Antenna and electronic device

Abstract

An antenna and an electronic device, relating to the technical field of electronic devices. The antenna can solve the problem of electromagnetic compatibility caused by the discharge of static electricity on sensitive electronic components or traces. The antenna comprises a radiator, a grounding structure, a conductive portion, and an insulating layer. The radiator is configured to radiate signals; the grounding structure is electrically connected to the radiator; the conductive portion is electrically connected to the radiator; the conductive portion is configured to collect electrostatic charges, which are discharged by the grounding structure; the insulating layer covers the surface of the radiator; and the conductive portion and a feed portion are exposed from the insulating layer.

Description

Antennas and electronic devices Technical Field

[0001] This application relates to the field of electronic equipment technology, and more particularly to an antenna and an electronic device. Background Technology

[0002] During use (e.g., in winter or when rubbing the screen), static electricity can easily accumulate on the screen surface of electronic devices. This static electricity can be conducted into the internal components of the device. When this static electricity is released at sensitive electronic components or traces, it can lead to electromagnetic compatibility issues, such as frequent crashes, automatic shutdowns, poor picture and volume quality, and intermittent signal strength. Summary of the Invention

[0003] This application provides an antenna and an electronic device that can solve the electromagnetic compatibility problem caused by static electricity discharge in sensitive electronic components or traces.

[0004] To achieve the above objectives, the embodiments of this application adopt the following technical solutions:

[0005] In a first aspect, this application provides an antenna comprising a radiator, a grounding structure, a conductive portion, and an insulating layer. The radiator is used to radiate signals, the grounding structure is electrically connected to the radiator, the conductive portion is electrically connected to the radiator, the conductive portion is used to collect static charge, and the static charge is released through the grounding structure. The insulating layer covers the surface of the radiator, and the conductive portion and the grounding structure are exposed to the insulating layer.

[0006] In this way, when there is static electricity around the antenna, the conductive part is exposed to the insulating layer. The conductive part provides a low-impedance release path for the static electricity, and the static charge can be effectively conducted to the conductive part. The conductive part is electrically connected to the radiator, and the static charge is conducted to the radiator through the conductive part. The static charge is then conducted to the grounding structure through the radiator for release.

[0007] Antennas enhance their electrostatic attraction capabilities by utilizing conductive parts, preventing static electricity from being conducted to other electronic components besides the antenna when it occurs. This avoids damage to other electronic components caused by static electricity and further prevents electromagnetic compatibility issues caused by static electricity, such as frequent crashes, automatic shutdowns, poor picture and volume quality, and intermittent signal strength.

[0008] Furthermore, an insulating layer covers the surface of the radiator, protecting it from direct contact with air and oxidation, thus ensuring its radiation performance. Additionally, the conductive parts and grounding structure are exposed to the insulating layer, which protects the radiator without reducing the antenna's electrostatic attraction capability. Therefore, the antenna provides excellent electrostatic protection while ensuring its radiation performance.

[0009] In one possible design of the first aspect, the radiator includes a first surface, and an insulating layer has a first through-hole that exposes a first region of the first surface, the first region forming a conductive portion. When static electricity accumulates around the antenna, the static charge can be conducted to the conductive portion. Furthermore, the radiator and the conductive portion are integral structural components; therefore, there is no additional connection resistance between the radiator and the conductive portion, and the radiator and the conductive portion have high conductivity. The static charge is directly conducted to the radiator via the conductive portion, and then conducted to the grounding structure for release via the radiator.

[0010] Furthermore, integrating the radiator and conductor into a single structural component simplifies the manufacturing process, reduces assembly steps, and lowers production costs. Additionally, the reduced number of connection points between the radiator and conductor avoids failures caused by poor connections, thus improving the overall reliability of the antenna.

[0011] In one possible design of the first aspect, the radiator has a first groove formed by at least a partial recess in a first region, and the inner wall of the first groove forms a conductive portion. After the insulating layer is attached to the surface of the radiator, a first through-hole is machined. During the drilling process of the insulating layer, at least a portion of the radiator opposite to the first through-hole can be removed to form the first groove. This reduces the machining difficulty of drilling the insulating layer, allows for lower precision in the drilling process, and thus improves the antenna's manufacturing efficiency and reduces its production cost.

[0012] Furthermore, when the area of ​​the first region is small, the conductive area of ​​the conductive part can be increased by the first groove, thereby improving the electrostatic attraction capability of the radiator. When static charge accumulated on the screen enters the electronic device through the gap, the radiator can effectively adsorb the static charge with the help of the conductive part. The static charge is then conducted to the grounding structure for release, preventing the static charge from being conducted to electronic components and causing electromagnetic compatibility problems.

[0013] In one possible design of the first aspect, the radiator further includes a second surface, with the first surface and the second surface disposed opposite each other along the thickness direction of the radiator. The insulating layer has a second through-hole that exposes a second region of the second surface, the second region forming a conductive portion.

[0014] In this way, the radiator and the conductive part are integrated into one structural component. There is no additional connection resistance between the radiator and the conductive part. The radiator and the conductive part have high conductivity. Static charge is directly conducted to the radiator through the conductive part, and then the static charge is conducted to the grounding structure for release through the radiator.

[0015] Furthermore, integrating the radiator and conductor into a single structural component simplifies the manufacturing process, reduces assembly steps, and lowers production costs. Additionally, the reduced number of connection points between the radiator and conductor avoids failures caused by poor connections, thus improving the overall reliability of the antenna.

[0016] The conductive part offers greater selectivity and flexibility in its placement. In other words, the conductive part can be formed from either the first or second region, allowing the radiator to adapt to different installation scenarios. For example, during the use of an electronic device, static electricity tends to concentrate on one side of the screen; the conductive part can be placed on the surface of the radiator facing the screen. Therefore, the position of the conductive part can be flexibly adjusted according to the specific internal layout of the electronic device and the expected electromagnetic environment.

[0017] In one possible design of the first aspect, the radiator has a second groove formed by at least a partial recess of the second region, the inner wall of the second groove forming a conductive portion. After the insulating layer is attached to the surface of the radiator, a second through-hole is machined. During the drilling process of the insulating layer, at least a portion of the radiator opposite to the second through-hole can be removed to form the second groove. This reduces the machining difficulty of drilling the insulating layer, allows for lower precision in the drilling process, and thus improves the antenna's manufacturing efficiency and reduces its production cost.

[0018] Furthermore, when the area of ​​the second region is small, the conductive area of ​​the conductive part can be increased by the second groove, thereby improving the electrostatic attraction capability of the radiator. When static charge accumulated on the screen enters the electronic device through the gap, the radiator can effectively adsorb the static charge with the help of the conductive part. The static charge is then conducted to the grounding structure for release, preventing the static charge from being conducted to electronic components and causing electromagnetic compatibility problems.

[0019] In one possible design of the first aspect, the radiator includes a third through-hole that penetrates the radiator along its thickness direction and is connected to the first through-hole, with the inner wall of the third through-hole forming a conductive portion.

[0020] After the insulating layer is attached to the surface of the radiator, a first through-hole is machined. During the hole-cutting process of the insulating layer, the portion of the radiator opposite to the first through-hole can be removed to form a third through-hole. This reduces the processing difficulty of the hole-cutting process of the insulating layer, allows for lower precision in the hole-cutting process, and thus improves the antenna processing efficiency and reduces the antenna production cost.

[0021] Furthermore, when the area of ​​the first region is small, the conductive area of ​​the conductive part can be increased through the third through-hole, thereby improving the electrostatic attraction capability of the radiator. When static charge accumulated on the screen enters the electronic device through the gap, the radiator can effectively adsorb the static charge with the help of the conductive part. The static charge is then conducted to the grounding structure for release, preventing the static charge from being conducted to electronic components and causing electromagnetic compatibility problems.

[0022] In one possible design of the first aspect, the third through-hole is also connected to the second through-hole. In this way, when drilling the insulating layer, both the insulating layer and the radiator are drilled together; that is, the first, second, and third through-holes are coaxially arranged, and all three are drilled in the same process. This improves both the antenna's current-carrying capability and its manufacturing efficiency.

[0023] The positions of the first through hole, the second through hole, and the third through hole can coincide with the avoidance hole. In this way, the area of ​​the hole on the radiator 41 can be reduced to ensure that the radiator maintains its original characteristics.

[0024] In one possible design of the first aspect, the antenna further includes an anti-oxidation conductive layer that covers the conductive portion and is exposed to the insulating layer.

[0025] In this way, the antioxidant conductive layer can protect the covered conductive part from oxidation, improve the conductivity and radiation performance of the conductive part, and enhance the stability and reliability of the conductive part.

[0026] In one possible design of the first aspect, the radiator includes a first surface and a second surface disposed opposite to each other along its thickness direction, and a first side surface connecting the first surface and the second surface. The first side surface has a third region exposed to an insulating layer, the third region forming a conductive portion.

[0027] In one possible design of the first aspect, the insulating layer includes a first insulating layer covering a first surface, and the first insulating layer has a first overlap protruding from the edge of the first surface, the first overlap covering at least a portion of a first side surface. A portion of the edge of the first overlap is recessed toward the first side surface to form a first notch, and a third region is exposed to the first notch.

[0028] Thus, the first insulating layer covers the first surface of the radiator, protecting it from environmental factors such as oxygen, humidity, and dust, thereby extending its lifespan. Oxidation of the radiator can alter its surface properties, potentially affecting its electromagnetic performance. The insulating layer helps maintain the radiator's original performance, including but not limited to radiation efficiency, bandwidth, and impedance matching.

[0029] Furthermore, the first insulating layer covers the first surface, and the insulating layer can be connected to the surface of the radiator through a lamination process, which simplifies the antenna manufacturing process and helps to improve the antenna processing efficiency.

[0030] The insulating layer is a separate structural component, which offers greater assembly flexibility. Furthermore, since the radiator is a copper foil structure with a relatively small thickness, exposing a portion of the third region by setting a first notch to form a conductive part is less difficult to manufacture compared to setting a through hole in the area opposite the first side of the insulating layer and the radiator, thus improving the accuracy of the conductive part's placement.

[0031] In one possible design of the first aspect, the insulating layer further includes a second insulating layer covering the second surface, and the second insulating layer has a second overlap protruding from the edge of the second surface, the second overlap engaging with the first overlap to cover the first side surface. A portion of the edge of the second overlap is recessed toward the first side surface to form a second notch, and a third region is exposed to the second notch.

[0032] Therefore, the second insulating layer covers the second surface of the radiator, protecting it from environmental factors such as oxygen, humidity, and dust, thus extending its lifespan. Oxidation of the radiator can alter its surface properties, potentially affecting its electromagnetic performance. The insulating layer helps maintain the radiator's original performance, including but not limited to radiation efficiency, bandwidth, and impedance matching.

[0033] Furthermore, the second insulating layer covers the second surface, and the insulating layer can be connected to the surface of the radiator through a lamination process, which simplifies the antenna manufacturing process and helps to improve the antenna processing efficiency.

