Bonding of substrates with low surface energy using adhesion-promoting adhesive

A specialized thermosetting adhesive composition addresses the challenge of bonding low surface energy substrates by enhancing wetting and adhesion, achieving robust and reliable bonding with consistent quality for thermoplastic and thermoset materials.

WO2026128360A1PCT designated stage Publication Date: 2026-06-18CYTEC IND INC
View PDF 0 Cites 0 Cited by

Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
CYTEC IND INC
Filing Date
2025-12-08
Publication Date
2026-06-18

AI Technical Summary

Technical Problem

The challenge of bonding substrates with low surface energy, such as thermoplastic substrates, is significant due to their smooth, hydrophobic surfaces that are difficult to wet out and bond effectively with conventional adhesives, leading to poor adhesion and variability in bonding quality.

Method used

A thermosetting adhesive composition comprising epoxy-based pre-react, amine curing agent, wetting agent, flow control agent, and optionally trifunctional or tetrafunctional epoxy resin, along with specific additives like core-shell rubber particles and multifunctional epoxy resins, is formulated to enhance bonding performance on low surface energy substrates.

Benefits of technology

The adhesive composition provides improved wetting and adhesion to low surface energy substrates, resulting in robust and reliable bonding with consistent fracture toughness and cohesive failure modes, suitable for demanding applications like aerospace.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure IMGF000007_0001
    Figure IMGF000007_0001
  • Figure IMGF000007_0002
    Figure IMGF000007_0002
  • Figure IMGF000010_0001
    Figure IMGF000010_0001
Patent Text Reader

Abstract

Disclosed herein is a method for bonding a first substrate with low surface energy to a second substrate using a thermosetting adhesive composition that has been formulated to enhance the bonding performance of the first substrate. The substrates with low surface energy include thermoplastic substrates and thermoplastic composites. The thermosetting adhesive composition includes: (a) a combination of multifunctional epoxy resins or an epoxy-based pre-react; (b) at least one amine as curing agent; (c) at least one wetting agent; and (d) a flow control agent or fillers.
Need to check novelty before this filing date? Find Prior Art