Display panel and display device

Abstract

A display panel, comprising a driving backplane, a light-emitting chip layer, and a retaining wall layer. The light-emitting chip layer is arranged on one side of the driving backplane, and the light-emitting chip layer comprises multiple light-emitting chips. The retaining wall layer is arranged on the side of the light-emitting chip layer away from the driving backplane; the retaining wall layer comprises multiple first openings; each first opening among the multiple first openings exposes one light-emitting chip among the multiple light-emitting chips; and each first opening among the multiple first openings is internally provided with a first light-concentrating structure.

Description

A display panel and display device

[0001] This application claims priority to Chinese patent application No. 202510012556.0, filed on January 3, 2025, the entire contents of which are incorporated herein by reference. Technical Field

[0002] This disclosure relates to the field of display technology, and more particularly to a display panel and display device. Background Technology

[0003] Currently, display panels, such as mini LED (mini light-emitting diode) display panels and Micro LED (micro light-emitting diode) display panels, have advantages such as high brightness, clear display images, and low power consumption, and are increasingly widely used in various display devices such as mobile phones, tablets, computers, and televisions. Summary of the Invention

[0004] On one hand, a display panel is provided, including a driving backplate, a light-emitting chip layer, and a barrier layer; the light-emitting chip layer is disposed on one side of the driving backplate and includes a plurality of light-emitting chips; the barrier layer is disposed on the side of the light-emitting chip layer away from the driving backplate and includes a plurality of first openings, each of the plurality of first openings exposing one of the plurality of light-emitting chips, and a first light-concentrating structure is disposed in each of the plurality of first openings.

[0005] In some embodiments, the angle between the plane containing the sidewall of at least one of the plurality of first openings and the plane containing the surface of the light-emitting chip layer near the barrier layer is within a preset range.

[0006] In some embodiments, the preset range is 70° to 110°.

[0007] In some embodiments, the first focusing structure includes a convex lens.

[0008] In some embodiments, the light-emitting chip layer includes a first electrode layer, which is close to the barrier layer and is disposed throughout the entire layer; the display panel further includes a thermally conductive layer disposed between the first electrode layer and the barrier layer, the thermally conductive layer including a plurality of second openings, each of the plurality of second openings corresponding to one of the plurality of first openings; a first light-concentrating structure is also disposed within the corresponding second opening; wherein the material of the thermally conductive layer includes a first metal material, the material of the barrier layer includes a second metal material, and the thermal conductivity of the first metal material is higher than that of the second metal material.

[0009] In some embodiments, a reflective layer is provided on the portion of the sidewall of at least one of the plurality of first openings that is not in contact with the first light-concentrating structure.

[0010] In some embodiments, multiple light-emitting chips emit light of the same color; the display panel further includes a color conversion layer and a color filter layer. The color conversion layer fills multiple first openings in the barrier layer and is located on the side of the first light-concentrating structure away from the light-emitting chips. The color conversion layer is used to convert the light emitted by the multiple light-emitting chips into white light. The color filter layer is disposed on the side of the color conversion layer away from the light-emitting chip layer. The color filter layer includes multiple filter portions, and each filter portion corresponds to one of the multiple light-emitting chips.

[0011] In some embodiments, multiple light-emitting chips emit light of the same color; the display panel further includes a color conversion layer and a color filter layer. The color conversion layer includes multiple color conversion sections, one of which is located within one of multiple first openings and on the side of the first light-concentrating structure away from the light-emitting chips. Each of the multiple color conversion sections is used to convert the light emitted by the corresponding light-emitting chip into light of a set color. The color filter layer is disposed on the side of the color conversion layer away from the light-emitting chip layer. The color filter layer includes multiple filter sections, each of which corresponds to one of the multiple light-emitting chips.

[0012] In some embodiments, the color filter layer further includes partitions disposed at the intervals between the plurality of filter portions.

[0013] In some embodiments, the display panel further includes a light-concentrating layer disposed on the side of the color filter layer away from the light-emitting chip layer. The light-concentrating layer includes a plurality of second light-concentrating structures, each of the plurality of second light-concentrating structures corresponding to one of the plurality of light-emitting chips.

[0014] In some embodiments, the second focusing structure includes a convex lens.

[0015] In some embodiments, the display panel further includes a protective layer disposed between the color conversion layer and the color filter layer.

[0016] In some embodiments, the drive backplane includes a substrate made of silicon.

[0017] On the other hand, a display device is provided, including the display panel and driver chip described above, wherein the driver chip is connected to the display panel. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly described below. Obviously, the drawings described below are only drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0019] Figure 1 is a cross-sectional view of a display panel according to some embodiments;

[0020] Figure 2 is a plan view of a display panel according to some embodiments;

[0021] Figure 3 is a cross-sectional view of a drive backplane according to some embodiments;

[0022] Figure 4 is a cross-sectional view of a light-emitting chip according to some embodiments;

[0023] Figure 5 is a diagram illustrating the manufacturing steps of a display panel according to some embodiments;

[0024] Figures 6 to 12 are yet another cross-sectional view of a display panel according to some embodiments;

[0025] Figure 13 is a structural diagram of a display device according to some embodiments. Detailed Implementation

[0026] The technical solutions in some embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0027] Unless the context otherwise requires, throughout the specification and claims, the term "comprise" and its other forms, such as the third-person singular "comprises" and the present participle "comprising," are interpreted as open-ended and encompassing, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific example," or "some examples," etc., are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples.

[0028] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, unless otherwise stated, "a plurality of" means two or more.

[0029] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate.

[0030] This document describes exemplary embodiments with reference to cross-sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as being limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. For example, etched areas shown as rectangular would typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the areas of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0031] With the continuous development of the display technology industry, the PPI of display panels is constantly increasing. PPI (pixels per inch) represents the number of subpixels per inch of a display panel. The higher the PPI value, the higher the density at which the display panel displays the image, resulting in higher image fidelity and richer image details. Currently, high PPI has become an important direction for the development of display panels.

