Touch and pressing detection apparatus and electronic device
By using a thin-film touch sensor and a small circuit board in the touchpad, combined with a pressure sensor, the problem of excessively thick touchpads in existing technologies has been solved, making it suitable for thin and light laptops.
Patent Information
- Authority / Receiving Office
- WO · WO
- Patent Type
- Applications
- Current Assignee / Owner
- SHENZHEN GOODIX TECH CO LTD
- Filing Date
- 2025-06-27
- Publication Date
- 2026-07-23
AI Technical Summary
Existing touchpads are too thick and not suitable for thin and light laptops.
It employs a thin-film touch sensor and a small circuit board, with pressure sensors placed in different areas of the thin-film touch sensor to achieve touch and pressure detection.
The overall thickness of the touch press detection device has been reduced, making it suitable for thin and light devices and reducing the space occupied by electronic devices.
Smart Images
Figure CN2025104553_23072026_PF_FP_ABST
Abstract
Description
Touch press detection device and electronic equipment Technical Field
[0001] This application relates to the field of touchpad technology, and more particularly to a touch press detection device and an electronic device. Background Technology
[0002] The touchpad is a flat panel mounted on the C-shell of a laptop. The touchpad on a laptop can recognize touch commands and press commands. When the user's finger slides on the touch area of the touchpad, the cursor on the laptop can be moved. When the user's finger presses on the touchpad, the touchpad can recognize the press command and make the laptop perform the corresponding operation.
[0003] Existing touchpads use printed circuit boards (PCBs) as the touch sensor layer. The touch sensor is located on the PCB near the cover plate, while the components are arranged on the back of the PCB using surface mount technology to form a PCB assembly (PCBA).
[0004] However, the touchpads in these technologies are relatively thick, making them unsuitable for use in thin and light laptops. Summary of the Invention
[0005] In view of this, embodiments of this application provide a touch press detection device and an electronic device to at least partially solve the above-mentioned problems.
[0006] According to a first aspect of the present application, a touch press detection device is provided, applied to an electronic device. The touch press detection device includes: a first circuit board, a thin-film touch sensor, and at least one pressure sensor; the first circuit board and the pressure sensor are both disposed on a first surface of the thin-film touch sensor, and the first circuit board and the pressure sensor are located in different areas of the thin-film touch sensor; the pressure sensor is electrically connected to the thin-film touch sensor, and the circuit board is electrically connected to the thin-film touch sensor; the thin-film touch sensor is used to generate a touch sensing signal when a detection object touches the recognition area; the pressure sensor is used to generate a pressure sensing signal when a detection object presses on the recognition area; the first circuit board is used to receive the touch sensing signal through the thin-film touch sensor and perform touch detection based on the touch sensing signal, and to receive the pressure sensing signal through the thin-film touch sensor and perform press detection based on the pressure sensing signal.
[0007] In one possible implementation, the thin-film touch sensor includes: a film substrate and a plurality of electrodes; the plurality of electrodes includes a plurality of first electrodes and a plurality of second electrodes; the first electrodes are distributed on a first surface of the film substrate, and the second electrodes are distributed on a second surface of the film substrate; one of the first electrodes and the second electrodes serves as a driving electrode, the other of the first electrodes and the second electrodes serves as a receiving electrode, and / or, at least one of the first electrodes and the second electrodes serves as both a driving electrode and a receiving electrode; the driving electrode receives a touch driving signal transmitted from the first circuit board, and the receiving electrode generates the touch sensing signal.
[0008] In one possible implementation, the thin-film touch sensor further includes: a first electrical connection region and a second electrical connection region, the film substrate includes a first through hole; the first electrical connection region and the second electrical connection region are disposed on a first surface of the film substrate; the first electrode is electrically connected to the first electrical connection region, the second electrode is electrically connected to the second electrical connection region through the first through hole, and the first electrical connection region and the second electrical connection region are electrically connected to the first circuit board through the traces in the thin-film touch sensor.
[0009] In one possible implementation, the thin-film touch sensor further includes: a third electrical connection area and a fourth electrical connection area; the third electrical connection area and the fourth electrical connection area are disposed on a first surface of the film substrate; the first circuit board is electrically connected to the third electrical connection area, the pressure sensor is electrically connected to the fourth electrical connection area, and the fourth electrical connection area is electrically connected to the third electrical connection area through a trace in the thin-film touch sensor.
[0010] In one possible implementation, the first circuit board is directly electrically connected to the third electrical connection area, or the first circuit board is electrically connected to the third electrical connection area through a second circuit board.
[0011] In one possible implementation, the thin-film touch sensor further includes: a first insulating layer and a shielding layer; the first insulating layer is disposed on the surface of the plurality of first electrodes, and the shielding layer is disposed on the surface of the first insulating layer; the shielding layer is used to shield electromagnetic interference to the first electrodes and the second electrodes.
[0012] In one possible implementation, the thin-film touch sensor further includes: a second insulating layer, a conductive layer, and a third insulating layer; the second insulating layer is disposed on the surface of the shielding layer, the conductive layer is disposed on the surface of the second insulating layer, and the third insulating layer is disposed on the surface of the conductive layer.
[0013] In one possible implementation, the pressure sensor includes: a first sensing electrode and a second sensing electrode; the first sensing electrode is disposed on a first surface of the membrane substrate, and the second sensing electrode is electrically connected to the fourth electrical connection region, with the first sensing electrode and the second sensing electrode disposed opposite to each other.
[0014] In one possible implementation, the touch pressure detection device further includes: a bracket; the bracket is connected to the housing of the electronic device; the bracket includes a second through hole, the first circuit board is located in the second through hole, the pressure sensor is disposed between the bracket and the thin-film touch sensor, and the bracket abuts against the pressure sensor through an elastic pad; when the detected object is pressed on the recognition area, the distance between the thin-film touch sensor and the bracket changes, causing the pressure sensor to deform and generate the pressure sensing signal.
