Optoelectronic assembly, display device and method for producing an optoelectronic device

Abstract

The invention relates to an optoelectronic assembly (10) comprising a carrier substrate (100) and at least one component (105) arranged on the carrier substrate (100). The component has a light-emitting element (106) and a converter element (110). The light-emitting element (106) is designed to emit electromagnetic radiation during operation, and the converter element (110) is designed to convert a wavelength of the emitted electromagnetic radiation. The optoelectronic assembly (10) also comprises a dye element (115) which is arranged in a position adjacent to the component (105) and is arranged above a surface of the carrier substrate (100).

Description

[0001] 2024PF01060 1

[0002] OPTOELECTRONIC ARRANGEMENT, DISPLAY DEVICE AND METHOD FOR MANUFACTURING AN OPTOELECTRONIC DEVICE

[0003] DESCRIPTION

[0004] Display devices using micro-LEDs (p-LEDs) are employed in numerous applications. There is a general search for ways to improve such display devices.

[0005] The present invention is based on the objective of providing an improved optoelectronic arrangement and an improved method for manufacturing an optoelectronic arrangement.

[0006] According to the implementation forms, the problem is solved by the subject matter of the independent patent claims.

[0007] An optoelectronic arrangement comprises a support substrate and at least one component mounted on the support substrate. The component includes a light-emitting element and a converter element. The light-emitting element is configured to emit electromagnetic radiation during operation, and the converter element is configured to convert a wavelength of the emitted electromagnetic radiation. The optoelectronic arrangement further includes a dye element located at a position adjacent to the component and positioned over a surface of the support substrate.

[0008] For example, in the non-operated state, the converter element has a body color, and the dye element has a color that is a complementary color to the body color of the converter element. 2024PF01060 2

[0009] For example, the shortest distance between the component and the dye element is less than 10 mm.

[0010] According to the implementation forms, the following relationship applies to an area ratio F of the area of ​​the converter element to the area of ​​the dye element:

[0011] 0.75 < F < 1.25.

[0012] According to the design specifications, the optoelectronic arrangement also has a protective layer over the component.

[0013] For example, the dye element is positioned between the carrier substrate and the protective layer.

[0014] According to further embodiments, the dye element is arranged on a side of the protective layer facing away from the component.

[0015] According to other implementation methods, the component is integrated into the protective layer.

[0016] For example, the optoelectronic arrangement further includes conductor tracks for controlling the light-emitting element, with the conductor tracks being arranged on one side of the substrate.

[0017] According to the design specifications, the dye element is arranged above the conductor tracks.

[0018] According to the implementation forms, the optoelectronic arrangement has a large number of components and a large number of coloring-2024PF01060 3

[0019] material elements, with the dye elements arranged between adjacent building elements.

[0020] For example, the dye element can be arranged exclusively over non-light-emitting areas.

[0021] Other implementation forms relate to a display device that has the optoelectronic arrangement as described above.

[0022] A method for fabricating an optoelectronic arrangement comprises mounting at least one component on a support substrate, wherein the component includes a light-emitting element and a converter element, the light-emitting element being configured to emit electromagnetic radiation during operation, and the converter element being configured to convert a wavelength of the emitted electromagnetic radiation. The method further comprises mounting a dye element at a position adjacent to the component and over one side of the support substrate.

[0023] For example, the dye element is arranged by masked application on the carrier substrate.

[0024] For example, the dye element is applied by ink jetting, screen printing, slot die coating, molding, spin coating, spraying, or as a film.

[0025] The accompanying drawings serve to illustrate exemplary embodiments of the invention. The drawings depict these embodiments and, together with the description, serve to explain them. Further exemplary embodiments and many of the intended advantages will become apparent directly from 2024PF01060 4

[0026] The following detailed description applies. The elements and structures shown in the drawings are not necessarily drawn to scale. Identical reference symbols refer to identical or corresponding elements and structures.