[0032] For example, the display panel includes multiple subpixels, which are the smallest units for displaying images on the display panel. Each subpixel can display a single color. For instance, the multiple subpixels include a first color subpixel, a second color subpixel, and a third color subpixel, which display red, green, or blue, respectively. By adjusting the brightness (grayscale) of different color subpixels, and through the combination and superposition of the colors displayed by different color subpixels, multiple colors can be displayed, thereby enabling full-color display of the display panel. Subpixels can also display other colors, which are not limited herein.

[0033] For example, the higher the PPI value of a display panel, the smaller the size of the sub-pixels and the smaller the distance between adjacent sub-pixels. Because the distance between adjacent sub-pixels is small, light from a first-color sub-pixel in the display panel may be emitted into its adjacent second-color and / or third-color sub-pixels, light from a second-color sub-pixel may be emitted into its adjacent first-color and / or third-color sub-pixels, and light from a third-color sub-pixel may be emitted into its adjacent first-color and / or second-color sub-pixels. This can cause light crosstalk between adjacent sub-pixels in the display panel, reducing the display quality. Simultaneously, light emitted from a sub-pixel into other sub-pixels reduces the light extraction efficiency of that sub-pixel, thus reducing the light extraction efficiency of the display panel.

[0034] In some embodiments, as shown in FIG1, this disclosure provides a display panel 100, including a driving backplate 10, a light-emitting chip layer 20, and a barrier layer 30; the light-emitting chip layer 20 is disposed on one side of the driving backplate 10, and the light-emitting chip layer 20 includes a plurality of light-emitting chips 20-1; the barrier layer 30 is disposed on the side of the light-emitting chip layer 20 away from the driving backplate 10, and the barrier layer 30 includes a plurality of first openings 30-1, each of the plurality of first openings 30-1 exposing one of the plurality of light-emitting chips 20-1, and a first light-concentrating structure 1 is disposed in each of the plurality of first openings 30-1.

[0035] For example, the display panel 100 can be used to display images; the display panel 100 can be, for example, a mini light-emitting diode (Mini LED) display panel, a micro light-emitting diode (Micro LED) display panel, etc., and this disclosure is not limited thereto. This disclosure uses a Micro LED display panel as an example for description.

[0036] For example, as shown in FIG2, the display panel 100 (e.g., a Micro LED display panel) includes a display area AA and a peripheral area BB located on at least one side of the display area AA. For example, the peripheral area BB is located on all four sides of the display area AA and is arranged around the display area AA.

[0037] For example, as shown in FIG2, the display area AA of the display panel 100 can be provided with multiple sub-pixels P and multiple signal lines, such as data signal lines and gate signal lines. A sub-pixel P includes a pixel driving circuit D and a light-emitting chip 20-1, and a pixel driving circuit D includes at least one transistor; the peripheral area BB of the display panel 100 can be provided with multiple signal lines, such as initialization signal lines, to ensure the normal display of the display panel 100.

[0038] For example, the pixel driving circuit D can be configured to provide an electrical signal (e.g., driving voltage or driving current) to the light-emitting chip 20-1 coupled to the pixel driving circuit D in response to the received scan signal and data signal (e.g., the scan signal output by the scan driving circuit and the data signal output by the data driving circuit), so as to drive the light-emitting chip 20-1 to emit light, thereby enabling the display panel 100 to display an image.

[0039] In some embodiments, as shown in FIG1, the display panel 100 includes a driving backplate 10, a light-emitting chip layer 20, and a barrier layer 30 stacked sequentially.

[0040] In some embodiments, as shown in FIG3 and referring to FIG1, the driving backplate 10 can be used to set the pixel driving circuit D of the sub-pixel P in the display panel 100, that is, the driving backplate 10 includes multiple pixel driving circuits D. The driving backplate 10 may include multiple metal layers, which may include, for example, a semiconductor layer 12 (ACT), a gate metal layer 14 (Gate), a source / drain metal layer 16 (SD), a common electrode layer 19-1 (COM), and a pixel electrode layer 19-3 (Pixel) stacked together. Of course, the driving backplate 10 may also include other metal layers, such as a second gate metal layer, and / or a second source / drain metal layer, and / or a third source / drain metal layer, etc., which can be specifically set according to the actual situation, and this disclosure does not limit it.

[0041] For example, as shown in FIG3, a plurality of metal layers on the drive backplane 10 form at least one transistor TFT. For example, the transistor TFT may include a semiconductor pattern T11 disposed on the semiconductor layer 12, a gate pattern T12 disposed on the gate metal layer 14, and a source pattern T13 and a drain pattern T14 disposed on the source and drain metal layers 16.

[0042] In some embodiments, the common electrode layer 19-1 includes a plurality of common electrodes, the pixel electrode layer 19-3 includes a plurality of pixel electrodes, and a pixel driving circuit D includes a common electrode and a pixel electrode. In other embodiments, the common electrode layer 19-1 can be disposed as a single layer, in which case a pixel driving circuit D includes a portion of the common electrode and a pixel electrode.

[0043] In some embodiments, the driving backplane 10 may further include an insulating layer located between adjacent metal layers, the insulating layer being used to isolate adjacent metal layers. For example, as shown in FIG3, the driving backplane 10 may include a substrate 11, a first gate insulating layer 13 (GI1) located between the semiconductor layer 12 and the gate metal layer 14, a second gate insulating layer 15 (GI2) located between the gate metal layer 14 and the source / drain metal layer 16, a passivation layer 17 (PVX) located between the source / drain metal layer 16 and the common electrode layer 19-1, a planarization layer 18 (PLN) located between the common electrode layer 19-1 and the pixel electrode layer 19-3, and an electrode insulating layer 19-2 located between the common electrode layer 19-1 and the pixel electrode layer 19-3. The driving backplane 10 may also include other insulating layers, which may be specifically configured according to actual conditions, and are not limited herein.

