Method, circuit and pad for heating

Abstract

The present application provides a method for heating, comprising: presetting an ideal temperature; turning on a power supply, so that a circuit reaches a first temperature; triggering a switch, so that the circuit reaches a second temperature; determining whether the second temperature is the same as the ideal temperature; when the second temperature is less than the ideal temperature, enabling the circuit to continue heating, so that the second temperature continues to rise; and when the second temperature is greater than or equal to the ideal temperature, stopping the heating of the circuit, wherein the first temperature is less than the second temperature. In the present application, by means of setting the second temperature and the ideal temperature, the heating process of the entire circuit is simpler and more intelligent.

Description

A method, circuit, and pad for heating Technical Field

[0001] This invention relates to the field of heating pad technology, and more specifically, to a method, circuit, and pad for heating. Background Technology

[0002] In daily life, people often encounter situations where food, clothing, or other daily necessities become cold or damp, requiring heating or drying. For example, in cold winters, milk needs to be heated, but pouring it into a pot for separate heating is inconvenient; similarly, in damp weather, clothes easily become damp, requiring additional drying; and in colder seasons, food cools down easily over time during meals. Based on these various applications, a heating pad was developed to heat or dry food, clothing, or other daily necessities.

[0003] However, market research and actual use revealed that existing heating pads are complex to operate and generally have multiple settings. In practice, it is difficult to quickly select the desired working mode, leading to operational errors by many consumers. This results in poor heating performance and a poor customer experience, as the heating pads fail to heat food, clothing, or other daily necessities quickly. Summary of the Invention

[0004] In view of the above-mentioned technical problems, the present invention provides a method for heating, comprising:

[0005] Preset an ideal temperature;

[0006] Turn on the power so that the circuit reaches the first temperature;

[0007] Trigger the switch to bring the circuit to the second temperature;

[0008] Determine whether the second temperature and the ideal temperature are the same;

[0009] When the second temperature is lower than the ideal temperature, the circuit continues to heat up so that the second temperature continues to rise.

[0010] When the second temperature is greater than or equal to the ideal temperature, heating of the circuit is stopped.

[0011] The first temperature is lower than the second temperature.

[0012] Specifically, the step of turning on the power supply to bring the circuit to the first temperature further includes:

[0013] Turn on the power to put the circuit into standby mode;

[0014] Turn on the first switch, detect the change in the resistance value of the circuit, and detect that the circuit has reached the first temperature.

[0015] Specifically, the heating method further includes:

[0016] A preset time threshold is provided;

[0017] Calculate the heating time of the circuit; when the heating time of the circuit is greater than or equal to the time threshold.

[0018] This causes the circuit to be in the standby state or to reach the first temperature.

[0019] Specifically, the step of triggering the switch to bring the circuit to the second temperature includes:

[0020] Turn on the second switch;

[0021] The change in the resistance value of the circuit is detected, and the actual temperature value of the circuit is detected, which is defined as the second temperature.

[0022] The present invention also provides a circuit for heating, comprising:

[0023] The power module is used to connect to an external power source so that the circuit reaches a first temperature; it is also used to trigger a switch so that the circuit reaches a second temperature.

[0024] A heating module is electrically connected to the power module, which supplies power to the heating module to cause the temperature of the heating module to change.

[0025] The processing module is used to preset an ideal temperature and to determine whether the second temperature and the ideal temperature are the same. When the second temperature is less than the ideal temperature, the circuit continues to heat up so that the second temperature continues to rise. When the second temperature is greater than or equal to the ideal temperature, the heating of the circuit is stopped.

[0026] The first temperature is lower than the second temperature;

[0027] The circuit board is on which the power supply module and the processing module are mounted, and the power supply module, the processing module and the heating module are electrically connected.

[0028] Specifically, the heating circuit further includes:

[0029] The display module is electrically connected to the power module and the processing module;

[0030] The display module includes:

[0031] Indicator light unit;

[0032] A driving unit is used to drive the indicator light unit;

[0033] The display unit is electrically connected to the indicator light unit.

[0034] The indicator light unit, the drive unit, and the display unit are electrically connected.

