Cover and electronic device comprising same

Abstract

The present disclosure relates to an electronic device. The electronic device comprises: a display forming a front surface; and a rear cover forming a rear surface. The rear cover includes: a glass layer including a first surface on which a first pattern is formed; a deposition layer stacked on the first surface of the glass layer; and a UV pattern layer stacked on the deposition layer and filling at least a portion of a step formed in the deposition layer by the first pattern.

Description

Cover and electronic device including the same

[0001] The present disclosure relates to a cover and an electronic device including the same.

[0002] Driven by advancements in electronic technology, various types of electronic devices are being developed and distributed. Among these are mobile devices that users carry personally, such as mobile phones, tablet PCs, and smartwatches. Mobile devices house various components, such as displays, processors, and memory, within a single housing. Covers may be placed on the front, sides, or rear of the housing. The covers may take the form of covering the front, sides, or rear of the housing, or they may become part of the housing itself.

[0003] Meanwhile, various patterns can be added to the cover to increase user satisfaction with the design of the mobile device.

[0004] For example, a pattern can be formed by etching the inner layer of the cover into various shapes.

[0005] However, conventional covers containing such patterns had a problem in that their surface hardness decreased as the pattern depth increased, making them susceptible to breakage from external impact. Additionally, conventional covers had the problem of an increased number of deposition processes required to form the patterns.

[0006] Embodiments of the present disclosure may solve at least one of the previously described problems and / or disadvantages and provide the advantages described below. Accordingly, various embodiments of the present disclosure provide a cover and an electronic device including the same.

[0007] Additional embodiments will be presented in the detailed description below, some of which are obvious from the detailed description, and other embodiments can also be presented through learning from the presented embodiments.

[0008] An electronic device according to at least one embodiment of the present disclosure comprises a display forming the front exterior of the electronic device and a rear cover forming the rear exterior of the electronic device. The rear cover comprises a glass layer having a first surface having a first pattern formed thereon, a deposition layer laminated on the first surface of the glass layer, and a UV pattern layer laminated on the deposition layer and filling at least a portion of the step formed in the deposition layer by the first pattern.

[0009] The above description of embodiments of the present disclosure, as well as other aspects, features, and benefits, will become more apparent from the following description with reference to the accompanying drawings. In the accompanying drawings:

[0010] FIG. 1 is a block diagram of an electronic device according to at least one embodiment of the present disclosure.

[0011] FIG. 2 is a perspective view showing the rear portion of an electronic device according to at least one embodiment of the present disclosure.

[0012] FIG. 3 is a cross-sectional view of 'A' of FIG. 2 according to at least one embodiment of the present disclosure, cut in a direction perpendicular to the longitudinal direction of the electronic device.

[0013] FIG. 4 is a cross-sectional view of 'A' of FIG. 2 according to at least one embodiment of the present disclosure, cut in a direction perpendicular to the longitudinal direction of the electronic device.

[0014] FIG. 5 is a cross-sectional view of 'A' of FIG. 2 taken in a direction perpendicular to the longitudinal direction of an electronic device according to at least one embodiment of the present disclosure.

[0015] FIG. 6 is a cross-sectional view of 'A' of FIG. 2 according to at least one embodiment of the present disclosure, cut in a direction perpendicular to the longitudinal direction of the electronic device.

[0016] FIG. 7 is a cross-sectional view of 'A' of FIG. 2 according to at least one embodiment of the present disclosure, cut in a direction perpendicular to the longitudinal direction of the electronic device.

[0017] FIG. 8 is a drawing showing the rear portion of an electronic device according to at least one embodiment of the present disclosure.

[0018] FIG. 9 is a cross-sectional view of 'B' of FIG. 8 according to at least one embodiment of the present disclosure, cut in a direction perpendicular to the longitudinal direction of the electronic device.

[0019] FIG. 10 is a drawing showing the rear portion of an electronic device according to at least one embodiment of the present disclosure.

[0020] The various embodiments of this document and the terms used therein are not intended to limit the technical features described in this document to specific embodiments, and should be understood to include various modifications, equivalents, or substitutions of said embodiments.

[0021] In relation to the description of the drawings, similar reference numerals may be used for similar or related components.

[0022] The singular form of the noun corresponding to the item may include one or multiple items, unless the relevant context clearly indicates otherwise.

[0023] In this document, each of the phrases such as "A or B", "at least one of A and B", "at least one of A or B", "A, B or C", "at least one of A, B and C", and "at least one of A, B, or C" may include any one of the items listed together in the corresponding phrase, or all possible combinations thereof.