[0027] Fig. 1A shows a schematic cross-sectional view of an optoelectronic arrangement according to implementation forms .

[0028] Fig. 1B shows a vertical cross-sectional view of an optoelectronic arrangement according to further embodiments.

[0029] Fig. IC shows a vertical cross-sectional view of an optoelectronic arrangement according to implementation forms.

[0030] Figures 2A to 2D show vertical cross-sectional views of an optoelectronic arrangement according to further embodiments.

[0031] Figures 3A to 3D show top views of an optoelectronic arrangement according to further embodiments.

[0032] Figures 4A and 4B show top views of optoelectronic arrangements according to further embodiments.

[0033] Fig. 5 shows an example of a display device which has the optoelectronic arrangement according to the embodiments.

[0034] Fig. 6 summarizes a method according to implementation forms.

[0035] The following detailed description refers to the accompanying drawings, which form part of the disclosure and in which specific embodiments are shown for illustrative purposes. In this context, a 2024PF01060 5

[0036] Directional terminology such as "top", "bottom", "front", "back", "over", "on", "in front", "behind", "front", "back", etc., refers to the orientation of the figures just described. Since the components of the exemplary embodiments can be positioned in different orientations, the directional terminology serves only for explanation and is in no way restrictive.

[0037] The description of the embodiments is not restrictive, as other embodiments exist and structural or logical modifications can be made without deviating from the scope defined by the claims. In particular, elements of the embodiments described below can be combined with elements of other described embodiments, unless otherwise indicated by the context.

[0038] The terms "lateral" and "horizontal," as used in this description, are intended to describe an orientation or alignment that is essentially parallel to a first surface of a substrate or semiconductor body. This could be, for example, the surface of a wafer or a chip (die).

[0039] The horizontal direction can, for example, lie in a plane perpendicular to a growth direction when layers are growing.

[0040] The term "vertical," as used in this description, is intended to describe an orientation that is essentially perpendicular to the first surface of a substrate or semiconductor body. The vertical direction may, for example, correspond to a growth direction in the growth of layers. 2024PF01060 6

[0041] Fig. 1A shows a vertical cross-sectional view of an optoelectronic arrangement 10 according to embodiments. The optoelectronic arrangement 10 comprises a support substrate 100 and at least one component 105 arranged on the support substrate. The component 105 has a light-emitting element 106 and a converter element 110. The light-emitting element 106 is configured to emit electromagnetic radiation during operation. The converter element 110 is configured to convert a wavelength of the emitted electromagnetic radiation. The optoelectronic arrangement further comprises a dye element 115, which is arranged at a position adjacent to the component 105 and is positioned over a surface of the support substrate 100.The term “dye element” used in the context of this disclosure refers to an element that has a dye and is not arranged above a light-emitting element 106. For example, the dye element 115 may be arranged exclusively above non-light-emitting regions. The term “non-light-emitting”

[0042] In this context, "area" is meant to describe an area that is not set up to emit electromagnetic radiation when a voltage is applied.

[0043] The carrier substrate 100 can be made of a translucent material and may include, for example, PET (polyethylene terephthalate), high-density polyethylene (HDPE), polypropylene (PP), polyimide (PI), or another engineering plastic such as cyclo-olefin polymer or polyamide.

[0044] The light-emitting element 106 can, for example, comprise an LED (light-emitting diode). The light-emitting diode can, for example, be semiconductor-based or organic.

[0045] Semiconductor materials are included. For example, the light-emitting element 106 can also be implemented as an array of electrically pumped quantum dots. According to further embodiments, the light-emitting element 105 can also be implemented in any other arbitrary way.

