron nitride particles, and aluminum nitride; metal sulfate particles such as calcium sulfate particles and barium sulfate particles; metal particles; and carbon black particles. These inorganic particles may be used individually or in combination of two or more types. Among these, aluminum oxide (alumina) particles, magnesium oxide particles, silicon nitride particles, boron nitride particles, and aluminum nitride particles are preferred, with aluminum oxide particles being even more preferred. 【0067】 From the viewpoint of preventing aggregation of the inorganic particles, the average particle diameter of the inorganic particles is preferably 0.3 μm or more. More preferably 0.5 μm or more, and even more preferably 1 μm or more. Furthermore, from the viewpoint of improving the dispersion stability of the inorganic particles, the average particle diameter is preferably 100 μm or less. More preferably 80 μm or less, and even more preferably 50 μm or less. Therefore, the average particle diameter of the inorganic particles is preferably 0.3 to 100 μm, more preferably 0.5 to 80 μm, and even more preferably 1 to 50 μm. Note that the average particle diameter of the inorganic particles refers to the volume-average particle diameter measured using a laser diffraction scattering particle size distribution analyzer [Beckman Coulter, part number: LS13320]. 【0068】(Plasticizer) The above liquid A preferably contains a plasticizer. This helps maintain the flexibility of the cured resin composition. Furthermore, the resin composition will have excellent processability even when no solvent is used. Examples of plasticizers include trimellitic acid ester plasticizers such as trialkyl trimellitic acids (number of carbon atoms in the alkyl group: 4 to 11), represented by tri-2-ethylhexyl trimellitate, tri-n-octyl trimellitate, triisononyl trimellitate, and tri-n-octyl-n-decyl trimellitate; dimethyl phthalate, diethyl phthalate, dibutyl phthalate, dihexyl phthalate, dioctyl phthalate, diisononyl phthalate, di-2-ethylhexyl phthalate, dibenzyl phthalate, Phthalate ester plasticizers such as diisodecylphthalate, ditridecylphthalate, and diundecylphthalate; adipate ester plasticizers such as di-n-butyl adipate, diisobutyl adipate, dibutoxyethyl adipate, di-n-octyl adipate, diisooctyl adipate, diisononyl adipate, bis-2-ethylhexyl adipate, and diisodecyl adipate; tributyl phosphate, tri(2-ethylhexyl) phosphate, trioctyl phosphate, and triphenyl phosphate. Phosphate ester plasticizers such as phosphate, diphenyl-2-ethylhexyl phosphate, and tricresyl phosphate; sebacate ester plasticizers such as dibutyl sebacate, dioctyl sebacate, and di-2-ethylhexyl sebacate; azelaic acid ester plasticizers such as dihexyl azelate and dioctyl azelate; citrate ester plasticizers such as triethyl citrate, acetyl triethyl citrate, and tri-n-butyl citrate; methylphthalyl ethyl glycolate and ethylphthalyl Glycolic acid ester plasticizers such as ethyl glycolate; pyrrolimetic acid ester plasticizers such as alkyl pyrrolimetic acid esters represented by 2-ethylhexyl pyrrolimetic acid; ricinoleic acid ester plasticizers such as methylacetyl ricinolate, butylacetyl ricinolate, and glycerol monoricinolate; maleic acid ester plasticizers such as di-n-butyl maleate; itaconic acid ester plasticizers such as monobutyl itaconate; oleic acid ester plasticizers such as butyl oleate;Examples of glycerin-based plasticizers include glycerin monoacetomolaurate, glycerin diacetomolaurate, glycerin monoacetomostearate, and glycerin diacetomooleate, but the present invention is not limited to these examples. These plasticizers may be used individually or in combination of two or more. Among these plasticizers, trimellitic acid ester plasticizers are preferred from the viewpoint of preventing vaporization of the plasticizer and improving its thermal stability over a long period of time. 【0069】 ((meth)acrylic polymer) The above liquid A preferably contains a (meth)acrylic polymer. Furthermore, it is more preferable that the above liquid A contains inorganic particles with a thermal conductivity of 2 W / m·K or more, and contains a (meth)acrylic polymer as a dispersant for the inorganic particles with a thermal conductivity of 2 W / m·K or more. 【0070】 (Meth)acrylic polymers have structural units derived from (meth)acrylic monomers. These structural units derived from (meth)acrylic monomers are units that have a structure in which the carbon-carbon double bond of the (meth)acrylic monomer is replaced by a carbon-carbon single bond. These structural units derived from (meth)acrylic monomers can be introduced into (meth)acrylic polymers by polymerizing the (meth)acrylic monomers. Examples of (meth)acrylic monomers include alkyl (meth)acrylates and hydroxyl group-containing (meth)acrylates, but the present invention is not limited to these examples. These (meth)acrylic monomers may be used individually or in combination of two or more types. 【0071】Examples of the alkyl (meth)acrylates mentioned above include alkyl (meth)acrylates having 1 to 18 carbon atoms in the alkyl group. Specifically, examples include methyl (meth)acrylate, ethyl (meth)acrylate, propyl (meth)acrylate, isopropyl (meth)acrylate, and the alkyl (meth)acrylates having 4 to 15 carbon atoms mentioned above. These alkyl (meth)acrylates may be used individually or in combination of two or more types. Among these alkyl (meth)acrylates, alkyl (meth)acrylates having 4 to 15 carbon atoms in the alkyl group are preferred from the viewpoint of increasing the flexibility of the cured product and improving its ability to follow the heat source and heat sink when the cured product is used as a heat dissipation material, and n-butyl (meth)acrylate, n-octyl (meth)acrylate, 1-methylheptyl (meth)acrylate, and 2-ethylhexyl (meth)acrylate are more preferred. 【0072】 The content of alkyl (meth)acrylate-derived structural units in the above (meth)acrylic polymer is not particularly limited, but from the viewpoint of improving the heat dissipation material's ability to follow the heat source and the heat dissipation material, it is preferably 50% by mass or more, more preferably 60% by mass or more, even more preferably 70% by mass or more, and still more preferably 80% by mass or more, based on 100% by mass of all structural units, with an upper limit of 100% by mass. Therefore, the content of alkyl (meth)acrylate in the (meth)acrylic monomer is preferably 50 to 100% by mass, more preferably 60 to 99% by mass, even more preferably 70 to 98% by mass, and particularly preferably 80 to 97% by mass. 【0073】Examples of hydroxyl group-containing (meth)acrylates include 2-hydroxyethyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, and glycerin mono (meth)acrylate, all of which have 1 to 18 carbon atoms in the ester portion. However, the present invention is not limited to these examples. These hydroxyl group-containing (meth)acrylates may be used individually or in combination of two or more. Among these hydroxyl group-containing (meth)acrylates, 2-hydroxyethyl (meth)acrylate and glycerin mono (meth)acrylate are preferred from the viewpoint of reactivity, 2-hydroxyethyl (meth)acrylate is more preferred, and 2-hydroxyethyl acrylate is even more preferred. Furthermore, when inorganic particles described later are included in solution A, from the viewpoint of improving the dispersion stability of the inorganic particles in solution A, 2-hydroxyethyl (meth)acrylate and glycerin mono(meth)acrylate are preferred, 2-hydroxyethyl (meth)acrylate is more preferred, and 2-hydroxyethyl acrylate is even more preferred. 【0074】 The content of structural units derived from hydroxyl group-containing (meth)acrylate in the above (meth)acrylic polymer is preferably 0% by mass or more, more preferably 0.3% by mass or more, even more preferably 0.5% by mass or more, and even more preferably 1% by mass or more, based on 100% by mass of all structural units, from the viewpoint of improving the dispersion stability of the resin composition and lowering the viscosity of the resin composition. From the viewpoint of lowering the viscosity of the (meth)acrylic polymer and improving the compatibility between the (meth)acrylic monomer and the radical polymerizable monomer, it is preferably 30% by mass or less, more preferably 25% by mass or less, and even more preferably 20% by mass or less. Therefore, the content of hydroxyl group-containing (meth)acrylate in the (meth)acrylic monomer is preferably 0 to 30% by mass, more preferably 0.3 to 30% by mass, even more preferably 0.5 to 20% by mass, and even more preferably 1 to 20% by mass, based on 100% by mass of all structural units. 【0075】The above-mentioned (meth)acrylic polymer may have structural units derived from other monomers other than those described above, as long as the objectives of the present invention are not hindered. Examples of other monomers include cycloalkyl (meth)acrylates such as cyclopropyl (meth)acrylate, cyclobutyl (meth)acrylate, cyclopentyl (meth)acrylate, cyclohexyl (meth)acrylate, and isobornyl (meth)acrylate; carbon-carbon double bond-containing monomers having a carboxyl group such as (meth)acrylic acid; carbon-carbon double bond-containing monomers having a silane group; carbon-carbon double bond-containing monomers having a nitrogen atom; carbon-carbon double bond-containing monomers having an oxo group; carbon-carbon double bond-containing monomers having a fluorine atom; carbon-carbon double bond-containing monomers having an epoxy group; carbon-carbon double bond-containing monomers having an aralkyl group; and aromatic monomers having a carbon-carbon double bond such as styrene. 