Display device

Abstract

A display device, the display device comprising: a display panel; a first printed circuit board, electrically connected to the display panel, the first printed circuit board comprising at least one first driving unit and a first connecting unit electrically connected to the display panel; a second printed circuit board, comprising at least one second driving unit and a second connecting unit electrically connected to the at least one second driving unit; and a first connecting portion, electrically connected to the first connecting unit and the second connecting unit.

Description

Display device Technical Field

[0001] This disclosure relates to the field of display technology, and more particularly to display devices. Background Technology

[0002] Currently, organic light-emitting diode (OLED) display technology has been applied in display terminal products. These products typically integrate multiple modules that control and implement display functions onto a single printed circuit board (PCB). However, each module and its peripheral components occupy a large area, easily leading to a crowded PCB layout. Summary of the Invention

[0003] This disclosure provides a display device, which includes:

[0004] Display panel;

[0005] A first printed circuit board is electrically connected to a display panel; the first printed circuit board includes: at least one first driving unit and a first connection unit electrically connected to the display panel;

[0006] The second printed circuit board includes: at least one second driving unit, and a second connection unit electrically connected to at least one second driving unit;

[0007] The first connecting part is electrically connected to the first connecting unit and the second connecting unit.

[0008] In some embodiments, the display panel has a front side and a back side, wherein the front side is the light-emitting surface of the display panel;

[0009] The display panel includes: a display area, at least one first binding area, and a bent area located between the display area and the at least one first binding area; the bent area is bent along a bending axis such that the first binding area is located on the back side; the bending axis extends along a first direction;

[0010] The first printed circuit board and the second printed circuit board are attached to the back side, and the orthographic projections of the first printed circuit board and the second printed circuit board on the back side are located on the same side of the orthographic projection of the first bonding area on the back side in the second direction, and the first direction and the second direction intersect.

[0011] In some embodiments, the orthographic projection of the second printed circuit board on the back side is located on the side of the orthographic projection of the first printed circuit board on the back side that is away from the orthographic projection of the first bonding area on the back side.

[0012] In some embodiments, the second connecting unit is located in the edge region of the second printed circuit board on the side close to the first printed circuit board, and the length of the second connecting unit in the first direction is greater than the length of the second connecting unit in the second direction;

[0013] The first connecting portion includes at least a portion located on one side of the second connecting unit in the second direction.

[0014] In some embodiments, a portion of the orthographic projection of the first connecting portion on the back side is located on the side of the orthographic projection of the second connecting unit on the back side facing the orthographic projection of the first printed circuit board on the back side.

[0015] Outside the area where the first connecting part is electrically connected to the first connecting unit, the orthographic projection of the first connecting part on the back overlaps with the orthographic projection of the first printed circuit board on the back.

[0016] In some embodiments, a portion of the orthographic projection of the first connecting portion on the back side is located on the side of the orthographic projection of the second connecting unit on the back side that is away from the orthographic projection of the first printed circuit board on the back side.

[0017] A portion of the orthographic projection of the first connecting part on the back is located on the side of the orthographic projection of the first connecting unit on the back that is far from the orthographic projection of the first bonding area on the back.

[0018] Outside the area where the first connecting part is electrically connected to the first connecting unit, the orthographic projection of the first connecting part on the back side and the orthographic projection of the first printed circuit board on the back side do not overlap.

[0019] In some embodiments, the second connecting unit is located in the edge region of the second printed circuit board extending along the second direction, and the length of the second connecting unit in the first direction is less than the length of the second connecting unit in the second direction;

[0020] The first connecting portion includes: a portion located on one side of the second connecting unit in the first direction, and a portion located on the side of the first connecting unit away from the first binding area in the second direction;

[0021] In the area outside the region where the first connecting part is electrically connected to the first connecting unit, the orthographic projection of the first connecting part on the back side and the orthographic projection of the first printed circuit board on the back side do not overlap.

[0022] In some embodiments, the orthographic projection of the second printed circuit board on the back side is located at the edge region of the back side extending along the second direction.

[0023] In some embodiments, the orthographic projection of the second printed circuit board on the back side is located on one side of the orthographic projection of the first printed circuit board on the back side in a first direction.

[0024] In some embodiments, the second connecting unit is located on the edge region of the second printed circuit board near the first printed circuit board, and the length of the second connecting unit in the first direction is less than the length of the second connecting unit in the second direction.

[0025] In some embodiments, the first connecting portion includes: a first portion electrically connected to the second connecting unit and a second portion electrically connected to the first portion; the second portion is located in a second direction on the side of the first portion away from the first binding area;

[0026] The orthographic projection of the first part on the back overlaps with the orthographic projection of the first printed circuit board on the back, while the orthographic projection of the second part on the back does not overlap with the orthographic projection of the first printed circuit board on the back.

[0027] In some embodiments, the first printed circuit board includes: at least one first groove; and an area in which the orthographic projection of the first connection portion on the back side overlaps with the orthographic projection of the first printed circuit board on the back side, wherein the first connection portion is located within the first groove.

[0028] In some embodiments, the first printed circuit board includes: multiple conductive layers and an insulating layer located between the conductive layers;

[0029] The number of conductive and insulating layers included in the first printed circuit board in the area of ​​the first recess is less than the number of conductive and insulating layers included in the first printed circuit board in the area outside the first recess.

[0030] In some embodiments, at least one first driving unit includes: a timing controller; the first printed circuit board further includes: at least one first trace electrically connected to the timing controller and the first connection unit;

[0031] The first connection unit is located on one side of the timing controller in the first direction.

[0032] In some embodiments, at least one first driving unit further includes:

[0033] The logic power management unit is located on the side of the first connection unit away from the timing controller in the first direction.

[0034] In some embodiments, the first printed circuit board has a first axis of symmetry extending along a second direction;

[0035] The logic power management unit is located on one side of the first axis of symmetry in the positive direction of the first direction;

[0036] At least a portion of the timing controller is located on one side of the first axis of symmetry in the negative direction of the first direction.

[0037] In some embodiments, the orthographic projection of the logic power management unit on the back and the orthographic projection of the second printed circuit board on the back are located on opposite sides of the first axis of symmetry.

[0038] In some embodiments, at least one first driving unit further includes:

[0039] The flash memory cell is located on the side of the timing controller away from the first connection cell in the first direction.

[0040] In some embodiments, the orthographic projection of the second printed circuit board on the back side is located on the side of the orthographic projection of the first printed circuit board on the back side that is away from the orthographic projection of the first bonding area on the back side; the first connection portion includes: a first portion electrically connected to the second connection unit, and a third portion electrically connected to the first connection unit;

[0041] The orthographic projection of the third part on the back and the orthographic projection of the first part on the back both overlap with the orthographic projection of the first printed circuit board on the back. The orthographic projection of the third part on the back is located on the side of the orthographic projection of the timing controller on the back that is far away from the orthographic projection of the flash memory cell on the back. The orthographic projection of the first part on the back is located between the orthographic projection of the timing controller on the back and the orthographic projection of the flash memory cell on the back.

[0042] In some embodiments, the orthographic projection of the second printed circuit board on the back side is located on one side of the orthographic projection of the first printed circuit board on the back side in a first direction, and the first connection portion includes a first part electrically connected to the second connection unit.

[0043] The first part is projected onto the back side of the flash memory cell, which is projected onto the back side of the second printed circuit board.

[0044] In some embodiments, the display device further includes a motherboard; the first connecting portion is also electrically connected to the motherboard.

[0045] In some embodiments, the first connection portion includes a set of adapter leads, the set of adapter leads includes multiple connecting leads, and at least a portion of the multiple connecting leads have their two ends electrically connected to the first connection unit and the second connection unit, respectively.

[0046] Alternatively, the first connecting part includes a first flexible circuit board, the first flexible circuit board includes multiple connecting leads, and at least some of the connecting leads have their ends electrically connected to the first connecting unit and the second connecting unit, respectively.