[0024] The term "and / or" includes a combination of multiple related described components or any of the multiple related described components.

[0025] Terms such as "first," "second," or "first" or "second" may be used simply to distinguish a component from another component and do not limit the components in other aspects (e.g., importance or order).

[0026] Where any (e.g., 1st) component is referred to as "coupled" or "connected" to another (e.g., 2nd) component, with or without the terms "functionally" or "communicationly," it means that said any component may be connected to said other component directly (e.g., via a wire), wirelessly, or through a third component.

[0027] Terms such as "include" or "have" are intended to specify the existence of the features, numbers, steps, actions, components, parts, or combinations thereof described in this document, and do not preclude the existence or addition of one or more other features, numbers, steps, actions, components, parts, or combinations thereof.

[0028] When it is said that a component is "connected," "combined," "supported," or "in contact" with another component, this includes not only cases where the components are directly connected, combined, supported, or in contact, but also cases where they are indirectly connected, combined, supported, or in contact through a third component.

[0029] When it is said that a component is located "on" another component, this includes not only cases where one component is in contact with the other, but also cases where another component exists between the two components.

[0030] In the embodiment, the 'module' or multiple 'parts' may be integrated into at least one module and implemented by at least one processor, except for the 'module' or 'part' that needs to be implemented in specific hardware.

[0031] Operations performed by a module, program, or other component according to various embodiments may be executed sequentially, in parallel, iteratively, or heuristically, or at least some operations may be executed in a different order, omitted, or other operations may be added.

[0032] Meanwhile, various elements and areas in the drawings are depicted schematically. Accordingly, the technical concept of the present invention is not limited by the relative sizes or spacing depicted in the attached drawings.

[0033] Hereinafter, a cover and an electronic device including the cover according to various embodiments will be described in detail with reference to the drawings.

[0034] FIG. 1 is a block diagram of an electronic device (100) according to at least one embodiment of the present disclosure.

[0035] Referring to FIG. 1, the electronic device (100) may be one of various forms of electronic devices, such as a notebook (190), smartphones (191) having various form factors (e.g., a bar-type smartphone (191-1), a foldable-type smartphone (191-2), or a sliderable (or rollable)-type smartphone (191-3)), a tablet (192), a cellular phone (not shown), and other similar computing devices (not shown). The components, their relationships, and their functions illustrated in FIG. 1 are illustrative only and are not intended to limit the implementations described or claimed herein. The electronic device (100) may be referred to as a mobile device, a user device, a multifunction device, a portable device, or a server.

[0036] The electronic device (100) may include components comprising at least one processor (110) (hereinafter referred to as processor (110)), at least one memory (120) (hereinafter referred to as memory (120)), at least one display (140) (hereinafter referred to as display (140)), at least one image sensor (150) (hereinafter referred to as image sensor (150)), at least one communication circuit (160) (hereinafter referred to as communication circuit (160)), and / or at least one sensor (170) (hereinafter referred to as sensor (170)). The components are merely exemplary. For example, the electronic device (100) may include other components (e.g., power management integrated circuitry (PMIC), audio processing circuit, antenna, rechargeable battery, or input / output interface). For example, some components may be omitted from the electronic device (100). For example, some components may be integrated into a single component.

[0037] The processor (110) may be implemented as one or more IC (integrated circuit (or circuitry)) chips and may perform various data processing operations. The processor (110) may include at least one electrical circuit and may process instructions (or programs, data, etc.) stored in memory (120) individually or collectively in a distributed manner. The processor (110) may include a processor assembly comprising one or more processing circuits. The processor (110) may include any processing circuit that is operative to control the performance and operations of one or more components of the electronic device (100) (e.g., memory (120), display (140), image sensor (150), communication circuit (160), and / or sensor (170)). For example, the processor (110) (e.g., application processor (AP)) may be implemented as a system on chip (SoC) (e.g., a single chip or chipset). For example, the processor (110) may be implemented with a plurality of cores (or at least one core circuit), a plurality of chips, or a plurality of chipsets. For example, the processor (110) may include one or more processing circuits. For example, the processor (110) may include one or more processing circuits configured to perform the various functions of the present disclosure individually and / or collectively. As an example without limitation, at least a portion of the processor (110) may be included in a first chip of the electronic device (100), and at least another portion of the processor (110) may be included in a second chip of the electronic device (100) different from the first chip of the electronic device (100).