[0044] In some embodiments, as shown in FIG4 and referring to FIG1, the light-emitting chip layer 20 can be used to set the light-emitting chips 20-1 of the sub-pixel P in the display panel 100, that is, the light-emitting chip layer 20 includes a plurality of light-emitting chips 20-1. The light-emitting chip 20-1 can be a Micro LED light-emitting chip or a Mini LED light-emitting chip, which is not limited herein.

[0045] In some embodiments, as shown in FIG4, the light-emitting chip 20-1 includes a second electrode 21, an epitaxial layer 22, and a first electrode 23 stacked sequentially. The epitaxial layer 22 includes a second semiconductor layer 22-1, a light-emitting layer 22-2, and a first semiconductor layer 22-3 stacked sequentially. The second electrode 21 is disposed on the side close to the second semiconductor layer 22-1, and the first electrode 23 is disposed on the side close to the first semiconductor layer 22-3.

[0046] In some embodiments, the second electrode 21 is a P-type electrode, and the second semiconductor layer 22-1 is a P-type semiconductor layer; the first electrode 23 is an N-type electrode, and the first semiconductor layer 22-3 is an N-type semiconductor layer. In other embodiments, the second electrode 21 is an N-type electrode, and the second semiconductor layer 22-1 is an N-type semiconductor layer; the first electrode 23 is a P-type electrode, and the first semiconductor layer 22-3 is a P-type semiconductor layer. This disclosure does not limit the specific embodiments described herein. This disclosure uses the example of the second electrode 21 being a P-type electrode, the second semiconductor layer 22-1 being a P-type semiconductor layer, and the first electrode 23 being an N-type electrode, and the first semiconductor layer 22-3 being an N-type semiconductor layer for illustration.

[0047] In some embodiments, the light-emitting chip 20-1 may further include a bonding electrode disposed on the side of the second electrode 21 away from the epitaxial layer 22. The bonding electrode may be used to bond the second electrode 21 of the light-emitting chip 20-1 to the pixel driving circuit D.

[0048] For example, as shown in FIG1, a light-emitting chip 20-1 of the light-emitting chip layer 20 can be connected to a pixel driving circuit D of the driving backplane 10. For example, the second electrode 21 on the light-emitting chip 20-1 can be connected to the pixel electrode in the pixel driving circuit D, and the first electrode 23 on the light-emitting chip 20-1 can be connected to the common electrode in the pixel driving circuit D.

[0049] For example, the pixel driving circuit D is used to drive the light-emitting chip 20-1 to emit light. In some embodiments, the plurality of light-emitting chips 20-1 of the display panel 100 may include a red light-emitting chip, a green light-emitting chip, and a blue light-emitting chip, which can emit red light, green light, and blue light respectively, so that the sub-pixel P where the light-emitting chip 20-1 is located displays red, green, and blue, thereby realizing the display of a color image on the display panel 100. In other embodiments, the plurality of light-emitting chips 20-1 of the display panel 100 may all be light-emitting chips 20-1 of the same color, for example, they may all be blue light-emitting chips, emitting blue light, and then the blue light emitted by the blue light-emitting chip may be converted into light of other colors, such as red or green light, through other film layers (e.g., color conversion layer), thereby making the sub-pixel P where the light-emitting chip 20-1 is located display red, green, and blue, thereby realizing the display of a color image on the display panel 100.

[0050] In some embodiments, as shown in Figures 1 and 2, the sub-pixels P on the display panel 100 can be arranged in an array, that is, multiple sub-pixels P are arranged in multiple rows and columns. At this time, the multiple pixel driving circuits D of the driving backplane 10 are arranged in an array, and the multiple light-emitting chips 20-1 of the light-emitting chip layer 20 are also arranged in an array. The sub-pixels P on the display panel 100 can also be arranged in other forms, which are not limited in this disclosure.

[0051] In some embodiments, as shown in FIG1, an insulating filling layer 24 can be provided between the gaps between the plurality of light-emitting chips 20-1 of the light-emitting chip layer 20. The insulating filling layer 24 separates two adjacent light-emitting chips 20-1, avoids short circuits between two adjacent light-emitting chips 20-1, and increases the flatness of the light-emitting chip layer 20.

[0052] In some embodiments, as shown in FIG1, the first electrodes 23 of the plurality of light-emitting chips 20-1 of the light-emitting chip layer 20 can be laid in the entire layer, that is, the first electrodes 23 of all light-emitting chips 20-1 are connected to each other. This arrangement increases the display uniformity of the display panel 100 and simplifies the manufacturing process.

[0053] In other embodiments, the first electrodes 23 of the plurality of light-emitting chips 20-1 in the light-emitting chip layer 20 can be set individually, which is not limited herein.

[0054] In some embodiments, as shown in FIG1, a barrier layer 30 is disposed on the side of the light-emitting chip layer 20 away from the driving backplate 10. The barrier layer 30 is provided with a plurality of first openings 30-1, each of which exposes a light-emitting chip 20-1, thereby forming a barrier 30-2 located between any two adjacent light-emitting chips 20-1; that is, the orthographic projection of the barrier 30-2 on the driving backplate 10 is located between the orthographic projections of any two adjacent light-emitting chips 20-1 on the driving backplate 10.

[0055] In some embodiments, the material of the barrier layer 30 can be a reflective metal such as aluminum, nickel, or silver. The thickness of the barrier layer 30 in the direction perpendicular to the display panel 100 needs to ensure that the light emitted by the light-emitting chip 20-1 is reflected by the barrier layer 30-2 and incident on the area corresponding to the sub-pixel P. The thickness of the barrier layer 30 in the direction perpendicular to the display panel 100 can be, for example, 3µm to 5µm.

[0056] In some embodiments, as shown in FIG1, a first light-concentrating structure 1 is provided in each first opening 30-1 of the retaining wall layer 30.