[0046] For example, the components 105 can be mini-LEDs, such as sapphire flip-chip LEDs. The edge length of the light-emitting surface of the components 105 can range from more than 50 pm to less than 300 pm. For example, the size of the components 105 with mini-LEDs can be greater than 75 pm and less than 150 pm. According to other embodiments, the components 105 can also be p-LEDs, for example, as substrateless LEDs. The edge length of the light-emitting surface of the components 105 with p-LEDs can be greater than 10 pm or greater than 40 pm. The edge length of the light-emitting surface of the components 105, and thus of the light-emitting elements 106, can be less than 100 pm, for example, less than 80 pm. The individual components 105 can be square or rectangular. However, other geometries of the light emission surface are also possible, for example triangular or hexagonal.For example, the vertical height s of p-LEDs or components 105 can range from 10 to 200 pm, for instance, when implemented as sapphire flip-chip LEDs. If the components 105 are implemented without a substrate, the vertical height s can be less than 10 pm, for example, greater than 1 pm.

[0047] The converter element 110 can be implemented in any way. For example, the converter element 110 can comprise organic, inorganic, or semiconductor materials and be suitable for converting a wavelength of the electromagnetic radiation emitted by the light-emitting elements 106 to 2024PF01060 8

[0048] Convert. According to further examples, the converter element 110 can additionally contain particles for light scattering or dye particles. According to further examples, the converter element 110 can additionally contain fillers to improve thermal conductivity.

[0049] The dye element 115, for example, can contain an organic or inorganic dye. For example, the following organic dyes and luminescent dyes are suitable: acridine dyes, acridinone dyes, anthrachino dyes, anthracene dyes, cyanine dyes, dansyl dyes, squaryllium dyes, spiropyrans, boron dipyrromethenes (BODIPY), perylenes, pyrenes, naphthalenes, flavins, pyrroles, porphyrins and their metal complexes, diarylmethane dyes, triarylmethane dyes, nitro and nitroso dyes, phthalocyanine dyes and the metal complexes of phthalocyanines, quinones, azo dyes, indophenol dyes, oxazines, oxazones, thiazines and thiazoles, xanthenes, fluorenes, fluorones, pyronines, rhodamines, coumarins. General inorganic pigments can be used as inorganic dyes, for example transition metal or rare earth oxides, sulfides or cyanides.According to further examples, the dye element may also contain fillers or additives to improve thermal conductivity or elasticity to improve surface properties (tackiness).

[0050] For example, the following relationship can apply to an area ratio F of the area of ​​the converter element 110 to the area of ​​the dye element 115: 0.75 < F < 1.25. Accordingly, the area coverage of the dye element 115 is of a similar order of magnitude to the area coverage of the converter element 110. In general, the area ratio can be less than 10 and greater than 0.1. If several dye elements 115 border a converter element 110 or a component 105, then...

[0051] The above relationship can apply to each individual dye element 115, that is, the relationship applies to the area of ​​each dye element 115. According to further embodiments, however, this relationship can also apply to the added area of ​​all directly adjacent dye elements. In an optoelectronic arrangement 10 with a plurality of converter elements 110 or components 105 and a plurality of dye elements 115, the relationship applies to the added areas of each converter element 110 or dye element 115.

[0052] Similar to component 105, dye element 115 can be square or rectangular. Other geometries are also possible according to further specifications, for example, round or oval, triangular, hexagonal, or any other shape. For example, the shape of dye element 115 can correspond to the shape of the light-emitting surface of converter 110.

[0053] The converter element 110 can have a body color when the component 105 is not in operation. Furthermore, the dye element 115 can have a color that differs from the body color of the adjacent converter element 110. For example, the dye element 115 can have a color that is the complementary color to the body color of the converter element 110. For instance, if the converter element 110 has a yellow body color when not in operation, the dye element 115 will have a blue color.

[0054] The dimensions of component 105 and dye element 115 are sufficiently small that the human eye can no longer distinguish the individual elements. The mixture of the reflected ambient light from the optoelectronic arrangement 10 in the switched-off state results, due to the additive 2024PF01060 10

[0055] In color mixing, a white impression is produced by combining the light reflected by the component 105 and the dye element 115. For example, by combining the dye element 115 with the complementary color of the body color of the converter element 110, a white or colored color impression of areas of the optoelectronic arrangement 10 in the non-operated state can be generated.