[0035] Specifically, the processing module includes:

[0036] Storage unit for storing the ideal temperature;

[0037] The processing unit is used to determine whether the second temperature and the ideal temperature are the same; when the second temperature is less than the ideal temperature, the circuit continues to heat up so that the second temperature continues to rise; when the second temperature is greater than or equal to the ideal temperature, the heating of the circuit is stopped.

[0038] A temperature control unit, which is electrically connected to the processing unit, is used to receive the numerical values ​​of the first temperature and the second temperature.

[0039] The present invention also provides a heating pad that employs the aforementioned heating method, the heating pad comprising:

[0040] Operation area, the operation area includes:

[0041] The upper shell is a shell-like structure with through holes;

[0042] The lower shell is disposed opposite to the upper shell, and the upper shell and the lower shell are fixedly connected to form an accommodating space;

[0043] A circuit board, which is mounted in the receiving space;

[0044] The user interface is located at the through hole of the upper shell, and the user interface and the circuit board are electrically connected.

[0045] The heating zone is fixedly connected to the operating area; the heating zone includes:

[0046] The mat body is made of a flexible material, and the mat body includes an upper surface and a lower surface, which are disposed opposite to each other;

[0047] A plurality of support columns are disposed on the lower surface and extend outward from the lower surface, wherein the height of the support columns is greater than the thickness of the mat body;

[0048] A heating wire is mounted on the lower surface; gaps exist between the plurality of support columns, and the heating wire is disposed in the gaps; the heating wire and the circuit board are electrically connected.

[0049] Specifically, the heating pad also includes:

[0050] A mounting slot having an opening, the opening being away from the upper surface; the mounting slot being located at the gap; the mounting slot comprising:

[0051] bottom wall;

[0052] First sidewall;

[0053] The second sidewall is disposed opposite to the first sidewall;

[0054] The first sidewall, the bottom wall, and the second sidewall are connected in sequence, and the bottom wall, the first sidewall, and the second sidewall form a groove-shaped space.

[0055] The heating wire is disposed in the groove-shaped space.

[0056] Specifically, the heating zone also includes:

[0057] A first encapsulation layer is wrapped around the heating wire, and both the heating wire and the first encapsulation layer are disposed in the groove-shaped space.

[0058] The second encapsulation layer is disposed at the opening of the mounting groove, such that the bottom wall, the first side wall, the second side wall and the second encapsulation layer form a sealed space, and the first encapsulation layer and the heating wire are disposed in the sealed space. Attached Figure Description

[0059] The accompanying drawings, which are included to provide a further understanding of the invention and form part of this invention, illustrate exemplary embodiments of the invention and are used to explain the invention, but do not constitute an undue limitation of the invention. Some specific embodiments of the invention will be described in detail below with reference to the accompanying drawings in an exemplary and non-limiting manner. The same reference numerals in the drawings designate the same or similar parts or components. It should be understood by those skilled in the art that these drawings are not necessarily drawn to scale, wherein:

[0060] Figure 1 is a schematic flowchart of a heating method provided in this application;

[0061] Figure 2 is a flowchart of step S2 in one embodiment provided in this application;

[0062] Figure 3 is a flowchart of step S2 in another embodiment provided in this application;

[0063] Figure 4 is a flowchart of step S3;

[0064] Figure 5 is a flowchart of step S5.

[0065] Figure 6 is a flowchart of step S6.

[0066] Figure 7 is a schematic flowchart of the heating method described above;

[0067] Figure 8 is a schematic diagram of a heating circuit.

[0068] Figure 9 is a schematic diagram of another heating circuit provided in this application.

[0069] Figure 10 is a schematic diagram of the processing module provided in this application.

[0070] Figure 11 is a schematic diagram of the structure of the processing unit 032 provided in this application;

[0071] Figure 12 is a schematic diagram of the structure of the processing unit 032 provided in this application;

[0072] Figure 13 is a schematic diagram of the structure of a heating circuit according to another embodiment of this application;

[0073] Figure 14 is a structural view of the front of a heating pad 001 provided in this application;

[0074] Figure 15 is a structural schematic diagram of the back side of a heating pad 001 provided in this application;

[0075] Figure 16 is a schematic diagram of the disassembly structure of a heating pad 001 provided in this application;

[0076] Figure 17 is a cross-sectional view of the heating area 03 of a heating pad 001 provided in this application;

[0077] Figure 18 is a partial cross-sectional view of the heating area 03 of a heating pad 001 according to this application. [0077.1] [Correction 03.03.2025 according to Article 91] Figure 19 is a partial cross-sectional view of the heating area 03 of another heating pad 001 of this application. Detailed Implementation

[0078] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0079] It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indication will also change accordingly.

