Textured implanter components for particle reduction
WO2026151577A1PCT designated stage Publication Date: 2026-07-16APPLIED MATERIALS INC
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- APPLIED MATERIALS INC
- Filing Date
- 2025-12-16
- Publication Date
- 2026-07-16
AI Technical Summary
Technical Problem
Ion implanters in semiconductor manufacturing face issues with deposition and delamination of materials on surfaces adjacent to the ion beam path, leading to particle defects that can damage semiconductor devices, and current preventive measures are inefficient and time-consuming.
Method used
Implementing textured surfaces with pyramidal structures and undercuts on ion implanter components, such as dose cup aperture plates, to redirect and trap deposition material away from the process chamber, reducing the accumulation of harmful particles.
Benefits of technology
Significantly reduces particle defects and the need for frequent tool maintenance by effectively managing ion beam-induced deposits, enhancing semiconductor device yield and productivity.
✦ Generated by Eureka AI based on patent content.
Smart Images
Figure US2025059813_16072026_PF_FP_ABST
Abstract
The present invention relates to components in ion implanters having surfaces adjacent to the path of the ion beam through the ion implanter. Such surfaces will be prone to deposition and the present invention addresses problems associated with delamination of deposited material. An ion implanter component is provided that has a surface defining at least in part an ion beam path through the ion implanter, wherein at least a portion of the surface is textured, the texture including serrations or pyramidal structures.
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