BMS heat dissipation structure and BMS circuit board

Abstract

Provided in the present invention is a BMS heat dissipation structure, comprising a heat dissipation substrate, wherein at least part of the outer surface of the heat dissipation substrate is coated with a graphene heat dissipation layer. Further provided in the present invention is a BMS assembly, comprising: a BMS circuit board and the BMS heat dissipation structure as described above, wherein the BMS heat dissipation structure is connected to the BMS circuit board. The present invention provides a BMS heat dissipation structure and a BMS assembly. By coating at least part of the outer surface of a heat dissipation substrate with a graphene heat dissipation layer, graphene attached to the outer surface of an aluminum alloy can significantly improve the heat dissipation capacity of the heat dissipation substrate, since the heat conduction capacity of graphene is much higher than that of a heat dissipation substrate made of an aluminum alloy material, thereby improving the heat dissipation efficiency of the BMS heat dissipation structure per unit of area. Therefore, the volume of the BMS heat dissipation structure can be reduced on the premise of achieving the same heat dissipation efficiency, making a device more compact.

Description

A BMS heat dissipation structure and BMS circuit board

[0001] Cross-reference of related applications

[0002] This application claims priority to and is based on Chinese Patent Application No. 202423217065X, filed on December 25, 2024, with the invention title "A BMS Heat Dissipation Structure and BMS Component", the contents of which are incorporated herein by reference. Technical Field

[0003] This invention relates to the field of electronic systems, and more specifically, to a heat dissipation structure for a BMS and a BMS circuit board using the structure. Background Technology

[0004] A Battery Management System (BMS) is an electronic system used to monitor and manage battery packs, especially lithium-ion battery packs. BMS plays a central role in electric vehicles, hybrid vehicles, energy storage systems, portable electronic devices, and other applications requiring high-performance battery packs. Its main functions include: 1. Battery status monitoring, 2. Battery protection, 3. Balance management, 4. Communication, 5. Fault diagnosis and alarms, and 6. Thermal management.

[0005] The basic components of a Battery Management System (BMS) include: a BMS circuit board, a battery connector, a heat sink, battery voltage acquisition terminals, and battery temperature acquisition terminals. Because the MOSFETs in a BMS have internal resistance, they generate heat when a large current flows through them. If the temperature exceeds a certain value, the MOSFETs will be damaged, and the BMS will become ineffective. Therefore, proper heat dissipation for the BMS is crucial.

[0006] Traditional heat dissipation methods include adding heat sinks to heat-generating components and silicone pads between them to conduct heat from the MOS to the heat sink for heat exchange with the outside environment. When the current is large, additional teeth are added to the heat sink to improve heat dissipation capacity, or aluminum alloy is used as the BMS circuit board to increase its own heat dissipation capacity.

[0007] When a BMS needs to handle high current, the heat dissipation effect of ordinary aluminum sheets is insufficient, requiring the addition of serrated heat sinks. However, small heat sinks have insufficient heat dissipation capacity, so large heat sinks are usually used to meet the high current requirements, resulting in an excessively large overall BMS size and high cost. When using aluminum alloy as the circuit board, to meet the circuit design and handle high current, the overall circuit board size becomes too large, leading to an excessively large overall BMS size. Furthermore, the heat from the MOSFETs is transferred to the MCU, causing the MCU to reach its temperature threshold and malfunction, thus preventing the MOSFETs from performing at their full potential.

[0008] During long-term use, heat sinks undergo chemical or electrochemical reactions on their surface due to various factors, leading to corrosion. Corrosion significantly reduces the heat dissipation performance of the heat sink, causing the overall BMS temperature to rise excessively, thus affecting the normal operation of the equipment and shortening its lifespan.