【0076】 The content of structural units derived from other monomers in the above (meth)acrylic polymer is not particularly limited, but is preferably 0 to 10% by mass, more preferably 0 to 5% by mass, even more preferably 0 to 1% by mass, even more preferably 0 to 0.1% by mass, and most preferably 0% by mass, based on 100% by mass of all structural units. 【0077】 (Meth)acrylic polymers can be prepared by polymerizing monomer components containing (meth)acrylic monomers using polymerization methods such as bulk polymerization, solution polymerization, or emulsion polymerization. Among these polymerization methods, bulk polymerization is preferred from the viewpoint of ensuring that the solvent and dispersion medium are not included in the (meth)acrylic polymer. 【0078】 The glass transition temperature of the (meth)acrylic polymer is preferably -20°C or lower, more preferably -30°C or lower, from the viewpoint of increasing the flexibility of the cured product and improving its conformability to the heat-generating element and heat-dissipating element when the cured product is used as a heat-dissipating material. The lower limit of the glass transition temperature of the (meth)acrylic polymer is not particularly limited, but is preferably -200°C or higher, more preferably -180°C or higher. 【0079】 In the present invention, the glass transition temperature of the polymer is determined based on the Fox equation represented by the following formula (1) using the glass transition temperature of the homopolymer of the monomer used as the raw material of the polymer: 1 / Tg = Σ (W ｍ / Tg ｍ ) / 100 (1) [In the formula, W ｍ represents the content (%) of monomer m in the monomer component constituting the polymer, and Tg ｍ represents the glass transition temperature (absolute temperature: K) of the homopolymer of monomer m]. 【0080】 The glass transition temperature of the polymer (non-volatile content) is determined from the glass transition temperature (Tg) (absolute temperature: K) of the homopolymer composed of the monomer contained in the monomer component used as the raw material of the polymer and the mass fraction of the monomer, using the following formula (2): 1 / Tg = W １ / Tg １ + W ２ / Tg ２ + W ３ / Tg ３ + ······ + W ｎ / Tg ｎ (2) [In the formula, Tg represents the glass transition temperature (K) of the polymer to be determined, W １ , W ２ , W ３ ···· W ｎ are the mass fractions of the respective monomers, and Tg １ , Tg ２ , Tg ３ ···· Tg ｎ represent the glass transition temperatures (K) of the homopolymers composed of the monomers corresponding to the mass fractions of the respective monomers]. It can be determined based on the Fox equation represented by the formula (2). 【0081】 In this specification, the glass transition temperature of the polymer means the glass transition temperature determined based on formula (2). For monomers with unknown glass transition temperatures, the glass transition temperature is determined using only the monomers with known glass transition temperatures. Considering the glass transition temperature of the polymer, the composition of the radically polymerizable monomer used as the raw material of the polymer can be determined. 【0082】 The glass transition temperatures of homopolymers are, for example, 105°C for methyl methacrylate homopolymer, 8°C for methyl acrylate homopolymer, -20°C for ethyl acrylate homopolymer, -56°C for n-butyl acrylate homopolymer, 20°C for n-butyl methacrylate homopolymer, -80°C for n-octyl acrylate homopolymer, -58°C for isooctyl acrylate homopolymer, -70°C for 2-ethylhexyl acrylate homopolymer, and cyclo The optimal temperature for homopolymers is 16°C for hexyl acrylate, 83°C for cyclohexyl methacrylate, -15°C for 2-hydroxyethyl acrylate, 55°C for 2-hydroxyethyl methacrylate, -40°C for 4-hydroxybutyl acrylate, 106°C for acrylic acid, 105°C for methacrylic acid, 80°C for styrene, and 170°C for N-vinylpyrrolidone. 【0083】 The glass transition temperature of a (meth)acrylic polymer refers to the temperature determined based on the glass transition temperature measurement method of the polymer described above. The glass transition temperature of a (meth)acrylic polymer can be easily adjusted by appropriately adjusting the type and amount of (meth)acrylic monomer, which is the raw material of the (meth)acrylic polymer. 【0084】 The weight-average molecular weight of the (meth)acrylic polymer is not particularly limited, but is preferably 10,000 to 1,500,000, more preferably 20,000 to 1,000,000, even more preferably 30,000 to 500,000, and even more preferably 40,000 to 300,000. In one embodiment, the weight-average molecular weight of the (meth)acrylic polymer may be 100,000 or more, or 150,000 or more. In this specification, the weight-average molecular weight of the (meth)acrylic polymer is a converted value using standard polystyrene [Tosoh Corporation], with a gel permeation chromatography (GPC) measuring device manufactured by Tosoh Corporation, model number: HLC-8220GPC, and a separation column manufactured by Tosoh Corporation, model number: TSKgel Super HZM-M. 【0085】 <Solution B> (Reaction Accelerator) Solution B contains a reaction accelerator, characterized in that the reaction accelerator contains a ketone compound. The reaction accelerator is an agent that reacts with the reaction accelerator of Solution A to generate radicals. For example, when Solution A and Solution B are mixed under normal temperature (25°C) and atmospheric pressure conditions, the reaction accelerator reacts with the reaction accelerator of Solution A to generate radicals, thereby accelerating the polymerization reaction of radical polymerizable monomers. The reaction accelerator contains a ketone compound, and the ketone compound is preferably a dicarbonyl compound, and more preferably a β-dicarbonyl compound. In this specification, the ketone compound is a compound having a structure (ketone structure) in which a carbonyl group (C=O group) and two hydrocarbon groups are bonded. Examples of hydrocarbon groups include alkyl groups, aryl groups, groups formed by bonding these groups, and divalent hydrocarbon groups obtained by abstracting hydrogen from these groups. The divalent hydrocarbon group may further be bonded to a part other than the ketone structure. That is, the ketone compound may have a ketone structure as well as a part other than the ketone structure. Among ketone compounds, dicarbonyl compounds are compounds that have a ketone structure and another carbonyl group. The other carbonyl group can be an aldehyde group, a carboxylic acid (salt) group, an ester group, an amide group, or a group in the other ketone structure. β-dicarbonyl compounds have a structure in which two carbonyl groups are adjacent with one carbon atom in between, as shown in formula (3) below; 【0086】 【0087】 (In the formula, R １ , R ２ , R ３ R represents a monovalent or divalent group, which may be identical or different. １ and R ２ and / or R ２ and R ３The compounds are preferably represented by ( ). The monovalent or divalent groups include hydrocarbon groups which may have heteroatoms, amino groups, carboxyl groups, thiol groups, cyano groups, halogen groups, etc. The number of carbon atoms in the hydrocarbon group which may have heteroatoms is not particularly limited, but is preferably 1 to 20. More preferably 1 to 15, even more preferably 1 to 10, even more preferably 1 to 8, and particularly preferably 1 to 6. 【0088】 The above hydrocarbon group may have a heteroatom, for example, a substituent having a heteroatom such as an amino group, carboxyl group, thiol group, cyano group, halogen group, hydroxyl group, ether group, ester group, or thioether group. 【0089】 Examples of the hydrocarbon groups mentioned above include alkyl groups, alkenyl groups, alkynyl groups, aryl groups, and groups obtained by abstracting hydrogen from heterocyclic compounds. 【0090】 Examples of the alkyl groups mentioned above include the C4-C15 alkyl groups, aliphatic alkyl groups such as methyl, ethyl, propyl, isopropyl, hexadecyl, heptadecyl, stearyl, and eicosyl groups, and alicyclic alkyl groups such as cyclopropyl groups. 【0091】 Examples of the above-mentioned alkenyl groups include the C4-C15 alkenyl group, vinyl group, allyl group, hexadecenyl group, heptadecenyl group, octadecinyl group, and icosinyl group. 【0092】 Examples of the alkynyl group and aryl group mentioned above include the alkynyl group having 4 to 15 carbon atoms and the aryl group having 4 to 15 carbon atoms mentioned above. 【0093】Examples of the above heterocyclic compounds include imidazole, imidazolidine, pyrazole, benzimidazole, pyridine, pyrimidine, pyrazine, pyridazine, pyrrole, pyrroline, thiophene, furan, benzothiophene, benzofuran, indole, dibenzothiophene, dibenzofuran, carbazole, thiazole, benzothiazole, oxazole, benzoxazole, quinoline, isoquinoline, quinoxaline, benzothiadiazole, phenantholidine, oxadiazole, thiadiazole, and the like. 