[0056] According to further embodiments, it is possible that the color of the dye element 115 does not correspond to the complementary color of the body color of the converter element 110. In this case, the optoelectronic arrangement 10 may appear to have a color that differs from white or the body color of the converter element 110. For example, a combination of a red body color of the converter element 110 in the non-operated state of the component 105 and a blue dye element may result in a pink color impression. Thus, according to customer requirements or specific applications, any desired color impression can be generated by appropriately selecting the color of the dye element 115.

[0057] For example, the dye elements 115 can be arranged in a regular pattern with the building elements 110 on the support substrate 100.

[0058] For example, the shortest distance w between component 105 and dye component 115 can be less than 10 mm or even less than 2 mm. According to further embodiments, the shortest distance can correspond to the minimum distance that the human eye can resolve. As shown in Fig.

[0059] As shown in Fig. 1A, the height d of the dye element 115, measured in the vertical direction, can be less than the height s of the component 105, where the height s is also measured in the vertical direction. As shown in Fig. 1A2024PF01060 11

[0060] For example, the component 105 and the dye component 115 can be arranged over a first main surface 101 of the support substrate 100.

[0061] For example, the transparency of dye element 115 can be similar to the transparency of component 105. The term "transparency" refers to the proportion of ambient light that is transmitted through dye element 115 or component 105. For example, the transparency of dye element 115 can be a maximum of 50% or a minimum of 50%.

[0062] The optoelectronic arrangement 10 can further comprise conductive traces 109, for example a first conductive trace 107 and a second conductive trace 108. The component 105 or the light-emitting element 106 can be operated, i.e., switched on and off, via the conductive traces 109. For example, the conductive traces 109 can contain copper or be made of copper.

[0063] According to embodiments shown in Fig. 1B, the height d of the dye element 115 can also be greater than the height of the component 105 with converter element 110. Further elements of the optoelectronic arrangement 10 are described as with reference to Fig. 1A.

[0064] Fig. IC shows an optoelectronic arrangement 10 with a plurality of components 105 and dye elements 115. For example, the dye element 115 can be arranged adjacent to side faces of the component 105. For example, along a first direction, for example the x-direction, the dye element 115 can be arranged on both sides of the component 105. In an optoelectronic arrangement with a plurality of components 105, it is possible-2024PF01060 12

[0065] It was shown that some of the components 105 have a light-emitting element 106 but not a converter element. According to further examples, different components 105 can also have different converter elements 110. Furthermore, it is possible that some of the components 105 have dye / titanium dioxide elements on the top surface of the component 105, for example, above the converter element 110.

[0066] For example, the height d can be of a similar order of magnitude to the size s of the component with converter element 110. For example, the ratio of d / s can be greater than 0.1 and less than 10. For example, the following relationship can hold: 0.75 < d / s < 1.25.

[0067] As shown in Figures 2A to 2D, the optoelectronic arrangement can further comprise a protective layer 113 over the component 105. For example, the protective layer 113 can embed the individual components 105. The material of the protective layer 113 can also include PET or another engineering plastic, such as cyclo-olefin polymer or polyamide.

[0068] For example, according to all embodiments, the protective layer 113 can be bonded to the substrate 100 via an adhesive layer. For example, the adhesive layer can encapsulate the components 105. The adhesive layer can be based on, for example, silicone, epoxy resin, or acrylic adhesive. As a result, the individual components 105 are embedded and sealed by the adhesive layer and the protective layer 113.

[0069] For example, according to all embodiments, a surface of the converter element 110 is not exposed, but is covered by the translucent material of the protective layer 113. 2024PF01060 13

[0070] and sealed. The protective layer 113 can be implemented as a flexible film and have a layer thickness of less than 200 pm or less than 150 pm or less than 100 pm.