[0015] In one possible implementation, the thickness of the film substrate is in the range of [12.5 μm, 100 μm].
[0016] In one possible implementation, the thickness of the first insulating layer ranges from [5μm to 70μm], and the thickness of the shielding layer ranges from [4μm to 7μm].
[0017] In one possible implementation, the thicknesses of the second insulating layer and the third insulating layer range from [5 μm to 70 μm].
[0018] According to a second aspect of the present application, an electronic device is provided, including a touch press detection device as described in the first aspect of the present application.
[0019] In one possible implementation, the electronic device further includes a cover plate; the cover plate is used to provide the identification area.
[0020] According to the touch pressure detection device provided in the embodiments of this application, the touch pressure detection device includes a first circuit board, a thin-film touch sensor, and at least one pressure sensor. The first circuit board and the pressure sensor are both disposed on the first surface of the thin-film touch sensor, and the first circuit board and the pressure sensor are located in different areas of the thin-film touch sensor. Since the first circuit board is a small circuit board disposed on the first surface of the thin-film touch sensor, and the first circuit board and the pressure sensor are located in different areas of the thin-film touch sensor, and the thickness of the thin-film touch sensor is much smaller than the thickness of a traditional PCB, compared with the PCBA solution in the prior art, the overall thickness of the touch pressure detection device can be reduced, thereby reducing the space occupied by the electronic device, and it can be applied to thin and light devices. Attached Figure Description
[0021] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings.
[0022] Figure 1 is a schematic diagram of a touch press detection device provided in an embodiment of this application;
[0023] Figure 2 is a schematic diagram of a thin-film touch sensor provided in an embodiment of this application;
[0024] Figure 3 is a schematic diagram of another thin-film touch sensor provided in an embodiment of this application;
[0025] Figure 4 is a schematic diagram of a first circuit board provided in an embodiment of this application;
[0026] Figure 5 is a schematic diagram of a second circuit board touch press detection device provided in an embodiment of this application;
[0027] Figure 6 is a schematic diagram of the stacking of a thin-film touch sensor provided in an embodiment of this application;
[0028] Figure 7 is a schematic diagram of the stacking of another thin-film touch sensor provided in an embodiment of this application;
[0029] Figure 8 is a schematic diagram of a pressure sensor provided in an embodiment of this application;
[0030] Figure 9 is a schematic diagram of a touch press detection device including a bracket provided in an embodiment of this application. Detailed Implementation
[0031] To enable those skilled in the art to better understand the technical solutions in the embodiments of this application, the technical solutions in the embodiments of this application will be clearly and thoroughly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art should fall within the protection scope of the embodiments of this application.
[0032] As mentioned earlier, a touchpad is a flat panel mounted on the C-shell of a laptop. The touchpad can recognize touch and press commands. When a user's finger slides across the touch area of the touchpad, the cursor on the laptop can be moved. When a user's finger presses on the touchpad, the touchpad can recognize the press command and cause the laptop to perform the corresponding operation. Existing touchpads use a printed circuit board (PCB) as the touch sensor layer. The touch sensor is located on the PCB near the cover plate, and the components are arranged on the back of the PCB using surface mount technology to form a PCB assembly (PCBA). However, touchpads in this technology are relatively thick, making them unsuitable for use in thin and light laptops.
[0033] This application provides a touch pressure detection device, which includes a first circuit board, a thin-film touch sensor, and at least one pressure sensor. The first circuit board and the pressure sensor are both disposed on the first surface of the thin-film touch sensor, and the first circuit board and the pressure sensor are located in different areas of the thin-film touch sensor. Since the first circuit board is a small circuit board disposed on the first surface of the thin-film touch sensor, and the first circuit board and the pressure sensor are located in different areas of the thin-film touch sensor, and the thickness of the thin-film touch sensor is much smaller than the thickness of a traditional PCB, compared with the PCBA solution in the prior art, the overall thickness of the touch pressure detection device can be reduced, thereby reducing the space occupied by the electronic device, and it can be applied to thin and light devices.
[0034] The touch pressure detection device provided in this application is illustrated below through embodiments.
[0035] Figure 1 is a schematic diagram of a touch pressure detection device provided in an embodiment of this application. The touch pressure detection device 100 is applied to an electronic device. As shown in Figure 1, the touch pressure detection device 100 includes a first circuit board 102, a thin-film touch sensor 101, and at least one pressure sensor 103. The first circuit board 102 and the pressure sensor 103 are both disposed on the first surface of the thin-film touch sensor 101, and the first circuit board 102 and the pressure sensor 103 are located in different areas of the thin-film touch sensor 101. The pressure sensor 103 is electrically connected to the thin-film touch sensor 101, and the first circuit board 102 is electrically connected to the thin-film touch sensor 101.
[0036] The thin-film touch sensor 101 can generate a touch sensing signal when the detected object touches the recognition area, and the pressure sensor 103 can generate a pressure sensing signal when the detected object presses on the recognition area. The first circuit board 102 can receive the touch sensing signal through the thin-film touch sensor 101 and perform touch detection based on the touch sensing signal, and receive the pressure sensing signal through the thin-film touch sensor 101 and perform press detection based on the pressure sensing signal.
[0037] At least one pressure sensor 103 is disposed in different areas of the first surface of the thin-film touch sensor 101. Optionally, at least four pressure sensors 103 may be included. The at least four pressure sensors 103 may be disposed at the four corners of the thin-film touch sensor 101, thereby detecting the pressure at each position. When the number of pressure sensors 103 is greater than four, in addition to the four corners of the thin-film touch sensor 101, the remaining pressure sensors 103 may be distributed along the edge of the thin-film touch sensor 101.