【0094】 The above R １ Preferably, the group is an alkyl group having 1 to 3 carbon atoms, an alkoxy group having 1 to 3 carbon atoms, or a phenyl group. More preferably, it is a methyl group, an ethyl group, a methoxy group, an ethoxy group, or a phenyl group, and even more preferably, a methyl group. The above R ２ , R ３ Preferably, an alkyl group having 1 to 3 carbon atoms, an alkoxy group having 1 to 3 carbon atoms, a phenyl group, R ２ and R ３ This form involves bonding to form a ring structure with 3 to 8 carbon atoms. More preferably R ２ and R ３ This form involves bonding to form a lactone structure having 3 to 8 carbon atoms. Preferably, the lactone structure has 3 to 7 carbon atoms, more preferably 3 to 6, and even more preferably 3 to 5 carbon atoms. 【0095】Specifically, the above dicarbonyl compounds include α-acetyl-γ-butyrolactone, cyclopentanone-2-carboxylate ethyl, cyclopentanone-2-carboxylate methyl, acetylacetone, methyl acetoacetate, acetate acetate, acetoacetate-n-butyl, acetoacetate-iso-propyl, acetoacetate allyl ether, 1,1-cyclopropanedicarboxylate diethyl, dimethyl malonate, diethyl malonate, dipropyl malonate, diisopropyl malonate, tert-butylethyl malonate, methyl malonate dimethyl, ethyl malonate diethyl, 1,3-diphenyl-1,3-propanedione, acetoacetamide, and N-methyl Examples include acetoacetamide, N,N-dimethylacetacetamide, N,N-diethylacetacetamide, N,N-diisopropylacetacetamide, N,N-dibutylacetacetamide, N,N-dihydroxyethylacetacetamide, N-methylacetacetanilide, 1-acetoacetylpyrrolidine, 1-acetoacetylindole, 1-acetoacetylimidazole, 1-acetoacetylpyrrole, 1-acetoacetylimidazoline, 1-acetoacetylpyrroline, 1-acetoacetylimidazolidin, 1-acetoacetylpiperidine, 1-acetoacetylpiperazine, N-pyrodininoacetacetamide, etc. Preferably, α-acetyl-γ-butyrolactone, dimethyl malonate, diethyl malonate, cyclopentanone-2-carboxylate ethyl, cyclopentanone-2-carboxylate methyl, 1,3-diphenyl-1,3-propanedione, and more preferably α-acetyl-γ-butyrolactone. 【0096】The above reaction accelerator may contain compounds other than the above ketone compounds, for example, it may contain a peroxide-based initiator. However, if the above solution B contains a radical polymerizable monomer, it is preferable that it does not contain a peroxide-based initiator. The above peroxide-based initiator is not particularly limited as long as it can initiate the polymerization reaction of the above radical polymerizable monomer, and examples include ketone peroxide polymerization initiators, hydroperoxide polymerization initiators, diacyl peroxide polymerization initiators, peroxyester polymerization initiators, peroxyketal polymerization initiators, dialkyl peroxide polymerization initiators, peroxydicarbonate polymerization initiators, etc. These polymerization initiators may be used individually or in combination of two or more types. 【0097】 Examples of the ketone peroxide-based polymerization initiators mentioned above include methyl ethyl ketone peroxide, cyclohexane peroxide, methylcyclohexane peroxide, methyl acetacetate peroxide, and acetylacetone peroxide. 【0098】 Examples of the above-mentioned hydroperoxide-based polymerization initiators include p-menthane hydroperoxide, diisopropylbenzene hydroperoxide, 1,1,3,3-tetramethylbutyl hydroperoxide, cumene hydroperoxide, tert-hexyl hydroperoxide, and tert-butyl hydroperoxide. Cumene hydroperoxide and tert-butyl hydroperoxide are preferred among these. 【0099】 Examples of the above-mentioned diacyl peroxide polymerization initiators include diisobutyl peroxide, di-3,5,5-trimethylhexanoyl peroxide, octanoyl peroxide, dilauroyl peroxide, distearoyl peroxide, disuccinate peroxide, m-toluyl peroxide, m-benzoyl peroxide, and benzoyl peroxide. Among these, m-benzoyl peroxide and benzoyl peroxide are preferred. 【0100】Examples of the above-mentioned peroxyester polymerization initiators include t-butyl peroxybenzoate, t-hexyl peroxypivalate, t-butyl peroxypivalate, 2,5-dimethyl-2,5-di(2-ethylhexanoylperoxy)hexane, 1,1,3,3-tetramethylbutyl peroxy-2-ethylhexanoate, t-hexyl peroxy-2-ethylhexanoate, t-butyl peroxy-2-ethylhexanoate, t-butyl peroxylaurate, t-butyl peroxy-3,5,5-trimethylhexanoate, t-hexyl peroxyisopropyl monocarbonate, t-butyl peroxyisopropyl monocarbonate, and t-butyl peroxy-2-ethylhexyl monocarbonate. Among these, t-butyl peroxybenzoate is preferred. Examples of the above-mentioned peroxyketal polymerization initiators include 1,1-di(t-hexylperoxy)cyclohexane, 1,1-di(t-butylperoxy)cyclohexane, n-butyl-4,4-di(t-butylperoxy)valerate, and 2,2-di(tert-butylperoxy)butane. 【0101】 Examples of the above-mentioned dialkylperoxide polymerization initiators include dicumyl peroxide, α,α'-di(tert-butylperoxy)diisopropylbenzene, tert-butylcumyl peroxide, di-tert-butyl peroxide, di-t-hexyl peroxide, 2,5-dimethyl-2,5-di(tert-butylperoxy)hexane, and 2,5-dimethyl-2,5-bis(tert-butylperoxy)hexane. Examples of the above-mentioned peroxydicarbonate polymerization initiators include diisopropyl peroxydicarbonate and di-n-propyl peroxydicarbonate. 【0102】(Radical Polymerizable Monomers) The above-mentioned Solution B preferably contains radical polymerizable monomers. Specific examples and preferred examples of the above-mentioned radical polymerizable monomers are as described in the description of Solution A. The form in which Solutions A and B contain radical polymerizable monomers is one of the preferred embodiments of the present invention. When Solutions A and B contain radical polymerizable monomers, the radical polymerizable monomers contained in each may be the same or different. 【0103】 (Inorganic particles with a thermal conductivity of 2 W / m·K or higher) Liquid B preferably contains inorganic particles with a thermal conductivity of 2 W / m·K or higher. Specific examples and preferred examples of inorganic particles with a thermal conductivity of 2 W / m·K or higher are as described in the description of Liquid A. The form in which Liquid A and Liquid B contain inorganic particles with a thermal conductivity of 2 W / m·K or higher is one of the preferred embodiments of the present invention. When Liquid A and Liquid B contain inorganic particles with a thermal conductivity of 2 W / m·K or higher, the inorganic particles with a thermal conductivity of 2 W / m·K or higher contained in each may be the same or different. 【0104】 (Plasticizer) It is preferable that the above-mentioned liquid B contains a plasticizer. This helps maintain the flexibility of the cured resin composition. Furthermore, even when no solvent is used, the resin composition will have excellent processability. Specific examples and preferred examples of the above-mentioned plasticizer are as described in the description of liquid A. The form in which liquids A and B contain a plasticizer is one of the preferred embodiments of the present invention. When liquids A and B contain a plasticizer, the plasticizers contained in each may be the same or different. 【0105】 ((meth)acrylic polymer) It is preferable that the above-mentioned liquid B contains a (meth)acrylic polymer. This allows for more sufficient dispersion of inorganic particles, etc. Specific examples and preferred examples of the above-mentioned (meth)acrylic polymer are as described in the description of liquid A. The form in which liquids A and B contain a (meth)acrylic polymer is one of the preferred embodiments of the present invention. When liquids A and B contain a (meth)acrylic polymer, the (meth)acrylic polymers contained in each may be the same or different. 【0106】The above-mentioned Solution A and / or Solution B may each contain other additives, provided that the objectives of the present invention are not hindered. Examples of other additives include colorants such as pigments, leveling agents, ultraviolet absorbers, ultraviolet stabilizers, antioxidants, polymerization inhibitors, fillers, coupling agents, rust inhibitors, antibacterial agents, metal deactivators, wetting agents, defoaming agents, surfactants, reinforcing agents, lubricants, antifogging agents, corrosion inhibitors, pigment dispersants, flow regulators, peroxide decomposing agents, mold decolorizing agents, fluorescent whitening agents, organic flame retardants, inorganic flame retardants, anti-dripping agents, molten flow modifiers, antistatic agents, anti-algal agents, antifungal agents, flame retardants, slip agents, metal chelating agents, antiblocking agents, heat-resistant stabilizers, processing stabilizers, dispersants, thickeners, rheology control agents, foaming agents, anti-aging agents, preservatives, antistatic agents, silane coupling agents, antioxidants, film-forming aids, solvents, etc., but the present invention is not limited to these examples. These additives may be used individually or in combination of two or more types. 【0107】 Furthermore, if the above-mentioned liquid A and / or liquid B contain a radical polymerizable monomer, the content of the peroxide-based initiator in the above-mentioned liquid A and / or liquid B is preferably 1% by mass or less, and more preferably 0.1% by mass or less. It is even more preferable that the above-mentioned liquid A and / or liquid B do not contain a peroxide-based initiator. This improves the storage stability of the resin composition. Also, the content of the peroxide-based initiator in the above-mentioned liquid A and / or liquid B is preferably 1% by mass or less, and more preferably 0.1% by mass or less. It is even more preferable that the above-mentioned liquid A and / or liquid B do not contain a peroxide-based initiator. 