[0009] From the perspective of thermal radiation, aluminum has a relatively low emissivity. In comparison, the thermal radiation heat dissipation coefficient of aluminum heat sinks is relatively low, ranging from 0.02 to 0.1. Heat sinks can only enhance their thermal radiation dissipation effect by increasing the radiating area. To meet circuit requirements, this results in an excessively large overall BMS size. Summary of the Invention

[0010] The main technical problem to be solved by this invention is to provide a BMS heat dissipation structure that improves heat dissipation efficiency per unit area and reduces the volume of the heat dissipation structure.

[0011] To address the aforementioned technical problems, the present invention provides a BMS heat dissipation structure, including a heat dissipation substrate for abutting against a BMS circuit board, wherein at least a portion of the outer surface of the heat dissipation substrate is coated with a graphene heat dissipation layer.

[0012] In a preferred embodiment, the thickness of the graphene heat dissipation layer is 10µm to 30µm.

[0013] In a preferred embodiment: the device includes a base plate and a plurality of heat sinks, one side of the heat sink is connected to the base plate, and the other side of the heat sink extends away from the base plate; a heat dissipation channel is formed between two adjacent heat sinks.

[0014] The present invention also provides a BMS component, comprising: a BMS circuit board and a BMS heat dissipation structure as described in claim 3, wherein the BMS heat dissipation structure is connected to the BMS circuit board.

[0015] In a preferred embodiment: the BMS circuit board includes a circuit board body and power components. The circuit board body is divided into a power area and a control area, and the power components are installed in the power area.

[0016] In a preferred embodiment: the circuit board body has a partition hole between the power region and the control region.

[0017] In a preferred embodiment: the partition hole is a strip-shaped hole.

[0018] In a preferred embodiment: a thermally conductive layer is provided between the power element and the substrate, and the thermally conductive layer is in thermal contact with both the power element and the substrate.

[0019] In a preferred embodiment: the circuit board body and the base plate are provided with a first mounting hole and a second mounting hole at corresponding positions. The circuit board body and the base plate are connected and fixed through the mounting holes and connectors to form a space between the circuit board body and the base plate to accommodate the power element and the heat-conducting layer; the height of the space is less than the sum of the height of the power element and the thickness of the heat-conducting pad.

[0020] In a preferred embodiment: the connector includes a single-ended copper stud and a fixing screw; the upper end of the single-ended copper stud passes through the second mounting hole, and the lower end abuts against the base plate; the upper end of the fixing screw passes through the first mounting hole and is fixedly connected to the lower end of the single-ended copper stud.

[0021] Compared with the prior art, the technical solution of the present invention has the following beneficial effects:

[0022] This invention provides a BMS (Body Management System) heat dissipation structure by coating at least a portion of the outer surface of a heat dissipation substrate with a graphene heat dissipation layer. Since graphene's thermal conductivity is far superior to that of aluminum alloy heat dissipation substrates, the graphene attached to the aluminum alloy outer surface significantly improves the heat dissipation capacity of the substrate, thereby enhancing the BMS heat dissipation structure and increasing heat dissipation efficiency per unit area. This allows for a reduction in the size of the BMS heat dissipation structure while achieving the same heat dissipation efficiency, resulting in a more compact device.

[0023] This invention provides a BMS heat dissipation structure. In addition to improving thermal conductivity, the graphene heat dissipation layer can also form a protective layer on the heat dissipation substrate, which can block the erosion of moisture, oxygen and various corrosive substances, so that the heat dissipation performance of the heat dissipation substrate remains stable and there is no need to worry about the BMS failing due to excessive temperature caused by corrosion.