[0057] In some embodiments, as shown in FIG1, the first light-concentrating structure 1 may include a convex lens, and the diameter / height ratio of the convex lens of the first light-concentrating structure 1 may be 5:1 to 3:1. The first light-concentrating structure 1 may also include other structures, as long as they can achieve the light-concentrating effect.

[0058] In some embodiments, as shown in FIG5, the display panel 100 described above can be fabricated by the following method:

[0059] S1. On a silicon substrate (Si) or a sapphire substrate, a primary first semiconductor layer 22-3', a primary light-emitting layer 22-2', a primary second semiconductor layer 22-1', and a second electrode layer are sequentially formed. The second electrode layer is patterned to form multiple second electrodes 21.

[0060] S2. Bond the multiple second electrodes 21 to the multiple pixel driving circuits on the driving backplate 10 respectively.

[0061] For example, the second electrode 21 may be bonded to the pixel electrode of the pixel driving circuit D.

[0062] S3. Remove the silicon substrate (Si) or sapphire substrate, and etch the original first semiconductor layer 22-3', the original light-emitting layer 22-2', and the original second semiconductor layer 22-1' to form multiple epitaxial layers 22, with each epitaxial layer 22 corresponding to a second electrode 21.

[0063] For example, silicon or sapphire substrates can be removed by etching or laser lift-off (LLO) techniques.

[0064] S4. An insulating fill layer 24 is formed over a plurality of epitaxial layers 22, and the insulating fill layer 24 is patterned such that at least a portion of each epitaxial layer 22 is exposed.

[0065] For example, the insulating filling layer 24 fills the space between any two adjacent second electrodes 21 and any two adjacent epitaxial layers 22.

[0066] S5. A first electrode layer 23' is formed above the insulating fill layer 24, thereby forming a plurality of light-emitting chips 20-1.

[0067] For example, the material of the first electrode layer 23' can be a transparent material, such as indium tin oxide (ITO) or indium zinc oxide (IZO).

[0068] Exemplarily, the first electrode layer 23' can be disposed as a whole layer, and the first electrode layer 23' is the first electrode 23 of all light-emitting chips 20-1; the first electrode layer 23' can also be patterned to form multiple first electrodes 23, with one first electrode 23 corresponding to one epitaxial layer 22. This disclosure uses the disposal of the first electrode layer 23' as an example for illustration.

[0069] S6. A first light-concentrating structure layer 1' is formed above the first electrode layer 23', and photoresist O is coated on the first light-concentrating structure layer 1'. The first electrode layer 23' at the interval position of the light-emitting chip 20-1 is exposed by exposure, development and etching.

[0070] For example, the material of the first light-concentrating structure layer 1' can be silicon nitride (SiN) or silicon oxide (SiO) or a composite material of silicon nitride (SiN) and silicon oxide (SiO).

[0071] For example, in this step, the thickness of the photoresist O in the direction perpendicular to the display panel 100 can be relatively thick, and the specific thickness can be set according to the actual situation; and the photoresist O is not removed in this step.

[0072] S7. A barrier layer 30 is formed above the exposed first electrode layer 23'.

[0073] For example, the barrier layer 30 can be made of a metallic material and can be formed by an electroforming process. The exposed first electrode layer 23' can serve as a seed layer for the barrier layer 30.

[0074] For example, in the direction perpendicular to the display panel 100, the height of the barrier layer 30 is approximately the same as the sum of the heights of the first light-concentrating structure layer 1' and the photoresist O coated above the first light-concentrating structure layer 1'.

[0075] S8. Remove the coated photoresist O to form multiple first openings 30-1 in the barrier layer 30, and etch the multiple first light-concentrating structure layers 1' exposed in the multiple first openings 30-1 to form multiple first light-concentrating structures 1.

[0076] For example, the edge effect of deep hole etching can be used to form the first light-concentrating structure 1 into an upwardly convex lens structure.

[0077] For example, the barrier layer 30 of this disclosure includes a plurality of first openings 30-1, which form a plurality of deep holes. A first light-concentrating structure 1 (convex lens structure) is disposed in the deep holes. The first light-concentrating structure 1 makes the light emitted by the corresponding light-emitting chip 20-1 more focused. That is, the first light-concentrating structure 1 can make the emission angle of the light emitted by the light-emitting chip 20-1, which originally had a large emission angle, smaller. This part of the light is concentrated towards the center, preventing the light from being emitted into the adjacent sub-pixel P due to the large emission angle. This effectively prevents the phenomenon of light crosstalk between adjacent sub-pixels P in the display panel 100 and effectively improves the display quality of the display panel 100. Furthermore, the first light-concentrating structure 1 allows most of the light emitted by the corresponding light-emitting chip 20-1 to exit the display panel 100, thereby improving the light emission efficiency of the display panel 100.

[0078] Meanwhile, after the light emitted by the light-emitting chip 20-1 passes through the first light-concentrating structure 1, even if a small portion of the light still has a large emission angle, the barrier 30-2 of the barrier layer 30 can block this portion of the light. This portion of the light is reflected multiple times within the barrier 30-2 before being emitted out of the display panel 100, preventing this portion of the light from being emitted into the adjacent sub-pixel P due to the large emission angle. This effectively prevents light crosstalk between adjacent sub-pixels P in the display panel 100 and effectively improves the display quality of the display panel 100. Furthermore, the multiple deep holes between the barrier 30-2 can achieve collimated light emission, allowing more light to be emitted out of the display panel 100 and improving the light emission efficiency of the display panel 100.

[0079] In some embodiments, as shown in Figures 1, 6, and 7, the plane containing the sidewall 30-11 of at least one of the plurality of first openings 30-1 is within a preset range, and the plane containing the surface of the light-emitting chip layer 20 near the barrier layer 30 is within a preset range.

[0080] For example, the surface of the light-emitting chip layer 20 near the barrier layer 30 can be the surface of the first electrode layer 23'.

[0081] For example, the angle α between the plane containing the sidewalls 30-11 of all the first openings 30-1 and the plane containing the surface of the first electrode layer 23' is within a preset range. That is, in a cross-sectional view of the first opening 30-1 in a direction perpendicular to the display panel 100, the angle α between the left and right sides and the bottom edge of the cross-section is within a preset range.