[0034] The insulating layer is a separate structural component, which offers greater assembly flexibility. Furthermore, since the radiator is a copper foil structure with a relatively small thickness, exposing a portion of the third region by setting a second notch to form a conductive part is less difficult to manufacture compared to setting a through hole in the area opposite the first side of the insulating layer and the radiator, thus improving the accuracy of the conductive part's placement.

[0035] In one possible design of the first aspect, the antenna further includes a first adhesive layer and a second adhesive layer, the first adhesive layer being located between the first surface and the first insulating layer, and the first insulating layer being connected to the first surface by means of the first adhesive layer. The second adhesive layer is located between the second surface and the second insulating layer, and the second insulating layer is connected to the second surface by means of the second adhesive layer.

[0036] This bonding method provides a uniform stress distribution, reduces stress concentration points, and thus improves the overall strength and durability of the antenna. The adhesive fills the tiny gaps between the insulation layer and the radiator, providing a good seal and preventing moisture, dust, and other contaminants from penetrating the radiator surface. Furthermore, the bonding method can better adapt to complex or irregular radiator shapes, providing uniform coverage.

[0037] In one possible design of the first aspect, the length of the conductive portion is greater than or equal to 0.01 mm in the length extension direction of the first side. This provides a lower limit to the length of the conductive portion and also a lower limit to the length over which it can adsorb static charge, thereby increasing the range over which the conductive portion can adsorb static charge. When static charge enters the electronic device, the conductive portion can adsorb static charge over a wider range, preventing static charge from being conducted to electronic components and causing electromagnetic compatibility issues.

[0038] In one possible design of the first aspect, the conductive part is a first lead, with one end of the first lead connected to the radiator and the second end of the first lead exposed to the insulating layer. This allows for an increase in the number of lead structures during the fabrication of the aforementioned electroplated leads. In other words, multiple lead structures are directly fabricated during the pre-finished antenna process, with some of these structures forming the first lead as the conductive part. Therefore, no additional fabrication process is required after the antenna is completed, simplifying the manufacturing process and improving production efficiency.

[0039] Furthermore, both the first lead and the electroplated lead can be used as conductive parts. The increased number of conductive parts increases the area on the antenna that can attract static charges. Multiple conductive parts can effectively attract static charges, preventing static charges from being conducted to electronic components and thus avoiding electromagnetic compatibility issues.

[0040] Static charge is directly conducted to the grounding structure for release through the first lead, without needing to pass through a radiator. This significantly shortens the electrostatic discharge path, reducing the risk of static electricity accumulation inside electronic devices and thus lowering the risk of damage to electronic components. This improves the stability and reliability of electronic devices.

[0041] In conclusion, increasing the number of electrostatic leads not only improves the antenna's electrostatic discharge capability and processing efficiency, but also enhances electrostatic protection, thereby improving the overall performance and reliability of electronic equipment.

[0042] In one possible design of the first aspect, there are multiple conductive parts, spaced apart from each other. Having multiple conductive parts increases the number of locations where the antenna can attract static charges. Multiple locations on the antenna can attract static charges, preventing static charges from being conducted to electronic components and causing electromagnetic compatibility issues, thereby improving the overall performance and reliability of the electronic device.

[0043] In one possible design approach of the first aspect, any two adjacent conductive parts are distributed at equal intervals. "Equal intervals" means that the distance between any two adjacent conductive parts is equal, and the conductive parts are uniformly distributed on the radiator. In this way, by setting the conductive parts at equal intervals, static charge can be distributed more evenly on the surface of the radiator, reducing local charge accumulation and thus reducing the local electric field strength. While ensuring that the performance of the antenna itself is not affected, it is also beneficial to improve the antenna's ability to attract electric charge.

[0044] In one possible design approach of the first aspect, the straight-line distance between two adjacent conductive parts is less than or equal to 15 millimeters. This provides an upper limit to the straight-line distance between adjacent conductive parts, meaning that the closer the multiple conductive parts are, the easier it is for static charges to be attracted to the conductive parts, and the less likely static charges will accumulate in any one location. This reduces the risk of charge accumulation leading to conduction to electronic components.

[0045] Multiple conductive parts can serve as electrostatic discharge paths, making it easier for static charges to be attracted and directed to the ground or other conductors, thereby improving the efficiency of electrostatic discharge. Furthermore, multiple closely spaced conductive parts provide multiple layers of protection; even if one conductive part fails, the others can still function, improving the overall reliability of the electronic device system.

[0046] In one possible design approach of the first aspect, the area of ​​the conductive part is greater than or equal to 0.025 square micrometers. This provides a lower limit to the area of ​​the conductive part and also a lower limit to the area over which it can adsorb static charge, thereby increasing the range over which the conductive part can adsorb static charge. When static charge enters the electronic device, the conductive part can adsorb static charge over a larger area, preventing static charge from being conducted to electronic components and causing electromagnetic compatibility issues.

[0047] In one possible design of the first aspect, the radiator includes a body and a tip, with the tip disposed on the body. In this way, when static charge enters the electronic device, the static charge preferentially accumulates and discharges at the tip; that is, the static charge is attracted by the tip, conducted through the tip to the surface of the body, and then conducted through the surface of the body to the grounding structure for release. Therefore, the tip configuration improves the antenna's ability to attract static electricity, avoids electromagnetic compatibility issues caused by electrostatic conduction to electronic components, and thus improves the overall performance of the electronic device.

[0048] In one possible design approach of the first aspect, a portion of the tip along the thickness direction of the radiator is exposed to the insulating layer. This improves the tip's ability to attract static charge, thereby enhancing the antenna's electrostatic attraction capability and preventing electrostatic charge conduction to electronic components, which could cause electromagnetic compatibility issues.

[0049] In one possible design of the first aspect, the insulating layer is an insulating ink with slits extending through it along its thickness. The areas of the radiator exposed to these slits form conductive portions. This allows the insulating layer to be uniformly coated onto the surface of a radiator with complex shapes, including small slits and corners, providing comprehensive insulation protection. The insulating layer is applied to the surface of the radiator by coating, and its thickness can be relatively thin, helping to maintain the size and weight of the radiator.

[0050] In one possible design of the first aspect, the conductive part and the feed part are located at opposite ends of the radiator. When static charge accumulates around the antenna, the static charge is attracted to the conductive part and thus directed away from the feed part, i.e., away from the electronic components. Because the static charge is attracted away from the feed part, direct conduction of the static charge to the electronic components near the feed part is avoided, thereby reducing the risk of damage caused by electrostatic discharge, preventing potential damage to electronic components from static electricity, and improving the reliability and stability of the electronic equipment.

[0051] In one possible design of the first aspect, the antenna is a flexible circuit board antenna, which includes at least one of a millimeter-wave antenna, a near-field communication antenna, and a global positioning system antenna.

[0052] Secondly, this application also provides an electrostatic protection structure, which includes a conductive layer, a grounding structure, a conductive part, and an insulating layer. The grounding structure and the conductive part are both electrically connected to the conductive layer. The conductive part is used to collect static charge, and the static charge is released through the grounding structure. The insulating layer covers the surface of the conductive layer, and the conductive part and the grounding structure are exposed to the insulating layer.

[0053] In one possible design of the second aspect, the electrostatic protection structure is a flexible electrical connection wire.

[0054] In one possible design approach of the second aspect, the electrostatic protection structure is a flexible circuit board.

[0055] Thirdly, this application also provides an electronic device, which includes a housing, an antenna, and a reference ground structure. The housing includes a frame that encloses an accommodating space, and the antenna is any of the antennas described above. The antenna is housed within the accommodating space, and the antenna's grounding structure is electrically connected to the reference ground structure.

[0056] Since the manufacturing method provided in this application embodiment is used to manufacture the support plate of the above technical solution, the two methods can solve the same technical problem and achieve the same effect.

[0057] In one possible design of the third aspect, the electronic device also includes a circuit board and an elastic element, the circuit board being disposed within an accommodating space, a reference ground structure being disposed on the circuit board, and the elastic element being electrically connected between the reference ground structure and the ground structure.

[0058] In one possible design approach of the third aspect, the electronic device also includes electronic components disposed on a circuit board, wherein the minimum distance between the electronic components and the frame is greater than the maximum distance between the conductive part of the antenna and the frame.

[0059] In this way, the conductive parts are closer to the frame than the electronic components, meaning they are closer to static charges. Static charges are initially attracted to the conductive parts upon entering the device, preventing them from further penetrating the electronic equipment and avoiding damage to internal electronic components from static electricity, thus protecting sensitive electronic components on the circuit board.

[0060] In one possible design approach in the third aspect, the conductivity of the electronic components is lower than that of the conductive parts of the antenna. This allows static charge to dissipate on the conductive parts, preventing static charge from discharging onto the electronic components and thus avoiding damage to them from static electricity. Consequently, the electronic components maintain their original performance, improving the stability and reliability of the electronic equipment. Attached Figure Description

[0061] Figure 1 is a perspective view of an electronic device provided in some embodiments of this application in its unfolded position;

[0062] Figure 2 is an exploded view of the electronic device shown in Figure 1;

[0063] Figure 3 is a partial schematic diagram of the electronic device shown in Figure 1 cut along line AA;

[0064] Figure 4 is a schematic diagram of the antenna structure provided in some embodiments of this application;

[0065] Figure 5 is a schematic diagram of the structure of the antenna shown in Figure 4 installed inside the housing;

[0066] Figure 6 is a schematic diagram of the antenna structure provided in some embodiments of this application;

[0067] Figure 7 is a schematic diagram of the antenna structure provided in some embodiments of this application;

[0068] Figure 8 is a front view of the radiator in the embodiment shown in Figure 7;

[0069] Figure 9 is a schematic diagram of the structure of the first insulating layer provided in some embodiments of this application;

[0070] Figure 10 is a schematic diagram of the structure after the radiator shown in Figure 8 and the first insulating layer shown in Figure 9 are stacked together.

[0071] Figure 11 is a schematic diagram of the antenna structure provided in some embodiments of this application;

[0072] Figure 12 is a schematic diagram of the antenna structure provided in some embodiments of this application;

[0073] Figure 13 is a flowchart of the process of connecting the insulating layer to the radiator according to some embodiments of this application;

[0074] Figure 14 is a flowchart of the process of connecting the insulating layer to the radiator according to some embodiments of this application;

[0075] Figure 15 is a schematic diagram of the antenna structure provided in some embodiments of this application;

[0076] Figure 16 is a schematic diagram of the antenna structure provided in some embodiments of this application;

[0077] Figure 17 is a schematic diagram of the antenna structure provided in some embodiments of this application;

[0078] Figure 18 is a schematic diagram of the antenna structure provided in some embodiments of this application;

[0079] Figure 19 is a schematic diagram of the antenna structure provided in some embodiments of this application;

[0080] Figure 20 is a schematic diagram of the antenna structure provided in some embodiments of this application;

[0081] Figure 21 is a front view of the antenna shown in Figure 20;

[0082] Figure 22 is a schematic diagram of the antenna structure provided in some embodiments of this application;

[0083] Figure 23 is a front view of an antenna provided in some embodiments of this application;

[0084] Figure 24 is a schematic diagram of the antenna structure provided in some embodiments of this application;

[0085] Figure 25 is a schematic diagram of the antenna structure provided in some embodiments of this application;

[0086] Figure 26 is a schematic diagram of the structure of the insulating layer provided in some embodiments of this application.