[0038] For example, the processor (110) may include a central processing unit (111), a graphics processing unit (112), a neural processing unit (113), an image signal processor (114), a display controller (115), a memory controller (116), a storage controller (117), a communication processor (118), and / or a sensor interface (119). These components of the processor (110) are merely exemplary. For example, the processor (110) may include other components. For example, some components of the processor (110) may be omitted from the processor (110). For example, some components of the processor (110) may be included as separate components of the electronic device (100) outside of the processor (110). For example, some components of the processor (110) (e.g., memory controller (116)) may be included in other components (e.g., at least part of memory (120), an interface (e.g. available for connection to at least one component of the electronic device (100)), a display (140) and / or an image sensor (150)).

[0039] The processor (110) may cause other components of the electronic device (100) to perform various operations by executing instructions stored in memory (120). The CPU (111) (or central processing circuit) may be configured to control the components of the processor (110) based on the execution of instructions stored in memory (120) (e.g., volatile memory (121) and / or non-volatile memory (122)). The GPU (112) (or graphics processing circuit) may be configured to execute parallel operations (e.g., rendering). The NPU (113) (or neural processing circuit, or AI (artificial intelligence) chip) may be configured to execute operations for an artificial intelligence model (e.g., convolution computation). An ISP (114) (or image signal processing circuit) may be configured to process a raw image acquired through an image sensor (150) into a format suitable for a component within the electronic device (100) or a component of the processor (110). A display controller (115) (or display control circuit, or DPU (display processing unit)) may be configured to process an image acquired from a CPU (111), GPU (112), ISP (114), or memory (120) (e.g., volatile memory (121)) into a format suitable for a display (140). A memory controller (116) (or memory control circuit) may be configured to control reading data from the volatile memory (121) and writing data to the volatile memory (121). A storage controller (117) (or storage control circuit) may be configured to control reading data from the non-volatile memory (122) and writing data to the non-volatile memory (122).The CP (118) (communication processing circuit) may be configured to process data obtained from a component of the processor (110) into a format suitable for transmitting to another electronic device via the communication circuit (160), or to process data obtained from another electronic device via the communication circuit (160) into a format suitable for processing by the component of the processor (110). For example, the communication circuit (160) may include one or more communication circuits. The sensor interface (119) (or sensing data processing circuit, sensor hub) may be configured to process data regarding the state of the electronic device (100) and / or the state around the electronic device (100), obtained through the sensor (170), into a format suitable for the component of the processor (110).

[0040] Memory (120) may include one or more storage media (or one or more storage devices). For example, memory (120) may include a memory assembly comprising one or more storage media. For example, the one or more storage media may include a hard drive, a permanent memory such as flash memory, read-only memory (ROM) (e.g., non-volatile memory (122)), a semi-permanent memory such as random access memory (RAM) (e.g., volatile memory (121)), any other suitable type of storage (or storage assembly), or any combination thereof. Memory (120) may include a cache memory, which is one or more different types of memory used to temporarily store data for a function or feature of the electronic device (100). As an example not limited to, the cache memory may be included within the processor (110). The memory (120) may be fixedly embedded within the electronic device (100) or incorporated into one or more suitable types of components (e.g., a SIM (subscriber identity module) card and / or an SD (secure digital) card) that can be repeatedly inserted into and removed from the electronic device (100).

[0041] For example, memory (120) may store one or more software applications, such as operating system (or system) software applications, firmware software applications, driver software applications, plugin (e.g., add-in, add-on, and / or applet) software applications, and / or any other suitable software applications. For example, the one or more software applications may include instructions executable by the processor (110). For example, memory (120) may store instructions that can be called by an application programming interface (API). For example, memory (120) may store instructions within a library.

[0042] Various components illustrated in FIG. 1 may be accommodated within the housing of an electronic device (100). The housing is a part that forms the outer shape of the electronic device (100), and may also be referred to as a main body or a packaging. The housing may be divided into a front part, a rear part, a side part, etc. According to various embodiments of the present disclosure, a cover may be attached to the front part, the rear part, and the side part of the housing, respectively, but is not limited thereto, and the front part, the rear part, and the side part of the housing itself may be implemented as a cover.

[0043] The cover may be formed in a smooth form without a pattern, or in a form with various patterns. For example, if a display is placed on the front of the electronic device (100), a cover in a smooth form may be placed on the display, and a cover containing a pattern may be placed on the rear or side of the electronic device (100). In various embodiments of the present disclosure, the pattern may be a design element capable of evoking visual aesthetics.

[0044] A detailed explanation of the cover is provided below.