[0038] A first circuit board 102 is disposed on the first surface of the thin-film touch sensor 101. The first circuit board 102 can be a PCB. Optionally, the length of the first circuit board 102 is less than the length of the thin-film touch sensor 101, and the width of the first circuit board 102 is less than the width of the thin-film touch sensor 101. Preferably, the length of the first circuit board 102 is at least 1 / 2 of the length of the thin-film touch sensor 101, and the width of the first circuit board 102 is at least 3 / 10 of the width of the thin-film touch sensor 101. In a specific implementation, the length of the thin-film touch sensor 101 is between 80mm and 150mm, the length of the first circuit board 102 is between 50mm and 100mm, the width of the thin-film touch sensor 101 is between 50mm and 100mm, and the width of the first circuit board 102 is between 15mm and 50mm.
[0039] Optionally, the first circuit board 102 may be provided with a touch chip and a pressure chip, or the first circuit board 102 may be provided with a touch pressure chip. Taking the touch chip and pressure chip as an example, when the first circuit board 102 receives a touch sensing signal through the thin-film touch sensor 101, the touch chip can perform touch detection according to the touch sensing signal. When the first circuit board 102 receives a pressure sensing signal through the thin-film touch sensor 101, the pressure chip can perform press detection according to the pressure sensing signal. Optionally, the first circuit board 102 may be electrically connected to the processor of the electronic device. The processor may be the central processing unit (CPU) of the electronic device. The first circuit board 102 may send the touch detection result and the press detection result to the CPU, so that the electronic device may perform corresponding operations according to the touch detection result and the press detection result.
[0040] Optionally, the touch press detection device 100 may further include a vibration feedback unit. The vibration feedback unit is disposed on the first surface of the thin-film touch sensor 101, and is disposed in a different area of the thin-film touch sensor 101 from the first circuit board 102 and the pressure sensor 103. The vibration feedback unit can provide vibration feedback. Optionally, the vibration feedback unit may include a motor, a voice coil motor, etc. Since the vibration feedback unit is disposed on the first surface of the thin-film touch sensor 101, and is disposed in a different area of the thin-film touch sensor 101 from the first circuit board 102 and the pressure sensor 103, the space occupied by the touch panel can be reduced compared with the prior art of disposing of vibration feedback on the PCB.
[0041] Optionally, the pressure sensor 103 can be electrically connected to the thin-film touch sensor 101 via anisotropic conductive film (ACF), or via soldering.
[0042] In this embodiment, the touch pressure detection device 100 includes a first circuit board 102, a thin-film touch sensor 101, and at least one pressure sensor 103. The first circuit board 102 and the pressure sensor 103 are both disposed on the first surface of the thin-film touch sensor 101, and the first circuit board 102 and the pressure sensor 103 are located in different areas of the thin-film touch sensor 101. Since the first circuit board 102 is a small circuit board disposed on the first surface of the thin-film touch sensor 101, and the first circuit board 102 and the pressure sensor 103 are located in different areas of the thin-film touch sensor 101, and the thickness of the thin-film touch sensor 101 is much smaller than the thickness of a traditional PCB, compared with the PCBA solution in the prior art, the overall thickness of the touch pressure detection device 100 can be reduced, thereby reducing the space occupied by the electronic device and making it suitable for thin and light devices.
[0043] Figure 2 is a schematic diagram of a thin-film touch sensor provided in an embodiment of this application. As shown in Figure 2, the thin-film touch sensor 101 includes a film substrate 1011 and a plurality of electrodes. The plurality of electrodes include a plurality of first electrodes 1012 and a plurality of second electrodes 1013. The first electrodes 1012 are distributed on the first surface of the film substrate 1011, and the second electrodes 1013 are distributed on the second surface of the film substrate 1011.
[0044] One of the first electrode 1012 and the second electrode 1013 serves as a driving electrode, and the other of the first electrode 1012 and the second electrode 1013 serves as a receiving electrode, and / or at least one of the first electrode 1012 and the second electrode 1013 serves as both a driving electrode and a receiving electrode. The driving electrode receives the touch driving signal transmitted by the first circuit board 102, and the receiving electrode generates a touch sensing signal.
[0045] Multiple electrodes are disposed on the surface of the film substrate 1011, and the multiple electrodes are connected to the first circuit board 102 through the thin-film touch sensor 101. First electrodes 1012 are distributed on the first surface of the film substrate 1011, and second electrodes 1013 are distributed on the second surface of the film substrate 1011. Optionally, the electrodes may be made of indium tin oxide (ITO) or at least one of copper, nickel, gold, silver, palladium, and their alloys. The film substrate 1011 may be made of polyethylene terephthalate (PET), polyimide (PI), or polyethylene naphthalate (PEN).
[0046] It should be understood that the first electrode 1012 and the second electrode 1013 are arranged in a horizontal and vertical manner. Therefore, in the cross-sectional view shown in FIG2, the second electrode 1013 distributed on the second surface of the film substrate 1011 consists of multiple second electrodes 1013 arranged in parallel in a horizontal manner, rather than having the same length and width as the film substrate 1011. In another example, the first electrode 1012 can be arranged in a horizontal manner on the first surface of the film substrate 1011, and the second electrode 1013 can be arranged in a vertical manner on the second surface of the film substrate 1011.
[0047] The following explanation uses the example of a touch chip in the first circuit board 102 to illustrate the principle of touch detection.
[0048] The first electrode 1012 and the second electrode 1013 are arranged horizontally and vertically. One of the multiple first electrodes 1012 and multiple second electrodes 1013 serves as a driving electrode. The touch chip in the first circuit board 102 outputs a touch driving signal to the driving electrode. The other of the multiple first electrodes 1012 and multiple second electrodes 1013 serves as a receiving electrode and outputs a touch sensing signal. The touch chip can identify the touch position of the detected object based on the touch sensing signal. This method is a mutual capacitance detection method.
