Pressure touch-control panel and electronic device
By adopting a pressure touchpad structure in laptop touchpads, utilizing a touch film and pressure sensor, and combining it with connection lines fabricated by photolithography etching, the problems of large thickness and large touch blind area of existing touchpads are solved, achieving a thinner and lighter design and a high-performance touch experience.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- SHENZHEN GOODIX TECH CO LTD
- Filing Date
- 2025-01-15
- Publication Date
- 2026-07-23
AI Technical Summary
Existing laptop touchpads have thick and expensive PCB boards, large touch blind spots, and cannot achieve a good user experience, making it difficult to meet the requirements of thinness and lightness and high performance.
The pressure touch panel structure includes a touch film, a pressure sensor, and a circuit board. The touch film consists of a film substrate, a touch pattern, a pad portion, and connecting lines. It is prepared by photolithography or etching processes. The connecting lines are directly connected to the touch pattern or connected through overlapping parts. The materials used are Cu, Al, Ag, and their alloys, with a thickness between 3μm and 12.5μm, to achieve high-sensitivity touch response.
The size of the non-touch area has been reduced, the touch blind zone has been decreased, and touch performance and user experience have been improved, resulting in an ultra-thin and high-performance touch solution.
Smart Images
Figure CN2025072514_23072026_PF_FP_ABST
Abstract
Description
Pressure touchpad and electronic devices Technical Field
[0001] This application relates to the field of touch technology, specifically to a pressure touchpad and electronic device. Background Technology
[0002] Currently, all touchpads in laptops are printed circuit boards (PCBs). PCBs are thick and expensive, and their large touch blind spots hinder a good user experience. With increasingly compact internal spaces in electronic products and growing user demands for multifunctional experiences, the development of touchpads towards thinner, lighter, and higher-performance designs is extremely urgent. Therefore, developing new ultra-thin, high-performance touch solutions is of great significance. Summary of the Invention
[0003] In view of the above problems, this application provides a pressure touchpad and electronic device to solve the above technical problems.
[0004] In a first aspect, embodiments of this application provide a pressure touch panel, comprising: a touch film for detecting touch operations applied to the upper surface of a cover and generating touch signals; a pressure sensor for detecting pressing operations applied to the upper surface of the cover and generating pressure signals; and a circuit board for processing touch signals and pressure signals; wherein the touch film comprises: a film substrate including a touch area and a non-touch area disposed outside the touch area; a touch pattern disposed on the touch area of the film substrate; and pads disposed on the non-touch area of the film substrate. Control area; connecting lines for connecting touch patterns to pad portions; if the connecting lines are directly connected to the touch patterns, the connecting lines include: a trace with one end connected to the touch pattern and the other end connected to the side of the pad closest to the touch image; and / or a trace with one end connected to the touch pattern and the other end connected to the side of the pad furthest from the touch pattern; if the connecting lines are connected to the touch patterns through overlaps, and the pad portions are arranged between multiple overlaps, the connecting lines include: a trace with one end connected to the overlap and the other end connected to the side of the pad furthest from the touch pattern.
[0005] In some embodiments, the touch pattern, connection lines, and pads are made of the same material.
[0006] In some embodiments, the touch pattern, connection lines, and pad portions include one of Cu, Al, Ag, and their alloys.
[0007] In some embodiments, the thickness of the touch pattern, connection lines, and pad portions is between 3 μm and 12.5 μm, so that their sheet resistance is between 0.0001 Ω and 0.08 Ω.
[0008] In some embodiments, the connecting lines and the touch pattern are made of different materials, wherein: the touch pattern includes Cu, and the connecting lines and pad portions are not Cu, wherein the thickness of the touch pattern is between 0.1 μm and 2 μm so that its sheet resistance is less than 450 Ω; or the touch pattern includes indium tin oxide (ITO), and the connecting lines and pad portions include at least one of Cu, Al, Ag and their alloys.
[0009] In some embodiments, the film substrate is a polyethylene terephthalate (PET) substrate, a polyimide (PI) substrate, or a polyethylene naphthalate (PEN) substrate, with a thickness between 12.5 μm and 100 μm.
[0010] In some embodiments, the touch pattern and connection lines are obtained by photolithography or etching of the metal film in the touch area on the film substrate; and / or the pad portion is obtained by photolithography or etching of the metal film in the non-touch area on the film substrate.
[0011] In some embodiments, the film substrate includes a plurality of through holes in a non-touch area on a first side of the film substrate, and conductive material is disposed in the through holes; a first connection line formed on a first surface of the film substrate near the cover plate, and a first touch pattern formed on the first surface of the film substrate is electrically connected to a first pad portion formed on a second surface of the film substrate through the through holes.
[0012] In some embodiments, the first pad portion is arranged directly above the via and overlaps with the via.
[0013] In some embodiments, each through-hole includes at least two sub-through-holes with a diameter greater than or equal to 0.1 mm.
[0014] In some embodiments, a second connection line formed on a second surface of the film substrate away from the cover plate connects a second touch pattern formed on the second surface of the film substrate to a second pad portion formed on the second surface of the film substrate, the second pad portion being located on a second side of the film substrate.
[0015] In some embodiments, a third pad portion overlapping with the through hole is further arranged on the first surface of the film substrate, and the first connection line is electrically connected to the through hole through the third pad portion.
[0016] In some embodiments, the pressure touchpad further includes: a first flexible printed circuit (FPC) board connected between the circuit board and the first pad portion, for transmitting touch signals sensed by the first touch pattern to the circuit board; and a second flexible printed circuit board connected between the circuit board and the second pad portion, for transmitting drive signals generated by the circuit board to the second touch pattern. Optionally, the first and second flexible printed circuit boards are welded to the pad portion by laser spot welding or hot pressing welding, or are pressed to the pad portion by anisotropic conductive film (ACF).
[0017] In some embodiments, the touch film further includes an organic solderability protectant film formed on at least one of the touch pattern, connection lines, and pad portions.
[0018] In some embodiments, the touch film further includes a shielding film, which is attached to the touch area of the film substrate away from the cover plate via an adhesive layer and is located on the organic solderability protective film.
[0019] In some embodiments, the shielding film includes an indium tin oxide (ITO) film with a thickness between 25 μm and 125 μm; the adhesive layer includes optically clear adhesive (OCA) with a thickness between 5 μm and 125 μm.
[0020] In some embodiments, the touch film further includes an insulating layer formed on the film substrate and covering at least the connection lines and touch patterns that overlap with the flexible printed circuit board.
[0021] In some embodiments, the insulating layer comprises ultraviolet (UV) insulating ink with a thickness between 5 μm and 15 μm.
[0022] In some embodiments, the line width of the connection lines is between 5 μm and 50 μm, and the minimum line spacing between adjacent connection lines is between 5 μm and 50 μm.
