Composite material and mixture
A composite material with high thermal conductivity and low electrical conductivity addresses eddy current loss and heat dissipation challenges, enhancing motor performance in mobile devices.
WO2026140120A1PCT designated stage Publication Date: 2026-07-02UACJ CORP
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- UACJ CORP
- Filing Date
- 2024-12-25
- Publication Date
- 2026-07-02
Smart Images
Figure JP2024045957_02072026_PF_FP_ABST
Abstract
The composite material contains a dispersed material having a thermal conductivity of 100 W / K∙m or more and a thermoplastic resin base material having a volume resistivity of 10 GΩ∙cm or more, the thermoplastic resin base material being interposed between the dispersed material. The mixture contains a dispersed material having a thermal conductivity of 100 W / K∙m or more and having one or a plurality of maximum values in the particle size distribution and a powder having a volume resistivity of 10 GΩ∙cm or more. The volume ratio of the volume of the powder to the total volume of the dispersed material and the powder is 0.5-50 vol%.
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