[0024] This invention provides a BMS component that, by setting a single-headed copper stud between the circuit board body and the base plate, can form a space for placing power components and a heat-conducting layer between the circuit board body and the base plate, and the back of the base plate can be made into a plane. Attached Figure Description

[0025] Figure 1 is an exploded view of a BMS component according to an embodiment of this application;

[0026] Figure 2 is a perspective assembly diagram of a BMS component according to an embodiment of this application;

[0027] Figure 3 is a schematic diagram of the heat dissipation structure of some embodiments of this application;

[0028] Figure 4 is a top view of the heat dissipation structure of some embodiments of this application;

[0029] Figure 5 is a top view of a BMS circuit board according to some embodiments of this application;

[0030] Figure 6 is a bottom view of a BMS circuit board according to some embodiments of this application;

[0031] Figure 7 is a schematic diagram of the circuit board body of some embodiments of this application;

[0032] Figure 8 is a side view of a BMS component according to some embodiments of this application;

[0033] Figure 9 is a schematic diagram of a BMS component and a battery module according to an embodiment of this application;

[0034] Figure 10 is a top view of a BMS component according to an embodiment of this application.

[0035] Reference numerals: BMS component 10, battery module 20, BMS circuit board 1, circuit board body 11, partition hole 111, body part 112, conductive layer 113, external power supply hole 114, power area 115, control area 116, second mounting hole 117, power element 12, MOSFET 121, sampling resistor 122, first side 13, second side 14, heat dissipation structure 2, heat dissipation substrate 21, substrate plate 211, groove 2111, heat sink 212, first mounting hole 213, third mounting hole 214, heat dissipation layer 22, thermally conductive layer 3, fixing screw 4, single-headed copper stud 5. Detailed Implementation

[0036] To make the technical solution and features of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and specific examples. It should be understood that these examples are only used to illustrate the present invention and are not intended to limit the scope of the present invention. After reading the present invention, any modifications of the present invention in various equivalent forms by those skilled in the art fall within the scope defined by the appended claims.

[0037] The BMS component 10 according to an embodiment of this application is described in detail below with reference to Figures 1-10.

[0038] Referring to Figures 1-3 and Figure 10, the BMS component 10 according to an embodiment of this application includes a BMS circuit board 1 and a BMS heat dissipation structure 2. The BMS heat dissipation structure 2 includes a heat dissipation substrate 21, and at least a portion of the outer surface of the heat dissipation substrate 21 is coated with a graphene heat dissipation layer 22. The BMS heat dissipation structure 2 is connected to the BMS circuit board 1. Since the thermal conductivity of the graphene heat dissipation layer 22 is much higher than that of the heat dissipation substrate 21, the graphene heat dissipation layer 22 attached to the outer surface of the heat dissipation substrate 21 can significantly improve the heat dissipation capacity of the BMS heat dissipation structure 2, thereby improving the overall performance of the BMS component 10. For example, in this embodiment, if only an aluminum heat dissipation substrate 21 is used, the thermal radiation heat dissipation coefficient of aluminum is relatively low (0.02 to 0.1). The aluminum heat dissipation substrate 21 can only enhance the thermal radiation heat dissipation effect by increasing the radiation area. To meet the circuit requirements, this would result in an excessively large overall BMS volume. The graphene heat dissipation layer 22 has a thermal radiation coefficient greater than 0.95, which improves the heat dissipation efficiency of the BMS heat dissipation structure 2 per unit area, significantly improves the heat dissipation capacity of the BMS heat dissipation structure 2, avoids the BMS component 10 from being too hot and thus affecting the performance of the BMS circuit board 1, and reduces the volume of the BMS heat dissipation structure 2 while meeting the heat dissipation requirements, thereby reducing the volume of the BMS component 10 and reducing the space occupation rate of the BMS component 10 in the battery pack.

[0039] In this embodiment, all outer surfaces of the heat dissipation substrate 21 are coated with a graphene heat dissipation layer 22. In some embodiments not shown in the figures, only a portion of the outer surface of the heat dissipation substrate 21 is coated with the graphene heat dissipation layer 22, for example, only the upper surface of the heat dissipation substrate 21 is coated with the graphene heat dissipation layer 22. It is understood that the graphene heat dissipation layer 22 can be coated at any location on the heat dissipation substrate 21, and the shape and size of the coated graphene heat dissipation layer 22 can be changed according to actual needs. In addition, the graphene heat dissipation layer 22 can be coated using conventional metal spraying technology or 360° high-speed rotating automatic spraying technology to control the thickness of the graphene heat dissipation layer 22 to be between 10 μm and 30 μm.

