Pan-tilt camera device
By using a natural heat dissipation system with multi-layer thermally conductive silicone blocks and heat-conducting plates in the camera pan-tilt device, heat is transferred from internal components to the large external shell, solving the problems of low heat dissipation efficiency and wasted space, and achieving low-cost, high-efficiency heat dissipation and improved structural strength.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- REMO INNOVATION TECHNOLOGY (CHENGDU) CO LTD
- Filing Date
- 2025-01-14
- Publication Date
- 2026-07-09
AI Technical Summary
Existing camera pan-tilt unit heat dissipation methods are inefficient and take up a lot of space, especially natural heat dissipation, which is ineffective. Air cooling and liquid cooling methods require additional components, resulting in noise and wasted space.
The natural heat dissipation system, consisting of multi-layer thermally conductive silicone blocks and heat-conducting plates, transfers heat from internal components to the outside of the device through thermally conductive components. It utilizes a large-area outer shell for heat dissipation, including the base, shaft top cover, lens housing, etc., avoiding the generation of additional heat dissipation components and noise.
It achieves efficient natural heat dissipation, reduces costs and space occupation, avoids noise pollution, and improves the structural strength and heat dissipation effect of the device.
Smart Images
Figure CN2025072226_09072026_PF_FP_ABST
Abstract
Description
Camera pan-tilt unit
[0001] This application claims priority to Chinese Patent Application No. 202423282677.7, filed with the Chinese Patent Office on December 30, 2024, the entire contents of which are incorporated herein by reference. Technical Field
[0002] This application relates to the field of camera pan-tilt technology, for example, to a camera pan-tilt device. Background Technology
[0003] A pan-tilt-zoom (PTZ) camera is a video input device, a type of closed-circuit television (CCTV), widely used in video conferencing, telemedicine, and real-time monitoring. Generally, a PTZ camera has basic functions such as video recording, transmission, and still image capture. It works by capturing images through a lens, then processing the images using the camera's internal photosensitive circuitry and control components, converting them into digital signals that a computer can recognize. These signals are then input to a computer via a parallel port or Universal Serial Bus (USB), where software reconstructs the image to create a video feed.
[0004] During operation, camera pan-tilt units generate heat from their internal components. If this heat is not dissipated in time, it can damage the core components. Typically, camera pan-tilt units employ natural cooling, air cooling, or liquid cooling. However, natural cooling is ineffective. Air cooling or liquid cooling requires components such as fans, which occupy a significant amount of internal space and generate noise, hindering product miniaturization. Summary of the Invention
[0005] This application provides a camera pan-tilt device that can dissipate heat through natural heat dissipation, which is low in cost, occupies little space, and has good heat dissipation effect.
[0006] This application provides a camera pan-tilt device, including a base housing, a shaft top cover, a central processing unit (CPU) motherboard, a first motor, a second heat-conducting component, and a third heat-conducting component;
[0007] Along the first direction, the bottom end of the shaft top cover is disposed on the top opening of the base housing, and the CPU motherboard and the first motor are sequentially disposed inside the base housing from bottom to top along the first direction, and the CPU motherboard has a first heat-generating component.
[0008] The second heat-conducting component is located between the CPU motherboard and the first motor;
[0009] The third heat-conducting component is located between the first motor and the shaft top cover. The heat generated by the first heating element can be transferred to the shaft top cover in sequence through the second heat-conducting component, the first motor, and the third heat-conducting component.
[0010] As an optional technical solution for the camera gimbal device, the camera gimbal device further includes a lens housing and a second motor. The first end of the second motor is connected to the top of the shaft cover, and the second end of the second motor is connected to the side wall of the lens housing. The two ends of the lens housing are arranged along a second direction, which is perpendicular to the first direction. The heat generated by the first heating element can also be transferred to the lens housing in sequence through the second heat-conducting component, the first motor, the third heat-conducting component, the shaft cover, and the second motor.
[0011] As an optional technical solution for the camera gimbal device, the bottom end of the base shell is provided with a bottom cover, and a first heat conduction component is provided between the bottom cover and the CPU motherboard. The heat generated by the first heat-generating component can be transferred to the outside of the camera gimbal device in sequence through the first heat conduction component and the bottom cover.
[0012] As an optional technical solution for the camera gimbal device, the second heat-conducting component includes a plurality of second heat-conducting silicone blocks. The first end of each second heat-conducting silicone block abuts against the nut of the first fastening screw at the bottom of the first motor, and the second end abuts against the top of the CPU motherboard.