【0108】The preparation methods for the above-mentioned liquids A and B are not particularly limited, but they can be prepared by mixing the essential and optional components, respectively, using means such as a batch mixer, tumbler, Henschel mixer, Banbury mixer, roll, kneader, single-screw extruder, or twin-screw extruder. The temperature when mixing the above components is not particularly limited and may be room temperature, higher than room temperature, or lower than room temperature. The atmosphere when mixing the above components is not particularly limited and may be air, but from the viewpoint of avoiding the influence of oxygen gas contained in the air, an inert gas such as nitrogen gas or argon gas may be used. 【0109】 [Two-component resin composition] The two-component resin composition of the present invention consists of liquid A and liquid B obtained as described above. The ratio of liquid A to liquid B is preferably adjusted so that the components contained in liquid A and liquid B are in the preferred ratio described above. 【0110】 Furthermore, the amount of liquid A excluding inorganic particles per 100 parts by mass of liquid B is preferably about 3 to 300 parts by mass, taking into consideration the convenience when mixing liquid A and liquid B. In the present invention, when liquid A and liquid B are mixed, they react rapidly even at room temperature, so it is not necessary to produce cured products such as heat dissipation materials by heating as in the conventional method. For example, cured products such as heat dissipation materials can be efficiently produced on a factory production line. 【0111】When mixing liquid A and liquid B, a stirring device can be used. Examples of stirring devices include batch mixers, tumblers, Henschel mixers, Banbury mixers, rolls, kneaders, single-screw extruders, and twin-screw extruders, but the present invention is not limited to these examples. The temperature when mixing liquid A and liquid B is not particularly limited, but from the viewpoint of efficiently producing cured products such as heat dissipation materials without using heating devices, cooling devices, etc., it is preferably room temperature. Here, room temperature varies depending on the region and cannot be determined in general terms, but it is usually 0 to 40°C, preferably 0 to 35°C, and more preferably 1 to 30°C. The temperature when mixing liquid A and liquid B may be higher or lower than room temperature as needed, but from the viewpoint of efficiently producing cured products such as heat dissipation materials, it is preferably about 0 to 50°C. The atmosphere when mixing liquid A and liquid B is not particularly limited and may be air, but from the viewpoint of avoiding the influence of oxygen gas contained in the air, it may be an inert gas such as nitrogen gas or argon gas. 【0112】 When liquid A and liquid B are mixed, the resulting mixture begins to harden, and hardening is usually completed within three days at room temperature. The endpoint of the hardening of the mixture can be defined as the tack-free time of the surface of the hardened product obtained by the mixture. Tack-free time refers to the time from the moment liquid A and liquid B are mixed until, when the surface of the hardened product formed by the hardening of the mixture is touched with a human finger that has had oil and grease removed with ethanol or the like, no components of the hardened product adhere to the finger. By mixing liquid A and liquid B contained in the two-component resin composition of the present invention in this manner, liquid A and liquid B react to obtain a hardened product such as a heat dissipation material. 【0113】The two-component resin composition of the present invention can be suitably used as a resin for heat dissipation materials, adhesives, and the like. The present invention also relates to a heat dissipation material obtained by curing the above two-component resin composition. There are no particular limitations on the shape of the heat dissipation material obtained using the two-component resin composition of the present invention. Examples of the shape of the heat dissipation material include sheet-like (film-like), tape-like, cylindrical, and desired molded shape, but the present invention is not limited to such shapes. A heat dissipation material having a sheet-like or tape-like shape can be manufactured by, for example, mixing liquid A and liquid B, forming a film on a substrate with the resulting mixture using, for example, a brush, bar coater, applicator, air spray, airless spray, roll coater, or flow coater, and curing the formed film; or by mixing liquid A and liquid B, extruding the resulting mixture through a T-die from an extrusion molding machine to form a sheet or film, and curing it. A cylindrical heat dissipation material can be manufactured, for example, by mixing liquid A and liquid B, extruding the resulting mixture through a spider in an extrusion molding machine to form a cylindrical heat dissipation material, and then curing it. A heat dissipation material having a desired molded shape can be manufactured, for example, by mixing liquid A and liquid B, and molding the resulting mixture in an injection molding machine or the like to achieve the desired shape. 【0114】 The thermal conductivity of the heat dissipation material can be adjusted, for example, by adjusting the amount of inorganic particles used as a thermally conductive material. The thermal conductivity of the heat dissipation material is not particularly limited, but from the viewpoint of improving the heat dissipation performance of the heat dissipation material, it is preferably 0.5 W / m·K or higher, and more preferably 1 W / m·K or higher. The thermal conductivity of the heat dissipation material is the value obtained when measured at a temperature of 25°C using a rapid thermal conductivity meter (model number: QTM-500) manufactured by Kyoto Electronics Manufacturing Co., Ltd. 【0115】 The present invention will be described in more detail below with reference to examples, but the present invention is not limited to these examples. Unless otherwise specified, "parts" means "parts by weight" and "%" means "mass%". 【0116】Example 1 [Preparation of Solution A] 14 g of 2-ethylhexyl acrylate / 2-hydroxyethyl acrylate copolymer [2-ethylhexyl acrylate / 2-hydroxyethyl acrylate (mass ratio) = 95 / 5, weight-average molecular weight: 200,000, glass transition temperature: approximately -68°C] as a (meth)acrylic polymer, 50 g of 2-ethylhexyl acrylate, 33.9 g of trimellitic acid ester plasticizer [manufactured by ADEKA Corporation, product name: ADEKA Sizer C-880NB], 0.1 g of 1,6-hexanediol diacrylate [manufactured by Tokyo Chemical Industry Co., Ltd.] as a crosslinking agent, and 2.0 g of cobalt octoate reagent [containing 8% Co, manufactured by Nippon Chemical Industrial Co., Ltd.] were mixed in air at room temperature (approximately 25°C) until a uniform composition was obtained. Then, 900 g of alumina powder (average particle size: 10 μm) was added and mixed until a uniform composition was obtained, and the resulting mixture was designated as Solution A. 【0117】 [Preparation of Solution B] 14 g of 2-ethylhexyl acrylate / 2-hydroxyethyl acrylate copolymer [2-ethylhexyl acrylate / 2-hydroxyethyl acrylate (mass ratio) = 95 / 5, weight-average molecular weight: 200,000, glass transition temperature: approximately -68°C] as a (meth)acrylic polymer, 50 g of 2-ethylhexyl acrylate, 30.9 g of trimellitic acid ester plasticizer [manufactured by ADEKA Corporation, product name: ADEKA Sizer C-880], 0.1 g of 1,6-hexanediol diacrylate [manufactured by Tokyo Chemical Industry Co., Ltd.] as a crosslinking agent, and 5 g of α-acetyl-γ-butyrolactone [manufactured by Tokyo Chemical Industry Co., Ltd.] as a promoter were mixed in air at room temperature (approximately 25°C) until a uniform composition was obtained. Then, 900 g of alumina powder (average particle size: 10 μm) was added and mixed until a uniform composition was obtained to obtain the mixture known as Solution B. Next, using the solutions A and B obtained above, the physical properties of each solution and the physical properties of the two-component curable composition for heat dissipation materials (two-component curable resin composition for heat dissipation materials) after mixing the solutions were investigated. The results are shown in Table 1. 【0118】 [Storage Stability of Solution A] Solution A was stored in an oven at 60°C for one month, and the liquid properties of Solution A after storage were evaluated based on the following evaluation criteria. 【0119】(Evaluation Criteria) ○: Liquid A is fluid after storage. ×: Liquid A is not fluid after storage and has solidified. 【0120】 [Storage Stability of Solution B] Solution B was stored in an oven at 60°C for one month, and the liquid properties of Solution B after storage were evaluated based on the following evaluation criteria. 