Functional module, heat dissipation system, and vehicle

Abstract

Provided in the present application are a functional module, a heat dissipation system and a vehicle. The functional module comprises a housing, a circuit board, a heat-generating device and a cooling structure, wherein the housing is provided with a liquid drain port, by means of which a cavity formed by the housing communicates with the exterior of the housing; the heat-generating device is electrically connected to the circuit board, and the heat-generating device and the circuit board are both located in the cavity; at least part of the cooling structure is located in the cavity, the cooling structure is further located on the side of the heat-generating device away from the circuit board, and a flow guide channel is provided in the cooling structure, the flow guide channel being configured to allow a cooling working medium to flow therethrough; and the liquid outside the cooling structure is discharged from the housing by means of the liquid drain port. While satisfying the heat dissipation performance requirement of the functional module, the technical solution of the present application can eliminate the risk of condensation in the module.

Description

Functional modules, cooling system and vehicle Technical Field

[0001] This application relates to the field of heat dissipation technology, and in particular to functional modules, heat dissipation systems, and vehicles. Background Technology

[0002] With the continuous advancement of science and technology, the power consumption of heat-generating devices (such as chips) used in functional modules has increased dramatically. Heat dissipation has become a crucial challenge in verifying the reliability of functional modules, as the ability to effectively dissipate heat directly affects module performance. Currently, liquid cooling is commonly used to dissipate heat from these devices. However, condensation often occurs inside the module because moisture cannot easily escape to the external environment. In severe cases, this can lead to short circuits and failure of internal components. Solving the failure problem caused by condensation remains a subject of ongoing research in the industry. Summary of the Invention

[0003] This application provides a functional module, a heat dissipation system, and a vehicle that can solve the risk of condensation on the module while meeting the heat dissipation performance requirements of the functional module.

[0004] In a first aspect, this application provides a functional module, which includes a housing, a circuit board, a heating element, and a cooling structure;

[0005] The outer casing is provided with a drain port, which connects the cavity formed by the outer casing and the outside of the outer casing;

[0006] The heating element is electrically connected to the circuit board, and both the heating element and the circuit board are located within the cavity;

[0007] At least a portion of the cooling structure is located within the cavity, and the cooling structure is also located on the side of the heating device away from the circuit board. The cooling structure is provided with a flow channel for the flow of cooling fluid.

[0008] Liquid located outside the cooling structure is discharged from the outer casing through the drain port.

[0009] It is understandable that, since the heat from the heating device and / or the circuit board can be transferred to the cooling structure, and the cooling structure has internal flow channels, the cooling medium can flow into the cooling structure from the flow channels. During its flow through the flow channels, the cooling medium carries the heat from the heating device and circuit board that has been conducted to the cooling structure, thereby exchanging heat and cooling the heating device and circuit board, achieving liquid cooling for the heating device and circuit board.

[0010] By incorporating a drain port on the outer casing, the cavity formed by the casing can be made non-enclosed and connected to the outside of the casing, thus maintaining a certain degree of airflow between the cavity and the outside. Since both the heating element and the circuit board generate heat during operation, the temperature at their location will be higher than the ambient air temperature. Therefore, even with the cavity non-enclosed, the heat generation function of the heating element and circuit board ensures that condensation will not occur on their surfaces within the cavity. Furthermore, the module as a whole does not require a high level of airtight protection, saving the additional costs associated with airtight protection and moisture-absorbing packs for condensation prevention.

[0011] When the temperature of the cooling medium in the flow channel is lower than the ambient dew point temperature, liquid (condensation) will form on the outer surface of the cooling structure. This liquid can be drained from the outer surface of the cooling structure through the drain port to the outside of the module, effectively preventing liquid from accumulating inside the module and dripping onto the circuit board, causing corrosion and / or short circuits in components, ultimately leading to module failure. This addresses the condensation risk while still meeting the module's heat dissipation requirements. Furthermore, the simple structure of the heat dissipation architecture, consisting of the circuit board, electronic components, and cooling structure, helps reduce the production cost and improve the module's production efficiency. For example, the liquid drained from the module can be discharged along with the air conditioner's condensate.

[0012] Furthermore, compared to the large-area cold plate layout of related technologies, at least a portion of the cooling structure in this embodiment is located within the cavity and close to the heat-generating device. This reduces the cooling area from full-area cooling to localized cooling of high-heat-dissipating devices, significantly decreasing the cooling area of ​​the cooling structure. Due to the smaller cooling area, this localized cooling solution results in significantly less condensation on the surface of the cooling structure compared to the cold plate solution of related technologies. This not only reduces the coverage area of ​​the cold plate structure, thereby reducing the volume and weight of structural components, achieving efficient localized heat dissipation, and facilitating layout, but also further reduces the cost of the module.

[0013] In one possible implementation, the circuit board, the heating element, and the cooling structure are arranged parallel to the direction of gravity.

[0014] Understandably, since the cooling structure is located below the heat-generating device and the circuit board, when a small amount of condensation occurs on the outside of the cooling structure, the condensate droplets will flow downwards due to gravity and exit the module from the drain port. They will not flow upwards against gravity to the surface of the heat-generating device and the circuit board, which helps to avoid the risk of liquid entering the circuit board and the heat-generating device and improves the working reliability of the functional module.

[0015] Alternatively, the circuit board, the heating element, and the cooling structure may be arranged perpendicular to the direction of gravity.

[0016] Understandably, since the circuit board, heating element, and cooling structure can be arranged perpendicular to the direction of gravity, when a small amount of condensation occurs on the outside of the cooling structure, the condensate droplets will flow downwards due to gravity and exit the module from the drain port. This helps to avoid the risk of liquid entering the circuit board and heating element and improves the reliability of the functional module.

[0017] In one possible implementation, the cooling structure includes a heat exchange section and a liquid cooling pipe, wherein the heat exchange section and at least a portion of the liquid cooling pipe are located within the cavity, the heat exchange section is connected to the heating device, the liquid cooling pipe is connected to the heat exchange section, and the liquid cooling pipe is provided with an inlet and an outlet.

[0018] The flow channel extends within the heat exchange section and the liquid cooling pipe, and is connected to both the liquid inlet and the liquid outlet. It is understood that by extending the flow channel within the heat exchange section and the liquid cooling pipe, the cooling medium can flow within both the liquid cooling pipe and the heat exchange section, thereby maximizing the liquid cooling heat exchange area between the cooling structure and the heat-generating device, and enhancing the liquid cooling heat dissipation performance of the cooling structure.

[0019] Alternatively, the flow channel extends within the liquid cooling pipe and communicates with both the inlet and the outlet. It is understood that extending the flow channel within the liquid cooling pipe allows the cooling medium to flow within the pipe. Furthermore, by connecting the heat exchange section between the liquid cooling pipe and the heating element, the excellent thermal conductivity of the heat exchange section enables efficient and convenient transfer of heat from the heating element to the liquid cooling pipe. This helps reduce the thermal temperature difference and thermal resistance between the heating element and the liquid cooling pipe, ensuring efficient heat transfer between the cooling structure and the heating element, and enhancing the heat dissipation performance of the cooling structure.

[0020] In one possible implementation, the heat exchange section is a liquid cooling head. Alternatively, the heat exchange section is a thermally conductive structure. The material of the heat exchange section can be any material with good thermal conductivity; for example, the material of the heat exchange section can be a metal. The material of the heat exchange section and the material of the liquid cooling pipe can be the same as or different. Furthermore, the heat exchange section can be a solid structure. Alternatively, the heat exchange section can also be a hollow structure. Exemplarily, the heat exchange section and the liquid cooling pipe can be welded together.

[0021] In one possible implementation, the heat exchange section and the liquid cooling pipe are an integral structure. For example, the heat exchange section and the liquid cooling pipe can be connected in a one-piece molding manner to form an integral structure. It is understood that the cooling structure formed by an integral structure has fewer parts, which helps to simplify the manufacturing process of the cooling structure and improve the production and assembly efficiency of the cooling structure.

[0022] Alternatively, the heat exchange section and the liquid cooling pipe can be separate components. For example, the heat exchange section and the liquid cooling pipe can be fixed together by assembly methods such as welding, bonding, screwing, or snap-fitting. It is understood that a separate cooling structure can be formed by connecting the heat exchange section and the liquid cooling pipe, simplifying the cooling structure through assembly and avoiding the problem of reduced strength due to excessive extension length of the same structural component. This also facilitates positioning and assembly.

[0023] In one possible implementation, the cooling structure includes a body and a protrusion. The body forms part of the outer casing. The body has a liquid inlet and a liquid outlet. The flow channel is located in the body and communicates with both the liquid inlet and the liquid outlet. The body includes a connecting surface facing the cavity. The protrusion is located in the cavity and connected to the body. The protrusion also protrudes relative to the connecting surface and is connected to the heating device on the side away from the body.

[0024] It is understandable that by extending the flow channel within the body, the cooling medium can flow within the body. Furthermore, by connecting the protrusion between the body and the heat-generating device, the excellent thermal conductivity of the protrusion can efficiently and conveniently transfer heat from the heat-generating device to the body. This helps reduce the thermal temperature difference and thermal resistance between the heat-generating device and the body, ensuring the heat transfer efficiency between the cooling structure and the heat-generating device, and enhancing the heat dissipation performance of the cooling structure.

[0025] In one possible implementation, the functional module further includes a first thermal insulation structure located within the cavity and covering at least a portion of the cooling structure.

[0026] It is understandable that by setting a first heat insulation structure on the outer surface of the cooling structure, the first heat insulation structure can wrap the part of the cooling structure that is not connected to the heat-generating device, so that the first heat insulation structure can play a role in heat insulation and heat preservation for the cooling structure, thereby slowing down the rate of condensation generation on the outside of the cooling structure and further reducing the condensation on the outside of the cooling structure, thus reducing the anti-condensation cost of the functional module.

[0027] In one possible implementation, the drain port is located at the bottom of the housing, and the bottom of the housing is also provided with a drain structure, which is located within the cavity.

[0028] The drainage structure can be a tray capable of collecting droplets. Alternatively, it can be a porous medium with water-absorbing properties, such as absorbent cloth or a sponge. It can also be a flow channel structure located at the bottom of the outer casing. Or, it can be a sloped structure located at the bottom of the outer casing. Of course, the drainage structure is not limited to the structures listed above; any structure capable of collecting droplets from the outside of the cooling structure and guiding them to the drainage port falls within the scope of protection claimed in this embodiment, and no strict limitations are imposed.

[0029] Understandably, by adding an extra drainage structure at the bottom of the casing, not only can the drainage structure catch the droplets falling from the outside of the cooling structure, but it can also collect the droplets and guide them to the drainage port of the casing, allowing the droplets to flow out of the functional module from the drainage port of the casing, thus playing a good guiding role.

[0030] In one possible implementation, the functional module further includes electronic devices electrically connected to the circuit board and spaced apart from the heat-generating device, wherein the heat dissipation of the electronic devices is less than that of the heat-generating device.

[0031] The functional module also includes an extension structure, the first end of which is connected to the cooling structure, and the second end of which is connected to the electronic device.

[0032] It is understandable that by adding an extension structure between the cooling structure and the electronic components, the cooling structure can further dissipate heat for the electronic components, thus giving the cooling structure the dual function of dissipating heat for both heat-generating components and electronic components. This is beneficial for improving the heat dissipation efficiency of the cooling structure and the heat dissipation performance of the functional modules.

[0033] In one possible implementation, the functional module further includes a first thermally conductive layer, which is connected between the heat-generating device and the cooling structure.

[0034] It is understandable that by connecting the first thermally conductive layer between the heat-generating device and the cooling structure, the excellent thermal conductivity of the first thermally conductive layer can be used to transfer the heat of the heat-generating device and the circuit board to the cooling structure, and the good heat dissipation performance of the cooling structure can be used to remove the heat of the heat-generating device and the circuit board, thereby achieving rapid heat dissipation and effectively improving the heat dissipation efficiency of the functional module.

[0035] In one possible implementation, the outer casing is further provided with an air inlet and an air outlet spaced apart, both of which are connected to the outside of the cavity and the outer casing.

[0036] Understandably, by opening air inlets and outlets on the outer casing, cold air can enter the cavity through the air inlet. The cold air entering the cavity can carry the heat generated by the circuit board and / or heating devices during its flow within the cavity and become hot air. The hot air flows out of the cavity through the air outlet and into the external environment. The alternating circulation of cold and hot air completes the uninterrupted heat exchange between the functional module and the external environment, which not only enhances the natural convection within the cavity but also improves the heat dissipation efficiency of the functional module.

[0037] Alternatively, the housing may also be provided with a ventilation port that connects the cavity and the outside of the housing.

[0038] It is understandable that by opening ventilation ports on the outer casing, air outside the casing and air inside the cavity can be exchanged through the ventilation ports, thereby further enhancing the natural convection of air inside the cavity and improving the heat dissipation performance of the functional modules.

[0039] In one possible implementation, the circuit board includes a first surface and a second surface, the first surface and the second surface being disposed opposite to each other in the thickness direction of the circuit board, the first surface facing the bottom of the housing and the second surface facing the top of the housing;

[0040] The heating element is connected to the first surface, and the cooling structure is connected to the heating element.

[0041] Understandably, since the cooling structure is located below the heat-generating device and the circuit board, when a small amount of condensation occurs on the outside of the cooling structure, the condensate droplets will flow downwards due to gravity and exit the module from the drain port. They will not flow upwards against gravity to the surface of the heat-generating device and the circuit board, which helps to avoid the risk of liquid entering the circuit board and the heat-generating device and improves the working reliability of the functional module.

[0042] In one possible implementation, the circuit board includes a first surface and a second surface, the first surface and the second surface being disposed opposite to each other in the thickness direction of the circuit board, the first surface facing the bottom of the housing, the second surface facing the top of the housing, the heating device being connected to the second surface, and the cooling structure being connected to the heating device.

