Zeolite, resin composition, liquid sealing agent, underfill material, sealing material production method, and electronic device
Surface-treated zeolites with silane coupling agents in resin compositions address the issues of high viscosity and hygroscopicity, providing low thermal expansion and improved adhesion for electronic device encapsulants.
WO2026150936A1PCT designated stage Publication Date: 2026-07-16MITSUBISHI CHEM CORP
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- MITSUBISHI CHEM CORP
- Filing Date
- 2026-01-08
- Publication Date
- 2026-07-16
AI Technical Summary
Technical Problem
Existing liquid encapsulants using inorganic fillers like silica do not have sufficiently low thermal expansion coefficients, leading to high viscosity and reduced injectability, while zeolites, though having low thermal expansion, are hygroscopic and affect dielectric properties.
Method used
Surface-treat zeolites with silane coupling agents to reduce hygroscopicity and viscosity, and incorporate them into resin compositions with specific structural and compositional characteristics to achieve low thermal expansion and improved adhesion.
Benefits of technology
The treated zeolites result in resin compositions with low hygroscopicity, low thermal expansion, and low viscosity, enhancing the injectability and reliability of electronic devices.
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Abstract
Provided is zeolite that has been surface-treated with a silane coupling agent, wherein, when the zeolite is heated to 800°C at a temperature rise rate of 10°C / min in an air atmosphere and held at 800°C for 10 minutes, the weight reduction at 800°C based on the weight at 400°C is 1.5% or more as determined by a thermogravimetric analysis (TGA). It is thus possible to provide a zeolite for obtaining a resin composition having low hygroscopicity, a low coefficient of thermal expansion after being cured, and a low viscosity.
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