Amplifier assembly having EMC shielding

WO2026137318A1PCT designated stage Publication Date: 2026-07-02HARMAN BECKER AUTOMOTIVE SYSTEMS INC +1
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Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
HARMAN BECKER AUTOMOTIVE SYSTEMS INC
Filing Date
2024-12-26
Publication Date
2026-07-02

AI Technical Summary

Technical Problem

Existing amplifier assemblies in vehicle infotainment systems face challenges with large PCB areas, complex installation processes, and inadequate electromagnetic interference (EMI) shielding, which affect acoustic and mechanical stability.

Method used

A compact amplifier assembly design with a housing and top cover that includes an EMC shielding zone, where the PCB is clamped between the housing and top cover without direct contact with the edge, using threaded connections and flexible arms for secure fixation and heat dissipation.

Benefits of technology

The design achieves a more compact structure, simplified installation, enhanced EMC shielding, and improved acoustic and thermal performance by reducing PCB area and ensuring effective signal integrity.

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Abstract

The present disclosure relates to an amplifier assembly (100) having EMC shielding, comprising: a housing (10) comprising an accommodation portion (12) and an edge portion (14) extending outwardly from a top of the accommodation portion (12); a top cover (20) comprising a top cover main body (22) and an EMC shielding zone (24) at least partially surrounding the top cover main body (22); an amplifier module (30) comprising a PCB (32) arranged within an accommodation space defined by the housing (10) and the top cover (20), wherein the PCB (32) of the amplifier module (30) is clamped between the housing (10) and the top cover main body (22), and wherein the EMC shielding zone (24) of the top cover (20) is directly abutted against the edge portion (14).
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