[0040] Referring to Figures 1, 2, 4, and 10, the heat dissipation substrate 21 includes a substrate plate 211 and heat sinks 212. One side of the heat sink 212 is connected to the substrate plate 211, and the other side of the heat sink 212 extends towards the side of the substrate plate 211 away from the BMS circuit board 1. A heat dissipation channel is formed between two adjacent heat sinks 212. Thus, the heat generated by the BMS circuit board 1 is transferred to the heat sink 212 through the substrate plate 211. The substrate plate 211 and the heat sink 212 together disperse excess heat to the outside, preventing the BMS component 10 from overheating and affecting the performance of the BMS circuit board 1. The extension of the heat sink 212 away from the BMS circuit board 1 increases the contact space between the heat sink 212 and the surrounding environment, effectively improving the heat dissipation capacity of the heat sink 212. At the same time, the arrangement of the heat sink 212 does not interfere with the BMS circuit board 1.

[0041] In some embodiments not shown in the figures, the heat sink 212 may extend in other directions besides extending toward the side of the base plate 211 away from the BMS circuit board 1, such as extending toward the side of the base plate 211 facing the BMS circuit board 1, that is, the heat sink 212 extends toward the lower side of the base plate 211, or the heat sink 212 extends in a direction parallel to the BMS circuit board 1.

[0042] The heat sink 212 can be a flat plate structure, which is simple in structure and easy to manufacture. The heat sink 212 can also be a plate structure with teeth, which can increase the surface area of ​​the heat sink 212 and thus improve the heat dissipation capacity.

[0043] As shown in Figures 1, 5, and 6, the BMS circuit board 1 includes a circuit board body 11 and a power component 12. The power component 12 is mounted on the side surface of the circuit board body 11 facing the BMS heat dissipation structure 2. A heat-conducting layer 3 is provided between the power component 12 and the substrate 211. One side of the heat-conducting layer 3 is attached to the power component 12, and the other side of the heat-conducting layer 3 is attached to the substrate 211.

[0044] In other words, the BMS circuit board has a first side 13 and a second side 14. The first side 13 faces the BMS heat dissipation structure 2, and the second side 14 faces away from the BMS heat dissipation structure 2. That is, the upper surface of the BMS circuit board is the first side 13, and the lower surface is the second side 14. The above-mentioned "power component 12 is mounted on the side surface of the circuit board body 11 facing the BMS heat dissipation structure 2" means that the power component 12 is mounted on the first side 13.

[0045] Specifically, by mounting the power element 12 on the first side 13, the power element 12 is brought closer to the BMS heat dissipation structure 2. This allows the heat generated by the power element 12 to be more easily dispersed to the BMS heat dissipation structure 2 and then to the surrounding environment, thus improving the heat dissipation efficiency of the BMS assembly 10. Furthermore, by providing a thermally conductive layer 3 between the power element 12 and the substrate 211, the heat generated by the power element 12 is dispersed more quickly onto the substrate 211 and then to the surrounding environment via the heat sink 212. This improves the heat exchange efficiency between the BMS circuit board 1 and the BMS heat dissipation structure 2, further enhancing the heat dissipation efficiency of the BMS assembly 10.

[0046] In this embodiment, the thermally conductive layer 3 can be a highly thermally conductive silicone pad, thermal grease, or the like. To enhance thermal conductivity, the distance between the substrate 211 and the circuit board body 11 should be less than the sum of the height of the power component 12 and the thickness of the thermally conductive layer 3. This ensures a tight fit between the thermally conductive layer 3 and the power component 12, as well as with the substrate 211.

