Member for semiconductor manufacturing apparatus

The semiconductor manufacturing apparatus member addresses discharge issues by optimizing plug and gas flow path dimensions and material properties, ensuring stable gas flow and preventing discharge, enhancing manufacturing efficiency.

WO2026140389A1PCT designated stage Publication Date: 2026-07-02NGK INSULATORS LTD

Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
NGK INSULATORS LTD
Filing Date
2025-09-19
Publication Date
2026-07-02

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  • Figure JP2025033076_02072026_PF_FP_ABST
    Figure JP2025033076_02072026_PF_FP_ABST
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Abstract

A wafer mounting platform (10) is provided with a ceramic plate (20), plug arrangement holes (24), and plugs (50). The plugs 50 are arranged in the plug arrangement holes 24 and have gas passages 52. As seen in a vertical cross section of each plug 50, the expression F = εr * d1 / {x * (εr * d1 + d2)} ≤ 0.25 is satisfied, where d1 [mm] is the vertical-direction length of the gas passages 52, d2 [mm] is the vertical-direction length of a plug body 51 between the gas passages 52, εr is the relative dielectric constant of the plug body 51, and x [items] is the number of gas passages 52 arranged in the vertical direction in the vertical cross section of the plug 50.
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