Cryogenic refrigeration device and refrigeration method using same

Abstract

A cryogenic refrigeration device (100) and a refrigeration method using same. The cryogenic refrigeration device (100) comprises a circulating refrigeration apparatus, a vibration damping device (3) and a test platform device (2), wherein the circulating refrigeration apparatus comprises a refrigeration chamber (1), a first heat exchange assembly and a second heat exchange assembly, the first heat exchange assembly having a medium outlet, a first medium inlet and a second medium inlet, and the second heat exchange assembly comprising a main throttling element (IV6), a main evaporator (IV7) and a first heat exchanger (IV5i); the medium outlet, a high-pressure line (IV11), the main throttling element (IV6), the first heat exchanger (IV5i), a bypass line (IV13) and the second medium inlet can be sequentially in communication and form a first cooling circuit; the medium outlet, the high-pressure line (IV11), the main throttling element (IV6), the main evaporator (IV7), a low-pressure line (IV12) and the first medium inlet can be sequentially in communication and form a second cooling circuit; the main evaporator (IV7) and the first heat exchanger (IV5i) can cool the temperature platform; the vibration damping device (3) has a line channel; line inlets and outlets of the refrigeration chamber (1) and a test chamber are both connected to two ends of the line channel; the high-pressure line (IV11), the low-pressure line (IV12) and the bypass line (IV13) all pass through the line channel; and the vibration damping device (3) can damp vibration of the high-pressure line (IV11), the low-pressure line (IV12) and the bypass line (IV13).

Description

Cryogenic Refrigeration Devices and Refrigeration Methods Technical Field

[0001] This invention relates to the field of refrigeration equipment technology, and in particular to a cryogenic refrigeration device and its refrigeration method. Background Technology

[0002] The development of technologies such as cryo-electron microscopy, quantum measurement, and mid-to-far infrared detection has not only raised the requirements for deep cryogenic working environments, but also imposed strict requirements on indicators such as temperature stability, vibration, and cooling time of refrigeration devices.

[0003] Dry refrigeration technology based on mechanical refrigeration has advantages over wet refrigeration technology using cryogenic working fluids such as longer lifespan, economy, small size, and light weight, and has become the mainstream refrigeration device for cryogenic testing instruments. However, mechanical refrigeration machines have problems such as insufficient temperature stability, high vibration, and long cooling and rewarming times, which restricts their application in instruments that require ultra-high temperature stability, ultra-low vibration, and rapid sample replacement.

[0004] Existing cryogenic refrigeration devices generally include a refrigeration unit, a testing platform, and a cold chain. The refrigeration unit is connected to the testing platform via a cold chain to cool the testing platform. This type of cryogenic refrigeration device relies solely on the cold chain for heat conduction and vibration reduction, resulting in poor low-temperature stability, significant vibration, and slow cooling speed. Summary of the Invention

[0005] The purpose of this invention is to provide a cryogenic refrigeration device and its refrigeration method to solve the problems existing in the prior art, improve refrigeration efficiency, and reduce vibration of circulating refrigeration equipment.

[0006] To achieve the above objectives, the present invention provides the following solution:

[0007] This invention provides a cryogenic refrigeration device, comprising a circulating refrigeration unit, a vibration damping device, and a testing platform device, wherein:

[0008] The circulating refrigeration equipment includes a refrigeration chamber, a first heat exchange component, and a second heat exchange component. The first heat exchange component is connected to the refrigeration chamber and has a medium outlet, a first medium inlet, and a second medium inlet. The medium outlet, the first medium inlet, and the second medium inlet are all located within the refrigeration chamber. The second heat exchange component includes a main throttling element, a main evaporator, and a first heat exchanger. The inlet of the main throttling element and the inlet of the first heat exchanger are both connected to the medium outlet via a high-pressure pipeline. The outlet of the main throttling element is connected to the inlet of the main evaporator. The outlet of the main evaporator is connected to the first medium inlet via a low-pressure pipeline. The outlet of the first heat exchanger is connected to the second medium inlet via a bypass pipeline. The medium outlet, the high-pressure pipeline, the first heat exchanger, the bypass pipeline, and the second medium inlet can be sequentially connected to form a first cooling circuit. The medium outlet, the high-pressure pipeline, the main throttling element, the main evaporator, the low-pressure pipeline, and the first medium inlet can also be sequentially connected to form a second cooling circuit.

[0009] The test platform device includes a test chamber and a temperature platform, with the temperature platform located in the test chamber; both the main evaporator and the first heat exchanger are capable of cooling the temperature platform;

[0010] The vibration damping device has a pipeline channel. The pipeline inlet and outlet of the refrigeration chamber and the pipeline inlet and outlet of the test chamber are respectively sealed and connected to both ends of the pipeline channel. The high-pressure pipeline, the low-pressure pipeline and the bypass pipeline are all installed in the pipeline channel. The high-pressure pipeline, the low-pressure pipeline and the bypass pipeline are all fixedly connected to the vibration damping device. The vibration damping device can dampen the vibration of the high-pressure pipeline, the low-pressure pipeline and the bypass pipeline.

[0011] Preferably, the vibration damping device includes a vibration damping body and a partition. The vibration damping body has the pipeline channel. The partition is fixedly connected to the pipeline channel of the vibration damping body and divides the vibration damping body into two cavities. The partition has three through holes. The high-pressure pipeline, the low-pressure pipeline, and the bypass pipeline all pass through one of the through holes. The high-pressure pipeline, the low-pressure pipeline, and the bypass pipeline are all sealed to their respective through holes. The vibration damping body can dampen the high-pressure pipeline, the low-pressure pipeline, and the bypass pipeline.

[0012] Preferably, it further includes a first vibration damping base, the partition plate is fixedly connected to the first vibration damping base, and the first vibration damping base can dampen the vibration of the partition plate.

[0013] Preferably, the test platform device further includes a second vibration damping base, the temperature platform is connected to the second vibration damping base, and the second vibration damping base can dampen the temperature platform.

[0014] Preferably, the refrigeration chamber is equipped with a refrigeration unit, and the first heat exchange assembly includes a gaseous medium storage tank, a refrigeration unit, a compressor, a first-stage heat exchanger, a second-stage heat exchanger, a third-stage heat exchanger, a secondary throttling element, a secondary evaporator, a liquid medium storage tank, a first valve, a second valve, and a third valve; the first-stage heat exchanger has a first heat exchange channel, a second heat exchange channel, a third heat exchange channel, and a fourth heat exchange channel; the second-stage heat exchanger has a fifth heat exchange channel and a sixth heat exchange channel; the third-stage heat exchanger has a seventh heat exchange channel and an eighth heat exchange channel; the third heat exchanger has a first medium channel, and the second heat exchanger has a second medium channel; the refrigeration unit has a first-stage cold head and a second-stage cold head; the third heat exchanger and the second heat exchanger are respectively in contact with the first-stage cold head and the second-stage cold head; the inlet of the compressor is connected to the outlet of the gaseous medium storage tank; the compressor outlet, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, and the... The seventh heat exchange channel, the secondary throttling element, the secondary evaporator, the eighth heat exchange channel, the sixth heat exchange channel, the second heat exchange channel, the first valve, and the compressor inlet can be sequentially connected to form a heat exchange circuit; the compressor outlet, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, the liquid medium storage tank, the high-pressure pipeline, the first heat exchanger, the bypass pipeline, the fourth heat exchange channel, the third valve, and the compressor inlet can be sequentially connected to form the first cooling circuit; the compressor outlet, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, the liquid medium storage tank, the high-pressure pipeline, the main throttling element, the main evaporator, the low-pressure pipeline, the third heat exchange channel, the second valve, and the compressor inlet can be sequentially connected to form the second cooling circuit.

[0015] Preferably, the system further includes a primary refrigeration base plate, a secondary refrigeration base plate, a primary refrigeration cold shield, and a secondary refrigeration cold shield. The primary refrigeration base plate and the secondary refrigeration base plate are fixedly connected to the primary cold head and the secondary cold head, respectively. The primary refrigeration base plate and the primary refrigeration cold shield are fixedly connected to form a first cooling shroud, and the secondary refrigeration base plate and the secondary refrigeration cold shield are fixedly connected to form a second cooling shroud. The primary refrigeration base plate and the primary refrigeration cold shield are both disposed within the refrigeration chamber, and the secondary refrigeration base plate and the secondary refrigeration cold shield are both disposed within the first cooling shroud. The primary heat exchanger is disposed between the inner wall of the refrigeration chamber and the outer wall of the first cooling shroud, and the secondary heat exchanger is disposed between the inner wall of the first cooling shroud and the outer wall of the second cooling shroud. The tertiary heat exchanger, the secondary throttling element, the secondary evaporator, and the liquid medium storage tank are disposed within the second cooling shroud.