[0023] In some embodiments, the width of each pad in the pad portion is greater than or equal to 0.2 mm, and the length is less than or equal to 7 mm; the distance between adjacent pads is greater than or equal to 0.2 mm.
[0024] In some embodiments, the distance between adjacent touch patterns is between 4 mm and 7 mm.
[0025] In some embodiments, the touch film further includes an electrostatic protection ring ground structure disposed on a first surface of the film substrate near the cover plate and / or a second surface away from the cover plate, and surrounding the connection lines, touch patterns and pad portions. The electrostatic protection ring ground structure is electrically connected to the pad portions to isolate static electricity acting on the touch film.
[0026] In some embodiments, the thickness of the touch film is greater than or equal to 0.103 mm.
[0027] Thirdly, embodiments of this application also provide an electronic device, including a device body and the aforementioned pressure touch panel disposed on the device body.
[0028] The technical solution provided in this application can reduce the size of the non-touch area, reduce the touch blind zone, and achieve better touch performance and user experience.
[0029] These or other aspects of this application will become more apparent from the description of the following embodiments. Attached Figure Description
[0030] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0031] Figure 1 shows a schematic diagram of the structure of an electronic device to which the technical solutions of the embodiments of this application are applicable.
[0032] Figure 2 shows a schematic diagram of the structure of a touch device to which the technical solutions of the embodiments of this application can be applied.
[0033] Figure 3 shows an exploded view of a pressure touchpad according to an embodiment of this application.
[0034] Figure 4 shows a schematic diagram of the first surface of the touch film provided in an embodiment of this application.
[0035] Figure 5 shows a schematic diagram of the second surface of the touch film provided in an embodiment of this application.
[0036] Figure 6A shows a schematic diagram of another wiring method on the first surface of the touch film provided in the embodiment of this application.
[0037] Figure 6B shows a schematic diagram of another wiring method for the second surface of the touch film provided in the embodiment of this application.
[0038] Figure 7 shows a schematic diagram of the wiring method of the touch film including the overlapping portion provided in the embodiment of this application.
[0039] Figure 8 shows a projection and a partial magnified view of an exemplary touch pattern.
[0040] Figure 9 shows a cross-sectional view of the touch film provided in an embodiment of this application.
[0041] Figure 10A shows a schematic cross-sectional view of the interconnection between the touch film and the FPC board provided in the embodiment of this application via through-hole pads.
[0042] Figure 10B shows a schematic cross-sectional view of the interconnection between the touch film and the FPC board provided in the embodiment of this application via surface mount pads.
[0043] Figure 10C shows a schematic cross-sectional view of the interconnection between the touch panel and the FPC board provided in the embodiment of this application via ACF.
[0044] Figure 11 shows a flowchart of a manufacturing method for interconnecting a touch film and an FPC board via through-hole pads according to an embodiment of this application.
[0045] Figure 12 shows a flowchart of a manufacturing method for interconnecting a touch film and an FPC board via surface mount pads according to an embodiment of this application.
[0046] Figure 13 shows a flowchart of the manufacturing method of interconnecting the touch film and FPC board via ACF according to an embodiment of this application. Detailed Implementation
[0047] The embodiments of this application are described in detail below. Examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application.
[0048] To enable those skilled in the art to better understand the solutions of this application, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.
[0049] In the embodiments of this application, it should be noted that, in this document, relational terms such as first and second are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations.
[0050] Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.
[0051] In the description of the embodiments of this application, the words "example" or "for example" are used to indicate exemplification, illustration, or description. Any embodiment or design described as "example" or "for example" in the embodiments of this application is not to be construed as being more preferred or having more advantages than another embodiment or design. The use of the words "example" or "for example" is intended to present relative concepts in a clear manner.
[0052] Furthermore, in the embodiments of this application, "multiple" refers to two or more. Therefore, in the embodiments of this application, "multiple" can also be understood as "at least two". "At least one" can be understood as one or more, such as one, two, or more. For example, including at least one means including one, two, or more, and is not limited to which ones are included. For example, including at least one of A, B, and C, then it could include A, B, C, A and B, A and C, B and C, or A and B and C.
[0053] It should be noted that in the embodiments of this application, "and / or" describes the relationship between associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, or B existing alone. In addition, the character " / ", unless otherwise specified, generally indicates that the associated objects before and after it are in an "or" relationship.
[0054] It should be noted that in the embodiments of this application, "connection" can be understood as electrical connection. The connection between two electrical components can be a direct or indirect connection between the two electrical components. For example, the connection between A and B can be a direct connection between A and B, or an indirect connection between A and B through one or more other electrical components.
[0055] In the circuit structure provided by the embodiments of this application, nodes such as the first node and the second node do not represent actual existing components, but rather represent the junction points of related couplings in the circuit diagram. In other words, these nodes are equivalent to the junction points of related couplings in the circuit diagram.
[0056] Figure 1 illustrates a schematic diagram of the structure of an electronic device to which the technical solutions of the embodiments of this application are applicable. Referring to Figure 1, the typical hardware structure of the electronic device 100 may include: a processor 101, a memory 102, a radio device 103, an audio output unit 104, an A / V input unit 105, a display unit 106, a user input unit 107, an interface unit 108, and a power supply 109. It should be understood that Figure 1 is only an exemplary illustration of the embodiments of this application and is not intended to limit the electronic device 100.
[0057] Display unit 106 includes various types of display panels capable of displaying visual graphics, such as a graphical user interface (GUI). User input unit 107 may include a keyboard, mouse, etc. Audio output unit 104 includes speakers, etc. A / V input unit 105 includes an image processor 1051 and a microphone 1052.
[0058] The memory 102 can store data and instructions that can be executed on the processor 101, including an operating system 111, etc. Referring to Figure 1, the memory 102 stores one or more application programs 110. The one or more application programs 110 include weather, instant messaging, telephone, text messaging, email, or stock information, etc.
[0059] Please continue referring to Figure 1. In this embodiment, the electronic device 100 also includes a touchpad 120. The touchpad 120 can detect touch operations and press operations, and generate vibration feedback based on touch operations and / or press operations. Specifically, in a laptop computer, the touchpad 120 can precisely control the position of the cursor on the display unit 106 through the sliding operation of a finger or stylus. For example, when editing a document, the cursor can be moved precisely to a specified text paragraph, facilitating operations such as inserting, deleting, and modifying text; in graphic design software, the cursor can also be accurately positioned to the graphic element that needs to be drawn or modified, just as accurately as moving the cursor with a mouse, only the operation method is more direct, achieving the corresponding displacement by sliding the finger on the surface of the touchpad 120. In some implementations, the right or left click operation of a mouse can also be simulated by lightly pressing the area below the touchpad 120 or by using a single finger to click the surface of the touchpad. In daily use, operations such as opening application icons on the desktop and selecting files or folders can be completed using this simulated right-click or left-click function, achieving the same effect as clicking with a mouse.