【0121】 (Evaluation Criteria) ○: Liquid B is fluid after storage. ×: Liquid B is not fluid after storage and has solidified. 【0122】 [Curing properties of the air-contact area when mixing unstorage liquids A and B] Liquids A and B, immediately after preparation, were added and mixed in a weight ratio of liquid A:liquid B = 1:1. The mixed liquid was poured into a mold and left to stand for 24 hours with one side in contact with the air. The resulting heat dissipation material was then measured for hardness within 1 second using a hardness tester (OO type durometer (rubber hardness tester, manufactured by Teclock)) in accordance with ASTM D 2240. The sample shape was 100 mm wide x 10 mm deep x 6 mm thick, and the measurement was performed at room temperature. The obtained hardness was averaged from values ​​measured at five locations, and the storage stability was evaluated based on the following evaluation criteria. 【0123】 (Evaluation Criteria) ○: The hardness difference between the non-air-contact area and the air-contact area is less than 15. △: The hardness difference between the non-air-contact area and the air-contact area is 15 or more, but the air-contact area is not liquid (the material does not adhere to the surface when touched with a glass rod). ×: The air-contact area is liquid. 【0124】[Curing properties after storage (air-free area)] After storing solution A and solution B in a 60°C oven for one month, they were added and mixed in a weight ratio of solution A:solution B = 1:1. The mixed solution was poured into a mold and left to stand for 24 hours in an air-free state. Then, 1 g was cut out from the resulting heat dissipation material, 9 g of ethyl acetate and 0.03 g of tridecane as an internal standard were added, and the solution was heated at 50°C for 2 hours while stirring. The solution was measured by gas chromatography (GC) to determine the conversion rate of monofunctional monomers, and the monomer conversion rate was evaluated based on the following evaluation criteria. The monomer conversion rate was measured using a Shimadzu GC-2014 gas chromatography (GC) measuring device under the following conditions. • Heating conditions: Hold at 40°C for 5 min ⇒ Heat from 40°C to 230°C at a rate of 15°C / min ⇒ Hold at 230°C for 10 min • Column: G-100 (Length: 20.0 m, Film thickness: 1.00 μm) • Carrier gas: N ２ • Carrier gas flow rate: 20.0 mL / min • Vaporization chamber temperature: 230°C • Detector: FID • Detector temperature: 230°C 【0125】 (Evaluation Criteria) ○: The conversion rate of monofunctional monomers is 90% or higher. ×: The conversion rate of monofunctional monomers is less than 90%. 【0126】 [Curing after storage (air contact area)] After storing liquid A and liquid B in a 60°C oven for one month, they were added and mixed in a weight ratio of liquid A:liquid B = 1:1. The mixed liquid was left to stand for 24 hours with one side in contact with air, and the resulting heat dissipation material was measured for hardness within 1 second using a hardness tester (OO type durometer (rubber hardness tester, manufactured by Teclock)) in accordance with ASTM D 2240. The sample shape was 100 mm wide x 10 mm deep x 6 mm thick, and the measurement was performed at room temperature. The obtained hardness was averaged from values ​​measured at five locations, and the storage stability was evaluated based on the following evaluation criteria. 【0127】 (Evaluation Criteria) ○: The hardness difference between the non-air-contact area and the air-contact area is less than 15. △: The hardness difference between the non-air-contact area and the air-contact area is 15 or more, but the air-contact area is not liquid (the material does not adhere to the surface when touched with a glass rod). ×: The air-contact area is liquid. 【0128】Example 2 [Preparation of Solution A] 14 g of 2-ethylhexyl acrylate / 2-hydroxyethyl acrylate copolymer [2-ethylhexyl acrylate / 2-hydroxyethyl acrylate (mass ratio) = 95 / 5, weight-average molecular weight: 200,000, glass transition temperature: approximately -68°C] as a (meth)acrylic polymer, 50 g of 2-ethylhexyl acrylate, 33.9 g of trimellitic acid ester plasticizer [manufactured by ADEKA Corporation, product name: ADEKA Sizer C-880NB], 0.1 g of 1,6-hexanediol diacrylate [manufactured by Tokyo Chemical Industry Co., Ltd.] as a crosslinking agent, and 2.0 g of cobalt naphthenate reagent [containing 8% Co, manufactured by Tokyo Chemical Industry Co., Ltd.] were mixed in air at room temperature (approximately 25°C) until a uniform composition was obtained. Then, 900 g of alumina powder (average particle size: 10 μm) was added and mixed until a uniform composition was obtained, and the resulting mixture was designated as Solution A. 【0129】 [Preparation of Solution B] 14 g of 2-ethylhexyl acrylate / 2-hydroxyethyl acrylate copolymer [2-ethylhexyl acrylate / 2-hydroxyethyl acrylate (mass ratio) = 95 / 5, weight-average molecular weight: 200,000, glass transition temperature: approximately -68°C] as a (meth)acrylic polymer, 50 g of 2-ethylhexyl acrylate, 30.9 g of trimellitic acid ester plasticizer [manufactured by ADEKA Corporation, product name: ADEKA Sizer C-880], 0.1 g of 1,6-hexanediol diacrylate [manufactured by Tokyo Chemical Industry Co., Ltd.] as a crosslinking agent, and 5 g of α-acetyl-γ-butyrolactone [manufactured by Tokyo Chemical Industry Co., Ltd.] as a promoter were mixed in air at room temperature (approximately 25°C) until a uniform composition was obtained. Then, 900 g of alumina powder (average particle size: 10 μm) was added and mixed until a uniform composition was obtained to obtain the mixture known as Solution B. Next, using the solutions A and B obtained above, the physical properties of each solution and the physical properties of the two-component curable composition for heat dissipation materials (two-component curable resin composition for heat dissipation materials) after mixing the solutions were investigated in the same manner as in Example 1. The results are shown in Table 1. 【0130】Example 3 [Preparation of Solution A] 14 g of 2-ethylhexyl acrylate / 2-hydroxyethyl acrylate copolymer [2-ethylhexyl acrylate / 2-hydroxyethyl acrylate (mass ratio) = 95 / 5, weight-average molecular weight: 200,000, glass transition temperature: approximately -68°C] as a (meth)acrylic polymer, 50 g of 2-octyl acrylate, 33.9 g of trimellitic acid ester plasticizer [manufactured by ADEKA Corporation, product name: ADEKA Sizer C-880NB], 0.1 g of 1,6-hexanediol diacrylate [manufactured by Tokyo Chemical Industry Co., Ltd.] as a crosslinking agent, and 2.0 g of cobalt octoate reagent [containing 8% Co, manufactured by Nippon Chemical Industrial Co., Ltd.] were mixed in air at room temperature (approximately 25°C) until a uniform composition was obtained. Then, 900 g of alumina powder (average particle size: 10 μm) was added and mixed until a uniform composition was obtained, and the resulting mixture was designated as Solution A. 【0131】 [Preparation of Solution B] 14 g of 2-ethylhexyl acrylate / 2-hydroxyethyl acrylate copolymer [2-ethylhexyl acrylate / 2-hydroxyethyl acrylate (mass ratio) = 95 / 5, weight-average molecular weight: 200,000, glass transition temperature: approximately -68°C] as a (meth)acrylic polymer, 50 g of 2-octyl acrylate, 30.9 g of trimellitic acid ester plasticizer [manufactured by ADEKA Corporation, product name: ADEKA Sizer C-880], 0.1 g of 1,6-hexanediol diacrylate [manufactured by Tokyo Chemical Industry Co., Ltd.] as a crosslinking agent, and 5 g of α-acetyl-γ-butyrolactone [manufactured by Tokyo Chemical Industry Co., Ltd.] as a promoter were mixed in air at room temperature (approximately 25°C) until a uniform composition was obtained. Then, 900 g of alumina powder (average particle size: 10 μm) was added and mixed until a uniform composition was obtained to obtain the mixture known as Solution B. Next, using the solutions A and B obtained above, the physical properties of each solution and the physical properties of the two-component curable composition for heat dissipation materials (two-component curable resin composition for heat dissipation materials) after mixing the solutions were investigated in the same manner as in Example 1. The results are shown in Table 1. 【0132】Example 4 [Preparation of Solution A] 14 g of 2-ethylhexyl acrylate / 2-hydroxyethyl acrylate copolymer as a (meth)acrylic polymer [2-ethylhexyl acrylate / 2-hydroxyethyl acrylate (mass ratio) = 95 / 5, weight-average molecular weight: 200,000, glass transition temperature: approximately -68°C], 50 g of 2-ethylhexyl acrylate, trimellitic acid ester plasticizer [(Manufactured by ADEKA Corporation, product name: ADEKA Sizer C-880N)] 33.3 g of [B], 1.5 g of tris(2-acryloyloxyethyl) isocyanurate [manufactured by Toagosei Co., Ltd., trade name: M-313] as a crosslinking agent, and 1.2 g of cobalt octoate reagent [containing 8% Co, manufactured by Nippon Chemical Industrial Co., Ltd.] were mixed in air at room temperature (approximately 25°C) until a uniform composition was achieved. Then, 900 g of alumina powder (average particle size: 10 μm) was added and mixed until a uniform composition was achieved, and the resulting mixture was designated as solution A. 