[0016] Preferably, the temperature platform includes a primary temperature platform, a primary platform cold shield, a secondary temperature platform, a secondary platform cold shield, a tertiary temperature platform, and a tertiary platform cold shield, all disposed within the test chamber. The primary platform cold shield is fixedly connected to the primary temperature platform to form a first test cover. The secondary platform cold shield is fixedly connected to the secondary temperature platform to form a second test cover. The tertiary platform cold shield is fixedly connected to the tertiary temperature platform to form a third test cover. The first test cover is disposed within the test chamber, the second test cover is disposed inside the first test cover, and the third test cover is disposed inside the second test cover. The third test cover is connected to the second test cover, the second test cover is connected to the first test cover, and the first test cover is connected to the second vibration damping base.

[0017] Preferably, the second heat exchange assembly further includes a fourth heat exchanger, a fifth heat exchanger, a sixth heat exchanger, and a seventh heat exchanger; the first heat exchange assembly further includes an eighth heat exchanger and a ninth heat exchanger; the fourth heat exchanger has a ninth heat exchange channel and a tenth heat exchange channel; the first heat exchanger has a third medium channel; the fourth heat exchanger has a fourth medium channel; the fifth heat exchanger has a fifth medium channel; the sixth heat exchanger has a sixth medium channel; the seventh heat exchanger has a seventh medium channel; the eighth heat exchanger has an eighth medium channel; and the ninth heat exchanger has a ninth medium channel; the compressor outlet, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, the liquid medium storage tank, and the... The high-pressure pipeline, the tenth heat exchange channel, the third medium channel, the fifth medium channel, the seventh medium channel, the bypass pipeline, the ninth medium channel, the fourth heat exchange channel, the third valve, and the compressor inlet can be sequentially connected to form the first cooling circuit; the compressor outlet, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, the liquid medium storage tank, the high-pressure pipeline, the tenth heat exchange channel, the main throttling element, the main evaporator, the ninth medium channel, the fourth medium channel, the sixth medium channel, the low-pressure pipeline, the eighth medium channel, the second valve, and the compressor inlet can be sequentially connected to form the second cooling circuit.

[0018] The present invention also provides a cryogenic refrigeration method based on the aforementioned cryogenic refrigeration device, comprising the following steps:

[0019] The sample and / or testing instrument are placed on the temperature platform, and the cooling medium circulates in the first cooling loop and cools the temperature platform through the first heat exchanger.

[0020] When the temperature of the temperature platform reaches the set temperature, the cooling medium circulates in the second cooling circuit and cools the temperature platform through the main evaporator; the sample is then tested and / or the testing instrument is used for testing.

[0021] During the cooling process of the temperature platform, the vibration damping device is used to dampen the high-pressure pipeline, the low-pressure pipeline and the bypass pipeline.

[0022] Preferably, the first heat exchange assembly includes a gaseous medium storage tank, a refrigerator, a compressor, a first-stage heat exchanger, a second-stage heat exchanger, a third-stage heat exchanger, a second heat exchanger, a secondary throttling element, a secondary evaporator, a liquid medium storage tank, a first valve, a second valve, and a third valve; the first-stage heat exchanger has a first heat exchange channel, a second heat exchange channel, a third heat exchange channel, and a fourth heat exchange channel; the second-stage heat exchanger has a fifth heat exchange channel and a sixth heat exchange channel; the third-stage heat exchanger has a seventh heat exchange channel and an eighth heat exchange channel; the third heat exchanger has a first medium channel; the second heat exchanger has a second medium channel; the refrigerator has a first-stage cold head and a second-stage cold head; the third heat exchanger and the second heat exchanger are respectively in contact with the first-stage cold head and the second-stage cold head; the inlet of the compressor is connected to the outlet of the gaseous medium storage tank; the compressor outlet, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, and the seventh heat exchange channel are all connected together. The secondary throttling element, the secondary evaporator, the eighth heat exchange channel, the sixth heat exchange channel, the second heat exchange channel, the first valve, and the compressor inlet can be sequentially connected to form a heat exchange circuit; the compressor outlet, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, the liquid medium storage tank, the high-pressure pipeline, the first heat exchanger, the bypass pipeline, the fourth heat exchange channel, the third valve, and the compressor inlet can be sequentially connected to form a first cooling circuit; the compressor outlet, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, the liquid medium storage tank, the high-pressure pipeline, the main throttling element, the main evaporator, the low-pressure pipeline, the third heat exchange channel, the second valve, and the compressor inlet can be sequentially connected to form a second cooling circuit;

[0023] The refrigeration unit is turned on, the first valve is opened, and the second and third valves are closed. The compressor drives the cooling medium in the gaseous medium storage tank to flow in the heat exchange circuit. When the cooling medium flows through the third heat exchanger, the first-stage cold head performs first-stage cooling on the cooling medium. When the cooling medium flows through the second heat exchanger, the second-stage cold head performs second-stage cooling on the cooling medium. After flowing through the secondary throttling element, the cooling medium changes from a gaseous state to a liquid state. When the cooling medium flows through the secondary evaporator, the secondary evaporator performs tertiary cooling on the cooling medium.

[0024] When the cooling medium in the heat exchange circuit reaches the set temperature, the first valve is closed and the third valve is opened. The compressor drives the cooling medium to flow in the first cooling circuit. When the cooling medium flows through the first heat exchanger, it can absorb the heat of the temperature plateau.

[0025] When the temperature of the temperature platform reaches the set temperature, the first valve is closed and the second valve is opened. The compressor drives the cooling medium to flow in the second cooling circuit. The main throttling element lowers the temperature of the cooling medium flowing through the main throttling element. When the cooling medium flows through the main evaporator, it can absorb the heat of the temperature platform.

[0026] The present invention achieves the following technical effects compared to the prior art:

[0027] This invention provides a cryogenic refrigeration device and its refrigeration method, including a circulating refrigeration unit, a vibration damping device, and a testing platform device. The circulating refrigeration unit includes a refrigeration chamber, a first heat exchange component, and a second heat exchange component. The first heat exchange component has a medium outlet, a first medium inlet, and a second medium inlet, all of which are located within the refrigeration chamber. The second heat exchange component includes a main throttling element, a main evaporator, and a first heat exchanger. The inlet of the main throttling element is connected to the medium outlet via a high-pressure pipeline. The two outlets of the main throttling element are respectively connected to the inlet of the main evaporator and the inlet of the first heat exchanger. The outlet of the main evaporator is connected to the first medium inlet via a low-pressure pipeline, and the outlet of the first heat exchanger is connected to the second medium inlet via a bypass pipeline. The medium outlet, high-pressure pipeline, and... The first heat exchanger, bypass pipeline, and second medium inlet can be sequentially connected to form a first cooling circuit. The medium outlet, high-pressure pipeline, main throttling element, main evaporator, low-pressure pipeline, and first medium inlet can be sequentially connected to form a second cooling circuit. The test platform device includes a test chamber and a three-stage temperature platform, with the three-stage temperature platform located in the test chamber. Both the main evaporator and the first heat exchanger can cool the three-stage temperature platform. The vibration damping device has a pipeline channel. The pipeline inlets and outlets of the refrigeration chamber and the test chamber are respectively sealed and connected to both ends of the pipeline channel. The high-pressure pipeline, low-pressure pipeline, and bypass pipeline all pass through the pipeline channel and are fixedly connected to the vibration damping device. The vibration damping device can dampen the high-pressure pipeline, low-pressure pipeline, and bypass pipeline.

[0028] This invention first circulates the cooling medium in a first cooling loop, cooling the tertiary temperature platform through a first heat exchanger in the first cooling loop. When the temperature of the tertiary temperature platform reaches the set temperature, the cooling medium circulates in a second cooling loop, cooling the tertiary temperature platform again through the main evaporator. This invention divides the refrigeration of the tertiary temperature platform into two stages, performing graded refrigeration, which can improve refrigeration efficiency. This invention uses vibration damping devices to dampen the high-pressure pipeline, low-pressure pipeline, and bypass pipeline, thereby reducing the impact of vibration from the circulating refrigeration equipment on the tertiary temperature platform. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0030] Figure 1 is a schematic diagram of the cryogenic refrigeration device provided in Example 1;

[0031] Figure 2 is a schematic diagram of the refrigeration machine provided in Example 1;

[0032] Figure 3 is a schematic diagram of the test platform device provided in Example 1;

[0033] Figure 4 is a schematic diagram of the vibration reduction device provided in Example 1;

[0034] Figure 5 is a schematic diagram of the helium throttling cycle refrigeration module provided in Example 1;