[0047] Referring to Figure 5, the circuit board body 11 includes a power region 115 and a control region 116, which are separated by a partition hole 111. A power component 12 is mounted in the power region 115. This separation of the power region 115 and control region 116 by the partition hole 111 reduces heat transfer from the power region 115 to the control region 116, mitigating the impact of the high temperature in the power region 115 on the MCU (Microcontroller Unit) in the control region 116. This allows for an increase in the temperature threshold of the power component 12 without affecting its lifespan, thereby improving the high-current carrying time of the BMS circuit board 1 and enhancing its overall performance. The control region 116 may contain logic circuits, data acquisition circuits, etc.

[0048] Referring to Figure 5, the power region 41 and the control region 42 are arranged spaced apart in the first direction. The partition hole 111 is an elongated hole. In this embodiment, there are two partition holes 111, but the number of partition holes 111 can be increased or decreased as needed. The length extension direction of the partition hole 111 is the second direction, and the angle between the second direction and the first direction is 70° to 110°. This helps to block heat transfer between the power region 41 and the control region 42, preventing the control region 42 from affecting its performance due to excessive temperature.

[0049] In this embodiment, the first direction is the F1-F2 direction, and the second direction is the F3-F4 direction. The angle between the first and second directions is 90°. It is understood that the angle between the first and second directions can also be 70°, 80°, 100°, 110°, or any other angle between 70° and 110°. There can be one, two, three, or more partition holes 111. These will not be listed individually here.

[0050] The partition hole 111 can also be a matrix arrangement of round holes, square holes, or other shapes of holes.

[0051] Referring to Figures 5 and 7, the circuit board body 11 includes a body portion 112 and multiple conductive layers 113. The multiple conductive layers 113 are embedded in the body portion 112. The circuit board body 11 has an exposed conductive layer area. Specifically, the exposed conductive layer area is located on the first side 13, where the conductive layers 113 are exposed, and the power components 12 are disposed in the exposed conductive layer area. In particular, the provision of multiple conductive layers 113 improves the current carrying capacity of the BMS circuit board 1, enhances the flexibility of board layout and wiring, and exposes part of the conductive layers 113, thereby improving the heat exchange capacity between the BMS circuit board 1 and the outside environment, as well as the heat dissipation efficiency of the conductive layers 3.

[0052] The number of conductive layers 113 can be two, three, four or more. The conductive layers 113 can be copper foil, aluminum foil, etc.

[0053] In this embodiment, the body part 112 can be made of epoxy resin board or plastic board.

[0054] Referring to Figures 6 and 7, on the surface of the circuit board body 11 facing away from the BMS heat dissipation structure 2, i.e., on the second side 14, the conductive layer 113 in the area facing away from the power component 12 is exposed. This improves the heat exchange capability between the BMS circuit board 1 and the external environment, as well as the heat dissipation efficiency of the BMS circuit board 1.

[0055] Referring to Figures 4 and 9, the substrate 211 is provided with a first mounting hole 213 and a third mounting hole 214. The first mounting hole 213 is used to connect the substrate 211 to the circuit board body 11, and the third mounting hole 214 is used to connect the substrate 211 to the battery module 20. Specifically, the first mounting hole 213, in conjunction with a connector, is used to fix the substrate 211 to the circuit board body 11. The third mounting hole 214, in conjunction with a connector, is used to fix the BMS assembly 10 to the battery module 20.

[0056] The first mounting hole 213 is a threaded hole or a smooth hole. There can be one, two, three or more first mounting holes 213. For example, as shown in Figure 4, there are six first mounting holes 213. The third mounting hole 214 is a threaded hole or a smooth hole. There can be one, two, three or more third mounting holes 214. For example, as shown in Figure 4, there are four third mounting holes 214.

[0057] The connection between the substrate 211 and the battery module 20 at the third mounting hole 214 can be a fixing screw connection, a stud connection, a rivet connection, or other connection methods. For example, in an embodiment not shown in the figures of this application, the substrate 211 and the battery module 20 are connected at the third mounting hole 214 by fixing screws.

