PFAS-free substitution for glass fiber filled polycarbonate compositions

A PFAS-free glass fiber-filled polycarbonate composition using cyclic phosphazene and silicone flame retardants addresses the need for high-performance, environmentally friendly alternatives, achieving V0 flammability ratings and mechanical stability.

WO2026151848A1PCT designated stage Publication Date: 2026-07-16COVESTRO LLC

Patent Information

Authority / Receiving Office
WO · WO
Patent Type
Applications
Current Assignee / Owner
COVESTRO LLC
Filing Date
2026-01-08
Publication Date
2026-07-16

AI Technical Summary

Technical Problem

There is a need for PFAS-free glass fiber-filled polycarbonate compositions that maintain or exceed the performance of existing compositions, particularly in terms of mechanical properties and flame retardancy.

Method used

A composition comprising polycarbonate, glass fibers, cyclic phosphazene and cyclic silicone flame retardants, and optional polymer additives, excluding polysiloxane-polycarbonate copolymer and bisphenol-A diphenyl phosphate, to achieve improved flame retardancy and mechanical properties.

Benefits of technology

The PFAS-free composition achieves UL94 flammability ratings of V0 at 1.5 mm and 2.0 mm with glass fiber loadings, while maintaining mechanical integrity and avoiding the drawbacks of PFAS, such as environmental persistence and health concerns.

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Patent Text Reader

Abstract

Provided is a composition comprising (a) a polycarbonate; (b) greater than zero to less than 40 wt.% of glass fibers; (c) 3 wt.% to 11 wt.% of a cyclic phosphazene flame retardant; (d) >0 wt.% to 2 wt.% of a cyclic silicone flame retardant; (e) 2 wt.% to 8 wt.% of an impact modifier; and (f) 0 wt.% to 30.0 wt.% of one or more polymer additives, wherein the composition comprises less than 5 wt.% of polysiloxane-polycarbonate copolymer, wherein the composition comprises less than 2 wt.% bisphenol-A diphenyl phosphate (BDP), and wherein wt.% all instances is based on weight of the composition, provided that the composition is free of per- and polyfluoroalkyl substances. The composition of the invention may find use in extruded films, profiles, electrical and electronic housings.
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