[0043] The functional module also includes a drainage structure located between the cooling structure and the heating device, and between the cooling structure and the circuit board. The drainage structure isolates the cooling structure and the heating device, and isolates the cooling structure and the circuit board. The drainage structure is used to guide liquid outside the cooling structure to the drain port.

[0044] Understandably, since the heating element and cooling structure are located above the circuit board, to prevent liquid from the outside of the cooling structure from dripping onto the heating element and circuit board due to gravity, drainage structures are installed between the cooling structure and the heating element, and between the cooling structure and the circuit board. These drainage structures isolate the cooling structure from the heating element and the circuit board. Therefore, when liquid accumulates on the outside of the cooling structure, it flows along the drainage structures to the drain port and eventually out of the casing, preventing it from dripping onto the surface of the heating element and circuit board. This helps avoid the risk of liquid ingress onto the circuit board and heating element, improving the operational reliability of the functional modules.

[0045] In one possible implementation, the circuit board includes a first surface and a second surface, the first surface and the second surface being disposed opposite to each other in the thickness direction of the circuit board, the first surface facing the bottom of the housing and the second surface facing the top of the housing;

[0046] The number of heating devices is multiple, and the multiple heating devices are connected to the first surface and the second surface;

[0047] The cooling structure includes a first cooling structure and a second cooling structure, wherein the first cooling structure is connected to the heating device connected to the first surface, and the second cooling structure is connected to the heating device connected to the second surface;

[0048] The functional module further includes a drainage structure, which is located between the second cooling structure and the heating device, and between the second cooling structure and the circuit board. The drainage structure isolates the second cooling structure and the heating device, and isolates the second cooling structure and the circuit board. The drainage structure is used to guide the liquid outside the second cooling structure to the drain port.

[0049] Secondly, this application also provides a heat dissipation system, which includes the functional modules described above.

[0050] Thirdly, this application also provides a vehicle that includes the functional modules described above. Attached Figure Description

[0051] Figure 1 is a simplified schematic diagram of an application scenario of the heat dissipation system provided in an embodiment of this application;

[0052] Figure 2 is a diagram of another application scenario of the heat dissipation system provided in the embodiment of this application;

[0053] Figure 3 is a schematic diagram of the structure of functional modules in related technologies;

[0054] Figure 4 is a cross-sectional schematic diagram of a functional module provided in the first embodiment of this application;

[0055] Figure 5 is another cross-sectional schematic diagram of the functional modules provided in the first embodiment of this application;

[0056] Figure 6 is a simplified schematic diagram of the projection of the heating device 30 and cooling structure 40 shown in Figure 3 onto the circuit board 10.

[0057] Figure 7 is a cross-sectional schematic diagram of a functional module provided in the second embodiment of this application;

[0058] Figure 8 is a cross-sectional schematic diagram of a functional module provided in the third embodiment of this application;

[0059] Figure 9 is another cross-sectional schematic diagram of the functional modules provided in the third embodiment of this application;

[0060] Figure 10 is a cross-sectional schematic diagram of a functional module provided in the third embodiment of this application;

[0061] Figure 11 is a cross-sectional schematic diagram of a functional module provided in the fourth embodiment of this application;

[0062] Figure 12 is a cross-sectional schematic diagram of a functional module provided in the fifth embodiment of this application;

[0063] Figure 13 is a cross-sectional schematic diagram of a functional module provided in the sixth embodiment of this application;

[0064] Figure 14 is a cross-sectional schematic diagram of a functional module provided in the seventh embodiment of this application;

[0065] Figure 15 is another cross-sectional schematic diagram of the functional modules provided in the seventh embodiment of this application;

[0066] Figure 16 is a cross-sectional schematic diagram of a functional module provided in the eighth embodiment of this application;

[0067] Figure 17 is another cross-sectional schematic diagram of the functional modules provided in the eighth embodiment of this application;

[0068] Figure 18 is a cross-sectional schematic diagram of a functional module provided in the ninth embodiment of this application;

[0069] Figure 19 is another cross-sectional schematic diagram of the functional modules provided in the ninth embodiment of this application;

[0070] Figure 20 is another cross-sectional schematic diagram of the functional modules provided in the ninth embodiment of this application;

[0071] Figure 21 is a cross-sectional schematic diagram of a functional module provided in the tenth embodiment of this application;

[0072] Figure 22 is a cross-sectional schematic diagram of a functional module provided in the eleventh embodiment of this application;

[0073] Figure 23 is a cross-sectional schematic diagram of a functional module provided in the twelfth embodiment of this application. Detailed Implementation

[0074] For ease of understanding, the terminology used in the embodiments of this application will be explained first.

[0075] And / or: This is simply a way of describing the relationship between related objects. It indicates that there can be three kinds of relationships. For example, A and / or B can represent three situations: A exists alone, A and B exist simultaneously, and B exists alone.

[0076] Multiple: refers to two or more.

[0077] Connection: should be interpreted broadly. For example, the connection between A and B can be a direct connection between A and B, or an indirect connection between A and B through an intermediary.

[0078] Spacing settings refer to a certain physical distance between objects. For example, spacing between A and B means that A and B have a certain distance between them. Multiple A's can be spaced at equal intervals or at unequal intervals.

[0079] Permissible tolerance range: This refers to the maximum allowable deviation range of a part's actual dimensions, shape, and position during manufacturing and assembly. Excessive precision requirements increase manufacturing costs, while insufficient precision may affect the part's performance. Therefore, setting this range ensures the interchangeability and functionality of the part, while also considering practical limitations and economic considerations during manufacturing and assembly. Tolerances can be one or more combinations of assembly dimensional deviations, cumulative operational errors, and machining dimensional deviations. For example, tolerances can be one or more combinations of dimensional tolerances, form tolerances, or flatness tolerances.

[0080] The specific embodiments of this application will now be clearly described in conjunction with the accompanying drawings.

[0081] Embodiments of this application provide a functional module, a heat dissipation system, and a vehicle. The functional module can be applied to a vehicle or a heat dissipation system. The vehicle can be, but is not limited to, a pure electric vehicle, a range-extended electric vehicle, a hybrid electric vehicle, a fuel cell vehicle, or a new energy vehicle. The heat dissipation system can be, but is not limited to, a vehicle's thermal management system, an energy storage battery's thermal management system, or a thermal management system for electronic devices (such as mobile phones, tablets, and laptops), or any other heat dissipation system requiring cooling.

[0082] The following explanation will use the cooling system as an example of a vehicle's thermal management system, but it should be understood that this is not the only explanation.

[0083] The cooling system can include the refrigerant circuit of the air conditioning system, the liquid cooling circuit of the battery, and the liquid cooling circuit of the electric drive. The heat exchange object of the refrigerant circuit of the air conditioning system can be the vehicle's air conditioning system. The heat exchange object of the liquid cooling circuit of the battery can be the power battery heat exchange system. The heat exchange object of the liquid cooling circuit of the electric drive can be the vehicle controller and the power motor assembly. The vehicle controller, power motor assembly, and power battery heat exchange system are related to the vehicle's power performance and handling performance, while the vehicle's air conditioning system affects the vehicle's safety and passenger cabin comfort. The cooling system can control the heat exchange between various working fluids to maintain the temperature of the vehicle's passenger cabin, power battery, motor, and other controlled objects within a target range.

[0084] The cooling system may also include functional modules. These modules support liquid cooling and can be connected to the refrigerant circuit of an air conditioning system, a battery liquid cooling circuit, or an electric drive liquid cooling circuit. The functional modules can exchange heat with the cooling medium in these circuits to achieve heat dissipation and ensure normal operation. In other embodiments, the cooling system may also include an engine liquid cooling circuit, and the functional modules may be connected to this circuit. Alternatively, the functional modules may not be limited to cooling systems but can be applied to other engineering fields employing liquid cooling, such as computers, data centers, and server rooms.

[0085] The functional modules can be, but are not limited to, in-vehicle computing platforms, and must possess at least one or more of the following functions: intelligent driving-related perception functions, intelligent driving-related decision-making functions, intelligent driving-related control functions, and intelligent cockpit functions such as human-machine interaction. Examples of functional modules include in-vehicle mobile data centers (MDCs), cockpit domain controllers (CDCs), also known as vehicle infotainment modules, LiDAR, and headlight modules. In other embodiments, the functional modules may also be non-vehicle components.

[0086] In one possible application scenario, please refer to Figure 1, which is a simplified schematic diagram of an application scenario of the heat dissipation system 200 provided in this application embodiment. In Figure 1, the arrows indicate the flow direction of the cooling medium. Furthermore, the components and their connections in the electric-driven liquid-cooled circuit 230 in Figure 1 are only for illustrating the flow direction of the cooling medium and do not constitute a limitation on the actual structure and connection relationship of the components.

[0087] Functional module 100 is connected to the electric drive liquid cooling circuit 230. The electric drive liquid cooling circuit 230 may further include an electric drive assembly 2310, a front-end cooling module 2320, and an electric drive liquid pump 2330. The electric drive assembly 2310, functional module 100, front-end cooling module 2320, and electric drive liquid pump 2330 may be connected in series. The coolant circulates in the electric drive liquid cooling circuit 230 driven by the electric drive liquid pump 2330. When the coolant flows through the electric drive assembly 2310 and functional module 100, it exchanges heat with the electric drive assembly 2310 and functional module 100 to dissipate heat from them. When the cooling medium carrying heat flows through the front-end cooling module 2320, the heat is dissipated by the fan in the front-end cooling module 2320 and then flows back to the electric drive assembly 2310 and the functional module 100, thus achieving liquid cooling heat dissipation of the electric drive liquid cooling circuit 230 through repeated cycles. For example, the cooling medium can be a mixture of water and ethylene glycol in a 50%:50% ratio.

[0088] In another possible application scenario, please refer to Figure 2, which is another application scenario diagram of the heat dissipation system 200 provided in the embodiments of this application. In Figure 2, the direction of the arrows indicates the flow direction of the cooling medium. Furthermore, the components and their connections in the battery liquid cooling circuit 220 in Figure 2 are only for illustrating the flow direction of the cooling medium and do not constitute a limitation on the actual structure and connection relationship of the components.

[0089] Functional module 100 is connected to battery liquid cooling circuit 220. Battery liquid cooling circuit 220 may also include battery cold plate 2210, battery cooler 2220, and electric-driven liquid pump 2230. Battery cold plate 2210, functional module 100, battery cooler 2220, and electric-driven liquid pump 2230 can be connected in series. The first cooling medium circulates in battery liquid cooling circuit 220 driven by electric-driven liquid pump 2230. When the first cooling medium flows through battery cold plate 2210 and functional module 100, it exchanges heat with them to dissipate heat. When the first cooling medium carrying heat flows through battery cooler 2220, it is cooled by the battery cooler 2220 and then flows back to battery cold plate 2210 and functional module 100, repeating this cycle to achieve liquid cooling of battery liquid cooling circuit 220.

[0090] The battery liquid cooling circuit 220 may further include a battery expansion valve 2240, a condenser 2250, and a compressor 2260. The battery expansion valve 2240, battery cooler 2220, compressor 2260, and condenser 2250 can be connected in series. After passing through the battery expansion valve 2240, the liquid second cooling medium experiences a rapid pressure drop, becoming a low-temperature, low-pressure gas-liquid mixture. This mixture flows into the battery cooler 2220, where it absorbs heat and evaporates, becoming gaseous. The gaseous second cooling medium then flows into the compressor 2260, where it is compressed into a high-temperature, high-pressure gaseous state. This high-temperature, high-pressure gaseous second cooling medium flows into the condenser 2250, where it condenses and releases heat, becoming liquid again. The liquid second cooling medium then re-enters the battery expansion valve 2240, thus circulating the mixture and enabling heat exchange between the first and second liquid cooling media within the battery cooler 2220. For example, the battery cooler 2220 can be a plate heat exchanger.

[0091] Please refer to Figure 3, which is a structural schematic diagram of functional module 1 in the related technology. In Figure 3, solid arrows indicate the flow direction of coolant in and out, droplets represent condensation, and dashed arrows indicate the dripping direction of condensation.

[0092] In related technologies, functional module 1 may include a liquid cooling plate 2, a module housing 8, and a circuit board assembly 3. The liquid cooling plate 2 and the module housing 8 are connected and together form the external structure of functional module 1. The liquid cooling plate 2 and the module housing 8 also enclose a receiving cavity 4 forming functional module 1. The circuit board assembly 3 is located within the receiving cavity 4. Coolant flows from the flow channel 5 of the liquid cooling plate 2 into the large-area liquid cooling plate 2 and exchanges heat with all components inside the module. A certain degree of airtightness design is required between the module housing 8, the liquid cooling plate 2, and the module housing 8 to ensure that the receiving cavity 4 is a closed cavity.

[0093] Understandably, in related technologies, the liquid cooling plate 2 is positioned above the circuit board assembly 3 as a large-area flow channel 5, simultaneously dissipating heat from all components within the circuit board assembly 3. When the inlet water temperature of the flow channel 5 is lower than the ambient dew point temperature, condensation will occur on the inner surface of the liquid cooling plate 2 located in the receiving cavity 4. Due to the large area of ​​the liquid cooling plate 2, a relatively large number of droplets are generated during condensation. To prevent condensation droplets from flowing into the circuit board assembly 3 and causing corrosion or short circuits in the components, the module housing 8 and the connector 6 located in the circuit board assembly 3 need to be designed with a high level of protection (e.g., IP67 protection level) for waterproofing and dustproofing, i.e., an airtight design. Additionally, a moisture-absorbing bag 7 needs to be added inside the module to absorb the moisture generated by the liquid cooling plate 2, preventing moisture condensation on the surface of the circuit board assembly 3 and causing module failure. However, this anti-condensation method has a complex architecture, high cost, and cannot completely eliminate the risk of water contact with the circuit board assembly 3.

[0094] To address the aforementioned issues, embodiments of this application provide a functional module 100 that can resolve the risk of condensation on the module while satisfying its heat dissipation performance. The structure of the functional module 100 will be described in detail below through multiple embodiments.