[0013] As an optional technical solution for the camera gimbal device, the third heat-conducting component includes multiple third heat-conducting silicone blocks, which are evenly arranged between the first motor and the shaft top cover; the first heat-conducting component includes multiple first heat-conducting silicone blocks, which are evenly arranged and abut against the bottom of the CPU motherboard.
[0014] As an optional technical solution for the camera gimbal device, the lens housing is provided with a lens rear cover at the tail end along the second direction, and a second heating element is provided inside the lens housing near the lens rear cover. The camera gimbal device also includes a fourth heat conduction component located between the second heating element and the lens rear cover. The heat generated by the second heating element can be transferred to the lens rear cover and the lens housing through the fourth heat conduction component.
[0015] As an optional technical solution for a camera gimbal device, the front end of the second heating element along the second direction is connected to the lens decorative ring, and the lens decorative ring is made of plastic material.
[0016] As an optional technical solution for the camera gimbal device, the camera gimbal device further includes a heat-conducting plate, the two ends of which are respectively connected to the lens rear cover and the fourth heat-conducting component along the second direction, and the heat-conducting plate is in contact with the inner wall of the lens housing.
[0017] As an optional technical solution for a camera gimbal device, the heat-conducting plate includes a base plate and a connecting plate. The base plate is fitted to the inner wall of the lens rear cover, and the first end of the connecting plate is connected to the edge of the base plate, while the second end abuts against the fourth heat-conducting component.
[0018] As an optional technical solution for camera gimbal device, the fourth thermal conductive component includes multiple fourth thermal conductive silicone blocks. Attached Figure Description
[0019] The accompanying drawings used in the description of the embodiments of this application will be briefly introduced below.
[0020] Figure 1 is a schematic diagram of the external structure of the camera pan-tilt device provided in an embodiment of this application;
[0021] Figure 2 is a schematic diagram of the internal structure of the camera pan-tilt device provided in the embodiment of this application;
[0022] Figure 3 is a schematic diagram of the internal structure of the lens housing and the internal structure of the shaft top cover of the camera gimbal device provided in the embodiment of this application;
[0023] Figure 4 is an exploded view of the camera pan-tilt device provided in the embodiments of this application.
[0024] In the diagram: 100, base shell; 110, bottom cover; 120, CPU motherboard; 130, first motor; 200, shaft top cover; 300, lens shell; 310, lens rear cover; 320, heat conduction plate; 330, lens decorative ring; 340, lens module; 400, second motor; 500, first heat conduction component; 600, second heat conduction component; 700, third heat conduction component; 800, fourth heat conduction component. Detailed Implementation
[0025] The present application will now be described in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for illustrative purposes only and not for limiting the scope of the application. Furthermore, it should be noted that, for ease of description, the accompanying drawings show only the parts relevant to the present application and not the entire structure.
[0026] In the description of this application, unless otherwise expressly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0027] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0028] In the description of this embodiment, the terms "upper," "lower," "left," and "right," etc., refer to the orientation or positional relationship shown in the accompanying drawings. They are used only for ease of description and simplification of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. In addition, the terms "first" and "second" are used only for distinction in description and have no special meaning.
[0029] This embodiment provides a camera pan-tilt device that can dissipate heat naturally, is low in cost, occupies little space, and has good heat dissipation effect.
[0030] As shown in Figures 1 to 4, the camera gimbal device includes a base housing 100, a shaft top cover 200, a CPU motherboard 120, a first motor 130, a second heat-conducting component 600, and a third heat-conducting component 700. Along a first direction (direction A in the figures), the bottom end of the shaft top cover 200 is positioned over the top opening of the base housing 100. The CPU motherboard 120 and the first motor 130 are sequentially arranged from bottom to top within the base housing 100 along the first direction. The CPU motherboard 120 contains a first heat-generating element, the second heat-conducting component 600 is located between the CPU motherboard 120 and the first motor 130, and the third heat-conducting component 700 is located between the first motor 130 and the shaft top cover 200. The heat generated by the first heat-generating element can be sequentially transferred to the shaft top cover 200 through the second heat-conducting component 600, the first motor 130, and the third heat-conducting component 700. The large outer surface area of the shaft top cover 200 allows heat generated by the first heat-generating component inside the camera gimbal to be transferred to the shaft top cover 200 for heat dissipation, increasing the heat dissipation area and thus improving the heat dissipation effect. Furthermore, it utilizes natural heat dissipation, saving both cost and space.