[0080] Furthermore, in this invention, descriptions involving "first," "second," etc., are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0081] In this invention, unless otherwise explicitly specified and limited, the terms "connection," "fixed," etc., should be interpreted broadly. For example, "fixed" can mean a fixed connection, a detachable connection, or an integral part; it can mean a mechanical connection or an electrical connection; it can mean a direct connection or an indirect connection through an intermediate medium; it can mean the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.

[0082] Furthermore, the technical solutions of the various embodiments of the present invention can be combined with each other, but only if they are feasible for those skilled in the art. If the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed by the present invention.

[0083] As shown in Figure 1, Figure 1 is a schematic flowchart of a heating method provided by this application. It includes:

[0084] S1. Preset an ideal temperature;

[0085] S2. Turn on the power so that the circuit reaches the first temperature;

[0086] S3, trigger the switch to bring the circuit to the second temperature;

[0087] S4. Determine whether the second temperature and the ideal temperature are the same;

[0088] S5. When the second temperature is lower than the ideal temperature, the circuit continues to heat up so that the second temperature continues to rise.

[0089] S6. When the second temperature is greater than or equal to the ideal temperature, heating of the circuit shall be stopped.

[0090] The first temperature is lower than the second temperature.

[0091] It should be noted that, unless otherwise specified, the designations S1, S2, S3, etc., mentioned above in this application are merely for easier understanding of the relationship between the method steps and for convenience in drawing, and do not uniquely define the order of the steps. It should also be noted that ideal temperature values ​​can be preset at the factory according to actual needs, and will not be listed here, nor will this application limit the specific value of the ideal temperature.

[0092] In one embodiment of this application, the step of turning on the power in step S2 to make the circuit reach a first temperature is a temperature that is lower than the second temperature, which is a preheating process before reaching the second temperature.

[0093] For example, before heating milk, the operator first needs to reach 30 degrees Celsius. This temperature serves two purposes: first, it signals to the operator that the equipment has started working and can begin further heating; second, it preheats the items to be heated, preventing hazards caused by rapid heating (such as explosions, food spoilage, or burning). For example, in a cold winter, where the room temperature might be 0 degrees Celsius, the first temperature setting could be 40 degrees Celsius, and the second temperature setting could be 100 degrees Celsius.

[0094] In another embodiment of this application, the first temperature can be the temperature at which the device is in standby mode after the power is turned on. This temperature is not specifically set; it could be room temperature or a preheated temperature.

[0095] It should be noted that, in a preferred embodiment of this application, the difference between the first temperature and the second temperature is greater than or equal to 40 degrees Celsius. For example, when the first temperature is 40 degrees Celsius, the second temperature is greater than or equal to 80 degrees Celsius; when the first temperature is 50 degrees Celsius, the second temperature is greater than or equal to 90 degrees Celsius.

[0096] In this application, by setting a second temperature and an ideal temperature, the heating process of the entire circuit is simplified and made more intelligent. During the heating process, consumers do not need to adjust various working modes or different speed settings; they can directly use the "one-button heating" method. That is, after triggering the switch, the ideal working temperature is reached and then maintained at a constant temperature. This operation method requires less operation and is less prone to errors.

[0097] As shown in Figure 2, Figure 2 is a flowchart of step S2 in one embodiment provided in this application. Step S2 includes:

[0098] S21. Turn on the power supply to put the circuit into standby mode;

[0099] S22. Turn on the first switch, detect the change in the resistance value of the circuit, and detect that the circuit has reached the first temperature.

[0100] At this point, step S2 includes two steps. The first step is in standby mode, during which no heating is performed, and the standby temperature is the same as room temperature. In the second step, the first switch is triggered, causing the entire circuit to start heating, but the heating temperature is not high, remaining at a low, constant temperature.