[0035] In the diagram: 100. Cryogenic Refrigeration Device; 1. Refrigeration Chamber; I1. Refrigeration Unit; I2. Refrigeration Base Plate; I3. Refrigeration Cover; I4. Primary Refrigeration Base Plate; I5. Secondary Refrigeration Base Plate; I6. Primary Refrigeration Cold Screen; I7. Secondary Refrigeration Cold Screen; 2. Test Platform Device; II1. Secondary Vibration Damping Base; II2. Test Base Plate; II3. Test Cover; II4. Primary Temperature Platform; II5. Primary Platform Cold Screen; II6. Secondary Temperature Platform; II7. Secondary Platform Cold Screen; II8. III. Temperature Platform; II9. III. Platform Cold Screen; II10. Primary Support Component; II11. Secondary Support Component; II12. Tertiary Support Component; 3. Vibration Damping Device; III1. First Vibration Damping Base; III2. Left Outer Bellows; III3. Right Outer Bellows; III4. Left Inner Bellows; III5. Right Inner Bellows; III6. Partition Plate; III7. Through-Plate Joint; 4. Helium Throttling Cycle Refrigeration Module; IV1. Compressor; IV2. Gaseous Medium Storage Tank; IV IV3i, First valve; IV3ii, Second valve; IV3iii, Third valve; IV3iv, Fourth valve; IV4i, First-stage heat exchanger; IV4ii, Second-stage heat exchanger; IV4iii, Third-stage heat exchanger; IV4iv, Fourth-stage heat exchanger; IV5i, First heat exchanger; IV5ii, Second heat exchanger; IV5iii, Third heat exchanger; IV5iv, Fourth heat exchanger; IV5v, Fifth heat exchanger; IV5vi, Sixth heat exchanger; IV5vii, Third... Seventh heat exchanger; IV5viii, eighth heat exchanger; IV5ix, ninth heat exchanger; IV6, main throttling element; IV7, main evaporator; IV8, secondary throttling element; IV9, secondary evaporator; IV10, liquid medium storage tank; IV11, high-pressure pipeline; IV12, low-pressure pipeline; IV13, bypass pipeline; IV14i, first cold chain; IV14ii, second cold chain; IV14iii, third cold chain; IV14iv, fourth cold chain; IV14v, fifth cold chain. Detailed Implementation

[0036] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention. It should be noted that, unless otherwise expressly limited or specified, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly indicating the sequential relationship of the indicated technical features.

[0037] The purpose of this invention is to provide a cryogenic refrigeration device and its refrigeration method to solve the problems existing in the prior art, improve refrigeration efficiency, and reduce vibration of circulating refrigeration equipment.

[0038] To make the above-mentioned objects, features and advantages of the present invention more apparent and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0039] Example 1

[0040] As shown in Figures 1-5, this embodiment provides a cryogenic refrigeration device 100, including a circulating refrigeration unit, a test platform device 2, and a vibration damping device 3. The circulating refrigeration unit includes a refrigeration chamber 1, a first heat exchange component, and a second heat exchange component. The first heat exchange component is connected to the refrigeration chamber 1 and has a medium outlet, a first medium inlet, and a second medium inlet. The medium outlet, the first medium inlet, and the second medium inlet are all located within the refrigeration chamber 1. The second heat exchange component includes a main throttling element IV6, a main evaporator IV7, and a first heat exchanger IV5i. The inlet of the main throttling element IV6 is connected to the medium outlet via a high-pressure pipeline IV11. The two outlets of the main throttling element IV6 are respectively connected to the inlet of the main evaporator IV7 and the inlet of the first heat exchanger IV5i. The outlet of the main evaporator IV7 is connected to the first medium inlet via a low-pressure pipeline IV12. The outlet of the first heat exchanger IV5i is connected to the second medium inlet via a bypass pipeline IV13. The medium outlet and the high-pressure pipeline IV5i are connected. V11, the first heat exchanger IV5i, the bypass pipe IV13, and the second medium inlet can be sequentially connected to form a first cooling circuit. The medium outlet, the high-pressure pipe IV11, the main throttling element IV6, the main evaporator IV7, the low-pressure pipe IV12, and the first medium inlet can be sequentially connected to form a second cooling circuit. The test platform device 2 includes a test chamber and a temperature platform, with the temperature platform located in the test chamber. Both the main evaporator IV7 and the first heat exchanger IV5i can cool the temperature platform. The vibration damping device 3 has a pipe channel. The pipe inlets and outlets of the refrigeration chamber 1 and the test chamber are respectively sealed and connected to both ends of the pipe channel. The high-pressure pipe IV11, the low-pressure pipe IV12, and the bypass pipe IV13 are all installed within the pipe channel. The high-pressure pipe IV11, the low-pressure pipe IV12, and the bypass pipe IV13 are all fixedly connected to the vibration damping device 3. The vibration damping device 3 can dampen the vibration of the high-pressure pipe IV11, the low-pressure pipe IV12, and the bypass pipe IV13.

[0041] In this embodiment, the cooling medium first circulates in the first cooling loop at a relatively high flow rate. The first heat exchanger IV5i in the first cooling loop cools the temperature platform, rapidly reducing its temperature from room temperature to the set temperature. Then, the cooling medium circulates in the second cooling loop, further cooling the temperature platform through the main evaporator IV7 and the main throttling element IV6. This embodiment divides the cooling of the temperature platform into two stages, performing graded cooling, which reduces power consumption and improves cooling efficiency. In this embodiment, the cooling chamber 1 and the test chamber are sealed together through the pipeline channels of the vibration damping device 3, forming a closed chamber. By evacuating this closed chamber, the vacuum requirements for deep cryogenic testing can be met. The vibration damping device 3 dampens the high-pressure pipeline IV11, the low-pressure pipeline IV12, and the bypass pipeline IV13, thereby reducing the impact of vibration from the circulating refrigeration equipment on the temperature platform.

[0042] In this embodiment, the vibration damping device 3 includes a vibration damping body and a partition plate III6. The vibration damping body has a pipeline channel, and the partition plate III6 is fixedly connected to the pipeline channel of the vibration damping body and divides the vibration damping body into two cavities. The partition plate III6 has three through holes, through which the high-pressure pipeline IV11, the low-pressure pipeline IV12, and the bypass pipeline IV13 each pass. The high-pressure pipeline IV11, the low-pressure pipeline IV12, and the bypass pipeline IV13 are all sealed to their respective through holes. The high-pressure pipeline IV11, the low-pressure pipeline IV12, and the bypass pipeline IV13 are all fixedly connected to the vibration damping body. The vibration damping body can dampen the vibration of the high-pressure pipeline IV11, the low-pressure pipeline IV12, and the bypass pipeline IV13. The vibration damping body is preferably a corrugated pipe.

[0043] In this embodiment, a first vibration damping base III1 is also included. The partition plate III6 is fixedly connected to the first vibration damping base III1. The first vibration damping base III1 can dampen the partition plate III6. It should be noted that the lower end of the partition plate III6 extends out of the vibration damping body to connect with the first vibration damping base III1. The partition plate III6 is sealed to the vibration damping body.

[0044] In this embodiment, the test platform device 2 further includes a second vibration damping base II1, the temperature platform is connected to the second vibration damping base II1, and the second vibration damping base II1 can dampen the temperature platform.

[0045] In this embodiment, the refrigeration chamber 1 is equipped with a refrigeration unit I1. The first heat exchange assembly includes a gaseous medium storage tank IV2, a refrigeration unit I1, a compressor IV1, a first-stage heat exchanger IV4i, a second-stage heat exchanger IV4ii, a third-stage heat exchanger IV4iii, a second-stage heat exchanger IV5ii, a third-stage heat exchanger IV5iii, a secondary throttling element IV8, a secondary evaporator IV9, a liquid medium storage tank IV10, a first valve IV3i, a second valve IV3ii, and a third valve IV3iii. The first-stage heat exchanger IV4i has a first heat exchange channel, a second heat exchange channel, and a third heat exchanger. The system includes a hot aisle, a third heat exchange aisle, and a fourth heat exchange aisle; the second-stage heat exchanger IV4ii has a fifth and a sixth heat exchange aisle; the third-stage heat exchanger IV4iii has a seventh and an eighth heat exchange aisle; the third heat exchanger IV5iii has a first medium channel; and the second heat exchanger IV5ii has a second medium channel; the refrigeration unit I1 has a first-stage cold head and a second-stage cold head; the third heat exchanger IV5iii and the second heat exchanger IV5ii are in contact with the first-stage and second-stage cold heads, respectively; the inlet of the compressor IV1 is connected to the outlet of the gaseous medium storage tank IV2. The outlet of compressor IV1, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, the secondary throttling element IV8, the secondary evaporator IV9, the eighth heat exchange channel, the sixth heat exchange channel, the second heat exchange channel, the first valve IV3i, and the inlet of compressor IV1 can be sequentially connected to form a heat exchange circuit; the outlet of compressor IV1, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, the liquid medium storage tank IV10, the high-pressure pipeline IV11, and the first heat exchanger IV 5i, bypass pipe IV13, fourth heat exchange channel, third valve IV3iii, and compressor IV1 inlet can be connected in sequence to form a first cooling circuit; compressor IV1 outlet, first heat exchange channel, first medium channel, fifth heat exchange channel, second medium channel, seventh heat exchange channel, liquid medium storage tank IV10, high pressure pipe IV11, main throttling element IV6, main evaporator IV7, low pressure pipe IV12, third heat exchange channel, second valve IV3ii, and compressor IV1 inlet can be connected in sequence to form a second cooling circuit.