[0071] Overall, the combination of substrate and components is flexible. For example, the combination of substrate 100, component 105, and protective layer 113 can have a layer thickness of less than 500 pm or less than 300 pm. When using very thin films, the total thickness of the combination can be less than 150 pm. However, the total thickness of the combination of substrate 100, component 105, and protective layer 113 can also be greater and amount to several millimeters.

[0072] As shown in Fig. 2A, for example, the dye element 115j can be arranged adjacent to a second main surface 102 of the support substrate 100. The dye element 115 is thus arranged on a side of the support substrate 100 facing away from the component 105. This arrangement can also be realized if the optoelectronic arrangement 10 does not have a protective layer 113.

[0073] According to embodiments shown in Fig. 2B, the protective layer 113 can also be arranged over the components 105, so that an air gap 116 exists between the first main surface 101 and the protective layer 113. For example, in this case, the components 105 are not embedded in the protective layer 113. According to further embodiments, a suitable adhesive 114 can also be arranged between the first main surface 101 and the protective layer 113.

[0074] According to embodiments shown in Fig. 2C, both components 105 and dye components 115 can be arranged over a first main surface 101 of the support substrate.

[0075] Furthermore, a protective layer 113 can be arranged over the first main surface 101 of the substrate 100. For example, both components 105 and dye elements 115 or an adhesive 114 can be embedded in the protective layer 113.

[0076] According to further embodiments, shown in Fig. 2D, the dye element 115 can also be arranged on a side of the protective layer 113 facing away from the support substrate 100. For example, the components 105 can be embedded in or covered by the protective layer 113. According to further embodiments, the components 105 can be embedded in an adhesive layer 114. Furthermore, the dye elements 115 are arranged on a surface of the protective layer 113 facing away from the support substrate 100.

[0077] Fig. 3A shows a top view of an optoelectronic arrangement 10 according to various embodiments. For example, the dye elements 115 can each be adjacent to the component 105 along a first direction, for example the x-direction. Furthermore, Fig. 3A shows conductive traces 109, for example a first and a second conductive trace 107, 108, as shown in Fig. 1A. The dye elements 115 can each be arranged above the conductive traces 109. According to further embodiments, the dye elements 115 can be arranged next to the conductive traces 109.

[0078] According to further embodiments shown in Fig. 3B, the colorant elements 115 can also abut the component 105 along the y-direction. According to still further embodiments, the colorant elements 115 can also abut the component 105 exclusively along the y-direction. 2024PF01060 15

[0079] Fig. 3C shows an arrangement in which the dye elements 115 are adjacent to the component 105 along both the x-direction and the y-direction. In contrast to the embodiments shown in Fig. 3B, the area of ​​the dye element 115 is smaller compared to the area of ​​the component 105 or the converter element 110. Furthermore, the distance between the dye element 115 and the converter element 110 is reduced and can, for example, be less than 1 mm.

[0080] Fig. 3D shows another optoelectronic arrangement 10 in which several components 105 are arranged along both the x- and y-directions. For example, in the optoelectronic arrangement 10 shown in Fig. 3D, two components 105 can be arranged adjacent to each other along the y-direction. Furthermore, the arrangement is surrounded along the x- and y-directions by dye elements 115. The dye elements 115 border, for example, the arrangement of components 105 along the x- and y-directions.

[0081] Fig. 4A shows another optoelectronic arrangement 10 in which components 105 and dye elements 115 are arranged alternately. For example, a plurality of components 105 are arranged along a first direction and are separated from each other by dye elements 115. Furthermore, additional components 105 are arranged along the y-direction and separated from each other in the same way by dye elements 115.