[0101] The "low temperature" mentioned here is relative to the second temperature. Any temperature lower than the second temperature can be called low temperature.

[0102] As shown in Figure 3, Figure 3 is a flowchart of step S2 in another embodiment provided in this application. Step S2 includes:

[0103] S021. Turn on the power supply so that the circuit reaches the first temperature.

[0104] In this embodiment, it means that the heating step is started after the power is turned on, so that the temperature of the circuit reaches the first temperature.

[0105] As shown in Figure 4, which is a flowchart of step S3, it includes:

[0106] S31. Turn on the second switch;

[0107] S32. Detect the change in the resistance value of the circuit and detect the actual temperature value of the circuit, which is defined as the second temperature.

[0108] As shown in Figure 5, which is a flowchart of step S5, it includes:

[0109] S51. Collect the value of the second temperature;

[0110] S52. Convert the numerical value of the second temperature to form a second digital signal;

[0111] S53. Compare the magnitude of the second digital signal with the numerical value of the ideal temperature;

[0112] S54. When the value of the second digital signal is less than the value of the ideal temperature, the circuit continues to heat up so that the second temperature continues to rise.

[0113] As shown in Figure 6, which is a flowchart of step S6, it includes:

[0114] S61. Collect the value of the second temperature;

[0115] S62. Convert the numerical value of the second temperature to form a second digital signal;

[0116] S63. Compare the magnitude of the second digital signal with the numerical value of the ideal temperature;

[0117] S64. When the value of the second digital signal is greater than or equal to the value of the ideal temperature, the circuit stops heating.

[0118] As shown in Figure 7, which is a flowchart illustrating the heating method, the heating method further includes:

[0119] S01, Preset a time threshold;

[0120] S02. Calculate the heating time of the circuit. When the heating time of the circuit is greater than or equal to the time threshold;

[0121] S03 then puts the circuit into standby mode or causes the circuit to reach a first temperature.

[0122] It should be noted that the above steps adjust the circuit's operation based on changes in time, determining whether it needs to be put into standby mode or reach a first temperature to achieve energy-saving and environmentally friendly effects. When the circuit is not used for an extended period, it can be put into standby mode or allowed to reach the first temperature to reduce power consumption.

[0123] As shown in Figure 8, Figure 8 is a schematic diagram of a heating circuit, which includes:

[0124] Power module 01 is used to connect to an external power source so that the circuit reaches a first temperature; it is also used to trigger a switch so that the circuit reaches a second temperature.

[0125] The heating module 02 is electrically connected to the power module 01, and the power module 01 supplies power to the heating module 02 so that the temperature of the heating module 02 changes.

[0126] Processing module 03 is used to preset an ideal temperature; it is also used to determine whether the second temperature and the ideal temperature are the same; when the second temperature is less than the ideal temperature, the circuit continues to heat up so that the second temperature continues to rise; when the second temperature is greater than or equal to the ideal temperature, the heating of the circuit is stopped.

[0127] The first temperature is lower than the second temperature;

[0128] The power supply module 01 and the processing module 03 are both mounted on the circuit board 04, and the power supply module 01, the processing module 03 and the heating module 02 are electrically connected to each other.

[0129] As shown in Figure 9, Figure 9 is a schematic diagram of another heating circuit provided in this application, which includes:

[0130] Power module 01 is used to connect to an external power source so that the circuit reaches a first temperature; it is also used to trigger a switch so that the circuit reaches a second temperature.

[0131] The heating module 02 is electrically connected to the power module 01, and the power module 01 supplies power to the heating module 02 so that the temperature of the heating module 02 changes.

[0132] Processing module 03 is used to preset an ideal temperature; it is also used to determine whether the second temperature and the ideal temperature are the same; when the second temperature is less than the ideal temperature, the circuit continues to heat up so that the second temperature continues to rise; when the second temperature is greater than or equal to the ideal temperature, the heating of the circuit is stopped.

[0133] The first temperature is lower than the second temperature;

[0134] The power supply module 01 and the processing module 03 are both mounted on the circuit board 04, and the power supply module 01, the processing module 03 and the heating module 02 are electrically connected to each other.