[0095] First embodiment:

[0096] Please refer to Figures 4 and 5. Figure 4 is a cross-sectional schematic diagram of the functional module 100 provided in the first embodiment of this application, and Figure 5 is another cross-sectional schematic diagram of the functional module 100 provided in the first embodiment of this application. In Figures 4 and 5, the dashed arrows indicate the flow direction of the cooling working fluid, the droplets represent the liquid outside the cooling structure 40, and the solid arrows indicate the flow direction of the liquid outside the cooling structure 40.

[0097] In this embodiment, the functional module 100 may include a housing 10, a circuit board 20, a heat-generating device 30, and a cooling structure 40. The housing 10 serves as the external structure of the functional module 100, accommodating all components of the functional module 100 and providing good mechanical support and protection for them. The circuit board 20 and the heat-generating device 30 are both located within the housing. The circuit board 20 can serve as a carrier for electronic components, providing electrical connection, protection, support, heat dissipation, and assembly functions, and can also act as a heat conductor to transfer heat from the electronic components. The heat-generating device 30 is electrically connected to the circuit board 20 and is an electronic component that generates heat during the operation of the functional module 100. The cooling structure 40 supports liquid cooling, dissipating heat from inside the functional module 100 (such as the heat from the heat-generating device 30 and / or the heat from the circuit board 20) to the external environment through liquid cooling circulation, thus achieving heat dissipation for the functional module 100.

[0098] Understandably, during the use of functional module 100, the location of the heat-generating device 30 will heat up due to the focused heat. If cooling measures are not taken in time, it will adversely affect the normal operation of functional module 100. However, by setting up a cooling structure 40 and enabling the cooling structure 40 to support liquid cooling, the heat generated by the heat-generating device 30 can be dissipated to the outside of functional module 100 in a timely and effective manner through the liquid cooling circulation within the cooling structure 40, thereby cooling the heat-generating device 30 and improving the heat dissipation reliability of functional module 100.

[0099] It should be noted that Figures 4 and 5 are merely schematic depictions of the connection relationships between the housing 10, circuit board 20, heating element 30, and cooling structure 40, and are not intended to specifically limit the connection positions, specific structures, or quantities of each device. Furthermore, the structure illustrated in this embodiment does not constitute a specific limitation on the functional module 100. In other embodiments of this application, the functional module 100 may include more or fewer components than those shown in Figures 4 and 5, or combine certain components, split certain components, or have different component arrangements. The components shown in Figures 4 and 5 can be implemented in hardware, software, or a combination of both.

[0100] In this embodiment, the outer shell 10 can surround and form the cavity W. The cavity W can be used to house the circuit board 20, the heating device 30, and at least part of the cooling structure 40.

[0101] The outer shell 10 can be a non-fully enclosed shell, meaning that the cavity W formed by the outer shell 10 is not completely sealed, and the airtightness of the outer shell 10 does not need to be guaranteed during assembly. That is, the outer shell 10 can be a non-airtight shell, meaning that the outer shell 10 has one or more openings (such as gaps, mesh, etc.) connecting the cavity W, which can protect the components inside the outer shell 10 from external damage while ensuring appropriate heat dissipation. Furthermore, the outer shell 10 can include multiple sub-shells. These multiple sub-shells can be fixed together by one or more methods such as welding, bonding, or snap-fitting, and enclose the cavity W forming the outer shell 10. For example, the outer shell 10 can include a main shell and a bottom shell. The main shell and the bottom shell can be connected and enclose the cavity W forming the outer shell 10. The bottom shell refers to the bottom shell of the functional module 100, which serves to support and protect the internal components.

[0102] The outer casing 10 may also be provided with a drain port 11. The drain port 11 can communicate with both the cavity W and the outside of the outer casing 10. That is, the drain port 11 is a through hole or through groove structure opened in the outer casing 10. The drain port 11 can communicate with both the cavity W and the outside of the outer casing 10. The number of drain ports 11 can be one or more. When there are multiple drain ports 11, the multiple drain ports 11 can be arranged at intervals on the outer casing 10. The structures of the multiple drain ports 11 can be similar, identical, or different. In this embodiment, there are no strict limitations on the characteristic parameters of the drain ports 11, such as the number, shape, and position, as long as they can communicate with both the cavity W and the outside of the outer casing 10. For example, the drain port 11 can be located at the bottom of the outer casing 10.

[0103] The circuit board 20 can be located within the cavity W and directly or indirectly connected to the housing 10. For example, the circuit board 20 can be fixed to a circuit board bracket, which in turn is fixed to the housing 10. That is, the circuit board 20 can be fixedly connected to the housing 10 via the circuit board bracket. Alternatively, the circuit board 20 and the housing 10 can be fixedly connected by means such as screw fastening or snap-fitting.

[0104] The circuit board 20 can be a rigid circuit board, a flexible circuit board, or a rigid-flex circuit board. The circuit board 20 can be a single-sided board with electronic components on one side, or a double-sided board with electronic components on both sides. There can be one or more circuit boards 20. When there is only one circuit board 20, it forms a single-layer circuit board architecture. When there are multiple circuit boards 20, they can be stacked sequentially and spaced apart to form a multi-layer circuit board stack architecture with two or more layers. In multiple circuit boards 20, adjacent circuit boards 20 can be electrically connected and / or elevated together via a frame board (FB). The structures of the multiple circuit boards 20 can be similar, identical, or different. The following explanation uses a single circuit board 20 as an example, but it should be understood that this is not a limitation.

[0105] In this embodiment, the placement direction of the circuit board 20 can be perpendicular to the thickness direction of the circuit board 20 (within acceptable tolerance range). The circuit board 20 may include a first surface 21 and a second surface 22. The first surface 21 and the second surface 22 may be arranged opposite to each other in the thickness direction of the circuit board 20. The first surface 21 faces the bottom of the housing 10, and the second surface 22 may face the top of the housing 10. For example, the angle between the placement direction of the circuit board 20 and the thickness direction of the circuit board 20 can be 90 degrees. Alternatively, the angle between the placement direction of the circuit board 20 and the thickness direction of the circuit board 20 can also be approximately 90 degrees, for example, it can be 87 degrees, 88 degrees, 89 degrees, 91 degrees, 92 degrees, 93 degrees, etc.

[0106] The heat-generating device 30 can be located within the cavity W and electrically connected to the first surface 21 of the circuit board 20. The heat-generating device 30 can be, but is not limited to, a system-on-chip (SOC), a graphics processing unit (GPU), universal flash storage (UFS), a central processing unit (CPU), a DC-DC converter, a generator control unit (GCU), a motor controller unit (MCU), double data rate (DDR) memory, dynamic random access memory (DRAM), a radio frequency integrated circuit (RFIC), a radio frequency power amplifier (RFPA), a wireless fidelity chip (WIFI), a power management unit (PMU), an auxiliary power management chip, etc.

[0107] The number of heating elements 30 can be one or more. When there are multiple heating elements 30, they can be connected at intervals to the first surface 21 of the circuit board 20. The multiple heating elements 30 can be arranged at equal intervals or at unequal intervals. Each heating element 30 is electrically connected to the circuit board 20. The multiple heating elements 30 can be the same or different. The following description uses a single heating element 30 as an example, but it should be understood that this is not a limitation.

[0108] At least a portion of the cooling structure 40 is located within the cavity W. That is, the cooling structure 40 may be entirely located within the cavity W, or it may be partially located within the cavity W. The cooling structure 40 is also located on the side of the heating device 30 facing away from the circuit board 20, and is capable of receiving heat from the heating device 30, or from both the heating device 30 and the circuit board 20. The projection of the cooling structure 40 onto the circuit board 20 along the thickness direction of the circuit board 20 covers at least a portion of the projection of the heating device 30 onto the circuit board 20 along the thickness direction of the circuit board 20. The cooling structure 40 may also be fixedly connected to the housing 10 and / or the circuit board 20 to enhance the installation stability of the cooling structure 40. Exemplarily, the cooling structure 40 may be fixedly connected to the housing 10 and to the circuit board 20 by means such as screw fastening or snap-fitting.

[0109] In one possible application scenario, please refer to Figure 6, which is a simplified schematic diagram of the projection of the heating device 30 and cooling structure 40 shown in Figure 3 onto the circuit board 10. In Figure 6, the dashed arrows indicate the thickness direction of the circuit board 10, i.e., the projection direction of the heating device 30 and the cooling structure 40. For ease of illustration, the thickness direction of the circuit board 10 is defined as the Z-direction.

[0110] In this application scenario, the projection R2 of the cooling structure 40 on the circuit board 20 along the Z direction can cover the projection R1 of the heat-generating device 30 on the circuit board 20 along the thickness direction of the circuit board 20.

[0111] In this embodiment, the cooling structure 40 is provided with a flow channel 41. The flow channel 41 can be used to allow the cooling medium to flow through, so as to remove the heat from the heat-generating device 30 and the circuit board 20 and dissipate heat from the heat-generating device 30 and / or the circuit board 20. Liquid located outside the cooling structure 40 can be discharged from the outer casing 10 through the drain port 11. It should be noted that the flow channel 41 shown in the figure is only for illustrative purposes and does not constitute a limitation on the actual structure of the flow channel 41.

[0112] It is understandable that, since the heat from the heating device 30 and / or the circuit board 20 can be transferred to the cooling structure 40, and the cooling structure 40 has a flow channel 41 inside, the cooling medium can flow into the cooling structure 40 from the flow channel 41, and carry the heat from the heating device 30 and the circuit board 20 conducted to the cooling structure 40 during the flow in the flow channel 41, so as to exchange heat and cool the heating device 30 and the circuit board 20, thereby achieving liquid cooling of the heating device 30 and the circuit board 20.

[0113] By providing a drain port 11 on the outer casing 10, the cavity W formed by the outer casing 10 can be made non-enclosed and connected to the outside of the outer casing 10, thus maintaining a certain air communication between the cavity W and the outside of the outer casing 10. Since both the heating element 30 and the circuit board 20 generate heat during operation, the temperature at their locations will be higher than the ambient air temperature. Therefore, even when the cavity W is not enclosed, the heat generation function of the heating element 30 and the circuit board 20 ensures that condensation will not occur on their surfaces within the cavity W. Furthermore, the module as a whole does not require high-level airtight protection, saving the cost of additional airtight protection and moisture-absorbing packs required for condensation prevention.

[0114] When the temperature of the cooling medium in the flow channel 41 is lower than the ambient dew point temperature, liquid (i.e., condensation) will form on the outer surface of the cooling structure 40. This liquid can be drained from the outer surface of the cooling structure 40 through the drain port 11 to the outside of the module, effectively preventing liquid from accumulating inside the module and dripping into the circuit board 20, causing corrosion of the circuit board 20 and / or short circuits in the devices on the circuit board 20, thus leading to the failure of the functional module 100. This effectively solves the condensation risk of the module while meeting the heat dissipation performance requirements of the functional module 100. Furthermore, the heat dissipation architecture composed of the circuit board 20, electronic components 70, and cooling structure 40 has a simple structure, which helps reduce the production cost of the functional module 100 and improve the module's production efficiency.

[0115] Furthermore, compared to the large-area cold plate layout of related technologies, in this embodiment, at least a portion of the cooling structure 40 is located within the cavity W and close to the heat-generating device 30. This reduces the cooling area of ​​the cooling structure 40 from full-area cooling to localized cooling of high-heat-dissipating devices, significantly decreasing its cooling area. Due to the smaller cooling area, this localized cooling solution results in significantly less condensation on the surface of the cooling structure 40 compared to the cold plate solution of related technologies. This not only reduces the coverage area of ​​the cold plate structure, thereby reducing the volume and weight of structural components and achieving efficient localized heat dissipation, but also facilitates layout and further reduces the cost of the module.

[0116] In this embodiment, the circuit board 20, the heating element 30, and the cooling structure 40 can be arranged parallel to the thickness direction of the circuit board 20. Specifically, the thickness direction of the circuit board 20 can be parallel to the gravity direction G (within acceptable tolerance). Alternatively, the thickness direction of the circuit board 20 can be inclined to the gravity direction G. For example, the angle between the thickness direction of the circuit board 20 and the gravity direction G can be 30 degrees, 35 degrees, 40 degrees, 45 degrees, 50 degrees, 55 degrees, 60 degrees, etc. Alternatively, the thickness direction of the circuit board 20 can be perpendicular to the gravity direction G (within acceptable tolerance). For example, the angle between the thickness direction of the circuit board 20 and the gravity direction G can be 90 degrees or approximately 90 degrees, such as 87 degrees, 88 degrees, 89 degrees, 91 degrees, 92 degrees, 93 degrees, etc.

[0117] The following explanation will take the case where the thickness direction of the circuit board 20 is parallel to the direction of gravity G as an example, but it should be understood that this is not a limitation.

[0118] Referring to Figures 4 and 5, the circuit board 20, the heating element 30, and the cooling structure 40 can be arranged parallel to the direction of gravity G. The circuit board 20, the heating element 30, and the cooling structure 40 are arranged sequentially along the direction of gravity G.

[0119] It is understandable that since the cooling structure 40 is located below the heating device 30 and the circuit board 20, when a small amount of condensation is generated on the outside of the cooling structure 40, the condensate droplets will flow downwards due to gravity and flow out of the module from the drain port 11. They will not flow upwards against gravity to the surface of the heating device 30 and the circuit board 20, which helps to avoid the risk of liquid entering the circuit board 20 and the heating device 30 and improves the working reliability of the functional module 100.

[0120] In this embodiment, as shown in FIG4, an air gap may exist between the cooling structure 40 and the heating device 30. Heat from the heating device 30 and the circuit board 20 can be transferred to the cooling structure 40 through this air gap. Alternatively, as shown in FIG5, the cooling structure 40 may be connected to the heating device 30 to enhance the stability and reliability of the connection between them. The following description will use the connection between the cooling structure 40 and the heating device 30 as an example, but it should be understood that this is not a limitation.

