Method and system for enhancing growth of chalcogen films

By employing separate introduction of metal and chalcogen precursors with additives in a controlled environment, the method addresses the challenges of grain size and contamination in TMD film fabrication, resulting in high-quality, single-crystalline TMD films for semiconductor applications.

WO2026135569A1PCT designated stage Publication Date: 2026-06-25NEXSTROM PTE LTD

Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
NEXSTROM PTE LTD
Filing Date
2025-12-18
Publication Date
2026-06-25

AI Technical Summary

Technical Problem

Conventional methods for fabricating large-area, high-quality transition metal dichalcogenide (TMD) films face challenges such as reduced grain size, thickness variation, and contamination, which compromise the performance of TMDs in semiconductor applications due to the limitations of chalcogen source selection and vaporization issues.

Method used

A method and system using separate introduction of metal and chalcogen precursors with additives in a controlled environment, such as oxidizing and redox additives, to enhance the growth of TMD films, achieving larger grain sizes, reduced defects, and improved crystallinity through precise control of nucleation density and contamination.

Benefits of technology

The method enables the production of high-quality, single-crystalline TMD films with controlled grain sizes and reduced defects, suitable for advanced semiconductor applications, by mitigating unwanted side effects associated with single chalcogen sources.

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Abstract

A device is described The device includes a substrate and a transition metal chalcogen film formed on the substrate by vapor deposition. The transition metal chalcogen film is continuous over an area of the substrate and is at least one monolayer thick. The area has a dimension of at least two inches. The vapor deposition may use a metal precursor, a chalcogen precursor, and at least one additive.
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