Thermoelectric element

Abstract

A thermoelectric element according to an embodiment of the present invention comprises: a first substrate; a first electrode disposed on the first substrate; a semiconductor structure disposed on the first electrode; a second electrode disposed on the semiconductor structure; a second substrate disposed on the second electrode; an electric wire connected to the first electrode; and a sealing member for sealing between the first substrate and the second substrate, wherein the electric wire includes a bundled conductor composed of a plurality of conductor strands, the electric wire includes a first region disposed between the first substrate and the second substrate and not surrounded by a sheath, a second region extending from the first region and not surrounded by the sheath, and a third region extending from the second region and surrounded by the sheath, the second region and the third region do not vertically overlap the first substrate and the second substrate, and the bundled conductor in the second region is in direct contact with the sealing member.

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