[0031] The camera gimbal device also includes a lens housing 300 and a second motor 400. The first end of the second motor 400 is connected to the top of the shaft top cover 200, and the second end of the second motor 400, opposite to the first end, is connected to the side wall of the lens housing 300. The two ends of the lens housing 300 are arranged along a second direction (direction B in the figure), which is perpendicular to the first direction. The heat generated by the first heating element can be transferred sequentially to the lens housing 300 through the second heat-conducting component 600, the first motor 130, the third heat-conducting component 700, the shaft top cover 200, and the second motor 400. The lens housing 300 has a large outer surface area, which transfers the heat generated by the first heating element inside the camera gimbal device to the shaft top cover and then to the lens housing for heat dissipation, further increasing the heat dissipation area and improving the heat dissipation effect. Furthermore, it also uses natural heat dissipation, saving both cost and space.
[0032] Continuing as shown in Figure 2, the bottom cover of the base housing 100 is provided with a bottom cover 110. A first heat-conducting component 500 is also provided between the bottom cover 110 and the CPU motherboard 120. The heat generated by the first heat-generating component can be transferred to the outside of the camera gimbal device through the first heat-conducting component 500 and the bottom cover 110. Similarly, the first heat-conducting component 500 enables the camera gimbal device to transfer the heat generated by the first heat-generating component inside to the outside through its own components, dissipating heat naturally, which saves both cost and space.
[0033] The first direction is perpendicular to the second direction. The bottom cover 110, the first motor 130, the second motor 400, the shaft top cover 200, and the lens housing 300 are all made of heat-conducting materials.
[0034] In some embodiments, the first thermal conductive component 500 includes a plurality of first thermal conductive silicone blocks, which are evenly arranged and abut against the bottom of the CPU motherboard 120, providing uniform heat conduction and simple connection with low cost.
[0035] The second thermal conductive component 600 includes multiple second thermal conductive silicone blocks. The first end of each second thermal conductive silicone block abuts against the nut of the first fastening screw at the bottom of the first motor 130. The second end of the second thermal conductive silicone block, opposite to the first end, abuts against the top of the CPU motherboard 120. The heat generated by the first heating element can be transferred to the first motor 130 in sequence through the second thermal conductive silicone and the first fastening screw. The first fastening screw is made of metal, which provides good heat transfer.
[0036] The bottom of the first motor 130 has a first chassis fixed by a first fastening screw. The second thermally conductive silicone block is abutted against the nut of the first fastening screw. This also avoids the need to set a gap on the first chassis to allow the second thermally conductive silicone block to contact the first motor 130. This can reduce costs and increase the structural strength of the first chassis, thereby further reducing the cost of the camera gimbal device and improving the structural strength of the camera gimbal device.
[0037] In other embodiments, the second thermally conductive component 600 can be a spreadable thermally conductive adhesive, that is, the surface of the first fastening screw is covered with a spreadable thermally conductive adhesive for heat conduction.
[0038] The third heat-conducting component 700 includes multiple third heat-conducting silicone blocks, which are evenly arranged between the first motor 130 and the shaft top cover 200, providing uniform heat conduction and simple connection with low cost.
[0039] Only the side walls of the base housing 100 are made of plastic to prevent burns from excessive heat. The rest can be made of metal, which has high thermal conductivity. The lens housing 300 has a lens cover 310 at its rear end along the second direction. Inside the lens housing 300, near the lens cover 310, there is a second heat-generating element. The camera gimbal device also includes a fourth heat-conducting component 800, located between the second heat-generating element and the lens cover 310. The heat generated by the second heat-generating element is transferred to the lens cover 310 and the lens housing 300 through the fourth heat-conducting component 800. This allows the camera gimbal device to transfer the heat generated by the second heat-generating element inside to the outside through its own components for natural heat dissipation, saving both cost and space.
[0040] The second heating element is connected to the lens decorative ring 330 along the second direction at its front end. The lens decorative ring 330 is made of plastic material, which can prevent the user from being burned due to excessive temperature.
[0041] In this embodiment, the second heat-generating component is a component in the lens module 340.
[0042] The camera gimbal device also includes a heat-conducting plate 320. The two ends of the heat-conducting plate 320 along the second direction are respectively connected to the lens rear cover 310 and the fourth heat-conducting component 800. The heat-conducting plate 320 is in contact with the inner wall of the lens housing 300, transferring the heat generated by the second component to the lens housing 300. This provides good heat dissipation and also presses the fourth heat-conducting component 800 firmly, preventing poor contact between the fourth heat-conducting component 800 and the lens rear cover 310, which could lead to insufficient heat dissipation and thus prevent the core components inside the lens housing 300 from burning out.