[0060] Figure 2 shows a schematic diagram of a touch device to which the technical solution of this application embodiment can be applied. The touch device 200 can be an external touch panel. As shown in Figure 2, the touch device 200 includes a touch module 210 and a communication interface 220. The touch module 210 is used to detect touch operations and press operations, and generate vibration feedback based on touch operations and / or press operations. The communication interface 220 is used to communicate with external electronic devices such as personal computers and tablets to use the touch device 200 as an external touch input device for electronic devices (such as the electronic device 100 shown in Figure 1). The communication interface 220 can include, but is not limited to, wired interfaces such as Universal Serial Bus (USB) interfaces, and can also include wireless interfaces such as Bluetooth, ZigBee, and Wi-Fi. In some implementations, the touch device 200 may also include a rechargeable battery (not shown in Figure 2) for powering the touch module 210 and the communication interface 220. In some implementations, the USB interface can transmit power from electronic devices and other devices.
[0061] In related technologies, both the touchpad 120 and the touch device 200 are printed circuit boards (PCBs), with the touch layer and device layer integrated on a single PCB. PCBs are thick and expensive, and their large touch blind spots hinder a good user experience. With increasingly compact internal spaces in electronic products and growing user demands for multifunctional experiences, the development of touchpads towards thinner, lighter, and higher-performance designs is extremely urgent. Therefore, developing new ultra-thin and high-performance touch solutions is of great significance. To this end, this application provides a pressure-sensitive touchpad that can be applied to the touchpad 120 shown in Figure 1 or the touch device 200 shown in Figure 2.
[0062] Referring to Figure 3, the pressure touchpad provided in this embodiment includes: a cover plate 301, a touch film 310, a pressure sensor 320, a vibration mechanism 330, and a circuit board 340. The cover plate 301 may include composite materials such as glass, plastic, or glass fiber reinforced plastic. The touch film 310 is mounted on the lower surface of the cover plate 301 and is fixed to the lower surface of the cover plate 301 by an adhesive layer 302 such as double-sided adhesive. The touch film 310 is used to detect touch operations applied to the upper surface of the cover plate 301 and generate touch signals. Touch operations can be generated by fingers, styluses, etc. The shape and size of the touch film 310 are adapted to the cover plate 301. Specifically, if the cover plate 301 is rectangular, the length and width of the touch film 310 are substantially equal to those of the cover plate 301. The pressure sensor 320 is used to detect pressing operations applied to the upper surface of the cover plate 301 and generate pressure signals. The vibration mechanism 330 is used to generate vibration feedback. The circuit board 340 is electrically connected to the touch film 310, the pressure sensor 320 and the vibration mechanism 330, and is used to process touch signals, pressure signals and control the vibration mechanism 330.
[0063] In practical implementation, the larger the proportion of the effective touch area of the cover plate 301, the better; correspondingly, the larger the proportion of the effective touch area of the touch film 310, the better, i.e., the smaller the touch blind area, the better. To this end, this application provides a touch film, as shown in Figures 4 to 7, including: a film substrate 400, a touch pattern 410, a pad portion 420, and connecting lines 430. The film substrate 400 includes a touch area (also called the effective touch area) and a non-touch area (also called the ineffective touch area, non-effective touch area), with the non-touch area arranged outside the touch area. The connecting lines 430 connect the touch pattern 410 to the pad portion 420. The pad portion 420 includes multiple pads, and multiple connecting lines 430 connect multiple touch patterns 410 to corresponding pads.
[0064] In some embodiments, the connection line 430 is directly connected to the touch pattern 410, i.e., there is no overlap between the connection line 430 and the touch pattern 410. The connection line 430 includes: a trace with one end connected to the touch pattern and the other end connected to the side of the pad closest to the touch image; and / or a trace with one end connected to the touch pattern and the other end connected to the side of the pad furthest from the touch pattern. Specifically, as shown in Figures 4 and 5, the pads in the pad portion 420 are concentrated. Some pads are adjacent to the touch pattern 410 they are connected to, specifically the touch pattern in the middle of the short side direction in Figure 4 and the touch pattern in the middle of the long side direction in Figure 5; some pads are farther from the touch pattern 410 they are connected to, specifically the touch patterns on both sides of the short side direction in Figure 4 and the touch patterns on both sides of the long side direction in Figure 5. When a pad in the pad portion 420 is adjacent to its corresponding touch pattern 410, one end of the trace is connected to the touch pattern 410, and the other end is connected to the side of the pad closest to the touch pattern 410. When the pad portion 420 is far from the touch pattern 410 it is connected to, one end of the trace is connected to the touch pattern 410, and the other end is connected to the side of the pad away from the touch pattern 410. Taking the short side of the touch film as an example, as shown in Figure 4, a dashed line BB' is drawn at the center of the third pad portion 420c. The upper side of the dashed line BB' is the side of the third pad portion 420c away from the touch pattern 410, and the lower side of the dashed line BB' is the side of the third pad portion 420c closer to the touch pattern 410. Furthermore, referring to Figures 6A and 6B, compared to the routing methods in Figures 4 and 5, in Figures 6A and 6B, all traces in the connecting line 430 are connected to the side of the pad portion 420 closer to the touch pattern 410. Using this embodiment, the connecting line 430 is directly connected to the touch pattern 410, with no overlap between them, which reduces the non-touch area and lowers the touch blind zone.
[0065] Preferably, the touch pattern 410, the pad portion 420, and the connecting line 430 are made of the same material to achieve better connection performance without overlap. Optionally, the touch pattern 410, the pad portion 420, and the connecting line 430 may be made of Cu, Al, Ag, or their alloys, which can meet the conductivity requirements of the touch pattern 410 and the connecting line 430, achieving high-sensitivity touch response, reducing attenuation and delay during signal transmission, and improving the response speed of touch detection. Further, the thickness of the touch pattern 410, the pad portion 420, and the connecting line 430 is between 3 μm and 12.5 μm, so that its sheet resistance is between 0.0001 Ω and 0.08 Ω. In this case, the touch pattern 410 can sensitively detect touch operations, and the connecting line 430 can transmit touch signals with less attenuation and delay, achieving high-performance touch detection and signal transmission. In some implementations, the touch pattern 410, the connecting line 430, and the pad portion 420 may be made of Al, with a thickness between 3 μm and 12.5 μm, preferably 6 μm, and a sheet resistance between 0.0001 Ω and 0.08 Ω. In some implementations, the touch pattern 410, the connecting line 430, and the pad portion 420 may be made of Ag, with a thickness between 3 μm and 12.5 μm, preferably 6 μm, and a sheet resistance between 0.0001 Ω and 0.08 Ω. In some implementations, the touch pattern 410, the connecting line 430, and the pad portion 420 may be made of Cu, specifically rolled Cu or electrolytic Cu, with a thickness between 3 μm and 12.5 μm, preferably 6 μm, and a sheet resistance between 0.0001 Ω and 0.08 Ω.
