A heat lift assembly employing flow tube circuits for the controlled keeping or conveyance of bulk fluids

The heat lift assembly with a tubular framework and spring forces maintains consistent bulk fluid properties and reduces heat leakage, addressing inefficiencies in conventional systems for cryogenic fluid conveyance.

WO2026147564A1PCT designated stage Publication Date: 2026-07-09

Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Filing Date
2025-09-05
Publication Date
2026-07-09

AI Technical Summary

Technical Problem

Conventional fluid-mechanical heat transfer systems have limited ability to keep or convey cryogenic fluids without fluid loss or loss of control of the thermodynamic state, leading to inefficiencies and potential heat leakage.

Method used

A heat lift assembly with a tubular framework comprising upper and lower linear manifold flow tubes and flow tube circuits, utilizing spring forces for structural support and fluid communication, which maintains bulk fluids with consistent thermophysical properties and reduces heat leakage.

Benefits of technology

The assembly provides consistent bulk fluid properties, reduces heat leakage, and enhances heat transfer efficiency, ensuring reliable conveyance and thermal management of cryogenic fluids.

✦ Generated by Eureka AI based on patent content.

Smart Images

  • Figure US2025045192_09072026_PF_FP_ABST
    Figure US2025045192_09072026_PF_FP_ABST
Patent Text Reader

Abstract

Provided is a heat lift assembly that includes a tubular framework, the tubular framework including an upper linear manifold flow tube, a lower linear manifold flow tube and flow tube circuits. In at least one aspect, each flow tube circuit connected to the upper linear manifold flow tube and to the lower linear manifold flow tube, wherein hollow interior spaces of the upper linear manifold flow tube, the lower linear manifold flow tube and the flow tube circuits are in fluid communication with each other, and a spring force is present between the upper linear manifold flow tube, the lower linear manifold flow tube and the flow tube circuits.
Need to check novelty before this filing date? Find Prior Art