[0047] In some embodiments, the display device further includes:

[0048] At least one second flexible circuit board; one end of the second flexible circuit board is bonded to the first bonding area, and the other end of the second flexible circuit board is bonded to the first printed circuit board; the orthographic projection of the second flexible circuit board on the back side overlaps with the orthographic projection of the area between the first bonding area and the first printed circuit board on the back side. Attached Figure Description

[0049] To more clearly illustrate the technical solutions in the embodiments of this disclosure, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this disclosure. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0050] Figure 1 is a schematic diagram of the structure of a display device provided in an embodiment of this disclosure;

[0051] Figure 2 is a schematic diagram of another display device provided in an embodiment of this disclosure;

[0052] Figure 3 is a schematic diagram of the structure of a display panel in an unbent state of the bending area of ​​an embodiment of the present disclosure;

[0053] Figure 4 is a schematic diagram of the structure of another display device provided in an embodiment of this disclosure;

[0054] Figure 5 is a schematic diagram of another display device provided in an embodiment of this disclosure;

[0055] Figure 6 is a schematic diagram of another display device provided in an embodiment of this disclosure;

[0056] Figure 7 is a schematic diagram of another display device provided in an embodiment of this disclosure;

[0057] Figure 8 is a schematic diagram of another display device provided in an embodiment of this disclosure;

[0058] Figure 9 is a schematic diagram of the structure of another display device provided in an embodiment of this disclosure;

[0059] Figure 10 is a schematic diagram of another display device provided in an embodiment of this disclosure;

[0060] Figure 11 is a schematic diagram of another display device provided in an embodiment of this disclosure;

[0061] Figure 12 is a schematic diagram of another display device provided in an embodiment of this disclosure;

[0062] Figure 13 is a schematic diagram of another display device provided in an embodiment of this disclosure;

[0063] Figure 14 is a schematic diagram of another display device provided in an embodiment of this disclosure;

[0064] Figure 15 is a schematic diagram of another display device provided in an embodiment of this disclosure;

[0065] Figure 16 is a schematic diagram of the structure of another display device provided in an embodiment of this disclosure. Detailed Implementation

[0066] To make the objectives, technical solutions, and advantages of the embodiments of this disclosure clearer, the technical solutions of the embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this disclosure. Furthermore, the embodiments and features in the embodiments of this disclosure can be combined with each other without conflict. All other embodiments obtained by those skilled in the art based on the described embodiments of this disclosure without creative effort are within the scope of protection of this disclosure.

[0067] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms “first,” “second,” and similar terms used in this disclosure do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Terms such as “comprising” or “including” mean that an element or object preceding the word encompasses the elements or objects listed following the word and their equivalents, without excluding other elements or objects. Terms such as “connected” or “linked” are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect.

[0068] It should be noted that the dimensions and shapes of the figures in the accompanying drawings do not reflect actual proportions and are intended only to illustrate the content of this disclosure. Furthermore, the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout.

[0069] This disclosure provides a display device, as shown in FIG1, the display device including:

[0070] Display panel 1;

[0071] The first printed circuit board 2 is electrically connected to the display panel 1; the first printed circuit board 2 includes: at least one first driving unit 201 and a first connection unit 202 electrically connected to the display panel 1.

[0072] The second printed circuit board 3 includes: at least one second driving unit 301, and a second connection unit 302 electrically connected to at least one second driving unit 301;

[0073] The first connecting part 4 is electrically connected to the first connecting unit 202 and the second connecting unit 302.

[0074] The display device provided in this disclosure embodiment has at least one first driving unit and at least one second driving unit located on different printed circuit boards. The layout space of the first driving unit and the second driving unit on their respective printed circuit boards is sufficient, thereby avoiding the problem of crowded layout space and heat dissipation caused by integrating the first driving unit and the second driving unit on one printed circuit board.

[0075] The display device provided in this disclosure embodiment has at least one first driving unit and at least one second driving unit located on different printed circuit boards. The layout space of the first driving unit and the second driving unit on their respective printed circuit boards is sufficient, the heat dissipation effect is good, and the temperature of the first driving unit and the second driving unit under the working state can be reduced, avoiding reliability issues caused by excessive temperature of the first driving unit and the second driving unit, and also improving the user experience.

[0076] In some embodiments, as shown in FIG2, the display panel 1 has a front side 1-1 and a back side 1-2, wherein the front side 1-1 is the light-emitting surface of the display panel 1.

[0077] In some embodiments, as shown in Figures 1 to 3, the display panel 1 includes: a display area AA, at least one first binding area NA-2, and a bending area NA-1 located between the display area AA and the at least one first binding area NA-2;

[0078] As shown in Figures 1 and 2, the bending area NA-1 is bent along the bending axis, so that the first binding area NA-2 is located on the back side 1-2; the bending axis extends along the first direction X.

[0079] It should be noted that Figure 3 is a schematic diagram of the bending area NA-1 of the display panel 1 in the unbent state. As shown in Figure 3, the display panel 1 includes a peripheral area NA surrounding the display area AA. The peripheral area NA located on one side of the display area AA in the second direction Y includes a first binding area NA-2 and a bending area NA-1.

[0080] In some embodiments, as shown in FIG2, the display panel 1 includes: a substrate 101 and a display functional layer 102 located on one side of the substrate 101. For example, the bending region and the first bonding region include at least a portion of the film layer in the display functional layer, and the substrate is bent along the bending axis in the bending region so that the substrate and at least a portion of the film layer in the display functional layer disposed thereon are bent to the back side.

[0081] In some embodiments, the display panel is an electroluminescent display panel, such as an organic light-emitting diode (OLED) display panel; the display functional layer includes: a pixel driving circuit layer, a plurality of light-emitting devices located on the side of the pixel driving circuit layer opposite to the substrate, and an encapsulation layer located on the side of the plurality of light-emitting devices opposite to the substrate. The light-emitting devices are, for example, organic light-emitting diode devices. The driving circuit layer includes a plurality of thin-film transistors and a plurality of signal lines. Other essential components of the OLED display panel are as would be understood by those skilled in the art and are not described in detail here, nor should they be construed as limiting this disclosure.

[0082] In some embodiments, as shown in FIG2, the display panel 1 further includes a heat dissipation structure 103 located on the side of the substrate 101 that is not bent to the back side 1-2 away from the display functional layer 102; the surface of the display functional layer 102 that is not bent and corresponds to the light-emitting surface of the display panel 1 is the front side 1-1, and the surface of the heat dissipation structure 103 that is away from the substrate 101 is the back side 1-2 of the display panel 1. In some embodiments, the heat dissipation structure includes an adhesive layer, foam, and a conductive film stacked together; wherein the adhesive layer is in contact with the area of ​​the substrate that is not bent to the back side. The conductive film may be a copper foil or a stainless steel film. In addition to its heat dissipation function, the heat dissipation structure, due to the inclusion of the conductive film, can also achieve a grounding function.

[0083] In some embodiments, as shown in FIG1, the first printed circuit board 2 and the second printed circuit board 3 are attached to the back surface 1-2, and the orthographic projections of the first printed circuit board 2 and the second printed circuit board 3 on the back surface 1-2 are located on the same side of the orthographic projection of the first bonding area NA-2 on the back surface 1-2 in the second direction Y, and the first direction X intersects the second direction Y. In a specific implementation, the first printed circuit board and the second printed circuit board are attached to a heat dissipation structure.

[0084] In some embodiments, as shown in FIG1, the display device further includes a motherboard 8.

[0085] In some embodiments, as shown in FIG1, the first connecting portion 4 is also electrically connected to the motherboard 8. Thus, the motherboard can transmit signals between itself and the first printed circuit board and the second printed circuit board via the first connecting portion.

[0086] In some embodiments, the first connection portion includes multiple connection leads; at least a portion of the multiple connection leads are directly electrically connected to the first printed circuit board and the second printed circuit board.

[0087] Alternatively, the first printed circuit board and the second printed circuit board may be directly electrically connected without the connection leads in the first connection portion. In some embodiments, the first connection portion includes: a first connection sub-part and a second connection sub-part; the first connection sub-part is connected to the first printed part, and the second connection sub-part is connected to the second printed part; and both the first connection sub-part and the second connection sub-part are electrically connected to the motherboard. The motherboard transmits signals to the second printed circuit board through the second connection sub-part, the motherboard transmits signals to the first printed circuit board through the first connection sub-part, and the first printed circuit board transmits signals to the second printed part through the first connection sub-part, the motherboard, the second connection sub-part, and the second printed part.