[0066] In practical implementation, the touch pattern 410, the pad portion 420, and the connecting lines 430 can be obtained by laser etching of a metal film located in the non-touch area of the film substrate 400. This metal film can be one of Cu, Al, Ag, or their alloys. Laser etching offers high processing precision, achieving micron- or even nanometer-level accuracy. It can precisely determine the etching position with micron-level positioning accuracy, enabling the etching of connecting lines with low line spacing and width. It also offers high processing flexibility, allowing for the etching of various complex graphics and patterns according to different design requirements, without being limited by the shape or complexity of the graphics. Whether it's a straight line, curve, circle, or irregular shape, it can be accurately etched, making the connecting line routing flexible and allowing the shape of the touch pattern to be set according to product needs. Furthermore, it offers fast etching speed, enabling the completion of large-area etching tasks in a short time, meeting the needs of large-scale production.
[0067] In some embodiments, the pad portion 420 can be obtained by photolithography or etching of the metal film in the non-touch area on the film substrate 400. In specific embodiments, photolithography may include photolithography, and etching may include laser etching. In a typical embodiment, the touch pattern 410, the pad portion 420, and the connection line 430 are obtained by laser etching of the metal film on the film substrate 400.
[0068] In some embodiments, as shown in FIG7, the connection point where the connecting line 430 connects to the touch pattern 410 forms an overlap S, that is, the connecting line 430 is connected to the touch pattern 410 through the overlap S. In this embodiment, in order to reduce the area of the non-touch area, as shown in FIG7, the pad portion 420 is arranged between multiple overlaps S. It should be understood that, for simplicity, FIG7 is mainly used to illustrate the positional relationship between the pad portion 420 and the overlap S, and other structures are not shown. The positional relationship between the pad portion 420 and the overlap S shown in FIG7 also applies to the first touch pattern 410a, the first connecting line 430a, the third pad portion 420c, and the first pad portion 420a, that is, the pads in the third pad portion 420c are arranged between the overlaps connecting the first connecting line 430a and the first touch pattern 410a.
[0069] The overlap S is typically found when the materials of the touch pattern 410 and the connecting line 430 are different. In this case, a material with better conductivity can be selected for the touch pattern 410 to ensure efficient transmission of touch signals and achieve high-sensitivity touch response; a metal material with lower resistance can be selected for the connecting line 430 to effectively reduce attenuation and delay during signal transmission and improve the response speed of touch detection. In some specific embodiments, the touch pattern 410 shown in Figure 7 may include Cu, and the connecting line 430 and the pad portion 420 may include Ag, wherein the thickness of the touch pattern is between 0.1 μm and 2 μm, and the sheet resistance is less than 450 Ω. In other specific embodiments, the touch pattern 410 shown in Figure 7 may include indium tin oxide (ITO), and the connecting line 430 and the pad portion 420 may include one of Cu, Al, Ag, and their alloys. If the touch pattern 410 is ITO, the touch film can have better light transmittance, and optical devices can be disposed on the side of the touch film away from the cover plate 301. The optical devices may include optical fingerprint sensors, etc.
[0070] In some embodiments, the film substrate 400 is a polyethylene terephthalate (PET) substrate, a polyimide (PI) substrate, or a polyethylene naphthalate (PEN) substrate, with a thickness between 12.5 μm and 100 μm. In specific implementations, the thickness of the PET and PEN substrates is preferably 50 μm, and the thickness of the PI substrate is preferably 25 μm, to achieve a balance between performance and cost.
[0071] In some specific embodiments, touch patterns 410 are arranged on the touch areas of the first surface 400a and the second surface 400b of the film substrate 400. As shown in FIG4, the first touch pattern 410 arranged on the first surface 400a of the film substrate 400 near the cover plate 301 is marked as 410a. As shown in FIG5, the second touch pattern 410 arranged on the second surface 400 of the film substrate 400 away from the cover plate 301 is marked as 410b. The projections of the first touch pattern 410a and the second touch pattern 410b on the film substrate 400 are interlaced. The first touch pattern 410a serves as a sensing electrode array, and the second touch pattern 410b serves as a driving electrode array. The touch patterns 410 in FIG4 to FIG7 are only schematic and not a limitation on their specific shapes. Figure 8 shows a projection and a partial magnified view of an exemplary touch pattern. As shown in Figure 8, the projections of the first touch pattern 410a (RX pattern) and the touch pattern 410b (TX pattern) on the film substrate 400 are intersected. The first touch pattern 410a is located in the cutout area of the second touch pattern 410b after projection.
[0072] It should be understood that although Figures 4 and 5 show touch patterns arranged on a first surface 400a of the film substrate 400 near the cover plate 301 and a second surface 400b away from the cover plate 301, in specific implementations, the touch pattern 410 may only be arranged on the surface of the film substrate 400 near the cover plate 301. For example, in a self-contained touch film, the touch pattern may be arranged on the surface of the film substrate 400 near the cover plate 301. For simplicity, this embodiment of the present application will not elaborate on this.
[0073] Referring again to Figures 4 and 5, the film substrate 400 includes a plurality of through-holes 450 located in a non-touch area on a first side of the film substrate 400, and conductive material is disposed within the through-holes 450. In Figures 4 and 5, the through-holes 450 are located on one side of the short side of the rectangular film substrate 400. Further, a first connection line 430a formed on the first surface 400a of the film substrate 400 electrically connects a first touch pattern 410b formed on the first surface 400a of the film substrate 400 to a first pad portion 420a formed on the second surface 400b of the film substrate 400 via the through-holes 450. Thus, the first pad portion 420a on the second surface 400b of the film substrate 400 facilitates its connection to a flexible printed circuit board. Preferably, the first connection line 430a is obtained by etching the metal film in the non-touch area on the first surface 400a of the film substrate 400, so that the line width and line spacing of the first connection line 430a are smaller, reducing the area of the first connection line 430a on the film substrate 400, thereby reducing the size of the non-touch area, reducing the touch blind zone, and achieving better touch performance and user experience.
[0074] Referring again to Figures 4 and 5, in some implementations, the first pad portion 420a is positioned directly above and overlaps with the via 450. This allows the via 450, which contains conductive material, to be directly electrically connected to the first pad portion 420a, eliminating the need for connecting lines on the second surface 400b of the film substrate 400, thus reducing the number of connecting lines. Referring again to Figure 9, in some implementations, to improve electrical connectivity, the via 450 may include at least two sub-vias, shown as sub-vias 450a and 450b in Figure 9. Preferably, the diameter of the sub-vias is greater than or equal to 0.1 mm.