[0046] In this embodiment, it also includes a primary refrigeration base plate I4, a secondary refrigeration base plate I5, a primary refrigeration cold shield I6, and a secondary refrigeration cold shield I7. The primary refrigeration base plate I4 and the secondary refrigeration base plate I5 are fixedly connected to the primary cold head and the secondary cold head, respectively. The primary refrigeration base plate I4 and the primary refrigeration cold shield I6 are fixedly connected to form a first cooling shroud. The secondary refrigeration base plate I5 and the secondary refrigeration cold shield I7 are fixedly connected to form a second cooling shroud. The primary refrigeration base plate I4 and the primary refrigeration cold shield I6 are both disposed in the refrigeration chamber 1. The secondary refrigeration base plate I5 and the secondary refrigeration cold shield I7 are both disposed in the first cooling shroud. The primary heat exchanger IV4i is disposed between the inner wall of the refrigeration chamber 1 and the outer wall of the first cooling shroud. The secondary heat exchanger IV4ii is disposed between the inner wall of the first cooling shroud and the outer wall of the second cooling shroud. The tertiary heat exchanger IV4iii, the secondary throttling element IV8, the secondary evaporator IV9, and the liquid medium storage tank IV10 are disposed in the second cooling shroud.

[0047] In this embodiment, the temperature platform includes a primary temperature platform II4, a secondary temperature platform II6, a primary platform cold shield II5, a secondary platform cold shield II7, a tertiary temperature platform II8, and a tertiary platform cold shield II9, all disposed within the test chamber. The primary platform cold shield II5 is fixedly connected to the primary temperature platform II4 to form a first test cover. The secondary platform cold shield II7 is fixedly connected to the secondary temperature platform II6 to form a second test cover. The tertiary platform cold shield II9 is ​​fixedly connected to the tertiary temperature platform II8 to form a third test cover. The first test cover is disposed within the test chamber, the second test cover is disposed within the first test cover, and the third test cover is disposed within the second test cover. The third test cover is connected to the second test cover, the second test cover is connected to the first test cover, and the first test cover is connected to the second vibration damping base II1. The test platform device 2 has a multi-stage radiative cold shield structure. By controlling the temperatures of the primary platform cold shield II5 and the secondary platform cold shield II7, the influence of external temperature changes on the temperatures of the tertiary temperature platform II8 and the tertiary platform cold shield II9 can be effectively reduced, thereby improving the temperature stability of the tertiary temperature platform II8 and the tertiary platform cold shield II9. Meanwhile, setting up three temperature platforms can ensure a wider range of deep cryogenic temperature testing.

[0048] In this embodiment, the second heat exchange assembly further includes a fourth-stage heat exchanger IV4iv, a fourth heat exchanger IV5iv, a fifth heat exchanger IV5v, a sixth heat exchanger IV5vi, and a seventh heat exchanger IV5vii; the first heat exchange assembly further includes an eighth heat exchanger IV5viii and a ninth heat exchanger IV5ix. The fourth-stage heat exchanger IV4iv has a ninth heat exchange channel and a tenth heat exchange channel; the first heat exchanger IV5i has a third medium channel; the fourth heat exchanger IV5iv has a fourth medium channel; the fifth heat exchanger IV5v has a fifth medium channel; the sixth heat exchanger IV5vi has a sixth medium channel; the seventh heat exchanger IV5vii has a seventh medium channel; the eighth heat exchanger IV5viii has an eighth medium channel; and the ninth heat exchanger IV5ix has a ninth medium channel. The outlet of compressor IV1, the first heat exchange channel, the first medium channel, and the... The fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, the liquid medium storage tank IV10, the high-pressure pipeline IV11, the tenth heat exchange channel, the third medium channel, the fifth medium channel, the seventh medium channel, the bypass pipeline IV13, the ninth medium channel, the fourth heat exchange channel, the third valve IV3iii, and the inlet of the compressor IV1 can be connected in sequence to form the first cooling circuit; the outlet of the compressor IV1, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, the liquid medium storage tank IV10, the high-pressure pipeline IV11, the tenth heat exchange channel, the main throttling element IV6, the main evaporator IV7, the ninth medium channel, the fourth medium channel, the sixth medium channel, the low-pressure pipeline IV12, the eighth medium channel, the second valve IV3ii, and the inlet of the compressor IV1 can be connected in sequence to form the second cooling circuit.

[0049] In a preferred embodiment, the vibration damping body includes a left outer corrugated pipe III2, a right outer corrugated pipe III3, a left inner corrugated pipe III4, and a right inner corrugated pipe III5. The left outer corrugated pipe III2 is sleeved outside the left inner corrugated pipe III4, and both are located on one side of the partition III6. The right outer corrugated pipe III3 is sleeved inside the right inner corrugated pipe III5, and both are located on the other side of the partition III6. The two ends of the left outer corrugated pipe III2 are respectively sealed and connected to the pipeline inlet / outlet of the test chamber and the partition III6. The two ends of the left inner corrugated pipe III4 are respectively sealed and connected to the pipeline inlet / outlet of the first test cover and the partition III6. The two ends of the right outer corrugated pipe III3 are respectively sealed and connected to the pipeline inlet / outlet of the cooling chamber 1 and the partition III6. The two ends of the right inner corrugated pipe III5 are respectively sealed and connected to the pipeline inlet / outlet of the first cooling cover I3 and the partition III6.

[0050] In a preferred embodiment, each through hole is provided with a through-plate connector III7, and the high-pressure pipeline IV11, the low-pressure pipeline IV12 and the bypass pipeline IV13 are respectively connected to the partition plate III6 through a through-plate connector III7.

[0051] In a preferred embodiment, the test chamber is defined by an internal space consisting of a detachably connected test base plate II2 and a test enclosure II3. A second vibration damping base II1 is fixedly connected below the test base plate II2. The test platform device 2 also includes a primary support II10, a secondary support II11, and a tertiary support II12. The two ends of the primary support II10 are fixedly connected to the test base plate II2 and the primary temperature platform II4, respectively, and the primary support II10 is used to support the primary temperature platform II4. The two ends of the secondary support II11 are fixedly connected to the secondary temperature platform II6 and the primary temperature platform II4, respectively, and the secondary support II11 is used to support the secondary temperature platform II6. The two ends of the tertiary support II12 are fixedly connected to the secondary temperature platform II6 and the tertiary temperature platform II8, respectively, and the tertiary support II12 is used to support the tertiary temperature platform II8. The test enclosure II3 is used to be fitted outside the test chamber, and the test enclosure II3 is provided with the pipe inlet and outlet of the test chamber.

[0052] In a preferred embodiment, gaseous medium storage tank IV2 is used to store helium, and liquid medium storage tank IV10 is used to store liquid helium; compressor IV1 is a DC compressor IV1; a fourth valve IV3iv is installed on the pipeline between gaseous medium storage tank IV2 and compressor IV1; the first valve IV3i, the second valve IV3ii, the third valve IV3iii, and the fourth valve IV3iv are all shut-off valves; the first-stage heat exchanger IV4i, the second-stage heat exchanger IV4ii, the third-stage heat exchanger IV4iii, and the fourth-stage heat exchanger IV4iv are all counter-flow multi-channel heat exchangers.

[0053] In a preferred embodiment, the third heat exchanger IV5iii, the eighth heat exchanger IV5viii, and the ninth heat exchanger IV5ix are fixedly connected to the primary refrigeration base plate I4, achieving a thermally coupled connection; the second heat exchanger IV5ii is fixedly connected to the secondary refrigeration base plate I5, achieving a thermally coupled connection; the secondary evaporator IV9 is thermally coupled to the liquid medium storage tank IV10; the main evaporator IV7 is thermally coupled to the tertiary temperature platform II8; the first heat exchanger IV5i is thermally coupled to the tertiary temperature platform II8 through the first cold chain IV14i, and the cooling capacity of the first heat exchanger IV5i is transferred to the tertiary temperature platform II8 through the first cold chain IV14i to cool the tertiary temperature platform II8; the fourth heat exchanger IV5iv and the fifth heat exchanger IV5v are connected to the secondary temperature platform I4. I6 is fixedly connected to achieve thermal coupling. The sixth heat exchanger IV5vi and the seventh heat exchanger IV5vii are thermally coupled to the first-stage temperature platform II4 through the second cold chain IV14ii and the third cold chain IV14iii, respectively. The second cold chain IV14ii and the third cold chain IV14iii are used to transfer the cooling capacity of the sixth heat exchanger IV5vi and the seventh heat exchanger IV5vii to cool the first-stage temperature platform II4. The low-pressure pipeline IV12 is fixedly connected to the right inner bellows III5 and the left inner bellows III4 through the fourth cold chain IV14iv to achieve thermal coupling. The bypass pipeline IV13 is fixedly connected to the right inner bellows III5 and the left inner bellows III4 through the fifth cold chain IV14v to achieve thermal coupling. It should be noted that the thermal coupling connection in this embodiment refers to heat exchange through contact heat exchange.