【0133】 [Preparation of Solution B] 7.5 g of 2-ethylhexyl acrylate / 2-hydroxyethyl acrylate copolymer [2-ethylhexyl acrylate / 2-hydroxyethyl acrylate (mass ratio) = 95 / 5, weight-average molecular weight: 50,000, glass transition temperature: approximately -68°C] as a (meth)acrylic polymer, 16.3 g of trimellitic acid ester plasticizer [manufactured by ADEKA Corporation, product name: ADEKA Sizer C-880], and 2.5 g of α-acetyl-γ-butyrolactone [manufactured by Tokyo Chemical Industry Co., Ltd.] as a promoter were mixed in air at room temperature (approximately 25°C) until a uniform composition was achieved. Then, 225 g of alumina powder (average particle size: 10 μm) was added and mixed until a uniform composition was achieved to obtain the mixture known as Solution B. Next, using the solutions A and B obtained above, the physical properties of each solution and the physical properties of the two-component curable composition for heat dissipation materials (two-component curable resin composition for heat dissipation materials) after mixing the solutions were investigated in the same manner as in Example 1. The results are shown in Table 1. 【0134】Example 5 [Preparation of Solution A] 14 g of 2-ethylhexyl acrylate / 2-hydroxyethyl acrylate copolymer [2-ethylhexyl acrylate / 2-hydroxyethyl acrylate (mass ratio) = 95 / 5, weight-average molecular weight: 200,000, glass transition temperature: approximately -68°C] as a (meth)acrylic polymer, 50 g of 2-ethylhexyl acrylate, 33.9 g of trimellitic acid ester plasticizer [manufactured by ADEKA Corporation, product name: ADEKA Sizer C-880NB], 0.1 g of 1,6-hexanediol diacrylate [manufactured by Tokyo Chemical Industry Co., Ltd.] as a crosslinking agent, and 2.0 g of cobalt octoate reagent [containing 8% Co, manufactured by Nippon Chemical Industrial Co., Ltd.] were mixed in air at room temperature (approximately 25°C) until a uniform composition was obtained. Then, 900 g of alumina powder (average particle size: 10 μm) was added and mixed until a uniform composition was obtained, and the resulting mixture was designated as Solution A. 【0135】 [Preparation of Solution B] 14 g of 2-ethylhexyl acrylate / 2-hydroxyethyl acrylate copolymer [2-ethylhexyl acrylate / 2-hydroxyethyl acrylate (mass ratio) = 95 / 5, weight-average molecular weight: 200,000, glass transition temperature: approximately -68°C] as a (meth)acrylic polymer, 50 g of 2-ethylhexyl acrylate, 33.4 g of trimellitic acid ester plasticizer [manufactured by ADEKA Corporation, product name: ADEKA Sizer C-880], 0.1 g of 1,6-hexanediol diacrylate [manufactured by Tokyo Chemical Industry Co., Ltd.] as a crosslinking agent, and 2.5 g of α-acetyl-γ-butyrolactone [manufactured by Tokyo Chemical Industry Co., Ltd.] as a promoter were mixed in air at room temperature (approximately 25°C) until a uniform composition was obtained. Then, 900 g of alumina powder (average particle size: 10 μm) was added and mixed until a uniform composition was obtained to obtain the mixture known as Solution B. Next, using the solutions A and B obtained above, the physical properties of each solution and the physical properties of the two-component curable composition for heat dissipation materials (two-component curable resin composition for heat dissipation materials) after mixing the solutions were investigated in the same manner as in Example 1. The results are shown in Table 1. 【0136】Example 6 [Preparation of Solution A] 14 g of 2-ethylhexyl acrylate / 2-hydroxyethyl acrylate copolymer [2-ethylhexyl acrylate / 2-hydroxyethyl acrylate (mass ratio) = 95 / 5, weight-average molecular weight: 200,000, glass transition temperature: approximately -68°C] as a (meth)acrylic polymer, 50 g of 2-ethylhexyl acrylate, 33.9 g of trimellitic acid ester plasticizer [manufactured by ADEKA Corporation, product name: ADEKA Sizer C-880NB], 0.1 g of 1,6-hexanediol diacrylate [manufactured by Tokyo Chemical Industry Co., Ltd.] as a crosslinking agent, and 2.0 g of cobalt octoate reagent [containing 8% Co, manufactured by Nippon Chemical Industrial Co., Ltd.] were mixed in air at room temperature (approximately 25°C) until a uniform composition was obtained. Then, 900 g of alumina powder (average particle size: 10 μm) was added and mixed until a uniform composition was obtained, and the resulting mixture was designated as Solution A. 【0137】 [Preparation of Solution B] 14 g of 2-ethylhexyl acrylate / 2-hydroxyethyl acrylate copolymer [2-ethylhexyl acrylate / 2-hydroxyethyl acrylate (mass ratio) = 95 / 5, weight-average molecular weight: 200,000, glass transition temperature: approximately -68°C] as a (meth)acrylic polymer, 50 g of 2-ethylhexyl acrylate, 25.9 g of trimellitic acid ester plasticizer [manufactured by ADEKA Corporation, product name: ADEKA Sizer C-880], 0.1 g of 1,6-hexanediol diacrylate [manufactured by Tokyo Chemical Industry Co., Ltd.] as a crosslinking agent, and 10.0 g of α-acetyl-γ-butyrolactone [manufactured by Tokyo Chemical Industry Co., Ltd.] as a promoter were mixed in air at room temperature (approximately 25°C) until a uniform composition was obtained. Then, 900 g of alumina powder (average particle size: 10 μm) was added and mixed until a uniform composition was obtained to obtain the mixture known as Solution B. Next, using the solutions A and B obtained above, the physical properties of each solution and the physical properties of the two-component curable composition for heat dissipation materials (two-component curable resin composition for heat dissipation materials) after mixing the solutions were investigated in the same manner as in Example 1. The results are shown in Table 1. 【0138】Example 7 [Preparation of Solution A] 14 g of 2-ethylhexyl acrylate / 2-hydroxyethyl acrylate copolymer [2-ethylhexyl acrylate / 2-hydroxyethyl acrylate (mass ratio) = 95 / 5, weight-average molecular weight: 200,000, glass transition temperature: approximately -68°C] as a (meth)acrylic polymer, 45 g of 2-ethylhexyl acrylate, 1,2,2,6,6-pentamethyl-4-piperidinyl-methacrylate [manufactured by Nippon Emulsifier Co., Ltd., trade name: Newcol] 5 g of LS-3410, 32.4 g of trimellitic acid ester plasticizer (manufactured by ADEKA Corporation, product name: ADEKA Sizer C-880NB), 1.5 g of tris(2-acryloyloxyethyl) isocyanurate (manufactured by Toagosei Co., Ltd., product name: M-313) as a crosslinking agent, 2 g of cobalt octoate reagent (containing 8% Co, manufactured by Nippon Chemical Industrial Co., Ltd.), and 0.1 g of 4,4'-bis(α,α-dimethylbenzyl)diphenylamine (manufactured by Tokyo Chemical Industry Co., Ltd.) were mixed in air at room temperature (approximately 25°C) until a uniform composition was achieved. Then, 900 g of alumina powder (average particle size: 10 μm) was added and mixed until a uniform composition was achieved, and the resulting mixture was designated as Solution A. 【0139】[Preparation of Solution B] 14 g of 2-ethylhexyl acrylate / 2-hydroxyethyl acrylate copolymer as a (meth)acrylic polymer [2-ethylhexyl acrylate / 2-hydroxyethyl acrylate (mass ratio) = 95 / 5, weight-average molecular weight: 200,000, glass transition temperature: approximately -68°C], 50 g of 2-ethylhexyl acrylate, 30.9 g of trimellitic acid ester plasticizer [(Manufactured by ADEKA Corporation, product name: ADEKA Sizer C-880)], and α-acetyl-γ-butyl as an accelerator. Solution B was prepared by mixing 5.0 g of lolactone [manufactured by Tokyo Chemical Industry Co., Ltd.] and 0.1 g of pentaerythritol tetrakiss [3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate] [manufactured by ADEKA Corporation, product name: ADEKA Stab AO-60] in air at room temperature (approximately 25°C) until a uniform composition was achieved. Then, 900 g of alumina powder (average particle size: 10 μm) was added and mixed until a uniform composition was achieved to obtain the mixture, which was then designated as Solution B. Next, using the above-mentioned Solutions A and B, the physical properties of each solution and the physical properties of the two-component curable composition for heat dissipation materials (two-component curable resin composition for heat dissipation materials) after mixing each solution were investigated in the same manner as in Example 1. The results are shown in Table 1. 【0140】 Example 8 [Preparation of Solution A] 14 g of 2-ethylhexyl acrylate / 2-hydroxyethyl acrylate copolymer as (meth)acrylic polymer [2-ethylhexyl acrylate / 2-hydroxyethyl acrylate (mass ratio) = 95 / 5, weight-average molecular weight: 200,000, glass transition temperature: approximately -68°C], 45 g of 2-ethylhexyl acrylate, 5 g of vinyltoluene [manufactured by Tokyo Chemical Industry Co., Ltd.], 3 g of trimellitic acid ester plasticizer [manufactured by ADEKA Corporation, product name: ADEKA Sizer C-880NB] 3.8 g of , 0.1 g of 1,6-hexanediol diacrylate (manufactured by Tokyo Chemical Industry Co., Ltd.) as a crosslinking agent, 2 g of cobalt octoate reagent (containing 8% Co, manufactured by Nippon Chemical Industrial Co., Ltd.), and 0.1 g of 4,4'-bis(α,α-dimethylbenzyl)diphenylamine (manufactured by Tokyo Chemical Industry Co., Ltd.) were mixed in air at room temperature (approximately 25°C) until a homogeneous composition was achieved. Then, 900 g of alumina powder (average particle size: 10 μm) was added and mixed until a homogeneous composition was achieved, and the resulting mixture was designated as Solution A. 