Ceramic wiring member
The ceramic wiring member's innovative conductor design with protruding and recessed connections enhances connection strength and reduces delamination, improving solder contact and manufacturing efficiency.
WO2026141056A1PCT designated stage Publication Date: 2026-07-02NGK CORP
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- NGK CORP
- Filing Date
- 2025-12-16
- Publication Date
- 2026-07-02
Smart Images

Figure JP2025043969_02072026_PF_FP_ABST
Abstract
This ceramic wiring member comprises: a ceramic insulating substrate which has a first main surface and a second main surface, and in which a first layer including the first main surface and a second layer are laminated; and a conductive part which is disposed in contact with the insulating substrate and is formed from a conductor. The conductive part has an outer layer conductor which is formed on the first main surface, an inner layer conductor which is formed between the first layer and the second layer, and a lateral surface conductor which electrically connects the outer layer conductor and the inner layer conductor. The lateral surface conductor includes a lateral surface portion which is formed in contact with a lateral surface intersecting the first main surface in the first layer, a first connection portion which connects the lateral surface portion and the inner layer conductor, and a second connection portion which connects the lateral surface portion and the outer layer conductor. The first connection portion protrudes from the surface of the lateral surface portion, and the distal end of the first connection portion on the first main surface side thereof in a first direction heading from the second main surface toward the first main surface is located more toward the first main surface in comparison to the interface between the first layer and the inner layer conductor.
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