[0049] In addition, in another possible implementation, a self-capacitance detection method can be superimposed for touch detection. At least one of the multiple first electrodes 1012 and multiple second electrodes 1013 serves as both a driving electrode and a receiving electrode. The touch chip sends a touch driving signal to the driving electrode and performs touch detection based on the touch sensing signal output by the receiving electrode. For example, the touch chip outputs touch driving signals to multiple first electrodes 1012 (driving electrodes) and simultaneously receives the touch sensing signals output by the multiple first electrodes 1012 (receiving electrodes); or the touch chip outputs touch driving signals to multiple second electrodes 1013 (driving electrodes) and simultaneously receives the touch sensing signals output by the multiple second electrodes 1013 (receiving electrodes); or the touch chip simultaneously outputs driving signals to multiple first electrodes 1012 and multiple second electrodes 1013 and simultaneously receives the touch sensing signals output by the multiple first electrodes 1012 and multiple second electrodes 1013. The touch chip identifies the touch position of the detected object based on the received touch sensing signals.
[0050] In one example, when the touch chip performs touch detection based on the touch sensing signal, it can first detect the touch sensing signal generated by the first electrode 1012 to obtain the Y-axis coordinate of the touch position, and then detect the touch sensing signal generated by the second electrode 1013 to obtain the X-axis coordinate of the touch position. Alternatively, it can detect the X-axis coordinate first and then the Y-axis coordinate. In another example, the touch chip can simultaneously detect the touch sensing signals generated by the first electrode 1012 and the second electrode 1013 to directly obtain the X-axis and Y-axis coordinates of the touch position. In yet another example, the touch chip can detect only the touch sensing signal generated by the first electrode 1012 or the second electrode 1013, i.e., only detect the X-axis coordinate or the Y-axis coordinate of the touch position. This is suitable for scenarios with low detection accuracy requirements. The specific detection method can be set as needed and is not limited here.
[0051] In this embodiment, the thin-film touch sensor 101 includes a film substrate 1011 and multiple electrodes, including multiple first electrodes 1012 and multiple second electrodes 1013. The first electrodes 1012 are distributed on the first surface of the film substrate 1011, and the second electrodes 1013 are distributed on the second surface of the film substrate 1011. Touch detection can be performed by using the first electrodes 1012 and the second electrodes 1013 in a self-capacitive and / or mutual-capacitive manner, thereby realizing the touch detection function of the thin-film touch sensor 101. Since the multiple electrodes are distributed on the surface of the thin-film touch sensor 101, rather than on the surface of the PCB, and the thickness of the thin-film touch sensor 101 is less than the thickness of the PCB, the overall thickness can be reduced while realizing touch detection compared with the solution using a PCBA.
[0052] In one possible implementation, the thin-film touch sensor 101 further includes a first electrical connection area 1014 and a second electrical connection area 1015. The film substrate 1011 includes a first through hole 1016. The first electrical connection area 1014 and the second electrical connection area 1015 are disposed on a first surface of the film substrate 1011. The first electrode 1012 is electrically connected to the first electrical connection area 1014. The second electrode 1013 is electrically connected to the second electrical connection area 1015 through a trace in the first through hole 1016. The first electrical connection area 1014 and the second electrical connection area 1015 are electrically connected to the first circuit board 102 through traces in the thin-film touch sensor 101.
[0053] Figure 3 is a schematic diagram of another thin-film touch sensor provided in an embodiment of this application. As shown in Figure 3, a first through-hole 1016 is provided on the film substrate 1011. The first through-hole 1016 can be a metallized through-hole. A first electrical connection area 1014 and a second electrical connection area 1015 are disposed on the first surface of the film substrate 1011. A second electrode 1013 disposed on the second surface of the film substrate 1011 is electrically connected to the second electrical connection area 1015 through a trace in the metallized through-hole (first through-hole 1016). Optionally, the electrical connection area can be a metal pad. The first electrical connection area 1014 and the second electrical connection area 1015 are electrically connected to the first circuit board 102 through traces on the film substrate 1011. The first electrode 1012 is electrically connected to the first circuit board 102 through the first electrical connection area 1014, and the second electrode 1013 is electrically connected to the first circuit board 102 through the second electrical connection area 1015, thereby realizing signal interaction between the electrodes and the first circuit board 102.
[0054] It should be understood that the second surface of the thin-film touch sensor 101 can be bonded to a cover plate in an electronic device. The cover plate can provide the recognition area in the aforementioned embodiment. If the second electrical connection area 1015 is disposed on the second surface of the thin-film touch sensor 101, it will affect the bonding effect. Therefore, disposing the second electrical connection area 1015 on the first surface of the thin-film touch sensor 101 can also improve the bonding effect between the cover plate and the thin-film touch sensor 101.
[0055] In this embodiment, the thin-film touch sensor 101 further includes a first electrical connection area 1014 and a second electrical connection area 1015. The first electrode 1012 is electrically connected to the first electrical connection area 1014, and the second electrode 1013 is electrically connected to the second electrical connection area 1015 through a first through-hole 1016. The first electrical connection area 1014 and the second electrical connection area 1015 allow the first electrode 1012 and the second electrode 1013 to be electrically connected to the first circuit board 102 through metal traces within the thin-film touch sensor 101. The film substrate 1011 includes a first through-hole 1016, and the first electrical connection area 1014 and the second electrical connection area 1015 are disposed on the first surface of the film substrate 1011. This allows the first electrical connection area 1014 and the second electrical connection area 1015 to be disposed on the same side as the first circuit board 102, ensuring the stability of the connection.
[0056] In one possible implementation, the thin-film touch sensor 101 further includes a third electrical connection area 1017 and a fourth electrical connection area 1018, which are disposed on the first surface of the film substrate 1011. The first circuit board 102 is electrically connected to the third electrical connection area 1017, and the pressure sensor 103 is electrically connected to the fourth electrical connection area 1018. The fourth electrical connection area 1018 is electrically connected to the third electrical connection area 1017 through a trace in the thin-film touch sensor 101.