[0045] FIG. 2 is a perspective view showing the rear portion of an electronic device (100) according to at least one embodiment of the present disclosure.

[0046] In FIG. 2, the electronic device (100) may include a housing (500) and a display (not shown) disposed on the front exterior of the housing (500). Additionally, the electronic device (100) may include at least one camera (200) and a cover (1000) on the rear exterior.

[0047] Although described as a cover (1000) in this specification, the cover (1000) may also be referred to as a rear cover (1000). From FIG. 2, the cover (1000) is described based on the rear cover (1000), but for convenience of explanation, it will be described using the expression cover (1000). At least one camera (200) may be placed on the rear surface of the electronic device (100). At least one camera (200) may be placed on the rear surface of the housing (500). At least one camera may be placed on the rear surface of the electronic device (100). At least one camera (200) may be able to take pictures in the direction of the rear exterior of the electronic device (100). In FIG. 2, three cameras (200) arranged in a row on the second surface of the housing (500) are shown, but the number, shape, position, etc. of the cameras may be varied.

[0048] The cover (1000) may be placed on the rear surface of the electronic device (100). The cover (1000) may be placed on the rear surface of the housing (500). The cover (1000) may cover the rear surface of the housing (500). The cover (1000) may be a back cover comprising at least one camera area in which at least one camera (200) is placed. However, it is not necessarily limited thereto, and the cover (1000) may have at least one opening formed to match the outer shape of at least one camera (200). Accordingly, at least one camera (200) may be coupled to at least one opening portion of the cover (1000).

[0049] The housing (500) may include side portions (1210, 1220). The side portions (1210, 1220) of the housing (500) may be formed with a rounded shape at the point where they meet the cover (1000). The side portions (1210, 1220) of the housing (500) may be formed with an angled shape at the point where they meet the cover (1000).

[0050] The cover (1000) may include multiple patterns in part or in whole. Since a detailed description of the multiple patterns will be provided later, the description thereof is omitted.

[0051] In addition, multiple patterns based on 'A', which is a part formed on the cover (1000), will be explained starting from Fig. 3.

[0052] FIG. 3 is a cross-sectional view of ‘A’ of FIG. 2 according to at least one embodiment of the present disclosure, cut in a direction perpendicular to the longitudinal direction of the electronic device (100).

[0053] In FIG. 3, the cover (1000) may include a glass layer (1300), a deposition layer (1400), a UV pattern layer (1500), and an anti-shatter layer (1600).

[0054] The glass layer (1300) is a layer that acts as a lens and can see through a plurality of layers disposed between the glass layer (1300) and the housing (500). The thickness of the glass layer (1300) can be formed to be 0.40 mm or more and 0.50 mm or less. The glass layer (1300) may include a first surface on which a first pattern (2100) is formed. A second surface opposite to the first surface of the glass layer (1300) may be in contact with the outside. The first pattern (2100) formed on the first surface of the glass layer (1300) can be manufactured using a mold without separate processing. Since the glass layer (1300) is manufactured using a mold, the possibility of damage from external impact can be reduced even if the thickness of the pattern is thick. That is, since the glass layer (1300) is manufactured using a mold, the durability of the cover (1000) can be increased.

[0055] The first pattern (2100) of the glass layer (1300) may be formed in a concave shape with respect to the first surface. However, it is not necessarily limited to this, and the first pattern (2100) of the glass layer (1300) may be formed in various shapes.

[0056] For example, the first pattern (2100) of the glass layer (1300) can be formed in a lens shape, a plurality of lens array shapes, a pyramid shape, a serration shape, etc.

[0057] The deposition layer (1400) can control the reflectance and refractive index of light entering toward the cover (1000). Accordingly, the deposition layer (1400) can control the light intensity of the cover (1000) in various ways. The deposition layer (1400) can increase the visual depth perception of the cover (1000). The deposition layer (1400) can be laminated on the first surface of the glass layer (1300).

[0058] The deposition layer (1400) may be deposited on the first surface of the glass layer (1300). As the deposition layer (1400) is deposited on the first surface of the glass layer (1300), it may include an area formed in a shape corresponding to the first pattern (2100) of the glass layer (1300) at a position corresponding to the first pattern (2100). As the deposition layer (1400) is formed with the same thickness, a step (2200) formed on the deposition layer (1400) corresponding to the first pattern (2100) may be formed on the opposite side of the surface in contact with the glass layer (1300).