[0121] Referring to Figure 5, the functional module 100 may further include a first thermally conductive layer 51. The first thermally conductive layer 51 is connected between the heat-generating device 30 and the cooling structure 40. The first thermally conductive layer 51 can receive heat from the heat-generating device 30 and the circuit board 20, and conduct the heat from the heat-generating device 30 and / or the circuit board 20 to the cooling structure 40, so that it can be dissipated to the outside of the functional module 100 through the cooling structure 40.

[0122] The first thermally conductive layer 51 has good thermal conductivity and can be made of a thermal interface material (TIM). For example, the first thermally conductive layer 51 can be thermal grease, thermal gel, phase change material, thermal pad, thermal film, liquid metal, etc. In other embodiments, the first thermally conductive layer 51 can also be other structural components with good thermal conductivity, such as a heat sink, metal plate, etc.

[0123] It is understandable that by connecting the first thermally conductive layer 51 between the heat-generating device 30 and the cooling structure 40, the excellent thermal conductivity of the first thermally conductive layer 51 can be used to transfer the heat of the heat-generating device 30 and / or the circuit board 20 to the cooling structure 40, and the good heat dissipation performance of the cooling structure 40 can be used to remove the heat of the heat-generating device 30 and the circuit board 20, thereby achieving rapid heat dissipation and effectively improving the heat dissipation efficiency of the functional module 100.

[0124] Referring to Figure 5, the cooling structure 40 may include a heat exchange section 42 and a liquid cooling pipe 43. The heat exchange section 42 and at least a portion of the liquid cooling pipe 43 are located within the cavity W. The heat exchange section 42 can be connected to the heating device 30, and may be a liquid cooling head. The liquid cooling pipe 43 can be connected to the heat exchange section 42. The liquid cooling pipe 43 may have an inlet T1 and an outlet T2. A flow channel 41 can extend within the heat exchange section 42 and the liquid cooling pipe 43, and communicate with both the inlet T1 and the outlet T2. Low-temperature cooling fluid can flow into the flow channel 41 through the inlet T1, and in the flow of the flow channel 41, it carries the heat from the cooling structure 40 and heats up. The heated cooling fluid can then flow out of the flow channel 41 through the outlet T2, repeating this process to achieve the heat exchange function of the cooling structure 40.

[0125] The heat exchange section 42 and the heating element 30 can be connected through the first heat-conducting layer 51. Alternatively, in some other embodiments, an air gap may exist between the heat exchange section 42 and the heating element 30. The number of liquid inlets T1 can be one or more. When there are multiple liquid inlets T1, they can be spaced apart on the outer casing 10. The structures of the multiple liquid inlets T1 can be similar, identical, or different. The number of liquid outlets T2 can be one or more. When there are multiple liquid outlets T2, they can be spaced apart on the outer casing 10. The structures of the multiple liquid outlets T2 can be similar, identical, or different. This embodiment does not strictly limit the characteristic parameters of the liquid inlets T1 (number, shape, position) and the liquid outlets T2 (number, shape, position), as long as both the liquid inlets T1 and T2 can communicate with the cavity W of the outer casing 10 and the outside of the outer casing 10.

[0126] When the liquid cooling pipe 43 is entirely located within the cavity W, the inlet T1 and outlet T2 can be located within the cavity W. When the liquid cooling pipe 43 is partially located within the cavity W and the remaining portion is located within the outer casing 10, the inlet T1 and outlet T2 can be located on the outer casing 10. When the liquid cooling pipe 43 is partially located within the cavity W and the remaining portion is located on the outer casing 10 and outside the outer casing 10, the inlet T1 and outlet T2 can be located outside the outer casing 10. The inlet T1 and outlet T2 can be connected to any liquid cooling circuit of the heat dissipation system 200, such as the battery liquid cooling circuit 220. For example, the inlet T1 and outlet T2 can be connected to any liquid cooling circuit of the heat dissipation system 200 via a quick-connect coupling.

[0127] It is understandable that by extending the flow channel 41 within the heat exchange section 42 and the liquid cooling pipe 43, the cooling medium can flow within both the liquid cooling pipe 43 and the heat exchange section 42, thereby maximizing the liquid cooling heat exchange area between the cooling structure 40 and the heat-generating device 30 and enhancing the liquid cooling heat dissipation performance of the cooling structure 40.

[0128] In this embodiment, the heat exchange section 42 and the liquid cooling pipe 43 can be an integral structure. For example, the heat exchange section 42 and the liquid cooling pipe 43 can be connected in a one-piece molding manner to form an integral structure. It is understood that the cooling structure 40 formed by the integral structure has fewer parts, which helps to simplify the manufacturing process of the cooling structure 40 and improve the production and assembly efficiency of the cooling structure 40.

[0129] Alternatively, the heat exchanger 42 and the liquid cooling pipe 43 can be separately configured. For example, the heat exchanger 42 and the liquid cooling pipe 43 can be fixed together by assembly methods such as welding, bonding, screwing, or snap-fitting. It is understood that the split-design cooling structure 40 can be formed by connecting the heat exchanger 42 and the liquid cooling pipe 43, simplifying the cooling structure 40 through assembly of the heat exchanger 42 and the liquid cooling pipe 43, avoiding the problem of reduced strength due to excessive extension length of the same structural component, and facilitating positioning and assembly.

[0130] Second embodiment:

[0131] Please refer to Figure 7, which is a cross-sectional schematic diagram of the functional module 100 provided in the second embodiment of this application. In Figure 7, the dashed arrows indicate the flow direction of the cooling working fluid, the droplets represent the liquid outside the cooling structure 40, and the solid arrows indicate the flow direction of the liquid outside the cooling structure 40. Furthermore, Figure 7 is only intended to schematically depict the connection relationships of the various structures in the functional module 100, and does not constitute a specific limitation on the connection positions, specific constructions, or quantities of each structure. That is, the structures illustrated in this embodiment do not constitute a specific limitation on the functional module 100.

[0132] In this embodiment, the contents that are the same as in the first embodiment will not be repeated. The difference from the first embodiment is that the structure of the cooling structure 40 is different, which will be described in detail below. In addition, the description of the structural improvements of the functional module 100 in this embodiment can be applied to the first embodiment above, unless there is any conflict.

[0133] In this embodiment, the heat exchange section 42 can be a heat-conducting structure. The flow channel 41 extends only within the liquid cooling pipe 43 and is connected to both the liquid inlet T1 and the liquid outlet T2.

[0134] The heat exchange section 42 can be made of any material with good thermal conductivity; for example, it can be made of metal. The material of the heat exchange section 42 can be the same as or different from the material of the liquid cooling pipe 43. Furthermore, the heat exchange section 42 can be a solid structure. Alternatively, it can be a hollow structure. Exemplarily, the heat exchange section 42 and the liquid cooling pipe 43 can be welded together.

[0135] It is understandable that by extending the flow channel 41 within the liquid cooling pipe 43, the cooling medium can flow within the liquid cooling pipe 43. Furthermore, by connecting the heat exchange section 42 between the liquid cooling pipe 43 and the heat-generating device 30, the excellent thermal conductivity of the heat exchange section 42 can efficiently and conveniently transfer heat from the heat-generating device 30 to the liquid cooling pipe 43. This helps reduce the thermal temperature difference and thermal resistance between the heat-generating device 30 and the liquid cooling pipe 43, ensuring the heat transfer efficiency between the cooling structure 40 and the heat-generating device 30, and enhancing the heat dissipation performance of the cooling structure 40.

[0136] It should be noted that this embodiment does not impose strict restrictions on the number, shape, position, or other characteristic parameters of the heat exchange section 42, as long as it can be connected between the heating device 30 and the liquid cooling pipe 43.

[0137] Third embodiment:

[0138] Please refer to Figures 8, 9, and 10. Figure 8 is a cross-sectional schematic diagram of the functional module 100 provided in the third embodiment of this application; Figure 9 is another cross-sectional schematic diagram of the functional module 100 provided in the third embodiment of this application; and Figure 10 is a cross-sectional schematic diagram of the functional module 100 provided in the third embodiment of this application. In Figures 8-10, the dashed arrows indicate the flow direction of the cooling working fluid, the droplets represent the liquid outside the cooling structure 40, and the solid arrows indicate the flow direction of the liquid outside the cooling structure 40. Furthermore, Figures 8-10 are only intended to schematically describe the connection relationships of the various structures in the functional module 100, and are not intended to specifically limit the connection positions, specific structures, or quantities of each structure. That is, the structures illustrated in this embodiment do not constitute a specific limitation on the functional module 100.

[0139] In this embodiment, the contents that are the same as in the first embodiment will not be repeated. The difference from the first embodiment is that the drain port 11 can be located at the bottom of the outer casing 10. The bottom of the outer casing 10 can also be provided with a drain structure 61, which is located within the cavity W. Furthermore, the descriptions of structural improvements to the functional module 100 in this embodiment can be applied to both the first and second embodiments described above, unless there is conflict.

[0140] In this embodiment, the drainage structure 61 can be a tray capable of collecting droplets. Alternatively, the drainage structure 61 can be a porous medium with water absorption function, such as absorbent cloth or sponge. Alternatively, the drainage structure 61 can be a flow channel structure disposed at the bottom of the outer casing 10. Alternatively, the drainage structure 61 can be a sloped structure disposed at the bottom of the outer casing 10. Of course, the drainage structure 61 is not limited to the structures listed above. Any structure capable of collecting droplets on the outside of the cooling structure 40 and guiding them to the drainage port 11 is within the scope of protection claimed in this embodiment, and no strict limitation is imposed.

[0141] It is understandable that by adding an additional drain structure 61 at the bottom of the outer casing 10, not only can the drain structure 61 catch the droplets falling from the outside of the cooling structure 40, but it can also collect the droplets and guide them to the drain port 11 of the outer casing 10, so that the droplets can flow out of the functional module 100 from the drain port 11 of the outer casing 10, thus playing a good guiding role.

[0142] As shown in Figure 8, the projection of the drain structure 61 onto the housing 10 along the height direction of the functional module 100 can cover the entire projection of the cooling structure 40 onto the housing 10 along the height direction of the functional module 100. That is, the drain structure 61 can be positioned directly opposite the cooling structure 40 along the height direction of the functional module 100.

[0143] Alternatively, as shown in Figure 9, the projection of the drain structure 61 onto the housing 10 along the height direction of the functional module 100 can partially cover the projection of the cooling structure 40 onto the housing 10 along the height direction of the functional module 100. That is, the drain structure 61 can be partially offset from the cooling structure 40 along the height direction of the functional module 100.

[0144] Alternatively, as shown in Figure 9, the projection of the drain structure 61 onto the housing 10 along the height direction of the functional module 100 can be offset from the projection of the cooling structure 40 onto the housing 10 along the height direction of the functional module 100. That is, the drain structure 61 can be completely offset from the cooling structure 40 along the height direction of the functional module 100. Furthermore, a guide structure can be provided at the bottom of the housing 10 to guide liquid dripping onto the bottom of the housing 10 to the drain structure 61, so that the liquid can eventually be discharged to the outside of the housing 10 through the drain structure 61.

[0145] For example, the cooling structure 40 of this embodiment may include a heat exchange section 42 and a liquid cooling pipe 43. The structure of the heat exchange section 42 and the liquid cooling pipe 43 of this embodiment can generally refer to the structure of the heat exchange section 42 and the liquid cooling pipe 43 in the first embodiment above, or can refer to the structure of the heat exchange section 42 and the liquid cooling pipe 43 in the second embodiment above, and will not be described again here.

[0146] Fourth embodiment:

[0147] Please refer to Figure 11, which is a cross-sectional schematic diagram of the functional module 100 provided in the fourth embodiment of this application. In Figure 11, the dashed arrows indicate the flow direction of the cooling working fluid, the droplets represent the liquid outside the cooling structure 40, and the solid arrows indicate the flow direction of the liquid outside the cooling structure 40. Furthermore, Figure 11 is only intended to schematically depict the connection relationships of the various structures in the functional module 100, and does not constitute a specific limitation on the connection positions, specific constructions, or quantities of each structure. That is, the structures illustrated in this embodiment do not constitute a specific limitation on the functional module 100.

[0148] In this embodiment, the contents that are the same as in the first embodiment will not be repeated. The difference from the first embodiment is that the functional module 100 may further include a first heat insulation structure 62. In addition, the description of the structural improvements of the functional module 100 in this embodiment can be applied to the first to third embodiments above, unless there is any conflict.

[0149] The first heat insulation structure 62 can be located inside the cavity W and also outside the cooling structure 40. The first heat insulation structure 62 can cover part or all of the cooling structure 40. The material of the first heat insulation structure 62 can be a material with low thermal conductivity. For example, the first heat insulation structure 62 can be thermal insulation cotton. In other embodiments, the material of the first heat insulation structure 62 can also be a material with certain water absorption properties, such as sponge, foam, etc.

[0150] It is understood that by providing a first heat insulation structure 62 on at least a portion of the outer surface of the cooling structure 40, the first heat insulation structure 62 can at least cover the portion of the cooling structure 40 that is not connected to the heat-generating device 30, thereby enabling the first heat insulation structure 62 to provide heat insulation and heat preservation for the cooling structure 40, thereby slowing down the rate of condensation formation on the outside of the cooling structure 40 and further reducing the condensation on the outside of the cooling structure 40, thus reducing the anti-condensation cost of the functional module 100.

[0151] For example, the cooling structure 40 of this embodiment may include a heat exchange section 42 and a liquid cooling pipe 43. The structure of the heat exchange section 42 and the liquid cooling pipe 43 of this embodiment can generally refer to the structure of the heat exchange section 42 and the liquid cooling pipe 43 in the first embodiment above, or refer to the structure of the heat exchange section 42 and the liquid cooling pipe 43 in the second embodiment above, and will not be described again here. When the heat exchange section 42 of this embodiment is connected to the heating device 30 through the first heat-conducting layer 51, the first heat insulation structure 62 can cover the liquid cooling pipe 43 located in the cavity W, and cover the part of the heat exchange section 42 that is not connected to the first heat-conducting layer 51. When there is an air gap between the heat exchange section 42 and the heating device 30 of this embodiment, the first heat insulation structure 62 can cover the liquid cooling pipe 43 located in the cavity W, and cover the entire heat exchange section 42.