[0057] Figure 4 is a schematic diagram of a first circuit board provided in an embodiment of this application. As shown in Figure 4, the thin-film touch sensor 101 further includes a third electrical connection area 1017 and a fourth electrical connection area 1018. The first circuit board 102 is electrically connected to the third electrical connection area 1017, and the pressure sensor 103 is electrically connected to the fourth electrical connection area 1018. Optionally, the first electrical connection area 1014, the second electrical connection area 1015, and the fourth electrical connection area 1018 are respectively electrically connected to the third electrical connection area 1017 through the wiring layer of the thin-film touch sensor 101, so as to realize the signal interaction between the first circuit board 102 and multiple electrodes, and between the first circuit board 102 and the pressure sensor 103.
[0058] In this embodiment, the thin-film touch sensor 101 further includes a third electrical connection area 1017 and a fourth electrical connection area 1018. The third electrical connection area 1017 and the fourth electrical connection area 1018 are disposed on the first surface of the film substrate 1011. The first circuit board 102 is electrically connected to the third electrical connection area 1017, and the pressure sensor 103 is electrically connected to the fourth electrical connection area 1018. This enables both the first circuit board 102 and the pressure sensor 103 to be electrically connected to the thin-film touch sensor 101. Thus, the thin-film touch sensor 101 can transmit electrical signals between the first circuit board 102 and multiple electrodes, as well as between the first circuit board 102 and the pressure sensor 103, without the need for separate electrical connection components, reducing wiring difficulty and improving the stability of electrical connections.
[0059] In one possible implementation, the first circuit board 102 is directly electrically connected to the third electrical connection area 1017, or the first circuit board 102 is electrically connected to the third electrical connection area 1017 through the second circuit board 104.
[0060] The first circuit board 102 can be directly electrically connected to the third electrical connection area 1017. For example, Figure 4 shows a scheme in which the first circuit board 102 is electrically connected to the third electrical connection area 1017 via an ACF. In addition to the scheme shown in Figure 4, the first circuit board 102 and the thin-film touch sensor 101 can be electrically connected via a zero insertion force (ZIF) connector disposed on the surface of the thin-film touch sensor 101, or the first circuit board 102 can be electrically connected to the third electrical connection area 1017 via soldering.
[0061] In addition to the first circuit board 102 being directly electrically connected to the third electrical connection area 1017, the first circuit board 102 can also be electrically connected to the third electrical connection area 1017 through the second circuit board. Figure 5 is a schematic diagram of a touch press detection device including the second circuit board provided in an embodiment of this application. As shown in Figure 5, the first circuit board 102 is electrically connected to the third electrical connection area 1017 through the second circuit board 104. Optionally, the second circuit board 104 can be a flexible printed circuit (FPC). Optionally, the FPC and the third electrical connection area 1017 can be electrically connected by ZIF, ACF, or soldering.
[0062] In this embodiment, the first circuit board 102 is directly electrically connected to the third electrical connection area 1017, or the first circuit board 102 is electrically connected to the third electrical connection area 1017 through the second circuit board 104. The scheme of the first circuit board 102 being electrically connected to the third electrical connection area 1017 can be set according to production costs or structural requirements, which has a high degree of freedom.
[0063] Figure 6 is a schematic diagram of the stacking of a thin-film touch sensor provided in an embodiment of this application. As shown in Figure 6, the thin-film touch sensor 101 further includes a first insulating layer 111 and a shielding layer 112. The first insulating layer 111 is disposed on the surface of a plurality of first electrodes 1012, and the shielding layer 112 is disposed on the surface of the first insulating layer 111. The shielding layer 112 can shield electromagnetic interference to the first electrodes 1012 and the second electrodes 1013.
[0064] To prevent other metal components from affecting the touch sensing signal, a shielding layer 112 is provided on the first electrode 1012 to shield the first circuit board 102 and other devices from electromagnetic interference to the first electrode 1012 and the second electrode 1013. The shielding layer 112 may include an indium tin oxide (ITO) film, a steel sheet, copper foil, or other conductive thin films. It should be understood that a first insulating layer 111 is included between the shielding layer 112 and the first electrode 1012. The first insulating layer 111 can insulate the first electrode 1012 from the shielding layer 112. The first insulating layer 111 may be an epoxy resin (Organic Compound, OC). In one example, as shown in FIG6, the first insulating layer 111 and the shielding layer 112 have windows in corresponding areas of the first electrical connection area 1014 and the second electrical connection area 1015 to facilitate subsequent wiring.
[0065] Optionally, when fabricating the thin-film touch sensor 101, a metal layer can be deposited on the film substrate 1011 to form a first electrode 1012 and a second electrode 1013. Then, an OC layer is screen-printed on the surface of the first electrode 1012 to form a first insulating layer 111. Then, a first Ag pattern layer is screen-printed on the OC insulating layer to form a shielding layer 112.
[0066] In this embodiment, the thin-film touch sensor 101 further includes a first insulating layer 111 and a shielding layer 112. The first insulating layer 111 is disposed on the surface of the first electrode 1012, and the shielding layer 112 is disposed on the surface of the first insulating layer 111. The shielding layer 112 can shield the electromagnetic interference to the first electrode 1012 and the second electrode 1013, so that the external signal interference is small during touch detection, and the proportion of effective signal in the touch sensing signal can be increased.
[0067] Figure 7 is a schematic diagram of another thin-film touch sensor provided in the embodiment of this application. As shown in Figure 7, the thin-film touch sensor 101 further includes a second insulating layer 113, a conductive layer 114 and a third insulating layer 115. The second insulating layer 113 is disposed on the surface of the shielding layer 112, the conductive layer 114 is disposed on the surface of the second insulating layer 113, and the third insulating layer 115 is disposed on the surface of the conductive layer 114.
[0068] The thin-film touch sensor 101 further includes a second insulating layer 113, a conductive layer 114, and a third insulating layer 115. The conductive layer 114 electrically connects the first circuit board 102 and the multiple electrodes, as well as the first circuit board 102 and the pressure sensor 103. Optionally, the third insulating layer 115 has windows in the areas of the third electrical connection region 1017 and the fourth electrical connection region 1018 to facilitate the subsequent formation of the third electrical connection region 1017 and the fourth electrical connection region 1018. Optionally, the second insulating layer 113 and the third insulating layer 115 can be OC layers, and the conductive layer 114 can be a metal layer, preferably an Ag layer.