[0088] Alternatively, in some embodiments, the display device further includes a second connecting portion; the second connecting portion is electrically connected to the motherboard and the second printed circuit board. Thus, signal transmission is achieved between the motherboard and the second printed circuit board via the second connecting portion, and signal transmission is achieved between the motherboard and the second printed circuit board via the second connecting portion, the second printed circuit board, the first connecting portion, and the first printed circuit board.

[0089] In some embodiments, the first driving unit and the second driving unit are integrated circuits.

[0090] In some embodiments, as shown in FIG1, at least one first driving unit 201 includes: a timing controller TIC, a logic power management unit LPMIC, and a flash memory unit FL.

[0091] In some embodiments, as shown in FIG1, at least one second driving unit 301 includes a light-emitting control power management unit (ELPMIC).

[0092] Of course, in some embodiments, at least one second driving unit may include a light-emitting control power management unit, in which case one or two of the timing controller, logic power management unit, and flash memory unit are second driving units located on the second printed circuit board, and the timing controller, logic power management unit, and flash memory unit that are not located on the second printed circuit board are used as first driving units located on the first printed circuit board.

[0093] In related technologies, the timing controller, logic power management unit, flash memory unit, and light emission control power management unit are located on a single printed circuit board. These driving units occupy a large area, leading to a crowded layout on the printed circuit board. Furthermore, the timing controller, logic power management unit, and light emission control power management unit are all high-heat-generating devices. A crowded printed circuit board layout results in poor heat dissipation efficiency for each driving unit, causing the entire display device to overheat, severely impacting device reliability and user experience. However, in the display device provided by this disclosure, the light emission control power management unit is located on a different printed circuit board than the timing controller, logic power management unit, and flash memory unit. This provides more layout space for the timing controller, logic power management unit, and flash memory unit, and also keeps the light emission control power management unit away from the high-heat-generating devices on the first printed circuit board, improving the heat dissipation efficiency of the first and second printed circuit boards and avoiding the high-temperature problem caused by overly concentrated driving unit layouts. Moreover, the first and second printed circuit boards are electrically connected via a first connection portion, which does not affect signal transmission between the driving units. Furthermore, the first and second printed circuit boards also include multiple traces. Compared to related technologies that integrate various driving units onto a single printed circuit board, the first and second printed circuit boards have more space for traces, allowing for thicker traces and reduced heat generation, further lowering the heat output of the first and second printed circuit boards. For example, by placing the light-emitting control power management unit on the second printed circuit board, the maximum temperature of the display device is significantly reduced, for example, by at least 10°C.

[0094] In some embodiments, as shown in FIG1, the first printed circuit board 2 further includes at least one first trace 204 electrically connected to the timing controller TIC and the first connection unit 202;

[0095] The first connection unit 202 is located on one side of the timing controller TIC in the first direction X, that is, there is no other first drive unit 201 between the first connection unit 202 and the timing controller TIC in the first direction X.

[0096] The display device provided in this embodiment has a first connection unit located on one side of the timing controller in a first direction. There are no other first driving units between the first connection unit and the timing controller, so the distance between the first connection unit and the timing controller is relatively close, which is beneficial to reduce the length of the first trace that is electrically connected to both, thereby improving the signal transmission efficiency between the first connection unit and the timing controller.

[0097] In some embodiments, as shown in FIG1, the Logic Power Management Unit (LPMIC) is located on the side of the first connection unit 202 away from the timing controller TIC in the first direction X. That is, the first connection unit 202 is located between the LPMIC and the timing controller TIC.

[0098] The display device provided in this disclosure has a logic power management unit located on the side of the first connection unit away from the timing controller in a first direction. This increases the distance between the timing controller and the logic power management unit, two high-heat-generating devices, thereby improving the heat dissipation efficiency of the timing controller and the logic power management unit, avoiding high-temperature problems caused by their layout, and enhancing the user experience.

[0099] In some embodiments, as shown in FIG1, the first printed circuit board 2 has a first axis of symmetry 9 extending along a second direction Y;

[0100] The logic power management unit (LPMIC) is located on one side of the first axis of symmetry 9 in the positive direction X+ of the first direction X.

[0101] At least a portion of the timing controller TIC is located on one side of the first axis of symmetry 9 in the negative X direction of the first direction X.

[0102] It should be noted that in Figure 1, the distance is illustrated using the direction from right to left as the negative X- of the first direction X and the direction from left to right as the positive X+ of the first direction X.

[0103] The display device provided in this embodiment has at least a portion of the logic power management unit and the timing controller located on both sides of the first axis of symmetry. This can further increase the distance between the timing controller and the logic power management unit, which are two high-heat-generating devices, thereby improving the heat dissipation efficiency of the timing controller and the logic power management unit, avoiding high-temperature problems caused by their layout, and improving the user experience.

[0104] In some embodiments, as shown in FIG1, the logic power management unit (LPMIC) is located in the edge region of the first printed circuit board 2, that is, the logic power management unit (LPMIC) is the outermost device in the positive X+ direction of the first direction X. While at least part of the logic power management unit and the timing controller are located on both sides of the first axis of symmetry, the distance between the logic power management unit and the timing controller is increased as much as possible, which is more conducive to improving the heat dissipation efficiency of the timing controller and the logic power management unit and avoiding the display device from getting too hot.

[0105] In some embodiments, as shown in FIG1, in the first direction X, the distance between the logic power management unit LPMIC and the first connection unit 202 is greater than the distance between the first connection unit 202 and the timing controller TIC.

[0106] In some embodiments, as shown in FIG1, the orthographic projection of the logic power management unit LPMIC on the back side 1-2 and the orthographic projection of the second printed circuit board 3 on the back side 1-2 are respectively located on both sides of the first axis of symmetry 9.

[0107] The display device provided in this embodiment has a logic power management unit and a second printed circuit board located on opposite sides of a first axis of symmetry. This increases the distance between the logic power management unit and the second printed circuit board, resulting in a greater distance between the logic power management unit and the light-emitting control power management unit. This avoids the concentration of high-heat-generating devices, improves the heat dissipation efficiency of the logic power management unit and the light-emitting control power management unit, further avoids reliability issues caused by excessively high operating temperatures of the display device, and further enhances the user experience.

[0108] In some embodiments, as shown in FIG1, the flash memory cell FL is located on the side of the timing controller TIC away from the first connection unit 202 in the first direction X.

[0109] In some embodiments, as shown in FIG1, the first connecting part 4 includes a converter lead group 5, which includes a plurality of connecting leads (not shown).

[0110] Alternatively, in some embodiments, as shown in FIG4, the first connection portion 4 includes a first flexible circuit board 6; the first flexible circuit board 6 includes multiple connection leads (not shown).

[0111] In some embodiments, as shown in FIG5, at least a portion of the connecting leads 11 are electrically connected at both ends to the first connecting unit 202 and the second connecting unit 302, respectively.

[0112] In some embodiments, as shown in FIG1, the first connecting portion 4 further includes: a first sub-connecting portion 404 connected to the first connecting unit 202, a second sub-connecting portion 405 connected to the second connecting unit 302, and a third sub-connecting portion 406 connected to the third connecting unit 801.

[0113] In some embodiments, the two ends of the first connecting lead are electrically connected to the first sub-connecting portion and the second sub-connecting portion, respectively; the two ends of the second connecting lead are electrically connected to the first sub-connecting portion and the third sub-connecting portion, respectively; and the two ends of the third connecting lead are electrically connected to the second sub-connecting portion and the third sub-connecting portion, respectively.

[0114] In some embodiments, the first connecting unit, the second connecting unit, and the third connecting unit are connectors; the corresponding first sub-connecting part, the second sub-connecting part, and the third sub-connecting part are also connectors.

[0115] Alternatively, in some embodiments, when the first connecting portion includes a first flexible circuit board, the first connecting unit, the second connecting unit, and the third connecting unit may not have connectors. For example, the first connecting unit, the second connecting unit, and the third connecting unit include bonding pins, and the first flexible circuit board is bonded to the bonding pins by bonding.

[0116] In some embodiments, at the point where the first flexible circuit board is bonded to the first connecting unit, the width of the first flexible circuit board is greater than the width of the first connecting unit in the direction perpendicular to the extension of the first flexible circuit board.

