Composition containing amide compound

Abstract

[Problem] To provide: a composition that has high dissolving power with respect to water, organic compounds, and inorganic compounds, does not have hazardous properties such as irritancy or toxicity, and can be readily employed in various industrial uses, for example, as a solvent for chemical reactions or resin synthesis, a solvent for analysis, a solvent for dissolving resins, paints, inks, and the like, a diluent for dilution, a dispersant for dispersion, a cleaning agent for cleaning manufacturing equipment, metal components, electronic components, and the like, a stripping agent for stripping resists or resins, a liquid crystal alignment treatment agent for alignment treatment of liquid crystal molecules, or an electrolyte solution for battery manufacturing; and various formulations and products containing said composition. [Solution] A composition containing an N,N-disubstituted amide (compound A) and an N-monosubstituted amide (compound B).

Description

Amide compound-containing composition 【0001】 This invention relates to compositions containing amide compounds and their uses. 【0002】 Most amide compounds are liquid at room temperature and have good compatibility with a variety of compounds, including water, organic compounds, and resins. Furthermore, amide compounds have high boiling and flash points, making them thermally and chemically stable. For these reasons, they are widely used industrially as solvents for chemical reactions, resin manufacturing, cleaning agents, dispersants, resist stripping agents, liquid crystal alignment agents, and solvents for pharmaceuticals and agrochemicals. Representative amide compounds include N-methyl-2-pyrrolidone (NMP), dimethylformamide (DMF), and dimethylacetamide (DMAC). However, these amide compounds raise concerns about their harmful effects on the human body, including skin irritation, carcinogenicity (mutagenicity), and reproductive toxicity (teratogenicity). 【0003】 Due to these problems, there is a great deal of effort being put into developing amide compounds that are liquid at room temperature, have excellent compatibility with water, organic compounds and resins, exhibit excellent dispersibility with inorganic compounds, are thermally and chemically stable, and have high safety. 【0004】 The present invention aims to provide a composition that has high compatibility with water, organic compounds, and resins, high dispersibility with inorganic compounds, does not exhibit harmful effects on the human body such as skin irritation or carcinogenicity, and can be stably stored for a long period of time. Furthermore, the present invention provides solvents for chemical reactions or resin synthesis; solvents for dissolving resins, paints, inks, adhesives, pharmaceuticals or agricultural chemicals; diluents for dilution; dispersants for dispersion; cleaning agents for cleaning manufacturing equipment, metal parts, electronic components, etc.; stripping agents for stripping resists and resins, etc.; etching solutions for etching metals, alloys or metal oxides; liquid crystal alignment agents for aligning liquid crystal molecules; electrolytes for battery manufacturing; resin varnishes and resin compositions usable in various industrial fields; various formulations containing the same and products containing the same; and products obtained therefrom. 【0005】 As a result of diligent research to solve the aforementioned problems, the present inventors discovered a composition (composition D) containing an N,N-disubstituted amide (compound A) and an N-monosubstituted amide (compound B), leading to the present invention. 【0006】 Composition D has high compatibility with water, organic compounds, and resins, high dispersibility with inorganic compounds, does not exhibit harmful effects on the human body such as skin irritation or carcinogenicity, can be stored stably for a long period of time, and is a composition that can be used for various industrial applications. 【0007】 Compounds A and B both possess high solubility in water, organic compounds, and resins, as well as high dispersibility in inorganic compounds, while simultaneously being highly safe. Composition D is characterized by containing compound A and compound B as essential components. Composition D can be actively used as a solvent for dissolving various materials, a solvent for synthesizing various resins and resin precursors, a solvent for synthesizing various resin varnishes and resin compositions, and a solvent for forming polyimide films, semiconductor substrates, flexible substrates, cured relief pattern films, wiring patterns, printed patterns, insulating films, protective films, separation films, gas barrier films, and sliding members. 【0008】 Solutions obtained using composition D as a solvent, diluents obtained using it as a diluent, and dispersions obtained using it as a dispersant exhibit high storage stability due to the interaction between compound A and compound B. Furthermore, the performance of cleaning agents, stripping agents, etching agent solutions, liquid crystal alignment agents, and electrolytes using composition D is also improved. 【0009】 The embodiments for carrying out the present invention will be described in detail below. One embodiment of the present invention is a composition (composition D) containing an N,N-disubstituted amide (compound A) and an N-monosubstituted amide (compound B). 【0010】Composition D contains compound A, which is a specific N,N-disubstituted amide, and a trace amount of compound B, which is a specific N-monosubstituted amide. Composition D has excellent solubility in water, organic compounds, and resins, as well as excellent dispersibility in inorganic compounds. It also has reduced harmful effects on the human body, such as skin irritation and carcinogenicity, and excellent long-term storage stability. Furthermore, a solution obtained by dissolving resin using composition D has high storage stability and transparency, and yields a high molecular weight resin. The resulting resin can be used to obtain films, coatings, and adhesive layers with uniform thickness and smooth surfaces. Moreover, since composition D has excellent solubility in other substances and has a suitable viscosity at room temperature, it can be suitably used as a dissolving solvent or reaction solvent, diluent, dispersant, cleaning agent, release agent, etching solution, etc. 【0011】 The content of compound A in composition D is not particularly limited, but should be 0.1% by mass or more relative to the total amount of composition D. From the viewpoint of fully exhibiting the effects of compound A, it is preferably 1.0 to 99.9999% by mass, more preferably 5.0 to 99.999% by mass, and particularly preferably 10 to 99.99% by mass. When the content of compound A is within this range, composition D functions effectively not only as a solvent system but also as a dispersant, exhibiting high solubility or compatibility with a variety of substances, from polar solvents such as water and alcohol to non-polar solvents such as hydrocarbons, various resins, paints, and inks. Compound A may be used alone or in combination of two or more types. Using two or more types in combination makes it easier to adjust properties such as compatibility, dispersibility, drying speed, and viscosity to an appropriate range. 【0012】The content of compound B in composition D is characterized by being 1 ppm to 1% by mass (10,000 ppm) or less relative to the total amount of composition D. Specifically, it is preferably 10 ppm to 0.8% by mass (8,000 ppm), and more preferably 50 ppm to 0.5% by mass (5,000 ppm). When the content of compound B is within this range, an appropriate hydrogen bond network is formed between compound B and compound A or between compound B compounds themselves, making it easier to adjust the physical properties of the composition. Specifically, if the content of compound B is less than 1 ppm, the interaction with compound A will be insufficient, making it difficult to obtain the effect of improving the stability of the composition or, in the case of resin solutions using it, the effect of improving the quality. On the other hand, if the content of compound B is 1% by mass or more, there is a risk of the composition becoming highly viscous due to the strong hydrogen bonding ability of compound B itself, or a decrease in solubility in certain resins. Compound B may be used alone or in combination of two or more types. 【0013】 Compound A in this embodiment is at least one N,N-disubstituted amide represented by the following general formula (1). In this structure, since there is no hydrogen atom bonded to the nitrogen atom of the amide bond, it does not act as a hydrogen bond donor between molecules, which is the reason for the difference in properties between it and compound B, which will be described later. 【0014】 In the general formula (1) above, R1 and R2 each independently represent a linear or branched alkyl group having 1 to 4 carbon atoms. Examples of linear or branched alkyl groups having 1 to 4 carbon atoms include methyl, ethyl, n-propyl, isopropyl, n-butyl, isobutyl, sec-butyl, and tert-butyl groups. Of these, methyl or ethyl groups are particularly preferred due to the balance between the overall polarity of the molecule and its steric bulk. For example, N,N-dimethylamide structures where both R1 and R2 are methyl groups, and N,N-diethylamide structures where both are ethyl groups, are preferred because they exhibit excellent solubility in many substances. 【0015】In the general formula (1) above, R1 and R2 may, together with the nitrogen atom to which they are bonded, form a saturated 5- to 7-membered ring structure. This ring structure may consist of a carbon atom and one or more nitrogen atoms, and may also contain one or more oxygen atoms and heteroatoms such as sulfur atoms. Specific examples include pyrrolidine rings, piperidine rings, azepane rings, imidazolidine rings, piperazine rings, oxazolidine rings, isoxazolidine rings, morpholine rings, thiazolidinated rings, and thiomorpholine rings. Among these ring structures, morpholine rings are particularly preferred from the viewpoint of chemical stability, availability, and imparting appropriate polarity. 【0016】 In the above general formula (1), R3 and R4 each independently represent a hydrogen atom, a linear or branched alkyl group having 1 to 4 carbon atoms, a linear or branched alkoxy group having 1 to 4 carbon atoms, or a linear or branched alkylene oxyalkyl group having 2 to 4 carbon atoms. Examples of linear or branched alkyl groups having 1 to 4 carbon atoms include the same groups as those exemplified by R1 and R2, namely, methyl group, ethyl group, n-propyl group, isopropyl group, n-butyl group, isobutyl group, sec-butyl group, and tert-butyl group. Examples of linear or branched alkoxy groups having 1 to 4 carbon atoms include methoxy group, ethoxy group, n-propoxy group, isopropoxy group, n-butoxy group, isobutoxy group, sec-butoxy group, and tert-butoxy group. Examples of linear or branched alkylene oxyalkyl groups having 2 to 4 carbon atoms include methyleneoxymethyl group, methyleneoxyethyl group, methyleneoxypropyl group, methyleneoxyisopropyl group, ethyleneoxymethyl group, ethyleneoxyethyl group, propyleneoxymethyl group, and isopropyleneoxymethyl group. Of these, hydrogen atoms, methyl groups, ethyl groups, methoxy groups, ethoxy groups, propoxy groups, and methyleneoxymethyl groups are preferred from the viewpoint of providing appropriate polarity and solubility. 【0017】In the above general formula (1), R3 and R4 may, together with the carbon atom (when m=0) or hydrocarbon group (when m=1 or 2) to which they are bonded, form a saturated 5- to 7-membered ring structure. Such a ring structure may be a saturated or unsaturated cyclic aliphatic hydrocarbon group, or a heterocyclic group containing any heteroatom. Preferably, the heteroatom contains a nitrogen atom and / or an oxygen atom. Examples of saturated or unsaturated cyclic aliphatic hydrocarbon ring groups include cyclopentane, cyclopentyl, cyclohexane, cyclohexene, cycloheptane, cycloheptyl, cyclooctane, and cyclooctyl groups. 【0018】 In the general formula (1) above, m represents an integer from 0 to 2. When m is 0, the structure is such that R3 and R4 are directly bonded to the carbon adjacent to the carbonyl group, and in this case, R3 and R4 are not both hydrogen atoms. When m is 1 or 2, the structure is such that a methylene chain (-(CH2)m-) is interposed between the carbonyl group and the carbon having substituents R3 and R4. In this case, the -(CH2)m-R3 as a whole may form a branched alkyl group having 3 to 6 carbon atoms or a branched alkoxy group having 3 to 6 carbon atoms. This means that, for example, when m=1 and R3 is an isopropyl group, the whole structure can be considered as part of an isobutyl group. Examples of branched alkyl groups having 3 to 6 carbon atoms include isopropyl group, isobutyl group, sec-butyl group, tert-butyl group, isopentyl group, neopentyl group, tert-pentyl group, isohexyl group, etc. Examples of branched alkoxy groups having 3 to 6 carbon atoms include isopropoxy, isobutoxy, sec-butoxy, tert-butoxy, isopentoxy, neopentoxy, tert-pentoxy, and isohexyloxy groups. Examples of alkylene oxyalkyl groups include methyleneoxymethyl, methyleneoxyethyl, methyleneoxypropyl, methyleneoxyisopropyl, ethyleneoxymethyl, ethyleneoxyethyl, propyleneoxymethyl, and isopropyleneoxymethyl groups. 【0019】Examples of compound A include a variety of compounds such as: Specifically, acetic acid derivatives such as N,N-dimethyl-2-methoxyacetamide, N,N-methylethyl-2-methoxyacetamide, N,N-diethyl-2-methoxyacetamide, 2-methoxyacetate morpholide, N,N-dimethyl-2-ethoxyacetamide, N,N-methylethyl-2-ethoxyacetamide, N,N-diethyl-2-ethoxyacetamide, 2-ethoxyacetate morpholide, N,N-dimethylpropionic acid amide, N,N-methylethylpropionic acid amide, N,N-diethylpropionic acid amide, and 3-propionic acid morpholide. Lido, N,N-dimethyl-3-methoxypropionamide, N,N-methylethyl-3-methoxypropionamide, N,N-diethyl-3-methoxypropionamide, 3-methoxypropionate morpholide, N,N-dimethyl-2-methoxypropionamide, N,N-methylethyl-2-methoxypropionamide, N,N-diethyl-2-methoxypropionamide, 2-methoxypropionate morpholide, N,N-dimethyl-2-ethoxypropionamide, N,N-methylethyl-2-ethoxypropionamide N,N-Diethyl-2-ethoxypropionate amide, 2-ethoxypropionate morpholide, N,N-dimethyl-3-ethoxypropionate amide, N,N-methylethyl-3-ethoxypropionate amide, N,N-Diethyl-3-ethoxypropionate amide, 3-ethoxypropionate morpholide, N,N-dimethyl-2-methylpropionate amide, N,N-methylethyl-2-methylpropionate amide, N,N-Diethyl-2-methylpropionate amide, 2-methyl-3-propionate morpholide, N ,N-dimethyl-2-methyl-3-methoxypropionamide, N,N-methylethyl-2-methyl-3-methoxypropionamide, N,N-diethyl-2-methyl-3-methoxypropionamide, 2-methyl-3-methoxypropionate morpholide, N,N-dimethyl-2-methyl-3-ethoxypropionamide, N,N-methylethyl-2-methyl-3-ethoxypropionamide, N,N-diethyl-2-methyl-3-ethoxypropionamide, 2-methyl-3-ethoxypropionate morpholide, N,Propionic acid derivatives such as N-dimethyl-2-ethylpropionic acid amide, N,N-methylethyl-2-ethylpropionic acid amide, N,N-diethyl-2-ethylpropionic acid amide, 2-ethylpropionic acid morpholide, N,N-dimethyl-2-ethyl-3-methoxypropionic acid amide, N,N-methylethyl-2-ethyl-3-methoxypropionic acid amide, N,N-diethyl-2-ethyl-3-methoxypropionic acid amide, 2-ethyl-3-methoxypropionic acid morpholide, N,N-dimethylbutyrate amide, and N,N-methylethylbutyrate Amides, N,N-diethylbutyrate amide, 4-butyrate morpholide, N,N-dimethyl-2-methylbutyrate amide, N,N-methylethyl-2-methylbutyrate amide, N,N-diethyl-2-methylbutyrate amide, 2-methyl-4-butyrate morpholide, N,N-dimethyl-2-methoxybutyrate amide, N,N-methylethyl-2-methoxybutyrate amide, N,N-diethyl-2-methoxybutyrate amide, 2-methoxybutyrate morpholide, N,N-dimethyl-2-ethoxybutyrate amide, N,N-methylethyl-2-ethoxybutyrate amide, N,N-diethyl-2-ethoxybutyrate Acid amide, 2-ethoxybutyrate morpholide, N,N-dimethyl-2-ethylbutyrate amide, N,N-methylethyl-2-ethylbutyrate amide, N,N-diethyl-2-ethylbutyrate amide, 2-ethyl-3-butyrate morpholide, N,N-dimethyl-2-methyleneoxymethylbutyrate amide, N,N-methylethyl-2-methyleneoxymethylbutyrate amide, N,N-diethyl-2-methyleneoxymethylbutyrate amide, 2-methyleneoxymethylbutyrate morpholide, N,N-dimethyl-4-methoxybutyrate amide, N,N-methylethyl-4-methoxybutyrate amide, N ,N-diethyl-4-methoxybutyrate amide, 4-methoxybutyrate morpholide, N,N-dimethyl-4-ethoxybutyrate amide, N,N-methylethyl-4-ethoxybutyrate amide, N,N-diethyl-4-ethoxybutyrate amide, 4-ethoxybutyrate morpholide, N,N-dimethyl-2-methyl-4-methoxybutyrate amide, N,N-methylethyl-2-methyl-4-methoxybutyrate amide, N,N-diethyl-2-methyl-4-methoxybutyrate amide, 2-methyl-4-methoxybutyrate morpholide, N,N-dimethyl-2-methyl-4-ethoxybutyrate amide, N,N-methylethyl-2-methyl-4-ethoxybutyrate, N,N-diethyl-2-methyl-4-ethoxybutyrate, 2-methyl-4-ethoxybutyrate morpholide, N,N-dimethyl-2-ethyl-4-methoxybutyrate, N,N-methylethyl-2-ethyl-4-methoxybutyrate, N,N-diethyl-2-ethyl-4-methoxybutyrate, 2-ethyl-4-methoxybutyrate morpholide, N,N-dimethyl-2-ethyl-4-ethoxybutyrate, N,N-methylethyl-2-ethyl-4-ethoxybutyrate, N,N-diethyl-2- Butyric acid derivatives such as ethyl-4-ethoxybutyrate amide, 2-ethyl-4-ethoxybutyrate morpholide, N,N-dimethylvaleramide, N,N-methylethylvaleramide, N,N-diethylvaleramide, 5-valerate morpholide, N,N-dimethyl-2-methylvaleramide, N,N-methylethyl-2-methylvaleramide, N,N-diethyl-2-methylvaleramide, 2-methylvalerate morpholide, N,N-dimethyl-2-ethylvaleramide, N,N-methylethyl-2-ethylvaleramide, N,N-diethyl-2-ethylvaleramide, Valeric acid derivatives such as 2-ethylvalerate morpholide, N,N-dimethyl-2-methyl-5-methoxyvaleramide, N,N-methylethyl-2-methyl-5-methoxyvaleramide, N,N-diethyl-2-methyl-5-methoxyvaleramide, 2-methyl-5-methoxyvalerate morpholide, N,N-dimethyl-2-ethyl-5-methoxyvaleramide, N,N-methylethyl-2-ethyl-5-methoxyvaleramide, N,N-diethyl-2-ethyl-5-methoxyvaleramide, 2-ethyl-5-methoxyvalerate morpholide, N,N-dimethyl Examples of caproic acid derivatives include pronate amide, N,N-methylethylcaproate amide, N,N-diethylcaproate amide, caproic acid morpholide, N,N-dimethyl-2-methylcaproate amide, N,N-methylethyl-2-methylcaproate amide, N,N-diethyl-2-methylcaproate amide, 2-methylcaproic acid morpholide, N,N-dimethyl-2-ethylcaproate amide, N,N-methylethyl-2-ethylcaproate amide, N,N-diethyl-2-ethylcaproate amide, and 2-ethylcaproic acid morpholide. 