[0135] Display module 05, which is electrically connected to power module 01 and processing module 03; display module 05 includes:

[0136] Indicator unit 051;

[0137] Drive unit 052 is used to drive the indicator light unit 051;

[0138] Display unit 053, the indicator light unit 051 and the display unit 053 are electrically connected;

[0139] The indicator light unit 051, the drive unit 052, and the display unit 053 are electrically connected.

[0140] It should be noted that, in one embodiment of this application, the basic principle of the processing module in determining whether the second temperature and the ideal temperature are the same is as follows:

[0141] In this embodiment, a thermistor, such as an NTC (Negative Temperature Coefficient), is provided. The thermistor exhibits a negative temperature coefficient, meaning its resistance decreases exponentially with increasing temperature. This embodiment also includes a microcontroller unit (MCU, commonly known as a single-chip microcomputer), as a specific embodiment of the processing module 03.

[0142] It should be noted that using NTC or MUC does not mean excluding other electronic components with similar functions, especially electronic components such as temperature sensors.

[0143] The discussion continues as follows: The resistance of the NTC changes with the temperature of the heating wire in the heating module. The change in the resistance of the NTC will change the voltage of the MCU detection pin, and then the module conversion circuit will convert the signal into a digital signal, thus forming the digital signal of the second temperature.

[0144] Then, during the process of setting an ideal temperature, there is already a digital signal of the ideal temperature.

[0145] Finally, the magnitudes of the digital signals for the second temperature and the ideal temperature are compared and judged.

[0146] As shown in Figure 10, which is a schematic diagram of the processing module provided in this application, it includes:

[0147] Storage unit 031 is used to store the ideal temperature;

[0148] Processing unit 032 is used to determine whether the second temperature and the ideal temperature are the same; when the second temperature is less than the ideal temperature, the circuit continues to heat up so that the second temperature continues to rise; when the second temperature is greater than or equal to the ideal temperature, the heating of the circuit is stopped.

[0149] Temperature control unit 033 is electrically connected to the processing unit 032. Temperature control unit 033 is used to receive the numerical values ​​of the first temperature and the second temperature.

[0150] As shown in Figure 11, Figure 11 is a schematic diagram of the structure of the processing unit 032 provided in this application, which includes:

[0151] Acquisition subunit 0321 is used to acquire the numerical value of the second temperature;

[0152] The conversion subunit 0322 is used to convert the numerical value of the second temperature to form a second digital signal;

[0153] Comparison subunit 0323 is used to compare the magnitude of the second digital signal with the numerical value of the ideal temperature;

[0154] Heating subunit 0324 is used to cause the circuit to continue heating when the value of the second digital signal is less than the value of the ideal temperature, so that the second temperature continues to rise.

[0155] As shown in Figure 12, Figure 12 is a schematic diagram of the structure of the processing unit 032 provided in this application, which includes:

[0156] Acquisition subunit 0321 is used to acquire the numerical value of the second temperature;

[0157] The conversion subunit 0322 is used to convert the numerical value of the second temperature to form a second digital signal;

[0158] Comparison subunit 0323 is used to compare the magnitude of the second digital signal with the numerical value of the ideal temperature;

[0159] The heating stop subunit 0325 is used to stop the circuit from heating when the value of the second digital signal is greater than or equal to the value of the ideal temperature.

[0160] As shown in Figure 13, Figure 13 is a schematic diagram of a heating circuit according to another embodiment of this application, which includes:

[0161] Preset time module 01 is used to preset a time threshold;

[0162] The time calculation module 02 is used to calculate the heating time of the circuit, and when the heating time of the circuit is greater than or equal to the time threshold;

[0163] The status processing module 03 is used to put the circuit into a standby state or to make the circuit reach a first temperature.

[0164] It should be noted that the above steps adjust the circuit's operation based on changes in time, determining whether it needs to be put into standby mode or reach a first temperature to achieve energy-saving and environmentally friendly effects. When the circuit is not used for an extended period, it can be put into standby mode or allowed to reach the first temperature to reduce power consumption.