[0082] Fig. 4B shows a top view of an optoelectronic arrangement 10 comprising a plurality of optoelectronic arrangements described with reference to Fig. 4A. 2024PF01060 16

[0083] Fig. 5 shows an example of a display device comprising the described optoelectronic arrangement 10. For example, any representations or symbols can be displayed by the display device. Due to the special design described with reference to Fig. 1A, the display device 15 appears, for example, white or in any other color when not in operation.

[0084] Fig. 6 summarizes a method according to embodiments. According to embodiments, a method for manufacturing an optoelectronic arrangement comprises arranging (S100) at least one component on a support substrate, wherein the component has a light-emitting element and a converter element, the light-emitting element being configured to emit electromagnetic radiation during operation, and the converter element being configured to convert a wavelength of the emitted electromagnetic radiation. The method further comprises arranging (S110) a dye element at a position adjacent to the component and over one side of the support substrate. According to embodiments, the method steps can also be carried out in reverse order. More precisely, in step S100, at least one dye element can be arranged on a support substrate.Then, in step S110, at least one component is positioned above one side of the support substrate at a position adjacent to the component. The component comprises a light-emitting element and a converter element. The light-emitting element is configured to emit electromagnetic radiation during operation, and the converter element is configured to convert one wavelength of the emitted electromagnetic radiation. 2024PF01060 17.

[0085] The dye can be applied to the substrate with or without a matrix material. For example, the dye can be contained in a matrix made of silicone, epoxy, polyolefins (such as high-density or low-density polyethylene (PE) or polypropylene (PP)), polyvinyl chloride (PVC), polystyrene (PS), polyester, polycarbonate (PC), polyethylene terephthalate (PET), polyethersulfone (PES), polyethylene naphthalate (PEN), polymethyl methacrylate (PMMA), polyimide (PI), polyetherketone (PEEK), polyamides (such as polyphthalamides (PPA) or polycyclohexylenedimethyl terephthalate (PCT)). The matrix material can be liquefied by increasing the temperature during the process. According to further embodiments, a liquid matrix material can also be used, which is cured after dispensing by temperature or exposure to light. The matrix material can also be liquefied by dilution with a volatile solvent.The matrix containing the dye can be applied to the carrier substrate 100, for example, by dispensing or spraying.

[0086] For example, a dye-matrix mixture can be dispensed onto the entire workpiece or only onto parts of it. These areas can be prevented from spreading further, for example, by means of stop edges. According to further embodiments, a mask can also be used. For example, the dye elements 115 and the components 105 can be laterally separated from each other by transparent polymer materials.

[0087] For example, the dye can be administered in a volatile solvent (spin coating or spraying), which leaves behind the matrix-free dye after evaporation. Optionally, the remaining dye can then be fixed with a matrix. According to further formulations, the 2024PF01060 18

[0088] The dye can also be vapor-deposited onto the substrate using a vacuum process.

[0089] In general, the color layer can be applied by ink jetting, screen printing, slot die coating, molding, spin coating, spraying, or as a film.

[0090] By placing the dye element 115 next to the component, the dye is irradiated with very little light during operation. Only scattered light, which is reflected back from interfaces (e.g., laminate to air), reaches the dye element. As a result, materials that would degrade rapidly above the converter element 110, such as organic dyes, can also be used as the dye element 115. Compared to conventional methods, in which, for example, TiO2 or other white-appearing materials are applied above the converter element 110, this results in increased overall efficiency and reduced manufacturing complexity of the optoelectronic arrangement.