【0020】 Among these compounds A, N,N-dimethylpropionic acid amide, N,N-diethylpropionic acid amide, N,N-dimethyl-3-methoxypropionic acid amide, N,N-dimethyl-2-methoxypropionic acid amide, N,N-dimethylisobutyric acid amide, N,N-dimethyl-3-butoxypropionic acid amide, N,N-dimethyl-2-butoxypropionic acid amide, N,N-dimethyl-2-methoxypropionic acid amide, N,N-dimethyl-2-ethoxyacetic acid amide, N,N-diethyl-2-methoxyacetic acid amide, N,N-diethyl-2-ethoxyacetic acid amide, N,N-dimethyl-2-butoxyacetic acid amide, N,N-dimethyl-2-isopropoxyacetic acid amide, N,N-dibutyl-2-methoxyacetic acid amide, N,N-dimethyl-2,2-dimethoxyacetic acid amide, N,N-dimethyl-2-methoxyvaleric acid amide, N,N-dimethyl-2-methyl-3-methoxypropionic acid amide, N,N-diethyl-2-methoxypropionic acid amide, N,N-dimethyl-2-methoxybutyrate amide, N,N-dimethyl-2,4-dimethoxycaproic acid amide, N,N-dimethyl-2,4-dimethoxybutyrate amide, 2-methoxyacetic acid morpholide, N,N-diethyl-3-methoxypropionic acid amide, N,N-dimethyl-2-n-propoxyacetic acid amide, and N,N-diethyl-2-n-protoxyacetic acid amide are particularly preferred. 【0021】 The boiling point of compound A is preferably 170°C to 290°C at 1 atmosphere. When the boiling point of compound A is 170°C or higher, volatilization at room temperature and atmospheric pressure is reduced, and the compositional fluctuations of composition D during storage are minimized, thus improving storage stability. On the other hand, when the boiling point is 290°C or lower, when a composition containing compound A is used as a solvent, excessively high temperatures are not required for drying or solvent removal, allowing for the design of an efficient process. From these viewpoints, the boiling point of A is more preferably 180°C to 280°C, and particularly preferably 190°C to 270°C. 【0022】Compound B in this embodiment is at least one N-monosubstituted amide represented by the following general formula (2). Because this structure has one hydrogen atom bonded to the nitrogen atom of the amide bond, it functions as both a hydrogen bond donor and acceptor between molecules. This is the crucial difference from compound A and is the reason for the unique physical properties of composition D. 【0023】 In the general formula (2) above, R5 represents a linear or branched alkyl group having 1 to 4 carbon atoms. Specifically, it is the same as the examples given for R1 and R2. A methyl group or an ethyl group is particularly preferred from the viewpoint of minimizing steric hindrance to hydrogen bond formation and maintaining appropriate polarity. 【0024】 In the general formula (2) above, R6 and R7 each independently represent a hydrogen atom, a linear or branched alkyl group having 1 to 4 carbon atoms, a linear or branched alkoxy group having 1 to 4 carbon atoms, or a linear or branched alkylene oxyalkyl group having 2 to 4 carbon atoms. Specific examples of these groups are the same as those exemplified for R3 and R4. Hydrogen atoms, methyl groups, ethyl groups, methoxy groups, ethoxy groups, propoxy groups, and methyleneoxymethyl groups are preferred. 【0025】 In the general formula (2) above, R6 and R7 may, together with the hydrocarbon group to which they are bonded, form a saturated 5- to 7-membered ring structure. Examples of such ring structures include saturated or unsaturated cyclic aliphatic hydrocarbon groups, as in the case of R3 and R4 in compound A, and also heterocyclic groups containing any heteroatom. 【0026】In the general formula (2) above, n represents an integer from 0 to 2. When n is 0, the structure is such that R6 and R7 are directly bonded to the carbon adjacent to the carbonyl group, and in this case, R6 and R7 are not both hydrogen atoms. When n is 1 or 2, the structure is such that a methylene chain (-(CH2)n-) is interposed between the carbonyl group and the carbon having substituents R6 and R7. In this case, the -(CH2)n-R6 as a whole may form a branched alkyl group having 3 to 6 carbon atoms, a branched alkoxy group having 3 to 6 carbon atoms, or a branched alkylene oxyalkyl group having 2 to 6 carbon atoms. Specific examples of these groups are the same as those exemplified for -(CH2)m-R3 in general formula (1). 【0027】Specific examples of compound B include a variety of compounds such as: Specifically, acetic acid derivatives such as N-methyl-2-methoxyacetic acid amide, N-ethyl-2-methoxyacetic acid amide, N-methyl-2-ethoxyacetic acid amide, N-ethyl-2-ethoxyacetic acid amide, N-methylpropionic acid amide, N-methyl-3-methoxypropionic acid amide, N-methyl-2-methoxypropionic acid amide, N-methyl-2-ethoxypropionic acid amide, N-methyl-3-ethoxypropionic acid amide, N-methyl-2-methylpropionic acid amide, N-methyl-2-methyl-3-methoxypropionic acid amide, N- Methyl-2-methyl-3-ethoxypropionamide, N-methyl-2-ethylpropionamide, N-methyl-2-ethyl-3-methoxypropionamide, N-ethylpropionamide, N-ethyl-3-methoxypropionamide, N-ethyl-2-methoxypropionamide, N-ethyl-2-ethoxypropionamide, N-ethyl-3-ethoxypropionamide, N-ethyl-2-methylpropionamide, N-ethyl-2-methyl-3-methoxypropionamide, N-ethyl-2-methyl Propionic acid derivatives such as 3-ethoxypropionamide, N-ethyl-2-ethylpropionamide, N-ethyl-2-ethyl-3-methoxypropionamide, N-methylbutyrate, N-methyl-2-methylbutyrate, N-methyl-2-methoxybutyrate, N-methyl-2-ethoxybutyrate, N-methyl-2-ethylbutyrate, N-methyl-2-methyleneoxymethylbutyrate, N-methyl-4-methoxybutyrate, N-methyl-4-ethoxybutyrate, N-methyl-2-methyl-4-methoxybutyrate N-methyl-2-methyl-4-ethoxybutyrate, N-methyl-2-ethyl-4-methoxybutyrate, N-methyl-2-ethyl-4-ethoxybutyrate, N-ethylbutyrate, N-ethyl-2-methylbutyrate, N-ethyl-2-methoxybutyrate, N-ethyl-2-ethoxybutyrate, N-ethyl-2-ethylbutyrate, N-ethyl-2-methyleneoxymethylbutyrate, N-ethyl-4-methoxybutyrate, N-ethyl-4-ethoxybutyrate, N-ethyl-2-methyl-4-methoxybutyrateButyric acid derivatives such as N-ethyl-2-methyl-4-ethoxybutyrate, N-ethyl-2-ethyl-4-methoxybutyrate, N-ethyl-2-ethyl-4-ethoxybutyrate, N-methylvaleramide, N-methyl-2-methylvaleramide, N-methyl-2-ethylvaleramide, N-methyl-2-methyl-5-methoxyvaleramide, N-methyl-2-ethyl-5-methoxyvaleramide, N-ethylvaleramide, N-ethyl-2-methylvaleric acid Examples include amides, valeric acid derivatives such as N-ethyl-2-ethylvaleramide, N-ethyl-2-methyl-5-methoxyvaleramide, and N-ethyl-2-ethyl-5-methoxyvaleramide, and capron derivatives such as N-methylcaproamide, N-methyl-2-methylcaproamide, N-methyl-2-ethylcaproamide, N-ethylcaproamide, N-ethyl-2-methylcaproamide, and N-ethyl-2-ethylcaproamide. 【0028】 Among these compounds B, those that coexist with compound A in a specific proportion and form specific interactions, particularly appropriate hydrogen bonds, between compound A and B or between compounds B themselves, thereby improving the solubility, dispersibility, and storage stability of composition D, are N-methylpropionamide, N-ethylpropionamide, N-methyl-3-methoxypropionamide, N-methyl-2-methoxypropionamide, N-methyl-3-butoxypropionamide, N-methyl-2-butoxypropionamide, N-methyl-2-methoxyacetic acid amide, N-methyl-2-ethoxyacetic acid amide, N-ethyl-2-methoxy C-acetic acid amide, N-ethyl-2-ethoxyacetic acid amide, N-methyl-2-butoxyacetic acid amide, N-ethyl-2-butoxyacetic acid amide, N-butyl-2-methoxyacetic acid amide, N-methyl-2,2-dimethoxyacetic acid amide, N-methyl-4-methoxybutyrate amide, N-methyl-2-methoxyvaleric acid amide, N-methyl-2-methyl-3-methoxypropionic acid amide, N-methyl-2-methoxybutyrate amide, N-isopropyl-3-methoxypropionic acid amide, N-methyl-2-methoxycaproic acid amide, N-methyl-2-n-propoxyacetic acid amide, and N-ethyl-2-n-prothoxyacetic acid amide are particularly preferred. 【0029】 The composition of this embodiment contains compound A and compound B, which have specific structures, as essential components. Although compound A and compound B have similar chemical structures, they have different properties, particularly in their ease of hydrogen bond formation, due to the number of substituents on the nitrogen atom. This difference in properties results in differences in boiling point and polarity (Hansen solubility parameter: HSP value) between the two compounds. When these compounds coexist, a specific interaction, particularly hydrogen bonding, is formed between them, significantly improving the dissolving power, dispersion power, and other properties of composition D, as well as the overall physical and chemical stability of composition D. 【0030】 The difference in boiling points between compound A and compound B at 1 atmosphere is preferably 1 to 120°C in absolute value, more preferably 5 to 100°C, and particularly preferably 15 to 80°C. Here, the difference in boiling points is calculated as an absolute value, and the boiling point of compound A may be higher or lower than that of compound B. When two or more types of compound A or compound B are used in combination, the value with the largest difference in boiling points among all combinations (A1 and B1, A1 and B2, A2 and B1, A2 and B2) where compound A is A1 and A2 and compound B is B1 and B2 is adopted. 【0031】 If the difference in boiling points between compound A and compound B is within the above range, composition D can be expected to exhibit azeotropic behavior when evaporated. This makes it possible to appropriately adjust the evaporation temperature and evaporation rate of the entire composition D, enabling rapid, uniform, and smooth drying in processes such as coating film formation. Furthermore, it prevents the rapid boiling that is likely to occur with a single solvent, resulting in gentle evaporation behavior and avoiding problems in the manufacturing process. This evaporation behavior is presumed to be due to the interaction between compound A and compound B via hydrogen bonds, as described above, which affects the energy barrier of evaporation. In other words, the interaction of molecules with different boiling points via hydrogen bonds allows for a more controlled evaporation process, unlike the vapor pressure behavior of a simple mixture. 【0032】The HSP value is an index proposed by Charles Hansen and is used in various fields to predict affinity and solubility between substances. HSP values ​​can be calculated using commercially available software. In this specification, HSP values ​​were calculated using the Hansen Solubility Parameters in Practice (6th Edition 6.0.04) (HSPiP). The HSP value is calculated using the following three parameters (unit: MPa). 0.5 ) is composed of (units omitted below). δD: Energy derived from intermolecular dispersion forces (London dispersion forces) (dispersion term) δP: Energy derived from intermolecular dipole forces (permanent dipole-permanent dipole interaction) (polarity term) δH: Energy derived from intermolecular hydrogen bonding forces (hydrogen bonding term) 【0033】 The dispersion term (δD) is a parameter that represents the van der Waals forces, which depend on the size and shape of the molecule. Compounds A and B in this embodiment share a common carboxylic acid amide skeleton and have similar molecular sizes, so there is no significant difference in their δD values, and they can be considered almost the same. On the other hand, the polarity term (δP) reflects the magnitude of the molecule's permanent dipole moment, and the hydrogen bonding term (δH) reflects the strength of hydrogen bond donor and acceptor abilities. Compound A is an N,N-disubstituted amide and does not have a hydrogen atom bonded to the nitrogen atom of the amide group, so it does not function as a hydrogen bond donor. In contrast, compound B is an N-monosubstituted amide and has one hydrogen atom bonded to the nitrogen atom of the amide group, so it can function as a hydrogen bond donor. Due to this structural difference, their δP, δH, and the polarity representing their interaction are different. In this invention, the partial HSP value (P-HSP value) is calculated according to the following formula as an indicator of the polarity of the HSP values ​​of both compounds. P-HSP value = ((δP)) 2 +(δH) 2 ) 1 / 2 【0034】The P-HSP value of compound A is preferably from 8.0 to 16.0. When the P-HSP value of compound A is within this range, compound A exhibits amphiphilicity with moderate polarity. As a result, composition D shows excellent solubility and compatibility in high-polarity substances such as water and methanol, and in low-polarity substances such as hexane and xylene. In addition, it can also dissolve well general-purpose resins such as polyester, acrylic resin, polystyrene, polyacrylonitrile, polyvinyl chloride, polyvinyl pyrrolidone, polyvinyl acetate, polycarbonate, polyethersulfone, polysulfone, polyether, polyurethane, etc., and poorly soluble resins such as polyamide, polyimide, polyamideimide, polyesterimide, polyetherimide, polybenzoxazole, polyvinylidene fluoride, etc. 【0035】 Compound A preferably has a total of 5 to 15 carbon atoms in the molecule. When the number of carbon atoms is 5 or more, it has an appropriate molecular size, tends to maintain a liquid state at room temperature, and the flash point also tends to be sufficiently high. When the number of carbon atoms is 15 or less, the molecule is not too large and the viscosity is within an appropriate range. Such compound A easily penetrates into the interior of poorly soluble or poorly dispersible substances (for example, the aggregated structure of high-molecular-weight polymers or the aggregates of pigments), and can dissolve or disperse these substances at a high concentration in a short time. Due to this property, it exhibits excellent performance in the dissolution or dispersion of resins, paints, inks, adhesives, pharmaceuticals, agricultural chemicals, fragrances, pigments, dyes, cellulose derivatives (including particles and fibers, etc.), carbon materials (including carbon nanotubes, carbon fibers, etc.), inorganic particles, organosilicon polymers, and conductive materials, etc. 【0036】The P-HSP value of compound B is preferably 12.0 to 20.0. Compound B is more polar than compound A and exhibits slightly polar amphiphilicity. As a result, composition D shows excellent solubility or compatibility with a wide range of substances, from highly polar substances such as water, methanol, and ethylene glycol to typical moderately polar substances such as acetone, ethyl acetate, and tetrahydrofuran. In particular, compound B has high affinity and solubility for resin precursors and intermediates containing polar functional groups such as carbonyl groups and amino groups, such as polyimide precursors (polyamic acid), polyamideimide precursors, polyesterimide precursors, polyetherimide precursors, and polybenzoxazoles. For this reason, composition D can be suitably used as a solvent during polymerization reactions of these high-performance resins and as a diluent for the resulting varnish. 【0037】 Compound B preferably has a total of 4 to 13 carbon atoms in its molecule. When the number of carbon atoms is 4 or more, it has an appropriate molecular size and is easy to maintain in a liquid state at room temperature. When the number of carbon atoms is 13 or less, it is easy to adjust the compatibility with compound A. In addition, the molecule is not too large and the viscosity is within an appropriate range. Such compound B easily penetrates into the interior of poorly soluble or poorly dispersed substances, and can dissolve or disperse these substances at high concentrations in a short time. Furthermore, within this range of carbon atoms, the boiling point and polarity (P-HSP value) of compound B, as described later, are well balanced, and it is easy to exhibit suitable interactions with compound A. 【0038】In the composition of this embodiment, the difference in the P-HSP values of Compound A and Compound B is preferably 0.1 to 12.0. When the difference in the P-HSP values is within this range, Compound A and Compound B are likely to form an appropriate interaction. As a result, the stability of the entire Composition D is improved. The difference in the P-HSP values is more preferably 0.5 to 10.0, and particularly preferably 1.0 to 8.0. When two or more types of Compound A are used in combination (for example, Compound A1 and Compound A2), the P-HSP value of the mixed Compound A is calculated by the following formula based on the mass ratios of Compound A1 and A2 (mass % of Compound A1 and A2 in the mixed Compound A). The same calculation is performed when two or more types of Compound B are used in combination. δP of the mixed Compound A = mass % of A1 × δP(A1) + mass % of A2 × δP(A2) δH of the mixed Compound A = mass % of A1 × δH(A1) + mass % of A2 × δH(A2) P-HSP value of the mixed Compound A = ((δP of the mixed Compound A) 2 +(δH of the mixed Compound A) 2 ) 1 / 2　 【0039】Composition D may contain solvent C, depending on its application, to the extent that it does not impair the effects of the present invention. Solvent C may include aromatic hydrocarbon solvents such as toluene, xylene, ethylbenzene, and tetralin; aliphatic hydrocarbon solvents such as cyclohexane, n-hexane, heptane, n-octane, and isononane; diethyl ether, diisopropyl ether, dibutyl ether, ethylene glycol monomethyl ether, diethylene glycol monomethyl ether, ethylene glycol dimethyl ether, diethylene glycol dimethyl ether, ethylene glycol monoethyl ether, diethylene glycol monoethyl ether, ethylene glycol diethyl ether, diethylene glycol diethyl ether, ethylene glycol monobutyl ether, diethylene glycol monobutyl ether, propylene glycol monoethyl ether, dipropylene glycol monoethyl ether, propylene glycol dimethyl ether, dipropylene glycol dimethyl ether, propylene glycol monobutyl ether, dipropylene glycol monobutyl ether, ethylene glycol monomethyl ether acetate, di Ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, diethylene glycol monoethyl ether acetate, ethylene glycol monobutyl ether acetate, diethylene glycol monobutyl ether acetate, dialkylene (C2-C4) glycol, dialkylene (C2-C4) glycol monoalkyl (C2-C4) ether, trialchilen (C2-C4) glycol, trialchilen (C2-C4) glycol monoalkyl Ether-based solvents such as (C2-C4) ethers, polyalkylene (C2-C4) glycols, polyalkylene (C2-C4) glycol monoalkyl (C2-C4) ethers, 1,4-dioxane, 2-methyltetrahydrofuran, cyclopentyl methyl ether, 4-methyltetrahydropyran, 1,3-dioxolane; water; alcohol-based solvents such as methanol, ethanol, propanol, isopropanol, butanol, t-butanol, ethylene glycol, propylene glycol, and glycerin;Lactone-based solvents such as β-propiolactone, γ-butyrolactone, α-acetyl-γ-butyrolactone, γ-valerolactone, δ-valerolactone, ε-caprolactone, N-methyl-ε-caprolactam; ester-based solvents such as ethyl acetate, butyl acetate, 2-ethoxyethyl acetate, 2-butoxyethyl acetate, ethyl acetoacetate, isoamyl acetate, n-pentyl acetate, ethyl propionate, ethyl lactate, butyl lactate, ethyl benzoate; ketone-based solvents such as acetone, methyl ethyl ketone, methyl isobutyl ketone, cyclopentanone, cyclohexanone; Examples include sulfinyl solvents such as methyl sulfoxide (DMSO), methyl ethyl sulfoxide, and tetramethylene sulfoxide; and amide solvents such as tetramethylurea, hexamethylphosphoramide, N-dimethylpropyleneurea, trimethyl phosphate, 1,3-dimethyl-2-imidazolidinone, N,N-dimethylimidazolidinone, acetonitrile, N-methyl-2-pyrrolidone (NMP), N-ethyl-2-pyrrolidone (NEP), N-butyl-2-pyrrolidone (NBP), dimethylformamide (DMF), and dimethylacetamide (DMAC). 