[0054] In a preferred embodiment, both the first vibration damping base III1 and the second vibration damping base II1 are made of heavy solid materials. The first vibration damping base III1 can reduce the mechanical vibration of the refrigerator I1 and the helium throttling cycle refrigeration module 4 (including all components forming the first and second cooling circuits), while the second vibration damping base II1 can reduce the impact of external environmental vibrations on the test platform device 2. The first vibration damping base III1 and the second vibration damping base II1 can be made of vibration damping materials such as rubber and foam, or they can be combined with active vibration damping measures to isolate vibration.

[0055] Example 2

[0056] This embodiment provides a cryogenic cooling method based on the cryogenic cooling device 100 of Embodiment 1, including the following steps:

[0057] The sample and / or testing instrument are placed on the temperature platform, and the cooling medium circulates in the first cooling loop and cools the temperature platform through the first heat exchanger IV5i. When the temperature of the temperature platform reaches the set temperature, the cooling medium circulates in the second cooling loop and cools the temperature platform through the main evaporator IV7. The sample is tested and / or the testing instrument is tested. During the cooling process of the temperature platform, the high-pressure pipeline IV11, the low-pressure pipeline IV12, and the bypass pipeline IV13 are damped by the vibration damping device 3.

[0058] In this embodiment, the first heat exchange assembly includes a gaseous medium storage tank IV2, a refrigerator I1, a compressor IV1, a first-stage heat exchanger IV4i, a second-stage heat exchanger IV4ii, a third-stage heat exchanger IV4iii, a third-stage heat exchanger IV5iii, a second-stage heat exchanger IV5ii, a secondary throttling element IV8, a secondary evaporator IV9, a liquid medium storage tank IV10, a first valve IV3i, a second valve IV3ii, and a third valve IV3iii; the first-stage heat exchanger IV4i has a first heat exchange channel, a second heat exchange channel, and a third heat exchange channel. The fourth heat exchanger, the second heat exchanger IV4ii has a fifth and a sixth heat exchanger, and the third heat exchanger IV4iii has a seventh and an eighth heat exchanger; the third heat exchanger IV5iii has a first medium channel, and the second heat exchanger IV5ii has a second medium channel; the refrigeration unit I1 has a first-stage cold head and a second-stage cold head; the third heat exchanger IV5iii and the second heat exchanger IV5ii are in contact with the first-stage cold head and the second-stage cold head, respectively; the inlet of the compressor IV1 is connected to the outlet of the gaseous medium storage tank IV2; the compressor... The outlet of IV1, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, the secondary throttling element IV8, the secondary evaporator IV9, the eighth heat exchange channel, the sixth heat exchange channel, the second heat exchange channel, the first valve IV3i, and the inlet of compressor IV1 can be sequentially connected to form a heat exchange circuit; the outlet of compressor IV1, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, the liquid medium storage tank IV10, the high-pressure pipeline IV11, and the first heat exchanger IV5i, bypass pipe IV13, fourth heat exchange channel, third valve IV3iii, and compressor IV1 inlet can be connected in sequence to form a first cooling circuit; compressor IV1 outlet, first heat exchange channel, first medium channel, fifth heat exchange channel, second medium channel, seventh heat exchange channel, liquid medium storage tank IV10, high pressure pipe IV11, main throttling element IV6, main evaporator IV7, low pressure pipe IV12, second valve IV3ii, and compressor IV1 inlet can be connected in sequence to form a second cooling circuit.

[0059] Turn on the refrigeration unit I1, open the first valve IV3i, and close the second valve IV3ii and the third valve IV3iii. The compressor IV1 drives the cooling medium in the gaseous medium storage tank IV2 to flow in the heat exchange circuit. When the cooling medium flows through the third heat exchanger IV5iii, the first-stage cold head performs first-stage cooling (first-stage pre-cooling) on ​​the cooling medium. When the cooling medium flows through the second heat exchanger IV5ii, the second-stage cold head performs second-stage cooling (second-stage pre-cooling) on ​​the cooling medium. After the cooling medium flows through the secondary throttling element IV8, it changes from a gaseous state to a liquid state. When the cooling medium flows through the secondary evaporator IV9, the secondary evaporator IV9 performs tertiary cooling on the cooling medium.

[0060] When the cooling medium in the heat exchange circuit reaches the set temperature, the first valve IV3i is closed and the third valve IV3iii is opened. The cooling medium is driven to flow in the first cooling circuit by the compressor IV1. When the cooling medium flows through the first heat exchanger IV5i, it can absorb the heat of the temperature plateau.

[0061] When the temperature of the temperature platform reaches the set temperature, the third valve IV3iii is closed and the second valve IV3ii is opened. The cooling medium is driven to flow in the second cooling circuit by the compressor IV1. The temperature of the cooling medium flowing through the main throttling element IV6 decreases. When the cooling medium flows through the main evaporator IV7, it can absorb the heat of the temperature platform.

[0062] In a preferred embodiment, the temperature of the cooling medium after heat exchange in the third heat exchanger IV5iii is the same as or approximately the same as the temperature of the first-stage cold head, approximately 80K, and the temperature of the cooling medium after heat exchange in the second heat exchanger IV5ii is the same as or approximately the same as the temperature of the second-stage cold head, approximately 10K to 20K.

[0063] In a preferred embodiment, the refrigeration chamber 1 includes a detachably fixed refrigeration base plate I2 and a refrigeration cover I3.

[0064] The cryogenic cooling method in this embodiment specifically includes:

[0065] 1. Rapid cooling methods:

[0066] Before conducting the deep cryogenic test, place the sample and / or test instrument on the three-level temperature platform II8, and install the three-level platform cold shield II9, the two-level platform cold shield II7, the one-level platform cold shield II5 and the test enclosure II3 in sequence.

[0067] The test platform device 2 and the cooling chamber 1 are evacuated to the rated vacuum level, and then the first cooling process begins.

[0068] In the initial cooling process, the refrigeration unit I1 and the compressor IV1 are turned on, the third shut-off valve (third valve IV3iii) is opened, and the first shut-off valve (first valve IV3i) and the second shut-off valve (second valve IV3ii) are closed. The cooling medium flows in the first cooling circuit and enters the bypass rapid cooling stage.

[0069] When the temperature of the third-level temperature platform II8 drops below 40K, the second shut-off valve is opened, the third shut-off valve is closed, the first shut-off valve remains closed, and the cooling medium flows in the second cooling circuit, entering the platform throttling and cooling stage.

[0070] When the temperature of the three-stage temperature platform II8 drops to the set temperature, the first and third shut-off valves close, the second shut-off valve remains open, the cooling medium flows in the second cooling circuit, and the deep cryogenic cooling stage begins; the test sample or test instrument begins testing.

[0071] When it is necessary to replace the test sample or test instrument in the three-stage temperature platform II8, keep the pre-cooling refrigerator I1 on and the vacuum level of the cooling chamber 1, close the second and third shut-off valves, and open the first shut-off valve. At this time, the helium throttling cooling cycle is still running normally. The high-pressure helium gas enters the secondary evaporator IV9 after being throttled by the secondary throttling element IV8, providing deep cryogenic cooling capacity for cooling the liquid medium storage tank IV10. The helium working fluid in the device is liquefied and stored in the liquid medium storage tank IV10.

[0072] With the help of partition III6, the test platform device 2 and the cooling chamber 1 can operate in different vacuum environments. When changing test samples or instruments in the three-stage temperature platform II8, it is necessary to restore the test platform device 2 to normal temperature and pressure. Partition III6 can keep the cooling chamber 1 in a low temperature and vacuum state, which facilitates the rapid start of the next round of testing. The method to restore the test platform device 2 to normal temperature and pressure includes: charging the test platform device 2 with a certain amount of helium gas, reducing its vacuum level and restoring it to normal pressure, while using the convection effect of helium gas to rapidly warm it up.

[0073] After the test platform device 2 returns to normal temperature and pressure, test chamber II3, primary platform cold shield II5, secondary platform cold shield II7, and tertiary platform cold shield II9 are opened in sequence to replace the test sample or test instrument. After replacement, they are installed in sequence, and the test platform device 2 is evacuated. After the vacuum degree of test platform device 2 reaches the required level, the third shut-off valve is opened, and the first and second shut-off valves are closed. The device enters the liquid helium cooling bypass rapid cooling stage. The subsequent operation procedure is the same as the subsequent procedure of the bypass rapid cooling stage, and the device enters the throttling cooling stage and the deep cryogenic cooling stage in sequence.