[0075] Referring again to Figure 5, a second connection line 430b formed on the second surface 400b of the film substrate 400 connects a second touch pattern 410b formed on the second surface 400b of the film substrate 400 to a second pad portion 420b formed on the second surface 400b of the film substrate 400. The second pad portion 420b is located on the second side of the film substrate 400. In Figure 5, the film substrate 400 is rectangular, and the second pad portion 420b is located on one side of the long side of the film substrate 400. Preferably, the second connection line 430b is obtained by etching the metal film in the non-touch area on the second surface 400b of the film substrate 400. This results in a smaller linewidth and line spacing for the second connection line 430b, reducing its area on the film substrate 400, thereby reducing the size of the non-touch area, decreasing the touch blind zone, and achieving better touch performance and user experience.
[0076] Referring again to Figure 4, in some specific implementations, a third pad portion 420c overlapping with the via 450 is also arranged on the first surface 400a of the film substrate 400. The first connection line 430a is electrically connected to the via 450 through the third pad portion 420c to enhance the electrical connection performance between the first connection line 430a and the via 450. Specifically, the first connection line 430b of the first surface 400a of the film substrate 400 connects the touch pattern 410b to the third pad portion 420c. The third pad portion 420c and the first pad portion 420a are connected through the via 450 with built-in conductive material. Specifically, the third pad portion 420c can be obtained by photolithography or laser etching of the metal film on the first surface 400a of the film substrate 400.
[0077] Referring to Figures 3, 4, and 5, the pressure touchpad also includes a flexible printed circuit board 311, which connects the touch film and the circuit board 340. Specifically, as shown in Figures 3, 4, and 5, the flexible printed circuit board 311 includes: a first flexible printed circuit board 311a, connected between the circuit board 340 and the first pad portion 420a, for transmitting touch signals sensed by the first touch pattern 410a to the circuit board 340; and a second flexible printed circuit board 311b, connected between the circuit board 340 and the second pad portion 420b, for transmitting drive signals generated by the circuit board 340 to the second touch pattern 410b. Optionally, the first and second flexible printed circuit boards are welded to the pad portion by laser spot welding or hot pressing welding, or pressed to the pad portion by anisotropic conductive adhesive film.
[0078] Referring again to Figures 4 and 5, the touch film may further include an electrostatic discharge (ESD) protection ring structure 460. The ESD protection ring structure 460 surrounds the connection line 430, the touch pattern 410, and the pad portion 420, and is electrically connected to the pad portion 420, for isolating the touch film from static electricity. In a specific implementation, the ESD protection ring structure 460 may include an ESD protection ring structure 460b disposed on the second surface 400b of the film substrate 400, and an ESD protection ring structure 460a disposed on the first surface 400a of the film substrate 400. As shown in Figure 4, the ESD protection ring structure 460a surrounds the first connection line 430a, the first touch pattern 410a, the first pad portion 420a, and the third pad portion 420c, and is connected to the third pad portion 420c. As shown in Figure 5, the electrostatic discharge (ESD) protection ring structure 460b surrounds the second connection line 430b, the second touch pattern 410b, and the second pad portion 420b, and is electrically connected to the second pad portion 420b. Specifically, the ESD protection ring structure 460 can be a ring ground Cu, which can be obtained by photolithography or laser etching of the metal film on the second surface 400b and the first surface 400a of the film substrate 400.
[0079] In some embodiments, the width of each pad in the pad portion 430 shown in Figures 4 to 6A and 6B is greater than or equal to 0.2 mm, and the length is less than or equal to 7 mm. Furthermore, the distance between adjacent pads is greater than or equal to 0.2 mm. This provides good connectivity while achieving a small non-touch area, thus balancing performance and touch blind spots. Further, the distance between adjacent touch pattern 410 channels is between 4 mm and 7 mm. If the pad width is greater than or equal to 0.2 mm, the length is less than or equal to 7 mm, and the distance between adjacent pads is greater than or equal to 0.2 mm, then the number of pads arranged between adjacent touch pattern 410 channels is less than or equal to 18. Preferably, the distance between adjacent channels is between 4 mm and 5.46 mm, the pad size is 0.35 mm * 0.8 mm, the distance between pads is between 0.2 mm and 0.565 mm, and the number of pads arranged between adjacent channels is 3.
[0080] In some embodiments, the linewidth of the connection lines 430 shown in Figures 4 to 7 is between 5 μm and 50 μm, and the minimum line spacing between adjacent connection lines 430 is between 5 μm and 50 μm. This reduces the non-touch area occupied by the connection lines 430 and lowers the touch blind zone while ensuring the signal transmission performance of the connection lines 430. The linewidth is preferably 30 μm, and the line spacing is preferably 20 μm. Specifically, as shown in Figures 4, 5, and 7, the connection lines outside the pad portion 420 are substantially parallel, and the line spacing in this portion is the minimum line spacing of the connection lines, which is between 5 μm and 50 μm.
[0081] In some embodiments, to prevent oxidation of the touch pattern 410 and connection lines 430, and to ensure good solderability between the pad portion 430 and the FPC, as shown in Figures 10A, 10B, and 10C, the touch film may further include an organic solderability preservative (OSP) film 470, which is formed on at least one of the touch pattern 410, connection lines 430, pad portion 420, and electrostatic discharge protection ring structure 460. In a specific implementation, the thickness of the organic solderability preservative film 470 is approximately 1 μm.
[0082] In some embodiments, to mitigate the risk of short circuits when the touch film is interconnected with the flexible printed circuit board, local areas of the touch pattern 410 and the connecting lines 430 are insulated with an insulating material, as shown in Figures 10A, 10B, and 10C. The touch film further includes an insulating layer 480 formed on the film substrate 400 and at least covering the connecting lines 430 and the touch pattern 410 that overlap with the flexible printed circuit board. In a specific implementation, the insulating layer 480 includes ultraviolet (UV) insulating ink with a thickness between 5 μm and 15 μm.
[0083] In some embodiments, as shown in Figures 10A, 10B, and 10C, the touch film further includes a shielding film 490, which is adhered to the touch area of the second surface 400b of the film substrate 400 via an adhesive layer 491 and is located above the organic solderable protective film 470. In specific embodiments, the shielding film 490 may include an indium tin oxide (ITO) film with a thickness between 25 μm and 125 μm; the adhesive layer 491 may include optically clear adhesive (OCA) with a thickness between 5 μm and 125 μm. The shielding film 490 may also be made of steel sheet, Cu foil, or other conductive films. The shielding film 490 may also be adhered to the second surface 400b of the film substrate 400 using pressure-sensitive adhesive (PSA) or thermosetting adhesive.