[0152] The functional modules of this embodiment may also include a drainage structure (not shown in the figure). The specific construction of the drainage structure and the connection relationship between the drainage structure and the outer shell 10 in this embodiment can be generally referred to the specific construction of the drainage structure 61 in the third embodiment above, as well as the connection relationship between the drainage structure 61 and the outer shell 10, and will not be repeated here.

[0153] Fifth embodiment:

[0154] Please refer to Figure 12, which is a cross-sectional schematic diagram of the functional module 100 provided in the fifth embodiment of this application. In Figure 12, the dashed arrows indicate the flow direction of the cooling working fluid, the droplets represent the liquid outside the cooling structure 40, the solid arrows at the bottom of the outer shell 10 indicate the flow direction of the liquid outside the cooling structure 40, and the solid arrows at the top of the outer shell 10 indicate the air inlet and outlet directions. Furthermore, Figure 12 is only intended to schematically depict the connection relationships of the various structures in the functional module 100, and does not constitute a specific limitation on the connection positions, specific constructions, or quantities of each structure. That is, the structures illustrated in this embodiment do not constitute a specific limitation on the functional module 100.

[0155] In this embodiment, the contents that are the same as in the first embodiment will not be repeated. The difference from the first embodiment is that the outer shell 10 may also have an air inlet 12 and an air outlet 13 spaced apart, both of which connect to the cavity W and the outside of the outer shell 10. The air inlet 12 and the air outlet 13 are spaced apart from the drain outlet 11. Furthermore, the description of the structural improvements to the functional module 100 in this embodiment can be applied to the first to fourth embodiments described above, unless there is conflict.

[0156] In this embodiment, the air inlet 12 and the air outlet 13 can be located on the same surface of the housing 10. Alternatively, the air inlet 12 and the air outlet 13 can be located on different surfaces of the housing 10. Cold air entering the cavity W via the air inlet 12 can flow out of the cavity W from the air outlet 13 after being blown onto the circuit board 20 and / or the heating device 30. Exemplarily, the air inlet 12 and the air outlet 13 can be located on two opposite surfaces of the housing 10, respectively.

[0157] The number of air inlets 12 can be one or more. When there are multiple air inlets 12, they can be spaced apart on the outer casing 10. The structures of the multiple air inlets 12 can be similar, identical, or different. The number of air outlets 13 can be one or more. When there are multiple air outlets 13, they can be spaced apart on the outer casing 10. The structures of the multiple air outlets 13 can be similar, identical, or different. In this embodiment, there are no strict limitations on the characteristic parameters of the air inlets 12, such as their number, shape, and position, or the characteristic parameters of the air outlets 13, such as their number, shape, and position. It is only required that both the air inlets 12 and the air outlets 13 can connect to the cavity W of the outer casing 10 and the outside of the outer casing 10.

[0158] It is understandable that by opening an air inlet 12 and an air outlet 13 on the outer casing 10, cold air can enter the cavity W through the air inlet 12. The cold air entering the cavity W can carry the heat generated by the circuit board 20 and / or the heating device 30 during its flow in the cavity W and become hot air. The hot air flows out of the cavity W through the air outlet 13 and flows into the external environment. The alternating circulation of cold and hot air completes the uninterrupted heat exchange between the functional module 100 and the external environment, which not only enhances the natural convection in the cavity W, but also improves the heat dissipation efficiency of the functional module 100.

[0159] For example, the cooling structure 40 of this embodiment may include a heat exchange section 42 and a liquid cooling pipe 43. The structure of the heat exchange section 42 and the liquid cooling pipe 43 of this embodiment can generally refer to the structure of the heat exchange section 42 and the liquid cooling pipe 43 in the first embodiment above, or can refer to the structure of the heat exchange section 42 and the liquid cooling pipe 43 in the second embodiment above, and will not be described again here.

[0160] The functional module 100 of this embodiment may further include one or more combinations of a drainage structure and a first heat insulation structure (not shown). The specific construction of the drainage structure and its connection to the outer shell 10 in this embodiment can generally refer to the specific construction of the drainage structure 61 in the third embodiment above, as well as the connection between the drainage structure 61 and the outer shell 10, and will not be repeated here. Similarly, the specific construction of the first heat insulation structure and its connection to the cooling structure 40 in this embodiment can generally refer to the specific construction of the first heat insulation structure 62 in the fourth embodiment above, as well as the connection between the first heat insulation structure 62 and the cooling structure 40, and will not be repeated here.

[0161] Sixth embodiment:

[0162] Please refer to Figure 13, which is a cross-sectional schematic diagram of the functional module 100 provided in the sixth embodiment of this application. In Figure 13, the dashed arrows indicate the flow direction of the cooling working fluid, the droplets represent the liquid outside the cooling structure 40, the solid arrows at the bottom of the outer shell 10 indicate the flow direction of the liquid outside the cooling structure 40, and the double-headed solid arrows at the top of the outer shell 10 indicate the ventilation direction. Furthermore, Figure 13 is only intended to schematically depict the connection relationships of the various structures in the functional module 100, and does not constitute a specific limitation on the connection positions, specific constructions, or quantities of each structure. That is, the structures illustrated in this embodiment do not constitute a specific limitation on the functional module 100.

[0163] In this embodiment, the contents that are the same as in the first embodiment will not be repeated. The difference from the first embodiment is that the outer shell 10 may also be provided with a vent 14. The vent 14 can connect the cavity W and the outside of the outer shell 10, and is spaced apart from the drain port 11. Furthermore, the description of the structural improvements to the functional module 100 in this embodiment can be applied to the first to fifth embodiments described above, unless there is conflict.

[0164] In this embodiment, air outside the outer casing 10 and air inside the cavity W can be exchanged through the vent 14. That is, the vent 14 can both allow air to enter and exit the cavity W. The vent 14 and the drain port 11 can be located on the same surface of the outer casing 10. Alternatively, the vent 14 and the drain port 11 can be located on different surfaces of the outer casing 10. For example, the vent 14 and the drain port 11 can be located on the same surface of the outer casing 10, and are spaced apart in the height direction of the outer casing 10.

[0165] The number of ventilation ports 14 can be one or more. When there are multiple ventilation ports 14, they can be spaced apart on the outer casing 10. The structures of the multiple ventilation ports 14 can be similar, identical, or different. In this embodiment, there are no strict limitations on the characteristic parameters of the ventilation ports 14, such as the number, shape, and position, as long as they can connect the cavity W of the outer casing 10 and the outside of the outer casing 10.

[0166] It is understandable that by opening the ventilation port 14 on the outer casing 10, the air outside the outer casing 10 and the air inside the cavity W can be exchanged through the ventilation port 14, so as to further enhance the natural convection of the air inside the cavity W and improve the heat dissipation performance of the functional module 100.

[0167] For example, the cooling structure 40 of this embodiment may include a heat exchange section 42 and a liquid cooling pipe 43. The structure of the heat exchange section 42 and the liquid cooling pipe 43 of this embodiment can generally refer to the structure of the heat exchange section 42 and the liquid cooling pipe 43 in the first embodiment above, or can refer to the structure of the heat exchange section 42 and the liquid cooling pipe 43 in the second embodiment above, and will not be described again here.

[0168] The functional module 100 of this embodiment may further include one or more combinations of a drainage structure (not shown) and a first heat insulation structure (not shown). The specific construction of the drainage structure and its connection to the outer shell 10 in this embodiment can generally refer to the specific construction of the drainage structure 61 in the third embodiment above, as well as the connection between the drainage structure 61 and the outer shell 10, and will not be repeated here. Similarly, the specific construction of the first heat insulation structure and its connection to the cooling structure 40 in this embodiment can generally refer to the specific construction of the first heat insulation structure 62 in the fourth embodiment above, as well as the connection between the first heat insulation structure 62 and the cooling structure 40, and will not be repeated here.

[0169] The outer casing 10 of this embodiment may also be provided with an air inlet and an air outlet (not shown in the figure). The ventilation port 14, the air inlet, and the air outlet can be arranged at intervals on the outer casing 10. The structure of the air inlet and the air outlet in this embodiment can be generally referred to the structure of the air inlet 12 and the air outlet 13 in the fifth embodiment above, and will not be described again here.

[0170] For example, the air inlet and air outlet can be located at the top of the housing 10. The air vent 14 can be located at the bottom of the housing 10. Alternatively, the air vent 14 can be located at the top of the housing 10, and the air inlet and air outlet can be located at the bottom of the housing 10. Alternatively, the air vent 14, air inlet, and air outlet can all be located at the top of the housing 10. Alternatively, the air vent 14, air inlet, and air outlet can all be located at the bottom of the housing 10.

[0171] Seventh embodiment:

[0172] Please refer to Figures 14 and 15. Figure 14 is a cross-sectional schematic diagram of the functional module 100 provided in the seventh embodiment of this application, and Figure 15 is another cross-sectional schematic diagram of the functional module 100 provided in the seventh embodiment of this application. In Figures 14 and 15, the dashed arrows indicate the flow direction of the cooling working fluid, the droplets represent the liquid outside the cooling structure 40, and the solid arrows indicate the flow direction of the liquid outside the cooling structure 40. Furthermore, Figures 14 and 15 are only intended to schematically describe the connection relationships of the various structures in the functional module 100, and are not intended to specifically limit the connection positions, specific constructions, or quantities of each structure. That is, the structures illustrated in this embodiment do not constitute a specific limitation on the functional module 100.

[0173] In this embodiment, the content that is the same as in the first embodiment will not be repeated, and the content that differs from the first embodiment will be described below. In addition, the description of the structural improvements of the functional module 100 in this embodiment can be applied to the first to sixth embodiments above, unless there is any conflict.

[0174] In this embodiment, the functional module 100 may include an electronic device 70. The electronic device 70 is an electronic component that generates heat during the operation of the functional module 100. The electronic device 70 may be electrically connected to the first surface 21 of the circuit board 20 and spaced apart from the heat-generating device 30. The heat dissipation of the electronic device 70 may be less than the heat dissipation of the heat-generating device 30. Here, heat dissipation refers to the heat generated by the component during normal operation.

[0175] The electronic device 70 can be, but is not limited to, a capacitor, resistor, inductor, relay, metal-oxide-semiconductor field-effect transistor (MOSFET), laser device, packaged device, etc. The number of electronic devices 70 can be one or more. When there are multiple electronic devices 70, they can be connected at intervals to the first surface 21 of the circuit board 20. Each electronic device 70 is electrically connected to the circuit board 20. The multiple electronic devices 70 can be the same or different. The following description uses one electronic device 70 as an example, but it should be understood that this is not a limitation.

[0176] The functional module 100 may further include an extension structure 63. A first end of the extension structure 63 may be connected to the cooling structure 40, and a second end of the extension structure 63 may be connected to the electronic device 70. The extension structure 63 may be made of any material with good thermal conductivity; for example, it may be made of metal. Alternatively, the extension structure 63 may be a solid structure or a hollow structure. Exemplarily, the extension structure 63 and the cooling structure 40 may be welded together.

[0177] It is understandable that by adding an extension structure 63 between the cooling structure 40 and the electronic device 70, the cooling structure 40 can further dissipate heat for the electronic device 70, thus enabling the cooling structure 40 to have the dual function of dissipating heat for both the heat-generating device 30 and the electronic device 70, which is beneficial to improving the heat dissipation efficiency of the cooling structure 40 and the heat dissipation performance of the functional module 100.

[0178] In one possible application scenario, as shown in Figure 14, the first end of the extension structure 63 can be connected to the liquid cooling pipe 43, and the second end of the extension structure 63 can be connected to the electronic device 70. The extension structure 63 can be connected between the liquid cooling pipe 43 and the electronic device 70.

[0179] In another possible application scenario, as shown in Figure 15, the first end of the extension structure 63 can be connected to the heat exchange section 42, and the second end of the extension structure 63 can be connected to the electronic device 70. The extension structure 63 can be connected between the heat exchange section 42 and the electronic device 70.

[0180] In this embodiment, the functional module 100 may further include a second thermally conductive layer 52. The second thermally conductive layer 52 may be connected between the electronic device 70 and the extension structure 63. The second thermally conductive layer 52 may receive heat from the electronic device 70 and the circuit board 20, and conduct the heat from the electronic device 70 and the circuit board 20 to the cooling structure 40, so that the heat can be dissipated to the outside of the functional module 100 through the cooling structure 40.

[0181] The second thermally conductive layer 52 has good thermal conductivity and can be made of a thermally conductive interface material. Exemplarily, the second thermally conductive layer 52 can be thermally conductive silicone grease, thermally conductive gel, phase change material, thermally conductive pad, thermally conductive film, liquid metal, etc. In other embodiments, the second thermally conductive layer can also be other structural components with good thermal conductivity; for example, the second thermally conductive layer can be a heat sink, metal plate, etc.

[0182] It is understandable that by connecting the second thermal conductive layer 52 between the electronic device 70 and the cooling structure 40, the excellent thermal conductivity of the second thermal conductive layer 52 can be used to transfer the heat of the electronic device 70 and the circuit board 20 to the cooling structure 40, and the good heat dissipation performance of the cooling structure 40 can be used to remove the heat of the electronic device 70 and the circuit board 20, thereby achieving rapid heat dissipation and effectively improving the heat dissipation efficiency of the functional module 100.

[0183] It should be noted that this embodiment does not strictly limit the number, shape, position, or other characteristic parameters of the extension structure 63, as long as it can be connected between the electronic device 70 and the cooling structure 40. In some other embodiments, the second heat-conducting layer 52 may not be provided between the extension structure 63 and the heat-generating device 30; instead, an air gap may be provided. The heat from the electronic device 70 and the circuit board 20 can be transferred to the cooling structure 40 through the air gap between the extension structure 63 and the electronic device 70.