[0069] Optionally, when fabricating the thin-film touch sensor 101, a metal layer can be deposited on the film substrate 1011 to form a first electrode 1012 and a second electrode 1013. Then, an OC pattern layer is screen-printed on the surface of the first electrode 1012 to form a first insulating layer 111. An Ag pattern layer is then screen-printed on the OC insulating layer to form a shielding layer 112. A second insulating layer 113 is then screen-printed on the surface of the shielding layer 112 to form an OC pattern layer. An Ag pattern layer is then screen-printed on the second insulating layer 113 to fabricate an Ag circuit to form a conductive layer 114. Finally, an OC pattern layer is screen-printed on the surface of the conductive layer 114 to form a third insulating layer 115.
[0070] In this embodiment, the thin-film touch sensor 101 further includes a second insulating layer 113, a conductive layer 114, and a third insulating layer 115. The second insulating layer 113 is disposed on the surface of the shielding layer 112, the conductive layer 114 is disposed on the surface of the second insulating layer 113, and the third insulating layer 115 is disposed on the surface of the conductive layer 114. The conductive layer 114 enables the first circuit board 102 and multiple electrodes, as well as the first circuit board 102 and the pressure sensor 103, to be electrically connected. The second insulating layer 113 and the third insulating layer 115 ensure insulation performance.
[0071] Figure 8 is a schematic diagram of a pressure sensor provided in an embodiment of this application. As shown in Figure 8, the pressure sensor 103 includes a first sensing electrode 1031 and a second sensing electrode 1032. The first sensing electrode 1031 is disposed on the first surface of the membrane substrate 1011, and the second sensing electrode 1032 is electrically connected to the fourth electrical connection region 1018. The first sensing electrode 1031 and the second sensing electrode 1032 are disposed opposite to each other.
[0072] The pressure sensor 103 includes a first sensing electrode 1031 and a second sensing electrode 1032. The first sensing electrode 1031 and the second sensing electrode 1032 are arranged opposite to each other. When the object is pressed on the recognition area, the second sensing electrode 1032 deforms, and the distance between the first sensing electrode 1031 and the second sensing electrode 1032 changes, causing a change in the capacitance between the first sensing electrode 1031 and the second sensing electrode 1032, thereby generating a pressure sensing signal.
[0073] Optionally, the first sensing electrode 1031 can be integrated onto the first surface of the film substrate 1011, or the first sensing electrode 1031 can be disposed on the first surface of the film substrate 1011. The second sensing electrode 1032 can be electrically connected to the fourth electrical connection region 1018. The second sensing electrode 1032 can be a dome switch. Specifically, the second sensing electrode 1032 can include an integrally formed sensing part 10321, a deformation part 10322, and a connecting part 10323. The sensing part 10321 has a circular plate structure, and the connecting part 10323 has a ring structure. The radius of the sensing part 10321 is smaller than the inner radius of the connecting part 10323. The sensing part 10321 and the connecting part 1032... 3. The sensing part 10321 and the connecting part 10323 are connected via the deformation part 10322. The sensing part 10321 and the connecting part 10323 are located on different planes, and the center line connecting the sensing part 10321 and the connecting part 10323 is perpendicular to the membrane substrate 1011. The connecting part 10323 is soldered to the fourth electrical connection area 1018. The sensing part 10321 is positioned opposite to the first sensing electrode 1031 in a direction perpendicular to the membrane substrate 1011. When a pressing operation is received, the deformation part 10322 deforms, and the sensing part 10321 moves closer to the first sensing electrode 1031. The change in distance between the first sensing electrode 1031 and the sensing part 10321 causes the pressure sensor 103 to generate a pressure sensing signal. Optionally, the second sensing electrode 1032 can be electrically connected to the fourth electrical connection area 1018 via an ACF (Acoustic Coating Forming) or by soldering.
[0074] Optionally, the sensing portion 10321 of the second sensing electrode 1032 includes a through hole. This through hole allows for pressure balance on both sides of the second sensing electrode 1032 in a direction perpendicular to the film substrate 1011 when the second sensing electrode 1032 is electrically connected to the third electrical connection region 1017. Specifically, when the second sensing electrode 1032 is electrically connected to the fourth electrical connection region 1018, excess air between the second sensing electrode 1032 and the film substrate 1011 can be discharged through the through hole, thus balancing the pressure on both sides of the second sensing electrode 1032 in a direction perpendicular to the film substrate 1011.
[0075] Optionally, when the recognition area is pressed, the relative distance between the first sensing electrode 1031 and the second sensing electrode 1032 changes, causing a change in the capacitance of the pressure sensor 103. The pressure sensor 103 generates a pressure sensing signal. When the change in the relative distance between the first sensing electrode 1031 and the second sensing electrode 1032 is different, the change in capacitance of the pressure sensor 103 is different, resulting in different signal intensities of the generated pressure sensing signals (e.g., when the pressure sensing signal is a current signal, the change in current is different; when the pressure sensing signal is a voltage signal, the change in voltage is different). Furthermore, when the pressing force is greater, the change in the relative distance between the first sensing electrode 1031 and the second sensing electrode 1032 is greater. Therefore, the magnitude of the change in the relative distance between the first sensing electrode 1031 and the second sensing electrode 1032 can be determined based on the signal intensity of the pressure sensing signal, thereby determining the pressing force. For example, when the intensity of the pressure sensing signal is greater, the pressing force is greater; when the intensity of the pressure sensing signal is less, the pressing force is less, thus achieving the detection of the pressing force.