[0084] In some embodiments, as shown in Figures 10A, 10B, and 10C, the touch film further includes a flexible printed circuit board 311, which can be soldered to the pad portion 430 by laser spot welding or thermoforming, or laminated to the pad portion 430 by an anisotropic conductive film (ACF). Specifically, as shown in Figure 10A, the flexible printed circuit board 311 can use through-hole pads and can be soldered to the pad portion 430 by high-temperature or low-temperature solder paste. As shown in Figure 10B, the flexible printed circuit board 311 can use surface-mount pads and can be soldered to the pad portion 430 by high-temperature or low-temperature solder paste. As shown in Figure 10C, the flexible printed circuit board 311 can use surface-mount pads and can be laminated to the pad portion 430 by anisotropic conductive film. Furthermore, as shown in Figure 3, the flexible printed circuit board 311 includes two parts, wherein the first flexible printed circuit board 311a is connected to the first welding portion 420a of the second surface 400b of the film substrate 400, and the second flexible printed circuit board 311b is connected to the welding portion 420b of the second surface 400b of the film substrate 400.
[0085] In one typical implementation, the film substrate 400 is a PET substrate, a PI substrate, or a PEN substrate. The thickness of the PET, PI, and PEN substrates is between 12.5 μm and 100 μm. Specifically, the thickness of the PET and PEN substrates is preferably 50 μm, and the thickness of the PI substrate is preferably 25 μm. The film substrate 400 is double-sided coated with a metal film, which is used to form the connection lines 430, touch patterns 410, and pad portions 420, etc. In one implementation, the connection lines 430, touch patterns 410, and pad portions 420 can be made of Cu, and the material can be rolled Cu or electrolytic Cu, with a thickness between 3 μm and 12.5 μm, preferably 6 μm. In another implementation, the connection lines 430, touch patterns 410, and pad portions 420 can be made of Al, with a thickness between 3 μm and 12.5 μm, preferably 6 μm. In one implementation, the connecting lines 430, touch patterns 410, and pad portions 420 can be made of Ag, with a thickness ranging from 3μm to 12.5μm, preferably 6μm. The sheet resistance of metals such as Cu, Al, and Ag is between 0.0001Ω and 0.08Ω. A double-sided pure metal solution (Cu, Al, Ag, etc.) is preferred, as it achieves an innovative unification of the materials of the connecting lines 430, touch patterns 410, and pad portions 420 compared to traditional solutions such as ITO metal, making the solution more cost-effective and competitive.
[0086] Continuing with this typical implementation, the touch pattern 410 and pad portion 420 are obtained through photolithography or laser etching, and the connecting line 430 is obtained through laser etching. The distance between adjacent touch pattern 410 channels is between 4mm and 7mm; the linewidth of the connecting line 430 is between 5μm and 50μm, preferably 30μm; the width of the pad is greater than or equal to 0.2mm, the length is less than or equal to 7mm, and the distance between adjacent pads is greater than or equal to 0.2mm. The number of pads arranged between adjacent touch pattern 410 channels is less than or equal to 18. Preferably, the distance between adjacent channels is 5.46mm, the pad size is 0.35mm*0.8mm, the distance between pads is 0.565mm, and the number of pads arranged between adjacent channels is 3.
[0087] Continuing with this typical implementation, a via 450 is partially opened and metallized in the pad portion 420c of the first surface 400a of the film substrate 400, and connected to the pad portion 420b of the second surface 400b of the film substrate 400 via a connecting line 430b. The via 450 can be a circular via drilled with a laser, and the diameter of the via can be greater than or equal to 0.1 mm, preferably 0.12 mm.
[0088] Continuing with this typical implementation, the touch pattern 410 and connecting lines 430 are oxidized. To ensure good solderability between the pad portions 420a and 420b and the FPC board 200, the metal layer is protected with OSP (Optical State Protective Film), and the OSP film 470 is approximately 1 μm thick. To mitigate the risk of short circuits when the touch film interconnects with the FPC board 200, localized areas of the touch pattern 410 and connecting lines 430 are insulated with an insulating material, preferably UV insulating ink, with a thickness preferably between 5 μm and 15 μm.
[0089] Continuing with this typical implementation, to prevent the metal of the entire device from affecting the touch performance, a shielding film 490 is laminated to the second surface 400b (as the driving surface). The shielding film 490 can be made of ITO film, steel sheet, Cu foil, or other conductive thin film, preferably ITO film, with a thickness of 50 μm. The shielding film 490 can be laminated to the second surface 400b using PSA, OCA adhesive, or thermosetting adhesive, preferably OCA adhesive, with a thickness of 25 μm.
[0090] Continuing with this typical implementation, the interconnection between the FPC board 200 and the pad portion 420 can be achieved using either laser spot welding or thermoforming. The interconnecting material is solder paste, which can be printed on either the FPC board 200 or the pad portion 420, preferably on the FPC board 200. The FPC board 200 can be configured with through-hole pads or surface-mount pads. Depending on the substrate, high-temperature or low-temperature solder paste can be selected. PET / PEN materials are not heat-resistant, so low-temperature solder paste is selected; PI materials are heat-resistant, so high-temperature solder paste is selected. Alternatively, the interconnection between the FPC board 200 and the pad portion 420 can be achieved using an ACF process, where the ACF is attached to the touch film.
[0091] Continuing with this typical implementation, laser spot welding is preferred. Specifically, the laser spot welding spot can be a small circular spot to weld each pad individually, or a large circular spot or a long strip to weld the entire pad. An automated fixture pre-aligns the FPC board 200 and the touch film assembly. To enhance welding reliability and avoid cold solder joints, a glass sheet is used to press the two together. The laser passes through the glass sheet to weld the FPC board 200 and the touch film assembly together.
[0092] This classic implementation significantly reduces the thickness of traditional PCB touch panels. The touch film thickness of this solution is approximately 0.103mm to 0.128mm, while the thickness of traditional PCB boards is approximately 0.4mm to 1mm, resulting in a thickness gain of approximately 0.3-0.9mm, which aligns with the current trend towards thinner and lighter electronic products. Furthermore, this solution employs a new routing scheme to achieve an ultra-narrow touch-invalid area, improving touch performance. In addition, each workstation implementing this solution can perform large-scale batch processing on entire boards, offering a significant efficiency advantage.
[0093] Referring again to Figure 3, in this embodiment, the shape and size of the touch film 310 are adapted to the cover plate 301 to detect touch operations applied to the upper surface of the cover plate 301 and generate touch signals. The circuit board 340 is used to process the touch signals, and its shape and size are independent of the shape and size of the cover plate 301. Therefore, the shape and size of the circuit board 340 are independent of the appearance of the pressure touchpad (mainly the size and shape of the touch area), and pressure touchpads with different appearances can use the same circuit board 340. In this embodiment, the area of the circuit board 340 can be reduced by misaligning the pressure sensor 320 and the vibration mechanism 330 on the lower surface of the touch film 310.