[0184] In some other embodiments, the extension structure 63 may not be disposed between the cooling structure 40 and the electronic device 70, but rather between the electronic device 70 and the housing 10, thereby allowing the electronic device 70 to dissipate heat through the housing 10. Alternatively, the extension structure 63 may not be provided, and a thermally conductive structure with good thermal conductivity may be directly provided between the electronic device 70 and the housing 10, allowing the electronic device 70 to dissipate heat through the housing 10.

[0185] For example, the cooling structure 40 of this embodiment may include a heat exchange section 42 and a liquid cooling pipe 43. The structure of the heat exchange section 42 and the liquid cooling pipe 43 of this embodiment can generally refer to the structure of the heat exchange section 42 and the liquid cooling pipe 43 in the first embodiment above, or can refer to the structure of the heat exchange section 42 and the liquid cooling pipe 43 in the second embodiment above, and will not be described again here.

[0186] The functional module 100 of this embodiment may further include one or more combinations of a drainage structure (not shown) and a first heat insulation structure (not shown). The specific construction of the drainage structure and its connection to the outer shell 10 in this embodiment can generally refer to the specific construction of the drainage structure 61 in the third embodiment above, as well as the connection between the drainage structure 61 and the outer shell 10, and will not be repeated here. Similarly, the specific construction of the first heat insulation structure and its connection to the cooling structure 40 in this embodiment can generally refer to the specific construction of the first heat insulation structure 62 in the fourth embodiment above, as well as the connection between the first heat insulation structure 62 and the cooling structure 40, and will not be repeated here.

[0187] In this embodiment, the first heat insulation structure can cover part or all of the cooling structure 40, and also part or all of the extension structure 63. For example, when the heat exchange section 42 is connected to the heating device 30 through the first thermally conductive layer 51, and the extension structure 63 is connected to the electronic device 70 through the second thermally conductive layer 52, the first heat insulation structure of this embodiment can cover the liquid cooling pipe 43 located in the cavity W, cover the portion of the heat exchange section 42 not connected to the first thermally conductive layer 51, and cover the portion of the extension structure 63 not connected to the second thermally conductive layer 52. When there are air gaps between the heat exchange section 42 and the heating device 30, and between the extension structure 63 and the electronic device 70, the first heat insulation structure of this embodiment can cover the liquid cooling pipe 43 located in the cavity W, cover the entire heat exchange section 42, and cover the entire extension structure 63.

[0188] The outer casing 10 of this embodiment may also be provided with at least one of two types of ventilation openings: an air inlet (not shown) and an air outlet (not shown), and a ventilation port (not shown). The structures of the air inlet and air outlet in this embodiment are generally similar to the structures of the air inlet 12 and air outlet 13 in the fifth embodiment described above, and the structure of the ventilation port in this embodiment is generally similar to the structure of the ventilation port 14 in the sixth embodiment described above; further details will not be repeated here.

[0189] Eighth embodiment:

[0190] Please refer to Figures 16 and 17. Figure 16 is a cross-sectional schematic diagram of the functional module 100 provided in the eighth embodiment of this application, and Figure 17 is another cross-sectional schematic diagram of the functional module 100 provided in the eighth embodiment of this application. In Figures 16 and 17, the dashed arrows indicate the flow direction of the cooling working fluid, the droplets represent the liquid outside the cooling structure 40, and the solid arrows indicate the flow direction of the liquid outside the cooling structure 40. Furthermore, Figures 16 and 17 are only intended to schematically describe the connection relationships of the various structures in the functional module 100, and are not intended to specifically limit the connection positions, specific constructions, or quantities of each structure. That is, the structures illustrated in this embodiment do not constitute a specific limitation on the functional module 100.

[0191] In this embodiment, the contents that are the same as in the first embodiment will not be repeated. The difference from the first embodiment is that the structure of the cooling structure 40 is different. In addition, the description of the structural improvements of the functional module 100 in this embodiment can be applied to the first to seventh embodiments above, unless there is any conflict.

[0192] In this embodiment, the cooling structure 40 may include a body 44 and a protrusion 45. The body 44 may form part of the outer shell 10. The body 44 includes a connecting surface 47 facing the cavity W. The protrusion 45 is located inside the cavity W and connected to the body 44. The protrusion 45 also protrudes relative to the connecting surface 47, and its side away from the body 44 is connected to the heating device 30. The body 44 is also provided with an inlet T1 and an outlet T2. The flow channel 41 may extend within the body 44 or within the body 44 and the protrusion 45, and is connected to both the inlet T1 and the outlet T2. Low-temperature cooling medium can flow into the flow channel 41 through the inlet T1, and in the flow of the flow channel 41, it carries the heat of the cooling structure 40 and is heated. The heated cooling medium can flow out of the flow channel 41 through the outlet T2. This process is repeated to realize the heat exchange function of the cooling structure 40.

[0193] The protrusion 45 can be connected to the heating device 30 through the first heat-conducting layer 51. Of course, in some other embodiments, the protrusion 45 can also have an air gap with the heating device 30.

[0194] In one possible implementation, as shown in FIG16, the protrusion 45 may be a heat-conducting structure. The flow channel 41 may extend only within the body 44.

[0195] The protrusion 45 can be made of any material with good thermal conductivity; for example, it can be made of metal. The material of the protrusion 45 can be the same as or different from the material of the body 44. Furthermore, the protrusion 45 can be a solid structure, or it can be a hollow structure. Exemplarily, the protrusion 45 and the body 44 can be welded together.

[0196] It is understandable that by extending the flow channel 41 within the body 44, the cooling medium can flow within the body 44. Furthermore, by connecting the protrusion 45 between the body 44 and the heat-generating device 30, the excellent thermal conductivity of the protrusion 45 can efficiently and conveniently transfer heat from the heat-generating device 30 to the body 44. This helps reduce the thermal temperature difference and thermal resistance between the heat-generating device 30 and the body 44, ensuring the heat transfer efficiency between the cooling structure 40 and the heat-generating device 30, and enhancing the heat dissipation performance of the cooling structure 40.

[0197] In another possible implementation, as shown in FIG17, the flow channel 41 can extend within the body 44 and the protrusion 45. It is understood that by extending the flow channel 41 within the body 44 and the protrusion 45, the cooling medium can flow within both the body 44 and the protrusion 45, thereby maximizing the liquid-cooled heat exchange area between the cooling structure 40 and the heat-generating device 30 and enhancing the liquid-cooled heat dissipation performance of the cooling structure 40.

[0198] In this embodiment, the protrusion 45 and the body 44 can be an integral structure. For example, the protrusion 45 and the body 44 can be connected in a one-piece molding manner to form an integral structure. It is understood that the cooling structure 40 formed by the integral structure has fewer parts, which helps to simplify the manufacturing process of the cooling structure 40 and improve the production and assembly efficiency of the cooling structure 40.

[0199] Alternatively, the protrusion 45 and the body 44 can be separately configured. For example, the protrusion 45 and the body 44 can be fixed together by assembly methods such as welding, bonding, screwing, or snap-fitting. It is understood that the separately designed cooling structure 40 can be formed by connecting the protrusion 45 and the body 44, thereby simplifying the cooling structure 40 through assembly of the protrusion 45 and the body 44, avoiding the problem of reduced strength due to excessive extension length of the same structural component, and facilitating positioning and assembly.

[0200] For example, the cooling structure 40 of this embodiment may include a heat exchange section 42 and a liquid cooling pipe 43. The structure of the heat exchange section 42 and the liquid cooling pipe 43 of this embodiment can generally refer to the structure of the heat exchange section 42 and the liquid cooling pipe 43 in the first embodiment above, or can refer to the structure of the heat exchange section 42 and the liquid cooling pipe 43 in the second embodiment above, and will not be described again here.

[0201] The functional module 100 of this embodiment may further include one or more combinations of a drainage structure (not shown), an extension structure and electronic devices (not shown), and a first heat insulation structure (not shown). The specific construction of the drainage structure and its connection to the outer casing 10 in this embodiment can generally refer to the specific construction of the drainage structure 61 in the third embodiment above, as well as the connection between the drainage structure 61 and the outer casing 10, and will not be repeated here. The specific construction of the first heat insulation structure and its connection to the cooling structure 40 in this embodiment can generally refer to the specific construction of the first heat insulation structure 62 in the fourth embodiment above, as well as the connection between the first heat insulation structure 62 and the cooling structure 40, and will not be repeated here. The specific construction of the extension structure and electronic devices in this embodiment, and their connection, can generally refer to the specific construction of the extension structure 63 and electronic devices 70 in the seventh embodiment above, as well as the connection between the extension structure 63 and electronic devices 70, and will not be repeated here.

[0202] In this embodiment, the drainage structure can be disposed above the body 44 and connected to the protrusion 45 or have a gap.

[0203] In this embodiment, the first end of the extension structure can be connected to the body 44, and the second end of the extension structure can be connected to an electronic device or have an air gap. For example, the second end of the extension structure and the electronic device are connected through a second thermally conductive layer. Alternatively, in this embodiment, the first end of the extension structure can be connected to the protrusion 45, and the second end of the extension structure can be connected to an electronic device or have an air gap. For example, the second end of the extension structure and the electronic device are connected through a second thermally conductive layer.

[0204] The first heat insulation structure of this embodiment can cover the portion of the cooling structure 40 located within the cavity W. For example, when the protrusion 45 is connected to the heating device 30 via the first heat-conducting layer 51, the first heat insulation structure of this embodiment can cover the body 44 located within the cavity W, as well as the portion of the protrusion 45 not connected to the first heat-conducting layer 51. When there is an air gap between the protrusion 45 and the heating device 30, the first heat insulation structure of this embodiment can cover the body 44 located within the cavity W, as well as all of the protrusion 45. The first heat insulation structure of this embodiment can also cover part or all of the extension structure. For example, when the extension structure is connected to the electronic device via the second heat-conducting layer, the first heat insulation structure of this embodiment can also cover the portion of the extension structure not connected to the second heat-conducting layer. When there is an air gap between the extension structure and the electronic device, the first heat insulation structure of this embodiment can also cover the entire extension structure.

[0205] The outer casing 10 of this embodiment may also be provided with at least one of two types of ventilation openings: an air inlet (not shown) and an air outlet (not shown), and a ventilation port (not shown). The structures of the air inlet and air outlet in this embodiment are generally similar to the structures of the air inlet 12 and air outlet 13 in the fifth embodiment described above, and the structure of the ventilation port in this embodiment is generally similar to the structure of the ventilation port 14 in the sixth embodiment described above; further details will not be repeated here.

[0206] Ninth embodiment:

[0207] Please refer to Figures 18, 19, and 20. Figure 18 is a cross-sectional schematic diagram of the functional module 100 provided in the ninth embodiment of this application; Figure 19 is another cross-sectional schematic diagram of the functional module 100 provided in the ninth embodiment of this application; and Figure 20 is yet another cross-sectional schematic diagram of the functional module 100 provided in the ninth embodiment of this application. In Figures 18-20, the dashed arrows indicate the flow direction of the cooling working fluid, the droplets represent the liquid outside the cooling structure 40, and the solid arrows indicate the flow direction of the liquid outside the cooling structure 40. Furthermore, Figures 18-20 are intended only to schematically depict the connection relationships of the various structures in the functional module 100, and are not intended to specifically limit the connection positions, specific constructions, or quantities of each structure. That is, the structures illustrated in this embodiment do not constitute a specific limitation on the functional module 100.

[0208] In this embodiment, the content that is the same as in the first embodiment will not be repeated, and the content that differs from the first embodiment will be described below. In addition, the description of the structural improvements of the functional module 100 in this embodiment can be applied to the first to eighth embodiments above, unless there is any conflict.

[0209] In this embodiment, the heating element 30 is connected to the second surface 22 of the circuit board 20. The cooling structure 40 is located on the side of the heating element 30 facing away from the circuit board 20. The circuit board 20, the heating element 30, and the cooling structure 40 can be arranged parallel to the direction of gravity G (within allowable tolerance). The cooling structure 40, the heating element 30, and the circuit board 20 are arranged sequentially in the direction of gravity G.

[0210] The position and connection relationship between the heating element 30 and the cooling structure 40 are generally the same as in the first embodiment, which will not be repeated here. As shown in Figures 17 and 18, the cooling structure 40 may include a heat exchange section 42 and a liquid cooling pipe 43. The structure of the heat exchange section 42 and the liquid cooling pipe 43 can generally refer to the structure of the heat exchange section 42 and the liquid cooling pipe 43 in the first and second embodiments above, and will not be repeated here. Alternatively, as shown in Figure 19, the cooling structure 40 may include a body 44 and a protrusion 45. The structure of the body 44 and the protrusion 45 can generally refer to the structure of the body 44 and the protrusion 45 in the eighth embodiment above, and will not be repeated here.

[0211] In this embodiment, the functional module 100 may further include a drainage structure 64. The drainage structure 64 is located between the cooling structure 40 and the heating device 30, and between the cooling structure 40 and the circuit board 20. The drainage structure 64 isolates the cooling structure 40 from the heating device 30, and also isolates the cooling structure 40 from the circuit board 20. The drainage structure 64 is used to guide liquid outside the cooling structure 40 to the drain port 11. The drainage structure 64 may be connected to one or more of the cooling structure 40, the circuit board 20, and the housing 10 to enhance the connection stability and reliability of the drainage structure 64.

[0212] Understandably, since the heating element 30 and the cooling structure 40 are positioned above the circuit board 20, to prevent liquid from the outside of the cooling structure 40 from dripping onto the heating element 30 and the circuit board 20 due to gravity G, a drainage structure 64 is provided between the cooling structure 40 and the heating element 30, and between the cooling structure 40 and the circuit board 20. This drainage structure 64 isolates the cooling structure 40 from the heating element 30, and from the circuit board 20. Therefore, when liquid is generated on the outside of the cooling structure 40, the liquid flows along the drainage structure 64 to the drain port 11 and eventually out of the outer casing 10, without dripping onto the surfaces of the heating element 30 and the circuit board 20. This helps to avoid the risk of liquid ingress into the circuit board 20 and the heating element 30, improving the operational reliability of the functional module 100.