[0074] 2. Methods for achieving deep low-temperature variable temperature zones:

[0075] When the test sample or test instrument requires a variable temperature zone, the device enters the variable temperature zone stage. Considering the special characteristics of the helium throttling refrigeration system, the variable temperature zone stage is divided into the throttling variable temperature zone stage and the bypass variable temperature zone stage.

[0076] During the throttling temperature change zone, the first and third shut-off valves are kept closed, and the second shut-off valve is opened. By adjusting the DC compressor IV1, the low-pressure pressure of the throttling cycle is changed, thereby adjusting the refrigeration temperature of the main evaporator IV7, and thus achieving the temperature adjustment of the three-stage temperature platform II8.

[0077] When the required temperature of the third-stage temperature platform II8 is high, the throttling temperature change zone method is not applicable. The third shut-off valve is opened and the first and second shut-off valves are closed. At this time, the device enters the bypass temperature change zone stage. At this time, the third-stage temperature platform II8 is provided with cooling capacity by the first heat exchanger IV5i. The temperature of the third-stage temperature platform II8 is regulated by adjusting the temperature of the pre-cooling refrigerator I1 and the DC compressor IV1.

[0078] In a preferred embodiment, a heating module, a temperature detection module, and a controller are provided on the three-level temperature platform II8. Both the heating module and the temperature detection module are connected to the controller. The temperature detection module is used to detect the temperature of the three-level temperature platform II8 and transmit the temperature signal to the controller. The controller compares the measured temperature with a preset temperature. When the detected temperature is lower than the preset temperature, the controller controls the heating module to turn on; when the detected temperature is higher than the preset temperature, the controller controls the heating module to turn off, so as to perform thermal compensation temperature control.

[0079] Specific examples have been used to illustrate the principles and implementation methods of this invention. The descriptions of the above embodiments are only for the purpose of helping to understand the method and core ideas of this invention. Furthermore, those skilled in the art will recognize that, based on the ideas of this invention, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of this invention.

Claims

1. A cryogenic refrigeration device, characterized in that: This includes circulating refrigeration equipment, vibration damping devices, and testing platform equipment, among which: The circulating refrigeration equipment includes a refrigeration chamber, a first heat exchange component, and a second heat exchange component. The first heat exchange component is connected to the refrigeration chamber and has a medium outlet, a first medium inlet, and a second medium inlet. The medium outlet, the first medium inlet, and the second medium inlet are all located within the refrigeration chamber. The second heat exchange component includes a main throttling element, a main evaporator, and a first heat exchanger. The inlet of the main throttling element and the inlet of the first heat exchanger are both connected to the medium outlet via a high-pressure pipeline. The outlet of the main throttling element is connected to the inlet of the main evaporator. The outlet of the main evaporator is connected to the first medium inlet via a low-pressure pipeline. The outlet of the first heat exchanger is connected to the second medium inlet via a bypass pipeline. The medium outlet, the high-pressure pipeline, the first heat exchanger, the bypass pipeline, and the second medium inlet can be sequentially connected to form a first cooling circuit. The medium outlet, the high-pressure pipeline, the main throttling element, the main evaporator, the low-pressure pipeline, and the first medium inlet can also be sequentially connected to form a second cooling circuit. The test platform device includes a test chamber and a temperature platform, with the temperature platform located in the test chamber; both the main evaporator and the first heat exchanger are capable of cooling the temperature platform; The vibration damping device has a pipeline channel. The pipeline inlet and outlet of the refrigeration chamber and the pipeline inlet and outlet of the test chamber are respectively sealed and connected to both ends of the pipeline channel. The high-pressure pipeline, the low-pressure pipeline and the bypass pipeline are all installed in the pipeline channel. The high-pressure pipeline, the low-pressure pipeline and the bypass pipeline are all fixedly connected to the vibration damping device. The vibration damping device can dampen the vibration of the high-pressure pipeline, the low-pressure pipeline and the bypass pipeline.

2. The cryogenic refrigeration device according to claim 1, characterized in that: The vibration damping device includes a vibration damping body and a partition. The vibration damping body has the pipeline channel. The partition is fixedly connected to the pipeline channel of the vibration damping body and divides the vibration damping body into two cavities. The partition has three through holes. The high-pressure pipeline, the low-pressure pipeline, and the bypass pipeline all pass through one of the through holes. The high-pressure pipeline, the low-pressure pipeline, and the bypass pipeline are all sealed to their respective through holes. The vibration damping body can dampen the high-pressure pipeline, the low-pressure pipeline, and the bypass pipeline.

3. The cryogenic refrigeration device according to claim 2, characterized in that: It also includes a first vibration damping base, and the partition is fixedly connected to the first vibration damping base, which can dampen the vibration of the partition.

4. The cryogenic refrigeration device according to claim 1, characterized in that: The test platform device also includes a second vibration damping base, and the temperature platform is connected to the second vibration damping base, which can dampen the temperature platform.

5. The cryogenic refrigeration device according to claim 4, characterized in that: The refrigeration chamber is equipped with a refrigeration unit. The first heat exchange assembly includes a gaseous medium storage tank, a refrigeration unit, a compressor, a first-stage heat exchanger, a second-stage heat exchanger, a third-stage heat exchanger, a secondary throttling element, a secondary evaporator, a liquid medium storage tank, a first valve, a second valve, and a third valve. The first-stage heat exchanger has a first heat exchange channel, a second heat exchange channel, a third heat exchange channel, and a fourth heat exchange channel. The second-stage heat exchanger has a fifth heat exchange channel and a sixth heat exchange channel. The third-stage heat exchanger has a seventh heat exchange channel and an eighth heat exchange channel. The third heat exchanger has a first medium channel, and the second heat exchanger has a second medium channel. The refrigeration unit has a first-stage cold head and a second-stage cold head. The third heat exchanger and the second heat exchanger are in contact with the first-stage cold head and the second-stage cold head, respectively. The inlet of the compressor is connected to the outlet of the gaseous medium storage tank. The compressor outlet, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, and the seventh... The heat exchange channel, the secondary throttling element, the secondary evaporator, the eighth heat exchange channel, the sixth heat exchange channel, the second heat exchange channel, the first valve, and the compressor inlet can be sequentially connected to form a heat exchange circuit; the compressor outlet, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, the liquid medium storage tank, the high-pressure pipeline, the first heat exchanger, the bypass pipeline, the fourth heat exchange channel, the third valve, and the compressor inlet can be sequentially connected to form a first cooling circuit; the compressor outlet, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, the liquid medium storage tank, the high-pressure pipeline, the main throttling element, the main evaporator, the low-pressure pipeline, the third heat exchange channel, the second valve, and the compressor inlet can be sequentially connected to form a second cooling circuit.

6. The cryogenic refrigeration device according to claim 5, characterized in that: It also includes a primary refrigeration base plate, a secondary refrigeration base plate, a primary refrigeration cold shield, and a secondary refrigeration cold shield. The primary refrigeration base plate and the secondary refrigeration base plate are fixedly connected to the primary cold head and the secondary cold head, respectively. The primary refrigeration base plate and the primary refrigeration cold shield can be fixedly connected to form a first cooling shroud, and the secondary refrigeration base plate and the secondary refrigeration cold shield can be fixedly connected to form a second cooling shroud. The primary refrigeration base plate and the primary refrigeration cold shield are both disposed in the refrigeration chamber, and the secondary refrigeration base plate and the secondary refrigeration cold shield are both disposed within the first cooling shroud. The primary heat exchanger is disposed between the inner wall of the refrigeration chamber and the outer wall of the first cooling shroud, and the secondary heat exchanger is disposed between the inner wall of the first cooling shroud and the outer wall of the second cooling shroud. The tertiary heat exchanger, the secondary throttling element, the secondary evaporator, and the liquid medium storage tank are disposed within the second cooling shroud.

7. The cryogenic refrigeration device according to claim 6, characterized in that: The temperature platform includes a primary temperature platform, a primary platform cold shield, a secondary temperature platform, a secondary platform cold shield, a tertiary temperature platform, and a tertiary platform cold shield, all disposed within the test chamber. The test chamber comprises a test base plate and a detachable test cover. The primary platform cold shield is fixedly connected to the primary temperature platform to form a first test cover. The secondary platform cold shield is fixedly connected to the secondary temperature platform to form a second test cover. The tertiary platform cold shield is fixedly connected to the tertiary temperature platform to form a third test cover. The first test cover is disposed within the test chamber, the second test cover is disposed within the first test cover, and the third test cover is disposed within the second test cover. The third test cover is connected to the second test cover, the second test cover is connected to the first test cover, and the first test cover is connected to the second vibration damping base.