[0165] As shown in Figures 14, 15 and 16, Figure 14 is a structural diagram of the front of a heating pad 001 provided in this application, Figure 15 is a structural diagram of the back of a heating pad 001 provided in this application, and Figure 16 is a structural diagram of the disassembled heating pad 001 provided in this application.

[0166] The heating pad 001 employs any of the heating methods described above. All heating methods and / or heating circuits mentioned in this application can be applied to the heating pad 001; therefore, they will not be elaborated further here. The heating pad 001 includes an operating area 01 and a heating area 03, which are fixedly connected. The fixed connection can be achieved through screw connection, riveting, interference fit, clamping, adhesive bonding, etc.

[0167] The heating zone 03 includes a pad body 31, which is made of flexible material. The pad body 31 includes an upper surface 313 and a lower surface 311, which are arranged opposite to each other. The upper surface 313 is a generally flat and smooth surface, which is used to place items to be heated. In actual application scenarios, the items to be heated can be food, clothes, milk, meat to be thawed, etc.

[0168] In this application, the flexible material of the pad body 31 can be silicone, rubber, or other rollable materials, which will not be listed here.

[0169] The heating zone 03 also includes several support columns 33, which are disposed on the lower surface 311 and extend outward from the lower surface 311. The height of the support columns 33 is greater than the thickness of the pad body 31. The support columns 33 and the pad body 31 are an integrated design; in actual production, the support columns 33 and the pad body 31 are formed simultaneously in the mold. It should be noted that the thickness of the pad body 31 is the shortest distance between the upper surface 313 and the lower surface 311, and the height of the support column 33 is the distance between the top of the support column 33 and the lower surface.

[0170] It should be noted that the support columns 33 are arranged in an array on the lower surface 311, and there are gaps between different support columns 33. The cross-sectional shape of the support column 33 can be triangular, quadrilateral, pentagonal, hexagonal, heptagonal, octagonal, circular, elliptical and various irregular shapes.

[0171] In actual use, the free end of the support column 33 is usually in contact with the table, that is, the pad body 31 is placed on the table, and then the item to be heated is placed on the upper surface 313.

[0172] In a preferred embodiment of this application, the height of the support column 33 is at least twice the thickness of the pad body 31.

[0173] The heating zone 03 also includes a heating wire 35, which is installed on the lower surface 311; there are gaps between the plurality of support columns 33, and the heating wire 35 is disposed in the gaps, surrounding the support columns 33 to form an "S"-shaped winding state. The heating wire 35 is also made of flexible material.

[0174] It should be noted that in the application scenario of this application, the item to be heated is placed on the upper surface 313, and the lower surface 311 is generally placed on a table. Since the heating wire 35 is close to the lower surface 311, the heat from the heating wire 35 is ultimately transferred to the item to be heated through heat conduction from the mat body 31. However, if the lower surface 311, where the heating wire 35 is close, is too close to the table, it may cause excessively high temperatures that could damage the table or even cause a fire. Therefore, in this application, a support column 33 is provided, and the height of the support column 33 is greater than the thickness of the mat body 31. In the optimal embodiment, the height of the support column 33 is at least twice the thickness of the mat body 31.

[0175] The operating area 01 includes an upper shell 11, which is a shell-like structure with through holes 111. The shape of the through holes 111 is not specifically limited, and can be elliptical, circular, quadrilateral, triangular, etc. The number of through holes 111 is also not specifically limited, and can be a relatively large through hole 111 or several through holes 111.

[0176] The operating area 01 also includes a lower shell 13, which is disposed opposite to the upper shell 11. The upper shell 11 and the lower shell 13 are fixedly connected to form an accommodating space. The fixed connection between the upper shell 11 and the lower shell 13 can be achieved by snap-fitting, screw connection, adhesive bonding, interference fit, riveting, hinge connection, etc. In this embodiment, the selected connection method is screw connection.

[0177] The operation area 01 also includes a circuit board 17, an operation interface 19, and a wiring port 14, all of which are installed in the receiving space. The operation interface 19 is located at the through hole 111 of the upper shell 11, and the operation interface 19 and the circuit board 17 are electrically connected. The shape of the operation interface 19 is adapted to the shape of the through hole 111.