[0117] At the point where the first flexible circuit board is bonded to the second connecting unit, the width of the first flexible circuit board is greater than the width of the second connecting unit in the direction perpendicular to the extension of the first flexible circuit board.

[0118] At the point where the first flexible circuit board is bonded to the third connecting unit, the width of the first flexible circuit board is greater than the width of the third connecting unit in the direction perpendicular to the extension of the first flexible circuit board.

[0119] In some embodiments, as shown in FIG1, the display device further includes:

[0120] At least one second flexible circuit board 7; one end of the second flexible circuit board 7 is bonded to the first bonding area NA-2, and the other end of the second flexible circuit board 7 is bonded to the first printed circuit board 2; that is, the second flexible circuit board 7 is bonded to the display panel 1 and the first printed circuit board 2 on the back of the display panel 1.

[0121] The orthographic projection of the second flexible circuit board 7 on the back side 1-2 overlaps with the area between the first bonding area NA-2 and the first printed circuit board 2 on the back side 1-2.

[0122] In some embodiments, as shown in FIG1, the second flexible circuit board 7 corresponds one-to-one with the first bonding area NA-2. FIG1 illustrates an example of a display device including three second flexible circuit boards 7 and three first bonding areas NA-2. In specific implementations, the number of second flexible circuit boards 7 and first bonding areas NA-2 can be set according to the size of the display device, etc.

[0123] In some embodiments, as shown in FIG1, the display panel 1 further includes at least one second bonding area NA-3; the display device further includes at least one third driving unit SDIC; the third driving unit SDIC corresponds one-to-one with the second bonding area NA-3, and the third driving unit SDIC is bonded to the display panel 1 in the second bonding area NA-3. FIG1 illustrates an example of a display device including three second bonding areas NA-3 and three third driving units SDIC. For example, the third driving unit is an integrated circuit chip. The third driving unit is used to generate display driving signals according to the signals of the first printed circuit board and the second printed circuit board to drive the display panel to display.

[0124] In some embodiments, both the first bonding region and the second bonding region include a plurality of bonding pins; at least a portion of the bonding pins of the first bonding region are electrically connected to at least a portion of the bonding pins of the second bonding region.

[0125] The display functional layer also includes multiple fan-out lines, which extend to the second bonding area and are electrically connected to at least a portion of the bonding pins of the second bonding area;

[0126] The second flexible circuit board is bonded to the bonding pins of the first bonding area;

[0127] The third drive unit is bonded to the bonding pin of the second bonding area.

[0128] Since the second printed circuit board is electrically connected to the first printed circuit board, and the second flexible circuit board is electrically connected to the first printed circuit board, the signals from the second printed circuit board and the first printed circuit board can be transmitted to the display panel and the third driving unit through the second flexible circuit board.

[0129] In some embodiments, as shown in FIG5, the first printed circuit board 2 includes at least one third bonding region 205, the at least one third bonding region 205 being located at the edge of the first printed circuit board 2 toward the first bonding region (not shown);

[0130] The third bonding area 205, the first connection unit 202, the second connection unit 302, and the third connection unit 801 each include multiple bonding pins 12;

[0131] The second flexible circuit board (not shown) corresponds one-to-one with the third bonding area 205, and the second flexible circuit board (not shown) is bonded to the bonding pin 12 of the third bonding area 20.

[0132] The first connection unit 202 has multiple bonding pins 12, including: a first bonding pin 1201, a second bonding pin 1202, a third bonding pin 1203, and multiple fourth bonding pins 1204;

[0133] The second connection unit 302 includes multiple bonding pins 12, including: a fifth bonding pin 1205, a sixth bonding pin 1206, a seventh bonding pin 1207, and an eighth bonding pin 1208.

[0134] The multiple connecting leads 11 include: a first level lead 1101, a second level lead 1102, a first control lead 1103, a first input lead 1104, and multiple second control lines 1105;

[0135] The two ends of the first level lead 1101 are electrically connected to the first bonding pin 1201 and the fifth bonding pin 1205, respectively; the two ends of the second level lead 1102 are electrically connected to the second bonding pin 1202 and the sixth bonding pin 1206, respectively; the two ends of the first control lead 1103 are electrically connected to the third bonding pin 1203 and the seventh bonding pin 1207, respectively; the two ends of each second control line 1105 are electrically connected to the fourth bonding pin 1204 and the main board 8, respectively; the two ends of the first input lead 1104 are electrically connected to the eighth bonding pin 1208 and the main board 8, respectively.

[0136] The first printed circuit board 2 and the second printed circuit board 3 also include multiple traces 13;

[0137] Multiple bonding pins 12 of the second connection unit 302 are electrically connected to the light emission control power management unit ELPMIC via traces 13;

[0138] The multiple traces 13 of the first printed circuit board 2 include: a first level trace 1301 electrically connected to a first bonding pin 1201 and at least one bonding pin 12 of the third bonding area 20; a second level trace 1302 electrically connected to a second bonding pin 1202 and at least one bonding pin 12 of the third bonding area 20; a first control trace 1303 electrically connected to a third bonding pin 1203 and a timing controller TIC; a second control trace 1304 electrically connected to a fourth bonding pin 1204 and a timing controller TIC; and a third control trace 1305 electrically connected to a timing controller TIC and at least one bonding pin 12 of the third bonding area 20.

[0139] The motherboard 8 provides drive signals to the timing controller TIC through the second control line 1105, the fourth bonding pin 1204, and the second control line 1304, so that the timing controller TIC generates timing control signals and outputs them through the third control line 1305.

[0140] The motherboard 8 provides an input voltage signal VIN to the light-emitting control power management unit ELPMIC via the first input lead 1104 and the eighth bonding pin 1208. The light-emitting control power management unit ELPMIC generates a first light-emitting control level signal ELVDD and a second light-emitting control level signal ELVSS. The first light-emitting control level signal ELVDD is transmitted to the bonding pin 12 of the third bonding area 205 via the fifth bonding pin 1205, the first level lead 1101, the first bonding pin 1201, and the first level trace 1301. The second light-emitting control level signal ELVSS... The control level signal ELVSS is transmitted to the binding pin 12 of the third binding area 20 through the sixth binding pin 1206, the second level lead 1102, the second binding pin 1202, and the second level trace 1302. The timing controller TIC transmits the timing control signal SW to the light emission control power management unit ELPMIC through the first control trace 1303, the third binding pin 1203, the first control lead 1103, and the seventh binding pin 1207, so as to realize the effective control of the timing of the first light emission control level signal and the second light emission control level signal.

[0141] In some embodiments, as shown in FIG5, the first connection unit 202 further includes a ninth bonding pin 1209, and the first printed circuit board 2 further includes a first power trace 1306 and a second power trace 1307. The two ends of the first power trace 1306 are electrically connected to the ninth bonding pin 1209 and the logic power management unit LPMIC, respectively. The two ends of the second power trace 1307 are electrically connected to the logic power management unit LPMIC and the bonding pin 12 of the third bonding area 205, respectively. The multiple connection leads 11 further include a third control lead 1106 electrically connected to the ninth bonding pin 1209 and the motherboard 8. Thus, the motherboard 8 transmits power control signals to the logic power management unit LPMIC through the third control lead 1106, the ninth bonding pin 1209, and the first power trace 1306, so that the logic power management unit LPMIC generates a first power signal and outputs it through the second power trace 1307.

[0142] The first printed circuit board 2 also includes a third power trace 1308 and a fourth power trace 1309 electrically connected to the logic power management unit (LPMIC) and the timing controller (TIC). The LPMIC provides a high-level signal VDD and a low-level signal VC to the TIC via the third power trace 1308 and the fourth power trace 1309, respectively. The high-level signal VDD has a different voltage than the first light-emitting control signal ELVDD, and the low-level signal VC has a different voltage than the second light-emitting control signal ELVSS.

[0143] In some embodiments, as shown in Figures 1, 4, and 6 to 9, the orthographic projection of the second printed circuit board 3 on the back side 1-2 is located on the side of the first printed circuit board 2 on the back side 1-2 that is far from the orthographic projection of the first bonding area NA-2 on the back side 1-2.