【0141】 [Preparation of Solution B] 14 g of 2-ethylhexyl acrylate / 2-hydroxyethyl acrylate copolymer as a (meth)acrylic polymer [2-ethylhexyl acrylate / 2-hydroxyethyl acrylate (mass ratio) = 95 / 5, weight-average molecular weight: 200,000, glass transition temperature: approximately -68°C], 50 g of 2-ethylhexyl acrylate, 30.8 g of trimellitic acid ester plasticizer [(Manufactured by ADEKA Corporation, product name: ADEKA Sizer C-880)], and 1,6-hexanediol diacrylate as a crosslinking agent [Tokyo Chemical Industries]. 0.1 g of [manufactured by Tokyo Chemical Industry Co., Ltd.], 5.0 g of α-acetyl-γ-butyrolactone [manufactured by Tokyo Chemical Industry Co., Ltd.] as an accelerator, and 0.1 g of pentaerythritol tetrakiss [3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate] [manufactured by ADEKA Corporation, product name: ADEKA Stab AO-60] were mixed in air at room temperature (approximately 25°C) until a uniform composition was achieved. Then, 900 g of alumina powder (average particle size: 10 μm) was added and mixed until a uniform composition was achieved to obtain the mixture known as Solution B. Next, using the above-mentioned Solutions A and B, the physical properties of each solution and the physical properties of the two-component curable composition for heat dissipation materials (two-component curable resin composition for heat dissipation materials) after mixing each solution were investigated in the same manner as in Example 1. The results are shown in Table 1. 【0142】Example 9 [Preparation of Solution A] 14 g of 2-ethylhexyl acrylate / 2-hydroxyethyl acrylate copolymer as a (meth)acrylic polymer [2-ethylhexyl acrylate / 2-hydroxyethyl acrylate (mass ratio) = 95 / 5, weight-average molecular weight: 200,000, glass transition temperature: approximately -68°C], 50 g of 2-ethylhexyl acrylate, 28.9 g of trimellitic acid ester plasticizer [(Manufactured by ADEKA Corporation, product name: ADEKA Sizer C-880NB)], and as a crosslinking agent 0.1 g of 1,6-hexanediol diacrylate [manufactured by Tokyo Chemical Industry Co., Ltd.], 2 g of cobalt octoate reagent [containing 8% Co, manufactured by Nippon Chemical Industrial Co., Ltd.], and 5.0 g of 4,4'-bis(α,α-dimethylbenzyl)diphenylamine [manufactured by Tokyo Chemical Industry Co., Ltd.] were mixed in air at room temperature (approximately 25°C) until a uniform composition was achieved. Then, 900 g of alumina powder (average particle size: 10 μm) was added and mixed until a uniform composition was achieved, and the resulting mixture was designated as Solution A. 【0143】[Preparation of Solution B] 14 g of 2-ethylhexyl acrylate / 2-hydroxyethyl acrylate copolymer as a (meth)acrylic polymer [2-ethylhexyl acrylate / 2-hydroxyethyl acrylate (mass ratio) = 95 / 5, weight-average molecular weight: 200,000, glass transition temperature: approximately -68°C], 50 g of 2-ethylhexyl acrylate, 30.8 g of trimellitic acid ester plasticizer [(Manufactured by ADEKA Corporation, product name: ADEKA Sizer C-880)], and 1,6-hexanediol diacrylate as a crosslinking agent [Tokyo Chemical Industries]. 0.1 g of [manufactured by Tokyo Chemical Industry Co., Ltd.], 5.0 g of α-acetyl-γ-butyrolactone [manufactured by Tokyo Chemical Industry Co., Ltd.] as an accelerator, and 0.1 g of pentaerythritol tetrakiss [3-(3,5-di-tert-butyl-4-hydroxyphenyl)propionate] [manufactured by ADEKA Corporation, product name: ADEKA Stab AO-60] were mixed in air at room temperature (approximately 25°C) until a uniform composition was achieved. Then, 900 g of alumina powder (average particle size: 10 μm) was added and mixed until a uniform composition was achieved to obtain the mixture known as Solution B. Next, using the above-mentioned Solutions A and B, the physical properties of each solution and the physical properties of the two-component curable composition for heat dissipation materials (two-component curable resin composition for heat dissipation materials) after mixing each solution were investigated in the same manner as in Example 1. The results are shown in Table 1. 【0144】 Comparative Example 1 [Preparation of Solution A] 14 g of 2-ethylhexyl acrylate / 2-hydroxyethyl acrylate copolymer [2-ethylhexyl acrylate / 2-hydroxyethyl acrylate (mass ratio) = 95 / 5, weight-average molecular weight: 200,000, glass transition temperature: approximately -68°C] as a (meth)acrylic polymer, 50 g of 2-ethylhexyl acrylate, 33.9 g of trimellitic acid ester plasticizer [manufactured by ADEKA Corporation, product name: ADEKA Sizer C-880], 0.1 g of 1,6-hexanediol diacrylate [manufactured by Tokyo Chemical Industry Co., Ltd.] as a crosslinking agent, and 2 g of N,N-bis(2-hydroxyethyl)-p-toluidine [manufactured by Tokyo Chemical Industry Co., Ltd.] were mixed in air at room temperature (approximately 25°C) until a uniform composition was obtained. Then, 900 g of alumina powder (average particle size: 10 μm) was added and mixed until a uniform composition was obtained, and the resulting mixture was designated as Solution A. 【0145】[Preparation of Solution B] 14 g of 2-ethylhexyl acrylate / 2-hydroxyethyl acrylate copolymer [2-ethylhexyl acrylate / 2-hydroxyethyl acrylate (mass ratio) = 95 / 5, weight-average molecular weight: 200,000, glass transition temperature: approximately -68°C] as a (meth)acrylic polymer, 50 g of 2-ethylhexyl acrylate, 30.9 g of trimellitic acid ester plasticizer [manufactured by ADEKA Corporation, product name: ADEKA Sizer C-880], 0.1 g of 1,6-hexanediol diacrylate [manufactured by Tokyo Chemical Industry Co., Ltd.] as a crosslinking agent, and 5 g of peroxide-based initiator [manufactured by NOF Corporation, product name: NIPER NS] as a polymerization initiator were mixed in air at room temperature (approximately 25°C) until a uniform composition was obtained. Then, 900 g of alumina powder (average particle size: 10 μm) was added and mixed until a uniform composition was obtained, resulting in the mixture known as Solution B. Next, using the solutions A and B obtained above, the physical properties of each solution and the physical properties of the two-component curable composition for heat dissipation materials (two-component curable resin composition for heat dissipation materials) after mixing the solutions were investigated in the same manner as in Example 1. The results are shown in Table 1. 【0146】 Comparative Example 2 [Preparation of Solution A] 14 g of 2-ethylhexyl acrylate / 2-hydroxyethyl acrylate copolymer as a (meth)acrylic polymer [2-ethylhexyl acrylate / 2-hydroxyethyl acrylate (mass ratio) = 95 / 5, weight-average molecular weight: 200,000, glass transition temperature: approximately -68°C], 50 g of 2-ethylhexyl acrylate, trimellitic acid ester plasticizer [(Manufactured by ADEKA Corporation, product name: ADEKA Sizer C-880)] 33.3 The mixture obtained by adding 1.5 g of tris(2-acryloyloxyethyl) isocyanurate [manufactured by Toagosei Co., Ltd., trade name: M-313] and 1.2 g of N,N-bis(2-hydroxyethyl)-p-toluidine [manufactured by Tokyo Chemical Industry Co., Ltd.] as crosslinking agents in air at room temperature (approximately 25°C) until a uniform composition was obtained, and then adding 900 g of alumina powder (average particle size: 10 μm) and mixing until a uniform composition was obtained was designated as Solution A. 【0147】[Preparation of Solution B] 7.5 g of 2-ethylhexyl acrylate / 2-hydroxyethyl acrylate copolymer [2-ethylhexyl acrylate / 2-hydroxyethyl acrylate (mass ratio) = 95 / 5, weight-average molecular weight: 200,000, glass transition temperature: approximately -68°C] as a (meth)acrylic polymer, 16.3 g of trimellitic acid ester plasticizer [manufactured by ADEKA Corporation, product name: ADEKA Sizer C-880], and 5 g of peroxide-based initiator [manufactured by NOF Corporation, product name: NIPER NS] as a polymerization initiator were mixed in air at room temperature (approximately 25°C) until a uniform composition was obtained. Then, 225 g of alumina powder (average particle size: 10 μm) was added and mixed until a uniform composition was obtained, and the resulting mixture was designated as Solution B. Next, using the solutions A and B obtained above, the physical properties of each solution and the physical properties of the two-component curable composition for heat dissipation materials (two-component curable resin composition for heat dissipation materials) after mixing the solutions were investigated in the same manner as in Example 1. The results are shown in Table 1. 【0148】 Reference Example 1 [Preparation of Solution A] Solution A was prepared by mixing 14 g of 2-ethylhexyl acrylate / 2-hydroxyethyl acrylate copolymer [2-ethylhexyl acrylate / 2-hydroxyethyl acrylate (mass ratio) = 95 / 5, weight-average molecular weight: 200,000, glass transition temperature: approximately -68°C] as a (meth)acrylic polymer, 50 g of 2-ethylhexyl acrylate, 33.9 g of trimellitic acid ester plasticizer [manufactured by ADEKA Corporation, product name: ADEKA Sizer C-880NB], 0.1 g of 1,6-hexanediol diacrylate [manufactured by Tokyo Chemical Industry Co., Ltd.] as a crosslinking agent, and 2.0 g of cobalt octoate reagent [containing 8% Co, manufactured by Nippon Chemical Industrial Co., Ltd.] in air at room temperature (approximately 25°C) until a homogeneous composition was obtained. 