[0094] In some embodiments, as shown in FIG3, the pressure sensor 320 may include four pressure detection components 322 located at the four corners of the pressure touchpad. The pressure sensor 320 includes an electrical connection component 321 and one or more pressure detection components 322. The pressure detection components 322 are electrically connected to the electrical connection component 321 and are used to detect pressing operations and generate pressure signals. The electrical connection component 321 connects the pressure detection components 322 to a circuit board 340 and is used to transmit the pressure signals generated by the pressure detection components 322; the electrical connection component 321 may include an FPC board, etc.
[0095] Preferably, as shown in FIG3, it may include four pressure detection components 322 located at the four corners of the thin-film touch sensor 310, namely a first pressure detection component 322a, a second pressure detection component 322b, a third pressure detection component 322c, and a fourth pressure detection component 322d. The first pressure detection component 322a is adjacent to the second pressure detection component 322b and is connected to the circuit board 340 through a first electrical connection component 321a. The first electrical connection component 321a includes a first connection terminal connected to the first pressure detection component 322a, a second connection terminal connected to the second pressure detection component 322b, and a third connection terminal connected to the circuit board 340. The third pressure detection component 322c is adjacent to the fourth pressure detection component 322d and is connected to the circuit board 340 through the second electrical connection component 321b. The second electrical connection component 321b includes a first connection terminal connected to the third pressure detection component 322c, a second connection terminal connected to the fourth pressure detection component 322d, and a third connection terminal connected to the circuit board 340. The first electrical connection assembly 321a and the second electrical connection assembly 321b may be made of FPC board.
[0096] In some implementations, the pressure sensing component 322 can be a capacitive pressure sensing component, specifically including a pressure-sensing element and a fixed electrode. The pressure-sensing element is typically an elastic diaphragm made of materials such as a metal thin film or silicon wafer. As one electrode of a capacitor, it deforms under pressure, thereby changing the capacitance parameters. An insulating layer is provided between the pressure-sensing element and the fixed electrode. This insulating layer isolates the electrode, prevents short circuits, and, as part of the dielectric, its material and thickness significantly affect the capacitance characteristics. Pressure applied to the pressure-sensing element causes displacement, resulting in changes in the distance between the electrodes, the effective area of the electrodes, or the dielectric constant of the dielectric, thus altering the capacitance value. By measuring the change in capacitance, the magnitude of the pressure acting on the electrode can be calculated.
[0097] In some implementations, the pressure detection component 322 can be a stress detection component, which may include a resistance strain gauge and a measuring circuit. The resistance strain gauge deforms with pressure, and the change in resistance is converted into a voltage or current signal output by the measuring circuit.
[0098] In some embodiments, referring to FIG3, the pressure touchpad further includes a bracket 360 for fixing the pressure touchpad. The bracket 360 is provided with a receiving space 361 for accommodating a vibration mechanism 300. The vibration mechanism 300 may be disposed in the receiving space 361.
[0099] Referring to Figures 11 to 13, a typical manufacturing method of the touch film according to an embodiment of this application includes the following steps.
[0100] Step 1: For incoming PET, PI, or PEN double-sided metallized film (Film), create circular vias in the pad (first pad portion) area of the sensing channel (RX channel). Preferably, the diameter of the circular via is ≥0.1mm, and more preferably ≥0.12mm. Preferably, the thickness of the metal film is between 3μm and 12.5μm, and the sheet resistance is between 0.0001Ω and 0.08Ω. Preferably, the thickness of the metal film is 6μm.
[0101] Step 2: Selectively electroplate Cu onto the circular through-hole area obtained in Step 1 to metallize the circular through-hole, thereby enabling the RX pad (i.e., the first pad portion) to be connected to the drive channel (TX channel) surface (i.e., the second surface away from the cover plate).
[0102] Step 3: Apply photolithography or laser etching to the double-sided metal film to obtain the touch pattern, which includes the RX pattern (i.e., the first touch pattern) on the first surface near the cover plate and the TX pattern (i.e., the second touch pattern) on the second surface away from the cover plate.
[0103] Step 4: Use photolithography to laser etch the connection lines between the TX Pattern and the TX pad (referred to as the TX line, also known as the second connection line) and the connection lines between the RX Pattern and the RX pad (referred to as the RX line, also known as the first connection line). The line width is preferably less than or equal to 30μm and the line spacing is preferably 20μm.
[0104] Step 5: Perform OSP protection on the TX Pattern, RX Pattern and connection line area; insulate between the TX pad and RX pad and between the pad and the Pattern. In this embodiment, UV insulating ink is preferred to avoid short circuits when interconnected with the FPC.
[0105] Step 6: Apply the shielding film to the TX Pattern surface (i.e., the second surface furthest from the cover plate).
[0106] Step 7: Interconnect the Film touch component and FPC obtained in Step 6.
[0107] Optionally, interconnection is achieved in step 7 using solder paste. The solder paste can be printed on the FPC or Film touch component TX and RX pads, preferably on the FPC. The FPC can be a through-hole pad or a surface mount pad, and the FPC pad can be printed with either low-temperature solder paste or high-temperature solder paste. For PET and PEN touch solutions, a low-temperature solder paste solution is selected using FPC through-hole pads or surface mount pads; in this embodiment, a high-temperature solder paste solution is selected using FPC through-hole pads or surface mount pads. The laser wavelength is preferably 915nm, with a circular spot, and the power is preferably 6.6W. The low-temperature solder paste laser spot welding or thermoforming temperature can be selected between 160℃ and 200℃, with a welding time recommended to be ≥0.5S, preferably 180℃*1.5S. The high-temperature solder paste laser spot welding or thermoforming temperature can be selected between 260℃ and 300℃, with a welding time recommended to be ≥0.5S, preferably 280℃*1.5S.
[0108] Specifically, the cross-sectional structure diagram of the PET and PEN film touch + FPC through-hole pads + low-temperature or high-temperature solder paste solution is shown in Figure 10A, and the implementation method is shown in Figure 11. The cross-sectional structure diagram of the PET or PEN film touch + FPC surface mount pads + low-temperature or high-temperature solder paste solution is shown in Figure 10B, and the implementation method is shown in Figure 12.
[0109] Optionally, in step 7, interconnection is achieved using ACF adhesive, and the FPC serves as the surface mount pad. A schematic cross-sectional view of the PET / PEN / PI film touch + ACF + FPC surface mount pad solution is shown in Figure 10C, and the implementation method is shown in Figure 13.