[0144] The display device provided in this embodiment has sufficient space on the side of the first printed circuit board away from the first bonding area, and the second printed circuit board is disposed on the side of the first printed circuit board away from the first bonding area. This is more conducive to increasing the distance between the second driving unit of the second printed circuit board and the first driving unit of the first printed circuit board, improving the heat dissipation effect, and further reducing the temperature of the first driving unit and the second driving unit during operation.

[0145] It should be noted that in Figures 1, 4, and 6-9, the direction from top to bottom is the negative Y- of the second direction Y, and the direction from bottom to top is the positive Y+ of the second direction Y. The orthogonal projection of the first printed circuit board 2 on the back surface 1-2 is located on one side of the orthogonal projection of the first bonding area NA-2 on the back surface 1-2 in the negative Y- of the second direction Y, and the orthogonal projection of the second printed circuit board 3 on the back surface 1-2 is located on one side of the orthogonal projection of the first printed circuit board 2 on the back surface 1-2 in the negative Y- of the second direction Y.

[0146] In some embodiments, as shown in Figures 1, 4, and 6-9, the length of the first printed circuit board 2 in the first direction X is greater than the length of the first printed circuit board 2 in the second direction Y. That is, the edge of the first printed circuit board 2 extending along the first direction X is its longer side.

[0147] In some embodiments, as shown in FIG1, FIG4, FIG6 and FIG7, the second connecting unit 302 is located in the edge region of the second printed circuit board 3 near the first printed circuit board 2, and the length H1 of the second connecting unit 302 in the first direction X is greater than the length H2 of the second connecting unit 302 in the second direction Y.

[0148] The first connecting portion 4 includes at least a portion located on one side of the second connecting unit 302 in the second direction Y.

[0149] The display device provided in this embodiment has a second connecting unit whose length H1 in the first direction X is greater than its length H2 in the second direction Y. Specifically, the long side of the second connecting unit extends along the first direction X, and the long side of the second connecting unit is parallel to and opposite to the long side of the first printed circuit board. The first connecting portion includes at least a portion located on one side of the second connecting unit in the second direction Y, meaning the first connecting portion includes at least a portion extending along the second direction Y. Therefore, when the long side of the second connecting unit is parallel to and opposite to the long side of the first printed circuit board, the wiring difficulty of the first connecting portion can be reduced.

[0150] In some embodiments, as shown in FIG1 and FIG4, a portion of the orthographic projection of the first connecting portion 4 on the back surface 1-2 is located on the side of the orthographic projection of the second connecting unit 302 on the back surface 1-2 facing the orthographic projection of the first printed circuit board 2 on the back surface 1-2.

[0151] Outside the area where the first connecting part 4 is electrically connected to the first connecting unit 202, the orthographic projection of the first connecting part 4 on the back side 1-2 overlaps with the orthographic projection of the first printed circuit board 2 on the back side 1-2.

[0152] In some embodiments, as shown in Figures 1 and 4, when the motherboard 8 is located on the side of the display panel 1 in the positive Y+ direction of the second direction Y, i.e., when the motherboard 8 is located at the top of the figure, the first connecting part 4 also extends from the electrical connection point with the first connecting unit 202 and the electrical connection point with the second connecting unit 302 towards the positive Y+ direction of the second direction Y.

[0153] Alternatively, in some embodiments, as shown in Figures 6 and 7, a portion of the orthographic projection of the first connecting portion 4 onto the back surface 1-2 is located on the side of the orthographic projection of the second connecting unit 302 onto the back surface 1-2 that is far from the orthographic projection of the first printed circuit board 2 onto the back surface 1-2.

[0154] A portion of the orthographic projection of the first connecting part 4 on the back side 1-2 is located on the side of the orthographic projection of the first connecting unit 202 on the back side 1-2 that is far from the orthographic projection of the first binding area NA-2 on the back side 1-2.

[0155] Outside the area where the first connecting part 4 is electrically connected to the first connecting unit 202, the orthographic projection of the first connecting part 4 on the back side 1-2 does not overlap with the orthographic projection of the first printed circuit board 2 on the back side 1-2.

[0156] It should be noted that, regardless of whether the first connecting part includes the adapter cable assembly or the flexible circuit board, when the first connecting part passes through the first printed circuit board, it will cause the overall thickness of the display device to increase.

[0157] The display device provided in this embodiment of the present disclosure has a first connection portion that is electrically connected to the first connection unit. The orthographic projection of the first connection portion on the back side and the orthographic projection of the first printed circuit board on the back side do not overlap, thereby avoiding increasing the overall thickness of the display device and making it easier to achieve a thinner and lighter display device.

[0158] In some embodiments, as shown in Figures 6 and 7, when the motherboard 8 is located on the side of the display panel 1 in the negative Y- direction of the second direction Y, i.e., when the motherboard 8 is located at the bottom of the figure, the first connecting part 4 also extends from the electrical connection point with the first connecting unit 202 and the electrical connection point with the second connecting unit 302 towards the negative Y- direction of the second direction Y.

[0159] In some embodiments, as shown in Figures 8 to 9, the second connecting unit 302 is located in the edge region of the second printed circuit board 3 extending along the second direction Y, and the length H1 of the second connecting unit 302 in the first direction X is less than the length H2 of the second connecting unit 302 in the second direction Y.

[0160] The first connecting portion 4 includes: a portion located on one side of the second connecting unit 302 in the first direction X, and a portion located on the side of the first connecting unit 202 away from the first binding area NA-2 in the second direction Y;

[0161] In the area outside the region where the first connecting part 4 is electrically connected to the first connecting unit 202, the orthographic projection of the first connecting part 4 on the back side 1-2 does not overlap with the orthographic projection of the first printed circuit board 2 on the back side 1-2.

[0162] The display device provided in this embodiment has a second connecting unit whose length H1 in the first direction X is less than its length H2 in the second direction Y, i.e., the long side of the second connecting unit extends along the second direction Y. The first connecting portion includes a portion located on one side of the second connecting unit in the first direction X, i.e., a portion extending along the first direction X from the point of electrical connection with the second connecting unit. The first connecting portion also includes a portion located on the side of the first connecting unit away from the first bonding area in the second direction Y, i.e., a portion extending in the negative direction along the second direction from the point of electrical connection with the first connecting unit. In this way, outside the area of ​​electrical connection with the first connecting unit, the orthographic projection of the first connecting portion on the back side does not overlap with the orthographic projection of the first printed circuit board on the back side, thereby avoiding increasing the overall thickness of the display device and facilitating the thinning of the display device.

[0163] In some embodiments, as shown in Figures 8 to 9, the orthographic projection of the second printed circuit board 3 onto the back surface 1-2 is located in the edge region of the back surface 1-2 extending along the second direction Y.

[0164] It should be noted that, as shown in Figures 8 and 9, the orthographic projection of the second printed circuit board 3 on the back surface 1-2 located in the edge region of the back surface 1-2 extending along the second direction Y means that, in the first direction X, the distance between the second printed circuit board 3 and the first axis of symmetry 9 is greater than the distance between the second printed circuit board 3 and the edge of the back surface 1-2 extending along the second direction Y.

[0165] The display device provided in this embodiment has a second printed circuit board disposed on the edge region of the back of the display panel. The logic power management unit and the second printed circuit board are located on opposite sides of the first axis of symmetry and on opposite edge regions of the back of the display panel. This further increases the distance between the logic power management unit and the second printed circuit board, making the distance between the logic power management unit and the light-emitting control power management unit greater. This avoids the concentration of high-heat-generating devices, improves the heat dissipation efficiency of the logic power management unit and the light-emitting control power management unit, further avoids reliability issues caused by excessively high operating temperatures of the display device, and further enhances the user experience. Furthermore, the fact that the second printed circuit board is disposed on the edge region of the back of the display panel also allows for a wider blank area on the positive side of the first direction X, providing ample space for other structures of the display device and improving the overall space utilization of the display device.

[0166] In some embodiments, the distance between the second printed circuit board and its nearest back edge extending along the second direction Y is greater than or equal to 0.5 mm.

[0167] In some embodiments, as shown in FIG8, the motherboard 8 is located on the positive side of the display panel 1 in the first direction X. That is, the edge of the motherboard 8 located on the back side away from the second printed circuit board 3 and extending along the second direction Y is on the positive X+ side of the first direction X.