【0149】[Preparation of Solution B] Solution B was prepared by mixing 14 g of 2-ethylhexyl acrylate / 2-hydroxyethyl acrylate copolymer [2-ethylhexyl acrylate / 2-hydroxyethyl acrylate (mass ratio) = 95 / 5, weight-average molecular weight: 200,000, glass transition temperature: approximately -68°C] as a (meth)acrylic polymer, 50 g of 2-ethylhexyl acrylate, 30.9 g of trimellitic acid ester plasticizer [manufactured by ADEKA Corporation, product name: ADEKA Sizer C-880], 0.1 g of 1,6-hexanediol diacrylate [manufactured by Tokyo Chemical Industry Co., Ltd.] as a crosslinking agent, and 5 g of α-acetyl-γ-butyrolactone [manufactured by Tokyo Chemical Industry Co., Ltd.] as a promoter in air at room temperature (approximately 25°C) until a homogeneous composition was obtained. Next, using the solutions A and B obtained above, the physical properties of each solution and the physical properties of the two-component curable composition for heat dissipation materials (two-component curable resin composition for heat dissipation materials) after mixing the solutions were investigated in the same manner as in Example 1. The results are shown in Table 1. Note that in the case where inorganic particles were not added, the cured resin became an extremely flexible resin with a hardness of 0, so the curability of the air-contact area before and after storage was not investigated. 【0150】 Reference Example 2 [Preparation of Solution A] Solution A was prepared by mixing 14 g of 2-ethylhexyl acrylate / 2-hydroxyethyl acrylate copolymer [2-ethylhexyl acrylate / 2-hydroxyethyl acrylate (mass ratio) = 95 / 5, weight-average molecular weight: 200,000, glass transition temperature: approximately -68°C] as a (meth)acrylic polymer, 50 g of 2-ethylhexyl acrylate, 33.3 g of trimellitic acid ester plasticizer [manufactured by ADEKA Corporation, product name: ADEKA Sizer C-880], 1.5 g of tris(2-acryloyloxyethyl) isocyanurate [manufactured by Toagosei Co., Ltd., product name: M-313] as a crosslinking agent, and 1.2 g of cobalt octoate reagent [containing 8% Co, manufactured by Nippon Chemical Industrial Co., Ltd.] in air at room temperature (approximately 25°C) until a homogeneous composition was obtained. 【0151】[Preparation of Solution B] Solution B was prepared by mixing 7.5 g of 2-ethylhexyl acrylate / 2-hydroxyethyl acrylate copolymer [2-ethylhexyl acrylate / 2-hydroxyethyl acrylate (mass ratio) = 95 / 5, weight-average molecular weight: 200,000, glass transition temperature: approximately -68°C] as a (meth)acrylic polymer, 16.3 g of trimellitic acid ester plasticizer [manufactured by ADEKA Corporation, product name: ADEKA Sizer C-880], and 2.5 g of α-acetyl-γ-butyrolactone [manufactured by Tokyo Chemical Industry Co., Ltd.] as an accelerator in air at room temperature (approximately 25°C) until a uniform composition was obtained. Next, using the solutions A and B obtained above, the physical properties of each solution and the physical properties of the two-component curable composition for heat dissipation materials (two-component curable resin composition for heat dissipation materials) after mixing each solution were investigated in the same manner as in Example 1. The results are shown in Table 1. Furthermore, in the case where inorganic particles were not added, the cured resin became extremely flexible, with a hardness of 0. Therefore, the curability of the parts in contact with air before and after storage has not been verified. 【0152】 Reference Example 3 [Preparation of Solution A] Solution A was prepared by mixing 14 g of 2-ethylhexyl acrylate / 2-hydroxyethyl acrylate copolymer [2-ethylhexyl acrylate / 2-hydroxyethyl acrylate (mass ratio) = 95 / 5, weight-average molecular weight: 200,000, glass transition temperature: approximately -68°C] as a (meth)acrylic polymer, 50 g of 2-ethylhexyl acrylate, 33.3 g of trimellitic acid ester plasticizer [manufactured by ADEKA Corporation, product name: ADEKA Sizer C-880], 1.5 g of tris(2-acryloyloxyethyl) isocyanurate [manufactured by Toagosei Co., Ltd., product name: M-313] as a crosslinking agent, and 1.2 g of 1,3-dibutylthiourea [manufactured by Tokyo Chemical Industry Co., Ltd.] in air at room temperature (approximately 25°C) until a homogeneous composition was obtained. 【0153】[Preparation of Solution B] Solution B was prepared by mixing 7.5 g of 2-ethylhexyl acrylate / 2-hydroxyethyl acrylate copolymer [2-ethylhexyl acrylate / 2-hydroxyethyl acrylate (mass ratio) = 95 / 5, weight-average molecular weight: 200,000, glass transition temperature: approximately -68°C] as a (meth)acrylic polymer, 16.3 g of trimellitic acid ester plasticizer [manufactured by ADEKA Corporation, product name: ADEKA Sizer C-880], and 2.5 g of peroxide-based initiator [manufactured by NOF Corporation, product name: Perkmil H-80] as a polymerization initiator in air at room temperature (approximately 25°C) until a uniform composition was obtained. Next, using the solutions A and B obtained above, the physical properties of each solution and the physical properties of the two-component curable composition for heat dissipation materials (two-component curable resin composition for heat dissipation materials) after mixing each solution were investigated in the same manner as in Example 1. The results are shown in Table 1. Furthermore, in the case where inorganic particles were not added, the cured resin became extremely flexible, with a hardness of 0. Therefore, the curability of the parts in contact with air before and after storage has not been verified. 【0154】 The two-component resin compositions of Examples 1 to 9, which are the two-component resin compositions of the present invention, were found to have good storage stability and good curability after storage. 【0155】 On the other hand, in Comparative Example 1, the two-component resin composition in which solution B contains a peroxide-based initiator instead of a ketone compound along with a radical polymerizable monomer, solution B solidified after storage, resulting in poor storage stability. Furthermore, in Comparative Example 2, the two-component resin composition in which solution A contains a reaction accelerator other than a metal compound, and solution B does not contain a radical polymerizable monomer but contains inorganic particles and a peroxide-based initiator instead of a ketone compound, had good storage stability but poor curability, particularly poor curability after storage. 【0156】The two-component resin compositions of Reference Examples 1 to 3 do not contain inorganic particles and cannot exhibit sufficient thermal conductivity for forming heat dissipation materials, etc., but they exhibited good curing properties after storage. Even if the two-component resin composition contains a metal compound in liquid A and a ketone compound in liquid B, as in the present invention (Reference Examples 1 and 2), or if the two-component resin composition contains a reaction accelerator other than a metal compound and liquid B contains a peroxide-based initiator instead of a ketone compound (Reference Example 3), the curing properties after storage are good. Therefore, it can be seen that when the composition does not contain inorganic particles, the problem of curing properties after storage in the present invention is absent or much smaller.

Claims

1. A two-component resin composition comprising liquid A and liquid B, wherein liquid A contains a reaction accelerator, the reaction accelerator contains a metal compound, liquid B contains a reaction accelerator aid, the reaction accelerator aid contains a ketone compound, liquid A and / or liquid B contain a radical polymerizable monomer, and liquid A and / or liquid B contain inorganic particles with a thermal conductivity of 2 W / m·K or higher.

2. The two-component resin composition according to claim 1, wherein the ketone compound is a dicarbonyl compound.

3. The two-component resin composition according to claim 1 or 2, wherein the inorganic particles are at least one selected from the group consisting of carbonate particles, oxide particles, hydroxide particles, silicate particles, nitride particles, sulfate particles, metal particles, and carbon black particles.

4. The two-component resin composition according to any one of claims 1 to 3, wherein the radical polymerizable monomer comprises a radical polymerizable monomer whose glass transition temperature when formed into a homopolymer is 0°C or lower.

5. The two-component resin composition according to any one of claims 1 to 4, wherein the liquid A and / or liquid B further contain a polyfunctional monomer.

6. The two-component resin composition according to any one of claims 1 to 5, wherein the liquid A and / or liquid B further contain a plasticizer.

7. The two-component resin composition according to any one of claims 1 to 6, wherein the liquid A and / or liquid B further contain a (meth)acrylic polymer.

8. A two-component resin composition according to any one of claims 1 to 7, used for heat dissipation applications.

9. A cured product obtained by curing a two-component resin composition according to any one of claims 1 to 8.

10. A heat dissipation material obtained by curing the two-component resin composition according to claim 8.

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