【0040】 By adding solvent C, it becomes possible to reduce costs, fine-tune viscosity, control drying speed, and further improve solubility in specific resins. These solvents C may be used alone or in combination of two or more. However, considering the objectives of the present invention, it is preferable to avoid or limit the use of solvents such as NMP, NEP, NBP, DMF, and DMAC, which are of concern due to their reproductive toxicity. 【0041】 The content of solvent C in composition D is adjusted according to the application, but is preferably 99% by mass or less, and more preferably 70% by mass or less, relative to the total composition D. 【0042】Composition D may contain additives E. Various substances can be used as additives E to improve the performance of composition D or to impart specific functions. Specific examples include evaporation control agents, thickeners, surfactants, leveling agents, defoamers, wetting agents, surface modifiers, antioxidants, heat stabilizers, light stabilizers, color inhibitors, UV absorbers, preservatives, silane coupling agents, adhesion enhancers, dehydrating agents, and the like. These additives E may be used individually or in combination of two or more types. 【0043】 The content of additive E in composition D is not particularly limited and is appropriately selected according to its type and purpose. Generally, it is preferably 0.0005 to 10% by mass of the total composition D, and more preferably 0.001 to 5% by mass, depending on the application of composition D. 【0044】 Composition D of this embodiment contains an N,N-disubstituted amide (compound A) and an N-monosubstituted amide (compound B), and can be used as a solvent, dispersant, diluent, cleaning agent, or release agent. Due to the unique interaction between compounds A and B, it exhibits high compatibility or dispersibility with water, organic compounds, inorganic compounds, and various resins. Compositions with such properties have excellent wettability to substrates, penetration into materials, swelling properties of resins, release properties of unwanted substances, and particle dispersibility. For this reason, composition D can be used very suitably as a solvent, diluent, dispersant, cleaning agent, release agent, liquid crystal alignment agent, electrolyte, etc. in the various materials or technical fields detailed below, and can significantly improve the properties of the final product containing them. 【0045】Composition D, due to its excellent solubility, can be used as a solvent in a wide range of applications. Specifically, it is used for dissolving, diluting, or dispersing resins, paints, inks, adhesives, pharmaceuticals, pesticides, fragrances, pigments, dyes, cellulose derivatives, organosilicon polymers, and conductive materials. It is also useful as a reaction solvent in the synthesis reactions of resins and their precursors. In particular, in polycondensation reactions of polyimides, polyamideimides, polyesterimides, polyetherimides, polybenzoxazoles, polyurethanes, epoxy resins, phenolic resins, etc., it can efficiently dissolve raw materials, allow the reaction to proceed smoothly, and maintain the resulting oligomers and polymers in a stable soluble state. Furthermore, it is suitable for the synthesis of polystyrene, polyvinyl chloride, polyvinyl acetate, polyvinylpyrrolidone, polyacrylonitrile, polyamides, polyesters, polycarbonates, polyethers, polysulfones, polyethersulfones, cellulose derivatives, organosilicon polymers, and conductive polymers, as well as their precursors. 【0046】 Composition D can be used as a solvent in photosensitive resin compositions, temporary protective film resin compositions, protective film resin compositions, paint resin compositions, etching agent liquid compositions, binder resin compositions, photoresist resin compositions, encapsulant resin compositions, adhesive resin compositions, chemical mechanical polishing slurry compositions, and various binder resin compositions. In this case, it is possible to stably dissolve or disperse the functional components contained in the composition, improving coatability and storage stability. Furthermore, it is also ideal as a solvent in the formation or manufacturing processes of various coatings, films, patterns, members, and devices. For example, it can be used in the formation of polyimide films, semiconductor substrates, flexible substrates, cured relief pattern films, wiring patterns, printed patterns, insulating films, protective films, separation films, gas barrier films, and sliding members. It can also be used as a solvent for purposes such as material supply, processing, and cleaning in various steps in the manufacturing processes of semiconductors, electronic devices, electrodes, flexible devices, sensors, and displays. 【0047】Composition D also functions as an excellent dispersant. It can be used to uniformly and stably disperse particles of resins, paints, inks, adhesives, pharmaceuticals, pesticides, fragrances, pigments (titanium dioxide, carbon black, etc.), dyes, cellulose derivatives (cellulose nanofibers, etc.), organosilicon polymers, conductive materials (copper nanoparticles, silver nanowires, conductive polymers, etc.), and carbon materials (carbon nanotubes, graphene, etc.) in a liquid medium. Furthermore, composition D adsorbs to the surface of particles, preventing re-aggregation of particles through steric and electrical repulsion, making it possible to prepare a stable dispersion with low viscosity and high concentration. 【0048】 Composition D is also suitable as a diluent for adjusting the viscosity of high-concentration resin varnishes, paints, inks, adhesives, etc. Composition D has high compatibility with existing solvents in resin varnishes, paints, inks, and adhesives, and excellent viscosity-reducing ability, allowing for easy adjustment to a viscosity suitable for coating, printing, and other applications. Furthermore, when added as a diluent, it does not impair the stability of the dissolved resin; in fact, it can even be expected to improve storage stability. Examples of applicable compositions include resins, paints, inks, adhesives, pharmaceuticals, pesticides, fragrances, pigments, dyes, cellulose derivatives, organosilicon polymers, and conductive materials. 【0049】 Composition D possesses dissolving power and, consequently, high penetrating power, making it suitable for use as a powerful cleaning agent. It can be used to clean a very wide range of items, including manufacturing equipment (reaction vessels, piping, etc.), manufacturing tools (jigs, pallets, etc.), industrial products, industrial parts, plastic molded products, metal parts, electronic components (printed circuit boards, semiconductor wafers, etc.), filters for recording devices, three-dimensional molded objects, resin particles, inkjet printer nozzles, and liquid flow paths in ink cartridges. Furthermore, it exhibits excellent effectiveness in cleaning various process residues and ink residues that are difficult to remove, such as photoresist residue and etching residue generated in semiconductor manufacturing processes (semiconductor process residues), resin processing residue adhering to molds during resin molding, electrode slurry residue in battery manufacturing processes (battery manufacturing residues), and hardened ink residue in printing processes (printing ink residues). 【0050】Composition D has excellent ability to swell resin films and the like, reducing their adhesion to the substrate, and can therefore be used as an effective release agent. For example, it can be used to remove organic coating layers applied to the surface of plastic molded products, to remove support materials (usually acrylic or wax-based resins) in three-dimensional objects (3D printed products) produced by stereolithography, and to remove (lift off) photoresist films formed on semiconductor wafers or metal thin films. It is also effective for removing cured products such as UV-curing resins, polyimide resins, urethane resins, and epoxy resins, to remove battery binders (polyvinylidene fluoride: PVDF) that bond the positive and negative electrode active material layers to the current collector foil in the dismantling and recycling of secondary batteries, and to remove conductive ink residue that has clogged screen printing. 【0051】 Composition D can be used to prepare high-quality resin varnishes by compounding it with known resins, particularly poorly soluble resins. It is especially suitable for obtaining varnishes of high-performance polymers with excellent heat resistance and electrical insulation properties, such as polyimide varnishes, polyamideimide varnishes, polyesterimide varnishes, polyetherimide varnishes, and polybenzoxazole varnishes. By using Composition D, a high molecular weight, uniform resin varnish can be easily obtained. 【0052】 The aforementioned resin varnish can be developed into various functional resin compositions by itself or in combination with other components. Specifically, it can be used in a wide range of applications, such as photosensitive resin compositions, temporary protective film compositions used for temporary fixing of electronic components, insulating film forming compositions used for interlayer insulating films of semiconductors, resin compositions for paints such as heat-resistant paints, encapsulant compositions for sealing semiconductor chips, binder resin compositions for holding various fillers, resin compositions for printing inks, or adhesive compositions for joining dissimilar materials. By containing composition D, these resin compositions exhibit high uniformity, excellent coatability and moldability, and contribute to improving the performance of the final product. 【0053】The aforementioned resin composition, particularly the resin varnish, can be processed into various forms of products through processes such as coating, drying, and heating. For example, by forming a coating of the resin composition on a substrate, removing the solvent by heating, and proceeding with a curing reaction (e.g., imidization) as needed, high-quality films and sheets can be obtained. Specifically, examples include polyimide films and polyimide sheets, insulating protective films for semiconductor devices, alignment films for liquid crystal displays, pixel separation films (bank films) or heat-resistant protective films for organic EL displays, flexible electronic substrate films, copper-clad laminate films, laminate films, electrical insulating films, porous films for fuel cells, separation films, insulating coatings, heat-resistant coatings, IC packages, adhesive films, liquid crystal alignment films, resist films, planarization films, microlens array films, wire coating films, and optical fiber coating films. By using composition D, it is possible to manufacture films with low residual stress, smoothness, and uniformity. 【0054】 Polymer particles such as polyimide particles can be produced from resin composition D by processing it using known methods such as spray drying or reprecipitation, and then heating it. Composition D allows for easy control of particle shape (e.g., sphericity) and particle size distribution, contributing to the acquisition of uniform particles. The resulting polymer particles can be used in electrical and electronic materials such as powder toner additives for image forming, coating materials for electrical insulating components, molding fillers, and liquid crystal spacers, as well as in composite materials such as additives for heat-resistant paints and lubricants. 【0055】 Furthermore, a metal laminate can be manufactured by forming a coating film of the aforementioned resin composition on a metal substrate, and then heating and pressing it. As the metal substrate, foils or plates made of one or more metals selected from copper, iron, nickel, chromium, aluminum, silver, gold, titanium, palladium, platinum, molybdenum, tungsten, tantalum, zirconium, cobalt, and their alloys can be used. Since this composition also has excellent wettability to the metal substrate, it is possible to obtain a metal laminate with high adhesion between the resin layer and the metal substrate (for example, a copper-clad laminate that serves as a base material for a flexible printed circuit board). 【0056】Due to its unique physical properties, this composition can be suitably used in even more specialized applications. For example, in the manufacture of liquid crystal displays, it can be used as a solvent for liquid crystal alignment agents used to dissolve alignment film materials such as polyimide and coat them onto glass substrates. By using this composition, a uniform alignment film with few defects can be formed, contributing to improved display quality. Furthermore, in the manufacture of secondary batteries such as secondary batteries and next-generation batteries, it can be used as a solvent for non-aqueous electrolytes used to dissolve electrolytic salts (such as LiPF6). This composition has a high boiling point and chemical stability, and dissolves electrolytic salts well, potentially contributing to improved battery cycle characteristics and safety. 【0057】 Composition D can be incorporated in any amount depending on the application and method of use into various products such as resins, solvents for paints and inks, diluents, dispersants, solvents for chemical reactions or resin synthesis, cleaning agents, release agents, liquid crystal alignment agents, and electrolytes for secondary battery manufacturing. From the viewpoint of effectively exhibiting the performance of the product, the amount of composition D incorporated in the final product is preferably 5% by mass or more, more preferably 10% by mass or more, and particularly preferably 20% by mass or more. 【0058】 Specifically, there is a preferred range of composition D content depending on the application. As a solvent for resins, paints, and inks, it is preferable to contain 10 to 99% by mass of composition D in the total solution; as a diluent, 20 to 95% by mass of composition D in the total diluent; and as a dispersant medium, 30 to 99.9% by mass of composition D in the total dispersion. As a solvent for chemical reactions or resin synthesis, it is preferable to contain 10 to 85% by mass of composition D in the total solution; as a liquid crystal alignment treatment solution, 10 to 90% by mass of composition D in the total solution; and as a non-aqueous electrolyte for secondary battery manufacturing, it is preferable to contain 15 to 100% by mass of composition D in the total electrolyte. To maximize the effect of composition D, when used as a cleaning solution or stripping solution, it is preferable to use composition D at 5 to 100% by mass, that is, composition D alone or as the main component. 【0059】When composition D is used as a solvent for resins, it has high solubility for poorly soluble resins such as urethane resins, polyester resins, epoxy resins, polyamide resins, polyimide resins, polyamideimide resins, polyetherimide resins, polybenzoxazole resins, acrylic resins, and fluororesins, thus enabling the production of a uniform resin solution without gelation or insoluble matter. 【0060】 When composition D is used as a paint composition, it exhibits good affinity (wettability) to both polar and non-polar substrate surfaces, thus preventing paint repellency and unevenness, and enabling the formation of a smooth coating. Furthermore, it also has the effect of improving adhesion to the substrate, so when combined with urethane paints, acrylic paints, etc., it is possible to obtain a highly durable coating with excellent weather resistance, chemical resistance, and abrasion resistance. 【0061】 When composition D is used as an ink solvent, it possesses both appropriate drying properties and high solubility for pigments and dyes, resulting in good ink ejection, print stability, and storage stability. Furthermore, it exhibits high adhesion to various printing media such as paper and film, and allows for the creation of an ink composition that achieves both high-definition image quality with minimal bleeding and excellent printability. Moreover, the resulting printed materials dry uniformly, resulting in a beautiful finish free from gloss unevenness and printing inconsistencies. 【0062】 Furthermore, when composition D is also used as a solvent for inkjet recording inks, its high dissolving power allows for low ink viscosity even when pigments and dyes are blended at high concentrations. This reduces nozzle clogging, maintains stable ink ejection even during high-speed printing, and makes it possible to obtain an inkjet composition that is easy to handle. 