[0091] Although specific embodiments have been illustrated and described herein, those skilled in the art will recognize that the specific embodiments shown and described can be replaced by a multitude of alternative and / or equivalent embodiments without departing from the scope of protection of the invention. The application is intended to cover any adaptations or variations of the specific embodiments discussed herein. Therefore, the invention is limited only by the claims and their equivalents. 2024PF01060 19

[0092] REFERENCE MARK LIST

[0093] 10 optoelectronic arrangement

[0094] 15 Display device

[0095] 100 carrier substrate

[0096] 101 first main surface

[0097] 102 second main surface

[0098] 105 building elements

[0099] 106 light-emitting element

[0100] 107 first conductor track

[0101] 108 second conductor track

[0102] 109 conductor tracks

[0103] 110 converter element

[0104] 111 First main surface of the protective layer 112 Second main surface of the protective layer 113 Protective layer

[0105] 114 Adhesive

[0106] 115 dye element

[0107] 116 air gap

Claims

2024PF01060 20 REQUIREMENTS 1. Optoelectronic arrangement ( 10 ) with : a carrier substrate ( 100 ) ; at least one component (105) arranged on the support substrate (100), wherein the component comprises a light-emitting element (106) and a converter element (110), the light-emitting element (106) being configured to emit electromagnetic radiation during operation, and the converter element (110) being configured to convert a wavelength of the emitted electromagnetic radiation, and a dye element (115) being arranged at a position adjacent to the component (105) and positioned over a surface of the support substrate (100).

2. Optoelectronic arrangement (10) according to claim 1, wherein in the non-operated state the converter element (110) has a body color and the dye element (115) has a color that corresponds to a complementary color of the body color of the converter element.

3. Optoelectronic arrangement (10) according to claim 1 or 2, wherein a shortest distance between the component (105) and the dye element (115) is less than 10 mm.

4. Optoelectronic arrangement ( 10 ) according to one of the preceding claims, wherein the following relationship applies for an area ratio F of the area of ​​the converter element ( 110 ) to the area of ​​the dye element ( 115 ): 0.75<F<1.25.2024PF01060 21 5. Optoelectronic arrangement ( 10 ) according to one of the preceding claims, further comprising a protective layer ( 113 ) over the component ( 105 ).

6. Optoelectronic arrangement ( 10 ) according to claim 5 , wherein the dye element ( 115 ) is arranged between the carrier substrate ( 100 ) and the protective layer ( 113 ).

7. Optoelectronic arrangement ( 10 ) according to claim 5, wherein the dye element ( 115 ) is arranged on a side of the protective layer ( 113 ) facing away from the component ( 105 ).

8. Optoelectronic arrangement ( 10 ) according to one of claims 5 to 7 , wherein the component ( 104 ) is integrated into the protective layer .

9. Optoelectronic arrangement (10) according to one of the preceding claims, further comprising conductor tracks (107, 108, 109) for controlling the light-emitting element (106), wherein the conductor tracks (107, 108, 109) are arranged on one side of the carrier substrate (100).

10. Optoelectronic arrangement ( 10 ) according to claim 9, wherein the dye element ( 115 ) is arranged over the conductor tracks ( 107 , 108 , 109 ).

11. Optoelectronic arrangement (10) according to one of the preceding claims comprising a plurality of components (105) and a plurality of color elements (115), wherein the color elements (115) are arranged between adjacent components (105).

12. Optoelectronic arrangement (10) according to one of the preceding claims, wherein the dye element (115) is made of-2024PF01060 22 finally, it is arranged over non-light-emitting areas.

13. Display device ( 15) comprising the optoelectronic arrangement ( 10) according to any of the preceding claims .

14. Method for manufacturing an optoelectronic arrangement ( 10) , with Arranging (S100) at least one component (105) on a support substrate (100), wherein the component (105) comprises a light-emitting element (106) and a converter element (110), the light-emitting element (106) being configured to emit electromagnetic radiation during operation, and the converter element (110) being configured to convert a wavelength of the emitted electromagnetic radiation, and Arranging (S110) a dye element ( 115) at a position adjacent to the component ( 1059) and over one side of the support substrate ( 100) .

15. Method according to claim 14, wherein the dye element is arranged by masked application on the carrier substrate.

16. Method according to claim 14 or 15, wherein the dye element ( 115) is applied by ink jetting, screen printing, slot die coating, molding, spin coating, spraying or as a film.

Images