[0082] In some embodiments, the preset range is 70° to 110°. For example, the angle α between the plane where the sidewall 30-11 of the first opening 30-1 is located and the plane where the surface of the light-emitting chip layer 20 near the barrier layer 30 is located can be 75°, 80°, 85°, 90°, 95°, 100°, 105°, etc.

[0083] For example, as shown in FIG1, the cross-sectional view of the first opening 30-1 in the direction perpendicular to the display panel 100 can be rectangular. In this case, the angle α between the left and right sides and the bottom side of the cross-sectional view is 90°. That is, the angle α between the plane where the sidewall 30-11 of the first opening 30-1 is located and the plane where the surface of the light-emitting chip layer 20 near the barrier layer 30 is located is 90°.

[0084] For example, as shown in FIG6, the cross-sectional view of the first opening 30-1 in the direction perpendicular to the display panel 100 can be trapezoidal. In this case, the angle α between the left and right sides of the cross-section and the bottom side can be 70°, 75°, 80°, or 85°. That is, the angle α between the plane where the sidewall 30-11 of the first opening 30-1 is located and the plane where the surface of the light-emitting chip layer 20 near the barrier layer 30 is located can be 70°, 75°, 80°, or 85°.

[0085] For example, as shown in FIG7, the cross-sectional view of the first opening 30-1 in the direction perpendicular to the display panel 100 can be an inverted trapezoid. In this case, the angle α between the left and right sides of the cross-section and the bottom side can be 95°, 100°, 105°, or 110°. That is, the angle α between the plane where the sidewall 30-11 of the first opening 30-1 is located and the plane where the surface of the light-emitting chip layer 20 near the barrier layer 30 is located can be 95°, 100°, 105°, or 110°.

[0086] For example, the angle α between the plane containing the sidewalls 30-11 of the plurality of first openings 30-1 and the plane containing the surface of the light-emitting chip layer 20 near the barrier layer 30 can be equal; the angle α between the plane containing the sidewalls 30-11 of the plurality of first openings 30-1 and the plane containing the surface of the light-emitting chip layer 20 near the barrier layer 30 can also be unequal, and this disclosure does not limit this.

[0087] For example, when the plane containing the sidewalls 30-11 of the plurality of first openings 30-1 is at an angle α of 70° to 110° with the plane containing the surface of the light-emitting chip layer 20 near the baffle layer 30, the baffle 30-2 is approximately perpendicular to the light-emitting chip layer 20. After the light emitted by the light-emitting chip 20-1 is reflected by the baffle 30-2, most of the light will be emitted outside the display panel 100, and the light emission efficiency of the display panel 100 will be significantly improved.

[0088] When the plane containing the sidewalls 30-11 of the multiple first openings 30-1 is less than 70° with the plane containing the surface of the light-emitting chip layer 20 near the barrier layer 30, the barrier 30-2 is inverted trapezoidal in shape, and the angle α between the sidewalls 30-11 of the barrier 30-2 and the first electrode layer 23' is large. After the light emitted by the light-emitting chip 20-1 is reflected by the barrier 30-2, some of the light will be reflected back to the light-emitting chip 20-1, resulting in low light emission efficiency of the display panel 100.

[0089] When the plane containing the sidewalls 30-11 of the multiple first openings 30-1 is greater than 110° with the plane containing the surface of the light-emitting chip layer 20 near the barrier layer 30, the barrier 30-2 is trapezoidal in shape, and the angle α between the sidewalls 30-11 of the barrier 30-2 and the first electrode layer 23' is large. After the light emitted by the light-emitting chip 20-1 is reflected by the barrier 30-2, the reflection angle of some of the light is still large. This part of the light may still be incident on the adjacent sub-pixel P, thus failing to solve the problem of crosstalk between the sub-pixels P of the display panel 100.

[0090] In some embodiments, as shown in FIG8, the light-emitting chip layer 20 includes a first electrode layer 23', which is close to the barrier layer 30 and is disposed throughout the entire layer; the display panel 100 further includes a heat-conducting layer 40, which is disposed between the first electrode layer 23' and the barrier layer 30. The heat-conducting layer 40 includes a plurality of second openings 40-1, each of the plurality of second openings 40-1 corresponding to one of the plurality of first openings 30-1; the first light-concentrating structure 1 is also disposed in the corresponding second opening 40-1; wherein, the material of the heat-conducting layer 40 includes a first metal material, the material of the barrier layer 30 includes a second metal material, and the thermal conductivity of the first metal material is higher than that of the second metal material.

[0091] For example, as shown in FIG8, the first electrode layer 23' of the light-emitting chip layer 20 can be set as a whole layer.

[0092] For example, as shown in FIG8, the heat-conducting layer 40 of the display panel 100 includes a plurality of second openings 40-1, one second opening 40-1 corresponding to one first opening 30-1; thereby forming a heat-conducting portion 40-2 located between the baffle 30-2 and the first electrode layer 23'.

[0093] For example, as shown in FIG8, the second opening 40-1 is located on the side of the first opening 30-1 near the light-emitting chip layer 20, and the second opening 40-1 and the first opening 30-1 can be combined into a deep hole. A first light-concentrating structure 1 is located both inside the second opening 40-1 and inside the first opening 30-1 corresponding to the second opening 40-1, that is, the first light-concentrating structure 1 completely fills the second opening 40-1, and the first light-concentrating structure 1 is also located on the side of the first opening 30-1 near the second opening 40-1.

[0094] For example, the material of the heat-conducting layer 40 may include a first metallic material, such as copper, aluminum, etc. The material of the barrier layer 30 may include a second metallic material, such as aluminum, nickel, silver, etc.