8. The cryogenic refrigeration device according to claim 7, characterized in that: The second heat exchange assembly further includes a fourth heat exchanger, a fifth heat exchanger, a sixth heat exchanger, and a seventh heat exchanger; the first heat exchange assembly further includes an eighth heat exchanger and a ninth heat exchanger; the fourth heat exchanger has a ninth heat exchange channel and a tenth heat exchange channel; the first heat exchanger has a third medium channel; the fourth heat exchanger has a fourth medium channel; the fifth heat exchanger has a fifth medium channel; the sixth heat exchanger has a sixth medium channel; the seventh heat exchanger has a seventh medium channel; the eighth heat exchanger has an eighth medium channel; and the ninth heat exchanger has a ninth medium channel; the compressor outlet, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, the liquid medium storage tank, and the high pressure... The pipeline, the tenth heat exchange channel, the third medium channel, the fifth medium channel, the seventh medium channel, the bypass pipeline, the ninth medium channel, the fourth heat exchange channel, the third valve, and the compressor inlet can be sequentially connected to form the first cooling circuit; the compressor outlet, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, the liquid medium storage tank, the high-pressure pipeline, the tenth heat exchange channel, the main throttling element, the main evaporator, the ninth medium channel, the fourth medium channel, the sixth medium channel, the low-pressure pipeline, the eighth medium channel, the second valve, and the compressor inlet can be sequentially connected to form the second cooling circuit.

9. A cryogenic refrigeration method based on the cryogenic refrigeration device of claim 1, characterized in that: Includes the following steps: The sample and / or testing instrument are placed on the temperature platform, and the cooling medium circulates in the first cooling loop and cools the temperature platform through the first heat exchanger. When the temperature of the temperature platform reaches the set temperature, the cooling medium is circulated in the second cooling circuit and cooled by the main evaporator; The sample is tested and / or the testing instrument is used to perform the test; During the cooling process of the temperature platform, the vibration damping device is used to dampen the high-pressure pipeline, the low-pressure pipeline and the bypass pipeline.

10. The cryogenic refrigeration method according to claim 9, characterized in that: The first heat exchange assembly includes a gaseous medium storage tank, a refrigerator, a compressor, a first-stage heat exchanger, a second-stage heat exchanger, a third-stage heat exchanger, a second heat exchanger, a secondary throttling element, a secondary evaporator, a liquid medium storage tank, a first valve, a second valve, and a third valve; the first-stage heat exchanger has a first heat exchange channel, a second heat exchange channel, a third heat exchange channel, and a fourth heat exchange channel; the second-stage heat exchanger has a fifth heat exchange channel and a sixth heat exchange channel; the third-stage heat exchanger has a seventh heat exchange channel and an eighth heat exchange channel; the third heat exchanger has a first medium channel, and the second heat exchanger has a second medium channel; the refrigerator has a first-stage cold head and a second-stage cold head; the third heat exchanger and the second heat exchanger are respectively in contact with the first-stage cold head and the second-stage cold head; the inlet of the compressor is connected to the outlet of the gaseous medium storage tank; the compressor outlet, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, and the... The secondary throttling element, the secondary evaporator, the eighth heat exchange channel, the sixth heat exchange channel, the second heat exchange channel, the first valve, and the compressor inlet can be sequentially connected to form a heat exchange circuit; the compressor outlet, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, the liquid medium storage tank, the high-pressure pipeline, the first heat exchanger, the bypass pipeline, the fourth heat exchange channel, the third valve, and the compressor inlet can be sequentially connected to form the first cooling circuit; the compressor outlet, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, the liquid medium storage tank, the high-pressure pipeline, the main throttling element, the main evaporator, the low-pressure pipeline, the third heat exchange channel, the second valve, and the compressor inlet can be sequentially connected to form the second cooling circuit; The refrigeration unit is turned on, the first valve is opened, and the second and third valves are closed. The compressor drives the cooling medium in the gaseous medium storage tank to flow in the heat exchange circuit. When the cooling medium flows through the third heat exchanger, the first-stage cold head performs first-stage cooling on the cooling medium. When the cooling medium flows through the second heat exchanger, the second-stage cold head performs second-stage cooling on the cooling medium. After flowing through the secondary throttling element, the cooling medium changes from a gaseous state to a liquid state. When the cooling medium flows through the secondary evaporator, the secondary evaporator performs tertiary cooling on the cooling medium. When the cooling medium in the heat exchange circuit reaches the set temperature, the first valve is closed and the third valve is opened. The compressor drives the cooling medium to flow in the first cooling circuit. When the cooling medium flows through the first heat exchanger, it can absorb the heat of the temperature plateau. When the temperature of the temperature platform reaches the set temperature, the first valve is closed and the second valve is opened. The compressor drives the cooling medium to flow in the second cooling circuit. The main throttling element lowers the temperature of the cooling medium flowing through the main throttling element. When the cooling medium flows through the main evaporator, it can absorb the heat of the temperature platform.

11. A cryogenic cooling method based on the cryogenic cooling device according to claim 2, characterized in that: Includes the following steps: The sample and / or testing instrument are placed on the temperature platform, and the cooling medium circulates in the first cooling loop and cools the temperature platform through the first heat exchanger. When the temperature of the temperature platform reaches the set temperature, the cooling medium is circulated in the second cooling circuit and cooled by the main evaporator; The sample is tested and / or the testing instrument is used to perform the test; During the cooling process of the temperature platform, the vibration damping device is used to dampen the high-pressure pipeline, the low-pressure pipeline and the bypass pipeline.

12. A cryogenic refrigeration method based on the cryogenic refrigeration device of claim 3, characterized in that: Includes the following steps: The sample and / or testing instrument are placed on the temperature platform, and the cooling medium circulates in the first cooling loop and cools the temperature platform through the first heat exchanger. When the temperature of the temperature platform reaches the set temperature, the cooling medium is circulated in the second cooling circuit and cooled by the main evaporator; The sample is tested and / or the testing instrument is used to perform the test; During the cooling process of the temperature platform, the vibration damping device is used to dampen the high-pressure pipeline, the low-pressure pipeline and the bypass pipeline.

13. A cryogenic refrigeration method based on the cryogenic refrigeration device of claim 4, characterized in that: Includes the following steps: The sample and / or testing instrument are placed on the temperature platform, and the cooling medium circulates in the first cooling loop and cools the temperature platform through the first heat exchanger. When the temperature of the temperature platform reaches the set temperature, the cooling medium is circulated in the second cooling circuit and cooled by the main evaporator; The sample is tested and / or the testing instrument is used to perform the test; During the cooling process of the temperature platform, the vibration damping device is used to dampen the high-pressure pipeline, the low-pressure pipeline and the bypass pipeline.

14. A cryogenic refrigeration method based on the cryogenic refrigeration device of claim 5, characterized in that: Includes the following steps: The sample and / or testing instrument are placed on the temperature platform, and the cooling medium circulates in the first cooling loop and cools the temperature platform through the first heat exchanger. When the temperature of the temperature platform reaches the set temperature, the cooling medium is circulated in the second cooling circuit and cooled by the main evaporator; The sample is tested and / or the testing instrument is used to perform the test; During the cooling process of the temperature platform, the vibration damping device is used to dampen the high-pressure pipeline, the low-pressure pipeline and the bypass pipeline.

15. A cryogenic cooling method based on the cryogenic cooling device of claim 6, characterized in that: Includes the following steps: The sample and / or testing instrument are placed on the temperature platform, and the cooling medium circulates in the first cooling loop and cools the temperature platform through the first heat exchanger. When the temperature of the temperature platform reaches the set temperature, the cooling medium is circulated in the second cooling circuit and cooled by the main evaporator; The sample is tested and / or the testing instrument is used to perform the test; During the cooling process of the temperature platform, the vibration damping device is used to dampen the high-pressure pipeline, the low-pressure pipeline and the bypass pipeline.

16. A cryogenic refrigeration method based on the cryogenic refrigeration device of claim 7, characterized in that: Includes the following steps: The sample and / or testing instrument are placed on the temperature platform, and the cooling medium circulates in the first cooling loop and cools the temperature platform through the first heat exchanger. When the temperature of the temperature platform reaches the set temperature, the cooling medium is circulated in the second cooling circuit and cooled by the main evaporator; The sample is tested and / or the testing instrument is used to perform the test; During the cooling process of the temperature platform, the vibration damping device is used to dampen the high-pressure pipeline, the low-pressure pipeline and the bypass pipeline.

17. A cryogenic refrigeration method based on the cryogenic refrigeration device of claim 8, characterized in that: Includes the following steps: The sample and / or testing instrument are placed on the temperature platform, and the cooling medium circulates in the first cooling loop and cools the temperature platform through the first heat exchanger. When the temperature of the temperature platform reaches the set temperature, the cooling medium is circulated in the second cooling circuit and cooled by the main evaporator; The sample is tested and / or the testing instrument is used to perform the test; During the cooling process of the temperature platform, the vibration damping device is used to dampen the high-pressure pipeline, the low-pressure pipeline and the bypass pipeline.