[0087] Reference numerals: 100, electronic device; 10, screen; 11, light-transmitting cover; 12, display screen; 20, housing; 21, back cover; 22, frame; 23, middle plate; 30, circuit board assembly; 31, circuit board body; 32, electronic component; 33, spring contact; 34, antenna transceiver; 40, antenna; 41, radiator; 41a, body; 41b, tip; 411, first surface; 411a, first region; 412, second surface; 412a, second region; 413, first side surface; 413a, third region; 414, first groove; 415, second groove; 416, third through hole; 417, fourth through hole; 418, first notch; 42, grounding structure; 43. Insulating layer; 431. First through hole; 432. Second through hole; 43a. First insulating layer; 43a1. First overlap; 43b. Second insulating layer; 43b1. Second overlap; 433. Gap; 44. Conductive part; 45. Power supply part; 46. Antioxidant conductive layer; 47. Insulating layer blank; 48. Electroplated lead; 49. First lead. Detailed Implementation

[0088] In the embodiments of this application, the terms "exemplary" or "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or designs. Specifically, the use of terms such as "exemplary" or "for example" is intended to present the relevant concepts in a specific manner.

[0089] In the embodiments of this application, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" and "second" may explicitly or implicitly include one or more of that feature.

[0090] In the description of the embodiments of this application, the term "at least one" means one or more, and "more than one" means two or more. "At least one of the following" or similar expressions refer to any combination of these items, including any combination of a single item or a plurality of items. For example, at least one of a, b, or c can represent: a, b, c, ab, ac, bc, or abc, where a, b, and c can be a single item or multiple items.

[0091] In the description of the embodiments of this application, the term "and / or" refers to and covers any and all possible combinations of one or more of the associated listed items. The term "and / or" describes an association relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this application generally indicates that the preceding and following related objects have an "or" relationship.

[0092] In the description of the embodiments of this application, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, "linking" can mean a detachable connection or a non-detachable connection; it can mean a direct connection or an indirect connection through an intermediate medium. The directional terms mentioned in the embodiments of this application, such as "inner," "outer," "upper," "lower," "left," and "right," are only for reference to the directions in the accompanying drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the embodiments of this application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the embodiments of this application.

[0093] In the description of embodiments of this application, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus.

[0094] Unless otherwise specified, an element defined by the phrase "comprising a..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element.

[0095] This application provides an electronic device with an antenna, which can be user equipment (UE) or a terminal. For example, the electronic device can be a portable Android device (PAD), a laptop computer, a personal digital assistant (PDA), a handheld device with wireless communication capabilities, a computing device, an in-vehicle device, a wearable device, a virtual reality (VR) terminal device (e.g., VR glasses), an augmented reality (AR) terminal device (e.g., AR glasses), or other mobile or fixed terminals. The form of the electronic device is not specifically limited in the embodiments of this application.

[0096] Please refer to Figure 1, which is a perspective view of an electronic device 100 provided in some embodiments of this application. This embodiment and the following embodiments are exemplified by using an electronic device 100 as a handheld device with wireless communication capabilities. This handheld device with wireless communication capabilities can be, for example, a mobile phone. This application embodiment uses a candybar mobile phone as an example for illustration; in other embodiments, the mobile phone can also be a foldable mobile phone.

[0097] The electronic device 100 is roughly rectangular and flat. Therefore, for the convenience of describing the embodiments below, an XYZ coordinate system is established, specifically defining the width direction of the electronic device 100 as the X-axis, the length direction as the Y-axis, and the thickness direction as the Z-axis.

[0098] It is understandable that the coordinate system of electronic device 100 can be flexibly set according to actual needs, and no specific limitation is made here. When electronic device 100 is other products, electronic device 100 can also be roughly square or circular, etc., and no specific limitation is made here.

[0099] Please refer to Figures 1 and 2 together. Figure 2 is an exploded view of the electronic device 100 shown in Figure 1. The electronic device 100 includes a screen 10, a housing 20, a circuit board assembly 30, and an antenna 40.

[0100] It is understood that Figures 1 and 2 schematically illustrate some components included in the electronic device 100, and the actual shape, size, location, and construction of these components are not limited to Figures 1 and 2. In some other examples, the electronic device 100 may also not include the screen 10.

[0101] The screen 10 is used to display images, videos, etc., and includes a light-transmitting cover 11 and a display screen 12. The light-transmitting cover 11 and the display screen 12 are stacked together, and the light-transmitting cover 11 is mainly used to protect the display screen 12 and prevent dust.

[0102] The housing 20 is used to protect the internal electronic components of the electronic device 100. The housing 20 may include a back cover 21 and a frame 22. The back cover 21 is located on the side of the display screen 12 away from the light-transmitting cover plate 11 and is spaced apart from the display screen 12. The frame 22 is located between the back cover 21 and the screen 10 and is disposed along the edge of the back cover 21 and the edge of the screen 10.

[0103] The frame 22 is fixed to the back cover 21. For example, the frame 22 can be fixed to the back cover 21 by adhesive. The frame 22 can also be integrally formed with the back cover 21, that is, the frame 22 and the back cover 21 are a single structure. The light-transmitting cover 11 is fixed to the frame 22, and the light-transmitting cover 11, the frame 22 and the back cover 21 form a receiving cavity.

[0104] In some embodiments, referring specifically to FIG2, the housing 20 may further include a middle plate 23. The middle plate 23 is fixed to the inner surface of the frame 22. For example, the middle plate 23 may be fixed to the frame 22 by welding. The middle plate 23 may also be integrally formed with the frame 22. The middle plate 23 serves as the structural "skeleton" of the electronic device 100, supporting and fixing the electronic components within the electronic device 100.

[0105] The circuit board assembly 30 is housed in the receiving cavity. In some embodiments, the circuit board assembly 30 is fixed to the middle plate 23. In other embodiments, when the electronic device 100 does not include the middle plate 23, the circuit board assembly 30 may also be fixed to the back cover 21 or the frame 22.

[0106] The circuit board assembly 30 includes a circuit board body 31 and electronic components 32. The circuit board body 31 is used to carry and connect the electronic components 32 in the electronic device 100 to realize functions such as data processing, storage, power management and user interaction.

[0107] Electronic components 32 include, but are not limited to, processors (CPU), memory (RAM), storage (ROM), power management chips, wireless communication modules (such as baseband processors, Wi-Fi and Bluetooth modules), and other sensors and interfaces.

[0108] Antenna 40 is used to transmit and receive signals to enable the communication function of electronic device 100. Antenna 40 includes, but is not limited to, low-frequency antennas, mid-to-high-frequency antennas, near-field communication (NFC) antennas, wireless fidelity (WIFI) antennas, Sub-6G antennas, millimeter-wave antennas, etc.

[0109] In some embodiments, when the frame 22 is made of metal, at least a portion of the frame 22 can form an antenna 40. In this way, the frame 22 can be reused as an antenna 40, and the electronic device 100 does not need to set up additional space to install the antenna 40, which helps to save internal space of the electronic device 100.

[0110] Please refer to Figure 3, which is a partial schematic diagram of the electronic device 100 shown in Figure 1 cut along line AA. In some other embodiments, when the frame 22 is made of a non-metallic material, for example, when the frame 22 is made of plastic, the antenna 40 can also be a flexible circuit board antenna 40. The flexible circuit board antenna 40 can be bent into various shapes to facilitate its installation.

[0111] The flexible circuit board antenna 40 is disposed within the receiving cavity of the electronic device 100. For example, the flexible circuit board antenna 40 can be connected to the side surface of the frame 22 facing the receiving cavity. The flexible circuit board antenna 40 includes a radiator 41, a feed section (not shown in FIG3), and a grounding structure 42.

[0112] The radiator 41 is used to transmit and receive electromagnetic waves. When the antenna 40 is working, the radiator 41 converts energy into electromagnetic waves and radiates them into space. Similarly, the radiator 41 can also capture electromagnetic waves from space and convert them into electrical signals. The radiator 41 is made of a conductive material, and the material of the radiator 41 can be metal, composite material, etc., such as copper, aluminum, silver, gold, copper alloy, aluminum alloy, etc.

[0113] This application uses copper foil as an example to illustrate the material of the radiator 41. Copper foil has high electrical conductivity and can efficiently transmit and radiate electromagnetic waves, thereby improving the performance of the antenna 40.

[0114] The power supply unit is electrically connected to the radiator 41. The power supply unit is used to transmit the radio frequency energy generated by the antenna transceiver 34 to the radiator 41, and to transmit the radio frequency energy received from the radiator 41 to the antenna transceiver 34. The antenna transceiver 34 can be disposed on the circuit board body 31. The antenna transceiver 34 is connected to other electronic components 32, such as processors, memory, power management, etc., by means of the circuit board body 31.

[0115] The grounding structure 42 is used to allow the current fed into the power supply section 45 to flow through the radiator 41 and then back to the circuit board body 31 via the grounding structure 42 to form a complete current loop. The circuit board body 31 also includes a reference ground structure that is electrically connected to the grounding structure 42.

[0116] In some embodiments, the radiator 41, feed section 45, and grounding structure 42 of the antenna 40 are integrated into a single structure. For example, the radiator 41 is a copper foil structure, and a portion of the copper foil structure forms the feed section 45 and the grounding structure 42. This simplifies the components of the antenna 40, resulting in a higher degree of integration. The direct connection between the radiator 41, feed section 45, and grounding structure 42 reduces signal transmission loss and improves the performance of the antenna 40.

[0117] Please refer to Figure 3. The circuit board assembly 30 also includes a spring contact 33, which abuts against the antenna transceiver 34 and the grounding structure 42, and is electrically connected to both the antenna transceiver 34 and the antenna 40. In this way, the spring contact 33 can provide a stable mechanical and electrical connection between the antenna 40 and the antenna transceiver 34, maintaining contact between the antenna 40 and the antenna transceiver 34 even under vibration or impact conditions.

[0118] When a user comes into contact with the screen 10 during the use of the electronic device 100, static electricity E is generated due to the friction between the skin and the screen 10. Static electricity E can be transmitted to the inside of the electronic device 100 through the gap between the screen 10 and the frame 22. When the static electricity is released at the electronic components 32 or the wiring on the circuit board body 31, it will cause electromagnetic compatibility problems of the electronic device 100.