[0095] For example, the thermal conductivity of the first metal material of the thermally conductive layer 40 is higher than that of the second metal material of the baffle layer 30. The thermally conductive part 40-2 in the thermally conductive layer 40 has better thermal conductivity, which can conduct the heat accumulated on the baffle 30-2 during the preparation of the display panel 100 or during the use of the display panel 100 to the first electrode layer 23', thereby reducing the temperature of the baffle 30-2 and the temperature around the color transfer layer located between the baffles 30-2, and avoiding the failure of the color transfer layer. In addition, the thermally conductive part 40-2 of the thermally conductive layer 40 can serve as a seed layer for the electroformed baffle layer 30. At the same time, the baffle 30-2 is located above the thermally conductive part 40-2, and the thermally conductive part 40-2 can increase the distance from the surface of the baffle 30-2 away from the light-emitting chip layer 20 to the light-emitting chip layer 20, which is equivalent to increasing the height of the baffle 30-2, so that the display panel 100 can achieve the preparation of a higher baffle 30-2, further preventing crosstalk problems, and improving light extraction efficiency.

[0096] In some embodiments, as shown in FIG8, a reflective layer 50 is provided on the portion of the sidewall 30-11 of at least one of the plurality of first openings 30-1 that is not in contact with the first light-concentrating structure 1.

[0097] For example, as shown in FIG8, the sidewall 30-11 of the first opening 30-1 is also the sidewall of the baffle 30-2. A metal material, such as aluminum or silver, can be vapor-deposited onto the portion of the sidewall of the baffle 30-2 that is not in contact with the first light-concentrating structure 1 to form a reflective layer 50. The reflective layer 50 increases the number of reflections of the light emitted by the light-emitting chip 20-1 between the baffles 30-2, effectively increasing the light output of the display panel 100 and preventing crosstalk between the sub-pixels P of the display panel 100.

[0098] For example, the thickness of the reflective layer 50 on the sidewall 30-11 of the retaining wall 30-2 may be less than 80A.

[0099] In some embodiments, as shown in Figures 9 and 10, multiple light-emitting chips 20-1 emit light of the same color; the display panel 100 further includes a color conversion layer 60 and a color filter layer 80. The color conversion layer 60 includes multiple color conversion parts 60-1, one of which is located within one of multiple first openings 30-1 and on the side of the first light-concentrating structure 1 away from the light-emitting chip 20-1. Each of the multiple color conversion parts 60-1 is used to convert the light emitted by the corresponding light-emitting chip 20-1 into light of a set color. The color filter layer 80 is disposed on the side of the color conversion layer 60 away from the light-emitting chip layer 20, and includes multiple filter parts 80-1, each of which corresponds to one of the multiple light-emitting chips 20-1.

[0100] For example, multiple light-emitting chips 20-1 can all be light-emitting chips 20-1 of the same color, emitting light of the same color; for example, multiple light-emitting chips 20-1 can all be blue light-emitting chips, emitting blue light.

[0101] In some embodiments, as shown in Figures 9 and 10, the display panel 100 may further include a color transfer layer 60, which includes a plurality of color transfer sections 60-1. The plurality of color transfer sections 60-1 may include, for example, a red color transfer section, a green color transfer section, and a blue color transfer section. One color transfer section 60-1 fills a first opening 30-1 and is located on the side of the first light-concentrating structure 1 away from the light-emitting chip 20-1 in the first opening 30-1.

[0102] For example, when all the light-emitting chips 20-1 are blue light-emitting chips, the color conversion unit 60-1 (red color conversion unit) converts the blue light emitted by the blue light-emitting chip into red light; the color conversion unit 60-1 (green color conversion unit) converts the blue light emitted by the blue light-emitting chip into green light; the color conversion unit 60-1 (blue color conversion unit) can be made of transparent material, so that the blue light emitted by the blue light-emitting chip can pass through.

[0103] In some embodiments, as shown in Figures 9 and 10, the display panel 100 may further include a color filter layer 80. The color filter layer 80 is located on the side of the color transfer layer 60 away from the light-emitting chip layer 20. The color filter layer 80 includes a plurality of filter portions 80-1. The plurality of filter portions 80-1 may include, for example, a red filter portion, a green filter portion, and a blue filter portion. The red filter portion corresponds to the red color transfer portion (the red filter portion is located above the red color transfer portion), the green filter portion corresponds to the green color transfer portion (the green filter portion is located above the green color transfer portion), and the blue filter portion corresponds to the blue color transfer portion (the blue filter portion is located above the blue color transfer portion). The red filter portion, the green filter portion, and the blue filter portion allow red light, green light, and blue light to pass through, respectively.

[0104] In some embodiments, as shown in Figures 9 and 10, the blue light emitted by the light-emitting chip 20-1 (blue light-emitting chip) is converted into red light and green light respectively after passing through the red color conversion section and the green color conversion section. After passing through the red filter section and the green filter section, the red or green light displayed by the corresponding sub-pixel P is more pure. The blue light emitted by the light-emitting chip 20-1 (blue light-emitting chip) passes through the blue color conversion section and is filtered by the blue filter section, making the blue displayed by the corresponding sub-pixel P more pure. At the same time, a small portion of the blue light that is not converted into red or green light by the color conversion section 60-1 (red color conversion section or green color conversion section) can be filtered out by the corresponding filter section 80-1 on the color filter layer 80, effectively preventing the leakage of blue light and ensuring the purity of the color displayed by each sub-pixel P.

[0105] In some embodiments, as shown in Figures 9 and 10, multiple light-emitting chips 20-1 emit light of the same color; the display panel 100 further includes a color conversion layer 60 and a color filter layer 80. The color conversion layer 60 fills multiple first openings 30-1 in the barrier layer 30 and is located on the side of the first light-concentrating structure 1 away from the light-emitting chips 20-1. The color conversion layer 60 is used to convert the light emitted by the multiple light-emitting chips 20-1 into white light. The color filter layer 80 is disposed on the side of the color conversion layer 60 away from the light-emitting chip layer 20. The color filter layer 80 includes multiple filter portions 80-1, and each filter portion 80-1 corresponds to one of the multiple light-emitting chips 20-1.