[0059] The first pattern (2100) may have a concave shape in the direction of the deposition layer (1400). The step (2200) formed in the deposition layer (1400) may have a convex shape in the direction of the deposition layer (1400) at a position corresponding to the first pattern (2100). The deposition layer (1400) may include a curved region at a position corresponding to the first pattern (2100) and the step (2200) formed in the deposition layer (1400).

[0060] A UV pattern layer (1500) can be laminated onto a deposition layer (1400). The UV pattern layer (1500) is laminated onto the deposition layer (1400) and can fill at least a portion of the step (2200) formed in the deposition layer (1400) by the first pattern (2100). That is, the UV pattern layer (1500) can be laminated on the opposite side of the glass layer (1300) relative to the deposition layer (1400). The UV pattern layer (1500) may also be referred to as a UV-curing resin layer. The UV pattern layer (1500) can be laminated onto the deposition layer (1400) in a liquid state and then cured to finally form a solid state.

[0061] As the UV pattern layer (1500) is laminated onto the deposition layer (1400), a step (2200) formed in the deposition layer (1400) corresponding to the first pattern (2100) of the glass layer (1300) may be formed. That is, the UV pattern layer (1500) may include a step (2200) formed in the deposition layer (1400) that is formed in a shape corresponding to the first pattern (2100) at a position corresponding to the first pattern (2100).

[0062] A step (2200) formed on the deposition layer (1400) may be formed on the first surface of the UV pattern layer (1500). A second pattern (2300) may be formed on the second surface of the UV pattern layer (1500) opposite to the surface on which the first pattern (2100) is formed. The second pattern (2300) may be formed in a different shape or size from the first pattern (2100).

[0063] For example, the first pattern (2100) may be formed with a locally curved shape. Alternatively, the second pattern (2300) may be formed with a plurality of protrusion patterns formed over the entire area of ​​the second surface.

[0064] Here, the plurality of protrusion patterns can be formed as micro-patterns. For example, the height of each of the plurality of protrusion patterns can be 20 µm or more and 60 µm or less.

[0065] The second pattern (2300) may be formed by a plurality of protrusion patterns formed in a portion of the second surface. Here, the plurality of protrusion patterns may be formed as fine patterns. For example, the height of each of the plurality of protrusion patterns may be 20 µm or more and 60 µm or less.

[0066] Here, some areas may be formed at regular intervals in the form of horizontal or vertical stripes on the cover (1000) to create a sense of depth of the cover (1000), or may be formed in a radial form on the cover (1000).

[0067] That is, the second pattern (2300) can be formed as a plurality of protrusion patterns formed over a substantially entire area of ​​the second surface. Here, the substantially entire area refers to 80% to 99% of the second surface.

[0068] The UV pattern layer (1500) can be implemented by chemical etching and laser. The UV pattern layer (1500) can be implemented by being laminated onto a first pattern (2100) formed on glass (1300), thereby simplifying the deposition process. For example, a conventional UV pattern layer (1500) can be produced by a thermoforming press method.

[0069] The UV pattern layer (1500) can be manufactured through a process of forming a mirror section using a mold or plate of one of the materials, such as a squeegee, metal, and silicon, to maintain the laminate smoothness.

[0070] In FIG. 3, the anti-scattering layer (1600) is configured to suppress the scattering of dust and particles. The anti-scattering layer (1600) may be laminated on one side of the UV pattern layer (1500). The anti-scattering layer (1600) may be laminated on a second side of the UV pattern layer (1500). The anti-scattering layer (1600) may be formed in the form of a film that can be attached to the UV pattern layer (1500). Alternatively, the anti-scattering layer (1600) may be formed as a coating layer that is sprayed and coated onto the UV pattern layer (1500). The anti-scattering layer (1600) may also be referred to as a color spray layer.

[0071] The anti-scattering layer (1600) can be formed through a process of smoothing the surface using a squeegee, a metal, a silicone mold, or a plate to maintain smoothness.

[0072] The anti-shatter layer (1600) can be formed from a high-brightness material. For example, the anti-shatter layer (1600) can be formed in a form in which silver or silver-colored high-brightness material is randomly included within a black material.

[0073] FIG. 4 is a cross-sectional view of 'A' of FIG. 2 according to at least one embodiment of the present disclosure, cut in a direction perpendicular to the longitudinal direction of the electronic device (100).

[0074] In FIG. 4, the cover (1000) may further include an corrosion texture treatment layer (1700) on the upper side of the cover (1000) of FIG. 3.