[0119] In detail, electrostatic discharge (ESD) is characterized by long-term accumulation, high voltage, low charge, small current, and short duration. ESD can cause electronic devices to frequently freeze, shut down automatically, have poor picture and volume quality, and have intermittent signal strength. Therefore, resisting ESD has become an important aspect of electronic product quality control, and ESD protection for electronic devices is of paramount importance.

[0120] In some embodiments, the electronic device 100 can achieve the function of electrostatic discharge (E) by means of the antenna 40, thereby preventing E from being transmitted to the electronic component 32 and causing electromagnetic compatibility problems. For example, when the frame 22 is made of metal, the frame 22 can not only be reused as the antenna 40, but also, due to its good conductivity, the metal frame 22 can serve as a discharge channel for E, preventing the accumulation of E.

[0121] Please refer to Figure 3 again. As an example, when antenna 40 is a flexible circuit board antenna 40, static electricity E can also be released at the flexible circuit board antenna 40. Specifically, static electricity E enters the electronic device 100 through the gap between screen 10 and frame 22. The flexible circuit board antenna 40 conducts static electricity E to radiator 41, and releases it to reference ground structure through grounding structure 42, which is the path indicated by the dashed line in Figure 3.

[0122] When the radiator 41 is in direct contact with air, it is prone to oxidation reaction with the environment. For example, when the radiator 41 is a copper foil structure, copper will react with oxygen, moisture, carbon dioxide and other chemicals in the air to form a layer of copper oxide (CuO) or basic copper carbonate (Cu2(OH)2CO3). This oxide film will increase the signal transmission loss because the resistivity of copper oxide is much higher than that of pure copper, which will affect the performance of the copper foil.

[0123] Please refer to Figures 4 and 5 together. Figure 4 is a structural schematic diagram of the antenna 40 provided in some embodiments of this application; Figure 5 is a structural schematic diagram of the antenna 40 shown in Figure 4 disposed within the housing 20. To prevent oxidation of the radiator 41, the antenna 40 also includes an insulating layer 43, which covers the surface of the radiator 41. The insulating layer 43 can be made of insulating and anti-oxidation materials such as polyimide or ink.

[0124] The insulating layer 43 can prevent the radiator 41 from directly contacting the air and protect the radiator 41 from environmental factors such as humidity, corrosive gases, and dust, so that the radiator 41 can maintain its radiation performance.

[0125] However, this reduces the electrostatic attraction capability of antenna 40. Electrostatic attraction capability can be understood as the ability of antenna 40 to attract, conduct, or maintain current under the influence of an electric field. Static charge accumulates on screen 10 and is conducted to the interior of electronic device 100 through the gap between screen 10 and frame 22. Due to the low electrostatic attraction capability of antenna 40, it cannot conduct static electricity E to radiator 41. Static charge easily discharges at electronic component 32, causing electromagnetic compatibility problems.

[0126] To address the aforementioned issues, this application also provides an antenna 40 designed to enhance its electrostatic attraction capability. When static charge accumulates on the screen 10 and enters the electronic device 100 through the gap between the screen 10 and the frame 22, the antenna 40 can conduct the static charge to the radiator 41, thereby preventing the static charge from discharging at the electronic component 32.

[0127] Please refer to Figure 6, which is a schematic diagram of the structure of an antenna 40 provided in some embodiments of this application. The antenna 40 includes a radiator 41, a grounding structure 42, a conductive part 44, and an insulating layer 43. The radiator 41 is used to radiate signals. The function and structure of the radiator 41 are the same as those of the radiator 41 in the above embodiments, and will not be repeated here. In this embodiment, the radiator 41 is described as a copper foil structure.

[0128] The grounding structure 42 is electrically connected to the radiator 41. Similarly, the function and structure of the grounding structure 42 are the same as those in the above embodiments, and will not be repeated here. In this embodiment, the grounding structure 42 and the radiator 41 are integrated as a single structural component for illustration.

[0129] The difference between this embodiment and the previous embodiment is that, in this embodiment, the antenna 40 further includes a conductive part 44, which is electrically connected to the radiator 41. The conductive part 44 is used to collect static charge, and the static charge is released through the grounding structure 42. The conductive part 44 is made of a conductive material, such as metal (copper, aluminum, gold, silver, etc.), conductive polymer, carbon nanotubes, graphene, or other materials that allow charge flow. The conductive part 44 can effectively attract and conduct current.

[0130] An insulating layer 43 covers the surface of the radiator 41, and the conductive part 44 and the grounding structure 42 are exposed to the insulating layer 43. The insulating layer 43 is made of an insulating material, which can be polyimide, epoxy resin, polyethylene, polypropylene, phenolic resin, ink, or other insulating and antioxidant materials.

[0131] In this way, static electricity E accumulates on the screen 10. When static electricity E enters the electronic device 100 through the gap between the screen 10 and the frame 22, the conductive part 44 is exposed to the insulating layer 43. The conductive part 44 provides a low-impedance release path for static electricity E, and static electricity E can be effectively conducted to the conductive part 44. The conductive part 44 is electrically connected to the radiator 41. Static electricity E is conducted to the radiator 41 through the conductive part 44, and then to the grounding structure 42 through the radiator 41 for release.

[0132] The antenna 40 enhances its electrostatic discharge capability through the conductive part 44, preventing static electricity (SEE) from being conducted to other electronic components 32 besides the antenna 40. This avoids damage to other electronic components 32 caused by SEE, and further prevents electromagnetic compatibility issues caused by SEE, such as frequent crashes, automatic shutdowns, poor picture and volume quality, and intermittent signal strength. The improved electrostatic discharge capability of the antenna 40 enhances the electrostatic discharge protection function of the electronic device 100 and improves the stability of its performance.

[0133] Furthermore, the insulating layer 43 covers the surface of the radiator 41, protecting it from direct contact with air and oxidation, thus ensuring its radiation performance. Additionally, the conductive part 44 and the grounding structure 42 are exposed to the insulating layer 43, which protects the radiator 41 without reducing the antenna 40's electrostatic discharge capability. Therefore, the antenna 40 provided in this embodiment of the application ensures both radiation performance and excellent electrostatic discharge protection.

[0134] Since the antenna 40 is used for transmitting and receiving electromagnetic waves, and the radiator 41 is made of conductive material or conductive medium, the generation of static charge on the surface of the antenna 40 is part of its normal operation. The antenna 40 is designed with the influence of surface charge in mind, and specific designs are used to control static charge in order to optimize the performance of the antenna 40. Therefore, static electricity will not significantly interfere with the normal use of the antenna 40. The use of the antenna 40 to achieve the electrostatic discharge protection function of the electronic device 100 will not affect the normal operation of the antenna 40.

[0135] In this way, due to the inherent characteristics of the antenna 40, the antenna 40 has good electrostatic discharge (ESD) protection. This is more advantageous than using other structural components to achieve ESD protection. For example, the electronic device 100 can use a flexible circuit board structure to achieve ESD protection. Since ordinary flexible circuit boards are mainly used for electrical connections, flexible circuit boards include conductive paths, insulating layers, and flexible substrates.

[0136] Conductive paths are used to transmit low-frequency or digital signals. When static electricity accumulates on the surface of a flexible circuit board, it can interfere with these signals, causing electrical noise or signal distortion. Static electricity can also damage sensitive electronic components on the flexible circuit board, such as transistors and integrated circuits, and may also damage the insulation layer, affecting the long-term reliability of the circuit.

[0137] In summary, the embodiments of this application use antenna 40 to achieve electrostatic discharge (ESD) protection for electronic device 100, providing good ESD protection without affecting the performance of electronic device 100 itself. Referring to Figure 6, in some embodiments, insulating layer 43 includes a first insulating layer 43a and a second insulating layer 43b. This application embodiment will first illustrate this using the first insulating layer 43a and the second insulating layer 43b as separate structural components. The first insulating layer 43a covers the first surface 411, and the edge of the first insulating layer 43a protrudes beyond the edge of the first surface 411, with the portion of the first insulating layer 43a protruding beyond the edge of the first surface 411 forming a first overlap 43a1.

[0138] The second insulating layer 43b covers the second surface 412. The edge of the second insulating layer 43b protrudes from the edge of the second surface 412, and the portion of the second insulating layer 43b that protrudes from the edge of the second surface 412 forms a second overlap 43b1. The first overlap 43a1 is connected to the second overlap 43b1 to cover the first side surface 413 of the radiator 41.

[0139] The specific structure of the antenna 40, the specific structure of the conductive part 44, and the location of the conductive part 44 will be described in detail below.

[0140] Please refer to Figure 7, which is a schematic diagram of the structure of the antenna 40 provided in some embodiments of this application. The embodiment shown in Figure 6 is illustrated with an example of one conductive part 44, while the embodiment shown in Figure 7 is illustrated with an example of multiple conductive parts 44.

[0141] The presence of multiple conductive parts 44 increases the number of locations where the antenna 40 can attract static electricity E. For example, the dashed arrow in Figure 7 shows the path through which the conductive parts 44 attract static electricity E. Multiple locations on the antenna 40 can attract static electricity E, preventing it from being conducted to the electronic components 32 and causing electromagnetic compatibility issues, thereby improving the overall performance and reliability of the electronic device 100.

[0142] Please refer to Figures 7 and 8 together. Figure 8 is a front view of the radiator 41 in the embodiment shown in Figure 7. The radiator 41 can be a copper foil structure, which has good conductivity and processability. In the flexible circuit board antenna 40, the radiator 41 is usually made of highly conductive electrolytic copper (ED) or rolled copper (RC). The radiator 41 is flat, and the shape of the radiator 41 can be determined by the antenna 40 according to its own radiation characteristics, frequency, bandwidth, impedance matching, polarization mode, and direction.

[0143] For example, the radiator 41 can be a regular rectangle, circle, ellipse, etc., and the shape of the radiator 41 can also be an irregular pattern. The radiator 41 includes a first surface 411 and a second surface 412 along its own thickness direction, and a first side surface 413 connecting the first surface 411 and the second surface 412.

[0144] In some embodiments, a portion of the radiator 41 may form a grounding structure 42, which is exposed to the insulating layer 43. The grounding structure 42 may be electrically connected to a reference ground structure on the circuit board body 31 to achieve a grounding function. In other embodiments, a portion of the radiator 41 is covered with an antioxidant conductive layer 46, which forms the grounding structure 42. The material of the antioxidant conductive layer 46 may be gold, silver, nickel, etc.

[0145] The structure and location of the conductive part 44 will be described in detail below.

[0146] Please refer to Figures 8, 9 and 10 together. Figure 9 is a schematic diagram of the structure of the first insulating layer 43a provided in some embodiments of this application; Figure 10 is a schematic diagram of the structure after the radiator 41 shown in Figure 8 and the first insulating layer 43a shown in Figure 9 are stacked. In Figure 10, a perspective view is used, with the dashed line representing the insulating layer 43 and the solid line representing the radiator 41.

[0147] In some embodiments, the first insulating layer 43a has a first through hole 431. The cross-sectional shape of the first through hole 431 can be circular, rectangular, triangular, irregular, etc. In this embodiment, the cross-sectional shape of the first through hole 431 is circular as an example.