[0110] The touch solution in this application is approximately 0.3mm to 0.9mm thinner than traditional PCB touch boards, and the width of the touch invalid area can be significantly reduced by the routing method compared to traditional routing methods, thus meeting the demands for thinner, lighter, and higher-performance touch solutions in mobile terminals. Furthermore, it is suitable for mass production, as the manufacturing process does not require expensive equipment and materials, resulting in a significant cost advantage.
[0111] This application also provides an electronic device, including a device body and the aforementioned pressure touchpad disposed on the device body. The electronic device can be the electronic device shown in FIG1 or the touch device shown in FIG2. The electronic device can be, but is not limited to, a car infotainment screen, a car, a smart wearable device, a mobile terminal, or a smart home device. Smart wearable devices include, but are not limited to, smartwatches, smart bracelets, and neck massagers. Mobile terminals include, but are not limited to, smartphones, laptops, tablets, and POS (point of sales terminal) machines.
[0112] The above are merely preferred embodiments of this application and are not intended to limit this application in any way. Although this application has disclosed preferred embodiments as above, it is not intended to limit this application. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the technical solution of this application. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of this application without departing from the scope of the technical solution of this application shall still fall within the scope of the technical solution of this application.
Claims
1. A pressure-sensitive touchpad, characterized in that, The pressure touch panel includes: a touch film for detecting touch operations applied to the upper surface of the cover and generating touch signals; a pressure sensor for detecting pressing operations applied to the upper surface of the cover and generating pressure signals; and a circuit board for processing the touch signals and the pressure signals; wherein the touch film includes: A film substrate includes a touch area and a non-touch area disposed outside the touch area; A touch pattern is arranged in the touch area of the film substrate; The pad portion is arranged in the non-touch area of the film substrate; Connecting lines for connecting the touch pattern to the pad portion; If the connection line is directly connected to the touch pattern, the connection line includes: a trace with one end connected to the touch pattern and the other end connected to the pad near the touch image; and / or a trace with one end connected to the touch pattern and the other end connected to the pad away from the touch pattern. If the connection line is connected to the touch pattern through an overlap, the pad portion is arranged between multiple overlaps, and the connection line includes: a trace with one end connected to the overlap and the other end connected to the side of the pad away from the touch pattern.
2. The pressure touch panel as described in claim 1, characterized in that, The touch pattern, the connecting lines, and the pads are made of the same material, including one of Cu, Al, Ag, and their alloys.
3. The pressure touch panel as described in claim 2, characterized in that, The thickness of the touch pattern, the connecting lines, and the pad portion is between 3μm and 12.5μm, so that its sheet resistance is between 0.0001Ω and 0.08Ω.
4. The pressure touch panel as described in claim 1, characterized in that, The film substrate is a polyethylene terephthalate (PET) substrate, a polyimide (PI) substrate, or a polyethylene naphthalate (PEN) substrate, with a thickness between 12.5 μm and 100 μm.
5. The pressure touch panel as described in claim 1, characterized in that, The connecting lines are made of a different material than the touch pattern, wherein: The touch pattern comprises Cu, while the connecting lines and the pads are not Cu. The thickness of the touch pattern is between 0.1 μm and 2 μm to achieve a sheet resistance of less than 450 Ω; or The touch pattern includes indium tin oxide (ITO), and the connection lines and the pad portion include one of Cu, Al, Ag, and their alloys.
6. The pressure touch panel as described in any one of claims 1 to 4, characterized in that, The touch pattern and the connection lines are obtained by photolithography or etching of the metal film of the touch area on the film substrate; and / or the pad portion is obtained by photolithography or etching of the metal film of the non-touch area on the film substrate.
7. The pressure touch panel as described in any one of claims 1 to 5, characterized in that, The film substrate includes a plurality of through holes in a non-touch area located on a first side of the film substrate, and conductive material is disposed in the through holes; A first connection line formed on the first surface of the film substrate near the cover plate, through the through hole, electrically connects the first touch pattern formed on the first surface of the film substrate to the first pad portion formed on the second surface of the film substrate. The first pad portion is arranged directly above the through hole and overlaps with the through hole.
8. The pressure touch panel as described in claim 7, characterized in that, Each of the vias includes at least two sub-vias with a diameter greater than or equal to 0.1 mm.
9. The pressure touch panel as described in claim 7, characterized in that, A second connection line formed on the second surface of the film substrate away from the cover plate connects a second touch pattern formed on the second surface of the film substrate to a second pad portion formed on the second surface of the film substrate, wherein the first pad portion is located on the second side of the film substrate.
10. The pressure touch panel as described in claim 9, characterized in that, The first surface of the film substrate is further provided with a third pad portion that overlaps with the through hole, and the first connection line is electrically connected to the through hole through the third pad portion.
11. The pressure touch panel as described in claim 9, characterized in that, The pressure touchpad also includes: A first flexible printed circuit board is connected between the circuit board and the first pad portion, and is used to transmit the touch signal sensed by the first touch pattern to the circuit board; A second flexible printed circuit board is connected between the circuit board and the second pad portion, and is used to transmit the driving signal generated by the circuit board to the second touch pattern.
12. The pressure touch panel as described in any one of claims 1 to 5, characterized in that, Also includes: An organic solderability protective film is formed on at least one of the touch pattern, the connection line, and the pad portion; The shielding film is attached to the touch area of the second surface of the film substrate away from the cover plate by an adhesive layer and is located on the organic solderable protective film. The shielding film includes an indium tin oxide (ITO) film with a thickness between 25 μm and 125 μm; the adhesive layer includes an optically transparent adhesive with a thickness between 5 μm and 125 μm.
13. The pressure touch panel as described in any one of claims 1 to 5, characterized in that, Also includes: An insulating layer is formed on the film substrate and at least covers the connection lines and the touch pattern that overlap with the flexible printed circuit board; The insulating layer comprises ultraviolet (UV) insulating ink with a thickness between 5 μm and 15 μm. and / or An electrostatic discharge (ESD) protection ring ground structure is disposed on the first surface of the film substrate near the cover plate and / or the second surface away from the cover plate, and surrounds the connection lines, the touch pattern and the pad portion. The ESD protection ring ground structure is electrically connected to the pad portion to isolate static electricity acting on the touch film.
14. The pressure touch panel as described in any one of claims 1 to 5, characterized in that, The line width of the connecting lines is between 5μm and 50μm, and the minimum line spacing between adjacent connecting lines is between 5μm and 50μm; and / or The width of each pad in the pad portion is greater than or equal to 0.2 mm, and the length is less than or equal to 7 mm; the distance between adjacent pads is greater than or equal to 0.2 mm; and / or The distance between adjacent touch patterns is between 4mm and 7mm.
15. An electronic device, characterized in that, It includes a device body and a pressure touch panel disposed on the device body as described in any one of claims 1 to 14 above.