[0076] In this embodiment, the pressure sensor 103 includes a first sensing electrode 1031 and a second sensing electrode 1032. The first sensing electrode 1031 is disposed on the first surface of the membrane substrate 1011, and the second sensing electrode 1032 is electrically connected to the fourth electrical connection area 1018. The first sensing electrode 1031 and the second sensing electrode 1032 are disposed opposite to each other. The press detection function can be realized by detecting the capacitance change between the first sensing electrode 1031 and the second sensing electrode 1032 before and after pressing. Since the second electrode 1013 is electrically connected to the fourth electrical connection area 1018, the second electrode 1013 is electrically connected to the first circuit board 102 through the conductive layer 114, so that the press detection function can be realized without complicated wiring.
[0077] Figure 9 is a schematic diagram of a touch pressure detection device including a bracket according to an embodiment of this application. As shown in Figure 9, the touch pressure detection device 100 also includes a bracket 105, which is connected to the housing of the electronic device. The bracket 105 includes a second through hole 1051, and a first circuit board 102 is located in the second through hole 1051. A pressure sensor 103 is disposed between the bracket 105 and the thin-film touch sensor 101. The bracket 105 abuts against the pressure sensor 103 through an elastic pad 106. When the object being detected is pressed on the recognition area, the distance between the thin-film touch sensor 101 and the bracket 105 changes, causing the pressure sensor 103 to deform and generate a pressure sensing signal.
[0078] The bracket 105 includes a second through hole 1051 through which the first circuit board 102 passes. The bracket 105 abuts against the pressure sensor 103 via an elastic pad 106. Optionally, the elastic pad 106 may include a silicone pad, a rubber pad, etc., and the elastic pad 106 can provide cushioning. Optionally, when the touch pressure detection device 100 includes a vibration feedback unit, the vibration feedback unit also passes through a through hole on the bracket 105 (the first through hole 1016 or a through hole located in another area of the bracket 105).
[0079] Taking the cover plate 201 as an example of providing a recognition area, when the object being detected is pressed on the recognition area, the cover plate 201 and the thin-film touch sensor 101 are displaced towards the support 105 under the action of pressure. The distance between the thin-film touch sensor 101 and the support 105 changes, causing the pressure sensor 103 to deform (for example, the second sensing electrode 1032 deforms), generating a pressure sensing signal.
[0080] In this embodiment, the touch pressure detection device 100 further includes a bracket 105, which is connected to the housing of the electronic device. The bracket 105 supports the touch pressure detection device 100, allowing it to be installed within the electronic device. Since the bracket 105 abuts against a pressure sensor 103 disposed on the surface of the thin-film touch sensor 101 via an elastic pad 106, when the object is pressed on the recognition area, the distance between the thin-film touch sensor 101 and the bracket 105 changes, causing the pressure sensor 103 to deform and generate a pressure sensing signal, thus achieving the press detection function. Furthermore, since the bracket 105 includes a second through hole 1051 through which the first circuit board 102 can pass, the weight of the bracket 105 can be reduced while simultaneously decreasing the overall thickness.
[0081] In one possible implementation, the thickness of the film substrate 1011 is in the range of [12.5 μm, 100 μm].
[0082] Preferably, the thickness of the film substrate 1011 is 50 μm.
[0083] Optionally, the thickness of the first electrode 1012 and the second electrode 1013 disposed on the surface of the film substrate 1011 is preferably 6 μm, and the sheet resistance range is [0.0001Ω, 0.08Ω].
[0084] In this embodiment, the thickness of the film substrate 1011 is in the range of [12.5μm, 100μm], which can make the overall thickness of the thin-film touch sensor 101 smaller, reducing the thickness by about 0.25-0.85mm compared with the PCB, thus meeting the requirements for thinner and lighter electronic devices.
[0085] In one possible implementation, the thickness of the first insulating layer 111 ranges from [5μm to 70μm], the thickness of the shielding layer 112 ranges from [4μm to 7μm], and the thicknesses of the second insulating layer 113 and the third insulating layer 115 range from [5μm to 70μm].
[0086] Preferably, the thickness of the first insulating layer 111 is 60 μm, the thickness of the shielding layer 112 is 4 μm, the thickness of the second insulating layer 113 is 10 μm, and the thickness of the third insulating layer 115 is 10 μm.
[0087] Optionally, the thickness range of the first electrical connection region 1014, the second electrical connection region 1015, the third electrical connection region 1017 and the fourth electrical connection region 1018 is [20μm, 30μm].
[0088] In this embodiment, the thickness of the first insulating layer 111 ranges from [5μm to 70μm], the thickness of the shielding layer 112 ranges from [4μm to 7μm], and the thicknesses of the second insulating layer 113 and the third insulating layer 115 range from [5μm to 70μm]. This allows for a relatively thin and light design while maintaining conductivity and insulation performance. This results in a smaller overall thickness of the thin-film touch sensor 101, which is approximately 0.25-0.85mm thinner than a PCB, thus meeting the requirements for thinner and lighter electronic devices.
[0089] This application also provides an electronic device, including the touch press detection device in any of the foregoing embodiments.
[0090] In one possible implementation, the electronic device also includes a cover plate for providing an identification area.
[0091] Optionally, the cover plate is bonded to the second surface of the thin-film touch sensor in the touch press detection device.
[0092] Optionally, the bracket in the touch press detection device can be snapped onto or thermoset onto the housing of the electronic device. In another example, the bracket can be fixed to the housing of the electronic device by bolts, which is not limited here.
[0093] In one possible implementation, the electronic device includes a laptop computer, with a bracket in the touch press detection device fixed to the C-shell of the laptop computer.
[0094] It should be understood that the various embodiments in this specification are described in a progressive manner, and the same or similar parts between the various embodiments can be referred to mutually. Each embodiment focuses on describing the differences from other embodiments. In particular, for the method embodiments, since they are basically similar to the methods described in the apparatus and system embodiments, the description is relatively simple, and relevant parts can be referred to the descriptions of other embodiments.
[0095] It should be understood that the foregoing describes specific embodiments of this specification. Other embodiments are within the scope of the claims. In some cases, the actions or steps recited in the claims may be performed in a different order than that shown in the embodiments and may still achieve the desired result. Furthermore, the processes depicted in the drawings do not necessarily require the specific or sequential order shown to achieve the desired result. In some embodiments, multitasking and parallel processing are also possible or may be advantageous.