[0168] In some embodiments, as shown in FIG8, when the first connecting portion 4 includes the first flexible circuit board 6, the first connecting portion 4 includes: a first portion 401 electrically connected to the second connecting unit 302 and a third portion 403 electrically connected to the first connecting unit 202; the first portion 401 extends along the first direction X, and the third portion 403 extends along the second direction Y; the orthographic projection of the first portion 401 on the back surface 1-2 is located on the side of the orthographic projection of the third portion 403 on the back surface 1-2 away from the first bonding area NA-2, the first portion 401 is connected to the third portion 403, and the first portion 401 extends along the first direction X to the back surface 1-2 on the positive side of the first direction X and is electrically connected to the motherboard 8.

[0169] Alternatively, in some embodiments, as shown in FIG9, the motherboard 8 is located on the negative Y- side of the display panel 1 in the second direction Y.

[0170] In some embodiments, as shown in FIG9, when the first connecting portion 4 includes the first flexible circuit board 6, the first connecting portion 4 includes: a first portion 401 electrically connected to the second connecting unit 302 and a third portion 403 electrically connected to the first connecting unit 202; the first portion 401 extends along the first direction X, and the third portion 403 extends along the second direction Y; the orthographic projection of the first portion 401 on the back surface 1-2 is located on the side of the orthographic projection of the third portion 403 on the back surface 1-2 in the negative X- direction of the first direction X; the first portion 401 is connected to the third portion 403; and the third portion 403 extends along the second direction Y to the back surface 1-2 on the side of the negative Y- direction of the second direction Y and is electrically connected to the motherboard 8.

[0171] It should be noted that Figures 8 and 9 are illustrated using the example of the first connecting part 4 including the first flexible circuit board 6. When the first connecting part includes a connecting lead group, the extending direction of the connecting lead group is approximately the same as the extending direction of the first flexible circuit board, which will not be elaborated further here.

[0172] It should be noted that in Figure 8, the motherboard 8 is located on one side of the display panel in the first direction X, and in Figure 9, the motherboard 8 is located on one side of the display panel in the negative Y-direction of the second direction Y. Therefore, in the area outside the electrical connection between the first connecting part 4 and the first connecting unit 202, the orthogonal projection of the first connecting part 4 on the back side and the orthogonal projection of the first printed circuit board 2 on the back side 1-2 do not overlap, which helps to reduce the thickness of the display device. Of course, if it is necessary to set the motherboard on one side of the display panel in the negative Y-direction of the second direction Y, the first connecting part needs to include a portion extending along the negative Y-direction of the second direction Y. In the area outside the electrical connection between the first connecting part and the first connecting unit, the orthogonal projection of the first connecting part on the back side overlaps with the orthogonal projection of the first printed circuit board on the back side. Alternatively, the motherboard can be set on one side of the display panel in the negative X-direction of the first direction X, with the third part extending first towards the negative Y-direction of the second direction Y and then along the negative X-direction of the first direction X, passing through the area between the second printed circuit board and the first printed circuit board.

[0173] In some embodiments, as shown in Figures 10 to 12, the orthographic projection of the second printed circuit board 3 on the back surface 1-2 is located on one side of the orthographic projection of the first printed circuit board 2 on the back surface 1-2 in the first direction X.

[0174] The display device provided in this embodiment has a second driving unit, namely the light-emitting control power management unit, which is independent of the first printed circuit board. This allows for a reduction in the size of the first printed circuit board and the width of its long side. As a result, there is sufficient space on one side of the short side of the first printed circuit board to accommodate the second printed circuit board. This provides ample space for other structures of the display device on the side of the first and second printed circuit boards that are away from the first bonding area, which is beneficial for improving the overall space utilization of the display device.

[0175] In some embodiments, as shown in Figures 10-12, the orthographic projection of the second printed circuit board 3 on the back surface 1-2 is located on the side of the flash memory cell FL on the back surface 1-2 away from the orthographic projection of the timing controller TIC on the back surface 1-2 in the first direction X. That is, the orthographic projections of the second printed circuit board 3, the timing controller TIC first connection unit 202, and the logic power management unit LPMIC on the back surface 1-2 are arranged sequentially in the first direction X.

[0176] The display device provided in this embodiment has a second printed circuit board whose orthographic projection on the back side is located on the side of the flash memory cell's orthographic projection on the back side that is far from the timing controller's orthographic projection on the back side in the first direction X. This results in a greater distance between the light-emitting control power management unit and the timing controller in the second printed circuit board, and between the light-emitting control power management unit and the logic power management unit (LPMIC) in the second printed circuit board. This avoids the concentration of high-heat-generating devices, improves the heat dissipation efficiency of the logic power management unit and the light-emitting control power management unit, further avoids reliability issues caused by excessively high operating temperatures of the display device, and further enhances the user experience.

[0177] In some embodiments, as shown in Figures 10-12, the second connecting unit 302 is located in the edge region of the second printed circuit board 3 near the first printed circuit board 2. The length H1 of the second connecting unit 302 in the first direction X is less than the length H2 of the second connecting unit 302 in the second direction Y. That is, the long side direction of the second connecting unit 302 is the second direction Y, and the corresponding long side direction of the second printed circuit board 3 is the second direction Y, thereby avoiding increasing the size of the second printed circuit board 3 and the first printed circuit board 2 in the first direction X.

[0178] In some embodiments, as shown in FIG10-12, the first connecting portion 4 includes: a first portion 401 electrically connected to the second connecting unit 302 and a second portion 402 electrically connected to the first portion 401; the second portion 402 is located on the side of the first portion 401 away from the first binding area NA-2 in the second direction Y.

[0179] The orthographic projection of the first part 401 on the back side 1-2 overlaps with the orthographic projection of the first printed circuit board 2 on the back side 1-2, while the orthographic projection of the second part 402 on the back side 1-2 does not overlap with the orthographic projection of the first printed circuit board 2 on the back side 1-2.

[0180] In some embodiments, as shown in FIG10-12, the first connecting portion 4 further includes a third portion 403 electrically connected to the first connecting unit 202, wherein the second portion 402 is connected to the first portion 401 and the third portion 403 on the negative Y- side of the second direction Y; the first portion 401 extends along the positive X+ direction of the first direction X, and the third portion 403 extends along the negative Y- direction of the second direction Y.

[0181] In some embodiments, as shown in FIG10, the motherboard 8 is located on the negative X- side of the display panel 1 in the first direction X;

[0182] When the first connecting part 4 includes the first flexible circuit board 6, the second part 402 extends along the second direction Y and is electrically connected to the main board 8 located on the negative X- side of the display panel 1 in the first direction X.

[0183] In some embodiments, as shown in FIG11, the motherboard 8 is located on the positive X+ side of the display panel 1 in the first direction X;

[0184] When the first connecting part 4 includes the first flexible circuit board 6, the second part 402 extends along the second direction Y and is electrically connected to the main board 8 located on the positive X+ side of the display panel 1 in the first direction X.

[0185] In some embodiments, as shown in Figures 10 and 11, when the first connecting portion 4 includes the first flexible circuit board 6, the second portion 402 includes at least a strip-shaped portion extending along the first direction X.

[0186] In some embodiments, as shown in FIG12, the motherboard 8 is located on the negative Y- side of the display panel 1 in the second direction Y. When the first connecting portion 4 includes the first flexible circuit board 6, the second portion 402 is connected to the first portion 401 and the third portion 403 and extends along the negative Y- side of the second direction Y to be electrically connected to the motherboard 8 located on the negative Y- side of the display panel 1 in the second direction Y. The width of the second portion 402 on the side closer to the first portion 401 and the third portion 403 in the first direction X is greater than the width of the second portion 402 on the side closer to the motherboard 8 in the first direction X. The orthographic projection of the second portion 402 on the back surface 1-2 is an irregular pattern, and in the direction closer to the motherboard 8, the width of at least a portion of the second portion 402 in the first direction X decreases sequentially.

[0187] In the display device provided in this embodiment, when the motherboard is located on one side of the display panel in the first direction X or the negative direction of the second direction, the second part, which is connected to both the first part and the third part, can be located on the side of the first printed circuit board away from the bonding area. Thus, the second part and the first printed circuit board do not overlap, which is beneficial to reducing the overall thickness of the display device.