[0178] In actual use, the external power supply is connected to the connection port 14, and then the power supply is input to the circuit board 17. The circuit board 17 adopts any of the heating circuits described in Figures 8 to 13 of this application to perform various judgments and processing on the input current, and finally achieves the following functions: heating the heating wire 35, or detecting the temperature of the heating wire 35, or controlling the heating time of the heating wire 35, etc.

[0179] As shown in Figure 17, which is a cross-sectional view of the heating area 03 of a heating pad 001 provided in this application, and Figure 18, which is a partial cross-sectional view of the heating area 03 of a heating pad 001 provided in this application, the heating area 03 includes a mounting groove 37 with an opening, which is formed on the lower surface 311, the opening being away from the upper surface 313; the mounting groove 37 is positioned in the gap between different support columns 33; the mounting groove 37 includes a bottom wall 371, a first side wall 373, and a second side wall 375, the second side wall 375 being disposed opposite to the first side wall 373;

[0180] The bottom wall 371, the first side wall 373, and the second side wall 375 are integrated into a single design, forming a groove-shaped space 376; the heating wire 35 is disposed in the groove-shaped space 376.

[0181] It should be noted that the bottom wall 371, the first side wall 373, and the second side wall 375 shown in the accompanying drawings are only one embodiment. In other embodiments, the bottom wall 371, the first side wall 373, or the second side wall 375 may be a curved surface, a plane, an arc surface, a folded surface, or other irregular planes. That is to say, the shape of the bottom wall 371, the first side wall 373, and the second side wall 375 is not specifically limited here, as long as they can form a groove-shaped space 376.

[0182] It should also be noted that the layout of the operating space 376 on the lower surface is not specifically limited. It can be a meandering "S" shape, with the heating wire 35 placed within its meandering trajectory; or it can be a "straight line or broken line" layout.

[0183] In this application, the grooved space 376 may be recessed between the upper surface 313 and the lower surface 311, that is, the grooved space 376 is carved into the mat body 31. In this case, the heating wire 35 is disposed in the grooved space 376, and the heating wire 35 is closer to the upper surface 313, resulting in better heating performance. Because the heating wire 35 is closer to the upper surface 313, the heating effect is better; the heating wire 35 is also further away from the tabletop, more effectively preventing burns and damage to the tabletop.

[0184] The groove-shaped space 376 can also protrude outward from the lower surface 311, in which case the first sidewall 373 and the second sidewall 375 both protrude outward from the lower surface 311.

[0185] The heating zone 03 further includes a first encapsulation layer 38 and a second encapsulation layer 39. The first encapsulation layer 38 wraps around the heating wire 35, and the heating wire 35 is disposed in the groove-shaped space 376. The second encapsulation layer 39 is disposed in the opening of the mounting groove 37, so that the bottom wall 371, the first side wall 373, the second side wall 375, and the second encapsulation layer 39 form a sealed space, and the first encapsulation layer 38 and the heating wire 35 are disposed in the sealed space.

[0186] It should be noted that in the application scenario of this application, the material of the first encapsulation layer 38 can be flexible materials such as silicone or rubber; the material of the second encapsulation layer 39 can be flexible materials such as adhesive, silicone, or rubber. Through the first encapsulation layer 38 and the second encapsulation layer 39, localized overheating within the pad body 31 is reduced, thus improving the lifespan of the electronic body. Simultaneously, through the first encapsulation layer 38 and the second encapsulation layer 39, the heating wire 35 does not produce any odor after being energized (or rather, the odor is blocked), providing consumers with a pleasant dining experience.

[0187] The above description is merely an embodiment of this application. It should be noted that those skilled in the art can make improvements without departing from the inventive concept of this application, but these improvements all fall within the protection scope of this application.

Claims

1. A method for heating, characterized in that, include: Preset an ideal temperature; Turn on the power so that the circuit reaches the first temperature; Trigger the switch to bring the circuit to the second temperature; Determine whether the second temperature and the ideal temperature are the same; When the second temperature is lower than the ideal temperature, the circuit continues to heat up so that the second temperature continues to rise. When the second temperature is greater than or equal to the ideal temperature, heating of the circuit is stopped. The first temperature is lower than the second temperature.