【0063】When composition D is used as an adhesive resin composition, it can firmly bond dissimilar materials such as plastic materials and metal materials, or plastic materials to each other, or metal materials to each other. Composition D slightly swells the surface of the adherends to enhance the anchoring effect and further improves wettability at the interface, thereby increasing the strength of the adhesive interface. As a result, when combined with urethane adhesives, epoxy adhesives, fluorine-based epoxy adhesives, etc., it is possible to obtain highly durable bonded structures that can withstand thermal cycling and chemicals. 【0064】 When composition D is used as a liquid crystal alignment agent or electrolyte, its high purity, chemical stability, and solubility allow for the production of high-quality liquid crystal alignment films or secondary batteries. In particular, when used as a solvent for the synthesis of resins such as polyimide and polyamide-imide, the raw materials, reaction intermediates, and resulting polyamic acid precursors of these resins all exhibit high affinity for composition D. Furthermore, when performing film formation and dehydration imidization by dehydration heating using the resulting precursor solution, composition D, with its controlled boiling point difference, is removed from the coating at an appropriate temperature and rate, thereby suppressing stress generation within the film. This makes it possible to efficiently obtain high-quality polyimide films for photosensitive resins, polyamide-imide coatings for high heat-resistant paints, and the like. 【0065】 By using the composition of this embodiment, surface smoothness is improved in coatings, sliding members, insulating films, protective films, polyimide films, etc., and internal uniformity without cracks or voids can be obtained. Furthermore, adhesive layers, adhesives, liquid crystal alignment films, electronic devices, electrodes, flexible devices, semiconductor substrates, wiring board laminates, and semiconductor devices manufactured using these compositions have high quality characteristics required for their respective applications (e.g., electrical properties, mechanical strength, transparency, heat resistance, etc.), resulting in uniform, highly sensitive, and high-performance products. 【0066】 The present invention will be described in more detail below with reference to examples and comparative examples, but the present invention is not limited to these examples. In the following, "parts" and "%" all refer to mass unless otherwise specified. 【0067】The N,N-disubstituted amides (Compound A) and N-monosubstituted amides (Compound B) used in the examples and comparative examples are shown in Table 1 and Table 2, respectively. The boiling points of Compound A and Compound B and the calculation of partial HSP (P-HSP) values were performed by the following methods. 【0068】 (Measurement of boiling point) Exactly 10 mg of Compound A or Compound B was weighed and sealed in a pressure-resistant sealed cell, and the boiling point was measured using a differential scanning calorimeter (DSC-60Plus, manufactured by Shimadzu Corporation). Each sample was measured three times, and the average value was taken as the boiling point of Compound A and Compound B under 1 atm. 【0069】 (Calculation of P-HSP value) The P-HSP values of Compound A and Compound B were calculated from three parameters calculated using computer software HSPiP (Hansen Solubility Parameters in Practice, 6th Edition 6.0.04), and the polar term (δP) and hydrogen bond term (δH) were extracted and calculated by the following formula (unit: MPa 0.5 ). P-HSP value = ((δP 2 ) + (δH 2 )) 1 / 2 (MPa 0.5 ) 【0070】 【0071】 【0072】 The solvents C and additives E used in the examples and comparative examples are as follows. C-1: 1,3-Dimethyl-2-imidazolidinone C-2: γ-Butyrolactone C-3: γ-Valerolactone C-4: Dimethyl sulfoxide C-5: Ethylene glycol monobutyl ether C-6: Dipropylene glycol dimethyl ether C-7: Propylene glycol monobutyl ether C-8: Xylene C-9: 4-Methyltetrahydropyran C-10: Cyclopentyl methyl ether C-11: N-Butyl-2-pyrrolidone C-12: N-Methyl-2-pyrrolidone C-13: Isopropanol E-1: 2,6-Di-t-butyl-4-methylphenol E-2: 2,2,6,6-Tetramethylpiperidine-1-oxyl E-3: Guanidine hydrochloride 【0073】 (Preparation of Compositions) Compound A, Compound B, Solvent C, and Additive E were placed in a 500 mL beaker in the proportions shown in Table 3 and stirred at 25°C for 30 minutes using a magnetic stirrer. 200 g each of compositions D-1 to D-30 and compositions F-1 to F-4 were obtained. For composition D, the P-HSP values ​​and the difference in boiling points between Compound A and Compound B were calculated and are shown in Table 3. 【0074】 【0075】 Examples 1-30 (Composition D) and Comparative Examples 1-4 (Composition F) (Compatibility Evaluation) Each composition (D-1 to D-30 and F-1 to F-4) was mixed with an equal mass of organic solvent (shown in Table 4), water (neutral, pH=7), or acrylic monomer (shown in Table 4). Mixing was carried out using a magnetic stirrer at 25°C for 30 minutes. The resulting mixture was visually observed, and compatibility was evaluated according to the following criteria. The evaluation results are shown in Table 4. ○: No phase separation or turbidity was observed; the mixture was completely dissolved and transparent. △: Slight turbidity was observed. ×: Phase separation or significant turbidity was observed. 【0076】 (Solubility Evaluation) Each composition was mixed with a general-purpose resin or a poorly soluble resin (shown in Table 4) in a mass ratio of 10:1. Mixing was carried out by stirring at 150°C for 2 hours. After the resulting mixture was allowed to stand at 25°C for 24 hours, the solubility of the mixture was observed visually and evaluated according to the following criteria. The evaluation results are shown in Table 4. ◎: No insoluble matter observed, clear and uniform state 〇: No insoluble matter observed, slight turbidity observed △: Partially insoluble matter or overall turbidity observed ×: Not dissolved 【0077】(Accelerated storage stability test and storage stability evaluation) Each composition was left standing in a constant temperature oven set to 100°C for 240 hours. The amounts of compound A and compound B in the composition before and after heating were analyzed using liquid chromatography (LC) or gas chromatography (GC). The purity retention rate of compound A and compound B was calculated using the following formula, and the storage stability of the composition was evaluated according to the following criteria. The evaluation results are shown in Table 4. Purity retention rate (%) = (Purity before heating - Purity after heating) / Purity before heating × 100 ◎: Purity retention rate of both compound A and compound B is 98.0% or higher ○: The purity retention rate of either compound A or compound B is 98.0% or higher, and the other is 95.0% or higher but less than 98.0% △: Purity retention rate of both compound A and compound B is 95.0% or higher but less than 98.0% ×: Purity retention rate of both compound A and compound B is less than 95.0% 【0078】 【0079】 The results in Tables 3-4 show that compositions D-1 to D-30 of Examples 1-30 exhibited excellent compatibility with water, various organic solvents ranging from hydrophilic to hydrophobic, and acrylic monomers, and further demonstrated high solubility in various resins, from general-purpose resins to poorly soluble resins. In addition, accelerated storage stability tests showed that composition D of Examples had good stability. On the other hand, compositions F-1 to F-4 of Comparative Examples 1-4 showed some good compatibility with water, hydrophilic or hydrophobic organic solvents, and general-purpose acrylic monomers, but none showed good compatibility in all aspects. Furthermore, the comparative examples had low solubility in various resins, and their storage stability was not entirely satisfactory. These results suggest that the interaction between compound A and compound B improves the permeability and stability of composition D, thereby improving its solubility. 【0080】Examples 31-41 and Comparative Examples 5-8 (Preparation of Cellulose Nanofiber Dispersion) 40 g of the prepared composition D or F, 4 g of cellulose nanofiber (KC Floc W-300F, manufactured by Nippon Paper Industries Co., Ltd.), and 160 g of zirconia beads (particle size 0.5 mm) were added to the vessel of a wet bead mill apparatus (RMB-08, manufactured by AIMEX Corporation), and the mixture was treated with a bead mill by operating at 25°C and 1000 rpm for 90 minutes. The beads were then separated to obtain a cellulose nanofiber dispersion. 【0081】 (Evaluation of dispersibility of cellulose nanofiber dispersions) The obtained cellulose nanofiber dispersions were observed visually, and their dispersibility was evaluated according to the following criteria. The evaluation results are shown in Table 5. ◎: No aggregates were observed, and the dispersion was transparent. ○: No aggregates were observed, but it was slightly cloudy. △: A small amount of aggregates was observed. ×: Significant aggregates were observed. 【0082】 (Stability evaluation of cellulose nanofiber dispersions) The obtained cellulose nanofiber dispersions were stored at 40°C for one week, and then observed visually. The stability was evaluated according to the following criteria, compared to the state before storage. The evaluation results are shown in Table 5. ◎: Uniform immediately after dispersion, and no change was observed before and after storage. ○: Uniform immediately after dispersion, but slight aggregates were observed after storage. △: Slight aggregates were observed immediately after dispersion, and the amount of aggregates increased after storage. ×: Numerous aggregates were observed immediately after dispersion, and a uniform dispersion could not be obtained. 【0083】 【0084】As shown in Table 5, in Examples 31 to 41, when cellulose nanofiber dispersions were prepared using composition D, the cellulose nanofibers were highly dispersed, and a dispersion with excellent stability was obtained. This is because the coexistence of compound A and compound B resulted in interaction between them, improving the dispersion behavior. Furthermore, the balance of solubility parameters in the solvent system, such as the difference in boiling points and / or P-HSP values ​​within a specific range between compound A and compound B, was optimized, resulting in a stable dispersion in which aggregation was suppressed even after storage. On the other hand, the compositions of Comparative Examples 5 to 8 contained only either compound A or compound B, and therefore their dispersion power was insufficient. As a result, their dispersibility with respect to cellulose nanofibers was low, and significant aggregation was observed after storage at 40°C for one week. 【0085】 Examples 42-52 and Comparative Examples 9-12 (Preparation of Titanium Dioxide Dispersion) Using a paint conditioner, 90 g of the prepared composition D or F, 10 g of rutile-type titanium dioxide (JR-806, manufactured by Teika Co., Ltd.), and 400 g of zirconia beads (particle size 0.5 mm) were mixed and dispersed at 25°C for 30 minutes to obtain a white pigment dispersion. 【0086】 (Evaluation of Dispersibility of White Pigment Dispersion) The obtained white pigment dispersion was observed visually, and its dispersibility was evaluated according to the following criteria. The evaluation results are shown in Table 6. ◎: The dispersion was uniform overall, and no granular or streaky particles were observed. ○: The dispersion was uniform overall, and a small amount of granular or streaky particles were observed. △: The dispersion was almost uniform overall, and granular or streaky particles were observed. ×: Significant aggregates were observed. 【0087】 (Stability evaluation of white pigment dispersion) The obtained white pigment dispersion was stored at 25°C for one week, and then observed visually. Its stability was evaluated according to the following criteria, compared to its state before storage. The evaluation results are shown in Table 6. ◎: No change was observed before and after storage. ○: A slight increase in granular or streaky particles was observed after storage. △: Aggregates were observed after storage. ×: Large aggregates were observed after storage, and the liquid separated into two layers. 【0088】 【0089】 As shown in Table 6, in Examples 42 to 52, titanium dioxide particle dispersions were prepared using composition D. By including both compound A and compound B, high dispersibility was observed, and titanium dioxide particle dispersions (white pigment dispersions) with excellent dispersion stability were obtained. This is because the coexistence of compound A and compound B resulted in interactions between them, leading to improvements in dispersion behavior that cannot be obtained with either compound alone. Furthermore, the difference in boiling points and / or P-HSP values ​​between compound A and compound B within a specific range optimizes the balance of volatilization behavior and solubility parameters in the dispersion system. As a result, aggregation of titanium dioxide particles was suppressed, and the dispersion maintained its uniformity even after being stored at 25°C for one week, confirming good storage stability. On the other hand, in the compositions of Comparative Examples 9 to 12, the dispersibility improvement effect was insufficient because they contained only one of compound A or compound B, or neither. As a result, aggregation of titanium dioxide particles progressed significantly during storage, and a stable dispersion could not be obtained. 【0090】 Examples 53-57 and Comparative Examples 13-14 (Preparation of Colored Ink Compositions) Using a bead mill, 84.5 g of the prepared composition D or F, 5 g of pigment (spherical carbon black: average particle size 24 nm), 10 g of resin (styrene-acrylic copolymer), and 0.5 g of surfactant (polyoxyethylene alkyl ether) were mixed and dispersed to obtain a colored ink composition. 【0091】(Pigment Dispersibility Evaluation) The average particle size (D50) of the pigment in the colored ink composition immediately after preparation was measured using a dynamic light scattering particle size distribution analyzer (NanoTrac Wave, MicroTrac-Bel). The colored ink composition was then stored in a 70°C constant temperature bath for two weeks, and the average particle size was measured again after storage. The initial particle size and the particle size increase rate were calculated, and the pigment dispersibility of the colored ink composition was evaluated according to the following criteria. The evaluation results are shown in Table 7. ◎: Initial particle size is less than 150 nm, and the particle size increase rate after storage is less than 5% ○: Initial particle size is less than 150 nm, and the particle size increase rate after storage is 5% or more and less than 10% △: Initial particle size is 150 nm or more and less than 250 nm, or the particle size increase rate after storage is 10% or more ×: Initial particle size is 250 nm or more, or precipitation was observed after storage. 【0092】 (Viscosity Change Rate Evaluation) The colored ink composition was sealed in a glass bottle and stored in a constant temperature bath at 70°C for two weeks. An E-type viscometer (TVE-22L, manufactured by Toki Sangyo Co., Ltd.) was used to measure the ink viscosity before and after storage at 25°C. The viscosity change rate was calculated using the absolute value of the following formula, and the viscosity change rate of the colored ink was evaluated according to the following criteria based on the calculated viscosity change rate. The evaluation results are shown in Table 7. Note that a lower viscosity change rate indicates higher storage stability of the colored ink composition. Viscosity Change Rate (%) = |(Viscosity after storage - Viscosity before storage)| / Viscosity before storage × 100 ◎: Absolute value of viscosity change rate is less than 3% ○: Absolute value of viscosity change rate is 3% or more and less than 5% △: Absolute value of viscosity change rate is 5% or more and less than 10% ×: Absolute value of viscosity change rate is 10% or more or gelled. 【0093】(Ejection Stability Evaluation) A colored ink composition was filled into an ink cartridge of a commercially available inkjet printer. 100 full-surface solid images were continuously printed on A4 size plain paper from the printer head nozzles (600 dpi, 384 nozzles) at 25°C and 60% RH. During printing, nozzle clogging was visually checked, and printing was stopped and cleaning operations performed when nozzle clogging was confirmed. The number of times this was done was recorded as the "number of clogging occurrences". The ejection stability of the colored ink was evaluated according to the following criteria, and the results are shown in Table 7. ◎: 0 clogging occurrences ○: 1 or 2 clogging occurrences △: 3 or more but less than 5 clogging occurrences ×: 5 or more clogging occurrences or failure to eject after 10 or fewer prints. 【0094】 Examples 58-62 and Comparative Examples 15-16 (Preparation of Clear Ink Compositions) Using a magnetic stirrer, 79.8 g of the prepared composition D or F, 20 g of resin (acrylic resin, on a solids basis), and 0.2 g of leveling agent (silicone-based) were mixed at 25°C for 30 minutes. The mixture was then filtered through a membrane filter with a pore size of 0.5 μm to obtain a clear ink composition. 【0095】 (Storage Stability Evaluation) The viscosity of the clear ink composition immediately after preparation was measured at 25°C using an E-type viscometer (TVE-22L, manufactured by Toki Sangyo Co., Ltd.). Subsequently, the clear ink composition was sealed in a glass bottle and stored in a constant temperature bath at 60°C for 4 weeks, after which the viscosity was measured again. The viscosity change rate using absolute values ​​was calculated using the following formula, and the storage stability of the clear ink composition was evaluated according to the following criteria based on the calculated viscosity change rate. The evaluation results are shown in Table 7. Note that a lower viscosity change rate indicates higher storage stability of the clear ink composition. Viscosity Change Rate (%) = |(Viscosity after storage - Viscosity before storage)| / Viscosity before storage × 100 ◎: Absolute value of viscosity change rate is less than 5% ○: Absolute value of viscosity change rate is 5% or more and less than 10% △: Absolute value of viscosity change rate is 10% or more and less than 20% ×: Absolute value of viscosity change rate is 20% or more, or gelation or turbidity was observed. 