[0148] The number of first through holes 431 can be one or more. In this embodiment of the application, the number of first through holes 431 is multiple. The first through hole 431 exposes the first region 411a of the first surface 411, and the first region 411a forms a conductive part 44.

[0149] When static electricity E accumulates on the screen 10, it enters the electronic device 100 through the gap between the screen 10 and the frame 22, and can be conducted to the conductive part 44. Furthermore, the radiator 41 and the conductive part 44 are an integral structural component, with no additional connection resistance between them. The radiator 41 and the conductive part 44 have high conductivity, allowing static electricity E to be directly conducted to the radiator 41 via the conductive part 44, and then discharged through the grounding structure 42 via the radiator 41.

[0150] Furthermore, the radiator 41 and the conductive part 44 are integrated into a single structure, which simplifies the manufacturing process of the radiator 41 and the conductive part 44, reduces assembly steps, and lowers production costs. In addition, the number of connection points between the radiator 41 and the conductive part 44 is reduced, thus avoiding failures caused by poor connections between the radiator 41 and the conductive part 44, and improving the overall reliability of the antenna 40.

[0151] Please refer to Figure 11, which is a schematic diagram of the antenna 40 provided in some embodiments of this application. In some embodiments, the second insulating layer 43b has a second through hole 432. The cross-sectional shape of the second through hole 432 can be circular, rectangular, triangular, irregular, etc. This application uses a circular cross-sectional shape of the second through hole 432 as an example for description. The cross-sectional shape of the second through hole 432 can be the same as or different from the cross-sectional shape of the first through hole 431.

[0152] The second through-hole 432 exposes the second region 412a of the second surface 412, and the second region 412a forms a conductive part 44. Similarly, the radiator 41 and the conductive part 44 are integral structural components, and there is no additional connection resistance between the radiator 41 and the conductive part 44. The radiator 41 and the conductive part 44 have high conductivity. Static electricity E is directly conducted to the radiator 41 through the conductive part 44, and then the static electricity E is conducted to the grounding structure 42 through the radiator 41 for release.

[0153] Furthermore, the radiator 41 and the conductive part 44 are integrated into a single structure, which simplifies the manufacturing process of the radiator 41 and the conductive part 44, reduces assembly steps, and lowers production costs. In addition, the number of connection points between the radiator 41 and the conductive part 44 is reduced, thus avoiding failures caused by poor connections between the radiator 41 and the conductive part 44, and improving the overall reliability of the antenna 40.

[0154] In addition, the conductive part 44 offers greater selectivity and flexibility in its placement. Specifically, the conductive part 44 can be formed from either the first region 411a or the second region 412a, allowing the radiator 41 to adapt to different installation scenarios. For example, during the use of the electronic device 100, static electricity E tends to concentrate on one side of the screen 10, and the conductive part 44 can be placed on the surface of the radiator 41 facing the screen 10. Therefore, the position of the conductive part 44 can be flexibly adjusted according to the specific internal layout of the electronic device 100 and the expected electromagnetic environment.

[0155] Please refer to Figure 12, which is a schematic diagram of the structure of the antenna 40 provided in some embodiments of this application. In some embodiments, the insulating layer 43 has both a first through-hole 431 and a second through-hole 432. The radiator 41 includes a first region 411a exposed to the first through-hole 431 and a second region 412a exposed to the second through-hole 432. The first region 411a forms a conductive portion 44, and the second region 412a also forms a conductive portion 44. The number of conductive portions 44 is multiple.

[0156] For example, the second through hole 432 may be disposed opposite to the first through hole 431 along the thickness direction of the radiator 41; for another example, the second through hole 432 may not be disposed opposite to the first through hole 431 along the thickness direction of the radiator 41.

[0157] In this way, the conductive part 44 not only has the beneficial effect of being an integral structural component with the radiator 41, but also serves as a channel for the release of static electricity E. The conductive part 44 can attract the static electricity E on the electronic device 100 and effectively conduct the static electricity E from the radiator 41 to the reference ground structure for safe release.

[0158] With an increased number of conductive parts 44, the radiator 41 has more points or areas that can attract static electricity E, improving the charge attraction efficiency of the antenna 40. More conductive parts 44 can more effectively attract charge, thus avoiding potential damage caused by the accumulation of static electricity E. Furthermore, the increased number of conductive parts 44 reduces wear and aging of individual conductive parts 44, thereby extending the service life of the radiator 41 and maintaining the stability of the antenna 40's electrostatic attraction capability.

[0159] Depending on the arrangement of the first through hole 431 and the second through hole 432, the conductive part 44 may also include various forms. Please refer to FIG13, which is a flowchart of the process of connecting the insulating layer 43 to the radiator 41 according to some embodiments of this application.

[0160] In some embodiments, before the insulating layer 43 is connected to the surface of the radiator 41, a first through hole 431 and a second through hole 432 are formed on the insulating layer 43. After the insulating layer 43 is connected to the surface of the radiator 41, the first surface 411 has a first region 411a exposed to the first through hole 431, and the second surface 412 has a second region 412a exposed to the second through hole 432.

[0161] In this way, the processing of the first through hole 431 and the second through hole 432 can be completed in the separate manufacturing stage of the insulating layer 43, without the need for drilling after the insulating layer 43 is attached, thereby improving the processing efficiency of the antenna 40.

[0162] Please refer to Figure 14, which is a flowchart illustrating the process of connecting the insulating layer 43 to the radiator 41 according to some embodiments of this application. In other embodiments, after the insulating layer 43 blank 47 is connected to the surface of the radiator 41, the insulating layer 43 blank 47 is drilled to form a first through hole 431 exposing a first region 411a and a second through hole 432 exposing a second region 412a.

[0163] After the insulating layer 43 is connected to the surface of the radiator 41, holes are drilled. The position and shape of the first through hole 431 and the second through hole 432 can be set according to the surface structure of the radiator 41, and the setting of the first through hole 431 and the second through hole 432 has greater flexibility.

[0164] Especially when the surface structure of the radiator 41 is relatively complex, for example, when the radiator 41 has straight segments and bent segments, a first through hole 431 and a second through hole 432 can be provided in the area of ​​the insulating layer 43 opposite to the straight segment of the radiator 41. In this way, after the insulating layer 43 is connected to the surface of the radiator 41, holes are drilled according to the actual structure of the surface of the radiator 41 to ensure that the first through hole 431 and the second through hole 432 match the shape of the surface of the radiator 41.

[0165] Please refer to Figure 15, which is a schematic diagram of the structure of the antenna 40 provided in some embodiments of this application. In some embodiments, the radiator 41 has a first groove 414 formed by at least a partial recess of the first region 411a, and the inner wall of the first groove 414 forms a conductive portion 44. After the insulating layer 43 is attached to the surface of the radiator 41, a first through hole 431 is machined. During the drilling process of the insulating layer 43, at least a portion of the radiator 41 opposite to the first through hole 431 may be removed to form the first groove 414.

[0166] This reduces the processing difficulty of drilling holes in the insulating layer 43, allows for lower precision in the drilling process, and thus improves the processing efficiency of the antenna 40 and reduces its production cost.

[0167] Furthermore, when the area of ​​the first region 411a is small, the conductive area of ​​the conductive part 44 can be increased by the first groove 414, thereby improving the electrostatic attraction capability of the radiator 41. When static electricity E accumulated on the screen 10 enters the interior of the electronic device 100 through the gap, the radiator 41 can effectively adsorb static electricity E with the help of the conductive part 44. The static electricity E is conducted to the grounding structure 42 through the radiator 41 and released, avoiding the static electricity E from being conducted to the electronic components 32 and causing electromagnetic compatibility problems.

[0168] Please refer to Figure 16, which is a schematic diagram of the structure of the antenna 40 provided in some embodiments of this application. Similarly, in some embodiments, the radiator 41 has a second groove 415 formed by at least a partial recess of the second region 412a, the inner wall of the second groove 415 forms a conductive portion 44, and the insulating layer 43 forms a second through hole 432 after being connected to the surface of the radiator 41.

[0169] Similar to the above embodiment, after the insulating layer 43 is connected to the surface of the radiator 41, a second through hole 432 is machined. During the hole-cutting process of the insulating layer 43, at least a portion of the radiator 41 opposite to the second through hole 432 can be removed to form a second groove 415. This reduces the processing difficulty of the hole-cutting process of the insulating layer 43, allows for lower precision in the hole-cutting process, and thus improves the processing efficiency of the antenna 40 and reduces the production cost of the antenna 40.

[0170] Furthermore, when the area of ​​the second region 412a is small, the conductive area of ​​the conductive part 44 can be increased by the second groove 415, thereby improving the electrostatic attraction capability of the radiator 41. When static electricity E accumulated on the screen 10 enters the interior of the electronic device 100 through the gap 433, the radiator 41 can effectively adsorb static electricity E by means of the conductive part 44. The static electricity E is conducted to the grounding structure 42 through the radiator 41 and released, avoiding the static electricity E from being conducted to the electronic components 32 and causing electromagnetic compatibility problems.

[0171] Please refer to Figure 17, which is a schematic diagram of the antenna 40 provided in some embodiments of this application. In still some embodiments, the radiator 41 includes a first groove 414 and a second groove 415, thereby further increasing the area of ​​the conductive part 44 and the diversity of the conductive part 44's arrangement, making it easier for the conductive part 44 to be used in different application scenarios.

[0172] Please refer to Figure 18, which is a schematic diagram of the structure of the antenna 40 provided in some embodiments of this application. In some embodiments, the radiator 41 includes a third through hole 416, which penetrates the radiator 41 along the thickness direction of the radiator 41 and is connected to the first through hole 431. The inner wall of the third through hole 416 forms a conductive portion 44.

[0173] After the insulating layer 43 is attached to the surface of the radiator 41, a first through hole 431 is machined. During the hole-cutting process of the insulating layer 43, it is permissible to remove the portion of the radiator 41 opposite to the first through hole 431 to form a third through hole 416. This reduces the processing difficulty of the hole-cutting process of the insulating layer 43, allows for a lower precision in the hole-cutting process, and thus improves the processing efficiency of the antenna 40 and reduces the production cost of the antenna 40.

[0174] Furthermore, when the area of ​​the first region 411a is small, the conductive area of ​​the conductive part 44 can be increased through the third through hole 416, thereby improving the electrostatic attraction capability of the radiator 41. When static electricity E accumulated on the screen 10 enters the interior of the electronic device 100 through the gap, the radiator 41 can effectively adsorb static electricity E with the help of the conductive part 44. The static electricity E is conducted to the grounding structure 42 through the radiator 41 and released, avoiding the static electricity E from being conducted to the electronic components 32 and causing electromagnetic compatibility problems.