[0213] It should be noted that the drainage structure 64 shown in Figures 18-20 is for illustrative purposes only and does not constitute an actual limitation on the drainage structure 64. In this embodiment, the characteristic parameters of the drainage structure 64, such as its shape, quantity, setting position, and connection relationship, can be selected according to the actual application scenario. It is only necessary to ensure that the drainage structure 64 can isolate the cooling structure 40 and the heating device 30, as well as isolate the cooling structure 40 and the circuit board 20. This embodiment does not impose strict limitations on this.

[0214] In this embodiment, the functional module 100 may further include a second heat insulation structure. The second heat insulation structure may be located between the cooling structure 40 and the outer casing 10. It is understood that by providing a second heat insulation structure between the cooling structure 40 and the outer casing 10, the second heat insulation structure can isolate the cooling structure 40 and the outer casing 10, preventing condensation from forming at the connection between the cooling structure 40 and the outer casing 10 due to excessively low temperature, which could drip onto the heating device 30 and the circuit board 20, causing the functional module 100 to malfunction.

[0215] In some other embodiments, the number of heating elements 30 can be multiple. Multiple heating elements 30 can be electrically connected to the second surface 22 of the circuit board 20. Multiple heating elements 30 can be spaced apart. The cooling structure 40 is connected to all of the multiple heating elements 30. A drainage structure 64 is located between the cooling structure 40 and the multiple heating elements 30, and between the cooling structure 40 and the circuit board 20. The drainage structure 64 isolates the cooling structure 40 from the multiple heating elements 30, and also isolates the cooling structure 40 from the circuit board 20. The drainage structure 64 is used to guide liquid outside the cooling structure 40 to the drain port 11.

[0216] For example, the functional module 100 of this embodiment may further include one or more combinations of a drainage structure (not shown), an extension structure and electronic devices (not shown), and a first heat insulation structure (not shown). The specific construction of the drainage structure and its connection to the outer casing 10 in this embodiment can generally refer to the specific construction of the drainage structure 61 in the third embodiment above, and the connection between the drainage structure 61 and the outer casing 10, and will not be repeated here. The specific construction of the first heat insulation structure and its connection to the cooling structure 40 in this embodiment can generally refer to the specific construction of the first heat insulation structure 62 in the fourth embodiment above, and the connection between the first heat insulation structure 62 and the cooling structure 40, and will not be repeated here. The specific construction of the extension structure and electronic devices in this embodiment, and their connection, can generally refer to the specific construction of the extension structure 63 and electronic devices 70 in the seventh embodiment above, and the connection between the extension structure 63 and electronic devices 70, and will not be repeated here.

[0217] In this embodiment, the electronic device can be electrically connected to the second surface 22 of the circuit board 20 and spaced apart from the heat-generating device 30. The first end of the extension structure in this embodiment can be connected to the heat exchange section 42 or the body 44, and the second end of the extension structure can pass through the drainage structure 64 and be connected to the electronic device or have an air gap. For example, the second end of the extension structure is connected to the electronic device through a second thermally conductive layer. Alternatively, the first end of the extension structure in this embodiment can be connected to the liquid cooling pipe 43 or the protrusion 45, and the second end of the extension structure can pass through the drainage structure 64 and be connected to the electronic device or have an air gap. For example, the second end of the extension structure is connected to the electronic device through a second thermally conductive layer.

[0218] The first heat insulation structure of this embodiment can cover the portion of the cooling structure 40 located within the cavity W. For example, when the heat exchange section 42 and the heating device 30 are connected via the first heat-conducting layer 51, the first heat insulation structure 62 can cover the liquid cooling pipe 43 located within the cavity W, and cover the portion of the heat exchange section 42 not connected to the first heat-conducting layer 51. When there is an air gap between the heat exchange section 42 and the heating device 30 in this embodiment, the first heat insulation structure 62 can cover the liquid cooling pipe 43 located within the cavity W, and cover the entire heat exchange section 42. When the protrusion 45 is connected to the heating device 30 via the first heat-conducting layer 51, the first heat insulation structure of this embodiment can cover the body 44 located within the cavity W, and cover the portion of the protrusion 45 not connected to the first heat-conducting layer 51. When there is an air gap between the protrusion 45 and the heating device 30, the first heat insulation structure of this embodiment can cover the body 44 located within the cavity W, and cover the entire protrusion 45.

[0219] The first thermal insulation structure of this embodiment can also cover part or all of the extended structure. For example, when the extended structure is connected to the electronic device through a second thermally conductive layer, the first thermal insulation structure of this embodiment can also cover the portion of the extended structure not connected to the second thermally conductive layer. When there is an air gap between the extended structure and the electronic device, the first thermal insulation structure of this embodiment can also cover the entire extended structure.

[0220] The outer casing 10 of this embodiment may also be provided with at least one of two types of ventilation openings: an air inlet (not shown) and an air outlet (not shown), and a ventilation port (not shown). The structures of the air inlet and air outlet in this embodiment are generally similar to the structures of the air inlet 12 and air outlet 13 in the fifth embodiment described above, and the structure of the ventilation port in this embodiment is generally similar to the structure of the ventilation port 14 in the sixth embodiment described above; further details will not be repeated here.

[0221] Tenth embodiment:

[0222] Please refer to Figure 21, which is a cross-sectional schematic diagram of the functional module 100 provided in the tenth embodiment of this application. In Figure 21, the dashed arrows indicate the flow direction of the cooling working fluid, the droplets represent the liquid outside the cooling structure 40, and the solid arrows indicate the flow direction of the liquid outside the cooling structure 40. Furthermore, Figure 21 is only intended to schematically depict the connection relationships of the various structures in the functional module 100, and does not constitute a specific limitation on the connection positions, specific constructions, or quantities of each structure. That is, the structures illustrated in this embodiment do not constitute a specific limitation on the functional module 100.

[0223] In this embodiment, the content that is the same as in the first embodiment will not be repeated, and the content that differs from the first embodiment will be described below. In addition, the description of the structural improvements of the functional module 100 in this embodiment can be applied to the first to ninth embodiments above, unless there is any conflict.

[0224] In this embodiment, there are multiple heating elements 30. These multiple heating elements 30 can be electrically connected to the first surface 21 of the circuit board 20. The multiple heating elements 30 can be spaced apart. The cooling structure 40 is connected to all of the multiple heating elements 30. The cooling structure 40 may include multiple heat exchange sections 42 and multiple liquid cooling pipes 43. The multiple liquid cooling pipes 43 are connected in series with the multiple heat exchange sections 42. The structures of the heat exchange sections 42 and liquid cooling pipes 43 can generally refer to the structures of the heat exchange sections 42 and liquid cooling pipes 43 in the first and second embodiments described above, and will not be repeated here. Alternatively, the cooling structure 40 may include a body 44 and multiple protrusions 45. The multiple protrusions 45 are all connected to the body 44, protrude relative to the connecting surface 47, and are located within the cavity W. The structures of the body 44 and protrusions 45 can generally refer to the structures of the body 44 and protrusions 45 in the eighth embodiment described above, and will not be repeated here.

[0225] For example, the number of heating devices 30 can be two. Both heating devices 30 can be SOC chips. The number of heat exchange sections 42 can be two, and the two heat exchange sections 42 are respectively connected to the two heating devices 30. Multiple liquid cooling pipes 43 are connected in series to the two heat exchange sections 42. The flow channel 41 extends in the two heat exchange sections 42 and the multiple liquid cooling pipes 43.

[0226] For example, the functional module 100 of this embodiment may further include one or more combinations of a drainage structure (not shown), an extension structure and electronic devices (not shown), and a first heat insulation structure (not shown). The specific construction of the drainage structure and its connection to the outer casing 10 in this embodiment can generally refer to the specific construction of the drainage structure 61 in the third embodiment above, and the connection between the drainage structure 61 and the outer casing 10, and will not be repeated here. The specific construction of the first heat insulation structure and its connection to the cooling structure 40 in this embodiment can generally refer to the specific construction of the first heat insulation structure 62 in the fourth embodiment above, and the connection between the first heat insulation structure 62 and the cooling structure 40, and will not be repeated here. The specific construction of the extension structure and electronic devices in this embodiment, and their connection, can generally refer to the specific construction of the extension structure 63 and electronic devices 70 in the seventh embodiment above, and the connection between the extension structure 63 and electronic devices 70, and will not be repeated here.

[0227] In this embodiment, the electronic components can be electrically connected to the first surface 21 of the circuit board 20 and are spaced apart from the plurality of heat-generating components 30. The first end of the extension structure in this embodiment can be connected to the heat exchange section 42 or the body 44, and the second end of the extension structure can be connected to the electronic components or have an air gap; for example, the second end of the extension structure is connected to the electronic components through a second thermally conductive layer. Alternatively, the first end of the extension structure in this embodiment can be connected to the liquid cooling pipe 43 or the protrusion 45, and the second end of the extension structure can be connected to the electronic components or have an air gap; for example, the second end of the extension structure is connected to the electronic components through a second thermally conductive layer.

[0228] The first heat insulation structure of this embodiment can cover the portion of the cooling structure 40 located within the cavity W. For example, when multiple heat exchange sections 42 are connected to multiple heating devices 30 via multiple first heat-conducting layers 51, the first heat insulation structure 62 can cover the liquid cooling pipe 43 located within the cavity W, and cover the portion of the heat exchange section 42 not connected to the multiple first heat-conducting layers 51. When there is an air gap between the multiple heat exchange sections 42 and the heating devices 30 in this embodiment, the first heat insulation structure 62 can cover the liquid cooling pipe 43 located within the cavity W, and cover all of the heat exchange sections 42. When multiple protrusions 45 are connected to the heating devices 30 via multiple first heat-conducting layers 51, the first heat insulation structure of this embodiment can cover the body 44 located within the cavity W, and cover the portion of the protrusions 45 not connected to the multiple first heat-conducting layers 51. When there is an air gap between the multiple protrusions 45 and the heating devices 30, the first heat insulation structure of this embodiment can cover the body 44 located within the cavity W, and cover all of the protrusions 45.

[0229] The first thermal insulation structure of this embodiment can also cover part or all of the extended structure. For example, when the extended structure is connected to the electronic device through a second thermally conductive layer, the first thermal insulation structure of this embodiment can also cover the portion of the extended structure not connected to the second thermally conductive layer. When there is an air gap between the extended structure and the electronic device, the first thermal insulation structure of this embodiment can also cover the entire extended structure.

[0230] The outer casing 10 of this embodiment may also be provided with at least one of two types of ventilation openings: an air inlet (not shown) and an air outlet (not shown), and a ventilation port (not shown). The structures of the air inlet and air outlet in this embodiment are generally similar to the structures of the air inlet 12 and air outlet 13 in the fifth embodiment described above, and the structure of the ventilation port in this embodiment is generally similar to the structure of the ventilation port 14 in the sixth embodiment described above; further details will not be repeated here.

[0231] Eleventh Example:

[0232] Please refer to Figure 22, which is a cross-sectional schematic diagram of the functional module 100 provided in the eleventh embodiment of this application. In Figure 22, the dashed arrows indicate the flow direction of the cooling working fluid, the droplets represent the liquid outside the cooling structure 40, and the solid arrows indicate the flow direction of the liquid outside the cooling structure 40. Furthermore, Figure 22 is only intended to schematically depict the connection relationships of the various structures in the functional module 100, and does not constitute a specific limitation on the connection positions, specific constructions, or quantities of each structure. That is, the structures illustrated in this embodiment do not constitute a specific limitation on the functional module 100.

[0233] In this embodiment, the content that is the same as in the first embodiment will not be repeated, and the content that differs from the first embodiment will be described below. In addition, the description of the structural improvements of the functional module 100 in this embodiment can be applied to the first to tenth embodiments above, unless there is any conflict.

[0234] In this embodiment, there can be multiple heating elements 30. Multiple heating elements 30 are electrically connected to the first surface 21 and the second surface 22 of the circuit board 20. The cooling structure 40 may include a first cooling structure 46 and a second cooling structure 48. The first cooling structure 46 may be connected to the heating element 30 electrically connected to the first surface 21, and the second cooling structure 48 may be connected to the heating element 30 electrically connected to the second surface 22.

[0235] Both the first cooling structure 46 and the second cooling structure 48 may include a heat exchange section 42 and a liquid cooling pipe 43. The structures of the heat exchange section 42 and the liquid cooling pipe 43 can generally refer to the structures of the heat exchange section 42 and the liquid cooling pipe 43 in the first and second embodiments described above, and will not be repeated here. Alternatively, both the first cooling structure 46 and the second cooling structure 48 may include a body 44 and a protrusion 45. The structures of the body 44 and the protrusion 45 can generally refer to the structures of the body 44 and the protrusion 45 in the eighth embodiment described above, and will not be repeated here.

[0236] Functional module 100 may further include a drainage structure 64. The drainage structure 64 is located between the second cooling structure 48 and the heating element 30, and between the second cooling structure 48 and the circuit board 20. The drainage structure 64 isolates the second cooling structure 48 from the heating element 30, and also isolates the second cooling structure 48 from the circuit board 20. The drainage structure 64 is used to guide liquid outside the second cooling structure 48 to the drain port 11.

[0237] For example, the functional module 100 of this embodiment may further include one or more combinations of a drainage structure (not shown), an extension structure and electronic devices (not shown), and a first heat insulation structure (not shown). The specific construction of the drainage structure and its connection to the outer casing 10 in this embodiment can generally refer to the specific construction of the drainage structure 61 in the third embodiment above, and the connection between the drainage structure 61 and the outer casing 10, and will not be repeated here. The specific construction of the first heat insulation structure and its connection to the cooling structure 40 in this embodiment can generally refer to the specific construction of the first heat insulation structure 62 in the fourth embodiment above, and the connection between the first heat insulation structure 62 and the cooling structure 40, and will not be repeated here. The specific construction of the extension structure and electronic devices in this embodiment, and their connection, can generally refer to the specific construction of the extension structure 63 and electronic devices 70 in the seventh embodiment above, and the connection between the extension structure 63 and electronic devices 70, and will not be repeated here.