【0096】(Evaluation of coating adhesion) A clear ink composition was applied to a PET film using a bar coater, and a coating film with a thickness of approximately 5 μm was prepared by drying it in an 80°C oven for 3 minutes. A cross-cut test was performed on the obtained coating film in accordance with JIS K 5600-5-6. 100 grid-like cuts were made in the coating film at 1 mm intervals using a utility knife, cellophane tape was applied over the cuts, and after peeling it off in one go, the number of remaining sections was counted to evaluate the adhesion of the coating film according to the following criteria. The evaluation results are shown in Table 7. ◎: 100 / 100 remaining sections ○: 95 / 100 or more and less than 100 / 100 remaining sections △: 80 / 100 or more and less than 95 / 100 remaining sections ×: Less than 80 / 100 remaining sections 【0097】 (Evaluation of scratch resistance of the coating film) The surface of the coating film obtained in the same manner as in the (evaluation of adhesion of the coating film) was tested using steel wool (#0000) at a rate of 1 kg / cm². 2 The surface was rubbed back and forth 10 times while applying a load. The condition of scratches on the surface of the coating after rubbing was visually observed, and the scratch resistance of the coating was evaluated according to the following criteria. The evaluation results are shown in Table 7. ◎: No scratches were observed at all. ○: Very slight scratches were observed. △: Obvious scratches were observed. ×: The coating was scraped off or many deep scratches were observed. 【0098】 【0099】The results in Table 7 show that the compositions of Examples 53 to 62 contained both Compound A and Compound B, yielding a colored ink composition exhibiting good pigment dispersibility and a clear ink composition with excellent storage stability. Furthermore, evaluation of the colored ink compositions confirmed that the inclusion of the composition from the Examples resulted in uniform dispersion of the pigment in the ink, as well as uniform dissolution of other components, leading to high ink discharge stability. Evaluation of the clear ink compositions also showed that the inclusion of the composition from the Examples resulted in uniform dissolution of each component in the ink, yielding a uniform coating film with few defects, and exhibiting high adhesion and scratch resistance. On the other hand, in the comparative examples, the dispersion of the pigment and / or dissolution of each component was insufficient, and good results could not be obtained in terms of discharge stability, coating film adhesion, and scratch resistance. 【0100】 Examples 63-76 and Comparative Examples 17-18 (Synthesis of Polyimide Precursor Varnish) A 1000 mL four-necked flask was used and equipped with a stirring rod, thermometer, dropping funnel, and nitrogen gas inlet tube. 350 g of the prepared composition D or F was added, and 25.0 g (125 mmol) of 4,4'-diaminodiphenyl ether was added as the diamine compound. The mixture was stirred at 20°C for 30 minutes under a nitrogen atmosphere. Next, the solution was maintained at 20°C, and 37.8 g (128 mmol) of 3,3',4,4'-biphenyltetracarboxylic acid dianhydride was gradually added as the acid dianhydride. After the addition, stirring was continued for another hour. Then, the mixture was cooled to 25°C, and composition D or F was further added to adjust the solid content to 15% by mass, thereby obtaining a polyimide precursor varnish. The appearance and viscosity change rate of the obtained varnish were evaluated, and the results are shown in Table 8. 【0101】(Preparation of Resin Films) Using the varnishes obtained in Examples 63-76 and Comparative Examples 17-18, the varnishes were uniformly applied to glass substrates using a bar coater to achieve film thicknesses of 10 μm and 50 μm, respectively. After application, the films were dried on a hot plate at 80°C for 30 minutes. Subsequently, the films were heated in stages in an oven under a nitrogen atmosphere at 150°C for 30 minutes, 250°C for 30 minutes, and 350°C for 60 minutes (thermal imidization) to form resin films on the glass substrates. The obtained films were immersed in water for 10 minutes and peeled off the glass substrates. The peeled films were dried in a hot air dryer at 80°C for 10 minutes to obtain test films with film thicknesses of 10 μm and 50 μm. The transparency, surface smoothness, and tensile properties of the obtained 10 μm thick films were evaluated by the following methods. Furthermore, the amount of residual solvent in the 50 μm thick films was evaluated by the following methods. The results of these evaluations are shown in Table 8. 【0102】 (Evaluation of Varnish Appearance) The condition of each type of varnish obtained was observed visually and evaluated according to the following criteria. The evaluation results are shown in Table 8. ◎: No precipitation or turbidity was observed. ○: Fine particles or cloudiness were observed, but no precipitation was present. △: No precipitation was observed. ×: No significant turbidity or precipitation was observed. 【0103】 (Viscosity Change Rate Evaluation) The viscosity of the varnish immediately after synthesis was measured at 25°C in accordance with JIS K 5600-2-3 using a cone-plate viscometer (RE550 viscometer, manufactured by Toki Sangyo Co., Ltd.). Next, the varnish was stored at 40°C for 30 days, and the viscosity was measured again in the same manner. The viscosity change rate was calculated using the absolute value with the following formula, and evaluated according to the following criteria. The evaluation results are shown in Table 8. Note that the lower the viscosity change rate, the higher the storage stability of the varnish. Viscosity Change Rate (%) = |(Viscosity after storage - Viscosity before storage)| / Viscosity before storage × 100 ◎: Absolute value of viscosity change rate is less than 8% ○: Absolute value of viscosity change rate is between 8% and less than 12% △: Absolute value of viscosity change rate is between 12% and less than 20% ×: Absolute value of viscosity change rate is 20% or more 【0104】(Film Transparency Evaluation) The obtained resin films were visually inspected, and their transparency was evaluated according to the following criteria. ◎: Transparent, no defects such as bubbles were observed. ○: Transparent, with a small number of bubbles observed. △: Transparent, with many bubbles observed. ×: Opaque, with many bubbles observed. 【0105】 (Evaluation of film surface smoothness) The surfaces of the various resin films obtained were visually observed, and their surface smoothness was evaluated according to the following criteria. ◎: The surface was smooth, and no streaks or unevenness were observed. ○: The surface was smooth, but slight streaks were observed. △: The surface was smooth, but many streaks were observed. ×: The surface was rough, and irregularities were observed. 【0106】 (Tensile Properties Evaluation) The obtained film was cut into strips 100 mm long and 10 mm wide, and left to stand for 24 hours under conditions of 23°C and 50% relative humidity. Subsequently, a tensile testing machine (Tensilon RTA-100, manufactured by ORIENTEC) was used to test the film at a check interval of 50 mm and a tensile speed of 50 mm / min, and the tensile strength and elongation at break were evaluated according to the following criteria. 【0107】 (Tensile Strength Evaluation) ◎: Tensile strength was 200 MPa or higher. ○: Tensile strength was 150 MPa or higher but less than 200 MPa. △: Tensile strength was 100 MPa or higher but less than 150 MPa. ×: Tensile strength was less than 100 MPa. (Elongation at Break Evaluation) ◎: Elongation at break was 100% or higher. ○: Elongation at break was 80% or higher but less than 100%. △: Elongation at break was 60% or higher but less than 80%. ×: Tensile elongation was less than 60%. 【0108】(Evaluation of residual solvent amount) Approximately 20 mg was cut from each of the obtained resin films, accurately weighed, and then subjected to thermogravimetric differential thermal analysis (TG-DTA) (instrument: TG / DTA6300, Hitachi High-Tech Science Corporation). The measurement method involved heating from room temperature to 120°C at a rate of 10°C / min, holding at 120°C for 5 minutes, then heating to 400°C at a rate of 10°C / min, and holding at 400°C for 1 hour to measure the change in mass of the sample. The mass loss rate was calculated using the following formula, and the amount of residual solvent in the film was evaluated according to the following criteria. Mass loss rate (mass%) = 100 - (W1 / W0) × 100 (W0 is the mass of the sample after holding at 120°C for 5 minutes, and W1 is the mass of the sample at 400°C.) ◎: The amount of residual solvent was 1% or less. ○: The amount of residual solvent was greater than 1% and 5% or less. △: The amount of remaining solvent was greater than 5% but less than or equal to 10%. ×: The amount of remaining solvent was greater than 10%. 【0109】 【0110】 Examples 77-82 and Comparative Examples 19-20 (Synthesis and Evaluation of Polyamide-Imide Precursor Varnish) A 1000 mL four-necked flask was used and equipped with a stirring rod, thermometer, dropping funnel, and nitrogen gas inlet tube. 300 g of the prepared composition D or F was added, and 14.7 g (75 mmol) of trimellitic dianhydride, 16.1 g (50 mmol) of 3,3',4,4'-diphenylsulfonetetracarboxylic acid dianhydride, and 30 g (125 mmol) of 4,4'-diphenylmethane diisocyanate were added. The mixture was heated to 120°C while stirring under a nitrogen atmosphere and reacted at 120°C for 6 hours. After the reaction was complete, the reaction solution was cooled to 80°C, and composition D or F was further added to adjust the solid content to 15% by mass to obtain a polyamide-imide precursor varnish. The appearance and viscosity change rate of the obtained varnish were evaluated in the same manner as in Example 63. Furthermore, films were prepared in the same manner as in Example 63, and various evaluations were performed. The results of these evaluations are shown in Table 9. 【0111】 【0112】Examples 83-86 and Comparative Examples 21-22 (Synthesis and Evaluation of Polyesterimide Precursor Varnish) A 1000 mL four-necked flask was used and equipped with a stirring rod, thermometer, dropping funnel, and nitrogen gas inlet tube. 300 g of the prepared composition D or F was added, along with 24.78 g (125 mmol) of methylenedianiline, 24.6 g (128 mmol) of trimellitic dianhydride, 1.55 g (25 mmol) of ethylene glycol, and 0.2 g of tetrapropyl titanate as a catalyst. The mixture was heated to 80°C while stirring under a nitrogen atmosphere, and after reaching 80°C, the temperature was increased from 80°C to 180°C over 1 hour. The reaction was then continued at 180°C for 4 hours. After the reaction was complete, the reaction solution was cooled to 80°C, and composition D or F was further added to adjust the solid content to 15% by mass to obtain a polyesterimide precursor varnish. The appearance and viscosity change rate of the obtained varnish were evaluated in the same manner as in Example 63. Furthermore, films were prepared in the same manner as in Example 63, and various evaluations were performed. The results of these evaluations are shown in Table 10. 【0113】 【0114】 Examples 87-90 and Comparative Examples 23-24 (Synthesis and Evaluation of Polyetherimide Precursor Varnish) In Example 63, the diamine compound was changed to 13.5 g (125 mmol) of m-phenylenediamine. The acidic dianhydride was changed to 66.6 g (125 mmol) of bisphenol A acidic dianhydride having an ether group. Except for these changes, the polyetherimide precursor varnish was synthesized in the same manner as in Example 63. The appearance and viscosity change rate of the obtained varnish were evaluated in the same manner as in Example 63. Furthermore, a film was prepared and various evaluations were performed in the same manner as in Example 63. The results of these evaluations are shown in Table 11. 【0115】 【0116】Examples 91-97 and Comparative Examples 25-26 (Synthesis and Evaluation of Polybenzoxazole Precursor Varnish) A 1000 mL four-necked flask was used and equipped with a stirring rod, thermometer, dropping funnel, and nitrogen gas inlet tube. 250 g of the prepared composition D or F was added, and 27.0 g (125 mmol) of 3,3'-dihydroxy-4,4'-diaminobiphenyl was added as the diamine compound. The mixture was stirred at 20°C for 30 minutes under a nitrogen atmosphere. Next, 26.3 g (260 mmol) of triethylamine was added, and the mixture was cooled to 5°C. The solution was kept below 10°C, and 26.0 g (128 mmol) of isophthaloyl chloride was gradually added as the acid chloride. After the addition, the mixture was stirred for a further 3 hours at 25°C and then for a further 1 hour at 40°C. Subsequently, the resulting white powder, triethylamine hydrochloride, was removed by filtration. Finally, composition D or F was added to adjust the mixture to a solid content concentration of 15% by mass, thereby obtaining a polybenzoxazole precursor varnish. The appearance and viscosity change rate of the obtained varnish were evaluated in the same manner as in Example 63. Furthermore, a film was prepared and various evaluations were performed in the same manner as in Example 63. The results of these evaluations are shown in Table 12. 【0117】 【0118】 The results in Tables 8-12 show that all varnishes synthesized using composition D in the examples exhibited good appearance. Furthermore, the viscosity change rate after storage at 40°C for 30 days was less than 20%, indicating high storage stability. These results confirm that composition D exhibits excellent solubility for various resin precursors and can uniformly prepare varnish, which is a solution of resin precursors. Moreover, it was revealed that composition D has high storage stability due to the coexistence of compounds A and B, and the resulting resin precursors did not induce depolymerization, nor did they undergo thickening or gelation over time. On the other hand, in the comparative examples, turbidity and precipitation were observed in the varnish synthesized using composition F. Composition F had low solubility for various resin precursors, exhibited significant viscosity changes over time, and could not achieve good storage stability. 【0119】The varnish in the example contained a resin precursor uniformly dissolved in composition D. Films made from such varnish exhibited high transparency and surface smoothness, and possessed practical levels of tensile strength and elongation at break. Furthermore, composition D contained compounds A and B with a specific boiling point difference, which easily evaporated during thermal imidation, resulting in minimal residue in the film. On the other hand, in the comparative example, the non-uniformity of the resulting varnish affected the outcome, and a satisfactory film could not be obtained. Moreover, composition F resulted in a large amount of residue in the film. 【0120】 Examples 98-111 and Comparative Example 27 (Synthesis and Evaluation of Photosensitive Polyimide Precursors) A 1000 mL four-necked flask was used and equipped with a stirring rod, thermometer, dropping funnel, and nitrogen gas inlet tube. 250 g of the prepared composition D or F was added, and 25.0 g (125 mmol) of 4,4'-diaminodiphenyl ether as the diamine compound and 1.3 g (10 mmol) of hydroxyethyl methacrylate as the polymerizable compound were added. The mixture was stirred at 25°C for 30 minutes under a nitrogen atmosphere. Next, while maintaining the solution at 10°C, 37.8 g (128 mmol) of 3,3',4,4'-biphenyltetracarboxylic acid dianhydride was gradually added as the acid dianhydride. After the addition, the mixture was stirred for another 30 minutes at 25°C. Finally, composition D or F was added to adjust the solid content to 15% by mass to obtain a polyimide precursor varnish having a methacrylate group. 【0121】 Ethanone 1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]-1-(O-acetyloxime) was added to the obtained varnish as a photopolymerization initiator in an amount of 3% by mass relative to the methacrylate group-containing polyimide precursor, and the mixture was mixed and dissolved. This yielded a photosensitive polyimide resin composition. A coating film was prepared from the obtained photosensitive polyimide resin composition using the following method, and the appearance of the coating film was evaluated. In addition, the pattern moldability was evaluated using a negative-type photomask using the following method. The results of these evaluations are shown in Table 13. 【0122】(Evaluation of coating appearance) A photosensitive polyimide resin composition was applied to a glass substrate using a rotary coating machine to obtain a coating film with a thickness of 10 μm. The film was then dried at 120°C for 3 minutes. The appearance of the obtained coating film was observed visually and evaluated according to the following criteria. ◎: A transparent, smooth coating film without defects was obtained. ○: A transparent, smooth coating film was obtained, but slight defects were observed. △: It was transparent, but slight irregularities and defects were observed on the surface. ×: It was opaque, and numerous irregularities and defects were observed on the surface. 