[0175] Please refer to Figure 19, which is a schematic diagram of the antenna 40 provided in some embodiments of this application. In some embodiments, the third through-hole 416 is also connected to the second through-hole 432. In this way, when drilling holes in the insulating layer 43, the insulating layer 43 and the radiator 41 are drilled together. That is, the first through-hole 431, the second through-hole 432, and the third through-hole 416 are coaxially arranged, and the first through-hole 431, the second through-hole 432, and the third through-hole 416 are drilled in the same process. This improves the current-carrying capability of the antenna 40 while also increasing its processing efficiency.

[0176] Furthermore, the antenna 40 is disposed on the inner wall of the frame 22. Since the inner wall surface of the frame 22 is not a completely flat surface, there are some uneven areas on the inner wall surface of the frame 22. Therefore, clearance holes need to be provided for the antenna 40 to be connected to the inner wall surface of the frame 22 so that the antenna 40 fits snugly against the inner wall surface of the frame 22.

[0177] The positions of the first through hole 431, the second through hole 432 and the third through hole 416 can coincide with the avoidance hole. In this way, the area of ​​the hole on the radiator 41 can be reduced to ensure that the radiator maintains its original characteristics.

[0178] Please refer to Figure 20, which is a schematic diagram of the structure of the antenna 40 provided in some embodiments of this application. In some embodiments, the conductive portion 44 may also be formed on the first side surface 413 of the radiator 41. For example, when the insulating layer 43 is an integral structural component and covers the surface of the radiator 41, the insulating layer 43 may also include a fourth through hole 417, and the first side surface 413 has a third region 413a exposed to the fourth through hole 417, and the third region 413a forms the conductive portion 44.

[0179] The insulating layer 43 includes a first insulating layer 43a and a second insulating layer 43b, which are separate structural components. The first insulating layer 43a covers the first surface 411, and the second insulating layer 43b covers the second surface 412. The edge of the first insulating layer 43a protrudes beyond the edge of the first surface 411, and the portion of the first insulating layer 43a protruding beyond the edge of the first surface 411 forms a first overlap 43a1.

[0180] The second insulating layer 43b covers the second surface 412. The edge of the second insulating layer 43b protrudes from the edge of the second surface 412, and the portion of the second insulating layer 43b that protrudes from the edge of the second surface 412 forms a second overlap 43b1. The first overlap 43a1 is connected to the second overlap 43b1 to cover the first side surface 413 of the radiator 41.

[0181] Thus, the first insulating layer 43a and the second insulating layer 43b are connected and cover the entire surface of the radiator 41. The insulating layer 43 protects the radiator 41 from environmental factors such as oxygen, humidity, and dust, thereby extending the service life of the radiator 41. Oxidation of the radiator 41 can cause changes in its surface properties, potentially affecting its electromagnetic performance. The insulating layer 43 helps maintain the original performance of the radiator 41, including but not limited to radiation efficiency, bandwidth, and impedance matching.

[0182] Furthermore, the first insulating layer 43a covers the first surface 411, and the second insulating layer 43b covers the second surface 412. The insulating layer 43 can be connected to the surface of the radiator 41 through a stacking process, which simplifies the manufacturing process of the antenna 40 and helps to improve the processing efficiency of the antenna 40.

[0183] Please refer to Figure 21, which is a front view of the antenna 40 shown in Figure 20. The antenna 40 in Figure 21 is drawn in perspective; the dashed lines represent the insulating layer 43, and the solid lines represent the radiator 41. A first overlapping portion 43a1 covers at least a portion of the first side surface 413, and a second overlapping portion 43b1 connects to the first overlapping portion 43a1 to cover the first side surface 413. A portion of the edge of the first overlapping portion 43a1 is recessed towards the first side surface 413 to form a first notch 418, and a portion of the third region 413a is exposed to the first notch 418.

[0184] In this way, the insulating layer 43 is a separate structural component, and the first insulating layer 43a and the second insulating layer 43b have greater assembly flexibility. Furthermore, since the radiator 41 is a copper foil structure, its thickness is relatively small. By providing a first notch 418 to expose a portion of the third region 413a to form the conductive part 44, compared to providing a through hole in the area opposite the first side 413 of the insulating layer 43 and the radiator 41, providing a first notch 418 in the area opposite the first side 413 of the insulating layer 43 and the radiator 41 is less difficult to process, thereby improving the accuracy of the conductive part 44's placement.

[0185] Similarly, in some embodiments, a portion of the edge of the second overlap 43b1 is recessed toward the first side 413 to form a second notch, and a portion of the third region 413a is exposed to the second notch. In this way, the insulating layer 43 is a split structure, and the first insulating layer 43a and the second insulating layer 43b have greater assembly flexibility.

[0186] Furthermore, by setting a second notch to expose a portion of the third region 413a to form a conductive part 44, the processing difficulty of setting a second notch in the region opposite to the first side 413 of the radiator 41 is lower than that of setting a through hole in the region opposite to the first side 413 of the radiator 43, thereby improving the accuracy of the conductive part 44 setting position.

[0187] In some embodiments, the first insulating layer 43a includes a first notch 418 and the second insulating layer 43b includes a second notch. The first notch 418 is opposite to the second notch along the thickness direction of the radiator 41, that is, the third region 413a is exposed to the first notch 418 and the second notch.

[0188] In this way, the entire third region 413a is exposed to the insulating layer 43. That is to say, the entire third region 413a can be used as a conductive part 44, which increases the area of ​​the conductive part 44 and thus increases the area of ​​the antenna 40 that can attract static electricity E, thereby improving the antenna 40's ability to attract electricity and preventing static electricity E from being conducted to the electronic components 32 and causing electromagnetic compatibility problems.

[0189] In some embodiments, the first insulating layer 43a can be attached to the first surface 411 by an adhesive process or a hot-pressing process. Similarly, the second insulating layer 43b can also be attached to the second surface 412 by an adhesive process or a hot-pressing process. For example, the process of attaching the first insulating layer 43a to the first surface 411 can be the same as the process of attaching the second insulating layer 43b to the second surface 412. As another example, the process of attaching the first insulating layer 43a to the first surface 411 can be different from the process of attaching the second insulating layer 43b to the second surface 412.

[0190] This application embodiment uses an example where a first insulating layer 43a is bonded to a first surface 411 and a second insulating layer 43b is bonded to a second surface 412. For example, the antenna 40 also includes a first adhesive layer and a second adhesive layer, wherein the first adhesive layer is located between the first surface 411 and the first insulating layer 43a, and the first insulating layer 43a is connected to the first surface 411 by means of the first adhesive layer. The second adhesive layer is located between the second surface 412 and the second insulating layer 43b, and the second insulating layer 43b is connected to the second surface 412 by means of the second adhesive layer.

[0191] In this way, bonding can provide a uniform stress distribution, reduce stress concentration points, and thus improve the overall strength and durability of antenna 40. The adhesive can fill the tiny gaps between the insulating layer 43 and the radiator 41, providing a good seal and preventing moisture, dust, and other contaminants from penetrating the surface of the radiator 41. Furthermore, the bonding method can better adapt to complex or irregular shapes of the radiator 41, providing uniform coverage.

[0192] The above embodiment is illustrated by taking the first insulating layer 43a and the second insulating layer 43b as separate structural components. In some other embodiments, the insulating layer 43 is an integral structural component, and the insulating layer 43 covers the surface of the radiator 41. The surface of the radiator 41 includes a first surface 411, a second surface 412 and a first side surface 413.

[0193] The insulating layer 43 can be attached to the radiator 41 by means of coating, spraying, impregnation, electroplating, chemical vapor deposition, physical vapor deposition, etc. For example, the insulating layer 43 can be attached to the surface of the radiator 41 by coating. The insulating layer 43 can be insulating ink, polyurethane coating, epoxy resin coating, etc.

[0194] In this way, the insulating layer 43 can be uniformly coated on the surface of the radiator 41 with complex shapes, including small gaps 433 and corners, providing comprehensive insulation protection. The insulating layer 43 is attached to the surface of the radiator 41 by coating, and the thickness of the insulating layer 43 can be set to be relatively thin, which helps to maintain the size and weight of the radiator 41.

[0195] Please continue referring to Figure 21. In some embodiments, the length L1 of the conductive portion 44 is greater than or equal to 0.01 mm in the length extension direction of the first side surface 413. This provides a lower limit to the length L1 of the conductive portion 44, and also a lower limit to the length of the conductive portion 44 that can attract static electricity E, thereby increasing the range over which the conductive portion 44 can attract static electricity E. When static electricity E enters the interior of the electronic device 100, the conductive portion 44 can attract static electricity E over a larger range, preventing static electricity E from being conducted to the electronic component 32 and causing electromagnetic compatibility problems.

[0196] In some embodiments, the area of ​​the conductive portion 44 is greater than or equal to 0.025 square micrometers. This provides a lower limit to the area of ​​the conductive portion 44 and the area over which it can adsorb static electricity E, thereby increasing the range over which the conductive portion 44 can adsorb static electricity E. When static electricity E enters the interior of the electronic device 100, the conductive portion 44 can adsorb static electricity E over a larger area, preventing static electricity E from being conducted to the electronic component 32 and causing electromagnetic compatibility problems.

[0197] Since the first region 411a and the second region 412a of the radiator 41 are exposed to the insulating layer 43, the first region 411a and the second region 412a are in direct contact with air, moisture, dust, etc., and the first region 411a and the second region 412a are easily corroded, affecting the radiation performance of the radiator 41.

[0198] Please refer to Figure 22, which is a schematic diagram of the structure of the antenna 40 provided in some embodiments of this application. In order to ensure the radiation performance of the radiator 41, the antenna 40 further includes an anti-oxidation conductive layer 46, which covers the conductive portion 44 and is exposed to the insulating layer 43.

[0199] The material of the antioxidant conductive layer 46 can be gold, silver, nickel, platinum, etc. The antioxidant conductive layer 46 not only has good conductivity, but it can also resist its own oxidation. The antioxidant conductive layer 46 covers the conductive portion 44, which can be understood as covering at least one of the first region 411a, the second region 412a, the third region 413a, the inner wall of the first groove 414, the inner wall of the second groove 415, and the inner wall of the third through hole 416.

[0200] In this way, the antioxidant conductive layer 46 can protect the covered conductive part 44 from oxidation, improve the conductivity of the conductive part 44 and the performance of the radiator 41, and improve the stability and reliability of the conductive part 44.

[0201] The above embodiments use a portion of the radiator 41 itself as an example to illustrate the conductive part 44. In other embodiments, the conductive part 44 can be other structural components. The following description will elaborate on the conductive part 44 as a lead wire structure.

[0202] The antenna 40 also includes a power supply section 45, which is used to transmit energy and signals. Specifically, the power supply section 45 transmits the radio frequency energy generated by the antenna transceiver 34 to the radiator 41 of the antenna 40, and transmits the radio frequency energy received by the radiator 41 to the antenna transceiver 34. In some embodiments, both the power supply section 45 and the grounding structure 42 mentioned above can be gold finger structures.