[0106] For example, the multiple light-emitting chips 20-1 can all be light-emitting chips 20-1 of the same color, emitting light of the same color. For instance, the multiple light-emitting chips 20-1 can all be blue light-emitting chips, emitting blue light.

[0107] In some embodiments, as shown in Figures 9 and 10, the display panel 100 may further include a color conversion layer 60, which includes a plurality of color conversion sections 60-1. For example, a white color conversion section 60-1 can be a white color conversion section. One color conversion section 60-1 (white color conversion section) fills a first opening 30-1 and is located on the side of the first light-concentrating structure 1 away from the light-emitting chip 20-1 in the first opening 30-1. The color conversion section 60-1 (white color conversion section) converts the blue light emitted by the plurality of blue light-emitting chips into white light.

[0108] For example, the blue light emitted by each blue light-emitting chip has a different wavelength. After passing through the color conversion section 60-1 of other colors, such as the red color conversion section or the green color conversion section, the conversion efficiency of blue light into red light or green light varies greatly, which will result in a large difference in the final color brightness displayed by the display panel 100.

[0109] In this scheme, the color conversion unit 60-1 is a white color conversion unit. After blue light of different wavelengths passes through this white color conversion unit, the conversion efficiency difference between blue light and white light is small, which reduces the sensitivity of the color conversion unit 60-1 of the color conversion layer 60 to, for example, the wavelength of blue light. This effectively reduces the final color brightness difference displayed by the display panel 100. At the same time, after converting blue light into white light, the white light of one sub-pixel P can be incident on the area of ​​the adjacent sub-pixel P, and there will be no crosstalk problem between different colors of light.

[0110] In some embodiments, as shown in Figures 9 and 10, the display panel 100 may further include a color filter layer 80. The color filter layer 80 is located on the side of the color transfer layer 60 away from the light-emitting chip layer 20. The color filter layer 80 includes a plurality of filter portions 80-1. The plurality of filter portions 80-1 may include, for example, a red filter portion, a green filter portion, and a blue filter portion. The red filter portion, the green filter portion, and the blue filter portion allow red light, green light, and blue light to pass through, respectively.

[0111] In some embodiments, as shown in Figures 9 and 10, each filter section 80-1 corresponds to a light-emitting chip 20-1. The blue light emitted by the light-emitting chip 20-1 (blue light-emitting chip) is converted into white light by the color conversion section 60-1 (white color conversion section). After the white light passes through multiple filter sections 80-1 (red filter section, green filter section, and blue filter section) of the color filter layer 80, the red filter section, green filter section, and blue filter section allow the red light, green light, and blue light to pass through, respectively, thereby realizing the full-color display of the display panel 100. At the same time, a small portion of the blue light that is not converted into white light by the color conversion section 60-1 (white color conversion section) can be filtered out by the filter section 80-1 of the color filter layer 80, ensuring the purity of the displayed color of each sub-pixel P.

[0112] In some embodiments, as shown in FIG9 and FIG10, the color filter layer 80 further includes a partition portion 80-2 disposed at the intervals of the plurality of filter portions 80-1.

[0113] For example, as shown in Figures 9 and 10, one filter section 80-1 is provided for one light-emitting chip 20-1. A partition section 80-2 can be provided between two adjacent filter sections 80-1, that is, the orthogonal projection of the partition section 80-2 on the light-emitting chip layer 20 is located between two adjacent light-emitting chips 20-1.

[0114] For example, the blocking portion 80-2 can be a black matrix, which can be used for light blocking. When the light emitted by the light-emitting chips 20-1 of two adjacent sub-pixels P is emitted to the corresponding filter portion 80-1, some of the light has a large emission angle. The light emitted by the light-emitting chip 20-1 of one sub-pixel P will be emitted to the filter portion 80-1 corresponding to the light-emitting chip 20-1 of the other sub-pixel P. At this time, color mixing will occur between the two adjacent sub-pixels P. The blocking portion 80-2 blocks the light emitted by one of the sub-pixels P at a large emission angle when it is emitted to the corresponding filter portion 80-1, effectively avoiding the color mixing problem, and at the same time improving the contrast of red, blue, and green.

[0115] In some embodiments, as shown in Figures 11 and 12, the display panel 100 further includes a light-concentrating layer 90, which is disposed on the side of the color filter layer 80 away from the light-emitting chip layer 20. The light-concentrating layer 90 includes a plurality of second light-concentrating structures 2, each of the plurality of second light-concentrating structures 2 corresponding to one of the plurality of light-emitting chips 20-1.

[0116] For example, as shown in Figures 11 and 12, an inorganic planarization layer can be formed on the side of the color filter layer 80 away from the light-emitting chip layer 20. The inorganic planarization layer can be made of an inorganic material, for example. A light-concentrating layer 90 is disposed on the inorganic planarization layer. The light-concentrating layer 90 can be made of an organic material, for example.

[0117] In some embodiments, as shown in Figures 11 and 12, the second focusing structure 2 includes a convex lens. The second focusing structure 2 can be formed into a convex lens shape through exposure and post-baking, and the ratio of the diameter to the height of the convex lens can be 2:1 to 4:1.

[0118] For example, the second light-concentrating structure 2 can improve the light-emitting efficiency of the corresponding sub-pixel P, thereby improving the light-emitting efficiency of the display panel 100.

[0119] In some embodiments, as shown in Figures 9, 10, 11, and 12, the display panel 100 further includes a protective layer 70 disposed between the color conversion layer 60 and the color filter layer 80.

[0120] For example, as shown in Figures 9, 10, 11, and 12, a color transfer part 60-1 is filled in the first opening 30-1. The color transfer part 60-1 can be prepared by printing. A protective layer 70 can be provided above the color transfer part 60-1 to encapsulate the color transfer part 60-1. The protective layer 70 is used to protect the color transfer part 60-1. The material of the protective layer 70 can be, for example, silicon nitride (SiN) or a composite material of silicon nitride (SiN) and silicon oxide (SiO).