[0058] Specifically, the circuit board body 11 is provided with a second mounting hole 117, which is used to connect the circuit board body 11 to the base plate 211. The number of first mounting holes 213 and second mounting holes 117 is the same, and they correspond one-to-one in space. For example, as shown in Figures 2, 4, and 5, there are six first mounting holes 213 and six third mounting holes. The connection between the base plate 211 and the circuit board body 11 at the first mounting hole 213 can be a fixing screw connection, a riveting connection, a screw connection, or other connection methods. For example, as shown in Figure 2, the base plate 211 and the circuit board body 11 are connected at the first mounting hole 213 by a single-ended copper stud 5 and a fixing screw 4; the upper end of the single-ended copper stud 5 passes through the second mounting hole 117, and the lower end abuts against the base plate 211; the upper end of the fixing screw 4 passes through the first mounting hole 213 and is fixedly connected to the lower end of the single-ended copper stud 5.

[0059] In some embodiments, referring to Figures 1, 2, and 8, a groove 2111 is provided on the substrate 211. The groove 2111 is recessed in a direction away from the circuit board body 11, as shown in Figure 8, where the groove 2111 is recessed upwards. The power element 12 is at least partially located within the groove 2111, and a heat-conducting layer 3 is provided between the power element 12 and the substrate 211. Therefore, by partially positioning the power element 12 within the groove 2111, the total thickness of the BMS circuit board 1 and the BMS heat dissipation structure 2 is reduced. By placing the heat-conducting layer 3 between the power element 12 and the substrate 211, the heat generated by the power element 12 can be effectively transferred to the substrate 211 and then dissipated through the BMS heat dissipation structure 2, optimizing the heat conduction path and improving heat dissipation efficiency. Meanwhile, the design of the groove 2111 allows the power component 12 to be placed inside the groove 2111, making the circuit board body 11 closer to the base plate 211, increasing the heat conduction efficiency from the circuit board body 11 to the base plate 211, making the distance between the circuit board body 11 and the heat dissipation base 21 smaller, making the structure of the BMS component 10 more compact, and reducing the space occupied by the BMS component 10.

[0060] The power element 12 generates a significant amount of heat during operation. In some embodiments, as shown in Figures 1, 2, 5, and 8, the power element 12 may include a MOSFET 121 and a sampling resistor 122. The MOSFET 121 is at least partially located within some recesses 2111, and a thermally conductive layer 3 is provided between the MOSFET 121 and the substrate 211. The sampling resistor 122 is at least partially located within other recesses 2111, and a thermally conductive layer 3 is provided between the sampling resistor 122 and the substrate 211. Therefore, the heat generated by the MOSFET 121 and the sampling resistor 122 can be more effectively transferred to the substrate 211 and then dissipated through the BMS heat dissipation structure 2, optimizing the heat conduction path and improving heat dissipation efficiency. The design of the recess 2111 allows the MOSFET 121 and the sampling resistor 122 to be partially placed within the recess 2111, making the circuit board body 11 closer to the substrate 211. This increases the heat conduction efficiency between the circuit board body 11 and the substrate 211, reduces the distance between the circuit board body 11 and the heat dissipation substrate 21, and makes the structure of the BMS component 10 more compact, thus reducing the space occupied by the BMS component 10.

[0061] In other embodiments, the power element 12 may also be other types of heating elements.

[0062] Referring to Figures 5 and 7, the circuit board body 11 includes a body portion 112 and multiple conductive layers 113. The multiple conductive layers 113 are embedded in the body portion 112, stacked and spaced apart from each other. An external power supply hole 114 is provided on the circuit board body 11, and the external power supply hole 114 connects to the multiple conductive layers 113. Specifically, the external power supply hole 114 is used for soldering power lines. The external power supply hole 114 allows the power lines to contact the multiple conductive layers 113, increasing the contact area between the power lines and the multiple conductive layers 113, thereby improving the conductivity of the conductive layers 113. The power lines can provide the voltage required for the operation of the BMS circuit board 1.