[0075] The corrosion texture treatment layer (1700) is a configuration that can be protected from external scratches, etc. through the texture and surface treatment of the cover (1000). The corrosion texture treatment layer (1700) can be attached to one side of the glass layer (1300). The corrosion texture treatment layer (1700) can be placed on the opposite side (1310) of the glass layer (1300) that is in contact with the deposition layer (1400). That is, the corrosion texture treatment layer (1700) can be placed facing the outer surface (1710) of the electronic device (100). The corrosion texture treatment layer (1700) may be placed only on a part of one side of the glass layer (1300), or it may be placed over the entire side of the glass layer (1300).

[0076] The outer surface (1710) of the corrosion texture treatment layer (1700) can be formed in a flat shape. The outer surface (1710) of the corrosion texture treatment layer (1700) can be formed in a smooth shape.

[0077] Although not shown in FIG. 4, a logo layer (not shown) may be attached to a part of the outer surface (1700) of the corrosion texture treatment layer (1700).

[0078] FIG. 5 is a cross-sectional view of 'A' of FIG. 2 according to at least one embodiment of the present disclosure, cut in a direction perpendicular to the longitudinal direction of the electronic device (100).

[0079] In FIG. 5, a third pattern (1320) may be formed on one side of the glass layer (1300). The glass layer (1300) may include a third pattern (1320) formed on the opposite side of the side in contact with the deposition layer (1400).

[0080] The third pattern (1320) may include a plurality of protrusion patterns formed over the entire area of ​​the glass layer (1300). Here, the height of each of the plurality of protrusion patterns may be 20 µm or more and 60 µm or less.

[0081] The third pattern (1320) may include a plurality of protrusion patterns formed in a portion of the glass layer (1300). Here, the height of each of the plurality of protrusion patterns may be 20 µm or more and 60 µm or less. For example, the portion of the area may be formed at regular intervals in the form of horizontal or vertical stripes on the cover (1000) to create a sense of depth of the cover (1000), or it may be formed in a radial form on the cover (1000).

[0082] That is, the third pattern (1320) can be formed as a plurality of protrusion patterns formed over a substantially entire area of ​​the glass layer (1300). Here, the substantially entire area refers to an area of ​​80% to 99% of the glass layer (1300).

[0083] FIG. 6 is a cross-sectional view of 'A' of FIG. 2 according to at least one embodiment of the present disclosure, cut in a direction perpendicular to the longitudinal direction of the electronic device.

[0084] In FIG. 6, the second pattern (2310) of the UV pattern layer (1500) can be formed with the same pattern as the first pattern (2100) of the glass layer (1300). The second pattern (2310) of the UV pattern layer (1500) can be formed with a pattern corresponding to the first pattern (2100) of the glass layer (1300). That is, the second pattern (2310) of the UV pattern layer (1500) can be formed in a concave shape in the direction of the UV pattern layer (1500).

[0085] In FIG. 6, the anti-shatter layer (1600) may be formed in a shape corresponding to the first pattern (2100) of the glass layer (1300) on the surface (2400) in contact with the inner surface (3000). The anti-shatter layer (1600) may be formed in a shape corresponding to the first pattern (2100) at a position corresponding to the first pattern (2100) of the glass layer (1300).

[0086] FIG. 7 is a cross-sectional view of 'A' of FIG. 2 according to at least one embodiment of the present disclosure, cut in a direction perpendicular to the longitudinal direction of the electronic device.

[0087] In FIG. 7, the fourth pattern (3100) of the glass layer (1300) may be formed over the entire area of ​​the first surface. The fourth pattern (3100) of the glass layer (1300) may include a plurality of protrusions formed over the entire area of ​​the first surface.

[0088] The deposition layer (1400) may be deposited on the fourth pattern (3100) of the glass layer (1300). The deposition layer (1400) may include a fifth pattern (3200) on the opposite side of the surface in contact with the glass layer (1300). The fifth pattern (3200) may be formed in a shape symmetrical to the fourth pattern (3100) with respect to the deposition layer (1400). For example, the fourth pattern (3100) of the glass layer (1300) may be formed in a convex shape toward the deposition layer (1400) on the upper surface of the deposition layer (1400). The fifth pattern (3200) of the glass layer (1300) may be formed in a convex shape toward the deposition layer (1400) on the lower surface of the deposition layer (1400).

[0089] The UV pattern layer (1500) can be laminated on the lower surface of the deposition layer (1400). The UV pattern layer (1500) can be laminated on the surface of the deposition layer (1400) where the fifth pattern (3200) is formed. Accordingly, one surface of the UV pattern layer (1500) can be formed with a pattern corresponding to the fifth pattern (3200).