【0123】 (Pattern formability evaluation) Using a negative photomask, wavelength 405 nm, illuminance 0.5 mW / cm 2 , cumulative light intensity 90 mJ / cm 2 The coating film was irradiated with ultraviolet light under the specified conditions. Subsequently, it was heat-treated at 85°C for 3 minutes. After that, a solution was used as a developer, which was a mixture of the same composition (composition D or F) used in the preparation of the photosensitive polyimide resin composition and isopropyl alcohol in a 1:1 volume ratio, and the product was developed for 2 minutes. After development, it was rinsed with isopropyl alcohol and subjected to stepwise heat treatment under a nitrogen atmosphere at 120°C for 10 minutes, 250°C for 10 minutes, and 350°C for 30 minutes to obtain a polyimide pattern cured product. The shape of the obtained pattern cured product was observed visually, and the pattern moldability was evaluated according to the following criteria. ◎: No pattern distortion or chipping of the edges was observed. ○: No pattern distortion, slight chipping of the edges was observed. △: Slight pattern distortion and chipping of the edges were observed. ×: Pattern distortion and chipping of the edges were observed. 【0124】 【0125】Examples 112-118 and Comparative Example 28 (Synthesis and Evaluation of Photosensitive Polybenzoxazole Precursors) A 1000 mL four-necked flask was used and equipped with a stirring rod, thermometer, dropping funnel, and nitrogen gas inlet tube. 250 g of the prepared composition D or F was added, and 27.0 g (125 mmol) of 3,3'-dihydroxy-4,4'-diaminobiphenyl as the diamine compound and 1.3 g (10 mmol) of hydroxyethyl methacrylate as the polymerizable compound were added. The mixture was stirred at 20°C for 30 minutes under a nitrogen atmosphere. Next, 26.3 g (260 mmol) of triethylamine was added, and while maintaining the solution at 5°C, 26.0 g (128 mmol) of isophthaloyl chloride as the acid chloride was gradually added. After the addition, the mixture was stirred at 25°C for 4 hours, and the resulting white powder triethylamine hydrochloride was removed by filtration. Finally, composition D or F was added to adjust the mixture to a solid content concentration of 15% by mass, thereby obtaining a polybenzoxazole precursor varnish having a methacrylate group. 【0126】 A photopolymerization initiator was added to the obtained polybenzoxazole precursor varnish in the same manner as in Example 98 to prepare a photosensitive polybenzoxazole resin composition. The amount of photopolymerization initiator added was 3% by mass relative to the polybenzoxazole precursor having a methacrylate group. A coating film was prepared from the obtained photosensitive polybenzoxazole resin composition in the same manner as in Example 98, and the appearance of the coating film was evaluated. In addition, the pattern moldability was evaluated using a negative-type photomask in the same manner as in Example 98. The results of these evaluations are shown in Table 14. 【0127】 【0128】The results in Tables 13 and 14 confirm that composition D of the precursor varnish synthesized in the examples exhibits excellent solubility with polyimide precursors and polybenzoxazole precursors, resulting in the formation of a transparent, defect-free, and smooth coating film. Furthermore, it was revealed that by using a uniform varnish and by composition D containing compound A and a compound having a specific range of boiling point difference and / or P-HSP value difference, good patterns can be formed by heat treatment of the varnish. On the other hand, when the compositions of the comparative examples were used, a decrease in smoothness and defects were observed in the coating film, and good pattern formation properties could not be obtained. 【0129】 Examples 119-132 and Comparative Examples 29-30 (Synthesis and Evaluation of Urethane Prepolymer Solutions) A 1000 mL four-necked flask was used, equipped with a stirring rod, thermometer, dropping funnel, and nitrogen gas inlet tube, and 100 g of the prepared composition D or F was added. Next, 104.5 g (0.6 mol) of tolylene diisocyanate was added as the diisocyanate compound and dissolved with stirring at 25°C. Then, 325.0 g (0.5 mol) of polytetramethylene glycol (PTMG650) with a number average molecular weight of 650 as the diol compound and 0.05 g of dibutyltin dilaurate as a catalyst were added, and the reaction was carried out at 60°C for 4 hours under a nitrogen atmosphere. Finally, composition D or F was added to adjust the solid content concentration to 80% by mass to obtain an isocyanate-terminated urethane prepolymer solution. 【0130】 (Visual evaluation) The dissolution state of the obtained urethane prepolymer solution was observed visually and evaluated according to the following criteria. The evaluation results are shown in Table 15. ◎: No precipitation or turbidity was observed. ○: Fine particles or cloudiness were observed, but no precipitation. △: A small amount of precipitation was observed. ×: Significant turbidity or precipitation was observed. 【0131】(Viscosity Change Rate Evaluation) The viscosity of the urethane prepolymer solution immediately after preparation was measured at 25°C in accordance with JIS K 5600-2-3 using a cone-plate viscometer (RE550 viscometer, manufactured by Toki Sangyo Co., Ltd.). Next, the viscosity was measured again after the solution was stored at 40°C for 30 days. The viscosity change rate was calculated using the absolute value with the following formula, and the results are shown in Table 15. Note that a lower viscosity change rate indicates higher storage stability of the urethane prepolymer solution. Viscosity Change Rate (%) = |(Viscosity after storage - Viscosity before storage)| / Viscosity before storage × 100 ◎: Absolute value of viscosity change rate is less than 8% ○: Absolute value of viscosity change rate is 8 to less than 12% △: Absolute value of viscosity change rate is 12 to less than 20% ×: Absolute value of viscosity change rate is 20% or more 【0132】 (Preparation of Polyurethane Film) 11.1 g of polypropylene glycol triol type (manufactured by NOF Corporation, number average molecular weight 1000, trade name Uniol TG-1000R) was added to 88.9 g of the obtained urethane prepolymer solution and stirred at 25°C for 5 minutes. The resulting mixture was applied to the release surface of a 75 μm thick heavy-release PET film (manufactured by Toyobo Co., Ltd., trade name Polyester Film E7001) to a film thickness of 100 μm, and heated in a hot air dryer under a nitrogen stream at 130°C for 30 minutes. Next, the coating was peeled off the heavy-release PET film to obtain a polyurethane film. The appearance and tensile properties (tensile strength and elongation at break) of the obtained polyurethane film were evaluated by the following method, and the results are shown in Table 15. 【0133】 (Visual evaluation of polyurethane film) The obtained polyurethane film was visually inspected to check for defects such as foaming or cracking. The evaluation was performed according to the following criteria: ○: Transparent, no defects such as bubbles or streaks were observed. △: Slightly yellowed, but no defects such as bubbles or streaks were observed. ×: Yellow or opaque, with defects such as bubbles or streaks observed. 【0134】(Tensile Strength Evaluation) The obtained polyurethane film was cut into test pieces measuring 100 mm in length and 10 mm in width. After standing for 24 hours under conditions of 23°C and 50% relative humidity, it was tested using a tensile testing machine (ORIENTEC Tensilon RTA-100) with a chuck spacing of 50 mm, a tensile speed of 50 mm / min, and n=5 test pieces. The tensile strength and elongation at break were measured and evaluated according to the following criteria: ○: Tensile strength of 25 MPa or more and elongation at break of 150% or more △: Tensile strength of 25 MPa or more or elongation at break of 150% or more ×: Tensile strength less than 25 MPa and elongation at break less than 150% 【0135】 【0136】 The results in Table 15 show that the urethane prepolymer solution synthesized in the example showed excellent storage stability, with no precipitation or turbidity observed, and a viscosity change rate of less than 20%, due to the superior solubility of composition D with respect to the urethane prepolymer. Furthermore, the polyurethane film prepared from the urethane prepolymer solution in the example exhibited a transparent, defect-free appearance, appropriate values ​​for both tensile strength and elongation at break, and favorable results from the viewpoint of mechanical properties. On the other hand, when the composition of the comparative example was used, solubility was insufficient, precipitation and turbidity were observed, the viscosity change rate was large, storage stability was reduced, and the appearance and tensile properties of the resulting film were also inferior. Therefore, it was not possible to obtain a good urethane prepolymer solution or polyurethane film. 【0137】Examples 133-143 and Comparative Examples 31-36 (Preparation and Evaluation of Metal Etching Solutions) Using the prepared compositions D or F, metal etching solutions were prepared by the following methods. (Gold (Au) Etching Solution) Prepared by mixing 50 g of composition D or F with 50 g of iodine-potassium iodide aqueous solution (iodine concentration 2% by mass, potassium iodide concentration 10% by mass) at 25°C for 30 minutes. (Copper (Cu) Etching Solution) Prepared by mixing 70 g of composition D or F with 30 g of ethyl trichloroethyl acetate at 25°C for 30 minutes. (Tungsten (W) Etching Solution) Prepared by mixing 80 g of composition D or F, 15 g of hydrogen peroxide aqueous solution (concentration 30% by mass), and 5 g of ammonium fluoride at 25°C for 30 minutes. 【0138】 (Metal Film Etching Method and Etching Performance Evaluation) A Si wafer with a 1 μm metal film (Au, Cu, or W) was prepared, and a 25 μm thick dry resist was applied by spin coating to create a resist laminate. Next, a resist pattern was formed by exposure using a glass mask with a line / space (L / S) of 36 μm / 24 μm and removal of unexposed areas. The obtained resist pattern was etched by immersion in an etching solution adjusted to a liquid temperature of 30°C to remove the metal film. Subsequently, the resist was removed by immersion in a 3 mass% sodium hydroxide aqueous solution at 50°C for 4 minutes, the metal-deposited glass was washed with ultrapure water, and dried with nitrogen gas. The obtained etched wafer was observed using a scanning electron microscope (SEM, Hitachi High-Technologies Corporation SU8200 series) to confirm surface smoothness and measure the amount of side etching. 【0139】 (Surface Smoothness Evaluation) The surface condition of the etched wafers was observed using SEM, and the surface smoothness was evaluated according to the following criteria. The evaluation results are shown in Table 16. ◎: A smooth surface was observed. ○: Some areas were slightly rough. △: The entire surface was slightly rough. ×: The surface was rough, and no smooth surfaces were observed. 【0140】(Evaluation of Etching Accuracy) The amount of side etching was measured by SEM on the resulting etched wafers, and the etching accuracy was evaluated according to the following criteria. The evaluation results are shown in Table 16. Note that a smaller amount of side etching indicates higher etching accuracy. (Evaluation of Etching Accuracy) ◎: Side etching amount less than 200 nm ○: Side etching amount 200 nm or more and less than 400 nm △: Side etching amount 400 nm or more and less than 600 nm ×: Side etching amount 600 nm or more 【0141】 【0142】 The results in Table 16 show that the etching solution in the example used composition D, which contains compounds A and B, exhibited good etching properties for all metal films of Au, Cu, and W, with excellent surface smoothness and low side etching. This confirmed that high etching accuracy could be achieved in fine pattern formation, making it suitable for use as an etching solution for processing metal films. On the other hand, wafers treated with the etching solution of the comparative example showed a deterioration in surface smoothness and a tendency for increased side etching. 【0143】Examples 144-155 and Comparative Examples 37-40 (Preparation and Evaluation of Release Agents) (Preparation of Test Specimens) (1) Urethane resin coating A 10mm x 10mm area of ​​urethane adhesive (Loctite Superclear DSC-050, 1 component, manufactured by Henkel Japan Ltd.) was applied to a SUS304 plate (35mm x 15mm x 0.1mm thick), and left to cure at 25°C for 7 days to prepare Test Specimen 1. (2) Epoxy resin coating A 10mm x 10mm area of ​​epoxy adhesive (Bond E Set #16023, 2 component, manufactured by Konishi Co., Ltd.) was applied to a SUS304 plate (35mm x 15mm x 0.1mm thick), and left to cure at 25°C for 7 days to prepare Test Specimen 2. (Release Evaluation) 20g of the prepared composition D or F and the prepared Test Specimen 1 or 2 were immersed in a 100ml beaker. The specimens were left standing in a constant temperature oven at 70°C for 5 hours, and the peeling state of the resin coating was observed visually. The peelability of the composition was evaluated according to the following criteria, and the results are shown in Table 17. ◎: The resin coating detached from the substrate, and swelling was observed in the resin coating. ○: The resin coating detached from the substrate when lightly rubbed, and swelling was observed in the resin coating. △: The resin coating detached from the substrate when strongly rubbed, and slight swelling was observed in the resin coating. ×: The resin coating did not detach from the substrate, and no swelling was observed in the resin coating. 【0144】 【0145】Table 17 shows that the example's release agent, Composition D, exhibited excellent release properties for both urethane resin coatings and epoxy resin coatings. This is because the coexistence of compounds A and B in Composition D resulted in interactions between them, leading to improvements in dissolution behavior that could not be achieved with either compound alone. The synergistic effect of the coexistence of compounds A and B increased solubility in resin coatings, leading to improved release performance. Furthermore, the difference in boiling points and / or P-HSP values ​​between compounds A and B within a specific range optimized the balance of volatilization behavior and dissolution parameters in the solvent system. As a result, swelling of the resin coating was promoted, making it easier to peel from the substrate, and demonstrating high performance as a release agent. On the other hand, when the comparative example's composition was used, it contained only either compound A or compound B, resulting in an insufficient balance of dissolution capacity. As a result, swelling of the resin coating was insufficient, the release properties were low, and satisfactory performance as a release agent could not be obtained. 【0146】 Examples 156-165 and Comparative Examples 41-43 (Preparation of Electrode Slurries, Fabrication of Secondary Batteries, and Evaluation thereof) (Preparation of Positive Electrode Slurry and Evaluation of Dispersibility) Lithium cobalt oxide (LCO) was used as the positive electrode active material, acetylene black (AB) as the conductive material, polyvinylidene fluoride (PVDF) as the binder, and the prepared composition D or F as the solvent. These were mixed in a mass ratio of LCO:AB:PVDF:composition = 92:4:4:40 and dispersed using a homomixer. Next, composition D or F was added to adjust the solid content concentration to 70% by mass to obtain a positive electrode slurry. The viscosity of the obtained positive electrode slurry was measured using a rheometer (TA Instruments) at 25°C and a shear rate of 0.1 / s, and the dispersibility was evaluated according to the following criteria. The evaluation results are shown in Table 18. Note that lower viscosity indicates higher dispersibility. ◎: Slurry viscosity less than 5 Pa·s ○: Slurry viscosity between 5 Pa·s and 15 Pa·s △: Slurry viscosity between 15 Pa·s and 30 Pa·s ×: Slurry viscosity of 30 Pa·s or more 【0147】(Preparation and Dispersibility Evaluation of Negative Electrode Slurry) Graphite was used as the negative electrode active material, styrene-butadiene rubber (SBR) as the binder, carbon black (CB) as the conductive additive, carboxymethylcellulose (CMC) as the thickener, and prepared composition D or F as the solvent. These were mixed in a mass ratio of graphite:SBR:CB:CMC:composition = 96:1:1:2:140. Furthermore, 100 g of 3 mm particle size zirconia beads were added and dispersed by shaking at 300 rpm for 2 hours using a shaker. Next, composition D or F was added to adjust the solid content concentration to 40% by mass to obtain the negative electrode slurry. The viscosity of the obtained negative electrode slurry was measured using a rheometer (TA Instruments) at 25°C and a shear rate of 0.1 / s, and the dispersibility was evaluated according to the following criteria. The evaluation results are shown in Table 18. Note that lower viscosity indicates higher dispersibility. ◎: Slurry viscosity less than 20 Pa·s ○: Slurry viscosity between 20 Pa·s and 100 Pa·s △: Slurry viscosity between 100 Pa·s and 200 Pa·s ×: Slurry viscosity of 200 Pa·s or more 【0148】 (Fabrication of secondary batteries) The obtained positive electrode slurry was applied to both sides of a positive electrode core made of aluminum foil using a die-coating method. After the coating was dried, it was rolled with a rolling mill and cut to a predetermined electrode size to produce the positive electrode. Similarly, for the negative electrode, the obtained negative electrode slurry was applied to both sides of a negative electrode core made of copper foil using a die-coating method. After the coating was dried, it was rolled with a rolling mill and cut to a predetermined electrode size to produce the negative electrode. Using an aluminum HS cell, one positive electrode and one negative electrode were placed opposite each other, a polyethylene separator was placed between them, the electrolyte was filled, and the screws were tightened to produce an experimental battery. The electrolyte was prepared by dissolving lithium bis(fluorosulfonyl)imide (LiFSI) as the electrolyte to a concentration of 1 mol / L in a solvent made by mixing ethylene carbonate (EC), dimethyl carbonate (DMC), and ethyl methyl carbonate (EMC) in a volume ratio of EC:DMC:EMC = 1:1:1. 