2. The heating method as described in claim 1, characterized in that, The step of turning on the power supply to bring the circuit to the first temperature further includes: Turn on the power to put the circuit into standby mode; Turn on the first switch, detect the change in the resistance value of the circuit, and detect whether the circuit has reached the first temperature.

3. The method for heating as described in claim 2, characterized in that, Also includes: A preset time threshold is provided; Calculate the heating time of the circuit; when the heating time of the circuit is greater than or equal to the time threshold. This causes the circuit to be in the standby state or to reach the first temperature.

4. The method for heating as described in claim 2, characterized in that, The step of triggering the switch to bring the circuit to the second temperature includes: Turn on the second switch; The change in the resistance value of the circuit is detected, and the actual temperature value of the circuit is detected, which is defined as the second temperature.

5. A circuit for heating, characterized in that, include: The power module is used to connect to an external power source so that the circuit can reach the first temperature. Used to trigger the switch so that the circuit reaches the second temperature; A heating module is electrically connected to the power module, which supplies power to the heating module to cause the temperature of the heating module to change. Processing module; It is used to preset an ideal temperature; it is also used to determine whether the second temperature and the ideal temperature are the same; when the second temperature is less than the ideal temperature, the circuit continues to heat up so that the second temperature continues to rise. When the second temperature is greater than or equal to the ideal temperature, heating of the circuit is stopped. The first temperature is lower than the second temperature; The circuit board is on which the power supply module and the processing module are mounted, and the power supply module, the processing module and the heating module are electrically connected.

6. The circuit for heating as described in claim 5, characterized in that, Also includes: The display module is electrically connected to the power module and the processing module; The display module includes: Indicator light unit; A driving unit is used to drive the indicator light unit; The display unit is electrically connected to the indicator light unit. The indicator light unit, the drive unit, and the display unit are electrically connected.

7. The circuit for heating as described in claim 5, characterized in that, The processing module includes: Storage unit for storing the ideal temperature; The processing unit is used to determine whether the second temperature and the ideal temperature are the same; when the second temperature is less than the ideal temperature, the circuit continues to heat up so that the second temperature continues to rise; when the second temperature is greater than or equal to the ideal temperature, the heating of the circuit is stopped. A temperature control unit, which is electrically connected to the processing unit, is used to receive the numerical values ​​of the first temperature and the second temperature.

8. A heating pad, characterized in that, It employs the heating method as described in any one of claims 1 to 4, wherein the heating pad comprises: Operation area, the operation area includes: The upper shell is a shell-like structure with through holes; The lower shell is disposed opposite to the upper shell, and the upper shell and the lower shell are fixedly connected to form an accommodating space; A circuit board, which is mounted in the receiving space; The user interface is located at the through hole of the upper shell, and the user interface and the circuit board are electrically connected. The heating zone is fixedly connected to the operating area; the heating zone includes: The mat body is made of a flexible material, and the mat body includes an upper surface and a lower surface, which are disposed opposite to each other; A plurality of support columns are disposed on the lower surface and extend outward from the lower surface, wherein the height of the support columns is greater than the thickness of the mat body; A heating wire is mounted on the lower surface; gaps exist between the plurality of support columns, and the heating wire is disposed in the gaps; the heating wire and the circuit board are electrically connected.

9. The heating pad as described in claim 8, characterized in that, The heating zone also includes: A mounting slot having an opening; the mounting slot is located at the gap; the mounting slot includes: bottom wall; First sidewall; The second sidewall is disposed opposite to the first sidewall; The first sidewall, the bottom wall, and the second sidewall are connected in sequence, and the bottom wall, the first sidewall, and the second sidewall form a groove-shaped space. The heating wire is disposed in the groove-shaped space.

10. The heating pad as claimed in claim 9, characterized in that, The heating zone also includes: A first encapsulation layer is wrapped around the heating wire, and both the heating wire and the first encapsulation layer are disposed in the groove-shaped space. The second encapsulation layer is disposed at the opening of the mounting groove, such that the bottom wall, the first side wall, the second side wall and the second encapsulation layer form a sealed space, and the first encapsulation layer and the heating wire are disposed in the sealed space.

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