[0203] The gold finger structure can be formed on the radiator 41 using an electroplating gold process. For example, before gold plating, a layer of nickel is first plated on the gold finger area of ​​the radiator 41. Nickel can serve as the underlayer for the gold layer, improving its adhesion and wear resistance. Furthermore, nickel can prevent the gold layer from directly contacting copper, thus avoiding the diffusion of copper into the gold layer.

[0204] After nickel plating, preparation for gold plating is carried out. Photoresist is applied to areas on the surface of the radiator 41 that do not require gold plating, and a protective layer is formed through exposure, development, and other steps. Tiny electroplating leads 48 are soldered or bonded to the front end of the gold finger. The electroplating leads 48 can be gold wire or other conductive materials. The electroplating leads 48 extend from the front end of the gold finger to the edge of the radiator 41. The leads are used to conduct current during the gold finger electroplating process.

[0205] After preparation for gold plating, the radiator 41 is immersed in a gold plating solution containing gold ions. The gold ion solution (such as potassium gold cyanide) activates the surface of the radiator 41, preparing it for gold layer deposition. An electric current is used to deposit gold ions onto the nickel layer to form a gold layer. The current flows from the positive terminal of the power supply through leads to the cathode (the gold finger region of the radiator 41), where gold ions are deposited as electrons.

[0206] After the gold plating process is completed, the photoresist in the gold finger area is removed using a solvent or alkaline solution to expose the plated gold layer.

[0207] Please refer to Figure 23, which is a front view of the antenna 40 provided in some embodiments of this application. Therefore, through the gold plating process of the gold fingers described above, the radiator 41 retains electroplating gold leads 48 for the gold fingers, with one end of the electroplating gold leads 48 exposed at the edge of the radiator 41. Since the material of the electroplating gold leads 48 can be conductive materials such as gold, silver, or copper, the electroplating gold leads 48 can also be used as the conductive part 44 in the embodiments of this application.

[0208] In this way, the conductive part 44 can have different structural forms. The conductive part 44 can not only be formed from a part of the radiator 41 itself, but the conductive part 44 can also be a lead structure. The electroplated gold lead 48 is a structure retained during the gold finger manufacturing process. As the conductive part 44, the antenna 40 does not need to undergo additional processes to manufacture the conductive part 44, which helps to improve the manufacturing efficiency of the antenna 40.

[0209] Furthermore, the first end of the electroplated lead 48 is exposed to the insulating layer 43. This first end is used to attract static electricity E, preventing the static electricity E from being conducted to the electronic component 32 and causing electromagnetic compatibility issues. The static electricity E is conducted to the electroplated lead 48 via the first end, and the second end of the electroplated lead 48 is electrically connected to the gold finger (i.e., the grounding structure 42). In other words, the static electricity E in the electronic device 100 is directly conducted to the grounding structure 42 for release through the electroplated lead 48, without needing to be conducted through the radiator 41, thus shortening the path for the release of static electricity E.

[0210] Therefore, shortening the static electricity discharge path reduces the accumulation of static electricity within the electronic device 100, thereby reducing the risk of damage to the electronic components 32 within the electronic device 100. The shortened discharge path also allows static electricity to be conducted to the reference ground structure more quickly, reducing the time static electricity remains within the electronic device 100 and further lowering the risk of damage to the electronic components 32 inside the electronic device 100.

[0211] Please continue to refer to Figure 23. In some embodiments, the conductive part 44 is a first lead 49, which is connected to the radiator 41 and exposed to the insulating layer 43.

[0212] In this way, the number of lead structures can be increased during the fabrication of the aforementioned electroplated lead wire 48. That is, multiple lead structures can be directly fabricated during the pre-finishing process of the antenna 40, with some of these lead structures forming the first lead wire 49 as the conductive part 44. Therefore, after the antenna 40 is manufactured, no additional process is needed to fabricate the conductive part 44, which simplifies the manufacturing process and improves production efficiency.

[0213] Furthermore, both the first lead 49 and the electroplated lead 48 can be used as conductive parts 44. The increase in the number of conductive parts 44 increases the area on the antenna 40 that can attract static electricity E. Multiple conductive parts 44 can effectively attract static electricity E, preventing static electricity E from being conducted to electronic components 32, thereby avoiding electromagnetic compatibility issues.

[0214] Static electricity E is directly conducted to the grounding structure 42 through the electroplated lead 48 and released without passing through the radiator 41. This significantly shortens the release path of static electricity E, reducing the risk of static electricity E accumulating inside the electronic device 100 and thus reducing the risk of damage to electronic components 32. This improves the stability and reliability of the electronic device 100.

[0215] In summary, increasing the number of electrostatic leads 48 not only improves the current-carrying capability and processing efficiency of the antenna 40, but also enhances the electrostatic protection effect, thereby improving the overall performance and reliability of the electronic device 100.

[0216] In some embodiments, there are multiple conductive portions 44, and the multiple conductive portions 44 may have the same structure. For example, the multiple conductive portions 44 may all be formed from a portion of the radiator 41 itself, or the multiple conductive portions 44 may all be lead structures. The multiple conductive portions 44 may also have different structures. For example, some conductive portions 44 may be formed from a portion of the radiator 41 itself, while other conductive portions 44 may be lead structures.

[0217] Multiple conductive parts 44 are spaced apart, increasing the number of locations where the antenna 40 can attract static electricity E. Multiple locations on the antenna 40 can attract static electricity E, preventing the static electricity E from being conducted to the electronic components 32 and causing electromagnetic compatibility issues, thereby improving the overall performance and reliability of the electronic device 100.

[0218] In some embodiments, any two adjacent conductive parts 44 are distributed at equal intervals. "Equal intervals" means that the distance between any two adjacent conductive parts 44 is equal, and the conductive parts 44 are uniformly distributed on the radiator 41. In this way, by arranging the conductive parts 44 at equal intervals, static charge can be distributed more evenly on the surface of the radiator 41, reducing local charge accumulation and thus reducing the local electric field strength. While ensuring that the antenna 40 itself is not affected, it also helps to improve the antenna 40's ability to attract electricity.

[0219] In some embodiments, the straight-line distance between two adjacent conductive parts 44 is less than or equal to 15 mm. This provides an upper limit to the straight-line distance between adjacent conductive parts 44, meaning that the closer the multiple conductive parts 44 are, the easier it is for static electricity E to be attracted to the conductive parts 44, and the less likely static electricity E will accumulate in any one location. This reduces the risk of charge accumulation leading to conduction to the electronic components 32.

[0220] Multiple conductive parts 44 can serve as discharge paths for static electricity (E), making it easier for E to be attracted and guiding it to the ground or other conductive bodies, thereby improving the efficiency of E discharge. Furthermore, the close proximity of multiple conductive parts 44 provides multiple layers of protection; even if one conductive part 44 fails, the others can still function, improving the overall reliability of the electronic device 100 system.

[0221] Please refer to Figure 24, which is a schematic diagram of the structure of the antenna 40 provided in some embodiments of this application. In some embodiments, the radiator 41 includes a body 41a and a tip 41b, and the body 41a of the radiator 41 is the part of the antenna 40 used for receiving and transmitting signals. The tip 41b is disposed on the body 41a. For example, the tip 41b may be disposed on at least one of the first surface 411, the second surface 412, and the first side surface 413. In this embodiment of the application, the tip 41b is provided as an example where the first surface 411, the second surface 412, and the first side surface 413 all have the tip 41b.

[0222] The tip 41b can be a burr structure, a needle-like structure, a micro-needle array structure, a serrated edge structure, etc. By setting the tip 41b on the surface of the body 41a of the radiator 41, the effect of a lightning rod can be simulated, making it easier for static electricity E to accumulate at the tip 41b. The sharp structure of the tip 41b will generate a strong electric field around it, which helps to attract and accumulate static electricity E from the surrounding environment.

[0223] In this way, when static electricity E enters the electronic device 100, it will preferentially accumulate and discharge at sharp points. Specifically, static electricity E will be attracted by the tip 41b, conducted through the tip 41b to the surface of the body 41a, and then through the surface of the body 41a to the grounding structure 42 for release. Therefore, the tip 41b improves the attraction capability of the antenna 40, avoids electromagnetic compatibility issues caused by static electricity E being conducted to the electronic components 32, and thus enhances the overall performance of the electronic device 100.

[0224] Referring to Figure 24, in some embodiments, the insulating layer 43 covers the tip 41b, meaning the tip 41b is not exposed to the insulating layer 43. In this way, the insulating layer 43 prevents the tip 41b from corroding due to environmental factors (such as humidity and corrosive gases). The insulating layer 43 also protects the tip 41b from mechanical damage; for example, in the event of a collision or vibration of the electronic device 100, the insulating layer 43 protects the tip 41b, ensuring it maintains its original shape and function. Therefore, it extends the service life and performance of the tip 41b.

[0225] Please refer to Figure 25, which is a schematic diagram of the antenna 40 provided in some embodiments of this application. In other embodiments, at least a portion of the tip 41b along the thickness direction of the radiator 41 is exposed to the insulating layer 43. This improves the ability of the tip 41b to attract static electricity E, thereby enhancing the attraction capability of the antenna 40 and preventing electromagnetic compatibility problems caused by the conduction of static electricity E to the electronic components 32.

[0226] In some other embodiments, there are multiple tips 41b, with the insulating layer 43 covering a portion of the tips 41b and exposing another portion of the tips 41b to the insulating layer 43. This reduces the machining precision required for the insulating layer 43 to cover the surface of the radiator 41. After the insulating layer 43 is attached to the surface of the body 41a, it allows a portion of the tips 41b to be covered by the insulating layer 43 while another portion of the tips 41b is exposed to the insulating layer 43.

[0227] Please refer to Figure 26, which is a schematic diagram of the structure of the insulating layer 43 provided in some embodiments of this application. In some embodiments, the insulating layer 43 can be an integral structural component. For example, the insulating layer 43 is an insulating ink with slits 433. Along the thickness direction of the insulating ink, the slits 433 penetrate the insulating ink, and the radiator 41 forms a conductive portion 44 in the area exposed in the slits 433.

[0228] In this way, after the insulating ink cures on the surface of the radiator 41, it forms a continuous and dense protective film on the surface of the radiator 41, which can form a strong adhesion to the surface of the radiator 41 and is not easy to fall off, making it more reliable than other physically bonded insulating layers 43. Furthermore, the insulating ink can effectively block oxygen and moisture from direct contact with the surface of the radiator 41, thereby avoiding oxidation reaction on the surface of the radiator 41, allowing the radiator 41 to maintain its original performance.

[0229] Furthermore, the insulating ink can be applied by methods such as screen printing and inkjet printing, which reduces the processing difficulty of applying the insulating ink to the surface of the complex-shaped radiator 41.

[0230] The following section details the processing technology for the 433 gaps in insulating ink.

[0231] In some embodiments, after the insulating ink is cured on the surface of the radiator 41, the radiator 41 and the insulating ink are bent together to form a gap 433. More specifically, the insulating ink is uniformly coated on the surface of the radiator 41. After coating, the radiator 41 and the insulating ink are baked at a specific temperature and time to cure the insulating ink on the surface of the radiator 41. The cured insulating ink has a certain degree of elasticity and brittleness.