【0149】(Charge / Discharge Test) Using the fabricated secondary batteries, the discharge capacity was measured using a charge / discharge test device (LCDL-3, manufactured by Keisokuki Center Co., Ltd.) under the conditions of a charge / discharge speed of 0.2C (constant current mode) and a voltage range of 3.5 to 4.2V. The discharge capacity of the batteries (based on the mass of the positive electrode active material) was evaluated according to the following criteria, and the results are shown in Table 18. Note that a higher discharge capacity indicates better battery performance. ◎: Discharge capacity of 130mAh / g or more ○: Discharge capacity of 120mAh / g or more △: Discharge capacity of 110mAh / g or more and less than 120mAh / g ×: Discharge capacity less than 110mAh / g 【0150】 【0151】 The results in Table 18 show that the electrode slurry prepared using composition D in the examples exhibited high dispersibility and low viscosity in both the positive and negative electrodes. Therefore, it demonstrated excellent slurry coatability and dispersion stability during electrode formation, resulting in uniform electrodes. Furthermore, the batteries obtained in the examples had high discharge capacity, suggesting that the uniformity of the microstructure contributed to improved battery performance. These effects are attributed to composition D containing compounds A and B, which have a specific range of boiling point differences and / or P-HSP value differences. In contrast, when the compositions of the comparative examples were used, the dispersion stability of the positive or negative electrode slurry tended to be low, and the viscosity was high. As a result, non-uniform structures were more likely to occur during electrode formation, leading to low discharge capacity and insufficient battery performance in both cases. 【0152】Examples 166-171 and Comparative Examples 44-46 (Preparation and Evaluation of Electrolyte) Ethylene carbonate (EC), dimethyl carbonate (DMC), and ethyl methyl carbonate (EMC) were mixed in a volume ratio of EC:DMC:EMC = 1:1:1 to which lithium bis(fluorosulfonyl)imide (LiFSI) was dissolved as an electrolyte to a concentration of 1 mol / L. Further, the prepared composition D or F was added to the electrolyte to a concentration of 5% by mass to obtain the electrolyte. Using the obtained electrolyte, an experimental secondary battery was prepared in the same manner as in Example 156. The electrolyte was formulated with the compositions of Examples 166-171 or Comparative Examples 44-46, with C-12 used as the solvent for the positive electrode slurry and water used as the solvent for the negative electrode slurry. The resistance increase rate of the obtained battery was evaluated in cycle charge-discharge tests and storage tests. 【0153】 (Cycle Test) A 10-minute rest period was provided between each charge and discharge cycle, and a cycle test was performed under the same conditions as the charge and discharge test described above. The discharge capacity of the obtained batteries was evaluated according to the following criteria, and the results are shown in Table 19. ◎: Discharge capacity after 10 charge and discharge cycles is 92% or more of the capacity of the first cycle ○: Discharge capacity after 10 charge and discharge cycles is 88% or more but less than 92% of the capacity of the first cycle △: Discharge capacity after 10 charge and discharge cycles is 82% or more but less than 88% of the capacity of the first cycle ×: Discharge capacity after 10 charge and discharge cycles is less than 82% of the capacity of the first cycle 【0154】 (Resistance Increase Rate) After charging secondary batteries to 4.53V at 45°C, the initial resistance value of the battery and the resistance value of the battery after storage at 60°C for 28 days were measured, and the resistance increase rate was calculated using the following formula. Evaluation was performed according to the following criteria. Electrochemical impedance spectroscopy (EIS) was used to measure the resistance value. The obtained resistance increase rate was evaluated according to the following criteria, and the results are shown in Table 19. Resistance Increase Rate (%) = (Resistance value of battery after 28 days / Initial resistance value of battery) × 100 ○: Resistance increase rate less than 150% △: Resistance increase rate 150% or more and less than 170% ×: Resistance increase rate 170% or more 【0155】 【0156】 The results in Table 19 show that when the electrolyte containing composition D was used in the examples, both the discharge capacity retention rate and the resistance increase rate after the cycle test fell within an appropriate range, confirming that it can be suitably used as an electrolyte. These effects are thought to be due to composition D containing compound A and compound B. In particular, the difference in boiling points and / or P-HSP values ​​between compound A and compound B within a specific range optimizes the balance of volatilization behavior and solubility parameters in the solvent system, improving the stability of the electrolyte. As a result, the increase in resistance was suppressed even during long-term charge and discharge, and excellent cycle performance was achieved. On the other hand, when the compositions of the comparative examples were used, because they contained only one or neither compound A nor compound B, or neither, the stability of the electrolyte decreased, the cycle performance deteriorated, and the resistance increase rate tended to be high, making it impossible to obtain the desired performance. 【0157】 The present invention includes the following: (1) A composition containing an N,N-disubstituted amide (compound A) and an N-monosubstituted amide (compound B). (2) The composition according to (1), wherein the content of compound B in the whole composition is 1 ppm to 1% by mass or less. (3) The composition according to (1) or (2), wherein compound A is one or more compounds represented by general formula (1), and compound B is one or more compounds represented by general formula (2). R1, R2, and R5 each independently represent a linear or branched alkyl group having 1 to 4 carbon atoms, or a linear or branched alkylene oxyalkyl group having 2 to 4 carbon atoms. R1 and R2, together with the nitrogen atom to which they are bonded, include those that form a saturated 5 to 7-membered ring (including those with heteroatoms). R3, R4, R6, and R7 each independently represent a hydrogen atom, a linear or branched alkyl group having 1 to 4 carbon atoms, a linear or branched alkylene oxyalkyl group having 2 to 4 carbon atoms, or a linear or branched alkoxy group having 1 to 4 carbon atoms. R3 and R4, together with the hydrocarbon group to which they are bonded, include those that form a saturated 5 to 7-membered ring (including those with heteroatoms). R6 and R7, together with the hydrocarbon group to which they are bonded, include those that form a saturated 5 to 7-membered ring (including those with heteroatoms). m and n each independently represent an integer from 0 to 2. If m is 0, then R3 and R4 are not both hydrogen atoms. If m is 1 or 2, then -(CH2) m -R3 includes branched alkyl groups with 3 to 6 carbon atoms, branched alkylene oxyalkyl groups with 2 to 6 carbon atoms, and branched alkoxy groups with 3 to 6 carbon atoms. When n is 0, R6 and R7 are not both hydrogen atoms. When n is 1 or 2, -(CH2) m -R6 includes branched alkyl groups having 3 to 6 carbon atoms, branched alkylene oxyalkyl groups having 2 to 6 carbon atoms, and branched alkoxy groups having 3 to 6 carbon atoms. (4) The composition according to any one of (1) to (3) above, wherein compound A has a boiling point of 170 to 290°C at 1 atm. (5) The composition according to any one of (1) to (4) above, wherein the difference in boiling points between compound A and compound B at 1 atm is 5 to 120°C. (6) The difference in partial Hansen solubility parameters (P-HSP values) between compound A and compound B is 0.1 to 12.0 (MPa). 0.5(1) The composition according to any one of (1) to (5) above. (7) A solvent containing the composition according to any one of (1) to (6) above, which is used for dissolving resins, paints, inks, adhesives, pharmaceuticals, pesticides, fragrances, pigments, dyes, cellulose derivatives, organosilicon polymers and conductive materials. (8) A diluent containing the composition according to any one of (1) to (6) above, which is used for diluting resins, paints, inks, adhesives, pharmaceuticals, pesticides, fragrances, pigments, dyes, cellulose derivatives, organosilicon polymers and conductive materials. (9) A dispersant containing the composition according to any one of (1) to (6) above, which is used for dispersing resins, paints, inks, adhesives, pharmaceuticals, pesticides, fragrances, pigments, dyes, cellulose derivatives, organosilicon polymers, conductive materials and carbon materials. (10) A solvent containing the composition described in any one of (1) to (6) above, characterized in that it is used in the synthesis of polybenzoxazole polyimide, polyamideimide, polyesterimide, polyetherimide, polybenzoxazole, polyurethane, epoxy resin, phenolic resin, polystyrene, polyvinyl chloride, polyvinyl acetate, polyvinylpyrrolidone, polyacrylonitrile, polyamide, polyester, polycarbonate, polyether, polysulfone, polyethersulfone, cellulose derivatives, organosilicon polymers and conductive polymers, and precursors thereof. (11) A solvent containing the composition described in any one of (1) to (6) above, characterized in that it is used in photosensitive resin compositions, temporary protective film resin compositions, paint resin compositions, etching solution compositions, photoresist resin compositions, encapsulant resin compositions, adhesive resin compositions, cleaning agent resin compositions, release agent resin compositions, chemical mechanical polishing resin compositions and binder resin compositions.(12) A solvent containing the composition described in any one of (1) to (6) above, which is used for forming polyimide films, semiconductor substrates, flexible substrates, cured relief pattern films, wiring patterns, printed patterns, insulating films, protective films, separation films, gas barrier films, and sliding members. (13) A solvent containing the composition described in any one of (1) to (6) above, which is used for manufacturing semiconductors, electronic devices, electrodes, flexible devices, sensors, and displays. (13) A cleaning agent containing the composition described in any one of (1) to (6) above, which is used for cleaning manufacturing equipment, manufacturing tools, industrial products, industrial parts, plastic molded products, metal parts, electronic parts, filters for recording devices, three-dimensional molded objects, resin particles, inkjet nozzles, liquid channels of ink cartridges, semiconductor process residues, resin processing residues, battery manufacturing residues, and printing ink residues. (14) A release agent containing the composition described in any one of (1) to (6) above, which is used for removing organic coating layers from the surface of plastic molded products, support materials for three-dimensional rough molded products, resists on metal thin films, UV resins, polyimide resins, urethane resins and epoxy resins, battery binders and conductive ink residues. (15) A resin varnish containing the composition described in any one of (1) to (6) above, which includes any one resin varnish selected from polyimide varnish, polyamideimide varnish, polyesterimide varnish, polyetherimide varnish and polybenzoxazole varnish. (16) A resin composition containing the composition described in any one of (1) to (6) above, which includes any one resin composition selected from binder resin compositions, photosensitive resin compositions, adhesive resin compositions, lubricating coating resin compositions, heat-resistant paint resin compositions and ink resin compositions. Furthermore, the resin composition may include one or more resin varnishes selected from polyimide varnish, polyamideimide varnish, polyesterimide varnish, polyetherimide varnish, and polybenzoxazole varnish. (17) A liquid crystal alignment treatment agent containing the composition described in any one of the above items (1) to (6), which is used for aligning liquid crystal molecules.(18) An electrolyte containing the composition described in any one of (1) to (6) above, which is used in the manufacture of a secondary battery. (19) A secondary battery containing an electrolyte containing the composition described in any one of (1) to (6) above. (20) A film obtained by heating a coating film of a resin composition containing the composition described in any one of (1) to (6) above, selected from polyimide film, insulating protective film for semiconductor elements, alignment film for liquid crystal displays, pixel separation film for organic EL displays, and heat-resistant protective film. The resin composition may also contain one or more resin varnishes selected from polyimide varnish, polyamideimide varnish, polyesterimide varnish, polyetherimide varnish, and polybenzoxazole varnish. (21) Polyimide particles obtained by heating a resin composition containing the composition described in any one of (1) to (6) above. The resin composition may also contain one or more resin varnishes selected from polyimide varnish, polyamideimide varnish, polyesterimide varnish, polyetherimide varnish, and polybenzoxazole varnish. (22) A metal laminate comprising a coating film of a resin composition containing the composition described in any one of items (1) to (6) above, and one or more metal substrates selected from copper, gold, and alloys. The resin composition may include one or more resin varnishes selected from polyimide varnish, polyamideimide varnish, polyesterimide varnish, polyetherimide varnish, and polybenzoxazole varnish. 【0158】The composition of the present invention is harmless to the human body and has high stability, allowing for long-term storage as a solvent, diluent, dispersant, etc. By containing this composition, various formulations and products with improved performance according to their intended use can be provided. Specifically, solvents used for dissolving resins, paints, inks, adhesives, pharmaceuticals, pesticides, fragrances, pigments, dyes, cellulose derivatives, organosilicon polymers, and conductive materials containing the composition of the present invention; diluents used for diluting resins, paints, inks, adhesives, pharmaceuticals, pesticides, fragrances, pigments, dyes, cellulose derivatives, organosilicon polymers, and conductive materials containing the composition of the present invention; dispersants used for dispersing resins, paints, inks, adhesives, pharmaceuticals, pesticides, fragrances, pigments, dyes, cellulose derivatives, organosilicon polymers, conductive materials, and carbon materials containing the composition of the present invention; solvents used in chemical reactions containing the composition of the present invention; solvents used in diluents, extractants, cleaning agents, stripping agents, removers, degreasing agents, penetrating agents, absorbents, dispersants, and correction agents for lithographic printing plates containing the composition of the present invention; polyimide resins, polyamide resins, polyester resins, polystyrene resins, polyacrylonitrile resins, polyvinyl chloride resins, polyvinylpyrrolidone resins, polyvinyl acetate resins, and polycarbonates containing the composition of the present invention. Solvents used in the manufacture and / or dissolution of resins, polyethersulfone resins, polysulfone resins, polyether resins, polyurethane resins, polyesterimide resins, epoxy resins, poly(amide-imide) resins, and polyvinylidene fluoride resins; cleaning agents used for cleaning manufacturing equipment, manufacturing tools, industrial products, industrial parts, plastic molded products, metal parts, electronic components, filters for recording devices, three-dimensional molded objects, resin particles, inkjet nozzles, liquid channels of ink cartridges, semiconductor process residues, resin processing residues, battery manufacturing residues, and printing ink residues; stripping agents used for stripping organic coating layers on the surface of plastic molded products, support materials for three-dimensional rough molded objects, resists on metal thin films, UV resins, polyimide resins, urethane resins, and epoxy resins, battery binders, and conductive ink residues containing the composition of the present invention; resin varnishes such as polyimide varnish, polyamideimide varnish, polyesterimide varnish, polyetherimide varnish, and polybenzoxazole varnish containing the composition of the present invention;Resin compositions containing the composition of the present invention, such as photosensitive resin compositions, temporary protective film compositions, insulating film forming compositions, paint resin compositions, encapsulant compositions, binder resin compositions, ink resin compositions, adhesive compositions, etc.; films such as polyimide films, insulating protective films for semiconductor devices, alignment films for liquid crystal displays, pixel separation films for organic EL displays, and heat-resistant protective films, obtained by heating a coating film of a resin composition containing the composition of the present invention; polyimide particles obtained by heating a resin composition containing the composition of the present invention; metal laminates comprising a coating film of a resin composition containing the composition of the present invention and one or more metal substrates selected from copper, iron, nickel, chromium, aluminum, silver, gold, titanium, palladium, platinum, molybdenum, tungsten, tantalum, zirconium, cobalt, and alloys thereof; liquid crystal alignment treatment agents containing the composition of the present invention; and electrolytes containing the composition of the present invention, which can be suitably used in secondary batteries, etc.