[0043] In this embodiment, the fourth thermal conductive component 800 includes multiple fourth thermal conductive silicone blocks, which are simple to connect and low in cost.
[0044] Optionally, the heat-conducting plate 320 includes a base plate and a connecting plate. The base plate is fitted along the inner wall of the lens rear cover 310. The first end of the connecting plate is connected to the edge of the base plate, and the second end of the connecting plate opposite to the first end of the connecting plate abuts against the fourth heat-conducting component 800.
[0045] The heat-conducting plate 320 is fixed to the inner wall of the lens housing 300 by a third fastening screw and is also bonded to the lens rear cover 310 with adhesive. In this embodiment, the base plate is fixed to the inner wall of the lens housing 300 by a third fastening screw and is also bonded to the lens rear cover 310 with adhesive.
Claims
1. A camera pan-tilt device, comprising a base housing (100), a shaft top cover (200), a central processing unit (CPU) motherboard (120), a first motor (130), a second heat-conducting component (600), and a third heat-conducting component (700); Along the first direction, the bottom end of the shaft top cover (200) is covered by the top opening of the base housing (100). The CPU motherboard (120) and the first motor (130) are arranged sequentially from bottom to top in the base housing (100) along the first direction. The CPU motherboard (120) has a first heating element inside. The second heat-conducting component (600) is located between the CPU motherboard (120) and the first motor (130); The third heat-conducting component (700) is located between the first motor (130) and the shaft top cover (200). The heat generated by the first heating element can be transferred to the shaft top cover (200) in sequence through the second heat-conducting component (600), the first motor (130) and the third heat-conducting component (700).
2. The camera gimbal device according to claim 1 further includes a lens housing (300) and a second motor (400), the first end of the second motor (400) is connected to the top of the shaft top cover (200), the second end of the second motor (400) is connected to the side wall of the lens housing (300), the two ports of the lens housing (300) are arranged along a second direction, the second direction is perpendicular to the first direction, and the heat generated by the first heating element can also be transferred to the lens housing (300) in sequence through the second heat conduction component (600), the first motor (130), the third heat conduction component (700), the shaft top cover (200) and the second motor (400).
3. The camera pan-tilt device according to claim 1, wherein, The bottom end of the base housing (100) is provided with a bottom cover (110). A first heat conduction component (500) is provided between the bottom cover (110) and the CPU motherboard (120). The heat generated by the first heat-generating component can be transferred to the outside of the camera gimbal device through the first heat conduction component (500) and the bottom cover (110) in sequence.
4. The camera pan-tilt device according to claim 1, wherein, The second thermal conductive component (600) includes a plurality of second thermal conductive silicone blocks, each of which has a first end abutting against the nut of a first fastening screw at the bottom of the first motor (130) and a second end abutting against the top of the CPU motherboard (120).
5. The camera pan-tilt device according to claim 3, wherein, The third heat-conducting component (700) includes a plurality of third heat-conducting silicone blocks, which are evenly arranged between the first motor (130) and the shaft top cover (200); the first heat-conducting component (500) includes a plurality of first heat-conducting silicone blocks, which are evenly arranged and abut against the bottom of the CPU motherboard (120).
6. The camera pan-tilt device according to claim 2, wherein, The lens housing (300) has a lens rear cover (310) at its tail end along the second direction. A second heating element is disposed inside the lens housing (300) near the lens rear cover (310). The camera gimbal device also includes a fourth heat-conducting component (800) located between the second heating element and the lens rear cover (310). The heat generated by the second heating element can be transferred to the lens rear cover (310) and the lens housing (300) through the fourth heat-conducting component (800).
7. The camera pan-tilt device according to claim 6, wherein, The front end of the second heating element along the second direction is connected to the lens decorative ring (330), and the lens decorative ring (330) is made of plastic material.
8. The camera gimbal device according to claim 6 further includes a heat-conducting plate (320), wherein the heat-conducting plate (320) is connected to the lens rear cover (310) and the fourth heat-conducting component (800) at both ends along the second direction, and the heat-conducting plate (320) is in contact with the inner wall of the lens housing (300).
9. The camera pan-tilt device according to claim 8, wherein, The heat-conducting plate (320) includes a base plate and a connecting plate. The base plate is fitted to the inner wall of the lens rear cover (310). The first end of the connecting plate is connected to the edge of the base plate, and the second end abuts against the fourth heat-conducting component (800).
10. The camera pan-tilt device according to claim 6, wherein, The fourth thermally conductive component (800) includes a plurality of fourth thermally conductive silicone blocks.