[0232] After the insulating ink has fully cured, stress is applied to the radiator 41 at predetermined locations by mechanically bending it. Cracks form in the insulating ink at stress concentration points. The location and width of the cracks can be controlled by the bending force and position.

[0233] In some other embodiments, after the insulating ink is cured on the surface of the radiator 41, the gaps 433 on the insulating ink are formed by etching. Specifically, insulating ink is coated on the surface of the radiator 41 and cured under specific conditions. A mask with a perforated pattern is applied to the cured insulating ink; these perforations correspond to the locations of the gaps 433 to be formed.

[0234] The insulating ink exposed beneath the mask apertures is etched using a chemical etchant until the designed etching depth is reached, creating cracks. After etching, the mask is removed, and the surface is cleaned to remove any residual etchant and etched ink.

[0235] In some embodiments, the gap 433 is created by varying the baking temperature and time of the radiator 41 and the insulating ink. Specifically, the insulating ink is coated onto the surface of the radiator 41, and during baking, the shrinkage of the insulating ink is controlled by varying the baking temperature and time. Due to uneven internal stress in the insulating ink, gaps 433 will appear at specific locations. The optimal baking temperature and time can be determined experimentally to achieve precise control over the position and width of the insulation.

[0236] Depending on the application scenario, the processing method of the insulating ink can be any of the above embodiments. For example, obtaining the gap 433 by bending is simple and easy, obtaining the gap 433 by etching can improve the accuracy of the gap 433, and obtaining the gap 433 by baking temperature and time is suitable for mass production.

[0237] In some embodiments, the conductive portion 44 and the feed portion 45 are located at opposite ends of the radiator 41. Since the feed portion 45 is a structural component of the antenna 40 used for connection to the antenna transceiver 34, which is mounted on a circuit board, the feed portion 45 side of the antenna 40 is closer to the circuit board, while the conductive portion 44 is located on the side of the radiator 41 furthest from the feed portion 45. Electronic components 32 near the feed portion 45 are typically critical parts of the circuit, such as integrated circuits and transistors. The placement of the conductive portion 44 helps protect these sensitive components from electrostatic discharge (ESD).

[0238] When static electricity E accumulates inside the electronic device 100, it is attracted to the conductive part 44 and thus directed away from the power supply part 45, i.e., away from the electronic component 32. Because the static electricity E is attracted away from the power supply part 45, it is prevented from being directly conducted to the electronic component 32 near the power supply part 45. This reduces the risk of damage caused by the discharge of static electricity E, avoids potential damage to the electronic component 32, and improves the reliability and stability of the electronic device 100.

[0239] In some embodiments, the minimum distance between the electronic component 32 and the frame 22 is greater than the maximum distance between the conductive part 44 of the antenna 40 and the frame 22. During the use of the electronic device 100, the main cause of static electricity E is the user rubbing the screen 10. This static electricity E enters the interior of the electronic device 100 through the gap between the screen 10 and the frame 22. As a result, the conductive part 44 is closer to the frame 22 than the electronic component 32, meaning the conductive part 44 is closer to the static electricity E. The static electricity E is initially attracted by the conductive part 44 upon entering the device, preventing it from further penetrating the interior of the electronic device 100 and thus avoiding damage to the internal electronic component 32, protecting the sensitive electronic component 32 on the circuit board.

[0240] In some embodiments, the conductivity of electronic component 32 is less than the conductivity of conductive portion 44 of antenna 40. Conductivity is a physical quantity that measures an object's ability to conduct electricity; the higher the conductivity, the stronger the object's conductivity. Therefore, static electricity E tends to discharge through the path with the highest conductivity. Since the conductivity of conductive portion 44 is higher than that of electronic component 32, static electricity E will preferentially discharge on conductive portion 44. This can also be understood as the static electricity E choosing the path of least resistance, i.e., conductive portion 44, because conductive portion 44 has high conductivity and low resistance.

[0241] In this way, static electricity E is released on the conductive part 44, preventing static electricity E from discharging on the electronic component 32, thereby avoiding damage to the electronic component 32 by static electricity E, and thus allowing the electronic component 32 to maintain its original performance, improving the stability and reliability of the electronic device 100.

[0242] The antenna 40 provided in the embodiments of this application is tested below, and compared with the antenna 40 in related technologies.

[0243] This test was conducted in accordance with GB 17626.2-2018 "Electromagnetic Compatibility Testing and Measurement Techniques - Electrostatic Discharge Immunity Test", which is a national standard for evaluating the immunity level of electrical and electronic equipment under electrostatic discharge conditions.

[0244] When testing antenna 40 in the relevant technology according to the above standards, when the electrostatic discharge gun E discharges near antenna 40, the electric arc bypasses antenna 40 and directly hits other electronic components 32. Antenna 40 has weak electrostatic protection capability, and when electrostatic discharge E occurs, it cannot provide good protection for electronic components 32. Furthermore, in the 10kV and 12kV test experiments, all electrostatic discharge E is conducted to electronic components 32, causing damage to electronic components 32.

[0245] When the antenna 40 in this embodiment is tested according to the above standards, when the electrostatic discharge gun discharges near the antenna 40, the antenna 40 in this embodiment can effectively attract the electrostatic discharge. The electrostatic discharge is conducted to the radiator 41 through the conductive part 44, and then conducted to the grounding structure 42 through the radiator 41 to be released, thereby forming an electrostatic protection function and preventing the electrostatic discharge from being conducted to the electronic components 32, which could lead to electromagnetic compatibility problems.

[0246] When testing the antenna 40 of this application embodiment according to the above standards, the larger the area of ​​the conductive part 44, the stronger the attraction of the antenna 40 to static electricity E, that is, the better the electrostatic protection function of the antenna 40. Tests show that the antenna 40 provided in this application embodiment can also achieve electrostatic protection against static electricity E of about 3kV, such as 1kV, 2kV, 3kV, 4kV, 5kV, etc.

[0247] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0248] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of this application.

Claims

1. An antenna, characterized in that, The antenna includes: Radiators, used to radiate signals; A grounding structure is electrically connected to the radiator. A conductive part, electrically connected to the radiator, is used to collect static charge, and the static charge is released via the grounding structure; An insulating layer covers the surface of the radiator, and the conductive part and the grounding structure are exposed to the insulating layer.

2. The antenna according to claim 1, characterized in that, The radiator includes a first surface, and the insulating layer has a first through-hole that exposes a first region of the first surface, the first region forming the conductive portion.

3. The antenna according to claim 2, characterized in that, The radiator has a first groove formed by at least a partial depression in the first region, and the conductive portion is formed on the inner wall of the first groove.

4. The antenna according to claim 2 or 3, characterized in that, The radiator further includes a second surface, and along the thickness direction of the radiator, the first surface and the second surface are arranged opposite to each other; The insulating layer has a second through-hole that exposes a second region of the second surface, the second region forming the conductive portion.

5. The antenna according to claim 4, characterized in that, The radiator has a second groove formed by at least a partial depression of the second region, and the inner wall of the second groove forms the conductive portion.

6. The antenna according to claim 4 or 5, characterized in that, The radiator includes a third through hole that extends through the radiator along its thickness direction and is connected to the first through hole. The inner wall of the third through hole forms the conductive portion.

7. The antenna according to claim 6, characterized in that, The third through hole is also connected to the second through hole.

8. The antenna according to any one of claims 1-7, characterized in that, The antenna further includes an antioxidant conductive layer that covers the conductive portion and is exposed to the insulating layer.

9. The antenna according to any one of claims 1-8, characterized in that, The radiator includes a first surface and a second surface arranged opposite to each other along its own thickness direction, and a first side surface connected between the first surface and the second surface; The first side has a third region exposed to the insulating layer, the third region forming the conductive portion.

10. The antenna according to claim 9, characterized in that, The insulating layer includes a first insulating layer that covers the first surface and has a first overlap that protrudes from the edge of the first surface and covers at least a portion of the first side surface. A portion of the first overlapping portion has a recessed edge facing the first side to form a first notch, and the third region is exposed to the first notch.

11. The antenna according to claim 10, characterized in that, The insulating layer further includes a second insulating layer that covers the second surface and has a second overlapping portion protruding from the edge of the second surface. The second overlapping portion is connected to the first overlapping portion to cover the first side surface. A portion of the second overlapping portion is recessed toward the first side to form a second notch, and the third region is exposed to the second notch.

12. The antenna according to any one of claims 9-11, characterized in that, In the length extension direction of the first side, the length of the conductive portion is greater than or equal to 0.01 mm.

13. The antenna according to any one of claims 1-12, characterized in that, The conductive part is a first lead, which is made of the same material as the radiator; the first lead is connected to the radiator, and one end of the first lead is exposed to the insulating layer.

14. The antenna according to any one of claims 1-13, characterized in that, The number of conductive parts is multiple, and the multiple conductive parts are arranged at intervals.

15. The antenna according to claim 14, characterized in that, The conductive parts are distributed at equal intervals between any two adjacent parts.

16. The antenna according to claim 15, characterized in that, The straight-line distance between two adjacent conductive parts is less than or equal to 15 mm.

17. The antenna according to any one of claims 1-16, characterized in that, The area of ​​the conductive part is greater than or equal to 0.025 square micrometers.

18. The antenna according to any one of claims 1-17, characterized in that, The radiator includes a body and a tip, the tip being disposed on the body.

19. The antenna according to claim 18, characterized in that, A portion of the tip is exposed to the insulating layer.

20. The antenna according to any one of claims 1-19, characterized in that, The insulating layer is an insulating ink, which has gaps that extend through the ink along its thickness direction. The conductive portion is formed in the area of ​​the radiator exposed to the gaps.

21. The antenna according to any one of claims 1-20, characterized in that, The conductive part and the feeding part are located at opposite ends of the radiator.

22. The antenna according to any one of claims 1-21, characterized in that, The antenna is a flexible circuit board antenna, which includes at least one of a millimeter-wave antenna, a near-field communication antenna, and a global positioning system antenna.

23. An electronic device, characterized in that, include: The housing includes a frame that encloses an accommodating space; The antenna as described in any one of claims 1-22, wherein the antenna is housed within the accommodating space; The reference ground structure is electrically connected to the antenna ground structure.

24. The electronic device according to claim 23, characterized in that, The electronic device further includes a circuit board and an elastic element. The circuit board is disposed within the accommodating space, and the reference ground structure is disposed on the circuit board. The elastic element is electrically connected between the reference ground structure and the grounding structure.

25. The electronic device according to claim 24, characterized in that, The electronic device further includes electronic components disposed on the circuit board. The minimum distance between the electronic components and the frame is greater than the maximum distance between the conductive part of the antenna and the frame.

26. The electronic device according to claim 25, characterized in that, The conductivity of the electronic component is less than the conductivity of the conductive part of the antenna.

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