Optical fiber fixing substrate and method for manufacturing through-hole substrate

WO2026134010A1PCT designated stage Publication Date: 2026-06-25NIPPON ELECTRIC GLASS CO LTD
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Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
NIPPON ELECTRIC GLASS CO LTD
Filing Date
2025-12-08
Publication Date
2026-06-25

AI Technical Summary

Technical Problem

Existing optical fiber fixing substrates, particularly those used in Co-Packaged Optics, suffer from insufficient suppression of optical fiber misalignment, leading to potential light loss due to displacement of optical fibers during connection with optical waveguide circuits.

Method used

The optical fiber fixing substrate is designed with specific dimensions and surface roughness, including a matrix arrangement of through-holes with controlled inner surface roughness and angled configurations, ensuring precise alignment and fixation of optical fibers.

Benefits of technology

The substrate effectively suppresses optical fiber misalignment, reducing light loss and facilitating accurate positioning, thereby enhancing the reliability of optical connections.

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    Figure JP2025042640_25062026_PF_FP_ABST
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Abstract

Provided is an optical fiber fixing substrate with which it is possible to suppress positional deviation of an optical fiber.　An optical fiber fixing substrate (1) according to the present invention is a substrate for fixing an optical fiber, and is characterized by having a first main surface (1a) and a second main surface (1b) facing each other, the substrate thickness being 0.5-2 mm, a plurality of through-holes (1c) penetrating from the first main surface (1a) to the second main surface (1b) being provided so as to be arranged in a matrix of two or more rows and two or more columns, and when a surface forming each of the plurality of through-holes (1c) is defined as an inner surface (1d) of each of the plurality of through-holes (1c), the arithmetic average roughness Ra of the inner surface (1d) of each of the plurality of through-holes (1c) being 0.04-0.24 μm.
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