[0090] A sixth pattern (3300) may be formed on the opposite side of the UV pattern layer (1500) that contacts the deposition layer (1400). The sixth pattern (3300) may include a plurality of protrusion patterns formed over the entire area of ​​one side of the UV pattern layer (1500). Here, the height of each of the plurality of protrusion patterns may be formed to be 20 µm or more and 60 µm or less.

[0091] The sixth pattern (3300) may include a plurality of protrusion patterns formed in a portion of one surface of the UV pattern layer (1500). Here, the height of each of the plurality of protrusion patterns may be formed to be 20 µm or more and 60 µm or less. For example, the height of each of the plurality of protrusion patterns may be 20 µm or more and 60 µm or less. For example, some areas may be formed at regular intervals in the form of horizontal or vertical stripes on the cover (1000) to create a sense of depth on the cover (1000), or may be formed in a radial form on the cover (1000).

[0092] FIG. 8 is a drawing showing the rear portion of an electronic device (100) according to at least one embodiment of the present disclosure.

[0093] In FIG. 8, the electronic device (100) may include a housing (500), a display (not shown), at least one camera (200), and a cover (1000).

[0094] A display (not shown) may be placed on a first surface of the housing (500). At least one camera (200) may be placed on a second surface of the housing (500) opposite to the first surface. At least one camera (200) may be arranged in a line on the second surface. In FIG. 9, three cameras (200) are shown arranged in a line.

[0095] The cover (1000) may be a back cover that covers a second surface of the housing (500) and includes at least one camera area where at least one camera (200) is positioned. In FIG. 8, the cover (1000) may be a back cover that covers a second surface of the housing (500) and includes a camera area where three cameras are positioned.

[0096] At least one camera area of ​​the cover (1000) may be formed in the shape of at least one opening (4000) for joining at least one camera (200), or may be formed in the shape of covering at least one camera (200).

[0097] In FIG. 8, at least one camera area of ​​the cover (1000) is formed in the shape of at least one opening (4000), and at least one camera (200) is coupled to at least one opening (4000) of the cover (1000). That is, the cover (1000) may include at least one opening (4000) for coupling at least one camera (200).

[0098] In FIG. 8, the first pattern (2100) of the glass layer (1300) of FIG. 3 and the second pattern (2300) of the UV-cured layer (1500) may be formed in the edge region of at least one camera (200) region. The first pattern (2100) of the glass layer (1300) of FIG. 3 and the second pattern (2300) of the UV-cured layer (1500) may be formed in a shape that surrounds the outer surface of at least one camera (200). That is, the first pattern (2100) of the glass layer (1300) and the second pattern (2300) of the UV-cured layer (1500) may be formed in the edge region of at least one opening (4000).

[0099] FIG. 9 is a cross-sectional view taken by cutting 'B' of FIG. 8 according to at least one embodiment of the present disclosure in a direction perpendicular to the longitudinal direction of the electronic device (100).

[0100] In FIG. 9, the electronic device (100) may include at least one camera (200) and a cover (1000). In FIG. 9, at least one camera (200) may be coupled to an opening of the cover (1000). Accordingly, the height of the outer surface of the cover (1000) may be the same as the height of the outer surface of the camera (200).

[0101] In FIG. 9, the first pattern (2100) of the glass layer (1300) of FIG. 3 and the second pattern (2300) of the UV curing layer (1500) can be formed in the edge region (1100) of at least one camera (200) region.

[0102] The edge region (1100) of at least one camera (200) region of the cover (1000) may include glass (1300), a deposition layer (1400), a UV pattern layer (1500), and an anti-shatter layer (1600). The deposition layer (1400), the UV pattern layer (1500), and the anti-shatter layer (1600) may be sequentially stacked based on the glass (1300).

[0103] In FIG. 9, the shape of the glass (1300) may be curved so as to face the interior (3000) of the housing (500) as it moves away from at least one camera (200). However, it is not necessarily limited to this, and the shape of the glass (1300) may be formed in various shapes.

[0104] Accordingly, the deposition layer (1400), UV pattern layer (1500), and shatterproof layer (1600) can be deposited in a shape corresponding to the shape of the glass (1300).

[0105] FIG. 10 is a drawing showing the rear portion of an electronic device (100) according to at least one embodiment of the present disclosure.

[0106] In FIG. 10, the electronic device (100) may include a housing (500), a first side portion (1211), a second side portion (1221), and a cover (1000).

[0107] In FIG. 10, the first side portion (1211) may be formed with a smooth shape. The second side portion (1221) may include a plurality of protrusion patterns.