Claims

1. A composition containing an N,N-disubstituted amide (compound A) and an N-monosubstituted amide (compound B).

2. The composition according to claim 1, wherein the content of compound B relative to the total mass of the composition is 1 ppm to 1% by mass or less.

3. The composition according to claim 1 or 2, wherein compound A is one or more compounds represented by general formula (1), and compound B is one or more compounds represented by general formula (2). R1, R2, and R5 each independently represent a linear or branched alkyl group having 1 to 4 carbon atoms. R1 and R2, together with the nitrogen atom to which they are bonded, include those that form a saturated 5 to 7-membered ring structure. R3, R4, R6, and R7 each independently represent a hydrogen atom, a linear or branched alkyl group having 1 to 4 carbon atoms, a linear or branched alkoxy group having 1 to 4 carbon atoms, and a linear or branched alkylene oxyalkyl group having 2 to 4 carbon atoms. R3 and R4, together with the hydrocarbon group to which they are bonded, include those that form a saturated 5 to 7-membered ring structure. R6 and R7, together with the hydrocarbon group to which they are bonded, include those that form a saturated 5 to 7-membered ring structure. m and n each independently represent an integer from 0 to 2. If m is 0, R3 and R4 are not both hydrogen atoms. If n is 0, R6 and R7 are not both hydrogen atoms.

4. The composition according to any one of claims 1 to 3, wherein compound A has a boiling point of 170°C to 290°C at 1 atmosphere.

5. The composition according to any one of claims 1 to 4, wherein the difference in boiling points between compound A and compound B at 1 atmosphere is 5°C to 120°C.

6. The difference in partial Hansen solubility parameters (P-HSP values) between compound A and compound B is between 0.1 and 12.0 (MPa). 0.5 The composition according to any one of claims 1 to 5.

7. A solvent containing the composition according to any one of claims 1 to 6.

8. A solvent containing the composition described in any one of claims 1 to 6, wherein the solvent is used for dissolving resins, paints, inks, adhesives, pharmaceuticals, pesticides, fragrances, pigments, dyes, cellulose derivatives, organosilicon polymers and conductive materials; a solvent used for synthesizing polyimides, polyamideimides, polyesterimides, polyetherimides, polybenzoxazoles, polyurethanes, epoxy resins, phenolic resins, polystyrene, polyvinyl chlorides, polyvinyl acetates, polyvinylpyrrolidones, polyacrylonitriles, polyamides, polyesters, polycarbonates, polyethers, polysulfones, polyethersulfones, cellulose derivatives, organosilicon polymers and conductive polymers, and their precursors; a solvent used for photosensitive resin compositions, temporary protective film resin compositions, paint resin compositions, etching solution compositions, photoresist resin compositions, encapsulant resin compositions, adhesive resin compositions, cleaning agent resin compositions, release agent resin compositions, chemical mechanical polishing resin compositions and binder resin compositions. A solvent selected from solvents used in the formation of polyimide films, semiconductor substrates, flexible substrates, cured relief pattern films, wiring patterns, printed patterns, insulating films, protective films, separation films, gas barrier films, and sliding members, as well as solvents used in the manufacture of semiconductors, electronic devices, electrodes, flexible devices, sensors, and displays.

9. A dispersant containing the composition according to any one of claims 1 to 6.

10. A dispersant containing the composition described in any one of claims 1 to 6, which is used for dispersing resins, paints, inks, adhesives, pharmaceuticals, pesticides, fragrances, pigments, dyes, cellulose derivatives, organosilicon polymers, conductive materials and carbon materials.

11. A diluent containing the composition according to any one of claims 1 to 6.

12. A diluent containing the composition described in any one of claims 1 to 6, which is used for diluting resins, paints, inks, adhesives, pharmaceuticals, pesticides, fragrances, pigments, dyes, cellulose derivatives, organosilicon polymers, and conductive materials.

13. A detergent containing the composition described in any one of claims 1 to 6.

14. A cleaning agent comprising the composition described in any one of claims 1 to 6, which is used for cleaning manufacturing equipment, manufacturing tools, industrial products, industrial parts, plastic molded products, metal parts, electronic components, filters for recording devices, three-dimensional molded objects, resin particles, inkjet nozzles, liquid channels of ink cartridges, semiconductor process residues, resin processing residues, battery manufacturing residues, and printing ink residues.

15. A stripping agent containing the composition described in any one of claims 1 to 6.

16. A release agent comprising the composition described in any one of claims 1 to 6, which is used for removing organic coating layers from the surface of plastic molded articles, support materials for three-dimensional rough molded objects, resists on metal thin films, UV resins, polyimide resins, urethane resins and epoxy resins, battery binders and conductive ink residues.

17. An etching solution containing the composition according to any one of claims 1 to 6.

18. An etching solution containing the composition described in any one of claims 1 to 6, which is used for etching one metal selected from copper, iron, nickel, chromium, aluminum, silver, gold, titanium, palladium, platinum, molybdenum, tungsten, tantalum, zirconium, and cobalt, or an alloy of two or more metals, or an oxide of the said metal or alloy.

19. A resin varnish containing the composition according to any one of claims 1 to 6, wherein the resin varnish is selected from polyimide varnish, polyamideimide varnish, polyesterimide varnish, polyetherimide varnish, and polybenzoxazole.

20. A resin composition containing the composition described in any one of claims 1 to 6, wherein the resin composition is selected from any one of the following: a photosensitive resin composition, a temporary protective film composition, an insulating film forming composition, a paint resin composition, a encapsulant composition, a binder resin composition, an ink resin composition, and an adhesive composition.

21. A film obtained by heating a coating film of a resin composition containing the composition described in any one of claims 1 to 6, which is selected from a polyimide film, an insulating protective film for semiconductor devices, an alignment film for liquid crystal displays, a pixel separation film for organic EL displays, and a heat-resistant protective film.

22. Polyimide particles obtained by heating a resin composition containing the composition according to any one of claims 1 to 6.

23. A metal laminate comprising a coating film of a resin composition containing the composition described in any one of claims 1 to 6, and one or more metal substrates selected from copper, iron, nickel, chromium, aluminum, silver, gold, titanium, palladium, platinum, molybdenum, tungsten, tantalum, zirconium, cobalt, and alloys thereof.

24. A liquid crystal alignment treatment agent containing the composition described in any one of claims 1 to 6.

25. An electrolyte containing the composition according to any one of claims 1 to 6.

26. A secondary battery comprising an electrolyte containing the composition described in any one of claims 1 to 6.

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