[0096] It should be understood that the use of a singular form to describe an element or to show only one element in the accompanying drawings does not imply that the number of such element is limited to one. Furthermore, modules or elements described or shown as separate herein may be combined into a single module or element, and modules or elements described or shown as single herein may be broken down into multiple modules or elements.
[0097] It should also be understood that the terminology and expressions used herein are for descriptive purposes only, and one or more embodiments described herein should not be limited to these terms and expressions. The use of these terms and expressions does not exclude any illustrative and descriptive equivalent features (or parts thereof), and it should be recognized that various modifications that may exist should also be included within the scope of the claims. Other modifications, variations, and substitutions may also exist. Accordingly, the claims should be considered to cover all such equivalents.
Claims
1. A touch-sensitive pressure detection device, applied to electronic devices, characterized in that, The touch pressure detection device includes: a first circuit board, a thin-film touch sensor, and at least one pressure sensor; The first circuit board and the pressure sensor are both disposed on the first surface of the thin-film touch sensor, and the first circuit board and the pressure sensor are located in different areas of the thin-film touch sensor. The pressure sensor is electrically connected to the thin-film touch sensor, and the first circuit board is electrically connected to the thin-film touch sensor. The thin-film touch sensor is used to generate a touch sensing signal when the detected object touches the recognition area; The pressure sensor is used to generate a pressure sensing signal when the object being detected is pressed on the recognition area; The first circuit board is configured to receive the touch sensing signal through the thin-film touch sensor and perform touch detection based on the touch sensing signal, and to receive the pressure sensing signal through the thin-film touch sensor and perform press detection based on the pressure sensing signal.
2. The touch-sensitive pressure detection device according to claim 1, characterized in that, The thin-film touch sensor includes: a film substrate and multiple electrodes; The plurality of electrodes includes a plurality of first electrodes and a plurality of second electrodes; The first electrode is distributed on the first surface of the film substrate, and the second electrode is distributed on the second surface of the film substrate; One of the first electrode and the second electrode serves as a driving electrode, the other of the first electrode and the second electrode serves as a receiving electrode, and / or, at least one of the first electrode and the second electrode serves as both a driving electrode and a receiving electrode. The driving electrode receives the touch driving signal transmitted by the first circuit board, and the receiving electrode generates the touch sensing signal.
3. The touch-sensitive pressure detection device according to claim 2, characterized in that, The thin-film touch sensor further includes: a first electrical connection area and a second electrical connection area, and the film substrate includes a first through hole; The first electrical connection region and the second electrical connection region are disposed on the first surface of the film substrate; The first electrode is electrically connected to the first electrical connection area, and the second electrode is electrically connected to the second electrical connection area through the first through-hole trace. The first electrical connection area and the second electrical connection area are electrically connected to the first circuit board through the trace in the thin-film touch sensor.
4. The touch-sensitive pressure detection device according to claim 2, characterized in that, The thin-film touch sensor further includes: a third electrical connection area and a fourth electrical connection area; The third electrical connection region and the fourth electrical connection region are disposed on the first surface of the film substrate; The first circuit board is electrically connected to the third electrical connection area, the pressure sensor is electrically connected to the fourth electrical connection area, and the fourth electrical connection area is electrically connected to the third electrical connection area through the traces in the thin-film touch sensor.
5. The touch-sensitive pressure detection device according to claim 4, characterized in that, The first circuit board is directly electrically connected to the third electrical connection area, or the first circuit board is electrically connected to the third electrical connection area through the second circuit board.
6. The touch-sensitive pressure detection device according to claim 2, characterized in that, The thin-film touch sensor further includes: a first insulating layer and a shielding layer; The first insulating layer is disposed on the surface of the plurality of first electrodes, and the shielding layer is disposed on the surface of the first insulating layer; The shielding layer is used to shield the first electrode and the second electrode from electromagnetic interference.
7. The touch-sensitive pressure detection device according to claim 6, characterized in that, The thin-film touch sensor further includes: a second insulating layer, a conductive layer, and a third insulating layer; The second insulating layer is disposed on the surface of the shielding layer, the conductive layer is disposed on the surface of the second insulating layer, and the third insulating layer is disposed on the surface of the conductive layer.
8. The touch-sensitive pressure detection device according to claim 4, characterized in that, The pressure sensor includes: a first sensing electrode and a second sensing electrode; The first sensing electrode is disposed on the first surface of the film substrate, and the second sensing electrode is electrically connected to the fourth electrical connection region. The first sensing electrode and the second sensing electrode are disposed opposite to each other.
9. The touch pressure detection device according to any one of claims 1-8, characterized in that, The touch press detection device further includes: a bracket; The bracket is connected to the housing of the electronic device; The bracket includes a second through hole, the first circuit board is located in the second through hole, the pressure sensor is disposed between the bracket and the thin-film touch sensor, and the bracket abuts against the pressure sensor through an elastic pad; When the object being detected is pressed on the recognition area, the distance between the thin-film touch sensor and the bracket changes, causing the pressure sensor to deform and generate the pressure sensing signal.
10. The touch-sensitive pressure detection device according to claim 3, characterized in that, The thickness of the film substrate ranges from 12.5 μm to 100 μm.
11. The touch-sensitive pressure detection device according to claim 6, characterized in that, The thickness of the first insulating layer ranges from [5μm to 70μm], and the thickness of the shielding layer ranges from [4μm to 7μm].
12. The touch-sensitive pressure detection device according to claim 7, characterized in that, The thickness range of the second insulating layer and the third insulating layer is [5μm, 70μm].
13. An electronic device, characterized in that, include: The touch pressure detection device as described in any one of claims 1-12.
14. The electronic device according to claim 13, characterized in that, The electronic device also includes a cover plate; The cover plate is used to provide the identification area.