18. The cryogenic refrigeration method according to claim 11, characterized in that: The first heat exchange assembly includes a gaseous medium storage tank, a refrigerator, a compressor, a first-stage heat exchanger, a second-stage heat exchanger, a third-stage heat exchanger, a second heat exchanger, a secondary throttling element, a secondary evaporator, a liquid medium storage tank, a first valve, a second valve, and a third valve; the first-stage heat exchanger has a first heat exchange channel, a second heat exchange channel, a third heat exchange channel, and a fourth heat exchange channel; the second-stage heat exchanger has a fifth heat exchange channel and a sixth heat exchange channel; the third-stage heat exchanger has a seventh heat exchange channel and an eighth heat exchange channel; the third heat exchanger has a first medium channel, and the second heat exchanger has a second medium channel; the refrigerator has a first-stage cold head and a second-stage cold head; the third heat exchanger and the second heat exchanger are respectively in contact with the first-stage cold head and the second-stage cold head; the inlet of the compressor is connected to the outlet of the gaseous medium storage tank; the compressor outlet, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, and the... The secondary throttling element, the secondary evaporator, the eighth heat exchange channel, the sixth heat exchange channel, the second heat exchange channel, the first valve, and the compressor inlet can be sequentially connected to form a heat exchange circuit; the compressor outlet, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, the liquid medium storage tank, the high-pressure pipeline, the first heat exchanger, the bypass pipeline, the fourth heat exchange channel, the third valve, and the compressor inlet can be sequentially connected to form a first cooling circuit; the compressor outlet, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, the liquid medium storage tank, the high-pressure pipeline, the main throttling element, the main evaporator, the low-pressure pipeline, the third heat exchange channel, the second valve, and the compressor inlet can be sequentially connected to form a second cooling circuit; The refrigeration unit is turned on, the first valve is opened, and the second and third valves are closed. The compressor drives the cooling medium in the gaseous medium storage tank to flow in the heat exchange circuit. When the cooling medium flows through the third heat exchanger, the first-stage cold head performs first-stage cooling on the cooling medium. When the cooling medium flows through the second heat exchanger, the second-stage cold head performs second-stage cooling on the cooling medium. After flowing through the secondary throttling element, the cooling medium changes from a gaseous state to a liquid state. When the cooling medium flows through the secondary evaporator, the secondary evaporator performs tertiary cooling on the cooling medium. When the cooling medium in the heat exchange circuit reaches the set temperature, the first valve is closed and the third valve is opened. The compressor drives the cooling medium to flow in the first cooling circuit. When the cooling medium flows through the first heat exchanger, it can absorb the heat of the temperature plateau. When the temperature of the temperature platform reaches the set temperature, the first valve is closed and the second valve is opened. The compressor drives the cooling medium to flow in the second cooling circuit. The main throttling element lowers the temperature of the cooling medium flowing through the main throttling element. When the cooling medium flows through the main evaporator, it can absorb the heat of the temperature platform.

19. The cryogenic refrigeration method according to claim 12, characterized in that: The first heat exchange assembly includes a gaseous medium storage tank, a refrigerator, a compressor, a first-stage heat exchanger, a second-stage heat exchanger, a third-stage heat exchanger, a second heat exchanger, a secondary throttling element, a secondary evaporator, a liquid medium storage tank, a first valve, a second valve, and a third valve; the first-stage heat exchanger has a first heat exchange channel, a second heat exchange channel, a third heat exchange channel, and a fourth heat exchange channel; the second-stage heat exchanger has a fifth heat exchange channel and a sixth heat exchange channel; the third-stage heat exchanger has a seventh heat exchange channel and an eighth heat exchange channel; the third heat exchanger has a first medium channel, and the second heat exchanger has a second medium channel; the refrigerator has a first-stage cold head and a second-stage cold head; the third heat exchanger and the second heat exchanger are respectively in contact with the first-stage cold head and the second-stage cold head; the inlet of the compressor is connected to the outlet of the gaseous medium storage tank; the compressor outlet, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, and the... The secondary throttling element, the secondary evaporator, the eighth heat exchange channel, the sixth heat exchange channel, the second heat exchange channel, the first valve, and the compressor inlet can be sequentially connected to form a heat exchange circuit; the compressor outlet, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, the liquid medium storage tank, the high-pressure pipeline, the first heat exchanger, the bypass pipeline, the fourth heat exchange channel, the third valve, and the compressor inlet can be sequentially connected to form a first cooling circuit; the compressor outlet, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, the liquid medium storage tank, the high-pressure pipeline, the main throttling element, the main evaporator, the low-pressure pipeline, the third heat exchange channel, the second valve, and the compressor inlet can be sequentially connected to form a second cooling circuit; The refrigeration unit is turned on, the first valve is opened, and the second and third valves are closed. The compressor drives the cooling medium in the gaseous medium storage tank to flow in the heat exchange circuit. When the cooling medium flows through the third heat exchanger, the first-stage cold head performs first-stage cooling on the cooling medium. When the cooling medium flows through the second heat exchanger, the second-stage cold head performs second-stage cooling on the cooling medium. After flowing through the secondary throttling element, the cooling medium changes from a gaseous state to a liquid state. When the cooling medium flows through the secondary evaporator, the secondary evaporator performs tertiary cooling on the cooling medium. When the cooling medium in the heat exchange circuit reaches the set temperature, the first valve is closed and the third valve is opened. The compressor drives the cooling medium to flow in the first cooling circuit. When the cooling medium flows through the first heat exchanger, it can absorb the heat of the temperature plateau. When the temperature of the temperature platform reaches the set temperature, the first valve is closed and the second valve is opened. The compressor drives the cooling medium to flow in the second cooling circuit. The main throttling element lowers the temperature of the cooling medium flowing through the main throttling element. When the cooling medium flows through the main evaporator, it can absorb the heat of the temperature platform.

20. The cryogenic refrigeration method according to claim 13, characterized in that: The first heat exchange assembly includes a gaseous medium storage tank, a refrigerator, a compressor, a first-stage heat exchanger, a second-stage heat exchanger, a third-stage heat exchanger, a second heat exchanger, a secondary throttling element, a secondary evaporator, a liquid medium storage tank, a first valve, a second valve, and a third valve; the first-stage heat exchanger has a first heat exchange channel, a second heat exchange channel, a third heat exchange channel, and a fourth heat exchange channel; the second-stage heat exchanger has a fifth heat exchange channel and a sixth heat exchange channel; the third-stage heat exchanger has a seventh heat exchange channel and an eighth heat exchange channel; the third heat exchanger has a first medium channel, and the second heat exchanger has a second medium channel; the refrigerator has a first-stage cold head and a second-stage cold head; the third heat exchanger and the second heat exchanger are respectively in contact with the first-stage cold head and the second-stage cold head; the inlet of the compressor is connected to the outlet of the gaseous medium storage tank; the compressor outlet, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, and the... The secondary throttling element, the secondary evaporator, the eighth heat exchange channel, the sixth heat exchange channel, the second heat exchange channel, the first valve, and the compressor inlet can be sequentially connected to form a heat exchange circuit; the compressor outlet, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, the liquid medium storage tank, the high-pressure pipeline, the first heat exchanger, the bypass pipeline, the fourth heat exchange channel, the third valve, and the compressor inlet can be sequentially connected to form the first cooling circuit; the compressor outlet, the first heat exchange channel, the first medium channel, the fifth heat exchange channel, the second medium channel, the seventh heat exchange channel, the liquid medium storage tank, the high-pressure pipeline, the main throttling element, the main evaporator, the low-pressure pipeline, the third heat exchange channel, the second valve, and the compressor inlet can be sequentially connected to form the second cooling circuit; The refrigeration unit is turned on, the first valve is opened, and the second and third valves are closed. The compressor drives the cooling medium in the gaseous medium storage tank to flow in the heat exchange circuit. When the cooling medium flows through the third heat exchanger, the first-stage cold head performs first-stage cooling on the cooling medium. When the cooling medium flows through the second heat exchanger, the second-stage cold head performs second-stage cooling on the cooling medium. After flowing through the secondary throttling element, the cooling medium changes from a gaseous state to a liquid state. When the cooling medium flows through the secondary evaporator, the secondary evaporator performs tertiary cooling on the cooling medium. When the cooling medium in the heat exchange circuit reaches the set temperature, the first valve is closed and the third valve is opened. The compressor drives the cooling medium to flow in the first cooling circuit. When the cooling medium flows through the first heat exchanger, it can absorb the heat of the temperature plateau. When the temperature of the temperature platform reaches the set temperature, the first valve is closed and the second valve is opened. The compressor drives the cooling medium to flow in the second cooling circuit. The main throttling element lowers the temperature of the cooling medium flowing through the main throttling element. When the cooling medium flows through the main evaporator, it can absorb the heat of the temperature platform.

Images