[0238] In this embodiment, there can be multiple electronic devices, which can be electrically connected to the first surface 21 and the second surface 22 of the circuit board 20, and are respectively spaced apart from the heating device 30 electrically connected to the first surface 21 and the heating device 30 electrically connected to the second surface 22. The extension structure of this embodiment can be located on both sides of the circuit board 20.

[0239] Specifically, in the extension structure, the first cooling structure 46, and the electronic device located on the first surface 21 side, the first end of the extension structure can be connected to the heat exchange section 42 or the body 44, and the second end of the extension structure can be connected to the electronic device or have an air gap. For example, the second end of the extension structure is connected to the electronic device through a second thermally conductive layer. Alternatively, in this embodiment, the first end of the extension structure can be connected to the liquid cooling pipe 43 or the protrusion 45, and the second end of the extension structure can be connected to the electronic device or have an air gap. For example, the second end of the extension structure is connected to the electronic device through a second thermally conductive layer.

[0240] In the extension structure, second cooling structure 48, flow guiding structure 64, and electronic device located on the second surface 22 side, the first end of the extension structure can be connected to the heat exchange section 42 or the body 44, and the second end of the extension structure can pass through the flow guiding structure 64 and be connected to the electronic device or have an air gap. For example, the second end of the extension structure is connected to the electronic device through a second thermally conductive layer. Alternatively, in this embodiment, the first end of the extension structure can be connected to the liquid cooling pipe 43 or the protrusion 45, and the second end of the extension structure can pass through the flow guiding structure 64 and be connected to the electronic device or have an air gap. For example, the second end of the extension structure is connected to the electronic device through a second thermally conductive layer.

[0241] The first heat insulation structure of this embodiment can be located on both sides of the circuit board 20. In the first heat insulation structure and the first cooling structure 46 located on the first surface 21 side, the first heat insulation structure of this embodiment can cover the portion of the first cooling structure 46 located within the cavity W. For example, when the heat exchange section 42 is connected to the heating device 30 on the first surface 21 via the first thermally conductive layer 51, the first heat insulation structure 62 can cover the liquid cooling pipe 43 located within the cavity W, and cover the portion of the heat exchange section 42 not connected to the first thermally conductive layer 51. When there is an air gap between the heat exchange section 42 and the heating device 30 on the first surface 21 in this embodiment, the first heat insulation structure 62 can cover the liquid cooling pipe 43 located within the cavity W, and cover the entire heat exchange section 42. When the protrusion 45 is connected to the heating device 30 on the first surface 21 via the first thermally conductive layer 51, the first heat insulation structure of this embodiment can cover the body 44 located within the cavity W, and cover the portion of the protrusion 45 not connected to the first thermally conductive layer 51. When there is an air gap between the protrusion 45 and the heating device 30 on the first surface 21, the first heat insulation structure of this embodiment can cover the body 44 located in the cavity W and cover all the protrusions 45.

[0242] In the first heat insulation structure and the second cooling structure 48 located on the second surface 22 side, the first heat insulation structure of this embodiment can cover the portion of the second cooling structure 48 located within the cavity W. For example, when the heat exchange section 42 is connected to the heating device 30 on the second surface 22 via the first heat-conducting layer 51, the first heat insulation structure 62 can cover the liquid cooling pipe 43 located within the cavity W, and cover the portion of the heat exchange section 42 not connected to the first heat-conducting layer 51. When there is an air gap between the heat exchange section 42 and the heating device 30 on the second surface 22 in this embodiment, the first heat insulation structure 62 can cover the liquid cooling pipe 43 located within the cavity W, and cover the entire heat exchange section 42. When the protrusion 45 is connected to the heating device 30 on the second surface 22 via the first heat-conducting layer 51, the first heat insulation structure of this embodiment can cover the body 44 located within the cavity W, and cover the portion of the protrusion 45 not connected to the first heat-conducting layer 51. When there is an air gap between the protrusion 45 and the heating device 30 on the second surface 22, the first heat insulation structure of this embodiment can cover the body 44 located in the cavity W, as well as cover all the protrusions 45.

[0243] The first thermal insulation structure of this embodiment can also cover part or all of the extended structure. For example, when the extended structure is connected to the electronic device through a second thermally conductive layer, the first thermal insulation structure of this embodiment can also cover the portion of the extended structure not connected to the second thermally conductive layer. When there is an air gap between the extended structure and the electronic device, the first thermal insulation structure of this embodiment can also cover the entire extended structure.

[0244] The outer casing 10 of this embodiment may also be provided with at least one of two types of ventilation openings: an air inlet (not shown) and an air outlet (not shown), and a ventilation port (not shown). The structures of the air inlet and air outlet in this embodiment are generally similar to the structures of the air inlet 12 and air outlet 13 in the fifth embodiment described above, and the structure of the ventilation port in this embodiment is generally similar to the structure of the ventilation port 14 in the sixth embodiment described above; further details will not be repeated here.

[0245] Twelfth Example:

[0246] Please refer to Figure 23, which is a cross-sectional schematic diagram of the functional module 100 provided in the twelfth embodiment of this application. In Figure 23, the dashed arrows indicate the flow direction of the cooling working fluid, the droplets represent the liquid outside the cooling structure 40, and the solid arrows indicate the flow direction of the liquid outside the cooling structure 40. Furthermore, Figure 23 is only intended to schematically depict the connection relationships of the various structures in the functional module 100, and does not constitute a specific limitation on the connection positions, specific constructions, or quantities of each structure. That is, the structures illustrated in this embodiment do not constitute a specific limitation on the functional module 100.

[0247] In this embodiment, the content that is the same as in the first embodiment will not be repeated, and the content that differs from the first embodiment will be described below. In addition, the description of the structural improvements of the functional module 100 in this embodiment can be applied to the first to eleventh embodiments above, unless there is any conflict.

[0248] In this embodiment, the thickness direction of the circuit board 20 can be perpendicular to the gravity direction G (within acceptable tolerance range). That is, the arrangement direction of the circuit board 20, the heating device 30, and the cooling structure 40 can be perpendicular to the gravity direction G. The heating device 30 can be connected to the first surface 21 and / or the second surface 22 of the circuit board 20, and the cooling structure 40 can be connected to the heating device 30.

[0249] It is understandable that since the circuit board 20, the heating device 30 and the cooling structure 40 can be arranged perpendicular to the direction of gravity G, when a small amount of condensation is generated on the outside of the cooling structure 40, the condensate droplets will flow downward under the influence of gravity and flow out of the module from the drain port 11. This helps to avoid the risk of liquid entering the circuit board 20 and the heating device 30 and improves the working reliability of the functional module 100.

[0250] In embodiments of this application, the heat dissipation system 200 may further include a first temperature sensor. The first temperature sensor may be used to detect the ambient temperature outside the functional module 100. The functional module 100 may further include a controller, a second temperature sensor, and a regulating valve. The controller, the second temperature sensor, and the regulating valve are all located within the cavity W. The second temperature sensor may be used to detect the temperature of the object under test, wherein the object under test may include a heat-generating device 30 or a circuit board 20. The regulating valve may be connected in series with and communicate with the flow channel 41. The regulating valve may be used to regulate the flow rate within the flow channel 41. The controller may be electrically connected to the first temperature sensor, the second temperature sensor, and the regulating valve.

[0251] When the temperature detected by the second temperature sensor is less than or equal to the sum of the temperature detected by the first temperature sensor and a preset value, the controller controls the regulating valve to reduce or shut off the flow rate in the guide channel 41 to avoid condensation due to excessively low temperature. The preset value can be any constant. It is understood that increasing the preset value adds a correction factor to the reading error between the second and first temperature sensors, preventing the problem of an overestimation of the temperature even when it is already below the ambient dew point, without any action being taken to reduce or shut off the flow rate.

[0252] When the temperature detected by the second temperature sensor is greater than the sum of the temperature detected by the first temperature sensor and the preset value, the controller controls the regulating valve to open the flow channel 41, so that the cooling structure 40 can perform heat dissipation and cooling normally.

[0253] Alternatively, instead of setting a preset value, the flow rate can be adjusted based on the relationship between the actual readings of the first and second temperature sensors. Specifically, when the temperature detected by the second temperature sensor is less than or equal to the temperature detected by the first temperature sensor, the controller controls the regulating valve to reduce or shut off the flow rate in the guide channel 41 to prevent condensation due to excessively low temperatures. When the temperature detected by the second temperature sensor is greater than the temperature detected by the first temperature sensor, the controller controls the regulating valve to open the flow rate in the guide channel 41, allowing the cooling structure 40 to dissipate heat and cool normally.

[0254] The above are merely some embodiments and implementation methods of this application. The scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A functional module, characterized in that, The functional module includes a housing, a circuit board, a heating element, and a cooling structure; The outer casing is provided with a drain port, which connects the cavity formed by the outer casing and the outside of the outer casing; The heating element is electrically connected to the circuit board, and both the heating element and the circuit board are located within the cavity; At least a portion of the cooling structure is located within the cavity, and the cooling structure is also located on the side of the heating device away from the circuit board. The cooling structure is provided with a flow channel for the flow of cooling fluid. Liquid located outside the cooling structure is discharged from the outer casing through the drain port.

2. The functional module as described in claim 1, characterized in that, The circuit board, the heating element, and the cooling structure are arranged parallel to the direction of gravity, or the circuit board, the heating element, and the cooling structure are arranged perpendicular to the direction of gravity.

3. The functional module as described in claim 1 or 2, characterized in that, The cooling structure includes a heat exchange section and a liquid cooling pipe. The heat exchange section and at least a portion of the liquid cooling pipe are located within the cavity. The heat exchange section is connected to the heating device, and the liquid cooling pipe is connected to the heat exchange section. The liquid cooling pipe is provided with an inlet and an outlet. The flow channel extends within the heat exchange section and the liquid cooling pipe, and is connected to both the liquid inlet and the liquid outlet; alternatively, the flow channel extends within the liquid cooling pipe and is connected to both the liquid inlet and the liquid outlet.

4. The functional module as described in claim 3, characterized in that, The heat exchange section is a liquid cooling head, or the heat exchange section is a heat-conducting structure.

5. The functional module as described in claim 4, characterized in that, The heat exchange section and the liquid cooling pipe are an integral structure, or the heat exchange section and the liquid cooling pipe are separate components.

6. The functional module as described in claim 1 or 2, characterized in that, The cooling structure includes a body and a protrusion. The body forms part of the outer shell. The body has a liquid inlet and a liquid outlet. The flow channel is located in the body and communicates with both the liquid inlet and the liquid outlet. The body includes a connecting surface facing the cavity. The protrusion is located in the cavity and connected to the body. The protrusion also protrudes relative to the connecting surface and is connected to the heating device on the side away from the body.

7. The functional module as described in any one of claims 1-6, characterized in that, The functional module further includes a first heat insulation structure located within the cavity and covering at least a portion of the cooling structure.

8. The functional module as described in any one of claims 1-7, characterized in that, The drain port is located at the bottom of the outer shell, and the bottom of the outer shell is also provided with a drain structure, which is located inside the cavity.

9. The functional module as described in any one of claims 1-8, characterized in that, The functional module also includes electronic components, which are electrically connected to the circuit board and spaced apart from the heat-generating device. The heat dissipation of the electronic components is less than that of the heat-generating device. The functional module also includes an extension structure, the first end of which is connected to the cooling structure, and the second end of which is connected to the electronic device.

10. The functional module as described in any one of claims 1-9, characterized in that, The functional module also includes a first thermally conductive layer, which is connected between the heat-generating device and the cooling structure.

11. The functional module as described in any one of claims 1-10, characterized in that, The outer casing also has spaced-apart air inlets and outlets, both of which connect to the outside of the cavity and the outer casing; or, The outer casing is also provided with a ventilation port, which connects the cavity and the outside of the outer casing.

12. The functional module as described in any one of claims 1-11, characterized in that, The circuit board includes a first surface and a second surface, which are disposed opposite to each other in the thickness direction of the circuit board. The first surface faces the bottom of the housing, and the second surface faces the top of the housing. The heating element is connected to the first surface, and the cooling structure is connected to the heating element.

13. The functional module as described in any one of claims 1-11, characterized in that, The circuit board includes a first surface and a second surface, which are disposed opposite to each other in the thickness direction of the circuit board. The first surface faces the bottom of the housing, and the second surface faces the top of the housing. The heating device is connected to the second surface, and the cooling structure is connected to the heating device. The functional module also includes a drainage structure located between the cooling structure and the heating device, and between the cooling structure and the circuit board. The drainage structure isolates the cooling structure and the heating device, and isolates the cooling structure and the circuit board. The drainage structure is used to guide liquid outside the cooling structure to the drain port.

14. The functional module as described in any one of claims 1-11, characterized in that, The circuit board includes a first surface and a second surface, which are disposed opposite to each other in the thickness direction of the circuit board. The first surface faces the bottom of the housing, and the second surface faces the top of the housing. The number of heating devices is multiple, and the multiple heating devices are connected to the first surface and the second surface; The cooling structure includes a first cooling structure and a second cooling structure, wherein the first cooling structure is connected to the heating device connected to the first surface, and the second cooling structure is connected to the heating device connected to the second surface; The functional module further includes a drainage structure, which is located between the second cooling structure and the heating device, and between the second cooling structure and the circuit board. The drainage structure isolates the second cooling structure from the heating device and from the circuit board. The drainage structure is used to guide liquid outside the second cooling structure to the drain port.

15. A heat dissipation system, characterized in that, The heat dissipation system includes the functional modules as described in any one of claims 1-14.

16. A vehicle, characterized in that, The vehicle includes the functional modules as described in any one of claims 1-14.

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