[0121] In some embodiments, the drive backplane 10 includes a substrate 11, the substrate 11 being made of silicon.

[0122] For example, each film layer of the display panel 100 can be fabricated on the silicon substrate 11.

[0123] For example, the PPI of the display panel 100 can be greater than 3000 PPI, and it can be a display panel 100 with ultra-high PPI and ultra-high brightness.

[0124] On the other hand, as shown in FIG13, a display device 1000 is provided, including the display panel 100 and the driving chip 200 described above, wherein the driving chip 200 is connected to the display panel 100.

[0125] By way of example, display device 1000 can be any device that displays either moving (e.g., video) or stationary (e.g., still image), and whether it is text or image. Display device 1000 includes, but is not limited to, televisions, mobile phones, wearable devices, personal digital assistants (PDAs), augmented reality (AR) devices, virtual reality (VR) devices, handheld or portable computers, GPS receivers / navigators, cameras, MP4 video players, camcorders, game consoles, clocks, calculators, television monitors, flat panel displays, computer monitors, in-vehicle displays (e.g., odometer displays, etc.), navigators, cockpit controllers and / or displays, displays of camera views (e.g., displays of rearview cameras in vehicles), electronic photographs, electronic billboards or signs, projectors, architectural structures, packaging and aesthetic structures (e.g., displays of images of a piece of jewelry), etc.

[0126] For example, as shown in FIG13, the display device 1000 includes a display panel 100 and at least one driver chip 200 (Integrated Circuit, IC); the display panel 100 is coupled to the driver chip 200, and the driver chip 200 is configured to provide electrical signals to the display panel 100, such as control signals.

[0127] For example, the driver chip 200 can be a central processing unit, a digital signal processor, a microcontroller, a programmable logic controller, etc. For instance, the driver chip 200 may also include a memory, a power supply module, etc., and implement power supply and signal input / output functions through separately provided wires, signal lines, etc. For instance, the driver chip 200 may also include hardware circuitry and computer-executable code. The hardware circuitry may include conventional very-large-scale integrated circuits (VLSI) or gate arrays, as well as existing semiconductors or other discrete components such as logic chips and transistors; the hardware circuitry may also include field-programmable gate arrays, programmable array logic, programmable logic devices, etc.

[0128] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0129] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A display panel, comprising: Drive backplane; A light-emitting chip layer is disposed on one side of the driving backplate, and the light-emitting chip layer includes a plurality of light-emitting chips; A barrier layer is disposed on the side of the light-emitting chip layer away from the driving backplate. The barrier layer includes a plurality of first openings, each of which exposes one of the plurality of light-emitting chips. A first light-concentrating structure is disposed within each of the plurality of first openings.

2. The display panel according to claim 1, wherein, The angle between the plane containing the sidewall of at least one of the plurality of first openings and the plane containing the surface of the light-emitting chip layer near the barrier layer is within a preset range.

3. The display panel according to claim 2, wherein, The preset range is 70° to 110°.

4. The display panel according to any one of claims 1 to 3, wherein, The first focusing structure includes a convex lens.

5. The display panel according to any one of claims 1 to 4, wherein, The light-emitting chip layer includes a first electrode layer, which is close to the barrier layer and is disposed throughout the entire layer. The display panel also includes: A thermally conductive layer is disposed between the first electrode layer and the baffle layer. The thermally conductive layer includes a plurality of second openings, each of which corresponds to one of the plurality of first openings. The first light-concentrating structure is also disposed within the corresponding second opening. The thermally conductive layer is made of a first metal material, and the barrier layer is made of a second metal material. The thermal conductivity of the first metal material is higher than that of the second metal material.

6. The display panel according to any one of claims 1 to 5, wherein, A reflective layer is provided on the sidewall of at least one of the plurality of first openings, in the portion of which is not in contact with the first light-concentrating structure.

7. The display panel according to any one of claims 1 to 6, wherein, The multiple light-emitting chips emit light of the same color; The display panel also includes: A color-converting layer is provided, which fills the plurality of first openings in the barrier layer and is located on the side of the first light-concentrating structure away from the light-emitting chip; the color-converting layer is used to convert the light emitted by the plurality of light-emitting chips into white light. A color filter layer is disposed on the side of the color conversion layer away from the light-emitting chip layer. The color filter layer includes a plurality of filter portions, each of which corresponds to one of the plurality of light-emitting chips.

8. The display panel according to any one of claims 1 to 6, wherein, The multiple light-emitting chips emit light of the same color; The display panel also includes: A color conversion layer, comprising a plurality of color conversion sections, wherein one of the plurality of color conversion sections is located within one of the plurality of first openings and is located on the side of the first light-concentrating structure away from the light-emitting chip; each of the plurality of color conversion sections is used to convert the light emitted by the corresponding light-emitting chip into light of a set color; A color filter layer is disposed on the side of the color conversion layer away from the light-emitting chip layer. The color filter layer includes a plurality of filter portions, each of which corresponds to one of the plurality of light-emitting chips.

9. The display panel according to claim 7 or 8, wherein, The color filter layer also includes partitions disposed at the intervals between the plurality of filter portions.

10. The display panel according to any one of claims 7 to 9, wherein, Also includes: A light-concentrating layer is disposed on the side of the color filter layer away from the light-emitting chip layer. The light-concentrating layer includes a plurality of second light-concentrating structures, each of which corresponds to one of the plurality of light-emitting chips.

11. The display panel according to claim 10, wherein, The second focusing structure includes a convex lens.

12. The display panel according to any one of claims 7 to 11, wherein, Also includes: A protective layer is disposed between the color conversion layer and the color filter layer.

13. The display panel according to any one of claims 1 to 12, wherein, The drive backplane includes a substrate, the substrate being made of silicon.

14. A display device, comprising: The display panel according to any one of claims 1 to 13; The driver chip is connected to the display panel.

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