[0063] The above is only one specific embodiment of the present invention, but the design concept of the present invention is not limited thereto. Any non-substantial modifications made to the present invention using this concept shall be deemed as infringing the protection scope of the present invention. Industrial applicability

[0064] This invention provides a BMS (Body Management System) heat dissipation structure, including a heat dissipation substrate, at least a portion of which is coated with a graphene heat dissipation layer on its outer surface. This invention also provides a BMS component, including a BMS circuit board and the aforementioned BMS heat dissipation structure, wherein the BMS heat dissipation structure is connected to the BMS circuit board. This invention provides a BMS heat dissipation structure and a BMS component. By coating at least a portion of the outer surface of the heat dissipation substrate with a graphene heat dissipation layer, the graphene, due to its significantly higher thermal conductivity than aluminum alloy heat dissipation substrates, significantly improves the heat dissipation capacity of the heat dissipation substrate, thereby enhancing the BMS heat dissipation structure and increasing the heat dissipation efficiency per unit area. This allows for a reduction in the size of the BMS heat dissipation structure while achieving the same heat dissipation efficiency, making the equipment more compact and industrially practical.

Claims

1. A BMS circuit board with improved heat dissipation structure, characterized in that: The BMS circuit board includes a circuit board body, power components, and a BMS heat dissipation structure. The BMS heat dissipation structure has a heat dissipation substrate that abuts against the BMS circuit board. The power components are mounted on the side of the circuit board body facing the BMS heat dissipation structure. A thermally conductive layer is provided between the power components and the heat dissipation substrate. One surface of the thermally conductive layer is attached to the power components, and the other surface of the thermally conductive layer is attached to the heat dissipation substrate. At least a portion of the outer surface of the heat dissipation substrate is coated with a graphene heat dissipation layer.

2. The BMS circuit board with improved heat dissipation structure according to claim 1, characterized in that: The thickness of the graphene heat dissipation layer is 10um to 30um.

3. A BMS circuit board with an improved heat dissipation structure according to claim 1 or 2, characterized in that: The device includes a base plate and multiple heat sinks. One side of each heat sink is connected to the base plate, and the other side of each heat sink extends away from the base plate. A heat dissipation channel is formed between two adjacent heat sinks.

4. A BMS circuit board with improved heat dissipation structure, the BMS circuit board comprising a circuit board body, power components, and a BMS heat dissipation structure, the circuit board body being divided into a power area and a control area, the power components being installed in the power area, characterized in that... The power element is further provided with a heat-conducting layer, one surface of which is attached to the power element and the other surface of which is attached to the substrate. At least a portion of the outer surface of the heat dissipation substrate is coated with a graphene heat dissipation layer.

5. The BMS circuit board with improved heat dissipation structure according to claim 4, characterized in that, The circuit board body has a partition hole between the power area and the control area.

6. The BMS circuit board with improved heat dissipation structure according to claim 5, characterized in that, The partition hole is a strip-shaped hole.

7. The BMS circuit board with improved heat dissipation structure according to claim 4, characterized in that, The thermal conductive layer material is a silicone pad or thermal grease.

8. The BMS circuit board with improved heat dissipation structure according to claim 4, characterized in that: The circuit board body and the base plate are provided with a first mounting hole and a second mounting hole at corresponding positions. The circuit board body and the base plate are connected and fixed through the mounting holes and connectors to form a space between the circuit board body and the base plate to accommodate the power element and the heat-conducting layer. The height of the space is less than the sum of the height of the power element and the thickness of the heat-conducting pad.

9. A BMS circuit board with an improved heat dissipation structure according to claim 8, characterized in that: The connector includes a single-ended copper stud and a fixing screw; the upper end of the single-ended copper stud passes through the second mounting hole, and the lower end abuts against the base plate; the upper end of the fixing screw passes through the first mounting hole and is fixedly connected to the lower end of the single-ended copper stud.

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