[0188] Of course, in actual implementation, when the motherboard needs to be positioned on one side of the display panel in the positive direction of the second direction, the second part, which is connected to both the first part and the third part, needs to extend to the positive side of the display panel in the second direction. In this case, the second part has an overlapping area with the first printed circuit board.

[0189] In some embodiments, as shown in Figures 13-15, when the orthographic projection of the first connecting portion 4 on the back surface 1-2 overlaps with the orthographic projection of the first printed circuit board 2 on the back surface 1-2, the orthographic projection of the first connecting portion 4 on the back surface 1-2 does not overlap with the orthographic projection of the first driving unit 201 on the back surface 1-2. Since the first driving unit 201 is relatively thick, the non-overlapping orthographic projections of the first connecting portion 4 on the back surface 1-2 and the first driving unit 201 on the back surface 1-2 allow the first connecting portion to avoid the area where the first driving unit is located. This helps to reduce the total thickness of the first connecting portion 4 and the first printed circuit board 2 while simultaneously requiring overlap, thereby reducing the overall thickness of the display device.

[0190] In some embodiments, as shown in Figures 13 and 14, the orthographic projection of the second printed circuit board 3 on the back side 1-2 is located on the side of the first printed circuit board 2 on the back side 1-2 that is far from the orthographic projection of the first bonding area NA-2 on the back side 1-2.

[0191] The first connecting part 4 includes: a first part 401 electrically connected to the second connecting unit 302, and a third part 403 electrically connected to the first connecting unit 202;

[0192] The orthographic projection of the third part 403 on the back side 1-2 and the orthographic projection of the first part 401 on the back side 1-2 both overlap with the orthographic projection of the first printed circuit board 2 on the back side 1-2. The orthographic projection of the third part 403 on the back side 1-2 is located on the side of the orthographic projection of the timing controller TIC on the back side 1-2 that is far away from the orthographic projection of the flash memory cell FL on the back side 1-2. The orthographic projection of the first part 401 on the back side 1-2 is located between the orthographic projection of the timing controller TIC on the back side 1-2 and the orthographic projection of the flash memory cell FL on the back side 1-2.

[0193] In some embodiments, as shown in FIG15, the orthographic projection of the second printed circuit board 3 on the back surface 1-2 is located on one side of the orthographic projection of the first printed circuit board 2 on the back surface 1-2 in the first direction X, and the first connecting portion 4 includes a first portion 401 electrically connected to the second connecting unit 302.

[0194] The first part 401 is projected onto the back side 1-2, with the flash memory cell FL projected onto the back side 1-2, facing the side of the second printed circuit board 3 projected onto the back side 1-2.

[0195] In some embodiments, as shown in Figures 13 and 14, when the orthographic projection of the first connecting portion 4 on the back surface 1-2 overlaps with the orthographic projection of the first printed circuit board 2 on the back surface 1-2,

[0196] The first printed circuit board 2 includes: at least one first recess 203; the first connection portion 4 is located within the first recess 203, and the orthographic projection of the first connection portion 4 on the back side 1-2 overlaps with the orthographic projection of the first printed circuit board 2 on the back side 1-2.

[0197] The display device provided in this embodiment has a first printed circuit board with a first groove. The thickness of the first printed circuit board in the area corresponding to the first groove is less than the thickness of the other areas. When the first connecting portion needs to overlap with the first printed circuit board, placing the first connecting portion that overlaps with the first printed circuit board in the first groove can reduce the total thickness of the first connecting portion and the first printed circuit board, thereby helping to reduce the overall thickness of the display device.

[0198] In some embodiments, as shown in Figures 13-15, the orthographic projection of the first groove 203 on the back surface 1-2 does not overlap with the orthographic projection of the second flexible circuit board 7 on the back surface 1-2. That is, the area where the first groove 203 is disposed avoids the second flexible circuit board 7, so as to avoid affecting the bonding yield of the second flexible circuit board 7 and the first printed circuit board 2.

[0199] In some embodiments, as shown in Figures 13 and 14, the orthographic projection of the second printed circuit board 3 on the back side 1-2 is located on the side of the first printed circuit board 2 on the back side 1-2 that is away from the orthographic projection of the first bonding area NA-2 on the back side 1-2.

[0200] The orthographic projection of the third part 403 on the back side 1-2 and the orthographic projection of the first part 401 on the back side 1-2 both overlap with the orthographic projection of the first printed circuit board 2 on the back side 1-2. The first printed circuit board 2 includes a first groove 203 corresponding to the third part 403 and a first groove 203 corresponding to the first part 401.

[0201] The first groove 203 corresponding to the third part 403 is projected onto the back side 1-2 on the side away from the projection of the timing controller TIC onto the back side 1-2. The projection of the first groove 203 corresponding to the first part 401 is located between the projection of the timing controller TIC onto the back side 1-2 and the projection of the flash memory cell FL onto the back side 1-2.

[0202] In some embodiments, as shown in FIG15, the orthographic projection of the second printed circuit board 3 on the back surface 1-2 is located on one side of the orthographic projection of the first printed circuit board 2 on the back surface 1-2 in the first direction X.

[0203] The first printed circuit board 2 includes a first groove 203 corresponding to the first portion 401. The orthographic projection of the first groove 203 corresponding to the first portion 401 on the back side 1-2 is located on the side where the orthographic projection of the flash memory cell FL on the back side 1-2 faces the orthographic projection of the second printed circuit board 3 on the back side 1-2.

[0204] It should be noted that Figure 15 illustrates the example of the motherboard 8 being located on one side of the display panel 1 in the positive X+ direction of the first direction X. When the motherboard is located on one side of the display panel in the negative X- direction of the first direction X, or when the motherboard is located on one side of the display panel in the negative Y- direction of the second direction Y, the orthogonal projection of the first groove 203 corresponding to the first part 401 on the back side 1-2 is still located on the side where the orthogonal projection of the flash memory cell FL on the back side 1-2 faces the orthogonal projection of the second printed circuit board 3 on the back side 1-2.

[0205] In some embodiments, as shown in FIG16, the first printed circuit board 2 includes: a multilayer conductive layer 14 and an insulating layer 15 located between the conductive layers 14.

[0206] The number of conductive layers 14 and insulating layers 15 included in the first printed circuit board 2 in the area of ​​the first groove 203 is less than the number of conductive layers 14 and insulating layers 15 included in the first printed circuit board 2 in the area outside the first groove 203.

[0207] It should be noted that Figure 16 uses a first printed circuit board 2 comprising three conductive layers 14 as an example for illustration. For instance, the first printed circuit board includes three layers of wiring. The area of ​​the first recess 203 in Figure 16 includes the first conductive layer 1401 and the second conductive layer 1402, but not the third conductive layer 1403. The area outside the first recess 203 includes the first conductive layer 1401, the second conductive layer 1402, and the third conductive layer 1403. On both sides of the area of ​​the first recess 203, the insulating layer 15 between the second conductive layer 1402 and the third conductive layer 1403 includes a first via 1501. The third conductive layer 1403 is electrically connected to the second conductive layer 1402 through the first via 1501 to achieve electrical connection between the conductive layers 14 on both sides of the area of ​​the first recess 203. In specific implementations, the number of conductive layers included in the first printed circuit board can be set according to actual needs. For example, the area outside the first recess of the first printed circuit board may include 8 conductive layers, and the area within the first recess of the first printed circuit board may include 6 conductive layers; alternatively, the area outside the first recess of the first printed circuit board may include 6 conductive layers, and the area within the first recess of the first printed circuit board may include 4 conductive layers. In a specific implementation, the conductive layers not included in the area of ​​the first recess are electrically connected to the underlying conductive layer on both sides of the first recess through vias penetrating the insulating layer.

[0208] In some embodiments, the distance between the first printed circuit board and the second printed circuit board is greater than or equal to 1 mm.

[0209] The display device provided in this disclosure includes any product or component with a display function, such as a mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame, or navigator. Other essential components of this display device are understood by those skilled in the art and will not be described in detail here, nor should they be construed as limiting this disclosure.

[0210] In summary, the display device provided in this embodiment has at least one first driving unit and at least one second driving unit located on different printed circuit boards. The layout space of the first driving unit and the second driving unit on their respective printed circuit boards is sufficient, and the heat dissipation effect is good. This avoids the problem of limited layout space affecting heat dissipation caused by integrating the first driving unit and the second driving unit on a single printed circuit board. It can reduce the temperature of the first driving unit and the second driving unit during operation, avoid reliability issues caused by excessive temperature of the first driving unit and the second driving unit, and improve the user experience.