[0108] In FIG. 10, the cover (1000) may be formed in a shape (1200) corresponding to a plurality of protrusion patterns at a position corresponding to a plurality of protrusion patterns of the second side portion (1221).

[0109] The cover (1000) may include glass (1300) on its outer surface. The shape of the cover (1000) corresponding to a plurality of protrusion patterns of the second side portion (1221) may be formed inside the glass (1300). Accordingly, the texture of the outer surface of the cover (1000) may be smooth.

[0110] In FIG. 10, the first side portion (1211) and the second side portion (1221) may have the same pattern as the first pattern (2100) and the second pattern (2300) formed on the cover (1000). The first side portion (1211) and the second side portion (1221) may be formed of different materials. For example, the first side portion (1211) and the second side portion (1221) may be formed of a metal material, and the cover (1000) may be formed of various materials such as glass, an elastomer, and a UV-curing resin.

[0111] In FIG. 10, the cover (1000) may further include a side cover (not shown) for covering a first side portion (1211) and a second side portion (1221). Up to FIG. 9, the cover (1000) was configured to cover the rear side, but in FIG. 10, it may be formed as an integrated cover (1000) capable of covering the side side as well. Accordingly, the electronic device (100) can protect internal components from external impact.

[0112] Each of the components described in this document may be composed of one or more components, and the name of the component may vary depending on the type of cover (1000) and the electronic device (100) including the cover (1000).

[0113] Although various embodiments of the present disclosure have been described individually above, each embodiment is not required to be implemented alone, and the configuration and operation of each embodiment may be implemented in combination with at least one other embodiment.

[0114] Although preferred embodiments have been illustrated and described above, the present disclosure is not limited to the specific embodiments described above. It is understood that various modifications can be made by those skilled in the art without departing from the essence of the present disclosure as claimed in the claims, and such modifications should not be understood individually from the technical spirit or perspective of the present disclosure.

Claims

1. In an electronic device, A display forming the front exterior of the above electronic device; and It includes a rear cover forming the rear exterior of the electronic device; and The above rear cover is, A glass layer comprising a first surface having a first pattern formed thereon; A deposition layer laminated on the first surface of the glass layer; An electronic device comprising: a UV pattern layer laminated on the deposition layer and filling at least a portion of the step formed on the deposition layer by the first pattern.

2. In Paragraph 1, An electronic device comprising a UV pattern layer including a first surface facing the deposition layer and a second surface opposite to the first surface, wherein the second surface of the UV pattern layer includes a second pattern having a shape or size different from the first pattern.

3. In Paragraph 1, The first pattern formed on the first surface of the glass layer is concave in the direction of the glass layer, and The above-deposited layer comprises an electronic device having a region in which a step is formed along the first pattern.

4. In Paragraph 1, The above electronic device further includes a shatterproof layer, and An electronic device in which the above UV pattern layer is disposed between the above anti-shatter layer and the above deposition layer.

5. In Paragraph 4, The above-mentioned scattering prevention layer is, An electronic device formed in the form of a film attachable to the above UV pattern layer.

6. In Paragraph 4, The above-mentioned scattering prevention layer is, An electronic device, which is a coating layer sprayed and coated onto the above-mentioned UV pattern layer.

7. In Paragraph 2, The above glass layer is, An electronic device comprising a third pattern formed on a second surface opposite to the first surface in contact with the deposition layer.

8. In Paragraph 7, The above third pattern is, It includes a plurality of protrusion patterns formed over a substantially entire area of ​​the glass layer, and An electronic device having a height of each of the above plurality of protrusion patterns of 20 µm or more and 60 µm or less.

9. In Paragraph 2, The above second pattern is, It includes a plurality of protrusion patterns formed in a substantially entire area of ​​the second surface of the UV pattern layer, An electronic device having a height of each of the above plurality of protrusion patterns of 20 µm or more and 60 µm or less.

10. In Paragraph 1, The thickness of the above glass layer is, An electronic device having a diameter of 0.40 mm or more and 0.50 mm or less.

11. In Paragraph 2, It further includes at least one camera that takes a picture in the rear exterior direction of the electronic device, and The above rear cover includes at least one opening for coupling the at least one camera, and The above first pattern and the above second pattern are, An electronic device formed in the edge region of at least one opening.

12. In Paragraph 2, The first side part and the second side part are, An electronic device having a pattern identical to the first pattern and the second pattern formed on the rear cover.

13. In Paragraph 1, The above rear cover is, An electronic device further comprising a side cover for covering a first side portion and a second side portion.

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