[0211] Although preferred embodiments of the invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including both the preferred embodiments and all changes and modifications falling within the scope of the invention.

[0212] Obviously, those skilled in the art can make various modifications and variations to this disclosure without departing from its spirit and scope. Therefore, if such modifications and variations fall within the scope of the claims of this disclosure and their equivalents, this disclosure is also intended to include such modifications and variations.

Claims

1. A display device, wherein, The display device includes: Display panel; A first printed circuit board is electrically connected to the display panel; the first printed circuit board includes: at least one first driving unit and a first connection unit electrically connected to the display panel; The second printed circuit board includes: at least one second driving unit, and a second connection unit electrically connected to the at least one second driving unit; The first connecting part is electrically connected to the first connecting unit and the second connecting unit.

2. The display device according to claim 1, wherein, The display panel has a front and a back, and the front is the light-emitting surface of the display panel; The display panel includes: a display area, at least one first bonding area, and a bent area located between the display area and the at least one first bonding area; the bent area is bent along a bending axis such that the first bonding area is located on the back side; the bending axis extends along a first direction; The first printed circuit board and the second printed circuit board are attached to the back side, and the orthographic projections of the first printed circuit board and the second printed circuit board on the back side are located on the same side of the orthographic projection of the first bonding area on the back side in the second direction, and the first direction intersects the second direction.

3. The display device according to claim 2, wherein, The orthographic projection of the second printed circuit board on the back side is located on the side of the orthographic projection of the first printed circuit board on the back side that is away from the orthographic projection of the first bonding area on the back side.

4. The display device according to claim 3, wherein, The second connecting unit is located on the edge region of the second printed circuit board near the first printed circuit board, and the length of the second connecting unit in the first direction is greater than the length of the second connecting unit in the second direction; The first connecting portion includes at least a portion located on one side of the second connecting unit in the second direction.

5. The display device according to claim 4, wherein, A portion of the orthographic projection of the first connecting portion on the back side is located on the side of the orthographic projection of the second connecting unit on the back side facing the orthographic projection of the first printed circuit board on the back side. Outside the area where the first connecting portion is electrically connected to the first connecting unit, the orthographic projection of the first connecting portion on the back surface overlaps with the orthographic projection of the first printed circuit board on the back surface.

6. The display device according to claim 4, wherein, The portion of the first connecting part in the orthographic projection on the back side is located on the side of the second connecting unit in the orthographic projection on the back side that is away from the orthographic projection of the first printed circuit board on the back side. A portion of the orthographic projection of the first connecting portion on the back side is located on the side of the orthographic projection of the first connecting unit on the back side that is far from the orthographic projection of the first binding area on the back side. Outside the area where the first connecting portion is electrically connected to the first connecting unit, the orthographic projection of the first connecting portion on the back side and the orthographic projection of the first printed circuit board on the back side do not overlap.

7. The display device according to claim 3, wherein, The second connection unit is located in the edge region of the second printed circuit board extending along the second direction, and the length of the second connection unit in the first direction is less than the length of the second connection unit in the second direction; The first connecting portion includes: a portion located on one side of the second connecting unit in the first direction, and a portion located on the side of the first connecting unit away from the first binding area in the second direction; In the area outside the region where the first connecting part is electrically connected to the first connecting unit, the orthographic projection of the first connecting part on the back side and the orthographic projection of the first printed circuit board on the back side do not overlap.

8. The display device according to claim 7, wherein, The orthographic projection of the second printed circuit board on the back side is located in the edge region of the back side extending along the second direction.

9. The display device according to claim 2, wherein, The orthographic projection of the second printed circuit board on the back side is located on one side of the orthographic projection of the first printed circuit board on the back side in the first direction.

10. The display device according to claim 9, wherein, The second connection unit is located in the edge region of the second printed circuit board near the first printed circuit board, and the length of the second connection unit in the first direction is less than the length of the second connection unit in the second direction.

11. The display device according to claim 10, wherein, The first connecting portion includes: a first part electrically connected to the second connecting unit and a second part electrically connected to the first part; the second part is located on the side of the first part away from the first binding area in the second direction; The orthographic projection of the first portion on the back surface overlaps with the orthographic projection of the first printed circuit board on the back surface, while the orthographic projection of the second portion on the back surface does not overlap with the orthographic projection of the first printed circuit board on the back surface.

12. The display device according to claim 5 or 11, wherein, The first printed circuit board includes: at least one first groove; and an area in which the orthographic projection of the first connection portion on the back surface overlaps with the orthographic projection of the first printed circuit board on the back surface, wherein the first connection portion is located within the first groove.

13. The display device according to claim 12, wherein, The first printed circuit board includes: multiple conductive layers and at least an insulating layer located between the conductive layers; The number of conductive layers and insulating layers included in the first printed circuit board in the region of the first recess is less than the number of conductive layers and insulating layers included in the first printed circuit board in the region outside the first recess.

14. The display device according to any one of claims 1 to 13, wherein, At least one first driving unit includes: a timing controller; the first printed circuit board further includes: at least one first trace electrically connected to the timing controller and the first connection unit; The first connection unit is located on one side of the timing controller in a first direction.

15. The display device according to claim 14, wherein, At least one first drive unit further includes: The logic power management unit is located on the side of the first connection unit away from the timing controller in the first direction.

16. The display device according to claim 15, wherein, The first printed circuit board has a first axis of symmetry extending along a second direction; The logic power management unit is located on one side of the first axis of symmetry in the positive direction of the first direction; At least a portion of the timing controller is located on one side of the first axis of symmetry in the negative direction of the first direction.

17. The display device according to claim 16, wherein, The orthographic projection of the logic power management unit on the back and the orthographic projection of the second printed circuit board on the back are respectively located on both sides of the first axis of symmetry.

18. The display device according to claim 16 or 17, wherein, At least one first drive unit further includes: The flash memory cell is located on the side of the timing controller away from the first connection unit in the first direction.

19. The display device according to claim 18, wherein, The orthographic projection of the second printed circuit board on the back side is located on the side of the orthographic projection of the first printed circuit board on the back side that is away from the orthographic projection of the first bonding area on the back side; the first connection portion includes: a first part electrically connected to the second connection unit, and a third part electrically connected to the first connection unit; The orthographic projection of the third part on the back surface and the orthographic projection of the first part on the back surface both overlap with the orthographic projection of the first printed circuit board on the back surface. The orthographic projection of the third part on the back surface is located on the side of the orthographic projection of the timing controller on the back surface that is away from the orthographic projection of the flash memory cell on the back surface. The orthographic projection of the first part on the back surface is located between the orthographic projection of the timing controller on the back surface and the orthographic projection of the flash memory cell on the back surface.

20. The display device according to claim 18, wherein, The orthographic projection of the second printed circuit board on the back side is located on one side of the orthographic projection of the first printed circuit board on the back side in the first direction, and the first connection portion includes a first part that is electrically connected to the second connection unit. The orthographic projection of the first portion on the back side is located on the side where the orthographic projection of the flash memory cell on the back side faces the orthographic projection of the second printed circuit board on the back side.

21. The display device according to any one of claims 1 to 19, wherein, The display device further includes a motherboard; the first connecting part is also electrically connected to the motherboard.

22. The display device according to any one of claims 1 to 20, wherein, The first connection part includes an adapter lead group, which includes multiple connecting leads. At least a portion of the multiple connecting leads have their two ends electrically connected to the first connection unit and the second connection unit, respectively. Alternatively, the first connection portion includes a first flexible circuit board, the first flexible circuit board including a plurality of connection leads, at least a portion of the plurality of connection leads having both ends electrically connected to the first connection unit and the second connection unit respectively.

23. The display device according to any one of claims 2 to 22, wherein, The display device further includes: At least one second flexible circuit board; one end of the second flexible circuit board is bonded to the first bonding area, and the other end of the second flexible circuit board is bonded to the first printed circuit board; the orthographic projection of the second flexible circuit board on the back surface overlaps with the orthographic projection of the area between the first bonding area and the first printed circuit board on the back surface.

Images